Magnetic sensor device

Abstract

To provide a magnetic sensor device that can suitably fix a sensor substrate to a support substrate and has stable output characteristics.SOLUTION: A magnetic sensor device 1 comprises a support substrate 2 and a sensor substrate 10 fixed to the support substrate 2. The sensor substrate 10 includes: a first surface 10B facing the support substrate 2; and a second surface 10A that is located on an opposite side to the first surface 10B, the second surface 10A being provided with a functional film 20 including a plurality of magnetic detection elements E. A hole portion 11 is formed in the first surface 10B. An outline O11 of the hole portion 11 includes at least one corner C1, C2, C3..., and each of the plurality of magnetic detection elements E is disposed not to overlap any of the at least one corner C1, C2, C3... in a plan view seen in a plane-normal direction Z from the second surface 10A toward the first surface 10B.SELECTED DRAWING: Figure 17

Description

[Technical field]

[0001] The present disclosure relates to a magnetic sensor device. [Background technology]

[0002] There is a magnetic sensor device in which a sensor chip having a magnetic detection element provided on a sensor substrate is attached to a support substrate with an adhesive. For example, Patent Document 1 discloses a magnetic sensor device in which a first chip and a second chip including a magnetic sensor that generates a detection signal and a support including an application specific integrated circuit (ASIC) for processing the detection signal are prepared separately, and the first chip and the second chip are joined to the support with an adhesive.

[0003] In such a magnetic sensor device, it is preferable to apply the adhesive so that it slightly protrudes from the adhesive surface of the sensor substrate. If the amount of adhesive applied is insufficient, peeling may occur starting from the points where the adhesive is not applied, and the adhesive strength may decrease. If the amount of adhesive applied is excessive, the adhesive that protrudes from the sensor substrate may adhere to the electrodes on the surface of the ASIC, etc., and the connection reliability may decrease.

[0004] If a blind hole or through hole is formed on the adhesive surface of the sensor substrate, the amount of adhesive that overflows from the sensor chip is less likely to change due to surface tension even if the amount of adhesive applied changes slightly. The adhesive layer becomes thicker, and the adhesive strength is also improved. Patent Document 2, although not a magnetic sensor device, discloses forming a recess on the back surface of the semiconductor element facing the support substrate in a semiconductor device in which a semiconductor element is mounted on a support via an adhesive layer. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2023-10557 A [Patent Document 2] JP 2010-205893 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, unlike the semiconductor device described in Patent Document 2, the magnetic sensor device includes a magnetic detection element made of a magnetic material. When an external force is applied to a magnetic material, the response to the magnetic field fluctuates due to the inverse magnetostriction effect. In particular, a tunnel magnetoresistance effect element has excellent output characteristics with a large MR ratio, but the output characteristics are easily fluctuated by external forces. Furthermore, when a bottomed hole or a through hole is formed in the sensor substrate, the thickness of the sensor substrate changes locally, and therefore the thermal deformation when the sensor substrate expands and contracts due to temperature changes becomes uneven, and there is a risk that thermal stress will act on the magnetic detection element.

[0007] The present disclosure has been made in consideration of the above circumstances, and has an object to provide a magnetic sensor device in which a sensor substrate can be suitably fixed to a support substrate and which has stable output characteristics. [Means for solving the problem]

[0008] A magnetic sensor device according to an embodiment of the present disclosure includes a support substrate and a sensor substrate fixed to the support substrate. The sensor substrate has a first surface facing the support substrate and a second surface located on the opposite side to the first surface, the second surface being provided with a functional film including a plurality of magnetic detection elements. A hole is formed in the first surface, the contour of the hole includes at least one corner, and each of the magnetic detection elements is arranged so as not to overlap with any of the at least one corner in a plan view seen along a direction perpendicular to the surface from the second surface to the first surface. The hole may be a bottomed hole recessed from the first surface toward the second surface, or a through hole penetrating from the first surface to the second surface.

[0009] A magnetic sensor device according to another aspect of the present disclosure includes a support substrate and a sensor substrate fixed to the support substrate. The sensor substrate has a first surface facing the support substrate and a second surface opposite to the first surface, the second surface being provided with a functional film including a plurality of magnetic detection elements. A hole is formed in the first surface, and the outline of the hole is a circle without corners.

[0010] According to these aspects, since a hole is formed in the sensor substrate, the amount of adhesive overflowing from the underside of the sensor substrate is less likely to change even if the amount of adhesive applied changes, compared to when no hole is formed. The adhesive layer becomes thicker and the adhesive strength is improved. Thus, the sensor substrate can be suitably attached to the support substrate. In a plan view, the position that overlaps the corner of the hole outline is susceptible to the effects of thermal stress. According to these aspects, since each of the multiple magnetic detection elements does not overlap any of the corners, it is possible to provide a magnetic sensor device that is less susceptible to the effects of thermal stress and has stable output characteristics.

[0011] In the above aspect, the sensor substrate may be fixed to the support substrate using an adhesive, and the hole may be filled with the adhesive.

[0012] According to this aspect, the sensor substrate can be suitably fixed to the support substrate by the adhesive.

[0013] In the above aspect, the plurality of magnetic detection elements may be arranged so as not to overlap the contour in a plan view.

[0014] The positions other than the corners that overlap the contour of the hole are slightly more susceptible to the effects of thermal stress than positions that do not overlap the contour, although not as susceptible as the positions that overlap the corners. According to this aspect, since each of the multiple magnetic detection elements does not overlap either the corners or the contour, it is even less susceptible to the effects of thermal stress and the output characteristics are stable.

