Electronic device module, controller and vehicle

Abstract

The invention relates to an electronic device module, a controller and a vehicle. The electronic device module comprises two functional modules, each functional module is provided with a first terminal and a second terminal, the first terminal and the second terminal extend towards the other functional module, the ends of the two first terminals are conducted, and the ends of the two second terminals are conducted; and along the thickness direction of the first terminal, the projection of the second terminal on the first terminal is at least partially accommodated in the first terminal. According to the electronic device module, the two terminals of the two functional modules are arranged between the two functional modules, and the projection of the second terminal on the first terminal is at least partially accommodated in the first terminal, so that the magnetic field generated by the current flowing in the two first terminals can be transmitted to the two functional modules. And the magnetic field generated by the current flowing to the two second terminals can offset each other, so that the generation of stray inductance is reduced.

Description

Technical Field

[0001] The present application relates to the field of electronic device modules, and particularly to an electronic device module, a controller including the electronic device module, and a vehicle including the controller. Background Art

[0002] The controller of a vehicle generally includes a DC support capacitor and a power module that are electrically connected to each other. In the prior art, the terminals of the DC support capacitor are usually electrically connected to the terminals of the power module through nuts.

[0003] However, limited by the protruding length of the terminals required for nut connection, the terminals with longer lengths increase the inductance loop between the DC support capacitor and the power module. At the same time, due to the poor reliability of nut connection, when the nut becomes loose, a gap will be generated between the two connected terminals, further increasing the stray inductance. And the higher stray inductance will cause large oscillations in the circuit system, resulting in problems such as energy attenuation and device damage. Summary of the Invention

[0004] In view of the above deficiencies of the prior art, the purpose of the present application is to provide an electronic device module capable of reducing stray inductance, a controller including the electronic device module, and a vehicle including the controller. The specific technical solutions are as follows:

[0005] In a first aspect, an embodiment of the present application provides an electronic device module, including two functional modules.

[0006] Each functional module is provided with a first terminal and a second terminal. The first terminal and the second terminal both extend towards the other functional module. The ends of the first terminals of the two functional modules are electrically connected, and the ends of the second terminals of the two functional modules are electrically connected.

[0007] Along the thickness direction of the first terminal, the projection of the second terminal on the first terminal is at least partially received within the first terminal.

[0008] In the electronic device module of the present application, by arranging the two terminals of the two functional modules between the two functional modules and making the projection of the second terminal on the first terminal at least partially received within the first terminal, the magnetic field generated by the current flowing in the two first terminals can at least partially cancel out the magnetic field generated by the current flowing to the two second terminals, thereby reducing the generation of stray inductance.

[0009] In one embodiment, the sum of the lengths of the two first terminals of the two functional modules is greater than the maximum spacing distance between the two functional modules, and the ends of the two first terminals of the two functional modules are overlapped and electrically connected.

[0010] In one embodiment, the sum of the lengths of the two first terminals of the two functional modules is equal to the maximum spacing distance between the two functional modules, and the ends of the two first terminals of the two functional modules are butted and conductively connected.

[0011] In one embodiment, the sum of the lengths of the two first terminals of the two functional modules is L1, the maximum spacing distance between the two functional modules is D1, and the thickness of the first terminal of each functional module is H1; wherein, L1 < D1, and D1 - L1 ≤ H1 / 2; the ends of the two first terminals of the two functional modules are conductively connected by molten filling.

[0012] In one embodiment, the electronic device module further includes a connecting member, and the ends of the two second terminals of the two functional modules are conductively connected through the connecting member.

[0013] In one embodiment, the connecting member includes a connecting portion and two butting portions, the connecting portion is located between the two butting portions, and each butting portion is conductively connected to a second terminal respectively.

[0014] In one embodiment, the sum of the lengths of the connecting portion and the two butting portions is greater than the maximum spacing distance between the two second terminals of the two functional modules, and each butting portion is lapped and conductively connected to a second terminal of a functional module respectively.

[0015] In one embodiment, the sum of the lengths of the connecting portion and the two butting portions is equal to the maximum spacing distance between the two second terminals of the two functional modules, and each butting portion is butted and conductively connected to a second terminal of a functional module respectively.

[0016] In one embodiment, the sum of the lengths of the connecting portion and the two butting portions is L2, the maximum spacing distance between the two second terminals of the two functional modules is D2, and the thickness of the second terminal of each functional module is H2; wherein, L2 < D2, and D2 - L2 < H2 / 2; each butting portion is conductively connected to a second terminal of a functional module by molten filling respectively.

[0017] In one embodiment, there are multiple butting portions provided on at least one side of the connecting portion, and along the width direction of the second terminal, the butting portions are spaced apart and communicated with the connecting portion.

[0018] In one embodiment, the first terminal of at least one functional module includes multiple first sub-terminals, and along the width direction of the first terminal, the first sub-terminals are spaced apart; and / or, the second terminal of at least one functional module includes multiple second sub-terminals, and along the width direction of the second terminal, the second sub-terminals are spaced apart.

[0019] In one embodiment, the first terminal of at least one functional module includes multiple first sub-terminals, and along the width direction of the first terminal, the width of the first sub-terminal at the edge of the multiple first sub-terminals is greater than the width of the remaining first sub-terminals.

[0020] In one embodiment, the first terminal of the same functional module includes a plurality of first sub-terminals, and the second terminal includes a plurality of second sub-terminals. Along the thickness direction of the first terminal, the projection of each second sub-terminal on the first sub-terminal is at least partially received within one of the first sub-terminals.

[0021] In one embodiment, the number of first sub-terminals is equal to the number of second sub-terminals, and along the thickness direction of the first sub-terminals, each of the second sub-terminals is aligned with one of the first sub-terminals.

[0022] In one embodiment, the ratio of the width of the first terminal to the width of the second terminal is between 0.8 and 1.2.

[0023] In one embodiment, the electronic device module further includes two insulating members. Each insulating member is fixed between the first terminal and the second terminal of one functional module and extends respectively towards the other functional module, and the extension length of each insulating member is between the extension length of the first terminal and the extension length of the second terminal.

[0024] In one embodiment, the electronic device module further includes a second insulating member. The second insulating member is disposed on the surface of the connecting member facing the first terminal. Along the thickness direction of the first terminal, the projection of the second insulating member on the first terminal covers the first terminal exposed between the two second terminals of the two functional modules.

[0025] Along the length direction of the first terminal, the length of the second insulating member is greater than or equal to the distance between the two insulating members of the two functional modules.

[0026] In one embodiment, along the width direction of the first terminal, the width of the second insulating member is greater than or equal to the width of the connecting member.

[0027] In one embodiment, the electronic device module further includes an insulating layer. The insulating layer is coated on the surface of the connecting member facing the first terminal. Along the thickness direction of the first terminal, the projection of the first terminal exposed between the two second terminals of the two functional modules on the insulating layer is received within the insulating layer.

[0028] Along the length direction of the first terminal, the length of the insulating layer is greater than or equal to the distance between the two insulating members of the two functional modules.

[0029] In one embodiment, at least one of the insulating members is provided with an insulating protrusion. The insulating protrusion is exposed between the second terminals of the two functional modules and extends towards the direction away from the first terminal, and the insulating protrusion is spaced apart from the connecting member.

[0030] In one embodiment, at least one groove is provided on the surface of the insulating protrusion away from the first terminal; and / or, at least one groove is provided on the surface of the insulating protrusion away from the second terminal.

[0031] In one embodiment, a positioning post protrudes from the surface of the insulating protrusion away from the first terminal. Along the width direction of the first terminal, the positioning post is spaced apart from the first terminal and the second terminal; a positioning hole is provided on the connecting member, and the positioning post can extend into the positioning hole to realize the positioning of the connecting member.

[0032] In one embodiment, the color of the insulating member is white or other light colors close to white.

[0033] In one embodiment, the ends of the first terminals of the two functional modules are electrically connected by a non-contact energy source scanning connection technology.

