Device for preparing components connected to a circuit carrier by means of connecting material for recycling

Abstract

Device for preparing for reuse at least one component connected to a circuit carrier by means of a connecting material, comprising: a. at least one means configured to adjustably change the temperature of a substantially inert, electrically non-conductive liquid; b. at least one means configured to bring the at least one component to be reused into contact with the inert, electrically non-conductive liquid; and c. at least one means configured to controllably remove the at least one component to be reused from the circuit carrier while the connecting material of the component to be reused is liquid.

Description

1. Technical field The present invention relates to a device for preparing for the reuse of at least one component connected to a circuit carrier by means of connecting material. 2. State of the art Soldering processes play a crucial role in many industrial sectors. They are used, for example, to connect numerous small, simple components, such as resistors, and large, highly complex components, such as microprocessors, onto circuit boards. The rapid advancements in microelectronics allow for the integration of increasingly complex functions onto semiconductor chips of the same size in short intervals. This results in highly specialized and very expensive microelectronic components. On the other hand, the development of other components that build an infrastructure in a technology field where microelectronic components are embedded cannot always keep pace with the rapid development in the field of microelectronics. This is the case, for example, in the telecommunications sector or in the field of alternative energies. One way out of this dilemma is to continuously upgrade the systems that provide the infrastructure for a technology with the latest microelectronic components throughout their lifecycle. A key part of this upgrade process is the controlled removal of old or outdated microelectronic components from the circuit boards of the respective systems and the replacement of these with new, state-of-the-art components. When manufacturing complex circuits by soldering numerous components onto a printed circuit board (PCB), which often contains many layers, errors cannot be completely ruled out. Furthermore, individual components can fail during operation. The procedure for handling these failures depends in both cases on the application and the complexity of the circuit. In consumer electronics, this often renders the entire product unusable, especially if the electronic circuit(s) it contains can be mass-produced cost-effectively. In other sectors, such as the automotive industry, the situation is often different. The electronic circuits used in this field typically contain highly specialized, complex components designed for a long service life, for example, fifteen years. If problems arise in these circuits during the manufacturing process, attempts are made to repair the circuit. If this is not possible, at least an attempt is made to recover the most expensive component(s) for reuse by removing them from the assembled circuit board. This also applies if the circuit fails during its intended service life, particularly in the initial phase of its planned operating time. For this, these components usually have to be desoldered from the circuit board. Furthermore, there may be areas where very large printed circuit boards (PCBs) are used, featuring a very high number of wiring layers. The manufacturing process for these boards is very complex. As a result, these PCBs represent a significant economic value. They must be used for as long as possible to recoup the invested capital. To ensure a long service life, populated components must be removable from these specialized PCBs in a controlled manner without damaging them. As already explained above, processes for loosening or desoldering components, electronic components or simply components from printed circuit boards can be divided into the processes of rework, i.e. by repair or rework, and recycling, i.e. by functional or material recovery. In the field of rework, the focus is on the selective modification of individual components to maintain or restore the functionality of the circuit. Manual rework typically utilizes handheld tools. These include, for example, hot air stations with manually operated nozzles, soldering and desoldering tweezers for heat transfer with small components, such as surface-mount devices (SMDs), hand soldering irons with active tips, and hot plates onto which the printed circuit board (PCB) is placed. To reduce thermal stress, infrared (IR) heating is often used to warm the PCB or circuit board being reworked. In semi-automated systems—i.e., guided rework—an operator or user is supported by controlled temperature profiles and / or positioning aids.These systems often use split optics for component alignment and / or closed-loop temperature control via IR emitters or hot gas convection to prevent overheating of the components being processed, i.e., desoldered. Force sensors can be used to monitor the placement of new components onto the circuit board. PCT application WO 2009 / 120687 A2 describes a system that applies hot steam to the component to be desoldered. After the solder melts, a gripper lifts the component from the circuit board. Utility model DE 20 2010 015 776 U1, also filed by the applicant, proposes attaching a barrier around the component to be desoldered in order to heat the component locally or selectively in a hot liquid. Both applications exhibit a high degree of complexity and have not yet achieved commercial viability. In manual or semi-automated processes, process quality and repeatability can depend significantly on the operator's experience and performance on any given day. For example, hot air stations can cause collateral damage to adjacent components, as these can be unintentionally heated and displaced by the hot airflow. With moist components, there is also a risk of bursting due to an increase in internal vapor pressure during heating (the so-called popcorn effect). Furthermore, the temperature of the airflow, and not that of the component being processed, is typically measured. This inevitably leads to inaccurate process control. In addition, the use of hand-held soldering irons poses a risk of thermal shock due to the localized heat input, which can lead to cracking, particularly in ceramic components such as ceramic capacitors.Furthermore, uneven heating of heating plates can lead to thermal distortion of the entire circuitry on the printed circuit board. In addition to the semi-automatic systems described above, fully automatic, selective, or component-specific desoldering systems are also available. These systems utilize optical detection systems, such as camera systems, which automatically guide a desoldering head—which may, for example, have a programmable nozzle—to the connection points of the component being processed. Focused heat sources, such as hollow tips, or lasers, such as semiconductor lasers, are used to heat the solder joints. Furthermore, inductive methods are employed, which melt metallic connections between the circuit board and the component without contact using magnetic fields. Besides desoldering complex components, automatic desoldering systems can also be used to remove solder residue and to place new components. For fully automated desoldering systems, the high investment costs and the effort required for programming each new circuit board variant present an economic hurdle. Furthermore, these systems are generally designed for sequential processing, which limits their throughput of components. Additionally, the use of lasers as heat sources poses safety risks. Reflections of the focused radiation from reflective or shiny surfaces, such as solder joints, can damage their optics and / or surrounding components on the circuit board. Moreover, laser radiation cannot reach hidden solder joints, or at least not reliably. Finally, sudden or explosive heating of solder material creates a risk of solder spatter. When desoldering components using contact-based robotic systems, their tips and nozzles are subject to significant wear and are prone to clogging, necessitating regular process interruptions for maintenance. In cases of tolerance deviations and / or incomplete solder melting, the rigid mechanics of these systems often lead to solder pads breaking off, potentially damaging the circuit board and / or the component being desoldered. Inductive desoldering carries the risk of damaging or destroying sensitive semiconductor components and / or circuit board traces through induced eddy currents. These effects are highly material-dependent and therefore difficult to predict. For very large components, the aforementioned devices are only of limited use for desoldering, as they lack the capability to heat the numerous electrical connections (up to several hundred) simultaneously and uniformly to the melting temperature of the solder. A hot air source is, in principle, capable of heating a component to be soldered or desoldered—more precisely, its electrical connections—to the required temperature. However, the temperature distribution across the component is difficult to control and is therefore usually inhomogeneous. Furthermore, considerable equipment is required to ensure that the hot air does not unintentionally desolder adjacent components or damage parts of their solder joints, which could lead to premature failure of the circuit board.Furthermore, exposure to hot air can locally damage the circuit board, for example through delamination or detachment of conductor tracks. Another method for desoldering large components uses a system in which the printed circuit board (PCB) is heated simultaneously from both the top and bottom. A bottom heating element warms the entire underside of the PCB over a large area, allowing the heat energy to be distributed evenly and without stress. In a first step, a top heating element transfers the temperature profile of the bottom heating element locally to the component to be desoldered, which is located on the top side of the PCB. In a second step, the temperature of the top heating element is increased above that of the bottom heating element, thus raising the temperature of the solder joints of the component to be desoldered to the melting point of the solder. This method is particularly useful for components in BGA (ball grid array) packages, where the leads are located beneath the component's housing and are not visible. This method allows even large components to be safely desoldered. However, a disadvantage of the described method lies in the influence of the hot air on the solder joints of the components mounted on the circuit board. The oxidation of metal parts or metal connections caused by the oxygen in the hot air reduces the solder quality. Furthermore, local overheating of the component being soldered or desoldered can occur. Since the entire component must be heated, inhomogeneous heating processes can lead to temperature differences in the various layers of the component. To minimize mechanical stress on the electrical connections of large components, they are often additionally secured to the circuit board; this is usually done with one or more adhesive points. Therefore, safely removing these components requires not only disconnecting the electrical connections but also carefully loosening the adhesive. Similar to the rework area outlined above, the recycling area is also divided into two sub-areas. Preparation for reuse involves preparing a product or a product component for reuse; that is, the product, component, or part—which can also be a printed circuit board (PCB)—is functionally reused in this process. In electronics, this means that components from a populated PCB are removed from the board for use in the circuitry of a second or subsequent PCB (reuse). In the waste hierarchy, reuse represents the second level after avoidance (the first level). The second sub-area of ​​recycling, material recovery or reuse, i.e. the processing of defined waste streams or parts thereof into marketable secondary raw materials through material reuse, represents the third level of the waste hierarchy. For the material recycling of a component soldered onto a printed circuit board (PCB), i.e., the at least partial recovery of the materials contained within the component, it is sufficient to separate it from the PCB. Therefore, processes designed for a high throughput of components removed from a PCB are employed (so-called mass dismantling processes). The primary objective here is the rapid and cost-effective separation of the fractions and their subsequent feed-in for material recovery. For this purpose, complete PCBs are typically treated thermally and mechanically. Heating is usually achieved through convection or infrared radiation, causing the solder to melt. The components are then removed using non-specific methods such as rotation, vibration, gravity, or brush mechanisms. In this process, the component