POWER ELECTRONIC DEVICE AND POWER ELECTRONIC FUNCTIONAL SYSTEM

Description

[0001] The present invention relates to a power electronic device and a power electronic functional system which ensure cooling of a power semiconductor in a thermally and energetically optimized manner.

[0002] The power electronic device and the power electronic functional system can be used in the field of power electronics or assembly and connection technology.

[0003] Conventional power electronics, as exemplified in Figure 1 shown, usually comprises a power module 3, which is mounted on a heat sink 6, also referred to as a cold plate, through which a cooling medium 7 flows and is usually connected to an intermediate circuit capacitor 5 via a busbar 4.

[0004] Gate driver circuits and control electronics or a chip 8 are usually arranged on a control circuit board 2 encompassed by the power electronics.

[0005] The structure of a conventional power module 3 is shown in an enlarged view in Figure 2 It can be seen that the chip 8 is connected to a baseplate 12 via a bonding wire 9 and a solder layer 10 with an electrical connection DCB 11 made of a copper-ceramic-copper layer. Thermal paste 13 facilitates the transfer of heat from the baseplate 12 to the heat sink 6 and thus to the cooling medium 7.

[0006] Further designs of conventional power electronics and in particular their cooling aspects are explained with reference to the following documents.

[0007] US 9,560,790 B2 discloses a cooling system for a motor vehicle. The cooling system comprises an evaporator, a condenser arranged downstream of the evaporator, a pump arranged downstream of the condenser, and a two-phase cooler arranged downstream of the pump and in series upstream of the evaporator. The two-phase cooler can receive heat energy from a heat-generating device to preheat a working fluid and supply the preheated working fluid to the evaporator. The heat-generating device can be a power electronics device thermally coupled to the two-phase cooler.

[0008] US 9,363,930 B2 discloses a cooling system with a cooling plate configured to be contacted with a liquid coolant and to discharge vapor-phase coolant. Furthermore, the cooling system includes a heat exchanger configured to transfer heat from the vaporous coolant to the liquid coolant.

[0009] US Pat. No. 5,455,458 discloses a cooling device for a power semiconductor, which is arranged together with a substrate in a housing on a heat extraction base. The space within the housing is filled with a phase-change material that absorbs heat at a transition temperature below the critical temperature of the power semiconductor, to absorb heat during peak loads. Wires thermally couple the power semiconductor to the phase-change material. Heat is extracted from both the semiconductor wafer and the phase-change material via a base element.

[0010] US 2008 / 0266802 A1 discloses a technique for cooling connection points in power electronic circuits, such as connection points created by wire bonds. A phase-change heat spreader is thermally coupled at or near the connection point, and a continuous phase change occurs within the heat spreader to remove heat from the connection point during operation. The heat spreader can extend over an area larger than the connection point to improve cooling and dissipate heat over a larger area. The phase change is arranged below the component or chip to be cooled.

[0011] WO 2014 / 131589 A1 discloses a cooling device with phase-change storage units for converters for cooling converters and dissipating heat during power loss peaks. The cooling device comprises a component to be cooled with varying power losses, wherein the component to be cooled comprises a converter module. Thermally coupled to the component is a heat sink with cooling fins and a phase-change storage unit, wherein the heat sink and the phase-change storage unit are thermally connected to one another via at least one heat pipe.

[0012] However, the cooling devices presented, which are designed in particular for cooling power electronic devices, have thermal restrictions in that, particularly at peak loads, the heat generated by the power semiconductor cannot be dissipated or cannot be dissipated in a sufficiently short time despite the surrounding coolant.

[0013] To overcome this disadvantage, conventional designs often feature significantly larger heat transfer surfaces. However, this results in significantly increased installation space requirements, resulting in low power density for power electronic systems equipped with them.

[0014] In addition, such systems are not scalable in terms of performance. Furthermore, known systems in this field often exhibit unwanted, so-called parasitic inductance, which may affect the signals output by the power electronics unit and / or lead to voltage overshoots during switching.

[0015] From JP 2013 179104 A a power electronic device according to the preamble of claim 1 is known.

[0016] US 2009 / 033410 A1 discloses power semiconductors that are connected to a control circuit board via bond wires.

[0017] US 10 149 413 B1 discloses power semiconductors that are connected to a control circuit board via a liquid-cooled heat sink with embedded cooling channels.