[0034] In one embodiment, along the thickness direction of the first terminal, the distance between the ends of the first terminals of the two functional modules is less than or equal to 0.2 mm.

[0035] In one embodiment, the end of the second terminal of at least one functional module is electrically connected to the connecting member by a non-contact energy source scanning connection technology.

[0036] In one embodiment, along the thickness direction of the second terminal, the distance between the end of the second terminal electrically connected by the non-contact energy source scanning connection technology and the connecting member is less than or equal to 0.2 mm.

[0037] In a second aspect, an embodiment of the present application provides a controller, including an electronic device module, and the two functional modules of the electronic device module are a DC support capacitor and a power module respectively.

[0038] In a third aspect, an embodiment of the present application provides a vehicle, including the controller.

[0039] It can be understood that for the controller provided in the second aspect of the present application and the vehicle provided in the third aspect, both have the effect of being able to reduce stray inductance because they adopt the electronic device module provided in the first aspect of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic structural diagram of the vehicle provided in an embodiment of the present application;

[0041] Figure 2 It is a schematic structural diagram of the electronic device module provided in an embodiment of the present application;

[0042] Figure 3 It is a schematic structural diagram of the first functional module of the electronic device module provided in an embodiment of the present application;

[0043] Figure 4 It is a schematic structural diagram of the second functional module of the electronic device module provided in an embodiment of the present application;

[0044] Figure 5 It is a front view structural schematic diagram of the electronic device module provided in an embodiment of the present application;

[0045] Figure 6 It is an enlarged schematic diagram of the electronic device module provided in an embodiment of the present application;

[0046] Figure 7 It is another enlarged schematic diagram of the electronic device module provided in an embodiment of the present application;

[0047] Figure 8 It is yet another enlarged schematic diagram of the electronic device module provided in an embodiment of the present application;

[0048] Figure 9 It is a schematic structural diagram of the connector provided in an embodiment of the present application;

[0049] Figure 10 It is a partial enlarged schematic diagram of the electronic device module provided in an embodiment of the present application;

[0050] Figure 11 It is another partial enlarged schematic diagram of the electronic device module provided in an embodiment of the present application;

[0051] Figure 12 It is an enlarged schematic diagram of the first functional module of the electronic device module provided in an embodiment of the present application;

[0052] Figure 13 It is an enlarged schematic diagram of the second functional module of the electronic device module provided in an embodiment of the present application;

[0053] Figure 14 It is yet another partial enlarged schematic diagram of the electronic device module provided in an embodiment of the present application;

[0054] Figure 15 It is another enlarged schematic diagram of the second functional module of the electronic device module provided in an embodiment of the present application. Detailed implementation manners

[0055] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0056] The following description of each embodiment refers to the attached drawings, which illustrate specific embodiments in which the present application can be implemented. The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meanings. The terms "connection" and "coupling" as used in the present application, unless otherwise specified, both include direct and indirect connections (couplings). The directional terms mentioned in the present application, such as "up", "down", "front", "rear", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions in the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0057] In the description of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations. It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include", "may include", "contain", or "may contain" used in the present application indicate the existence of the corresponding functions, operations, elements, etc. disclosed, and do not limit one or more other functions, operations, elements, etc. Moreover, the term "include" or "contain" means the existence of the corresponding features, numbers, steps, operations, elements, components, or combinations thereof disclosed in the specification, and does not exclude the existence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, and is intended to cover non-exclusive inclusion.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0059] Please refer to Figure 1 the structural schematic diagram of the vehicle 300 provided in an embodiment of the present application as shown.

[0060] As Figure 1As shown in the figure, the vehicle 300 of the present application includes a battery pack 301, a controller 200, and a motor 302. The controller 200 is electrically connected between the battery pack 301 and the motor 302 to control the output of the motor 302 by controlling the electrical energy entering the motor 302 from the battery pack 301.

[0061] The controller 200 of the present application includes a control module 201 and an electronic device module 100. The electronic device module 100 includes a first functional module 10 and a second functional module 20 that are electrically connected. The first functional module 10 is a DC support capacitor, and the second functional module 20 is a power module.

[0062] As Figure 1 shown in the figure, when the user inputs a driving signal to the control module 201, the driving signal can be transmitted to the battery pack 301, causing the battery pack 301 to output current to the first functional module 10. After being processed by the first functional module 10, the current is output to the second functional module 20. The second functional module 20, which is a power module, converts the direct current processed by the first functional module 10 into three-phase alternating current and transmits it to the motor 302. The motor 302 rotates under the action of the three-phase alternating current and transmits signals such as its own speed and torque to the control module 201, which are processed by the control module 201 and then fed back to the user.

[0063] Among them, the first functional module 10, which is a DC support capacitor, protects the electronic device module 100 of the present application by absorbing ripples, preventing the electronic device module 100 of the present application from being broken down due to high voltage.

[0064] For ease of description, the first functional module 10 of the electronic device module 100 of the present application is a DC support capacitor, and the second functional module 20 is a power module. It can be understood that in another embodiment, the first functional module 10 can be a power module, and the second functional module 20 can be a DC support capacitor. In some other embodiments, the first functional module and the second functional module can also be other functional devices. The present application does not make any special restrictions on this.

[0065] Please refer to Figure 2 the schematic structural diagram of the electronic device module 100 provided in an embodiment of the present application shown in the figure, and please refer to Figure 3 the schematic structural diagram of the first functional module 10 of the electronic device module 100 provided in an embodiment of the present application shown in the figure, and please also refer to Figure 4 the schematic structural diagram of the second functional module 20 of the electronic device module 100 provided in an embodiment of the present application shown in the figure.

[0066] As Figures 2 - 4As shown in the figure, the electronic device module 100 of the present application includes a first functional module 10 and a second functional module 20. Among them, the first functional module 10 and the second functional module 20 are arranged at intervals. On the surface of the first functional module 10 facing the second functional module 20, a first terminal 31 and a second terminal 32 protrude, and both the first terminal 31 and the second terminal 32 extend towards the second functional module 20. On the surface of the second functional module 20 facing the first functional module 10, a first terminal 31 and a second terminal 32 also protrude, and both the first terminal 31 and the second terminal 32 extend towards the first functional module 10.

[0067] As Figure 3 shown, the first functional module 10 includes a first body portion 11. The first terminal 31 provided on the first functional module 10 is a first capacitor terminal 31a, and the second terminal 32 provided on the first functional module is a second capacitor terminal 32a. Both the first capacitor terminal 31a and the second capacitor terminal 32a are electrically connected to the internal structure of the first body portion 11.

[0068] Among them, both the first capacitor terminal 31a and the second capacitor terminal 32a are sheet-shaped, and along the thickness direction of the first capacitor terminal 31a, the projection of the second capacitor terminal 32a on the first capacitor terminal 31a is at least partially received within the first capacitor terminal 31a.

[0069] As Figure 4 shown, the second functional module 20 includes a second body portion 21. The first terminal 31 provided on the second functional module 20 is a first power terminal 31b, and the second terminal 32 provided on the second functional module 20 is a second power terminal 32b. Both the first power terminal 31b and the second power terminal 32b are electrically connected to the internal structure of the second body portion 21.

[0070] Among them, both the first power terminal 31b and the second power terminal 32b are sheet-shaped, and along the thickness direction of the first power terminal 31b, the projection of the second power terminal 32b on the first power terminal 31b is at least partially received within the first power terminal 31b.

[0071] Both the first terminal 31 and the second terminal 32 are sheet-shaped. Among them, for the convenience of description, Figure 2 in the following figures, the extending direction of the first terminal 31 and the second terminal 32 is set as the first direction 001, the thickness direction of the first terminal 31 and the second terminal 32 is set as the second direction 002, and the width direction of the first terminal 31 and the second terminal 32 is set as the third direction 003.

