Electrical terminals, systems and related methods

Abstract

The present invention discloses an electrical terminal for electrically connecting a cable to an electrical circuit, particularly an antenna, arranged on a thin support, the electrical terminal comprising a connection part including a central pin and a peripheral metal ring, a dielectric substrate having a top surface and a bottom surface, a ring metal pad electrically connected to the peripheral metal ring, and a base including a pin metal pad electrically connected to the central pin and electrically insulated from the ring metal pad, the ring metal pad and the pin metal pad being arranged on the bottom surface, the connection part being arranged on the top surface of the base and extending substantially perpendicular to the top surface. The base further comprises a ring penetration means designed to penetrate the thin support. The dielectric substrate and the ring penetration means are not in the same plane. The present invention also relates to a system including such an electrical terminal and a vehicle including such a system and related methods.

Description

[Technical field]

[0001] The present application relates to an electrical terminal for facilitating the supply of an electrical circuit disposed on a thin support. The present application also relates to a system including such an electrical terminal. [Background technology]

[0002] Mobile data traffic is continuously increasing and will surge significantly with 5G, putting mobile network operators under CAPEX pressure. The higher frequency bands of 5G mean more challenges for coverage deployment, especially in dense urban areas where capacity will be required and strict EMF restrictions apply. Small cell deployment is explained as a good solution for capacity improvement, which requires the installation of many antennas to ensure stable electromagnetic wave transmission and reception.

[0003] However, a number of drawbacks limit the deployment of small cells. First, it is very difficult to find locations for new antennas. Second, it is expensive to bring fiber and electricity outdoors. Finally, city regulations can limit the feasibility of small cells.

[0004] Moreover, with the advent of connected and autonomous vehicles, the number of on-board antennas required is constantly increasing, and finding suitable locations becomes more and more complicated, especially for Wi-Fi, 4G, 5G and DSRC, DTV, FM, etc.

[0005] In vehicles, the antenna is typically placed on the glass window or on the roof inside a shark fin or roof module.

[0006] A terminal is used between the cable and the antenna for connection to a functional system and for feeding the antenna.

[0007] Existing terminals on the market are based on solder technology to make the connection to the terminal of the antenna. One fairly common use is the use of a U.FL connector as a terminal. Such a terminal is soldered onto the antenna to provide the connection.

[0008] The antenna may be disposed on a substrate such as glass or a thin support.

[0009] However, cold-resistant substrates such as thin supports cannot withstand the high temperatures of soldering.

[0010] To avoid this problem of cold-resistant thin support, the terminals can be glued with conductive adhesive, but this solution has problems of mechanical resistance (terminals can be removed from the support, causing disconnection and quality problems, ageing problems, etc.). Summary of the Invention

[0011] The present invention relates in a first aspect to an electrical terminal for electrically connecting a cable to an electrical circuit arranged on a thin support, the electrical terminal comprising: - a connection part including a central pin (3) and a peripheral metal ring (4); a base including a dielectric substrate (2) having a top surface (2.1) and a bottom surface (2.2), a ring metal pad (5) electrically connected to a peripheral metal ring, and a pin metal pad (6) electrically connected to a central pin and electrically insulated from the ring metal pad; Including, The ring metal pad and the pin metal pad are disposed on the bottom surface; the connection portion is disposed on the top surface of the base and extends generally perpendicular to the top surface.

[0012] In a second aspect, the present invention relates to a system comprising a thin support, an electrical circuit disposed on the thin support, and an electrical terminal for electrically connecting a cable to the electrical circuit, the system comprising: - a connection part including a central pin (3) and a peripheral metal ring (4); a base including a dielectric substrate (2) having a top surface (2.1) and a bottom surface (2.2), a ring metal pad (5) electrically connected to a peripheral metal ring, and a pin metal pad (6) electrically connected to a central pin and electrically insulated from the ring metal pad; Including, The ring metal pad and the pin metal pad are disposed on the bottom surface, and the connection portion is disposed on the top surface of the base and extends generally perpendicular to the top surface.

[0013] The solution defined in the first and second aspects of the invention is based on the fact that the base further comprises ring piercing means (8) designed to pierce the thin support.

[0014] The solution defined in the first and second aspects of the invention is also based on the fact that the dielectric substrate and the ring feed-through means are not coplanar.