[0018] Based on this, the present invention is based on the object of providing a power electronic device and a power electronic functional system which ensure cooling of a power semiconductor in a thermally and energetically optimized manner.

[0019] This object is achieved by the inventive power electronic device according to claim 1 and by the inventive power electronic functional system according to claim 9. Advantageous embodiments of the inventive power electronic device are specified in subclaims 2 to 8.

[0020] In addition, according to the invention, a motor vehicle according to claim 10 is provided, which comprises at least one power electronic device according to the invention or one power electronic functional system according to the invention.

[0021] The features of the claims can be combined in any technically reasonable manner, whereby the explanations from the following description as well as features from the figures can also be used to comprise additional embodiments of the invention.

[0022] The invention relates to a power electronic device which comprises at least one power semiconductor and a first circuit board connected to the power semiconductor for control purposes.

[0023] Furthermore, the power electronic device comprises at least one leadframe, which implements the control-related connection between the power semiconductor and the first circuit board. According to the invention, the power semiconductor is connected to at least one contacting region of the leadframe in such a way that heat can be transferred from the power semiconductor to the leadframe and conducted away from the power semiconductor by the leadframe. The power electronic device further comprises a housing, which at least partially delimits a liquid reservoir in which a cooling liquid is or can be accommodated. A respective power semiconductor and a respective leadframe are arranged in the liquid reservoir for the purpose of transferring heat from the respective power semiconductor and / or from the respective leadframe to the cooling liquid.

[0024] The present power electronic device is a power electronic device.

[0025] The power semiconductor can also be referred to as a chip and functions as a switching device. A control unit, which is advantageously also included in the power electronic device and, in one embodiment, can be formed from a microcontroller and a gate driver, is configured to transmit signals to the power semiconductor via the circuit board. The power semiconductor then performs switching processes on components to be controlled, such as an electric motor or the corresponding phase of the electric motor, by transmitting electrical signals.

[0026] In particular, the power semiconductor can be connected to the leadframe by sintering or soldering. The power semiconductor can be connected to the leadframe via its so-called chip underside. Likewise, the connection between the leadframe and the circuit board can be realized by sintering or soldering.

[0027] An electrical energy supply can be realized in particular via a battery connected to the circuit board, which supplies current to the circuit board, the leadframe and the power semiconductor via an intermediate circuit capacitor.

[0028] Electrical energy provided by the battery can be routed via the circuit board and high-current contacts to operate the components.

[0029] The control unit itself can be arranged outside the space defined by the housing, in particular on the circuit board and connected to it for control purposes.

[0030] The intermediate circuit capacitor can also be arranged on the circuit board.

[0031] The so-called leadframe is a solderable metallic conductor carrier in the form of a frame or comb, designed particularly for use on semiconductor chips. In addition to a contacting area for contacting the power semiconductor, such a leadframe comprises a plurality of conductive elements extending from the contacting area, which in turn are configured for electrical contact with other electronic components, in particular with the circuit board.

[0032] In the present invention, the leadframe thus fulfills the function of a so-called "heat spreader." In addition, heat is absorbed from the power semiconductor via the circuit board and transferred from the circuit board to the cooling fluid. Furthermore, the leadframe serves to make electrical contact with the circuit board, particularly via its so-called "drain" connection.

[0033] The circuit board is in particular a so-called high-current PCB.

[0034] The housing and thus also the cooling liquid contained in the reservoir surround the respective power semiconductor and the respective leadframe.

[0035] The liquid reservoir here refers to a fluidically closed space that serves to hold the coolant.

[0036] Regardless of the possible variants regarding the number of power semiconductors and leadframes, these are arranged in the liquid reservoir according to the invention.

[0037] In particular, it is provided that the cooling liquid is an inert and / or electrically insulating liquid with respect to the components wetted by it.

[0038] The unit consisting of a circuit board, leadframe and at least one power semiconductor can also be called a half-bridge module

[0039] The power electronic device according to the invention thus allows a power semiconductor to be cooled in an optimal manner so that it can be operated with a correspondingly high electrical power.

[0040] The design of the power electronic device according to the invention exhibits low parasitic inductance. Furthermore, only low electrical resistances need to be overcome. Furthermore, it is clear that no expensive and / or heavy materials such as ceramics need to be used for the design of the power electronic device according to the invention.