[0072] Please refer to Figure 5 the front view structural schematic diagram of the electronic device module 100 provided in an embodiment of the present application shown in the figure, and please refer to Figure 6An enlarged schematic view of the electronic device module 100 provided in an embodiment of the present application is shown. Please also refer to Figure 4 .

[0073] As Figures 4 - 6 shown, along the first direction 001, the first capacitor terminal 31a and the first power terminal 31b are located between the first body portion 11 and the second body portion 21, and the sum of the lengths of the first capacitor terminal 31a and the first power terminal 31b is greater than the maximum spacing distance between the first body portion 11 and the second body portion 21. So that the end of the first capacitor terminal 31a can overlap on the end of the first power terminal 31b, thereby realizing the conduction between the first capacitor terminal 31a and the second capacitor terminal 32a.

[0074] As Figures 4 - 6 shown, along the first direction 001, the second capacitor terminal 32a and the second power terminal 32b are also located between the first body portion 11 and the second body portion 21, wherein the sum of the lengths of the second capacitor terminal 32a and the second power terminal 32b is less than the spacing distance between the first body portion 11 and the second body portion 21.

[0075] The electronic device module 100 of the present application further includes a connecting member 40, and the connecting member 40 is bridged between the second capacitor terminal 32a and the second power terminal 32b. So that the second capacitor terminal 32a and the second power terminal 32b can be conducted through the connecting member 40.

[0076] Among them, the first capacitor terminal 31a can be used as the positive output terminal of the DC support capacitor, and the second capacitor terminal 32a can be used as the negative output terminal of the DC support capacitor. Correspondingly, the first power terminal 31b can be used as the positive input terminal of the power module, and the second power terminal 32b can be used as the negative input terminal of the power module.

[0077] That is to say, in the electronic device module 100 of the present application, the current flow direction between the first capacitor terminal 31a and the first power terminal 31b is from the first capacitor terminal 31a to the first power terminal 31b. And the current flow direction between the second capacitor terminal 32a and the second power terminal 32b is from the second power terminal 32b through the connecting member 40 to the first power terminal 31b.

[0078] Based on the fact that the current flow direction in the wire is related to the magnetic field direction generated by the wire, and the generation of stray inductance is also related to the change of the magnetic field. It can be understood that the two first terminals 31 are conducted to each other, and the two second terminals 32 are conducted to each other. So that the magnetic fields generated by the currents flowing in the two first terminals 31 can cancel out the magnetic fields generated by the currents flowing to the two second terminals 32 and the connecting member 40, thereby reducing the generation of stray inductance.

[0079] Meanwhile, since both the first terminal 31 and the second terminal 32 are sheet-shaped, the magnetic fields generated by the currents in the first terminal 31 and the second terminal 32 will also extend along the third direction 003. It can be understood that the projection of the second capacitor terminal 32a on the first capacitor terminal 31a is at least partially received within the first capacitor terminal 31a, and the projection of the second power terminal 32b on the first power terminal 31b is also at least partially received within the first power terminal 31b. This can increase the area of the overlapping region between the first terminal 31 and the second terminal 32, reduce the distance between the first terminal 31 and the second terminal 32, and thus reduce the equivalent inductance loop formed between the first terminal 31 and the second terminal 32.

[0080] Since the longer the inductance loop, the higher the corresponding stray inductance generated. The existence of stray inductance will cause problems such as power loss or signal attenuation in the circuit system. In the power module, stray inductance will increase the voltage fluctuation range, thus causing damage to the power module. When the electronic device module 100 is in a high-frequency situation, stray inductance will also cause an increase in the switching loss of the power module.

[0081] Therefore, by electrically connecting the first terminals 31 and the second terminals 32 of the first functional module 10 and the second functional module 20 in the electronic device module 100 of the present application, and making the projection of each second terminal 32 on the first terminal 31 be at least partially received within the first terminal 31, it is also possible to reduce the generation of stray inductance while increasing the service life of the electronic device module 100 of the present application.

[0082] In another embodiment, the first capacitor terminal 31a can be used as the negative output terminal of the DC support capacitor, and the second capacitor terminal 32a can be used as the positive output terminal of the DC support capacitor. Correspondingly, the first power terminal 31b can be used as the negative input terminal of the power module, and the second power terminal 32b can be used as the positive input terminal of the power module.

[0083] At this time, the current flow direction between the first capacitor terminal 31a and the first power terminal 31b is still opposite to the current flow direction between the second capacitor terminal 32a and the second power terminal 32b. The magnetic fields generated by the currents in the two first terminals 31 can still cancel out the magnetic fields generated by the currents in the two second terminals 32. It still has the effect of reducing the generation of stray inductance.

[0084] It can be understood that in some other embodiments, other structures can also be used to achieve electrical connection between the second capacitor terminal 32a and the second power terminal 32b. The present application does not make any special restrictions on this.

[0085] Please refer to Figure 7 Another enlarged schematic diagram of the electronic device module 100 provided in an embodiment of the present application as shown.

[0086] As shown Figure 7 in the figure, along the first direction 001, the sum of the lengths of the first capacitor terminal 31a and the first power terminal 31b is equal to the maximum spacing distance between the first body portion 11 and the second body portion 21. Correspondingly, the ends of the first capacitor terminal 31a and the first power terminal 31b can be docked with each other to achieve conduction therebetween.

[0087] Please refer to Figure 8 the further enlarged schematic diagram of the electronic device module 100 provided in an embodiment of the present application as shown.

[0088] As shown Figure 8 in the figure, along the first direction 001, the sum of the lengths of the first capacitor terminal 31a and the first power terminal 31b is less than the maximum spacing distance between the first body portion 11 and the second body portion 21.

[0089] The sum of the lengths of the first capacitor terminal 31a and the first power terminal 31b is L1, the maximum spacing distance between the first body portion 11 and the second body portion 21 is D1, and the thickness of the first terminal 31 is H1. Among them, D1 - L1 ≤ H1 / 2. Correspondingly, the ends of the first capacitor terminal 31a and the first power terminal 31b are conducted in a molten filling manner.

[0090] It can be understood that setting D1 - L1 ≤ H1 / 2 avoids the situation that it is difficult to conduct between the first capacitor terminal 31a and the first power terminal 31b due to the too large spacing between the first capacitor terminal 31a and the first power terminal 31b, and ensures the electrical connection between the two first terminals 31.

[0091] Among them, in the embodiments of the present application and subsequent embodiments, the lap conduction means that two structures are arranged staggeredly in space, and one of the structures is placed on the surface of the other structure, so that there is an overlapping area between the two structures, and then an electrical connection means acts on the overlapping area of the two structures to connect the two structures into one body.

[0092] Exemplarily, the lap conduction between the first capacitor terminal 31a and the first power terminal 31b means that along the first direction 001, the first capacitor terminal 31a and the first power terminal 31b are arranged in a staggered manner, and the surface of the first capacitor terminal 31a facing the first power terminal 31b is in contact with the surface of the first power terminal 31b facing the first capacitor terminal 31a, so that there is an overlapping area between the first capacitor terminal 31a and the first power terminal 31b in the first direction 001. Then, the overlapping area of the first capacitor terminal 31a and the first power terminal 31b is connected into one body to achieve the lap conduction between the first capacitor terminal 31a and the first power terminal 31b.

[0093] In the embodiments of the present application and subsequent embodiments, butt conduction means that two structures extend towards each other respectively, and the end faces of each structure close to the other structure are in contact with each other, and then the two structures are connected into one body by means of electrical connection.

[0094] Exemplarily, the butt conduction between the first capacitor terminal 31a and the first power terminal 31b means that the end face of the first capacitor terminal 31a facing the second body portion 21 is in contact with the end face of the first power terminal 31b facing the first body portion 11, and the end faces of the first capacitor terminal 31a and the first power terminal 31b in contact with each other are connected into one body, so as to realize the butt conduction between the first capacitor terminal 31a and the first power terminal 31b.