[0015] In the above aspect, some of the magnetic detection elements may be disposed inside the contour in a plan view, and the remainder of the magnetic detection elements may be disposed outside the contour in a plan view. All of the magnetic detection elements may be disposed inside the contour in a plan view. All of the magnetic detection elements may be disposed outside the contour in a plan view.

[0016] According to these aspects, the magnetic detection elements can be arranged across the inside and outside of the contour, or only inside the contour, or only outside the contour. There are few restrictions on the arrangement of the magnetic detection elements, allowing for excellent design freedom.

[0017] In the above aspect, each of the magnetic detection elements may be arranged at an interval of 1 μm or more from the contour in a direction perpendicular to the surface direction.

[0018] According to this embodiment, each of the magnetic detection elements is located at a distance of at least 1 μm from the contour, and therefore is less susceptible to the effects of thermal stress.

[0019] In the above aspect, the multiple magnetic detection elements may include at least one first magnetic detection element arranged so as to overlap the contour in a plan view seen along a direction perpendicular to the surface from the second surface to the first surface.

[0020] According to this embodiment, the first magnetic detection element can be arranged so as to overlap the contour of the hole. Although the position overlapping the contour of the hole other than the corner is slightly more susceptible to the effect of thermal stress than the position not overlapping the contour, the effect of thermal stress is sufficiently small compared to the position overlapping the corner, so it is possible to provide a magnetic sensor device with stable output characteristics. Compared to the case where the contour of the hole must be completely avoided, there are fewer restrictions on the arrangement of the magnetic detection elements, and the degree of freedom in design is excellent.

[0021] In the above aspect, the plurality of magnetic detection elements may further include a plurality of second magnetic detection elements arranged so as not to overlap the contour in a plan view, and some of the plurality of second magnetic detection elements may be arranged inside the contour in a plan view, and the remainder of the plurality of second magnetic detection elements may be arranged outside the contour in a plan view. The entirety of at least one second magnetic detection element may be arranged inside the contour in a plan view. The entirety of at least one second magnetic detection element may be arranged outside the contour in a plan view.

[0022] According to these aspects, the first magnetic detection elements that overlap the contour and the second magnetic detection elements that do not overlap the contour can be mixed, and the second magnetic detection elements can be arranged straddling the inside and outside of the contour, or the second magnetic detection elements can be arranged only inside the contour, or the second magnetic detection elements can be arranged only outside the contour. There are few restrictions on the arrangement of the magnetic detection elements, allowing for excellent design freedom.

[0023] In the above aspect, the multiple magnetic detection elements may be arranged at intervals of 1 μm or more from all of at least one corner in an in-plane direction perpendicular to the perpendicular direction.

[0024] According to this embodiment, each of the magnetic detection elements is located at a distance of at least 1 μm from the corner, and therefore is less susceptible to the effects of thermal stress.

[0025] In the above aspect, the hole may be a bottomed hole recessed from the first surface toward the second surface, and the depth of the bottomed hole in the direction perpendicular to the surface may be equal to or less than half the plate thickness of the sensor substrate.

[0026] The deeper the hole, the greater the difference in plate thickness between the hole and non-hole areas, making the magnetic detection element more susceptible to thermal stress when the sensor substrate expands and contracts due to temperature changes. According to this embodiment, the difference in plate thickness between the hole and non-hole areas is less than half the plate thickness, making it possible to provide a magnetic sensor device with stable output characteristics that is less susceptible to excessive thermal stress.

[0027] In the above aspect, the semiconductor device may further include a wiring layer provided in a layer farther from the support substrate than the functional film in the direction perpendicular to the surface, and each of the multiple magnetic detection elements may be arranged inside the outline of the wiring layer in a planar view.

[0028] If the magnetic detection element is disposed inside the outline of the wiring layer, the magnetic detection element is less susceptible to the effects of thermal stress than if there was no wiring layer.

[0029] In the above aspect, the hole may have an inner surface that is inclined with respect to a direction perpendicular to the surface, and each of the plurality of magnetic detection elements may be arranged so as not to overlap the inner surface in a plan view.

[0030] The position where the magnetic detection elements overlap the inclined inner surface is susceptible to the effects of thermal stress. According to this aspect, since each of the magnetic detection elements does not overlap the inclined inner surface, it is possible to provide a magnetic sensor device that is less susceptible to the effects of thermal stress and has stable output characteristics.

[0031] In the above aspects, the angle sensor may be equipped with a magnetic sensor device, the magnetic compass may be equipped with a magnetic sensor device, the current sensor may be equipped with a magnetic sensor device, or the autofocus mechanism and / or the optical image stabilization mechanism of the camera module may be equipped with a magnetic sensor device.

[0032] According to these aspects, the magnetic sensor device can be used for various purposes. Effect of the Invention

[0033] According to the present disclosure, it is possible to provide a magnetic sensor device in which a sensor substrate can be suitably fixed to a support substrate and which has stable output characteristics. [Brief description of the drawings]