is typically damaged, meaning its function is impaired or it can be destroyed. Uncontrolled falling and / or collisions of individual components can mechanically damage sensitive components, generally precluding reuse. It is possible to sort the components removed from the circuit board and examine expensive components for any remaining functionality. Another disadvantage of mass dismantling is the typically uncontrolled heating of the populated circuit boards, which can release toxic emissions from burning plastics and / or electrolytes. In addition to the mass thermal desoldering described above, components can be removed purely mechanically, for example by using a saw, or chemically, e.g., by dissolving the solder material from a printed circuit board. These processes functionally destroy the components, which can then only be recycled materially. The mass mechanical or chemical dismantling of components from unused printed circuit boards releases toxic dust and nanoparticles and therefore requires the use of multi-stage filtration systems. In the article "Dismantling of printed circuit boards enabled electronic components sorting and their subsequent treatment open improved elemental sustainability opportunities," Sustainability 2021, 13, 103357, https: / / doi.org / 10.339o / su131810357, the authors AA Maurice et al. provide an overview of the dismantling of unused printed circuit boards and the potential recycling of the separated components. A key requirement for functional recycling is the removal of a component from a populated circuit board without compromising its functionality or that of the board itself. The robotic systems described above can be used for this purpose. These systems scan defective circuit boards using camera sensors and sequentially identify valuable components. The identified components are then approached by the robot's desoldering head, heated precisely (typically with a laser system or infrared irradiation), and subsequently lifted from the circuit board using a gripper. Due to the alignment process required for each individual component and the sequential heating process for each one, the recovery of functional, valuable components is a technically complex process with limited throughput.Furthermore, optical sensor systems often fail to detect contaminated components or those coated with protective lacquer. As a result, defective components are frequently not recognized as such. Moreover, the gripping technology of robotic systems is prone to errors with non-standardized housing shapes. Therefore, the costs of the desoldering process currently often exceed the value of the recovered components, making the use of robotic systems economically viable only for a few, very specialized components of very high value. The systems described above, from both the rework and recycling sectors—with the exception of the two semi-automatic systems—use convection, IR radiation, laser radiation, or inductive methods to heat the components to be desoldered. These processes limit the heat transfer from the heat source to the components being desoldered, resulting in long heating and processing times. Furthermore, the locally uneven heat distribution inevitably leads to large temperature differences, which can cause thermal stress within larger components. This means that the desoldering process poses a significant risk to the functionality of the component after it has been removed from the circuit board. Additionally, solder oxidizes the contact surfaces when melting under atmospheric conditions.As soon as the solder melts, the contact surfaces react with the oxygen in the air, which impairs their wettability for subsequent soldering processes and can therefore necessitate costly cleaning procedures. In the worst case, the desoldering process damages not only the component but also the circuit board. The present invention therefore addresses the problem of providing a device with which components can be removed from a populated circuit carrier without jeopardizing their functionality during this process. 3. Summary of the invention According to one embodiment, this problem is solved by a device for preparing at least one component connected to a circuit carrier (e.g., a printed circuit board) by means of a connecting material for reuse, comprising: (a) at least one means configured to adjustably change the temperature of a substantially inert, electrically non-conductive liquid; (b) at least one means configured to bring the at least one component to be reused into contact with the inert, electrically non-conductive liquid; and (c) at least one means configured to controllably remove the at least one component to be reused from the circuit carrier while the connecting material of the component to be reused is liquid. An apparatus according to the invention uses an inert, electrically non-conductive liquid as a means to heat a populated circuit carrier in an adjustable and controllable manner. Compared to gases, especially air, liquids have significantly higher heat capacities and much higher thermal conductivities. By bringing the components to be desoldered into direct contact with the liquid, which is used for heat transfer to the components and the circuit carrier, these components can be brought to a predetermined temperature quickly, and especially in a controllable manner. Furthermore, the spatial control of liquids is considerably easier than that of gases. The use of an inert, electrically non-conductive liquid to heat a reusable component thus enables excellent process control.In particular, the various embodiments of an inventive device described herein can ensure, through simple design measures, that only a portion of the circuit carrier containing the component to be desoldered or reused comes into contact with the heating liquid. A device according to the invention thus provides a simple desoldering station for large-area components. The liquid used changes the temperature of the circuit carrier and the connected components uniformly or homogeneously. Even hard-to-reach areas, such as internal connections on BGA packages, have the same temperature as more easily accessible external connections. Due to the design, thermal spikes at individual points do not occur. This largely prevents the occurrence of thermal stresses on or within individual components. An auxiliary device for preheating the back of a printed circuit board, as is often used in the prior art, is not required. The inert, electrically non-conductive liquid completely surrounds the component to be reused during the desoldering process. This protects the connections or solder joints from the oxidizing effect of atmospheric oxygen throughout the entire process, particularly during the high temperatures of the phase transition of the joining material. In addition to protecting the solder joints of the component to be reused, the essentially oxygen-free desoldering process of a device according to the invention also protects the solder joints of a circuit carrier to be reused, thus at least reducing the need for complex cleaning processes as preparatory steps for reuse. Circuit carriers serve as a base for the mechanical mounting and electrical connection of electrical and / or electronic components. They establish electrically conductive connections between the components mounted on the circuit carrier. Circuit carriers can be three-dimensional (3D) structures, for example, injection-molded circuit carriers known as Molded Interconnect Devices (MIDs). The acronym MID is increasingly being extended to Mechatronic Integrated Device to reflect the fact that 3D molded parts with integrated conductor structures do not necessarily have to be injection-molded and do not have to be made of plastic. More common than 3D circuit carriers are 2D circuit carriers in the form of (classic) flat printed circuit boards or circuit boards. The device defined above can process both 2D and 3D circuit carriers. Furthermore, a device according to the invention can be combined with or integrated into one of the desoldering systems described in the second part. For example, it is possible to use a device according to the invention as a means for the controlled heating of components to be desoldered in a robot system. The joining material can comprise at least one of the following: a solder material or an adhesive. A device according to the invention can be used to liquefy all currently permissible solder materials. An adhesive can be used to fix large and / or heavy components to the back or underside of a double-sided circuit board for subsequent soldering and / or to relieve the solder joints of excessive mechanical stress. Adhesive can also be used to attach heat sinks to components or to thermally couple components generating high power dissipation to thermal cooling paths. It is advantageous if the liquidus temperature of the solder and the liquefaction temperature of the adhesive are similar. For the safe removal of a heat sink or a component additionally secured to the circuit board with adhesive alongside solder, it is sufficient if the adhesive transitions from a hardened to a viscous state during the desoldering process. The means for the controlled removal of the reusable component from the circuit carrier may comprise at least one of the following: a mechanical gripping device, a gripping device based on a magnetic force, or a gripping device based on a vacuum. A mechanical gripping device can contact a reusable component by applying controlled pressure. A vacuum-based gripping device can create a force-fit connection with a reusable component by suction. To remove a reusable component from a populated circuit board, such as a printed circuit board, using magnetic force, it may be necessary to first attach a body made of ferromagnetic material to a surface of the component to be desoldered, for example, by gluing. The means for the controlled removal of the component to be reused may be arranged to be movable relative to the circuit carrier, and / or the means for bringing the component to be reused into contact with the inert, electrically non-conductive liquid may further be arranged to move the circuit carrier relative to the component to be reused. The gripping device can lift the reusable component from the circuit carrier while it is still surrounded by the hot, inert, electrically non-conductive liquid, or after the device according to the invention has separated the heating liquid from the reusable component. Once the gripping device is in contact with the reusable component, the gripping device, the circuit carrier, or both components can be moved to lift the reusable component from the circuit carrier. Moving the circuit carrier and / or the gripping device can be fully or semi-automatic. In simple devices, it is conceivable to operate the gripping device manually. Furthermore, the device may include an optical system configured to detect movement of at least one of: the reusable component, the circuit carrier, the means for controlled removal, or the means for bringing the reusable component into contact with the inert, electrically non-conductive liquid. In particular, the optical system can be configured to align the reusable component and the gripping device relative to each other. The optical system can comprise one or more camera systems. The means for bringing the reusable component into contact with the inert, electrically non-conductive liquid can be configured for fully automatic and / or semi-automatic operation. In simple embodiments of a device according to the invention, manual operation is also conceivable. This means that the means for bringing the components into contact can be adapted to the complexity and performance of a device according to the invention. The means for the controlled removal of the reusable component may include a force sensor for detecting the force exerted on the reusable component by the means for the controlled removal. A force sensor in a gripping device can fulfill several functions. Firstly, it can be configured to detect the force with which the gripping device acts on the component to be reused. This reliably prevents the gripping device from damaging or even destroying the component when making contact. Secondly, a force sensor can be configured to limit the force acting between the component to be reused and the circuit carrier when performing a relative movement between these two components. In this way, a force sensor can be used as a detector to determine whether the solder material has reached its liquidus temperature and / or whether the adhesive is still solid or at least already viscous, i.e., has fallen below a maximum permissible viscosity value. The means for controlled removal can be configured to remove the reusable component from the circuit carrier while the latter is surrounded by the inert, electrically non-conductive liquid or exposed to an atmospheric environment. If the means for controlled removal or the gripping device separates the component to be reused from the circuit carrier while both components are surrounded by the inert, electrically