[0041] In a continuous embodiment of the power electronic device, it is provided that the power electronic device comprises at least one further power semiconductor and at least one further leadframe, which realizes the control-technical connection between the further power semiconductor and the first printed circuit board, wherein the further power semiconductor is connected to at least one contacting region of the further leadframe in such a way that heat can be transferred from the further power semiconductor to the further leadframe and can be conducted away from the further power semiconductor by the further leadframe, and wherein the further power semiconductor and the further leadframe are arranged on the side of the first printed circuit board opposite the power semiconductor and the leadframe.

[0042] The invention is not limited to the fact that only power semiconductors and leadframes are arranged on the circuit board, but several power semiconductors and leadframes can be arranged on both sides of the circuit board according to the invention.

[0043] It can also be provided here that the further power semiconductor is connected to the contacting area of ​​the further leadframe with a side facing away from the first circuit board.

[0044] In the embodiment with only one power semiconductor and one leadframe, the housing is sealed from the first circuit board. Accordingly, the first circuit board serves to define the fluid reservoir. For sealing purposes, an additional seal can be arranged between the housing and the respective circuit board or circuit board side.

[0045] Vertical electrical connections, so-called vias, can be used to connect high-current contacts to the circuit board. These vias themselves have a sealing effect on the high-current contacts and the circuit board, so that no additional sealing against the coolant is necessary.

[0046] By using the circuit board as part of the liquid reservoir seal, the electrical contact between the power semiconductors and the external circuit board can be achieved via the vias on the circuit board and the high-current contacts. The high-current contacts can be soldered to the circuit board at the via locations. Therefore, sealing the high-current contacts is not necessary.

[0047] For the purpose of efficient heat dissipation, conduction elements of the respective leadframe can form a total heat transfer surface Ag for transferring heat to the cooling liquid, which, in relation to a connection surface Ac of the respective leadframe, at which the respective leadframe contacts the respective power semiconductor, has the following ratio: Ag / Ac > 1.

[0048] This means that the total heat transfer area realized by the conductive elements of the respective leadframe is at least as large as the contact area. In a favorable embodiment of the power electronic device, the total heat transfer area is significantly larger, i.e., at least twice as large as the contact area.

[0049] This area ratio ensures optimal distribution of the heat generated by the respective power semiconductor and consequently optimal heat dissipation and cooling of the respective power semiconductor.

[0050] This creates an optimal heat spreading effect.

[0051] In an advantageous embodiment, it is provided that an area on the first circuit board outlined by end regions of the line elements of the respective leadframe is at least twice as large as the area of ​​the respective power semiconductor facing the first circuit board.

[0052] In particular, the plane of attachment of the respective leadframe to the respective power semiconductor can have a distance from the first circuit board.

[0053] This enables optimal heat transfer from the respective leadframe to its surroundings or to the cooling liquid due to the fact that large areas of its conduction elements are completely contactable by the cooling liquid.

[0054] This is particularly achieved when the power semiconductor is attached to the leadframe with a side facing away from the first circuit board.

[0055] In particular, it can be provided that a direct electrical connection between the power semiconductor and the circuit board is formed on the side of the power semiconductor opposite the leadframe. This means that the power semiconductor is electrically coupled to the circuit board both indirectly via the leadframe and directly to the circuit board.

[0056] This is achieved in particular by electrically conductive layers on the two contact sides of the power semiconductor.

[0057] In a further advantageous embodiment, it is provided that the first circuit board is electrically coupled to a second circuit board, wherein the first circuit board with the power semiconductors and leadframes arranged thereon is positioned such that the further leadframe is at a distance from the second circuit board.

[0058] This is particularly important to ensure that the second leadframe is not covered, but can be contacted by the coolant as far as possible for efficient heat dissipation.

[0059] In the embodiment with at least two power semiconductors and two leadframes, the housing is sealed from the second circuit board, which is electrically connected to the first circuit board. Accordingly, the second circuit board serves to delimit the liquid reservoir. The electrical coupling of the second circuit board to the first circuit board is achieved, in particular, via additional high-current contacts.

[0060] In addition to the function of defining the liquid reservoir, the second circuit board also has the function of making contact with the outside, in particular with an intermediate circuit capacitor.

[0061] In addition, the power electronic device may further comprise a condensation unit which is configured to condense evaporated cooling liquid while cooling it and in turn to make it available for cooling the respective power semiconductor and / or the respective leadframe.

[0062] This ensures that the heat of evaporation can also be dissipated. The coolant is thus circulated in a heat cycle.