[0095] In the embodiments of the present application and subsequent embodiments, melt filling conduction means that two structures extend towards each other respectively, and the end faces of each structure close to the other structure are spaced apart from each other, and then a molten material is filled in the gap between the two end faces, and the molten material is melted by corresponding electrical connection means, so as to connect the two structures into one body.

[0096] Exemplarily, the melt filling conduction between the first capacitor terminal 31a and the first power terminal 31b means that the end face of the first capacitor terminal 31a facing the second body portion 21 is spaced apart from the end face of the first power terminal 31b facing the first body portion 11. Along the first direction 001, a molten material (not shown in the figure) is filled between the first capacitor terminal 31a and the first power terminal 31b, and the molten material is melted by high temperature, so as to connect the molten material with the first capacitor terminal 31a and the first power terminal 31b respectively, and ensure that the molten material fills the gap between the first capacitor terminal 31a and the first power terminal 31b, so that the first capacitor terminal 31a and the first power terminal 31b can be conducted under the action of the molten material. The melt filling conduction between the first capacitor terminal 31a and the first power terminal 31b is realized.

[0097] In one embodiment, the first capacitor terminal 31a and the first power terminal 31b are connected by a non-contact energy source scanning connection technology. Among them, as Figures 4 - 6 shown, the length of the first capacitor terminal 31a is greater than the length of the second capacitor terminal 32a, and the length of the first power terminal 31b is also greater than the length of the second power terminal 32b. That is to say, a part of the first capacitor terminal 31a is exposed outside the second capacitor terminal 32a, and a part of the first power terminal 31b is also exposed outside the second power terminal 32b.

[0098] As Figures 4 - 6As shown, along the first direction 001, the overlapping portion of the first capacitor terminal 31a and the first power terminal 31b is located between the second capacitor terminal 32a and the second power terminal 32b, so that an external energy source can scan the overlapping portion of the first capacitor terminal 31a and the first power terminal 31b, and the overlapping portions of the first capacitor terminal 31a and the first power terminal 31b are fused together to achieve conduction between the first capacitor terminal 31a and the first power terminal 31b.

[0099] It can be understood that the connection method between the two first terminals 31 in the electronic device module 100 of the present application adopts a non-contact energy source scanning connection technology, which can avoid the influence of the vibration of the external structure itself on the connection effect during the connection process. Thus, the connection stability between the two first terminals 31 of the electronic device module 100 of the present application is ensured.

[0100] In some other embodiments, the connection method between the two first terminals 31 in the electronic device module 100 of the present application can also be other methods, and the present application does not make special limitations on this.

[0101] Please refer to Figure 9 the schematic structural diagram of the connector 40 provided in an embodiment of the present application as shown. And cooperate with referring to Figure 2 and Figure 6 .

[0102] As Figure 2 , Figure 6 and Figure 9 shown, the connector 40 includes a connecting portion 43 and two docking portions. The two docking portions are the first docking portion 41 and the second docking portion 42 respectively. Along the first direction 001, the first docking portion 41 and the second docking portion 42 are located on opposite sides of the connecting portion 43, and the sum of the lengths of the first docking portion 41, the second docking portion 42 and the connecting portion 43 is greater than the maximum spacing distance between the second capacitor terminal 32a and the second power terminal 32b.

[0103] Among them, the first docking portion 41 overlaps on the surface of the second capacitor terminal 32a and conducts with the second capacitor terminal 32a, and the second docking portion 42 overlaps on the surface of the second power terminal 32b and conducts with the second power terminal 32b. To achieve conduction between the second capacitor terminal 32a and the second power terminal 32b that are spaced apart from each other.

[0104] In one embodiment, as Figures 4 - 6As shown, the opposite ends of the connecting member 40 are also connected by a connection technique of non-contact energy source scanning. It can be understood that the lengths of the second capacitor terminal 32a and the second power terminal 32b extending out of the corresponding first body portion 11 and second body portion 21 are such that it is convenient for an external energy source to scan the overlapping portions of the connecting member 40 with the second capacitor terminal 32a and the second power terminal 32b, thereby achieving the conduction of the connecting member 40 to the second capacitor terminal 32a and the second power terminal 32b.

[0105] It can be understood that the connection method between the two second terminals 32 in the electronic device module 100 of the present application adopts a connection technique of non-contact energy source scanning, which can avoid the influence of the vibration of the external structure itself on the connection effect during the connection process. Thus, the connection stability between each second terminal 32 and the connecting member 40 in the electronic device module 100 of the present application is ensured.

[0106] In some other embodiments, the connection method between each second terminal 32 and the connecting member 40 in the electronic device module 100 of the present application can also be other methods, and the present application does not make special limitations on this.

[0107] Please refer to Figure 10 the partial enlarged schematic diagram of the electronic device module 100 provided in an embodiment of the present application as shown. Among them, in order to facilitate the description of the connection relationship between the second docking portion 42 and the second power terminal 32b, Figure 10 some structures are omitted.

[0108] As Figure 10 shown, the sum of the lengths of the first docking portion 41, the second docking portion 42, and the connecting portion 43 is equal to the maximum spacing distance between the second capacitor terminal 32a and the second power terminal 32b.

[0109] Among them, the end of the first docking portion 41 is in butt conduction with the end of the second capacitor terminal 32a, and the end of the second docking portion 42 is in butt conduction with the end of the second power terminal 32b. To achieve the conduction of the mutually spaced second capacitor terminal 32a and second power terminal 32b.

[0110] Please refer to Figure 11 another partial enlarged schematic diagram of the electronic device module 100 provided in an embodiment of the present application as shown. Among them, in order to facilitate the description of the connection relationship between the second docking portion 42 and the second power terminal 32b, Figure 11 some structures are omitted.

[0111] As Figure 11 shown, the sum of the lengths of the first docking portion 41, the second docking portion 42, and the connecting portion 43 is less than the maximum spacing distance between the second capacitor terminal 32a and the second power terminal 32b.

[0112] The sum of the lengths of the first docking portion 41, the second docking portion 42, and the connecting portion 43 is L2, the maximum spacing distance between the second capacitor terminal 32a and the second power terminal 32b is D2, and the thickness of the second terminal 32 is H2. Among them, D2 - L2 < H2 / 2. Correspondingly, the ends of the second capacitor terminal 32a and the second power terminal 32b are electrically connected by means of molten filling.

[0113] It can be understood that setting D2 - L2 ≤ H2 / 2 avoids the situation where it is difficult to conduct electricity between the second capacitor terminal 32a and the second power terminal 32b due to the too large spacing between them, ensuring the electrical connection between the two second terminals 32.

[0114] In one embodiment, as Figure 2 、 Figure 6 and Figure 9 shown, there are multiple first docking portions 41, and along the third direction 003, the respective first docking portions 41 are spaced apart from each other and are sequentially connected to the connecting portion 43.

[0115] Since an external force needs to be applied to the first docking portion 41 when connecting the first docking portion 41 and the second capacitor terminal 32a, and the first docking portion 41 is deformed to reduce the spacing between the first docking portion 41 and the second capacitor terminal 32a in the second direction 002. It can be understood that setting multiple first docking portions 41 can reduce the stress concentration compared with one first docking portion 41, thereby reducing the difficulty of deforming each first docking portion 41. It is beneficial to realize the conduction between the first docking portion 41 and the second capacitor terminal 32a. Furthermore, the connection stability of the electronic device module 100 of the present application is improved.

[0116] At the same time, there are multiple second docking portions 42, and along the third direction 003, the respective second docking portions 42 are spaced apart from each other and are sequentially connected to the connecting portion 43.

[0117] Since an external force needs to be applied to the second docking portion 42 when connecting the second docking portion 42 and the second power terminal 32b, and the second docking portion 42 is deformed to reduce the spacing between the second docking portion 42 and the second power terminal 32b in the second direction 002. It can be understood that setting multiple second docking portions 42 can reduce the stress concentration compared with one second docking portion 42, thereby reducing the difficulty of deforming each second docking portion 42. It is beneficial to realize the conduction between the second docking portion 42 and the second power terminal 32b. Furthermore, the connection stability of the electronic device module 100 of the present application is improved.