[0034] [Figure 1] FIG. 1 is a perspective view showing a magnetic sensor device according to an embodiment. [Diagram 2] FIG. 2 is a cross-sectional view illustrating an example of an internal structure of the magnetic sensor device illustrated in FIG. [Diagram 3] 3A to 3C are perspective views illustrating a manufacturing process of the magnetic sensor device shown in FIG. [Figure 4] FIG. 4 is a diagram illustrating an example of a magnetic sensor device configured as an angle sensor. [Diagram 5] FIG. 5 is a plan view showing an example of a magnetic sensor device configured as a magnetic compass. [Figure 6] FIG. 6 is a diagram showing an example of a magnetic sensor device used as a part of a current sensor. [Figure 7] FIG. 7 is a diagram showing a circuit configuration of the current sensor shown in FIG. [Figure 8] FIG. 8 is a perspective view showing an example of a magnetic sensor device used as a part of an autofocus mechanism and an optical image stabilization mechanism of a camera module. [Figure 9] FIG. 9 is a cross-sectional view showing the internal structure of the camera module shown in FIG. [Figure 10A] FIG. 10A is a plan view of a simulation model in which a rectangular hole is formed, as viewed from a direction perpendicular to the surface. [Figure 10B] FIG. 10B is a plan view of a simulation model in which a rectangular hole with rounded corners is formed, as viewed from a direction perpendicular to the surface. [Figure 10C] FIG. 10C is a plan view of the simulation model in which a circular hole is formed, as viewed from a direction perpendicular to the surface. [Figure 10D] FIG. 10D is a plan view of a simulation model further including a wiring layer, as viewed from a direction perpendicular to the surface. [Figure 10E] FIG. 10E is a plan view of a simulation model having an inclined inner surface as viewed from a direction perpendicular to the surface. [Figure 11] FIG. 11 is a cross-sectional view of the simulation model taken along an XY plane perpendicular to the surface normal direction. [Figure 12-13] 12 and 13 are diagrams showing simulated angular errors at the positions shown in FIGS. 10A and 11. In FIG. [Figure 14]FIG. 14 is a diagram showing simulated angular errors at the positions shown in FIGS. 10A, 10B, and 10C. [Figure 15] FIG. 15 is a diagram showing angle errors obtained by simulating a model having the wiring layer shown in FIG. 10D at each of the positions shown in FIGS. 10A, 10B, and 10C. [Figure 16] FIG. 16 is a diagram showing simulated angular errors at each of the positions shown in FIG. 10E. [Figure 17-20] 17 to 20 are plan views showing first to fourth examples in which all the magnetic detection elements are arranged so as not to overlap the contours of the hole portions. [Figure 21-23] Figures 21 to 23 are plan views showing fifth to seventh examples in which the first magnetic detection element is arranged so as to overlap the outline of the hole portion other than at the corners, and the second magnetic detection element is arranged so as not to overlap the outline of the hole portion. [Figure 24] FIG. 24 is a plan view showing an eighth example in which the magnetic detection element is disposed inside the outline of the wiring layer. [Diagram 25] FIG. 25 is a cross-sectional view showing a ninth example in which the magnetic detection element is arranged so as not to overlap with the inclined inner surface. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] A preferred embodiment will be described with reference to the accompanying drawings. In each drawing, the same reference numerals are attached to the same or similar configurations. In the magnetic sensor device 1 according to the embodiment of the present disclosure, a hole 11 is formed in a sensor substrate 10, and as shown in FIG. 17 to FIG. 24, in a plan view seen along the direction perpendicular to the surface Z, each of the magnetic detection elements E is arranged so as not to overlap the corners C1, C2, C3... of the contour O11 of the hole 11. The contour O11 of the hole 11 may be a polygon such as a quadrangle including a plurality of corners C1, C2, C3..., or may be a circle not including the corners C1, C2, C3.... The corners C1, C2, C3... may be, for example, vertices C1, C2, C3... at which the curvature has a maximum value. The contour O11 of the hole 11 may be a combination of a vertex C1 and a curve such as a teardrop shape. For example, in the case of a circular arc with a constant curvature sandwiched between two straight lines such as corner R, corners C1, C2, C3 . . . may be the midpoints of the circular arc (see FIG. 10B).

[0036] A magnetic sensor device 1 according to one embodiment of the present disclosure includes a support substrate 2 and a sensor substrate 10 fixed to the support substrate 2 with an adhesive AD. The sensor substrate 10 has a first surface 10B facing the support substrate 2 and a second surface 10A located on the opposite side to the first surface 10B, the second surface 10A having a functional film 20 including a plurality of magnetic detection elements E. The adhesive AD is filled into a hole 11 formed in a bottomed hole recessed from the first surface 10B toward the second surface 10A or a through hole penetrating from the first surface 10B to the second surface 10A. A contour O11 of the hole 11 includes at least one vertex C1, C2, C3... at which the curvature has a maximum value. Each of the plurality of magnetic detection elements E is arranged so as not to overlap with at least one of the vertices C1, C2, C3... in a plan view seen along the surface perpendicular direction Z from the second surface 10A toward the first surface 10B. In a magnetic sensor device 1 according to another embodiment of the present disclosure, the contour O11 of the hole 11 is a circle that does not include vertices C1, C2, C3... where the curvature has a local maximum value. The magnetic sensor device 1 according to the present disclosure has the same or a corresponding special technical feature in that the magnetic detection element E is arranged so as not to overlap with the vertices C1, C2, C3... where the curvature has a local maximum value, whether the contour O11 of the hole 11 is a polygon or a circle. Each configuration will be described in detail below with reference to Figs. 1 to 25.

[0037] 1 is a perspective view showing a magnetic sensor device 1 according to one embodiment. In the illustrated example, the magnetic sensor device 1 includes a support substrate 2, a sensor chip 3, a wiring layer 4, a sealing resin 5, and electrodes 6. One magnetic sensor device 1 may include multiple sensor chips 3.

[0038] 1, the support substrate 2 is formed in a flat plate shape having an upper surface 2A and a lower surface 2B opposite to the upper surface 2A. In the following description, the thickness direction of the support substrate 2 is referred to as the plane perpendicular direction Z or the up-down direction Z, the direction from the lower surface 2B to the upper surface 2A is referred to as the upward direction, and the direction from the upper surface 2A to the lower surface 2B is referred to as the downward direction. The upper surface 2A extends parallel to the XY plane perpendicular to the plane perpendicular direction Z.