[0015] By penetrating the thin support, the ring penetration means, which is not flush with the dielectric substrate, mechanically maintains the electrical terminal to the thin support while the electrical terminal is electrically connected to the electrical circuit.

[0016] In a third aspect, the present invention relates to a vehicle including a system according to the second aspect of the invention.

[0017] In a fourth aspect, the invention relates to a method for connecting a cable to an electrical circuit, for electrically connecting the cable to an electrical circuit arranged on a thin support having electrical terminals.

[0018] The solution defined in a fourth aspect of the invention is based on the following: In the method, the electrical terminal comprises: - a connection part including a central pin (3) and a peripheral metal ring (4); a base including a dielectric substrate (2) having a top surface (2.1) and a bottom surface (2.2), a ring metal pad (5) electrically connected to a peripheral metal ring, and a pin metal pad (6) electrically connected to a central pin and electrically insulated from the ring metal pad; Including, The ring metal pad and the pin metal pad are disposed on the bottom surface, and the connection portion is disposed on the top surface of the base and extends generally perpendicular to the top surface.

[0019] The method further comprises: the base further comprises a ring piercing means (8) designed to pierce the thin support, the dielectric substrate and the ring piercing means being non-coplanar.

[0020] The solution defined in the fourth aspect of the invention is also based on the following: the method comprises a step of pressing an electrical terminal so that the ring penetrating means penetrates the thin support above the electrical circuit in order to electrically connect the central pin and the peripheral metal ring to the electrical circuit.

[0021] Surprisingly, this solution according to the first, second, third and fourth aspects makes it possible to improve the mechanical resistance whilst improving the handling of degradation and ageing problems, thanks to the ring penetration means which penetrate the thin support of the electrical terminal.

[0022] The electrical system according to the invention therefore makes it possible to electrically connect cables to electrical circuits arranged on a thin support in a simple, fast and durable manner.

[0023] The present invention enhances the quality and durability of the system according to the second aspect.

[0024] Additionally, the electrical terminal according to the present invention aids in making contact with electrical circuit surfaces and in resisting any movement.

[0025] Thus, the present invention solves the need to find new locations for systems while allowing for greater ease of use and quality.

[0026] It is noted that the invention relates to all possible combinations of features recited in the claims or in the described embodiments.

[0027] Although the following description relates to vehicle applications, it will be understood that the invention may be applicable in other fields such as transport applications, other road users and / or services, and construction applications. [Brief description of the drawings]

[0028] These and other aspects of the present invention will now be described in detail with reference to the accompanying drawings, which show various exemplary embodiments of the present invention, provided by way of illustration and not by way of limitation. The accompanying drawings are schematic and not to scale. The accompanying drawings do not limit the present invention in any manner. Further advantages will be illustrated by way of examples.

[0029] [Figure 1] FIG. 2 is a schematic 3D view from the top of an electrical terminal according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic 3D view from the bottom of an electrical terminal according to a first embodiment of the present invention. [Diagram 3] FIG. 2 is a schematic 3D view from the top of a system according to a second embodiment of the present invention. [Figure 4] FIG. 2 is a schematic 3D view from the bottom of a system according to a second embodiment of the present invention. [Diagram 5] FIG. 2 is a schematic view from one side of a system according to a second embodiment of the invention; [Figure 6] FIG. 2 is a schematic 3D view from the top of an electrical terminal according to a first embodiment of the invention penetrating an electrical circuit arranged on a thin support according to the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] In this specification, specific embodiments include various modifications, equivalents, and / or permutations of the corresponding embodiments. The same reference numbers are used throughout the accompanying drawings to refer to the same or similar parts.

[0031] As used herein, spatial or directional terms such as "inside", "outside", "on", "under", "top", "bottom", etc., refer to the invention as shown in the depicted figures. However, it should be understood that the invention may assume various alternative orientations, and therefore such terms should not be considered limiting. Furthermore, all numbers expressing dimensions, physical characteristics, processing parameters, amounts of ingredients, reaction conditions, etc., used in the specification and claims should be understood to be modified in all instances by the term "about". Thus, unless otherwise indicated, the numerical values ​​set forth in the following specification and claims are approximations that may vary depending on the desired properties sought to be obtained by the present invention. In the following description, unless otherwise specified, the expression "approximately" means within 10%, preferably within 5%.