[0063] For this purpose, the condensation unit can have a receiving chamber for receiving a cooling medium, in particular for the flow of a cooling medium through it. The condensation unit is configured to absorb heat from evaporated coolant and transfer it to the cooling medium in the receiving chamber. This creates a closed system for high-performance two-phase cooling. Accordingly, the power electronic device in this embodiment is designed with a heat exchanger function.

[0064] Furthermore, the condensation unit can have projections, in particular ribs, formed in the direction of the liquid reservoir, wherein the receiving space for receiving the cooling medium extends at least partially into these projections. These projections, which are in particular designed in the form of ribs, thus significantly increase the heat transfer surface of the condensation unit. Due to the fact that the receiving space extends into the projections, there is optimal heat transfer from the projections to the cooling medium in the projections, so that the condensation unit can be cooled efficiently by the cooling medium, and accordingly, efficient cooling of the evaporated cooling liquid and, consequently, condensation of the cooling liquid can be achieved.

[0065] A further aspect of the present invention is a power electronic functional system comprising a plurality of power electronic devices according to the invention, wherein the power electronic devices are connected to lines for different voltage phases. In particular, the power electronic functional system can be designed such that a plurality of power electronic devices according to the invention are mounted on a high-current conducting element, such as a multi-layer copper sheet, and interconnected to form a multi-phase power electronic system.

[0066] A very low-inductance, low-resistance high-current connection can be realized between the individual power electronic devices.

[0067] In particular, each power electronic device according to the invention can be coupled to a phase of an alternating voltage. Due to the possible design of the power electronic devices as modules, the power electronic functional system can be easily scaled with regard to output current and output power.

[0068] Heat can continue to be efficiently dissipated to the environment over a large area of ​​the high-current conducting element or the multi-layer copper sheet.

[0069] Furthermore, shielding can be implemented to achieve sufficient electromagnetic compatibility.

[0070] The present invention is supplemented by a motor vehicle, in particular a motor vehicle that can be driven at least partially by an electric motor, which comprises at least one power electronic device according to the invention and / or at least one power electronic functional system according to the invention and a cooling medium circuit that is fluidically coupled to the condensation unit of the respective power electronic device.

[0071] Accordingly, a cooling medium that may also be used for other purposes in a motor vehicle, such as a water-glycol mixture, can be supplied to the power electronic device according to the invention and thus the power electronic device can be integrated into the overall cooling circuit of the motor vehicle.

[0072] The invention described above will be explained in detail below against the relevant technical background with reference to the accompanying drawings, which show preferred embodiments. The invention is in no way limited by the purely schematic drawings, and it should be noted that the embodiments shown in the drawings are not limited to the dimensions shown. It is shown in Figure 1 : Power electronics with a conventional design, Figure 2 : the area of ​​the electrical connection of the chip according to the embodiment of Figure 1 in enlarged view, Figure 3 : a power electronics according to the invention in sectional view, Figure 4 : the area of ​​connection of high-current contacts of a high-current contact according to the Figure 3 illustrated embodiment, Figure 5: a further embodiment of a power electronics according to the invention in sectional view, and Figure 6 : a power electronic functional system according to the invention with several power electronic devices according to the invention.

[0073] On the Figures 1 and 2 has already been referred to to explain the state of the art.

[0074] Figure 3 shows a first embodiment of a power electronic device 1 according to the invention.

[0075] This comprises a power semiconductor 16, which can also be referred to as a chip. The chip or power semiconductor 16 is electrically connected to a leadframe 20 with its chip interior 17, which is oriented upwards in the embodiment shown here. It can be seen that the contact area 21 between the power semiconductor 16 and the leadframe 20 is significantly smaller than the total area formed by the leadframe 20, so that heat introduced into the leadframe 20 by the power semiconductor 16 can be distributed by the leadframe 20 over its large surface. The leadframe 20 is in turn electrically connected to a first printed circuit board 30. Accordingly, heat is also transferred from the leadframe 20 to the first printed circuit board 30. The power semiconductor 16 and the leadframe 20 are located within a liquid reservoir 41 defined by a housing 40.This liquid reservoir 41 contains cooling liquid 42, which completely surrounds the power semiconductor 16 and the leadframe 20. Accordingly, heat can be transferred from the power semiconductor 16 to the cooling liquid 42 via the large surface area of ​​the leadframe 20, thus effectively cooling the power semiconductor 16.