[0039] Fig. 2 is a cross-sectional view showing a schematic example of an internal structure of the magnetic sensor device 1 shown in Fig. 1. In the example shown, the support substrate 2 is an ASIC (Application Specific Integrated Circuit), and an electrode 2E electrically connected to a wiring layer 4 is provided on the upper surface 2A. The support substrate 2 is not limited to an ASIC, and may be a silicon substrate or a sapphire substrate. It may also be an intermediate substrate (interposer) on which only wiring is formed without including an integrated circuit.

[0040] The sensor chip 3 is fixed to the upper surface 2A of the support substrate 2 with an adhesive AD. As shown in Fig. 2, the sensor chip 3 includes a sensor substrate 10, at least one magnetic detection element array 30 that generates a detection signal, and a functional film 20 that surrounds the magnetic detection element array 30. The functional film 20 may be an inorganic film mainly composed of silica (silicon dioxide SiO2), or a laminated film of an inorganic film mainly composed of silica and an inorganic film mainly composed of alumina (aluminum oxide Al2O3).

[0041] The sensor substrate 10 is, for example, a silicon substrate, and is disposed between the upper surface 2A of the support substrate 2 and the functional film 20. The sensor substrate 10 has a first surface (lower surface) 10B facing the support substrate 2, and a second surface 10A opposite to the first surface 10B. The functional film 20 including the magnetic detection element array 30 is provided on the second surface 10A. The first surface 10B of the sensor substrate 10 has a hole 11 formed therein that can be filled with adhesive AD. The hole 11 may be a bottomed hole recessed from the first surface 10B toward the second surface 10A of the sensor substrate 10, or may be a through hole penetrating from the first surface 10B to the second surface 10A.

[0042] Each magnetic detection element array 30 is composed of a plurality of magnetic detection elements E (shown in FIG. 17) connected in a daisy chain and arranged in a matrix. An example of the magnetic detection element E is a TMR (tunnel magnetoresistance effect) element. The magnetic detection element E is not limited to a TMR element, but may be a GMR (giant magnetoresistance effect) element, an AMR (anisotropic magnetoresistance effect) element, a Hall element, or another type of magnetic detection element. The TMR element is particularly suitable for the magnetic detection element E because it has a smaller junction area than other types of MR elements, allowing the sensor chip 3 to be miniaturized, and has a larger MR ratio, allowing the output of the sensor chip 3 to be increased.

[0043] The magnetic detection element array 30 is disposed on the upper surface 2A side of the support substrate 2, and is formed on a first layer L1 on the upper surface 2A side of the support substrate 2. The wiring layer 4 is disposed on the upper surface 2A side of the support substrate 2, and is formed on a second layer L2 different from the first layer L1. The second layer L2 is farther from the support substrate 2 than the first layer L1.

[0044] The wiring layer 4 extends parallel to the upper surface 2A of the support substrate 2, and electrically connects the electrode 2E of the support substrate 2 to the electrode 3E provided on the upper surface 3A of the sensor chip 3 through a plurality of vias 40 extending in the direction perpendicular to the surface Z. The wiring layer 4 is disposed so as to partially overlap the sensor substrate 10 in the direction perpendicular to the surface Z.

[0045] The sealing resin 5 is disposed on the upper surface 2A side of the support substrate 2, and covers the sensor chip 3 and the wiring layer 4. The sealing resin 5 is configured by laminating a plurality of resin layers 51, 52, 53 (shown in FIG. 3) extending in parallel along the upper surface 2A of the support substrate 2. The wiring layer 4 is, for example, copper plating provided on the upper surfaces of the resin layers 51, 52. The electrodes 6 are, for example, solder balls or copper pillars, and are electrically connected to the wiring layer 4 and exposed from the sealing resin 5.

[0046] 3 is a perspective view for explaining a manufacturing process of the magnetic sensor device 1 shown in FIG. 1. As shown in FIG. 3(A), the sensor chip 3 is fixed to the upper surface 2A of the support substrate 2 with an adhesive AD (shown in FIG. 2). At this time, if the amount of adhesive AD applied is insufficient, the sensor chip 3 is likely to peel off from the portion where the adhesive is not applied, whereas if the amount of adhesive AD applied is excessive, the adhesive that protrudes from the sensor chip 3 will adhere to the electrode 2E on the upper surface 2A of the support substrate 2. For this reason, it is preferable to apply the adhesive AD so that it protrudes slightly from the lower surface of the sensor chip 3.

[0047] As shown in Fig. 3(B), a resin layer (first resin layer) 51 is formed so as to cover the sensor chip 3 and the upper surface 2A of the support substrate 2, and through holes 40P for the vias 40 (shown in Fig. 2) are opened at the positions of the electrodes 2E, 3E (shown in Fig. 10). As shown in Fig. 3(C), a seed layer is formed by sputtering or the like, and the vias 40 and the first wiring layer 41 are formed by plating. The process shown in Fig. 3(C) may be a subtractive method or an additive method.

[0048] As shown in FIG. 3(D), a resin layer (second resin layer) 52 is formed so as to cover the via 40, the first wiring layer 41, and the resin layer 51, and a through hole 40P for the via 40 is opened. As shown in FIG. 3(E), the via 40 and the second wiring layer 42 are formed by a process similar to that of FIG. 3(C). As shown in FIG. 3(F), a resin layer (third resin layer) 53 is formed so as to cover the via 40, the second wiring layer 42, and the resin layer 52, and a through hole 6P for the electrode 6 is opened. As shown in FIG. 3(G), the through hole 6P is filled with solder or the like to form the electrode 6. According to the procedure shown in FIGS. 3(A) to (G), the support substrate 2 and the sensor chip 3, which are separately prepared, are electrically connected to each other to obtain the magnetic sensor device 1 shown in FIG. 1.