[0032] Furthermore, all ranges disclosed herein should be understood to include the starting and ending range values ​​and to encompass all subranges subsumed therein. For example, a stated range of "1 to 10" should be considered to include all subranges between (and including) the minimum value of 1 and the maximum value of 10 (i.e., all subranges beginning with a minimum value of 1 or greater (e.g., 1 to 6.1) and all subranges ending with a maximum value of 10 or less (e.g., 5.5 to 10)). Furthermore, as used herein, the terms "deposited over" or "provided over" mean deposited on or provided on, but not necessarily in surface contact with. For example, a coating "deposited over" a substrate does not exclude the presence of one or more other coatings of the same or different configuration interposed between the deposited coating and the substrate.

[0033] When the term "comprising" is used in the present specification and claims, it does not exclude other elements or steps. When an infinitive or definite article (e.g., "a" or "an" or "the") is used in reference to a singular noun, this includes a plural of that noun unless specifically stated otherwise. As used herein, "configured to" may be used interchangeably with, for example, "adapted to," "capable of," "modified to," "made to," "able to," or "designed to" in hardware and software, depending on the context. In any context, the expression "a device configured to perform" may mean that the device "may perform" together with another device or component.

[0034] Moreover, the terms "first," "second," etc., within this specification and in the claims are used to distinguish between similar elements and are therefore not necessarily used to describe an order, either temporally, spatially, sequentially, or in any other manner. It should be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operating in other orders than those described or shown herein. When a component (e.g., a first component) is described as being "(functionally or communicatively) coupled to" or "connected to" another component (e.g., a second component), it should be understood that the component may be directly connected to the other component or may be connected to the other component via another component (e.g., a third component).

[0035] According to a first aspect of the invention, as shown in Figures 1 and 2, an electrical terminal 1 for electrically connecting a cable to an electrical circuit arranged on a thin support comprises a connection part C and a base part B. The connection with the electrical circuit is provided by a part of the base comprising a dielectric substrate 2 having a top surface 2.1 and a bottom surface 2.2, while the connection part allows connecting a cable to the electrical terminal.

[0036] The term thin support means a support having a thickness of 5 mm or less, preferably 3 mm or less.

[0037] The dielectric substrate may be made of any dielectric material capable of accommodating connections thereon, it being understood that "dielectric" means that the substrate is non-conductive.

[0038] According to the invention, the dielectric substrate can be FR4 (epoxy glass), PTFE filled with glass or ceramic, Bakelite, high frequency circuit laminates, thermoplastics such as PPE and PPO, hydrocarbon-based materials with ceramic fillers, liquid-crystalline-polymer (LCP) materials, or polyetheretherketone (PEEK) thermoplastics, or any other dielectric material that can be fixed on a thin support whilst being suitable for mounting thereon connections for connecting cables.

[0039] The connection includes a central pin 3 and a peripheral metal ring 4 .

[0040] As shown in Figure 1, the connection is located on the top surface of the base and extends approximately perpendicular to the top surface. This means that: the central pin 3 and the peripheral metal ring 4 extend from a first surface 2.1 of the base B to a second surface 2.2 in the opposite direction (approximately perpendicular to the first surface 2.1).

[0041] The terms central pin and peripheral metal ring are used to distinguish between elements of the connection and are not necessarily used to describe a particular design or in any other way. It is understood that the central pin and peripheral metal ring may have any 3D shape to connect the connector configured to be plugged into the connection (on which the cable is assembled). In a preferred but non-limiting embodiment and as shown in the accompanying drawings, the central pin has a 3D shape and the peripheral metal ring has a 3D shape that surrounds the central pin.

[0042] The base B further includes a ring metal pad 5 electrically connected to the peripheral metal ring 4 and a pin metal pad 6 electrically connected to the central pin 3 and electrically insulated from the ring metal pad 5 .

[0043] A ring metal pad and a pin metal pad are disposed on the bottom surface. The ring metal pad 5 and the pin metal pad 6 extend from the bottom surface 2.2 of the base 2 for electrical connection to an electrical circuit.

[0044] In some embodiments, the base may include two ring metal pads 5 .

[0045] It will be appreciated that the central pin, the peripheral metal ring, the ring metal pads and the pin metal pads include conductive material on at least their surfaces to electrically connect the cable to an electrical circuit. Preferably, the central pin, the peripheral metal ring, the ring metal pads and the pin metal pads are made of a conductive material such as aluminum, copper alloys; beryllium copper; phosphor bronze; brass; gold; nickel and nickel alloys, silver or nickel plated stainless steel, or any suitable conductive material for such applications.