[0076] The first circuit board 30 is thus designed to be multifunctional, since it serves to contact the power semiconductor 16 and to make electrical contact to the outside, but at the same time also to demarcate the liquid reservoir 41 in certain areas.

[0077] The power electronic device further comprises a condensation unit 100, which forms a receiving space 101 in which a cooling medium 103 is arranged. To increase the surface area of ​​the condensation unit 100, projections 102 are provided in the direction of the first circuit board 30. These projections are components of the receiving space 101 and are accordingly filled with cooling medium 103.

[0078] If the cooling liquid 42 evaporates due to temperature, it reaches the condensation unit 100 in vapor form. Because the cooling liquid is kept at a low temperature level by the cooling medium 103, the vaporous cooling liquid 42 condenses, so that the liquefied cooling liquid 42 again drips from the projections 102 and is fed to the liquid reservoir 41 for the purpose of further cooling of the power semiconductor 16 or the leadframe 20. The cooling medium 103 of the condensation unit 100 can be fluidically connected to another circuit, such as a cooling system of a motor vehicle, so that it can also be cooled via a heat exchanger (not shown here) and can be fed again for the described condensation purpose.

[0079] In order to connect the power electronic device 1 to a direct current network, the device in the embodiment shown here further comprises a so-called DC link capacitor 104.

[0080] In an alternative embodiment, the DC link capacitor 104 can also be mounted on the housing 40 by means of a press connection during assembly of the power electronic device 1.

[0081] On the first circuit board 30, a so-called snubber capacitor 95 is also arranged in an electrically conductive manner for the purpose of damping voltage peaks.

[0082] A distance 80 exists between the leadframe 20 and the first circuit board 30. In the embodiment shown here, the distance 80 is set such that the power semiconductor 16 rests on the first circuit board 30 with its side facing away from the leadframe 20 and thus with its upper side, making electrically conductive contact therewith. In this way, heat can be transferred directly from the power semiconductor 16 to the first circuit board 30.

[0083] A seal 70 is arranged between the housing 70 and the first circuit board 30. The electrical signals or the electrical power supply are transmitted or realized by high-current contacts 92, which are coupled to the first circuit board 30.

[0084] This connection is shown in enlarged view in Figure 4 visible.

[0085] It can also be seen here that each high-current contact 92 is electrically connected to the first circuit board 30 via a respective so-called via 94. The via 94 also simultaneously ensures a fluid seal against the cooling liquid 42 when passing through the circuit board 30.

[0086] In Figure 5 a further embodiment of the power electronic device 1 according to the invention is shown.

[0087] This differs from the one in Figure 3The embodiment shown essentially consists in that a further power semiconductor 50 and a further leadframe 60 are arranged on the side of the first circuit board 30 opposite the power semiconductor 16 and the leadframe 20. The further power semiconductor 50 and the further leadframe 60, like the power semiconductor 16 and the leadframe 20, are completely surrounded by the cooling liquid 42. This is ensured by a distance 91 between the first circuit board 30 and a second circuit board 90, which, together with the housing 40, delimits the liquid reservoir 41.

[0088] The connection between the first circuit board 30 and the second circuit board 90 is realized here via additional high-current contacts 93. As in the Figure 3In the first embodiment shown, the electrical connection of the power electronic device 1 is made via high-current contacts 92, which, however, are connected to the second circuit board 90 in the embodiment shown here.

[0089] The Figure 5 The embodiment shown thus has the advantage that two power semiconductors 16, 50 can be cooled simultaneously in a very space-efficient manner by a cooling liquid 42 which condenses on a common condensation unit 100.

[0090] Figure 6 shows a power electronic functional system according to the invention, which comprises several power electronic devices 1 according to the invention.

[0091] The power electronic devices 1 are connected via high-current contacts 92 to current-carrying lines 200, which can in particular be copper sheet layers, through which heat can also be dissipated. For example, one phase of a three-phase motor is connected to the output of the power electronic functional unit, here to the AC connection. Power electronic functional units are therefore connected to a three-phase motor, which is typical in an electric drive system.