non-conductive liquid, a force sensor can be used to determine the force profile acting during the separation process. This is particularly advantageous if the inert, electrically non-conductive liquid and / or its vapor are optically opaque in the visible wavelength range. If the component to be reused is not surrounded by the inert, electrically non-conductive liquid during the separation process, the optical system can also be used to monitor the desoldering process. Additionally or alternatively, it is advantageous to monitor the execution of a desoldering process using one or more temperature sensors. The inert, electrically non-conductive liquid can be composed of carbon, fluorine, and oxygen, in particular one or more perfluoropolyether liquids. Perfluoropolyether liquids with various boiling points are commercially available. In particular, these liquids are available with boiling temperatures higher than the liquidus temperature of all common solder materials. Alternatively, the inert, electrically non-conductive liquid can be a silicone oil-based liquid. Silicone oils have chains in which silicon and oxygen atoms alternate. Organic or inorganic residues, such as halogens, are attached to the two free electrons. The essentially inert, electrically non-conductive liquid ensures that the heating process does not chemically alter the component to be heated, reused, the circuit carrier, or neighboring components in their electrical functions at the melting temperature of the solder. The means for bringing the at least one reusable component into contact with the inert, electrically non-conductive liquid may comprise at least one of the following: at least one means for immersing at least one part of the circuit carrier containing the reusable component into the inert, electrically non-conductive liquid, or at least one means for flooding at least the part of the circuit carrier containing the reusable component with the inert, electrically non-conductive liquid. The portion of the circuit carrier that holds the reusable component can be immersed in the inert, electrically non-conductive liquid. This liquid can then be heated from room temperature or a temperature higher than room temperature to the liquidus temperature of the solder or the temperature at which the adhesive is at least viscous. In an alternative embodiment, at least the portion of the circuit carrier containing the reusable component can be sprinkled or flooded with the inert, electrically non-conductive liquid. To protect the reusable component from thermal damage, the temperature of the inert, electrically non-conductive liquid can be gradually increased from a temperature between room temperature and the liquidus temperature, ensuring that the maximum permissible temperature gradient(s) at the component are not exceeded.This allows the component to be heated without damage. The means for immersing at least the part of the circuit carrier containing the component to be reused may comprise at least one of the following: at least one means for moving the circuit carrier relative to the inert, electrically non-conductive liquid, or at least one means for moving the inert, electrically non-conductive liquid relative to the circuit carrier. The circuit carrier, in the 2D case the printed circuit board, can be immersed in the inert, electrically non-conductive liquid, which may be contained, for example, in a stationary container. Conversely, it is also possible to keep the circuit carrier stationary and move the inert, electrically non-conductive liquid, which may be stored in a movable container, such that at least the part containing the reusable component comes into contact with the liquid in the container. Naturally, it is also possible to make both the inert, electrically non-conductive liquid (by allowing movement of the container holding the liquid) and the circuit carrier movable. The means for flooding at least the part of the circuit carrier containing the component to be reused may comprise: at least one pump configured for at least one of the following: pumping the inert, electrically non-conductive liquid onto or off the component to be reused; and / or at least one drain valve configured to drain the inert, electrically non-conductive liquid from the component to be reused. By means of a favorable constructive arrangement of the various components for bringing the reusable component into contact with the liquid used for heating, a container for receiving the circuit carrier, a second container for storing the inert, electrically non-conductive liquid, a pump and a drain valve are sufficient to realize this means. The means for moving the circuit carrier can include a receptacle for receiving the circuit carrier. The receptacle can comprise a workpiece carrier of a vapor phase soldering system, which may be designed to be movable in two or three dimensions. Workpiece carriers can be manufactured with various lateral dimensions and are described in detail in the prior art. If required, the device can include a control or regulation system that controls the movement of the receptacle. Furthermore, the receptacle can include a temperature sensor, which can be used, for example, to determine the temperature of the inert, electrically non-conductive liquid into which the receptacle is immersed. The mount can be configured to fix the circuit carrier by applying at least one of the following: a mechanical force, a magnetic force, or a force based on a pressure difference. A mechanical force can be exerted on the circuit carrier, for example, by means of a clamping device. The means for moving the circuit carrier can be configured to move the circuit carrier at least perpendicular and / or at least parallel to the surface of the inert, electrically non-conductive liquid. Typically, circuit carriers, especially printed circuit boards (PCBs) or parts of PCBs onto which one or more reusable components are soldered, are moved perpendicular to the surface of the inert, non-conductive liquid. For this purpose, it may be sufficient to simply place the circuit carrier, such as the PCB, onto the fixture or workpiece carrier. It is also possible to immerse only a portion of the circuit carrier in the inert, non-conductive liquid. In this case, the surface of the circuit carrier or PCB can be at an angle other than 0° to the liquid surface. To prevent movement or slippage of the circuit carrier relative to the fixture when stored in a non-horizontal position, the fixture can incorporate a fixing mechanism, such as a clamping device. Alternatively, the circuit carrier can be held in position on a fixture by applying a vacuum to the circuit board. By attaching a ferromagnetic material to the circuit carrier, for example by gluing, one or more magnets embedded in the fixture can fix the circuit carrier to the fixture by exerting a magnetic force. In the simplest case, the fixture can consist of a wire mesh onto which the circuit carrier to be processed can be placed. As previously explained, a highly complex circuit carrier with a very large number of layers (in the range of 100) can be the component to be reused. In this case, it is advantageous to heat the circuit carrier uniformly as a whole in order to minimize thermal stresses within the circuit carrier due to the complexity of a bulky 3D circuit carrier or a thick 3D printed circuit board. A device according to the invention can then be used to desolder defective or obsolete components from the circuit carrier in a defined manner. The removed components can then be replaced on the reusable circuit carrier, including the components on it that are to be reused, by new integrated circuits manufactured according to the prior art. However, a device according to the invention also makes it possible to desolder or remove all soldered components from a circuit carrier, so that in a subsequent process step it can be completely equipped with new or reusable components. If, on the other hand, the circuit carrier is no longer to be used or cannot be used further, and there is only interest in reusing a few components, the circuit carrier can be divided into one or more parts with reusable components and one or more parts without these components. This process step, preceding the desoldering process, enables the recovery of reusable components from large circuit carriers, for example, printed circuit boards with large lateral dimensions, in small devices according to the invention. As an alternative to dismantling a large circuit board, it is possible to heat only the part(s) of the circuit board containing the component(s) to be reused. The processes described in this section also make it possible to increase the energy efficiency of a desoldering process. A device according to the invention can further comprise at least one lock which is configured to close a process chamber containing the inert, electrically non-conductive liquid, and to introduce and remove the means for moving the circuit carrier with the circuit carrier in the process chamber. A device described herein can be implemented in various embodiments. Small systems can be equipped with the components described above. These are ready for use in a short time and allow for the quick and cost-effective desoldering of one or more reusable components from individual circuit carriers, such as prototypes. Alternatively, devices according to the invention can be designed for batch operation. This allows for a high throughput of circuit carriers to be processed. In order to separate the process chamber, i.e., the space or volume in which the desoldering process takes place, from the environment and thereby shield the device from environmental inclusions on the one hand, and largely prevent the loss of inert, electrically non-conductive liquid and / or heat from the process chamber on the other, the latter can be equipped with an airlock for introducing the fixture or...The device includes the workpiece carrier and the circuit carrier mounted on it, leading into the process chamber. A desoldering device may have a lock for inserting and removing the workpiece carrier. However, a device according to the invention may also be equipped with its own lock for inserting and removing the circuit carrier to be processed into the process chamber. The means for adjusting the temperature of the inert, electrically non-conductive liquid may include at least one of the following: a heating device for the inert, electrically non-conductive liquid or a mixing device for mixing hot and cold inert, electrically non-conductive liquid. The means for adjusting the temperature of the inert, electrically non-conductive liquid can be designed to heat the liquid from room temperature to at least a predetermined temperature. A device according to the invention may further comprise a control unit or a regulating unit which is configured to control or regulate the changing of the temperature of the inert, electrically non-conductive liquid. Furthermore, the means for setting the temperature may include a control unit or a regulating unit designed to control or regulate a temperature rise of the inert, electrically non-conductive liquid up to the predetermined temperature, typically the liquidus temperature of the solder material of the circuit carrier and / or the temperature at which the adhesive between the circuit carrier and the component(s) becomes at least viscous, according to a predetermined temperature profile. By controlling the temperature rise of the liquid, the heat transfer to the component(s) to be reused is controlled. This allows the temperature gradient of the component(s) to be desoldered to be kept below a temperature rise specified by the component manufacturer. Controlling the temperature profile of the inert, electrically non-conductive liquid used for heat transfer to the component being heated thus makes it possible to find an optimum between the heating rate and the gentle treatment of the circuit carrier on the one hand, and the components located on the circuit carrier on the other. A device according to the invention avoids thermal and the resulting mechanical stresses in the circuit carrier and the components to be reused. Damage to the circuit carrier or to the components is prevented.The reusable components and the other components of the circuit carrier can thus be excluded. The heating device can be attached to the at least one container that holds the inert, electrically non-conductive liquid. The means for adjusting the temperature, such as the heating element for heating the liquid, can be located below the at least one container. By arranging the heating element in the immediate vicinity of the component(s) to be heated, the thermal inertia of such an embodiment of the inventive device is particularly low. This facilitates the control and regulation of the temperature profile of the liquid being heated and also results in good energy efficiency of the desoldering process. In another embodiment, the means for adjusting the temperature of the inert, electrically non-conductive liquid comprises a mixing device designed to heat the