[0118] In one embodiment, the number of the first docking portions 41 is the same as that of the second docking portions 42, so as to facilitate the manufacture of the connecting member 40. It can be understood that in other embodiments, the number of the first docking portions 41 and the number of the second docking portions 42 may be different. The present application does not make special limitations on this.

[0119] In one embodiment, please refer back to Figure 3 、 Figure 4 and Figure 6 . The first terminals 31 of the two functional modules include a plurality of first sub-terminals 311. Specifically, in the first functional module 10, the first capacitor terminal 31a includes a plurality of first capacitor sub-terminals 311a, and along the third direction 003, the respective first capacitor sub-terminals 311a are spaced apart. In the second functional module 20, the first power terminal 31b includes a plurality of first power sub-terminals 311b, and along the third direction 003, the respective first power sub-terminals 311b are spaced apart.

[0120] Based on the mutual overlap of the first power terminal 31b and the first capacitor terminal 31a, and when connecting the first capacitor terminal 31a and the first power terminal 31b, an external force also needs to be applied to the first power terminal 31b and the first capacitor terminal 31a to cause deformation, so as to reduce the distance between the first power terminal 31b and the first capacitor terminal 31a.

[0121] It can be understood that setting a plurality of first power sub-terminals 311b and a plurality of first capacitor sub-terminals 311a can reduce the stress concentration between the first power terminal 31b and the first capacitor terminal 31a, thereby reducing the deformation difficulty of each first power sub-terminal 311b and first capacitor sub-terminal 311a. It is beneficial to realize the conduction between the first power sub-terminals 311b and the first capacitor sub-terminals 311a. Furthermore, the connection stability of the electronic device module 100 of the present application is improved.

[0122] In one embodiment, along the second direction 002, in the overlapping area of the first capacitor terminal 31a and the first power terminal 31b, the gap between the first capacitor terminal 31a and the first power terminal 31b is less than or equal to 0.2 mm. To ensure that during the process of the energy source scanning the overlapping area, the molten first capacitor terminal 31a and first power terminal 31b can completely fill this gap, so as to ensure the sufficient connection between the first capacitor terminal 31a and the first power terminal 31b, and avoid phenomena such as explosion holes and false soldering. Furthermore, the connection stability of the electronic device module 100 of the present application is guaranteed.

[0123] In one embodiment, along the second direction 002, in the overlapping region between the first docking portion 41 and the second capacitor terminal 32a, the gap between the first docking portion 41 and the second capacitor terminal 32a is less than or equal to 0.2 mm. In the overlapping region between the second docking portion 42 and the second power terminal 32b, the gap between the second docking portion 42 and the second power terminal 32b is less than or equal to 0.2 mm. This ensures sufficient connection between the first docking portion 41 and the second capacitor terminal 32a, and between the second docking portion 42 and the second power terminal 32b. Thus, the connection stability of the electronic device module 100 of the present application is ensured.

[0124] In one embodiment, as Figure 3 , Figure 4 and Figure 6 shown, the number of the first power sub-terminals 311b is the same as the number of the first capacitor sub-terminals 311a, and each first capacitor sub-terminal 311a is overlapped and electrically connected to a first power sub-terminal 311b.

[0125] It can be understood that in other embodiments, since the first capacitor terminal 31a is overlapped on the first power terminal 31b, the number of the first capacitor sub-terminals 311a can be greater than the number of the first power sub-terminals 311b, and there is a case where multiple first capacitor sub-terminals 311a are overlapped on one first power sub-terminal 311b. In other embodiments, the numbers of the first capacitor sub-terminals 311a and the first power sub-terminals 311b can also be other values.

[0126] In one embodiment, for the first functional module 10, along the third direction 003, the ratio of the width of the first capacitor terminal 31a to the width of the second capacitor terminal 32a is between 0.8 and 1.2. When the ratio of the width of the first capacitor terminal 31a to the width of the second capacitor terminal 32a is less than 0.8, the projection of the second capacitor terminal 32a on the first capacitor terminal 31a does not increase the area of the first capacitor terminal 31a, so that a part of the magnetic field generated by the first capacitor terminal 31a cannot be cancelled by the magnetic field generated by the second capacitor terminal 32a, and the magnetic field generated by the second capacitor terminal 32a cannot be cancelled relative to the magnetic field generated by the first capacitor terminal 31a. Thus, stray inductance is generated.

[0127] When the ratio of the width of the first capacitor terminal 31a to the width of the second capacitor terminal 32a is greater than 1.2, the projection of the first capacitor terminal 31a on the second capacitor terminal 32a does not increase the area of the second capacitor terminal 32a, so that a part of the magnetic field generated by the second capacitor terminal 32a cannot be effectively cancelled relative to the magnetic field generated by the first capacitor terminal 31a, and the magnetic field generated by the first capacitor terminal 31a cannot be cancelled relative to the magnetic field generated by the second capacitor terminal 32a. Thus, stray inductance is generated.

[0128] That is, by setting the ratio of the width of the first capacitor terminal 31a to the width of the second capacitor terminal 32a to be between 0.8 and 1.2, the cancellation ratio of the magnetic field generated by the current in the first capacitor terminal 31a and the magnetic field generated by the current in the second capacitor terminal 32a can be increased, thereby further ensuring the effect of reducing the stray inductance of the electronic device module 100 of the present application.

[0129] In one embodiment, the ratio of the width of the first capacitor terminal 31a to the width of the second capacitor terminal 32a is 1, and the first capacitor terminal 31a and the second capacitor terminal 32a are arranged in alignment.

[0130] In one embodiment, for the second functional module 20, along the third direction 003, the ratio of the width of the first power terminal 31b to the width of the second power terminal 32b is between 0.8 and 1.2. When the ratio of the width of the first power terminal 31b to the width of the second power terminal 32b is less than 0.8, the projection of the second power terminal 32b on the first power terminal 31b does not increase in the area of the first power terminal 31b, so that a part of the magnetic field generated by the first power terminal 31b cannot be cancelled by the magnetic field generated by the second power terminal 32b, and the magnetic field generated by the second power terminal 32b cannot be cancelled relative to the magnetic field generated by the first power terminal 31b. As a result, stray inductance is generated.

[0131] When the ratio of the width of the first power terminal 31b to the width of the second power terminal 32b is greater than 1.2, the projection of the first power terminal 31b on the second power terminal 32b does not increase in the area of the second power terminal 32b, so that a part of the magnetic field generated by the second power terminal 32b cannot be cancelled by the magnetic field generated by the first power terminal 31b, and the magnetic field generated by the first power terminal 31b cannot be cancelled relative to the magnetic field generated by the second power terminal 32b. As a result, stray inductance is generated.

[0132] That is, by setting the ratio of the width of the first power terminal 31b to the width of the second power terminal 32b to be between 0.8 and 1.2, the cancellation ratio of the magnetic field generated by the current in the first power terminal 31b and the magnetic field generated by the current in the second power terminal 32b can be increased, thereby further ensuring the effect of reducing the stray inductance of the electronic device module 100 of the present application.

[0133] In one embodiment, the ratio of the width of the first power terminal 31b to the width of the second power terminal 32b is 1, and the first power terminal 31b and the second power terminal 32b are aligned with each other.

[0134] In one embodiment, the electronic device module 100 of the present application further includes five insulators 50, where there are two insulators 50, namely a capacitor insulator 50a and a power insulator 50b respectively.

[0135] Specifically, please refer to Figure 12 the enlarged schematic diagram of the first functional module 10 of the electronic device module 100 provided in one embodiment of the present application as shown. And cooperate with referring to Figure 3 .

[0136] As Figure 3 and Figure 12 shown, the capacitor insulator 50a is fixed between the first capacitor terminal 31a and the second capacitor terminal 32a, and is in contact with the first capacitor terminal 31a and the second capacitor terminal 32a. Along the first direction 001, the extension length of the capacitor insulator 50a is between the first capacitor terminal 31a and the second capacitor terminal 32a.