[0046] According to the invention, the base further comprises a ring piercing means 8 designed to pierce the thin support. The dielectric substrate and the ring piercing means are not coplanar in order to make it possible to maintain the electrical terminals on the thin support.

[0047] It will be appreciated that the ring penetration means may also penetrate the thin support and electrical circuitry disposed on the thin support.

[0048] In some embodiments according to the invention, the ring feedthrough means is fixed directly to the dielectric substrate. In such embodiments, the ring feedthrough means is preferably non-conductive. Electrical connection of the electrical circuit is made by physical contact between the electrical circuit and the ring metal pads and the pin metal pads.

[0049] In some other embodiments according to the invention, the ring penetration means is fixed directly to the ring metal pad.

[0050] As shown in figures 1 and 2, the ring penetrating means 8 may be fixed directly to the ring metal pad 5. The ring penetrating means may be an elongated portion of the ring metal pad.

[0051] Advantageously, in such an embodiment, the ring penetrating means may be electrically connected to the ring metal pad and the ring penetrating means 8 is conductive. An electrical circuit may be connected to the peripheral metal ring 4 via the ring penetrating means 8 and the ring metal pad 5 simultaneously.

[0052] The ring penetration means may be made of conductive plated material (i.e., non-plastic based material) or may be made of conductive base material such as aluminum; copper alloys; beryllium copper; phosphor bronze; brass; gold; nickel and nickel alloys, silver or nickel plated stainless steel, or any conductive material suitable for acting as a conductor while being capable of penetrating a thin substrate. The ring penetration means may also be coated or surface treated to improve electrical conductivity and / or mechanical resistance. Advantageously, in some embodiments, the ring penetration means has the same material composition as the ring metal pad.

[0053] In some embodiments, each of the ring metal pads has a ring penetration means.

[0054] In some embodiments, the ring penetration means includes at least one tine for penetrating the thin support. More preferably, the ring penetration means includes a plurality of tines to facilitate penetrating the at least one thin support.

[0055] The ring penetration means may also be generally triangular, hook-shaped, tooth-shaped, or any shape capable of at least penetrating the thin support (and more preferably, penetrating the thin support and electrical circuitry disposed on the thin support). At least a portion of either side of the ring penetration means may be sharpened to facilitate penetration.

[0056] According to the invention, the ring penetration means may have dimensions in the range of sub-millimeter (approximately 0.1 mm) to 10 cm in width and 0.1 mm to 10 cm in height, which dimensions may also be adapted to the dimensions of the electrical connection points to the electrical circuit as well as the required operating frequency of the electrical circuit.

[0057] In some embodiments according to the invention, the base may further comprise a pin penetration means 9 designed to penetrate the thin support. The dielectric substrate 2 and the pin penetration means 9 are not coplanar to allow the electrical terminals to be maintained on the thin support.

[0058] By "non-coplanar" it is meant that the ring piercing means and the base are not in the same plane even when the ring piercing means is at least partially folded over the bottom surface, and that the pin piercing means and the base are not in the same plane even when the pin piercing means is at least partially folded over the bottom surface.

[0059] It will be appreciated that the pin penetration means may also penetrate the thin support and the electrical circuitry disposed on the thin support.

[0060] In some embodiments according to the invention, the pin penetration means is fixed directly to the dielectric substrate. In such embodiments, the pin penetration means is preferably non-conductive. Electrical connection of the electrical circuit is made by physical contact between the electrical circuit, the pin metal pads and the pin penetration means.

[0061] In some other embodiments according to the present invention, the pin penetration means is fixed directly to the pin metal pad.

[0062] 1 and 2, the pin penetration means 9 may be fixed directly to the pin metal pad 6. The pin penetration means may be an elongated portion of the pin metal pad.

[0063] Advantageously, in such an embodiment, the pin penetration means may be electrically connected to the ring metal pad and the ring penetration means 8 is conductive. An electrical circuit may be connected to the peripheral metal ring 4 via the ring penetration means 8 and the ring metal pad 5 simultaneously.