component(s) to be desoldered in a controlled manner by mixing cold and hot liquid. The mixing device can change the ratio of cold to hot liquid during the heating process. The mixing device can further include a nozzle to bring the inert, electrically non-conductive liquid into contact with the component(s) to be desoldered. The mixing device can comprise two containers or tanks for the cold and hot liquid. The two containers can be arranged in a device according to the invention such that, driven by gravity, the hot and cold liquids flow onto the circuit carrier located below the mixing device after being mixed.Alternatively or additionally, the mixing device may have one or more pumps designed to pump the cold, but especially also the hot, inert, electrically non-conductive liquid onto at least one reusable component of a circuit carrier. The mixing device can also be designed to control the amount of liquid used for heating and thus influence the timing of the heating process for the component(s) being heated. Furthermore, the heating process can be adapted to a predefined temperature profile alternatively or additionally by a corresponding change in the temperature of the liquid. A device according to the invention can further comprise at least one sensor configured to measure the temperature of the inert, electrically non-conductive liquid surrounding the component to be reused, and / or to measure the temperature of the component to be reused. A temperature sensor for measuring the temperature of the inert, electrically non-conductive liquid can be attached to the circuit board or workpiece carrier. If the temperature sensor is also intended to detect the temperature of the component to be reused, it is advantageous to position it as close as possible to the component being desoldered. Attaching a (second) temperature sensor directly to the component being desoldered allows for reliable determination of the temperature profile of the component being removed from the circuit board and then reused. The temperature sensor attached to the component being desoldered can be used as a current-value detector for a control system that monitors, i.e., regulates, the heating process of the component being desoldered. A device according to the invention can further comprise a drying device which is configured to remove the inert, electrically non-conductive liquid from the component to be reused after its removal from the circuit carrier. The drying device can comprise at least one of the following: a vacuum dryer, an air knife blow-off device, or a thermal evaporation unit. Different drying devices can be advantageously employed for different embodiments of the device described herein. Preferably, small systems are equipped with a blow-off device or a thermal evaporation unit, whereas large systems operating in batch mode can use a vacuum dryer. The means for adjusting the temperature of the inert, electrically non-conductive liquid and the means for the controlled removal of the component to be reused can be arranged so as not to damage its functionality through the process of removing it from the circuit carrier. For this purpose, the means for adjusting the temperature of the inert, electrically non-conductive liquid, such as a heater or a mixing device, can be embedded in a closed control loop, so that the heating process of the component to be desoldered can be carried out following a predetermined temperature profile. The means for the controlled removal of the reusable component, such as a mechanical gripping device, can also include a force sensor that limits the maximum force exerted on the component being desoldered. This reliably prevents, for example, an adhesive that is still solid at the liquidus temperature from damaging or rendering unusable one or both components—especially if excessive force is applied between the component being desoldered and the circuit board. A force sensor in a gripping device can, for example, be in the form of a spring, such as a coil spring. The means for moving the circuit carrier can furthermore be configured for at least one of the following: to set the circuit carrier into vibration, to perform a jerky movement of the circuit carrier, to rotate the circuit carrier by 180° along an axis of rotation oriented in the longitudinal direction of the circuit carrier, or to set the circuit carrier into rotation. In addition to the controlled removal of a single component soldered onto a circuit board using a gripping device, as described above, a device according to the invention can also be used to remove some or all of the components on a circuit board. For this purpose, the entire circuit board can be heated to the liquid temperature of the solder material used. In this state, all components can be removed from the circuit board, for example, by rotating it 180° so that the components then fall off the downward-facing, populated surface. In the case of a double-sided circuit board, the components on the reverse side fall off the circuit board due to gravity.The separation of the components floating in liquid solder can be initiated, if necessary, by a sudden jerking motion of the circuit carrier or by a vibrating motion of the circuit carrier. Alternatively or additionally, a hot circuit carrier can be set into rotation by the fixture, so that the resulting centrifugal force tears the components from their position. For this purpose, the device can include a means designed to move the fixture of the circuit carrier or the workpiece carrier as described above. The removal of all components from the assembled circuit board can be carried out after the selective desoldering of individual components intended for reuse. A device according to the invention thus enables the execution of a multi-stage desoldering process. The means for bringing the reusable component into contact with the inert, electrically non-conductive liquid may comprise at least a container designed to hold the inert, electrically non-conductive liquid and at least the part of the circuit carrier containing the reusable component. The container can be designed to allow the circuit board or workpiece carrier to be immersed in the inert, electrically non-conductive liquid. The container can also include a heating device for setting or controlling the temperature of the liquid. The heating device can be located outside, inside, or within the container, i.e., in one or more walls and / or the bottom of the container. Furthermore, the container can include a temperature sensor for measuring the current temperature of the inert, electrically non-conductive liquid. A device according to the invention can further comprise a means for moving the inert, electrically non-conductive liquid, preferably according to one of the aspects described above. Furthermore, the means for moving the liquid can comprise at least one means for moving the container. The inert, electrically non-conductive liquid can be stored in a container, which can be designed to be movable in order to bring a circuit carrier mounted on a stationary fixture into contact with the component to be desoldered. Furthermore, both the container holding the liquid and the fixture for the circuit carrier can be designed to be movable. The device may further comprise at least one means configured to separate all components from the circuit carrier while the connecting material of the circuit carrier is liquid. If a component is additionally connected to the circuit carrier at one or more points by means of an adhesive besides solder, it is advantageous if the adhesive is at least in a viscous state at the liquid temperature of the solder. The means of separation may comprise at least one mechanical separating device. The mechanical separating device may comprise at least one of the following: a scraper element having a dimension substantially corresponding to a lateral dimension of the circuit carrier; a squeegee; a slider; or a brush. The method used to remove all components from a single- or double-sided circuit board can depend on whether the circuit board is to be reused or declared scrap. In the latter case, the condition of the circuit board after removal or desoldering of all components is irrelevant. In the former case, the initial conditions are exactly the opposite: the condition of the desoldered components is of secondary importance, whereas the removal process must be carried out so gently on the circuit board that it is not damaged in the process. The mechanical separating device can be arranged to be movable relative to a surface of the circuit carrier, and / or a surface of the circuit carrier can be arranged to be movable relative to the mechanical separating device. Specifically, the populated surface of the circuit carrier and the mechanical separating device perform a relative movement to each other. Typically, before separating all components from a populated circuit board, it is advantageous to fix the board in place and then, by moving the separating device relative to the board, scrape the components floating on liquid solder off the board. This embodiment is generally simpler to implement, especially for smaller systems. However, it is also possible to move the circuit board relative to a stationary separating device. This embodiment can be implemented in large systems designed for high throughput. Furthermore, to remove all components to be desoldered from a circuit board, both the circuit board and the separating device can be moved. The device may also include a vessel designed to accommodate components separate from the circuit carrier. When removing all components from the assembled circuit board, the container for receiving the components separated from the circuit board can be positioned in the inert, electrically non-conductive liquid, so that the components stripped from the circuit board are conveyed by the separation device into the designated container. The latter can be positioned within the inert, electrically non-conductive device and be shaped so that the separated components fall directly into the designated container. For this purpose, it is advantageous if a lateral dimension of the container is at least as large as the corresponding dimension of the circuit board to be desoldered. The components collected in the container, especially those of some economic value, can be tested to determine if they are still functional. If so, they can be prepared for functional reuse, for example by cleaning. If they are no longer functional, they can be recycled. A device according to the invention can have a second vessel that is separated from the inert, electrically conductive liquid and is designed to receive the individual reusable components lifted from the circuit carrier by the gripping device. As already explained above, a device according to the invention uses an inert, electrically non-conductive liquid for the partial or complete desoldering of populated circuit carriers. By using this liquid to heat the circuit carrier and the components mounted on it, in conjunction with the controlled lifting of individual components and the gentle removal of all components soldered onto a circuit carrier, a device according to the invention particularly enables the reuse of desoldered, highly complex circuit carriers. Furthermore, the two-stage desoldering or separation process that can be performed by the device described here allows for the best possible utilization of the desoldered components. 