Method and apparatus for generating textures
The process addresses the limitations of existing digital printing by using differential curing radiation and a separation layer to achieve deep cavities and minimize residue, improving texture generation efficiency.
EP4759438A1Pending Publication Date: 2026-06-17BARBERAN SA
Patent Information
- Application Number
- EP2024383364
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2026-06-17
AI Technical Summary
Technical Problem
Existing digital printing processes for generating textures face challenges in producing cavities of varying depths and efficiently removing material without residue accumulation, due to adhesion forces and limited depth penetration of droplets.
Method used
A process involving a base layer with differential curing radiation zones and a separation layer to facilitate material removal by creating differential adhesion at the interface, allowing for deeper cavities and easier handling of residues.
Benefits of technology
Enables the production of textures with precise, deep cavities and reduces residue accumulation on removal surfaces, enhancing texture quality and efficiency.
✦ Generated by Eureka AI based on patent content.
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Abstract
Texture generating process and system (3). Radiation curing by polymerisation is applied to a base layer (cb) differentially in zones (7, 7', 7") in which curing radiation is inhibited with respect to zones (8) laterally adjacent to the inhibition zones (7, 7', 7"). Textures (3) comprise cavities (4) which are formed by the removal of removable material from the base layer (cb) in the inhibition zones (7, 7', 7‴), in which the base layer (cb) has a substantially lower degree of curing than in the respective adjacent zones (8). The invention is characterized in that the base layer (cb) is spread over a separation layer (cs, cs', cs"), so that, when the removable material is removed, it is substantially separated out through the interface between the base layer (cb) and the separation layer (cs, cs', cs").
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Citation Information
Patent Citations
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