[0137] It can be understood that the setting of the capacitor insulator 50a can prevent voltage breakdown of the gap between the first capacitor terminal 31a and the second capacitor terminal 32a, and prevent short circuit caused by the too close distance between the first capacitor terminal 31a and the second capacitor terminal 32a in the second direction 002, thereby protecting the use safety of the electronic device module 100 of the present application.

[0138] At the same time, the setting of the capacitor insulator 50a can also reduce the distance between the first capacitor terminal 31a and the second capacitor terminal 32a on the premise of ensuring the safety distance between the first capacitor terminal 31a and the second capacitor terminal 32a in the second direction 002, thereby reducing the inductance loop of the electronic device module 100 of the present application, and further reducing the stray inductance of the electronic device module 100 of the present application.

[0139] In one embodiment, as Figure 3 and Figure 12 shown, the capacitor insulator 50a includes a first insulating portion 51a and a first insulating protrusion 52a. Wherein, the first insulating portion 51a is arranged between the first capacitor terminal 31a and the second capacitor terminal 32a, and the end of the first insulating portion 51a is provided with a first insulating protrusion 52a, and the first insulating protrusion 52a exposes on the surface of the second capacitor terminal 32a and extends along the second direction 002 in a direction away from the first capacitor terminal 31a. In the second direction 002, the first insulating protrusion 52a is spaced from the connecting member 40.

[0140] It can be understood that the provision of the first insulating protrusion 52a increases the creepage distance between the end of the second capacitor terminal 32a and the first capacitor terminal 31a, preventing the current at the end of the second capacitor terminal 32a from directly extending along the surface of the capacitor insulating member 50a and connecting with the current of the first capacitor terminal 31a. Thus, while reducing the spacing between the first capacitor terminal 31a and the second capacitor terminal 32a in the second direction 002, the creepage distance between the first capacitor terminal 31a and the second capacitor terminal 32a is increased, further ensuring the safe use of the electronic device module 100 of the present application and further reducing the generation of stray inductance.

[0141] In one embodiment, as Figure 3 and Figure 12 shown, a first groove 521a is provided on the surface of the first insulating protrusion 52a away from the first capacitor terminal 31a, and a first groove 521a is also provided on the surface of the first insulating protrusion 52a away from the second capacitor terminal 32a. It can be understood that the provision of the first groove 521a further increases the creepage distance between the first capacitor terminal 31a and the second capacitor terminal 32a, further ensuring the safe use of the electronic device module 100 of the present application and further reducing the generation of stray inductance.

[0142] In one embodiment, the number of the first grooves 521a can be multiple. In another embodiment, the first groove 521a can also be provided only on the surface of the first insulating protrusion 52a away from the first capacitor terminal 31a or on the surface of the first insulating protrusion 52a away from the second capacitor terminal 32a. The present application does not make special restrictions on this.

[0143] Please refer to Figure 13 the enlarged schematic diagram of the second functional module 20 of the electronic device module 100 provided in one embodiment of the present application shown. And cooperate with referring to Figure 4 .

[0144] As Figure 4 and Figure 13 shown, the power insulating member 50b is fixed between the first power terminal 31b and the second power terminal 32b and is in contact with the first power terminal 31b and the second power terminal 32b. Along the first direction 001, the extension length of the power insulating member 50b is between the first power terminal 31b and the second power terminal 32b.

[0145] It can be understood that the provision of the power insulating member 50b can prevent voltage breakdown of the gap between the first power terminal 31b and the second power terminal 32b and prevent short circuits caused by the too-close distance between the first power terminal 31b and the second power terminal 32b in the second direction 002, thus protecting the safe use of the electronic device module 100 of the present application.

[0146] Meanwhile, the provision of the power insulating member 50b can also reduce the spacing between the first power terminal 31b and the second power terminal 32b on the premise of ensuring the safety distance between the first power terminal 31b and the second power terminal 32b in the second direction 002, thereby reducing the inductance loop of the electronic device module 100 of the present application, and further reducing the stray inductance of the electronic device module 100 of the present application.

[0147] In one embodiment, as Figure 4 and Figure 13 shown, the power insulating member 50b includes a second insulating portion 51b and a second insulating protrusion 52b. Among them, the second insulating portion 51b is disposed between the first power terminal 31b and the second power terminal 32b. The end of the second insulating portion 51b is provided with a second insulating protrusion 52b. The second insulating protrusion 52b exposes on the surface of the second power terminal 32b and extends in the second direction 002 away from the first power terminal 31b. In the second direction 002, the second insulating protrusion 52b is spaced apart from the connecting member 40.

[0148] It can be understood that the provision of the second insulating protrusion 52b increases the creepage distance between the end of the second power terminal 32b and the first power terminal 31b to prevent the current at the end of the second power terminal 32b from directly extending along the surface of the power insulating member 50b and communicating with the current of the first power terminal 31b. Thus, while reducing the spacing between the first power terminal 31b and the second power terminal 32b in the second direction 002, the creepage distance between the first power terminal 31b and the second power terminal 32b is increased, further ensuring the use safety of the electronic device module 100 of the present application and further reducing the generation of stray inductance.

[0149] In one embodiment, as Figure 4 and Figure 13 shown, the surface of the second insulating protrusion 52b away from the first power terminal 31b is provided with a second groove 521b, and the surface of the second insulating protrusion 52b away from the second power terminal 32b is also provided with a second groove 521b. It can be understood that the provision of the second groove 521b further increases the creepage distance between the first power terminal 31b and the second power terminal 32b, further ensuring the use safety of the electronic device module 100 of the present application and further reducing the generation of stray inductance.

[0150] In one embodiment, the number of the second grooves 521b can be multiple. In another embodiment, the second groove 521b can also be provided only on the surface of the second insulating protrusion 52b away from the first power terminal 31b or on the surface of the second insulating protrusion 52b away from the second power terminal 32b. The present application does not make special restrictions on this.

[0151] In one embodiment, asFigure 2 and Figure 6 As shown in Figure 6 , the electronic device module 100 of the present application further includes a second insulating member 61, and the second insulating member 61 is fixed to the surface of the connecting portion 43 facing the first terminal 31. Since the current flow directions in the first terminal 31 and the second terminal 32 are different, and the connecting member 40 is electrically connected to the second terminal 32. It can be understood that the setting of the second insulating member 61 can prevent voltage breakdown of the gap between the connecting portion 43 and the first terminal 31, and prevent short circuit caused by the too close distance between the connecting portion 43 and the first terminal 31 in the second direction 002. Thus, the use safety of the electronic device module 100 of the present application is protected.

[0152] Meanwhile, the setting of the second insulating member 61 can also reduce the distance between the connecting portion 43 and the first terminal 31 on the premise of ensuring the safety distance between the connecting portion 43 and the first terminal 31 in the second direction 002, thereby reducing the inductance loop of the electronic device module 100 of the present application, so that the magnetic fields generated by the connecting portion 43 and the first terminal 31 can cancel each other out in a larger proportion, and further reduce the stray inductance of the electronic device module 100 of the present application.

[0153] In one embodiment, as shown in Figure 2 and Figure 6 As shown in Figure 6 , along the first direction 001, the length of the second insulating member 61 is greater than or equal to the distance between the capacitor insulating member 50a and the power insulating member 50b. So that the second insulating member 61 can cooperate with the capacitor insulating member 50a and the power insulating member 50b to further prevent voltage breakdown of the gap between the connecting portion 43 and the first terminal 31. Thus, the use safety of the electronic device module 100 of the present application is further protected.

[0154] Meanwhile, it can also further reduce the distance between the connecting portion 43 and the first terminal 31 to further reduce the inductance loop of the electronic device module 100 of the present application, and further reduce the stray inductance of the electronic device module 100 of the present application.