4. Description of the drawings In the following detailed description, currently preferred embodiments of the invention are described with reference to the drawings, wherein Fig. 1 shows a schematic section through some essential components of a device according to the invention; Fig. 2 shows Fig. 1 after a means for bringing the reusable component into contact with the inert, electrically non-conductive liquid – in the illustrated example, a receptacle for the printed circuit board to be processed, as an example of a circuit carrier to be processed – has brought the latter into contact by lowering it into the inert, electrically non-conductive liquid; Fig. 3 shows Fig. 2 in the state after the means for adjusting the temperature of the liquid, i.e.,A heating device in the example shown has heated the solder material, which connects the components to the printed circuit board to be processed, to its liquidus temperature, and a means for the controlled removal of components, in the illustrated example a gripping device, contacts the component to be reused for controlled removal from the printed circuit board; Fig. 4 shows Fig. 4 after the gripping device has removed the component to be reused from the printed circuit board; Fig. 5 shows Fig. 4 after the holder for the printed circuit board to be processed has lifted it out of the liquid; Fig. 6 shows a schematic section through a second embodiment of a device according to the invention for desoldering one or more reusable components; Fig. 7 shows Fig.Fig. 6 shows the component to be desoldered after a means of bringing it into contact with the inert, electrically non-conductive liquid – in the illustrated example, a reservoir, a pump, and a pipe – has brought the component to be desoldered into contact with the inert, electrically non-conductive liquid; Fig. 8 shows Fig. 7 in the state after the means of adjusting the temperature of the liquid, i.e., the heating device of the apparatus, has heated the solder material connecting the components to the circuit carrier to be processed (in the illustrated example, a 2D printed circuit board) to its liquid temperature, and a means of controlled component removal, in the illustrated example again a gripping device, has contacted the component to be reused for controlled removal from the circuit carrier; Fig. 9 shows Fig.Fig. 8 shows the device after the gripping device has lifted the component to be reused from the circuit carrier; Fig. 10 shows Fig. 9 after the pump has pumped the inert, electrically non-conductive liquid back into its reservoir; Fig. 11 illustrates a schematic section through an embodiment of a device according to the invention for removing all components soldered onto a circuit carrier; Fig. 12 shows the device after a holder for the circuit carrier has brought it into contact with an inert, electrically non-conductive liquid; Fig. 13 shows the device after the heating device has heated the solder material connecting the components to the circuit carrier to be processed to its liquidus temperature and a mechanical separating device has stripped the components from the circuit carrier; Fig. 14 shows the device after the device has heated the solder material connecting the components to the circuit carrier to be processed to its liquidus temperature.Figure 13 shows the circuit carrier, now free of components, after the device has lifted it out of the hot liquid in the container; Figure 15 shows a schematic section through an embodiment of a device according to the invention, combining the examples of Figures 6 and 11; Figure 16 shows Figure 15 after a means of bringing the components into contact with the inert, electrically non-conductive liquid – in the illustrated example, a reservoir, a pump, and a pipeline – has brought the components to be desoldered into contact with the inert, electrically non-conductive liquid; Figure 17 illustrates Figure 13 for the embodiment of Figure 11; Figure 18 shows Figure 17 after the pump has pumped the inert, electrically non-conductive liquid back into its reservoir; FigureFigure 19 comprises a second embodiment of a device for removing all components soldered onto a circuit carrier, wherein the separation device is stationary and the circuit carrier to be desoldered is movable; Figure 20 reproduces Figure 19 after the device has lowered the circuit carrier into the liquid in the container of the device and the heating device of the container has heated the inert, electrically non-conductive liquid to the liquidus temperature of the solder material of the circuit carrier; and Figure 21 reproduces Figure 20 after the device has moved the circuit carrier under the separation device. 5. Detailed description of preferred embodiments In the following, currently preferred embodiments of a device according to the invention are explained in more detail. These embodiments are discussed using printed circuit boards or circuit boards as examples of circuit carriers. However, a device according to the invention is not limited to the embodiments described in this part. Rather, it can process not only conventional 2D printed circuit boards but also 3D circuit carriers. The embodiments described below, which are merely examples, are intended to familiarize a person skilled in the art with the principles underlying the devices according to the invention. Fig. 1 schematically shows a section through a device 100 comprising a container 110 filled to a fill level 105 with an inert, electrically non-conductive liquid 120. The container 110 has an upper rim 115. The container 110 can be made of any material, provided that its melting point is significantly higher than the maximum temperature to which the liquid 120 is to be heated. Smooth walls of the container 110 are preferred for reasons of cleaning and energy efficiency. The entire container 110, including the rim 115, can be made of a single material. Preferred materials are metals, metal alloys, or castings. Currently, aluminum is considered a preferred material. Additionally, a heating device 130 can be attached to or within the container 110 as a means of adjustable temperature control of the inert, electrically non-conductive liquid 120. In an embodiment of the device 100 in which the heating device 130 is arranged in the container 110, it is advantageous for the thermal conductivity of the walls and bottom of the container 110 to be low in order to minimize heat loss through the container 110 and to keep heat input into the surroundings of the container 110 to a minimum. In the embodiment of a device 100 according to the invention shown in Fig. 1, the heater 130 is not housed in the container 110 itself, but is mounted directly below the bottom of the container 110. This arrangement does not restrict the shape of the inner surface of the container 110 and, due to the proximity of the heater 130 to the liquid 120 to be heated and to the one or more components to be heated, offers good energy efficiency of the heating process while simultaneously allowing good control of the temperature profile of the liquid 120. In the example shown in Fig. 1, it is advantageous if at least the bottom of the container 110 is designed to be thermally conductive in order to transfer the energy of the heater 130 to the liquid 120 with high efficiency. A temperature sensor 155, mounted on the circuit board 140 to be heated, allows the temperature rise of the liquid 120 in the container 110 to be controlled. Temperature control is suppressed in the device 100 shown in Fig. 1. To measure the temperature of the liquid 120, a second temperature sensor can be mounted on a side wall of the container 110 (not shown in Fig. 1). As already explained above, the embodiments discussed below are based on conventional or classic 2D circuit boards. However, this does not represent a limitation for a device 100 according to the invention. Rather, it can be used for the controlled desoldering of any circuit carrier, such as MIDs or conventional circuit boards 140. Any liquid that is inert with respect to the components 150 and the printed circuit board 140 can be used as liquid 120. The essentially inert liquid 120 is characterized by the fact that, at least up to the melting temperature of the solder material, it does not undergo any chemical reaction with the component(s) 150 to be heated, nor with the printed circuit board 140, nor with the container 110. In this context, as well as elsewhere in this description, the term "essentially" means that, if a chemical reaction occurs with the liquid 120, its reaction rate is so slow that it is below the experimental detection limit. In another embodiment, an alternative liquid can be used whose chemical reaction with the component(s) 150 to be heated and / or the printed circuit board 140 does not adversely affect the quality of the modified printed circuit board. Furthermore, the liquid 120 must have the properties of an electrical insulator. This property guarantees that none of the components with which a circuit carrier – in the example of Fig. 1, the printed circuit board 140 – is equipped can be damaged by a current flow caused by the liquid 120. The inert, electrically non-conductive liquid 120 is selected such that its boiling point is above the melting point of the solder and above the melting point of the adhesive used to bond a component 150 to be desoldered to the circuit board 140. A mixture of inert, electrically non-conductive liquids can also be used as liquid 120. Using a liquid mixture can be particularly advantageous if it is necessary to adjust the boiling point of the liquid 120 to the melting point of the solder used for the component 150 to be desoldered. As an example of a liquid 120 that particularly well fulfills the aforementioned requirements, liquids composed of the elements carbon, oxygen, and fluorine may be mentioned. In particular, perfluoropolyether liquids currently appear promising as inert, electrically non-conductive liquids 140. Their boiling points currently cover the range from approximately 55 °C to approximately 290 °C. Another important advantage of these perfluoropolyether liquids is that their vapors are also inert and therefore cannot cause electrical or chemical damage to either the printed circuit board 140 or the components 150 mounted on it. Furthermore, the perfluoropolyether liquids form vapors whose density exceeds that of air, which facilitates the localization of the vapor phase of these liquids. Due to these properties, an inert, electrically conductive liquid 120 can reliably prevent oxidation of the solder joints of both the component 150 being desoldered and the printed circuit board 140, or more generally, of a circuit carrier 140. Large-area components 150, or components 150 that are mounted in large-area housings due to the large number of electrical connections, often have one or more adhesive points for mechanical stabilization. These points fix the underside of the components 150 to the printed circuit board 140 or a circuit carrier 140 (not shown in Fig. 1). Since the component 150 or its housing is in contact with the liquid 120 over a large or entire area, the underside of the adhesive points is heated to the same extent as the electrical connections of the component 150. After the adhesive bonds open and the solder of the electrical connections melts, the component 150 detaches from the printed circuit board 140. Due to the homogeneity of the temperature on the surface of the component 150 discussed in the previous section, a device according to the invention is very well suited for the controlled desoldering of components 150 in BGA (Ball Grid Array) packages. It is conceivable that in the future other suitable liquids 120, for example silicone oils, could be used as inert, electrically non-conductive liquids in devices 100 according to the invention. Four different embodiments of the use of devices 100 according to the invention are explained below. The first two examples describe selective desoldering processes of individual components. The second part, the third and fourth examples, discuss the removal of all components mounted on a circuit board. However, those skilled in the art will recognize that a device according to the invention allows the sequential execution of embodiments one and three, and two and four, respectively. The device 100 can process circuit carriers 140 or printed circuit boards 140 that are populated on both sides with components 150. The exemplary printed circuit board 140 shown in Fig. 1 is populated with components 150 on only one side. Three components 150 are soldered onto the front side of the printed circuit board 140; these are to be individually removed or desoldered from the board 140 for subsequent reuse. Typically, many other components are present on the populated front side of the printed circuit board 140. These are omitted in Fig. 1 for the sake of simplicity. Also for the sake of simplicity, the electrical connections of the components 150 are not shown in the schematic representation of Fig. 1. Various embodiments of the device 100 according to the invention can be used to desolder any large-area components 150 from any type of printed circuit board 140.In addition to the components 150, a temperature sensor 155 is also mounted on the circuit board 140. In the simplest case, the latter is placed on the circuit board 140. However, it is also possible to fix the temperature sensor 155 to the circuit board 140, for example, using a clamping device or by gluing it in place. In another embodiment of the device 100, the temperature sensor 155 can be arranged on the mounting 160 for the circuit board 140 instead of on the circuit board 140 itself. In yet another embodiment, the temperature sensor 155 can be mounted on a side wall of the container 110 of the device 100 at a height suitable for measuring the temperature of the liquid 120 in the container 110. Furthermore, it is possible to equip the device with two or three temperature sensors 155, which can be mounted in the positions described above.The temperature sensor 155 can be used as an actual value detector to carry out the heating process of the inert, electrically non-conductive liquid 120 driven by the heating device 130 in a closed control loop (not shown in Fig. 1). The printed circuit board 140, populated with components 150, is mounted on the holder 160 of the device 100. The holder 160 is an example of a means 160 for bringing the reusable components 150 into contact with the inert, electrically non-conductive liquid 120. As indicated by the arrow 165, the holder 160 is movable vertically and can thus be lowered into the liquid 120 to undergo a controlled heating process for the printed circuit board 140, the components 150 soldered to it, and the solder material