[0049] 4 is a diagram showing an example of a magnetic sensor device 1 configured as an angle sensor that generates a detection value corresponding to the angle of a detection target. In the illustrated example, the magnetic sensor device 1 is configured as an angle sensor that detects the angle of a magnet 300 that can rotate around a central axis O of a cylinder as a rotation axis. In the illustrated example, the X direction, Y direction, and Z direction are mutually perpendicular, and the central axis O is parallel to the Z direction.

[0050] The magnetic sensor device 1 detects a first component parallel to the X direction of the magnetic field component MF generated by the magnet 300 and applied to the magnetic sensor device 1, and generates a first detection signal representing the intensity of the first component, and detects a second component parallel to the Y direction of the magnetic field generated by the magnet 300, and generates a second detection signal representing the intensity of the second component. A processor (not shown) calculates the arc tangent of the ratio between the first detection signal and the second detection signal to calculate the angle θ that the magnetic field generated by the magnet 300 makes with respect to the reference direction DR.

[0051] Fig. 5 is a diagram showing an example of a magnetic sensor device 1 configured as a magnetic compass that generates a detection value corresponding to the angle of the geomagnetic field. As shown in Fig. 5, the magnetic sensor device 1 includes three sensor chips 3 (first to third sensor chips 3X, 3Y, and 3Z), and the first to third sensor chips 3X, 3Y, and 3Z are configured to detect components of an external magnetic field in three directions that are orthogonal to each other, respectively.

[0052] 6 is a diagram showing an example of the magnetic sensor device 1 used as a part of a current sensor 400 that generates a detection value corresponding to the current value of a detection target. In the example shown, the current sensor 400 is configured to detect the value of a current Itg flowing through a busbar 410. A magnetic field MF is generated around the busbar 410 by the current Itg. The current sensor 400 is disposed in the vicinity of the busbar 410 at a position where the magnetic field MF is applied.

[0053] Fig. 7 is a diagram showing a circuit configuration of the current sensor 400 shown in Fig. 6. In the illustrated example, the current sensor 400 is configured as a magnetic balance type current sensor. The current sensor 400 includes a coil 420 in addition to the magnetic sensor device 1. The coil 420 is for generating a second magnetic field MF2 that cancels out the first magnetic field MF1 of the magnetic field MF. The magnetic sensor device 1 detects a residual magnetic field between the first magnetic field MF1 and the second magnetic field MF2, and generates a magnetic field detection value S according to the strength of the magnetic field.

[0054] The current sensor 400 further includes a feedback circuit 430, a current detector 440, and the like. The feedback circuit 430 passes a feedback current to the coil 420 to generate a second magnetic field MF2 based on the magnetic field detection value S. The current detector 440 detects the value of the feedback current passing through the coil 420. The current detector 440 is, for example, a resistor inserted in the current path of the feedback current. In this case, the potential difference across the resistor corresponds to the detection value of the feedback current. Since the detection value of the feedback current is proportional to the value of the current Itg of the busbar 410, the value of the current Itg can be detected from the detection value of the feedback current.

[0055] The magnetic sensor device 1 of the present disclosure may be mounted in an electronic device such as an information device and used as a magnetic compass to detect geomagnetism, or may be used as part of an autofocus mechanism or optical image stabilization mechanism of a camera module, or may be used as an angle sensor to detect the angle that the magnetic field generated by a magnet makes with respect to a reference direction, or may be used as part of a current sensor to detect the value of the current flowing through a bus bar.

[0056] Fig. 8 is a perspective view showing an example of a magnetic sensor device 1 used as a part of the autofocus mechanism and optical image stabilization mechanism of a camera module 200. Fig. 9 is a cross-sectional view showing the internal structure of the camera module 200 shown in Fig. 8. The autofocus mechanism and optical image stabilization mechanism of the camera module 200 include a driving device 230 that moves a lens 220, and controls the driving device 230 based on position information of the lens 220 detected by a plurality of magnetic sensor devices 1.

[0057] More specifically, the autofocus mechanism detects when a subject is in focus using an image sensor, an autofocus sensor, etc., and moves the lens in the Z direction relative to the image sensor. The optical image stabilization mechanism detects camera shake using a gyro sensor, etc., and moves the lens in the U direction and / or V direction relative to the image sensor.

[0058] The camera module 200 shown in Figure 8 includes an image sensor 210 such as a CMOS, a lens 220 that is aligned with the image sensor 210, a first holding member 241 that is movable in the U and V directions relative to the image sensor 210, a second holding member 242 that is movable in the Z direction relative to the first holding member 241, a plurality of elastically deformable wires 244 that support the first holding member 241 and the second holding member 242, a drive device 230 that moves the first holding member 241 and the second holding member 242, and a housing 250 that houses them.

[0059] The autofocus mechanism and optical image stabilization mechanism of the camera module 200 includes a driving device 230, a plurality of magnetic sensor devices 1, a processor that controls the driving device 230, an autofocus sensor that detects the state in which the subject is in focus, a gyro sensor that detects camera shake, etc. The processor, autofocus sensor, gyro sensor, etc. (not shown) are arranged outside the housing.

[0060] The lens 220 is fixed inside a cylindrical second holding member 242. The second holding member 242 is accommodated together with the lens 220 in a box-shaped first holding member 241. At least one second magnet 243 is fixed to the second holding member 242 so that at least one magnetic sensor device 1 detects position information of the second holding member 242.