[0155] In one embodiment, as shown in Figure 2 and Figure 6 As shown in Figure 6 , along the third direction 003, the width of the second insulating member 61 is greater than or equal to the width of the connecting member 40. That is, in the third direction 003, the opposite ends of the second insulating member 61 protrude from the end faces of the connecting member 40 to further prevent voltage breakdown of the gap between the connecting portion 43 and the first terminal 31. Thus, the use safety of the electronic device module 100 of the present application is further protected.

[0156] Please refer to Figure 14 Another partial enlarged schematic diagram of the electronic device module 100 provided in an embodiment of the present application shown in Figure 14 .

[0157] As shown in Figure 14As shown, the electronic device module 100 of the present application further includes an insulating layer 62, and the insulating layer 62 is coated on the surface of the connecting portion 43 facing the first terminal 31. It can be understood that the setting of the insulating layer 62 can prevent voltage breakdown of the gap between the connecting portion 43 and the first terminal 31, and prevent short circuit caused by the too close distance between the connecting portion 43 and the first terminal 31 in the second direction 002. Thus, the use safety of the electronic device module 100 of the present application is protected.

[0158] At the same time, the setting of the insulating layer 62 can also reduce the distance between the connecting portion 43 and the first terminal 31 on the premise of ensuring the safety distance between the connecting portion 43 and the first terminal 31 in the second direction 002, thereby reducing the inductance loop of the electronic device module 100 of the present application, so that the magnetic fields generated by the connecting portion 43 and the first terminal 31 can cancel each other out in a larger proportion. Furthermore, the stray inductance of the electronic device module 100 of the present application is reduced.

[0159] In one embodiment, as Figure 6 and Figure 13 shown, the electronic device module 100 of the present application further includes a support member 70, and the support member 70 is arranged on the side of the first power terminal 31b away from the second power terminal 32b to support the first power terminal 31b and the first capacitor terminal 31a lapped on the first power terminal 31b.

[0160] In one embodiment, as Figure 4 、 Figure 6 and Figure 10 shown, along the third direction 003, partial structures on opposite sides of the support member 70 extend along the side surfaces on opposite sides of the first power terminal 31b and are integrally connected to the power insulating member 50b.

[0161] It can be understood that in some other embodiments, when the first power terminal 31b is lapped on the first capacitor terminal 31a, the support member 70 is arranged on the side of the first capacitor terminal 31a away from the second capacitor terminal 32a to support the first capacitor terminal 31a and the first power terminal 31b.

[0162] In one embodiment, please refer back to Figure 2 、 Figure 7 and Figure 10 , the electronic device module 100 of the present application further includes positioning posts 80, the connecting portion 43 is provided with positioning holes 431, and the number of the positioning holes 431 is equal to the number of the positioning posts 80. Among them, the positioning posts 80 are arranged on the second groove 521b. When the connecting member 40 is connected to the second capacitor terminal 32a and the second power terminal 32b, the positioning posts 80 can extend into the positioning holes 431 to realize the positioning of the connecting member 40.

[0163] Please refer to Figure 15Another enlarged schematic diagram of the second functional module 20 of the electronic device module 100 provided in an embodiment of the present application as shown. Please also refer to Figure 4 .

[0164] As Figure 4 and Figure 15 shown, the first power terminal 31b includes a plurality of first power sub-terminals 311b, and the second power terminal 32b includes a plurality of second power sub-terminals 321b. Along the third direction 003, the plurality of first power sub-terminals 311b and the plurality of second power sub-terminals 321b are spaced from each other, and the number of the first power sub-terminals 311b is equal to the number of the second power sub-terminals 321b.

[0165] As Figure 4 and Figure 15 shown, a plurality of positioning posts 80 are provided and are respectively and spacedly arranged between two adjacent first power sub-terminals 311b, and each positioning post 80 is also arranged between two adjacent second power sub-terminals 321b. To avoid the damage to the creepage distance between the first power sub-terminals 311b and the second power sub-terminals 321b by the positioning posts 80, the use safety of the electronic device module 100 of the present application is further ensured.

[0166] Meanwhile, the mutual matching of the plurality of positioning posts 80 and the positioning holes 431 on the connecting portion 43 can further realize the positioning of the connecting member 40, and avoid affecting the connection reliability between the connecting member 40 and the second terminal 32 due to the position offset of the connecting member 40 during the connection process. Thus, the connection reliability of the electronic device module 100 of the present application is improved.

[0167] In another embodiment, the positioning post 80 can also be arranged on the first groove 521a of the first insulating protrusion 52a. Correspondingly, the second capacitor terminal 32a also correspondingly includes a plurality of second capacitor sub-terminals (not shown in the figure) to avoid the damage to the creepage distance between the first capacitor terminal 31a and the second capacitor terminal 32a by the positioning post 80.

[0168] In one embodiment, as Figures 2 - 4 shown, along the third direction 003, the widths of the first capacitor sub-terminals 311a and the first power sub-terminals 311b located on the opposite sides of the first body portion 11 are greater than the widths of the remaining first capacitor sub-terminals 311a and first power sub-terminals 311b.

[0169] During the operation of the controller according to the present application, there is a cooling pipeline passing through between the first body part 11 and the second body part 21 in the third direction 003. Along the flow direction of the coolant in the cooling pipeline, the temperature of the coolant gradually increases and the heat absorption capacity gradually decreases. It can be understood that widening the widths of the first capacitor sub-terminals 311a and the first power sub-terminals 311b on the opposite sides of the first body part 11 can reduce the overall resistance values of this part of the first capacitor sub-terminals 311a and the first power sub-terminals 311b, thereby reducing the heat generation of the first capacitor sub-terminals 311a and the first power sub-terminals 311b. Cooperating with the flow direction of the cooling pipeline, the temperature uniformity effect of the electronic device module 100 of the present application is improved.

[0170] In one embodiment, as Figures 2 - 4 shown, the width of the first capacitor terminal 31a lapped on the first power terminal 31b is greater than or equal to the width of the lapped first power terminal 31b. To ensure the lapping width of the first power terminal 31b and the first capacitor terminal 31a, thereby ensuring the over-current capacity of the electronic device module 100 of the present application.

[0171] In one embodiment, the materials of the first insulating protrusion 52a, the second insulating protrusion 52b and the positioning post 80 are white or other light colors close to white. Based on the connection technology of non-contact energy source scanning used in the electronic device module 100 of the present application, the energy source can be absorbed by dark materials. It can be understood that making the materials of the first insulating protrusion 52a, the second insulating protrusion 52b and the positioning post 80 white or other light colors close to white can reduce the heat absorbed during the energy source scanning, avoiding damage due to excessive self-heat. Ensuring the structural stability and electrical insulation safety of the first insulating protrusion 52a, the second insulating protrusion 52b and the positioning post 80.

[0172] In one embodiment, as Figure 3 shown, the first functional module 10 further includes a first input terminal 12 and a second input terminal 13. Among them, the first input terminal 12 and the second input terminal 13 are located on the side of the first body part 11 away from the first terminal 31 and the second terminal 32. The first input terminal 12 is connected to the negative electrode of the external battery pack, the second input terminal 13 is connected to the positive electrode of the external battery pack, and the first input terminal 12 and the second input terminal 13 supply electrical energy to the first functional module 10.

[0173] In one embodiment, as Figure 3As shown, the first functional module 10 further includes a first boost terminal 14 and a second boost terminal 15. Among them, the first boost terminal 14 is on the same side as the first input terminal 12 and the second input terminal 13, and the second boost terminal 15 is located on the side wall of the first body portion 11 and is connected to the internal structure of the first body portion 11 through the surface of the first body portion 11 where the first terminal 31 is provided.

[0174] The first boost terminal 14 and the second boost terminal 15 are connected to a boost capacitor (not shown in the figure) housed in the first body portion 11 and are connected to an external boost circuit to boost the voltage input from an external power source to the battery pack.