connecting the printed circuit board 140 and the components 150. After completion of the desoldering process of one or more components 150, the holder 160 can lift the processed printed circuit board 140, or more generally, a processed circuit carrier 140, out of the liquid 120.Additionally, the receptacle 160 of the device 100 can be designed to move the circuit board 140 in the x and / or y direction in addition to the z direction (vertical direction) (not illustrated in Fig. 1). In the exemplary device 100 of Fig. 1, the receptacle 160 has a fixing mechanism 145 – in the illustrated example, a clamping mechanism 145 – to fix the printed circuit board 140 in or on the receptacle 160. This ensures that the location or position of the printed circuit board 140 can be determined at any time by the receptacle 160 of the device 100. Furthermore, the fixing mechanism 145 enables the execution of the movements of the printed circuit board 140, or more generally of a circuit carrier 140, as described in the third application example of the device 100, without the latter being able to move relative to the receptacle 160. As a means 180 for the controlled removal of the component(s) 150 to be reused, the device 100 includes a gripping device 180. In the exemplary device 100 of Fig. 1, the gripping device 180 is a vacuum gripper 180 or a gripper 180 based on a vacuum between the component 150 to be reused and the gripping device 180. However, the device 100 also allows the use of gripping devices 180 that are based on applying a mechanical force or exerting a magnetic force on the component 150. To exert a magnetic force on the component 150, it may be necessary to attach a ferromagnetic material, preferably in the form of a cuboid or a disc (not shown in Fig. 1), to its surface. As symbolized by arrow 183 in Fig. 1, the gripping device 180 is movable in the vertical direction (z-direction). Furthermore, the gripping device 180 can be moved in the x-direction (arrow 186) and in the y-direction (not shown in Fig. 1). Furthermore, the device 100 shown schematically in Fig. 1 has an optical system 190. This can, for example, comprise one or more camera systems. The optical system 190 makes it possible to track the movement of the circuit carrier 140 fixed to the mount 160, in the illustrated example the fixed circuit board 140, such as its lowering into and lifting out of the liquid 120 of the container 110, as well as the alignment of the gripping device 180 with respect to the component(s) 150 to be reused. Based on the signals provided by the optical system 190, a control device, which is not shown in Fig. 1, can control the movement of the gripping device 180. Fig. 2 shows the device 100 of Fig. 1 after the fixture has lowered the assembled printed circuit board 140 into the liquid 120 of the container 110 to such an extent that the reusable components 150 of the printed circuit board 140 are completely immersed in the liquid 120, so that all electrical connections or solder joints are surrounded by the liquid 120. During immersion, the temperature of the liquid 120 can be at room temperature, but it is also possible to immerse the assembled printed circuit board 140 in a liquid 120 whose temperature is higher than room temperature. This can shorten the heating process. However, the initial temperature of the liquid 120 at which the assembled printed circuit board 140 comes into contact with the liquid 120 must be chosen so that the specified permissible temperature gradient of the reusable components 150 is not exceeded. The liquid 120 simultaneously heats all electrical connections of the components 150 to the melting temperature or liquidus temperature of the solder material used to connect the electrical connections of the component 150 to the corresponding connection points on the printed circuit board 140. Upon reaching the melting temperature, the solder material melts at the electrical connections of the component(s) 150, and these connections detach from the connection points on the printed circuit board 140 or the circuit carrier 140. The desoldered component 170 either floats on the liquid 120 or is still held in position by the adhesive points, whose adhesive still has a higher viscosity than the molten solder. In this state, the gripping device 180 of the apparatus 100 can lift a reusable component 150 from the printed circuit board 140, or more generally, the circuit carrier 140. This process is illustrated in Fig. 3.Fig. 3 illustrates the desoldering process of a reusable component 150 after the heating device 130 of the device 100 has heated the inert, electrically non-conductive liquid 120 in the container 110 to the melting temperature of the solder material. Furthermore, the gripping device 180 has been lowered onto the surface of the component 150 to be desoldered. For this purpose, the device 100 moves the gripping device 180 over the reusable component 150. This alignment process is illustrated by the double arrow 186. The alignment of the gripping device 180 to the component 150 to be desoldered can be monitored by the optical system 190 discussed in Fig. 1 (the optical system 190 is not shown in Fig. 3). As symbolized by the double arrow 183, the aligned gripping device 180 can then be lowered onto the component 150.It is of course also possible to carry out the adjustment process with respect to the x and y directions while lowering the gripping device 180 onto the component 150 to be reused. The exemplary gripping device 180 of Fig. 3, which is in contact with the component 150 to be desoldered, generates a vacuum relative to the component 150 in order to lift it off the circuit board 140 by moving the gripping device 180 in the z-direction. The magnitude of the vacuum generated by the gripping device 180 can be used to implement a force sensor, which ensures that neither the component 150 to be desoldered nor the circuit board 140 is damaged when the gripping device 180 is moved in the z-direction. If, for example, the component 150 is also glued to the circuit board 140 at one or more points in addition to being soldered, and the adhesive does not reach a predetermined numerical value for its viscosity between the circuit board 140 and the component 150 at the present liquidus temperature of the solder material, the gripping device 180 lifts off the top of the component 150 without separating it from the circuit board 140.In this way, a force sensor of the gripping device 180 implements a safety feature of a desoldering process of the device 100, which reliably prevents the reusable component 150 and / or the circuit board 140 from being damaged during the desoldering or separation process. In a modified process, starting from the initial configuration illustrated in Fig. 1, the gripping device 180 can be contacted with the component 150 to be desoldered, and the component 150 can undergo the heating process while in contact with it. Furthermore, in the process state shown in Fig. 2, the gripping device 180 can be brought into contact with the component 150 to be reused, i.e., before the heating device 130 of the apparatus 100 begins the heating process of the circuit carrier 140 or the printed circuit board 140. Figure 4 illustrates the configuration of the device 100 after the gripping device 180 has separated the reusable component 150 from the circuit board 140. The device 100 can also include a drying device that removes any residual liquid from the component 170 lifted from the liquid (not shown in Figure 4). A drying device can also minimize the carryover of liquid 120 from the container 110. This largely prevents the loss of the expensive liquid 120. After placing component 170 in a designated position, such as a tray, the device 100 can bring the gripping device 180 into contact with the second reusable component 150 of the printed circuit board 140 in order to desolder it from the printed circuit board 140, as already described. This also applies, of course, to the third component 150 to be desoldered, which remains on the circuit carrier 140 or the printed circuit board 140. The process of removing the second and third components 150 should be carried out as quickly as possible in order to minimize the thermal stress on the circuit carrier 140 or the printed circuit board 140, as well as on the components still mounted on it (not shown in Fig. 4). Furthermore, a rapid removal process of the components 150 to be desoldered ensures a high throughput of the device 100. In a modified process flow, the receiving device 160 of the device 100 can lift the circuit board 140 out of the liquid 120 before the gripping device 180 contacts the component to be reused 150, so that the gripping device 180 does not come into contact with the hot liquid 120. If only one of the three reusable components 150 is to be desoldered from the circuit board 140, Fig. 5 illustrates the position of some essential components of the device 100 after the gripping device 180 has lifted the component 150 from the circuit carrier 140 or the circuit board 140. Immediately after separating the component 150 from the printed circuit board 140, the fixture 160 of the device 100 lifts the printed circuit board 140 out of the hot liquid 120 in order to minimize the thermal stress on both the processed printed circuit board 140 and the reusable components 150. This is illustrated in Fig. 5. Any remaining liquid on the printed circuit board 140 can drip off or evaporate. To increase the throughput of the device 100, it can, as already described above, include a drying device to accelerate the drying process of the circuit carrier 140 or the printed circuit board 140. Fig. 6 shows a schematic section of a second embodiment of a device 600 according to the invention for desoldering individual components 150 from a populated circuit carrier 140 or a populated printed circuit board 140. In the device 600, the receptacle 660 for the printed circuit board 140 can be designed to be stationary. In the illustrated example, the means for bringing the inert, electrically non-conductive liquid 120 into contact with a component 150 to be desoldered comprises a reservoir 620 in which the liquid 120 is stored. The reservoir 620 of the device 600 has a means for adjusting the temperature of the stored liquid 120. In the example shown in Fig. 6, this is the heating device 630. Furthermore, the means that brings the reusable component 150 of the circuit board 140 into contact with the liquid 120 includes a pump 640 and a piping system 650 for the liquid 120.At the time when the component 150 to be desoldered comes into contact with the liquid 120, the liquid 120 can have any temperature between room temperature and the melting temperature of the solder material. The pump 640 pumps the liquid 120 at a predetermined temperature or a predetermined temperature changing over time into the container 610 of the device 600 via the piping system 650. The completion of the pumping process is illustrated in Fig. 7. The hot liquid 120 heats the solder material, which connects the components 150 to the circuit carrier 140 or the printed circuit board 140, to its liquidus temperature. During the heating process or after its completion, the gripping device 180 of the apparatus 600 is aligned with the component 150 to be desoldered and brought into contact with it. Details of this are already explained above in the context of the discussion of Fig. 3. Furthermore, the apparatus 600 also enables the process modifications discussed above. The configuration after aligning and lowering the desoldering device 180 onto the component 150 to be desoldered is illustrated in Fig. 8. The device 600 is designed to perform the various steps of a desoldering process in different sequences. For example, starting from Fig. 6, in a first step the desoldering device 180 can contact the component 150 to be desoldered before it comes into contact with the liquid 120. This process control facilitates the alignment of the desoldering device 180 with respect to the component 150 being removed from the printed circuit board 140 or, more generally, from the circuit carrier 140. In a further process modification, the pump 640 can pump the hot liquid 120 back into the reservoir 620 before the separating device 180 contacts the component 150 to be removed and then quickly lifts it off the circuit board 140 before the solder material solidifies again. Fig. 9 illustrates the configuration of the device 600 after the gripping device 180 has lifted the component 150 to be desoldered or the desoldered component 170 from the circuit board 140. The pump 640 can then return the liquid 120 to the reservoir 620 to prepare it for a further heating process. This state is illustrated in Fig. 10. In an alternative embodiment of the device 600, the reservoir 620 is positioned such that the hot liquid 120, driven by gravity and with its quantity controlled by a valve, can flow into the reservoir 610. The reservoir 610 may include a drain valve with a flanged piping system and a pump. The pump can return some or all of the liquid 120 from the reservoir 610 to the reservoir 620. This embodiment