[0061] The driving device 230 includes a plurality of first coils 231, a plurality of second coils 232, a plurality of first magnets 233, and the like. The plurality of first coils 231 are fixed to the housing 250. The plurality of second coils 232 are fixed to the second holding member 242. The plurality of first magnets 233 are fixed to the first holding member 241. Each of the plurality of first coils 231 faces a corresponding first magnet 233. Each of the plurality of second coils 232 faces a corresponding first magnet 233.

[0062] In the case of the autofocus mechanism, when a current flows through any second coil 232 in response to a command from the processor, the second holding member 242 fixed to the second coil 232 moves in the Z direction due to the interaction between the magnetic field generated from the first magnet 233 and the magnetic field generated from the second coil 232. At least one magnetic sensor device 1 generates a detection signal based on a composite magnetic field obtained by combining the magnetic field generated from at least one second magnet 243 fixed to the second holding member 242 and the magnetic field generated from the first magnet 233 fixed to the first holding member 241, and transmits the detection signal to the processor. The processor detects position information of the lens 220 in the Z direction from the detection signal, and controls the driving device 230 so as to focus on the subject.

[0063] In the case of an optical image stabilization mechanism, when a current flows through any of the first coils 231 in response to a command from the processor, the first holding member 241 fixed to the first magnet 233 moves in the U direction and / or V direction due to the interaction between the magnetic field generated from the first magnet 233 and the magnetic field generated from the first coil 231. Each of the multiple magnetic sensor devices 1 generates a detection signal based on the position of the corresponding first magnet 233 and transmits it to the processor. The processor detects position information of the lens 220 in the U direction and V direction from the detection signal, and controls the driving device 230 to correct the camera shake.

[0064] Next, the magnetic sensor device 1 of the present disclosure will be described in detail with reference to Fig. 10A to Fig. 25. Fig. 10A is a plan view of a simulation model in which a hole 11 with a rectangular contour O11 is formed in a first surface 10B of a sensor substrate 10, as viewed from a direction perpendicular to the surface Z, and shows positions P and Q plotted on an upper surface 3A of a sensor chip 3.

[0065] 10A, the position directly above the corner C1 of the hole 11, which is 280 μm square, is set as P=0 in the X-axis direction and the Y-axis direction, and the position is moved by 10 μm in the X-axis direction and the Y-axis direction, and plotted as P=1, 2, 3, ... 14. For example, P=14 is located 140 μm away from P=0 in the X-axis direction and the Y-axis direction. Similarly, the position directly above the corner C1 is set as Q=0, and the position is moved by 10 μm in the X-axis direction and plotted as Q=1, 2, 3, ... 14.

[0066] Fig. 10B is a plan view of a simulation model in which a rectangular hole 11 with a contour O11 and rounded corners is formed on the first surface 10B of the sensor substrate 10, as viewed from the direction perpendicular to the surface Z, and shows a position P plotted on the upper surface 3A of the sensor chip 3. As shown in Fig. 10B, the position directly above the corner C1 of the hole 11, which is 340 µm square and has rounded corners with a diameter of 200 µm, in both the X-axis and Y-axis directions is set to P=0, and the position is moved by 10 µm in each of the X-axis and Y-axis directions and plotted as P=1, 2, 3, ...14.

[0067] Fig. 10C is a plan view of a simulation model in which a circular hole 11 is formed in the first surface 10B of the sensor substrate 10, as viewed from the direction perpendicular to the surface Z, and shows a position P plotted on the upper surface 3A of the sensor chip 3. As shown in Fig. 10C, the position directly above the contour O11 of the circular hole 11 having a diameter of 400 µm is set to P=0, and the position is moved by 10 µm in each of the X-axis and Y-axis directions, and plotted as P=1, 2, 3, ...14.

[0068] Fig. 10D is a plan view of a simulation model in which the model shown in Fig. 10A is further provided with wiring layers 4 each of 100 μm square in the X-axis direction and Y-axis direction, as viewed from the direction perpendicular to the surface Z. The wiring layers 4 are arranged so that their centers are located at the position P=0. In the simulation results of Fig. 15 described later, similar to Fig. 10D, the models shown in Figs. 10B and 10C also include wiring layers 4 each of 100 μm square in the X-axis direction and Y-axis direction, each of which is arranged so that its center is located at the position P=0.

[0069] 10E is a plan view of a simulation model having an inner surface 11C inclined with respect to the direction perpendicular to the surface Z, as viewed from the direction perpendicular to the surface Z, and shows a position P plotted on the upper surface 3A of the sensor chip 3. As shown in FIG. 10E, the simulation model has a hole 11 of 400 μm square in each of the X-axis direction and the Y-axis direction, the deepest center depth D shown in FIG. 11 described later is 15 μm, there is no bottom surface 10D, and instead the inner surface 11C is formed in an inclined surface or a stepped shape. In this simulation model, the wiring layer 4 shown in FIG. 10D is added so as to overlap the hole 11, the position directly below the center of the wiring layer 4 is set as P=0, and it is moved by 10 μm in each of the X-axis direction and the Y-axis direction, and plotted as P=1, 2, 3, ... 14.

[0070] 11 is a cross-sectional view of the simulation model taken along an XY plane perpendicular to the plane-perpendicular direction Z. The contour O11 of the hole 11 is the contour of the bottom surface 11D of the hole 11, and is defined by the boundary between the bottom surface 11D and the inner surface 11C. The boundary between the bottom surface 11D and the inner surface 11C may have a corner R. In that case, if the bottom surface 11D is flat and the depth D from the first surface 10B to the bottom surface 11D is approximately constant, the position where the gradual decrease in the depth D begins is the boundary between the bottom surface 11D and the inner surface 11C.