[0092] The power electronic device and the power electronic functional system enable cooling of a power semiconductor in a thermally and energetically optimized manner so that it can be designed for high performance. List of reference symbols

[0093] 1Power electronic device 2Control circuit board 3Power module 4Busbar 5Intermediate circuit capacitor 6Heat sink 7Cooling medium 8Chip 9Bond wire 10Solder layer 11DCB 12Baseplate 13Thermal paste 16Power semiconductor 17Chip underside 20Leadframe 21Contacting area 30First circuit board 40Housing 41Liquid reservoir 42Cooling liquid 50Further power semiconductor 60Further leadframe 70Seal 80Gap 90Second circuit board 91Gap between the first circuit board and the second circuit board 92High-current contact 93Further high-current contact 94Via 95Snubber capacitor 100Condensation unit 101Receiving space 102Protrusion 103Cooling medium 104DC link capacitor 200Live wires / layers 201AC phase output

Claims

1. A power electronics device (1) comprising at least one power semiconductor (16) and a first printed circuit board (30) connected to the power semiconductor (16) for control purposes, wherein the power electronics device (1) further comprises at least one lead frame (20) which provides the control connection between the power semiconductor (16) and the first printed circuit board (30), characterised in that the power semiconductor (16) is connected to at least one contacting region (21) of the lead frame (20) in such a way that heat can be transferred from the power semiconductor (16) to the lead frame (20) and can be conducted away from the power semiconductor (16) by the lead frame (20), the power electronics device (1) further comprises a housing (40), which at least in regions delimits a liquid reservoir (41) in which a cooling liquid (42) is or can be received, and a respective power semiconductor (16) and a respective lead frame (20) are arranged in the liquid reservoir (41) for the purpose of transferring heat from the respective power semiconductor (16) and / or from the respective lead frame (20) to the cooling liquid (42).

2. The power electronics device according to claim 1, characterised in that the power electronics device (1) comprises a further power semiconductor (50) and at least one further lead frame (60), which provides the control connection between the further power semiconductor (50) and the first printed circuit board (30), the further power semiconductor (50) is connected to at least one contacting region of the further lead frame (60) in such a way that heat can be transferred from the further power semiconductor (50) to the further lead frame (60) and can be conducted away from the further power semiconductor (50) by the further lead frame (60), and the further power semiconductor (50) and the further lead frame (60) are arranged on the side of the first printed circuit board (30) opposite the power semiconductor (16) and the lead frame (20).

3. The power electronics device according to claim 2, characterised in that the first printed circuit board (30) is electrically coupled to a second printed circuit board (90), wherein the first printed circuit board (30) with the power semiconductors (16, 50) and lead frames (20, 60) arranged thereon is positioned such that the further lead frame (60) is at a distance from the second printed circuit board (90).

4. The power electronics device according to any one of claims 1 to 3, characterised in that line elements of the respective lead frame (20, 60) form a total heat transfer surface Ag for transferring heat to the cooling liquid (42), which has the following ratio with respect to a connection surface Ac of the respective lead frame (20, 60) at which the respective lead frame (20, 60) contacts the respective power semiconductor (16, 50): Ag / Ac > 1.

5. The power electronics device according to any one of claims 1 to 4, characterised in that the plane of mounting of the respective lead frame (20, 60) on the respective power semiconductor (16, 50) is at a distance (80) from the first printed circuit board (30).

6. The power electronics device according to any one of claims 1 to 5, characterised in that the power electronics device (1) further comprises a condensation unit (100) designed to condense evaporated cooling liquid (42) while cooling it and to make it available again for cooling the respective power semiconductor (16, 50) and / or the respective lead frame (20, 60).

7. The power electronics device according to claim 6, characterised in that the condensation unit (100) has a receiving space (101) for receiving a cooling medium (103), in particular for a cooling medium (103) to flow through, and the condensation unit (100) is designed to receive heat from evaporated cooling liquid (42) and transfer it to the cooling medium (103) in the receiving space (101).

8. The power electronics device according to claim 7, characterised in that the condensation unit (100) has projections (102), in particular ribs, formed in the direction of the liquid reservoir (41), and the receiving space (101) for receiving the cooling medium (103) extends at least in regions into these projections (102).

9. A power electronics functional system comprising a plurality of power electronics devices (1) according to any one of claims 1 to 8, wherein the power electronics devices (1) are connected to lines for different voltage phases.

10. A motor vehicle, in particular a motor vehicle that can be driven at least in part by an electric motor, comprising a power electronics device (1) according to any one of claims 1 to 8 or a power electronics functional system according to claim 9, and a cooling medium circuit that is fluidically coupled to the condensation unit (100) of the respective power electronics device (1).