avoids the need to transport all of the liquid 120 after each desoldering process and can thus contribute to increasing the energy efficiency of the device 600. In yet another modification of the device 600, the means for bringing the reusable component 150 into contact with the liquid 120 can include, in addition to the reservoir 620 which contains the heating device 630, a second reservoir for holding a cold liquid 120. A mixing device for the hot and cold liquid 120 can mix the hot and cold liquid 120 to establish a temperature profile over time for the liquid 120. This prevents the component 150 to be desoldered from being heated with a greater temperature gradient than specified by the manufacturer. Fig. 11 shows a schematic section of a third embodiment of a device 1100 according to the invention, which is designed to desolder all components 1150 from a circuit carrier 1140, in the illustrated example a printed circuit board 1140. The device 1100 has a modified receptacle 1160 for the circuit carrier 1140 or the printed circuit board 1140 compared to the receptacle 160 of Fig. 1. In the example shown in Fig. 11, the printed circuit board 1140 can be attached to the receptacle 1160 by means of a one-sided fixing mechanism 1145, for example a clamping device 1145. The modified receptacle 1160 has a rail system 1175 which enables a vacuum desoldering device 1180 to be moved in one dimension over a populated circuit carrier 1140 or a populated printed circuit board 1140. This is illustrated in Fig. 11 by the double arrow 1185. The recording 1160 can adjust the rail system 1175 in height, i.e.In the z-direction, the separating device 1180 is aligned with the position of the circuit board 1140 or the components 1150 soldered to it. In the vertical direction, the separating device 1180 moves synchronously with the circuit board 1140, which is clamped to the bottom of the holder 1160. The exemplary separating device 1180 of Fig. 11 has a slide 1185 that is fixedly connected to the separating device 1180 and is in contact with the printed circuit board 1140. The slide 1190 of the separating device 1180 can be adapted to a lateral dimension of the printed circuit board 1140. This embodiment makes it possible to strip all components 1150 from the printed circuit board 1140 while the slide 1185 is moved once across the populated surface of the printed circuit board 1140. In an alternative embodiment (not shown in Fig. 11), the separating device 1180 can have a brush instead of the slide 1185 for stripping the components 1150 floating in the molten solder material. This embodiment of a separating device 1180 is particularly advantageous if the circuit carrier 1140 has a 3D contour. In addition to a modified holder 1160, the device 1100 also includes a container 1120. This container is located in the liquid 120 used to heat the printed circuit board 1140, so that it can receive the components 1150 stripped from the printed circuit board 1140 by the slide 1185 of the separating device 1180. It is advantageous to adapt the depth dimension of the container 1120, i.e., perpendicular to the plane of the paper, to the width of the printed circuit board 1140 and / or the width of the slide 1185 of the separating device 1180. Fig. 12 shows the device 1100 of Fig. 11 after it has lowered the receptacle 1160 into the inert, electrically non-conductive liquid 120. The heating device 1130 heats the populated circuit board 1140 according to a predetermined temperature profile until the melting point of the solder material, which connects the components 1150 to the circuit carrier 1140 or the circuit board 1140, is reached. As illustrated in Fig. 13, the desoldering device 1180, guided by the rail system 1185, moves the slide 1185 across the circuit board 1140 while the solder is molten. This pushes the components 1150, which are suspended in the molten solder, away from the hot circuit board 1140. The desoldered components 1170 fall into the designated container 1120 and are collected there. Alternatively, the desoldering device 1180 can have a brush instead of the slide 1185, which wipes the components 1150 to be desoldered from a 3D circuit carrier 1140. In the next step, the receptacle 1160 of the device 1100 lifts the circuit board 1170, now free of components 1150, out of the hot liquid 120. This is illustrated in Fig. 14. If the circuit carrier 1140 or the printed circuit board 1140 is equipped with components 1150 on both sides or surfaces, the circuit carrier 1140 or the printed circuit board 1140 is turned over so that the components 1150 on the still equipped side can be separated from the circuit carrier 1140 or the printed circuit board 1140, as explained above in the context of Fig. 11, Fig. 12, Fig. 13 to Fig. 14. The described gentle separation process makes it possible to reuse the circuit carrier 1165 or the desoldered printed circuit board 1165 after desoldering components 1170, if this is economically feasible. The components 1170 collected in the container 1120 can be examined with regard to their reuse. If their functionality is impaired, and thus reuse is not economically viable, these components 1170 can be recycled. The mechanical separating device 1180 described in Figs. 11, 12, 13 to 14, which is based on a slide 1190, is merely one example for separating all components 1150 from a printed circuit board 1140. By modifying the receptacle 1160 of the device 1100, further embodiments of the separating device 1180 for gentle desoldering devices 1100 can be realized, as already described above. The device 1500 of Fig. 15 combines the device 600 of Fig. 6 with the modified receptacle 1160 and the container 1120 of the device 1100. Similar to the device 1100 of Fig. 11, the device 1500 is designed to desolder all components 1150 from a circuit carrier 1140 or a printed circuit board 1140. Fig. 16 illustrates the device 1500 of Fig. 15, after the heating device 630 of the reservoir 1120 has heated the stored liquid 120, and the pump 640 has pumped the hot liquid 120 from the reservoir 620 into the container 1510. The inert, electrically non-conductive liquid 120 transfers its heat energy to the populated circuit board 1140, or more generally, to the populated circuit carrier 1140. As soon as the liquidus temperature of the solder material is reached, the desoldering device 1180 pushes the slide 1190 across the populated surface of the circuit board 1140, or a brush across a populated surface of the circuit carrier 1140, and by this movement conveys the desoldered components 1170 into the container 1130 provided for this purpose. The completion of this process is illustrated in Fig. 17. As a final step, shown in Fig. 18, the pump 640 pumps the hot liquid 120 from the container 1510 of the device 1500 back into the reservoir 620 and removes the circuit board 1165, free of components 1170, from the environment of the inert, electrically non-conductive liquid 120. Finally, Fig. 19 illustrates a device 1900 which has a modified receptacle 1960 for a circuit carrier 1940 or a printed circuit board 1940 compared to the device 1100 of Fig. 11. In the modified receptacle 1960, the separating device 1980 is fixedly connected to the receptacle 1960 or the workpiece carrier 1960 by a rail system 1975 with respect to the lateral dimensions of the circuit carrier 1940 or the printed circuit board 1940. Similar to the separating device 1180 of the device 1100, the receptacle 1960 has a slide 1990 fixedly connected to the separating device 1980. In the embodiment shown in Fig. 19 for desoldering all components 1950 soldered onto a circuit board 1940, the circuit carrier 1940 or the circuit board 1940 is moved relative to the slide 1990 of the separation device 1980, in the example given being moved under the slide 1990.For this purpose, the base 1964 can have a transport device for the circuit board 1940, for example in the form of a conveyor belt. The transport of the circuit board 1940 across the base 1964 of the photograph 1960 is symbolized in Fig. 19 by the double arrow 1966. For the controlled removal of the desoldered components 1970, the base 1962 of the receptacle 1960 of the device 1900 has an opening 1964. Through this opening 1964, the components 1970 separated from the circuit board 1940 can fall into a container 1920 located below the opening 1964. The device 1900 performs a desoldering process that is very similar to the process described in the context of Figs. 12, 13 to 14. After the circuit board 1940 is lowered by insertion 1960 into the liquid 120 present in the container 1910, the heating device 1930 heats the circuit board 1940 to the melting point of the solder material. This state is illustrated by Fig. 20. Once the solder has reached its liquidus temperature, the transport device located in the base 1962 of the receptacle 1960, which is not shown in Fig. 20, conveys the circuit board 1940 under the slide 1990 of the separating device 1980, thereby stripping the components 1950 floating in the liquid solder from the circuit board 1940 and collecting them in the container 1920 located below the opening 1964 of the base 1962. This is shown schematically in Fig. 21.The further process steps performed by the device 1900 have already been explained in detail above in the context of a complete desoldering process of a populated printed circuit board 1940. As explained above, the separating device 1980 can, for example, have a brush instead of a slide 1990 if the circuit carrier 1940 has a 3D structure or a 3D molded part. Naturally, it is also possible to apply the modification explained with reference to Fig. 19, Fig. 20 to Fig. 21 to the fourth embodiment, namely the device 1500 of Fig. 15. 6. Procedural description of the principles of the invention The following describes some principles of the invention in a methodological manner. 1. A method for preparing at least one component connected to a circuit carrier by means of a bonding material for reuse, comprising: a. bringing the at least one component to be reused into contact with an inert, electrically non-conductive liquid; b. adjustable changing of the temperature of the inert, electrically non-conductive liquid; and c. controlled removal of the at least one component to be reused from the circuit carrier while the bonding material of the component to be reused is liquid. 2. A method as in 1., wherein the bonding material comprises at least one of: a solder material or an adhesive. 3.Method as in the first or second point, wherein the controlled removal of the reusable component from the circuit carrier comprises at least one element consisting of: a mechanical gripping device, a gripping device based on a magnetic force, or a gripping device based on a vacuum. 4. Method as in any of the preceding points, wherein the controlled removal of the reusable component moves it relative to the circuit carrier, and / or wherein bringing the reusable component into contact with the inert, electrically non-conductive liquid moves the circuit carrier relative to the reusable component. 5.A method as described in any of the preceding points, further comprising an optical system for detecting movement of at least one element consisting of: the reusable component, the circuit carrier, the controlled removal of the reusable component, or the contacting of the reusable component with the inert, electrically non-conductive liquid. 6. A method as described in any of the preceding points, wherein the controlled removal of the reusable component comprises the use of a force sensor for detecting the force exerted on the reusable component during the controlled removal. 7.Method as in any of the preceding points, wherein the controlled removal removes the reusable component from the circuit carrier while the latter is surrounded by the inert, electrically non-conductive liquid or exposed to an atmospheric environment. 8. Method as in any of the preceding points, wherein bringing the at least one reusable component into contact with the inert, electrically non-conductive liquid comprises at least one of: immersing at least a portion of the circuit carrier containing the reusable component into the inert, electrically non-conductive liquid, or flooding at least the portion of the circuit carrier containing the reusable component with the inert, electrically non-conductive liquid. 9.Method according to the preceding paragraph, wherein the immersion of at least the part of the circuit carrier containing the component to be reused comprises at least one of: moving the circuit carrier relative to the inert, electrically non-conductive liquid, or moving the inert, electrically non-conductive liquid relative to the circuit carrier. 10. Method according to one of paragraphs 8 or 9, wherein the flooding of at least the part of the circuit carrier containing the component to be reused comprises: pumping the inert, electrically non-conductive liquid onto the component to be reused, or pumping the inert, electrically non-conductive liquid from the component to be reused; and / or draining the inert, electrically non-conductive liquid from the component to be reused. 