[0071] 12 to 16, the thickness T from the first surface 10B to the second surface 10A of the sensor substrate 10 is 15 μm, and the thickness of the functional film 20 is also 15 μm. In the simulation result of Fig. 15, the distance from the upper surface 3A of the sensor chip 3 to the lower surface of the wiring layer 4 is 5 μm.

[0072] Figure 12 is a graph showing the simulated angular error at each of the depths D shown in Figure 11 at the position P shown in Figure 10A, in which the position P shown in Figure 10A is changed to 15 patterns from 0 to 14, and the depth D from the first surface 10B of the sensor substrate 10 shown in Figure 11 to the bottom surface 11D of the hole 11 is changed to four patterns of 0 μm, 5 μm, 7.5 μm, and 15 μm, and the simulation results of the angular error when a predetermined stress value is applied to the magnetic sensor device 1 are plotted on the vertical axis.

[0073] When the depth D is less than 15 μm, the hole 11 is formed as a bottomed hole recessed from the first surface 10B toward the second surface 10A of the sensor substrate 10. When the depth D is 15 μm, the hole 11 is formed as a through hole penetrating from the first surface to the second surface. Even when the hole 11 is a through hole, the magnetic detection element E is fixed by the functional film 20 that surrounds the magnetic detection element E.

[0074] 12, the closer to P=0, the larger the angle error becomes. If the magnetic detection element E is located directly above the corner C1, it is susceptible to the effect of thermal stress from the sensor substrate 10. In the in-plane direction perpendicular to the plane-perpendicular direction Z, each of the magnetic detection elements E is preferably disposed at a distance of 10 μm or more from each of the corners C1 to C4. Furthermore, the angle error increases as the depth D of the hole 11 increases. It is preferable that the depth D of the hole 11 is equal to or less than half the plate thickness T of the sensor substrate 10 (T=30 μm).

[0075] Figure 13 is a graph showing simulated angular errors at each of the depths D shown in Figure 11 at the position Q shown in Figure 10A, with the horizontal axis plotting the simulation results of the angular error when a predetermined stress value is applied to the magnetic sensor device 1 by changing the position Q shown in Figure 10A to 14 patterns from 1 to 14 and changing the depth D of the hole 11 shown in Figure 11 to four patterns of 0 μm, 5 μm, 7.5 μm, and 15 μm.

[0076] 13, the closer to Q=0 (the same value as the plot of P=0 shown in FIG. 12), the larger the angle error. If the magnetic detection element E is located directly above the corner C1, it is susceptible to the effects of thermal stress from the sensor substrate 10. Whether it is P moving away from the contour O11 of the hole 11 or Q moving on the contour O11 of the hole 11, there is a common tendency for the angle error to become larger as it approaches the corner C1.

[0077] Figure 14 shows a simulated angle error when a predetermined stress value is applied to the magnetic sensor device 1 while the depth D of the hole 11 is fixed at 15 μm and the position P shown in Figures 10A, 10B, and 10C is changed to 15 patterns from 0 to 14.

[0078] 14, the angle error tends to increase in the model in which the contour O11 of the hole 11 is a rectangle with rounded corners, followed by a circular model and a rectangle model. In each model, the angle error increases as P approaches 0. If the magnetic detection element E is located directly above the corner C1, it is susceptible to the effect of thermal stress from the sensor substrate 10.

[0079] Figure 15 shows a simulated angle error when a predetermined stress value is applied to the magnetic sensor device 1 while fixing the depth D of the hole 11 at 15 μm, adding the wiring layer 4 shown in Figure 10D, and changing the position P shown in Figures 10A, 10B, and 10C to 15 patterns from 0 to 14.

[0080] 14 and 15, when the contour O11 of the hole 11 is either a rectangle, a rectangle with a rounded edge, or a circle, at positions P=0 to 3 inside the contour O4 of the wiring layer 4, the model with the wiring layer 4 tends to have a smaller angle error than the model without the wiring layer 4. In other words, it can be expected that the sensor substrate 10 will be less susceptible to the effects of thermal stress. However, in the rectangular model, at positions P=4 to 6 near the contour O4 of the wiring layer 4, the model with the wiring layer 4 has a larger angle error than the model without the wiring layer 4.

[0081] Fig. 16 shows simulated angle errors when P shown in Fig. 10E is changed to 15 patterns from 0 to 14 and a predetermined stress value is applied to the magnetic sensor device 1. Comparing the simulation results of Fig. 15 and Fig. 16, the angle error is larger in both the model in which the inner surface 11C is inclined with respect to the direction perpendicular to the surface Z and the model in which the inner surface 11C is formed in a stepped shape than in the model in which the inner surface 11C is not inclined. In other words, they tend to be more susceptible to the influence of thermal stress from the sensor substrate 10.

[0082] A preferred example of the present disclosure will be described with reference to Figs. 17 to 25. As described above with reference to Figs. 12 to 15, the angle error increases as the angle approaches the corners C1 to C4. If the magnetic detection element E is located directly above the corners C1 to C4, it is susceptible to thermal stress from the sensor substrate 10. Figs. 17 to 20 are plan views showing first to fourth examples in which all the magnetic detection elements are arranged so as not to overlap the contours of the hole. All the magnetic detection elements E are arranged so as not to overlap the contour O11 of the hole 11. In the first to fourth examples, each of the multiple magnetic detection elements E does not overlap any of the corners C1 to C4 of the contour O11 of the hole 11 in a plan view, so that the magnetic detection element E is less susceptible to thermal stress from the sensor substrate 10.

