Retainer ring for semiconductor wafer polishing

JP1830854SActive Publication Date: 2026-07-06EBARA CORP
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2026001689D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2026-01-30
Publication Date
2026-07-06
Estimated Expiration
2051-01-30

Smart Images

  • Figure 0001830854000001
    Figure 0001830854000001
  • Figure 0001830854000002
    Figure 0001830854000002
  • Figure 0001830854000003
    Figure 0001830854000003
Patent Text Reader

Abstract

This item is used, for example, as shown in the "Reference Diagram Showing Usage," in the substrate polishing process of semiconductor manufacturing, etc., to hold a substrate such as a semiconductor wafer and polish one side of the substrate.
Need to check novelty before this filing date? Find Prior Art