[0175] In one embodiment, as Figure 3 shown, the first functional module 10 further includes a ground terminal 16. The ground terminal 16 is located on the side wall of the first body portion 11, is disposed opposite to the second boost terminal 15, and the ground terminal 16 is also connected to the internal structure of the first body portion 11 through the surface of the first body portion 11 where the first terminal 31 is provided. The ground terminal 16 is used to be connected to a ground structure to protect the safe use of the first functional module 10 and improve the anti-interference ability of the first functional module 10.

[0176] In one embodiment, as Figure 4 shown, the second functional module 20 further includes three-phase output terminals 22. There are three three-phase output terminals 22, and they are spaced apart on the surface of the second body portion 21 away from the first terminal 31 to output three-phase current outward.

[0177] It should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include one or more of the said features. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0178] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the said embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0179] It should be understood that the application of this application is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of this application. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. An electronic device module, characterized in that, it includes two functional modules, each of the functional modules is provided with a first terminal and a second terminal, the first terminal and the second terminal both extend towards the other functional module, the ends of the first terminals of the two functional modules are electrically connected, and the ends of the second terminals of the two functional modules are electrically connected; Along the thickness direction of the first terminal, at least part of the projection of the second terminal on the first terminal is received within the first terminal.

2. The electronic device module according to claim 1, characterized in that, the sum of the lengths of the two first terminals of the two functional modules is greater than the maximum distance between the two functional modules, and the ends of the two first terminals of the two functional modules are overlapped and electrically connected.

3. The electronic device module according to claim 1, characterized in that, the sum of the lengths of the two first terminals of the two functional modules is equal to the maximum distance between the two functional modules, and the ends of the two first terminals of the two functional modules are butted and electrically connected.

4. The electronic device module according to claim 1, characterized in that, the sum of the lengths of the two first terminals of the two functional modules is L1, the maximum distance between the two functional modules is D1, and the thickness of the first terminal of each functional module is H1; wherein, L1 < D1, and D1 - L1 ≤ H1 / 2; the ends of the two first terminals of the two functional modules are filled and electrically connected by melting.

5. The electronic device module according to claim 1, characterized in that, the electronic device module further includes a connecting member, and the ends of the two second terminals of the two functional modules are electrically connected through the connecting member.

6. The electronic device module according to claim 5, characterized in that, the connecting member includes a connecting portion and two butting portions, the connecting portion is located between the two butting portions, and each butting portion is electrically connected to a second terminal respectively.

7. The electronic device module according to claim 6, characterized in that, the sum of the lengths of the connecting portion and the two butting portions is greater than the maximum distance between the two second terminals of the two functional modules, and each butting portion is overlapped and electrically connected to a second terminal of a functional module respectively.

8. The electronic device module according to claim 6, characterized in that, the sum of the lengths of the connecting portion and the two butting portions is equal to the maximum distance between the two second terminals of the two functional modules, and each butting portion is butted and electrically connected to a second terminal of a functional module respectively.

9. The electronic device module according to claim 6, characterized in that, the sum of the lengths of the connecting portion and the two butting portions is L2, the maximum distance between the two second terminals of the two functional modules is D2, and the thickness of the second terminal of each functional module is H2; wherein, L2 < D2, and D2 - L2 < H2 / 2; each butting portion is filled and electrically connected to a second terminal of a functional module respectively by melting.

10. The electronic device module according to claim 6, wherein, a plurality of the docking portions are provided on at least one side of the connection portion, and along the width direction of the second terminal, the docking portions are spaced apart from each other and communicate with the connection portion.

11. The electronic device module according to any one of claims 5-10, wherein, the first terminal of at least one of the functional modules includes a plurality of first sub-terminals, and along the width direction of the first terminal, the first sub-terminals are spaced apart from each other; and / or, the second terminal of at least one of the functional modules includes a plurality of second sub-terminals, and along the width direction of the second terminal, the second sub-terminals are spaced apart from each other.

12. The electronic device module according to any one of claims 5-10, wherein, the first terminal of at least one of the functional modules includes a plurality of first sub-terminals, and along the width direction of the first terminal, the width of the first sub-terminal located at the edge of the plurality of first sub-terminals is greater than the width of the remaining first sub-terminals.

13. The electronic device module according to any one of claims 5-10, wherein, the first terminal of the same functional module includes a plurality of first sub-terminals, and the second terminal includes a plurality of second sub-terminals. Along the thickness direction of the first terminal, the projection of each second sub-terminal on the first sub-terminal is at least partially received within one of the first sub-terminals.

14. The electronic device module according to claim 13, wherein, the number of the first sub-terminals is equal to the number of the second sub-terminals, and along the thickness direction of the first sub-terminals, each of the second sub-terminals is aligned with one of the first sub-terminals.

15. The electronic device module according to any one of claims 5-10, wherein, the ratio of the width of the first terminal to the width of the second terminal is between 0.8 and 1.

2.

16. The electronic device module according to any one of claims 5-10, wherein, the electronic device module further includes two insulating members, each insulating member is fixed between the first terminal and the second terminal of one of the functional modules and extends respectively towards the other functional module, and the extension length of each insulating member is between the extension length of the first terminal and the extension length of the second terminal.

17. The electronic device module according to claim 16, wherein, the electronic device module further includes a second insulating member, the second insulating member is disposed on the surface of the connecting member facing the first terminal, and along the thickness direction of the first terminal, the projection of the second insulating member on the first terminal covers the first terminal exposed between the two second terminals of the two functional modules; along the length direction of the first terminal, the length of the second insulating member is greater than or equal to the distance between the two insulating members of the two functional modules.

18. The electronic device module according to claim 17, wherein, In the width direction of the first terminal, the width of the second insulating member is greater than or equal to the width of the connecting member.

19. The electronic device module according to claim 16, wherein, the electronic device module further includes an insulating layer, the insulating layer is coated on the surface of the connecting member facing the first terminal, and in the thickness direction of the first terminal, the projection of the first terminal between the two second terminals of the two functional modules on the insulating layer is received in the insulating layer; In the length direction of the first terminal, the length of the insulating layer is greater than or equal to the distance between the two insulating members of the two functional modules.

20. The electronic device module according to claim 16, wherein, at least one of the insulating members is provided with an insulating protrusion, the insulating protrusion is exposed between the second terminals of the two functional modules and extends in a direction away from the first terminal, and the insulating protrusion is spaced from the connecting member.

21. The electronic device module according to claim 20, wherein, at least one groove is provided on the surface of the insulating protrusion away from the first terminal; and / or, at least one groove is provided on the surface of the insulating protrusion away from the second terminal.

22. The electronic device module according to claim 20, wherein, a positioning post protrudes from the surface of the insulating protrusion away from the first terminal, and in the width direction of the first terminal, the positioning post is spaced from the first terminal and the second terminal; a positioning hole is provided on the connecting member, and the positioning post can extend into the positioning hole to realize the positioning of the connecting member.

23. The electronic device module according to claim 16, wherein, the color of the insulating member is white or other light colors close to white.

24. The electronic device module according to any one of claims 5-10, wherein, the ends of the first terminals of the two functional modules are electrically connected by a non-contact energy source scanning connection technique.

25. The electronic device module according to claim 24, wherein, in the thickness direction of the first terminal, the distance between the ends of the first terminals of the two functional modules is less than or equal to 0.2 mm.

26. The electronic device module according to any one of claims 5-10, wherein, the ends of the second terminals of at least one of the functional modules are electrically connected to the connecting member by a non-contact energy source scanning connection technique.

27. The electronic device module according to claim 26, wherein, in the thickness direction of the second terminal, the distance between the end of the second terminal electrically connected by the non-contact energy source scanning connection technique and the connecting member is less than or equal to 0.2 mm.

28. A controller, wherein, it includes the electronic device module according to any one of claims 1-27, and the two functional modules of the electronic device module are a DC support capacitor and a power module respectively.

29. A vehicle, wherein, it includes the controller according to claim 28.

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