[0064] The pin penetration means may be made of conductive plated material (i.e., non-plastic based material) or may be made of conductive base material such as aluminum; copper alloys; beryllium copper; phosphor bronze; brass; gold; nickel and nickel alloys, silver or nickel plated stainless steel, or any conductive material suitable for acting as a conductor while being capable of penetrating a thin substrate. The pin penetration means may also be coated or surface treated to improve electrical conductivity and / or mechanical resistance. Preferably, in some embodiments, the pin penetration means has the same material composition as the pin metal pad.

[0065] In some embodiments, the pin penetration means includes at least a tine for penetrating the thin substrate. More preferably, the pin penetration means includes a plurality of tines to facilitate penetrating the at least thin substrate.

[0066] The pin penetration means may also be generally triangular in shape (with or without truncated corners), with or without notches, hook-like, tooth-like, or any shape capable of at least penetrating the thin support (and more preferably, penetrating the thin support and electrical circuitry disposed on the thin support). At least a portion of the side of the ring penetration means may be sharpened to facilitate penetration.

[0067] According to the invention, the pin penetration means may have dimensions in the range of sub-millimeter (approximately 0.1 mm) to 10 cm in width and 0.1 mm to 10 cm in height, which dimensions may also be adapted to the dimensions of the electrical connection points to the electrical circuit as well as the required operating frequency of the electrical circuit.

[0068] As shown in FIG. 3, the present invention pertains to a system 100 that includes a thin support 12 and electrical circuits 10 and 11 disposed on the thin support.

[0069] Thin supports can take a variety of forms and shapes, and their dimensions (length and / or width) can vary and be between millimeters and several meters.

[0070] Depending on the application, the thin support has a thickness (Tts) of 10 μm to 3 mm (0.01 mm≦Tts≦3 mm). Depending on the application, the thickness can be 20 μm, 50 μm, 75 μm, 75 μm, 100 μm, 125 μm, 150 μm or any specific value.

[0071] In some preferred embodiments, the thin support has a thickness of 20 μm to 250 μm (0.02 mm≦Tts≦0.25 mm).

[0072] According to the present invention, the thin support may be a single layer or a multi-layer structure of the same or different materials on which the electrical circuitry may be disposed, it being understood that the thin support serves as a dielectric substrate for the electrical circuitry.

[0073] The thin support is preferably a thin plastic support. The thin support can be of any dielectric material used in printed circuits or of a more flexible material used as a flexible substrate (polymer, plastic, laminate material, or any other suitable material such as Polyethylene-PE, Polyethylene terephthalate-PET, Polystyrene-PS, Polyamide-PA, Polyvinyl chloride-PVC, Polycarbonate-PC, Polypropylene-PP, Polyethylene furanoate-PEF, etc.). Preferably, the thin support comprises PET, but can be of any other plastic material depending on the application, the manner in which the thin support is fixed on the object, the required durability due to external exposure such as sun, temperature, etc.

[0074] According to the present invention, the thin support and the electrical circuitry can be produced by using standard PCB techniques, screen printing of a metal coating on a thin film, inkjet printing of a metal coating on a thin film, or any other known technique for metallizing a thin support (meaning putting an electrical circuitry on a thin support).

[0075] The electric circuit may include two parts 10 and 11. These two parts are electrically isolated. The central pin is connected to one of the two parts and the peripheral metal ring is connected to the other of the two parts.

[0076] The electrical circuit is disposed on the thin support. The term "disposed on" means that the electrical circuit can be a conductive layer made by a printed conductive layer, a screen printed conductive layer, an inkjet printed conductive layer, a deposited conductive layer, or other similar methods suitable for disposing an electrical circuit on a thin support. The electrical circuit can also be realized by using etching techniques or laser ablation techniques to design the electrical circuit by creating non-conductive areas. The electrical circuit can also be made of a metal mesh film consisting of several thin connecting wires forming an electrical circuit or a printed circuit.

[0077] According to the present invention, the electrical circuit is made of a conductive material. The material for making the electrical circuit can be any highly conductive material, such as but not limited to copper, silver, copper ink, etc.

[0078] In some preferred embodiments, the electrical circuitry may be an antenna. The antenna is preferably a multi-band antenna used for communication such as Wi-Fi, FM, AM, TV, remote key entry (RKE), 2G, 3G, 4G, 5G, satellite, GPS navigation, V2X, telematic / cell electrical circuits such as DSRC, or any other wireless broadcasting applications. In a multi-band antenna embodiment, the antenna may include two parts 10, 11: a radiating part 10 designed to act as a radiating element and a ground part 11 designed to act as a ground plane. It is understood that the operating frequency range of the antenna depends on the design of the antenna.

