ELECTRONIC DEVICE WITH HEAT DISCHARGE ELEMENT
DE602024005406T2Active Publication Date: 2026-06-10SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- DE602024005406
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-08-30
- Filing Date
- 2024-04-19
- Publication Date
- 2026-06-10
- Estimated Expiration
- 2044-04-19
AI Technical Summary
Technical Problem
High heat-generating electronic components in electronic devices require effective heat dissipation structures that minimize housing thickness reduction and maintain rigidity, as existing solutions can weaken the housing structure.
Method used
An electronic device design incorporating a first and second heat exchanger, a vapor pipe, and a liquid pipe within the housing, allowing for heat dissipation without necessitating thickness-reducing processing, thus maintaining housing rigidity.
Benefits of technology
The design enhances heat dissipation area while ensuring the housing's rigidity, preventing damage from external impacts.
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