11.Method according to one of points 9 or 10, wherein the movement of the circuit carrier comprises a receptacle for receiving the circuit carrier. 12. Method according to the preceding point, wherein the receptacle fixes the circuit carrier by applying at least one of: a mechanical force, a magnetic force, or a force based on a pressure difference. 13. Method according to any one of points 9-12, wherein the movement of the circuit carrier moves the circuit carrier at least perpendicular and / or at least parallel to the surface of the inert, electrically non-conductive liquid. 14. Method according to any one of points 9-13, further comprising: sealing a process chamber containing the inert, electrically non-conductive liquid by means of an airlock and introducing and removing the circuit carrier into the process chamber. 15.A method according to any of the preceding points, wherein adjusting the temperature of the inert, electrically non-conductive liquid comprises at least one of the following: changing the temperature of the inert, electrically non-conductive liquid by means of a heating device or mixing hot and cold inert, electrically non-conductive liquid by means of a mixing device. 16. A method according to the preceding point, wherein changing the temperature of the inert, electrically non-conductive liquid comprises: controlling or regulating the change in temperature of the inert, electrically non-conductive liquid by means of a control unit or a regulating unit. 17. A method according to any of the preceding points, further comprising: measuring the temperature of the inert, electrically non-conductive liquid surrounding the component to be reused and / or the temperature of the component to be reused by means of a temperature sensor. 18.A method according to any of the preceding points, further comprising: removing the inert, electrically non-conductive liquid from the reusable component after its removal from the circuit carrier by means of a drying device. 19. A method according to the preceding point, wherein the drying device comprises at least one of: a vacuum dryer, an air knife blow-off device, or a thermal evaporation unit. 20. A method according to any of the preceding points, wherein adjusting the temperature of the inert, electrically non-conductive liquid and the controlled removal of the reusable component from the circuit carrier do not impair its functionality. 21.A method according to any one of points 9-20, wherein moving the circuit carrier comprises at least one of the following: setting the circuit carrier into oscillation, performing a reverse movement of the circuit carrier, rotating the circuit carrier 180° along an axis of rotation oriented in the longitudinal direction of the circuit carrier, or setting the circuit carrier into rotation. 22. A method according to any one of the preceding points, wherein bringing the reusable component into contact with the inert, electrically non-conductive liquid comprises at least one container for receiving the inert, electrically non-conductive liquid and at least the part of the circuit carrier containing the reusable component. 23. A method according to the preceding point, further comprising: moving the inert, electrically non-conductive liquid, preferably according to any one of points 8-20, wherein the moving comprises at least the moving of the container.24. A method according to any of the preceding points, further comprising: separating all components from the circuit carrier while the interconnect material of the circuit carrier is liquid. 25. A method according to the preceding point, wherein the separation is carried out by means of at least one mechanical separating device. 26. A method according to the preceding point, wherein the mechanical separating device comprises at least one of: a scraper element having a dimension substantially corresponding to a lateral dimension of the circuit carrier; a squeegee; a slide; or a brush. 27. A method according to any of the two preceding points, wherein the mechanical separating device is movable relative to a surface of the circuit carrier and / or a surface of the circuit carrier is movable relative to the mechanical separating device. 28. A method according to any of the preceding points, further comprising: collecting the components separated from the circuit carrier in a container. QUOTES INCLUDED IN THE DESCRIPTION This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature WO 2009 / 120687 A2

[0010] DE 20 2010 015 776 U1

[0010] Cited non-patent literature Dismantling of printed circuit boards enabled electronic components sorting and their subsequent treatment open improved elemental sustainability opportunities", Sustainability 2021, 13, 103357, https: / / doi.org / 10.339o / su131810357

[0023]

Claims

Device for preparing for reuse at least one component connected to a circuit carrier by means of a connecting material, comprising: a. at least one means configured to adjustably change the temperature of a substantially inert, electrically non-conductive liquid; b. at least one means configured to bring the at least one component to be reused into contact with the inert, electrically non-conductive liquid; and c. at least one means configured to controllably remove the at least one component to be reused from the circuit carrier while the connecting material of the component to be reused is liquid. Device according to claim 1, wherein the joining material comprises at least one of: a solder material or an adhesive. Device according to claim 1 or 2, wherein the means for controllably removing the component to be reused from the circuit carrier comprises at least one of: a mechanical gripping device, a gripping device based on a magnetic force, or a gripping device based on a vacuum. Device according to one of the preceding claims, wherein the means for controllably removing the component to be reused is arranged to be movable relative to the circuit carrier, and / or wherein the means for bringing the component to be reused into contact with the inert, electrically non-conductive liquid is further arranged to move the circuit carrier relative to the component to be reused. Device according to one of the preceding claims, wherein the device further comprises an optical system configured to detect movement of at least one of the following elements: the reusable component, the circuit carrier, the means for controlled removal, or the means for bringing the reusable component into contact with the inert, electrically non-conductive liquid. Device according to one of the preceding claims, wherein the means for controllable removal of the component to be reused comprises a force sensor for detecting the force exerted on the component to be reused by the means for controllable removal. Device according to one of the preceding claims, wherein the means for controlled removal is provided to remove the reusable component from the circuit carrier while the latter is surrounded by the inert, electrically non-conductive liquid or exposed to an atmospheric environment. Device according to one of the preceding claims, wherein the means for bringing the at least one reusable component into contact with the inert, electrically non-conductive liquid comprises at least one: at least one means for immersing at least one part of the circuit carrier containing the reusable component into the inert, electrically non-conductive liquid, or at least one means for flooding at least the part of the circuit carrier containing the reusable component with the inert, electrically non-conductive liquid. Device according to the preceding claim, wherein the means for immersing at least the part of the circuit carrier containing the component to be reused comprises at least one of: at least one means for moving the circuit carrier relative to the inert, electrically non-conductive liquid, or at least one means for moving the inert, electrically non-conductive liquid relative to the circuit carrier. Device according to claim 8 or 9, wherein the means for flooding at least the part of the circuit carrier containing the reusable component comprises: at least one pump configured for at least one of: pumping the inert, electrically non-conductive liquid onto the reusable component or pumping it off the reusable component; and / or at least one drain valve configured to drain the inert, electrically non-conductive liquid from the reusable component. Device according to one of claims 9 or 10, wherein the means for moving the circuit carrier comprises a receptacle for receiving the circuit carrier. Device according to the preceding claim, wherein the receptacle is configured to fix the circuit carrier by applying at least one of: a mechanical force, a magnetic force, or a force based on a pressure difference. Device according to one of claims 9-12, wherein the means for moving the circuit carrier is configured to move the circuit carrier at least perpendicular and / or at least parallel to the surface of the inert, electrically non-conductive liquid. Device according to one of claims 9-13, wherein the device further comprises at least one lock which is configured to close a process chamber containing the inert, electrically non-conductive liquid and to introduce and remove the means for moving the circuit carrier with the circuit carrier received into the process chamber. Device according to one of the preceding claims, wherein the means for adjusting the temperature of the inert, electrically non-conductive liquid comprises at least one: a heating device for the inert, electrically non-conductive liquid or a mixing device for mixing hot and cold inert, electrically non-conductive liquid. Device according to the preceding claim, further comprising a control unit or a regulating unit configured to control or regulate the changing of the temperature of the inert, electrically non-conductive liquid. Device according to one of claims 11-16, wherein the device further comprises at least one sensor configured to measure at least one of: the temperature of the inert, electrically non-conductive liquid surrounding the component to be reused, the temperature of the component to be reused, the temperature of the circuit carrier, or the temperature of the receptacle of the circuit carrier. Device according to one of the preceding claims, wherein the device further comprises a drying device which is configured to remove the inert, electrically non-conductive liquid from the component to be reused after its removal from the circuit carrier. Device according to the preceding claim, wherein the drying device comprises at least one of: a vacuum dryer, an air knife blow-off device, or a thermal evaporation unit. Device according to one of the preceding claims, wherein the means for adjusting the temperature of the inert, electrically non-conductive liquid and the means for controllably removing the component to be reused are provided, the functionality of which is not damaged by the process of removal from the circuit carrier. Device according to one of claims 9-20, wherein the means for moving the circuit carrier is further configured for at least one of: setting the circuit carrier into a vibration, performing a reverse movement of the circuit carrier, rotating the circuit carrier by 180° along an axis of rotation oriented in the longitudinal direction of the circuit carrier, or setting the circuit carrier into a rotation. Device according to one of the preceding claims, wherein the means for bringing the reusable component into contact with the inert, electrically non-conductive liquid comprises at least a container which is configured to receive the inert, electrically non-conductive liquid and at least the part of the circuit carrier which includes the reusable component. Device according to the preceding claim, further comprising a means for moving the inert, electrically non-conductive liquid, preferably according to one of claims 8-20, wherein the means for moving comprises at least a means for moving the container. Device according to one of the preceding claims, wherein the device further comprises at least one means which is configured to separate all components from the circuit carrier while the connecting material of the circuit carrier is liquid. Device according to the preceding claim, wherein the means for separating comprises at least one mechanical separating device. Device according to the preceding claim, wherein the mechanical separating device comprises at least one of: a scraper element having a dimension substantially corresponding to a lateral dimension of the circuit carrier; a squeegee; a slider; or a brush. Device according to one of the two preceding claims, wherein the mechanical separating device is arranged to be movable relative to a surface of the circuit carrier and / or a surface of the circuit carrier is arranged to be movable relative to the mechanical separating device. Device according to one of the preceding claims, wherein the device further comprises a vessel which is configured to receive components separated from the circuit carrier.

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