[0079] According to one embodiment, the thin support is a PEN film having a thickness of 50 μm and the electrical circuit is a copper layer having a thickness of 10 μm to 50 μm arranged on the surface of the thin support forming a multiband antenna (in particular a 4G and / or 5G antenna).

[0080] According to one embodiment, the thin support is a PET film having a thickness of about 50 μm and the electrical circuit is a copper layer having a thickness of 10 μm to 50 μm arranged on the surface of the thin support forming a multiband antenna (in particular a 4G and / or 5G antenna).

[0081] According to one embodiment, the thin support is a PI film having a thickness of about 50 μm and the electrical circuit is a copper layer having a thickness of 10 μm to 50 μm arranged on the surface of the thin support forming a multiband antenna (in particular a 4G and / or 5G antenna).

[0082] According to some embodiments, the electrical circuit is about an 18 μm or about a 35 μm copper layer.

[0083] In such an embodiment, a cable (not shown) is electrically connected to connection C. The central pin 3 is then electrically connected to the radiating portion 10 and the peripheral metal ring 4 is electrically connected to the ground plane 11.

[0084] As shown in Figures 4 and 5, the system may include two ring penetration means and a pin penetration means that penetrates the electrical circuit and the thin support. These two ring penetration means may each be connected to a different ring metal pad.

[0085] The two ring penetration means parts 8.1 and the pin penetration means parts 9.1 which penetrate the support emerge from opposite faces of the penetration means, such parts having a notch or hook shape to prevent the electrical terminals from being pulled out.

[0086] In some embodiments, the support penetrations 8.1 and 9.1 can be bent on the opposing faces of the thin support penetrations to ensure the mechanical strength of the system. Even if some parts are bent, the ring penetration means and the pin penetration means are not flush with the dielectric substrate.

[0087] At least one of the ring penetration means and the pin penetration means (if present) allows an electrical circuit to be clamped between the electrical terminal and the thin support to ensure an electrical connection between the ring metal pad and the ground and between the pin metal pad and the heat sink.

[0088] According to a third aspect, the invention also relates to a vehicle including at least one system, in particular a multi-band antenna, for installing electrical circuits in locations that would otherwise be difficult to install.

[0089] The system can be installed anywhere else where it is necessary to install an electrical circuit located on a thin support (especially an antenna). The system can be placed on the surface of glass window panels such as windshields, side windows, roofs, rear windows, on plastic parts of a vehicle (such as spoilers, B-pillars, bumpers, etc.). The system can also be placed in front of such elements to avoid fixing directly on the surface of such elements.

[0090] One embodiment provides a method of connecting cables (not shown) to electrical circuits 10 and 11 for electrically connecting the cables to the electrical circuitry arranged on a thin support 12 by electrical terminals 1 according to the first aspect of the invention to produce a system 100 according to the second aspect of the invention.

[0091] As shown in FIG. 6, the method includes a pressing step of pressing an electrical terminal to cause at least one ring penetration means to penetrate the thin support over the electrical circuit to electrically connect the central pin and the peripheral metal ring to the electrical circuit.

[0092] This pressing step enables at least one of the ring penetration means and the pin penetration means (if present) to pierce the thin support and ultimately the electrical circuit 8.3, 9.3 to create an electrical connection between the electrical circuit and the connection of the electrical terminal.

[0093] It is understood that this pressing step also forces the pin passing means, if present, through the thin support.

[0094] The method may include a bending step of bending the portions 8.1, 9.1 so that the portions 8.1, 9.1 which have penetrated the support emerge from the opposite face of the penetration means. This step may be performed during or after the pressing step.

[0095] The bending process makes it possible to avoid using special strain reliefs and makes it possible to keep the electrical terminals electrically connected to the electrical circuit and attached to the thin support.

[0096] After the pressing step, the method includes an overmolding step, which includes the substeps of placing the system in a mold having two molded parts, closing the two molded parts to form a closed space around the system, and injecting a plastic-based material into the closed space to form an overmolded element over (preferably over) at least a portion of the system.

[0097] The overmolded parts allow for reduced pulling out issues while reducing aging issues and increasing the compactness of the system.

[0098] The plastic base material can be made of thermoplastics, polyurethane (PU), polyamide, acrylic, polycarbonate, polyoxymethylene (POM), polystyrene (PS), acrylonitrile butadiene styrene (ABS), polypropylene (PP), polyethylene (PE), thermoplastic polyurethane (TPU), thermoplastic rubber (TPR), epoxy, acrylic, or any suitable material injected into a mold, with temperatures and pressures adapted to suit the particular embodiment.

[0099] The method may include a connecting step of connecting the cable to an electrical terminal, which may occur prior to or throughout the overmolding step (if present) depending on the portion of the system being overmolded.

[0100] An embodiment provides for the use of a system according to the second aspect to allow a user or a vehicle to communicate with its environment.

Claims

1. An electrical terminal (1) for electrically connecting a cable to an electrical circuit arranged on a thin support, said electrical terminal (1) comprising: - a connection comprising a central pin (3) and a peripheral metal ring (4); a base including a dielectric substrate (2) having a top surface (2.1) and a bottom surface (2.2), a ring metal pad (5) electrically connected to said peripheral metal ring, and a pin metal pad (6) electrically connected to said central pin and electrically insulated from said ring metal pad; Including, the ring metal pad and the pin metal pad are disposed on the bottom surface, and the connection portion is disposed on the top surface of the base and extends generally perpendicular to the top surface; said base further comprises ring piercing means (8) designed to pierce said thin support; and 13. An electrical terminal comprising: a dielectric substrate and a ring feedthrough means that are non-coplanar.

2. 2. The electrical terminal of claim 1, wherein said ring penetrating means is electrically connected to said ring metal pad.

3. 3. The electrical terminal of claim 1, wherein said base further comprises a pin penetration means designed to penetrate said thin support, said dielectric substrate and said pin penetration means being non-coplanar.

4. 4. The electrical terminal of claim 3, wherein said pin penetration means is electrically connected to said pin metal pad.

5. 3. The electrical terminal of claim 1 or 2, wherein said pin passing means includes at least a tine.

6. 3. The electrical terminal of claim 1 or 2, wherein said ring penetrating means includes at least a tine.

7. 3. An electrical terminal as claimed in claim 1 or 2, wherein the ring penetrating means comprises a bent portion 8.

1.

8. A system (100) comprising a thin support, an electrical circuit disposed on the thin support, and an electrical terminal for electrically connecting a cable to the electrical circuit, the electrical terminal comprising: - a connection comprising a central pin (3) and a peripheral metal ring (4); a base including a dielectric substrate (2) having a top surface (2.1) and a bottom surface (2.2), a ring metal pad (5) electrically connected to said peripheral metal ring, and a pin metal pad (6) electrically connected to said central pin and electrically insulated from said ring metal pad; Including, the ring metal pad and the pin metal pad are disposed on the bottom surface, and the connection portion is disposed on the top surface of the base and extends generally perpendicular to the top surface; said base further comprising a ring piercing means (8) for piercing said thin support; and The system according to claim 1, wherein said dielectric substrate and said ring penetration means are non-coplanar.

9. The system of claim 8 , wherein said ring penetration means is electrically connected to said ring metal pad.

10. 10. A system according to claim 8 or 9, wherein the electrical circuit is an antenna, preferably a multi-band antenna.

11. A vehicle comprising at least one system according to claim 8 or 9.

12. 1. A method for electrically connecting a cable to an electrical circuit, the method comprising: - a connection comprising a central pin (3) and a peripheral metal ring (4); a base including a dielectric substrate (2) having a top surface (2.1) and a bottom surface (2.2), a ring metal pad (5) electrically connected to said peripheral metal ring, and a pin metal pad (6) electrically connected to said central pin and electrically insulated from said ring metal pad; Including, the ring metal pad and the pin metal pad are disposed on the bottom surface, and the connection portion is disposed on the top surface of the base and extends generally perpendicular to the top surface; said base further comprising ring piercing means (8) designed to pierce said thin support; the dielectric substrate and the ring feedthrough means are not coplanar; and said method including the step of pressing said electrical terminal to cause said ring penetration means to penetrate said thin support over said electrical circuit to electrically connect said central pin and said peripheral metal ring to said electrical circuit.

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