[0083] 17, in a plan view, some of the multiple magnetic detection elements E are arranged inside the contour O11 of the hole 11, and the remainder of the multiple magnetic detection elements E are arranged outside the contour O11 of the hole 11. In other words, in the first example shown in FIG 17, the magnetic detection elements are arranged straddling the inside and outside of the contour O11.

[0084] As in the second example shown in Fig. 18, the hole 11 may be arranged across multiple bridge circuits. In the examples shown in Fig. 17 to Fig. 24, the magnetic sensor device 1 includes first to fourth magnetic detection element arrays 31, 32, 33, and 34, and a first bridge circuit is formed by two parallel circuits. In the second example shown in Fig. 18, the magnetic sensor device 1 further includes fifth to eighth magnetic detection element arrays 35, 36, 37, and 38, and a second bridge circuit is formed by two parallel circuits.

[0085] The first magnetic detection element array 31 and the second magnetic detection element array 32 are connected in series across the output port A to configure one parallel circuit of the first bridge circuit, and the third magnetic detection element array 33 and the fourth magnetic detection element array 34 are connected in series across the output port B to configure the other parallel circuit of the first bridge circuit. Similarly, the fifth magnetic detection element array 35 and the sixth magnetic detection element array 36 are connected in series across the output port A to configure one parallel circuit of the second bridge circuit, and the seventh magnetic detection element array 37 and the eighth magnetic detection element array 38 are connected in series across the output port B to configure the other parallel circuit of the second bridge circuit. The output ports A and B are connected to a galvanometer or the like. In the second example shown in FIG. 18, similar to the first example, magnetic detection elements are arranged across the inside and outside of the contour O11.

[0086] In the magnetic sensor device 1 of the present disclosure, all of the magnetic detection elements E may be arranged inside the contour O11 in a planar view, as in a third example shown in Fig. 19, or all of the magnetic detection elements E may be arranged outside the contour O11 in a planar view, as in a fourth example shown in Fig. 20. The magnetic sensor device 1 of the present disclosure has few restrictions on the arrangement of the magnetic detection elements E, and has excellent design freedom.

[0087] 21 to 23 are plan views showing fifth to seventh examples in which the first magnetic detection element E1 is arranged to overlap the contour O11 of the hole 11 at a portion other than the corners C1 to C4, and the second magnetic detection element E2 is arranged not to overlap the contour O11 of the hole 11. The positions overlapping the contour O11 of the hole 11 at a portion other than the corners C1 to C4 are slightly more susceptible to thermal stress than the positions not overlapping the contour O11, but are sufficiently less affected by thermal stress than the positions overlapping the corners C1 to C4. In the fifth to seventh examples, each of the multiple magnetic detection elements E does not overlap any of the corners C1 to C4 of the contour O11 of the hole 11 in a plan view. Therefore, the magnetic detection elements E (the first magnetic detection element E1 and the second magnetic detection element E2) are less susceptible to thermal stress from the sensor substrate 10.

[0088] In the magnetic sensor device 1 of the present disclosure, the second magnetic detection element E2 that does not overlap the contour O11 of the hole 11 may be arranged straddling the inside and outside of the contour O11 in a plan view as in a fifth example shown in Fig. 21, the entire second magnetic detection element E2 may be arranged inside the contour O11 in a plan view as in a sixth example shown in Fig. 22, or the entire second magnetic detection element E2 may be arranged outside the contour in a plan view as in a seventh example shown in Fig. 23. The magnetic sensor device 1 of the present disclosure has few restrictions on the arrangement of the magnetic detection elements E, and has excellent design freedom.

[0089] FIG. 24 is a plan view showing an eighth example in which a wiring layer 4 is added to the first example shown in FIG. 17 so that the magnetic detection elements E are disposed inside the contour O4 of the wiring layer 4. In the eighth example, similar to the first example, in a plan view, each of the magnetic detection elements E does not overlap any of the corners C1 to C4 of the contour O11 of the hole 11. Therefore, the magnetic detection elements E are less susceptible to the influence of thermal stress from the sensor substrate 10. As described with reference to FIG. 15, when the wiring layer 4 is added, the angle error is reduced inside the contour O4 of the wiring layer 4. In the eighth example, it is expected that the influence of thermal stress will be further reduced compared to the first example.

[0090] Fig. 25 is a cross-sectional view showing a ninth example in which the magnetic detection elements are arranged so as not to overlap with the inclined inner surface. As described with reference to Fig. 16, when there is an inner surface 11C inclined with respect to the plane perpendicular direction Z, the position overlapping with the inner surface 11C in a plan view tends to be susceptible to the influence of thermal stress from the sensor substrate 10. In the ninth example, each of the multiple magnetic detection elements E does not overlap with the inclined inner surface 11C, so that the magnetic detection elements E are less susceptible to the influence of thermal stress from the sensor substrate 10.

[0091] According to the magnetic sensor device 1 of the present disclosure configured as above, since the hole 11 is formed in the sensor substrate 10, the amount of adhesive AD protruding from the first surface 10B of the sensor substrate 10 is less likely to change even if the amount of adhesive AD applied changes, compared to when the hole 11 is not formed. The adhesive layer becomes thicker and the adhesive strength is improved. Therefore, the sensor substrate 10 can be adhered to the support substrate 2 and suitably fixed. In a plan view, the position of the outline O11 of the hole 11 overlapping the corners C1 to C4 is susceptible to the influence of thermal stress, but since each of the multiple magnetic detection elements E does not overlap any of the corners C1 to C4, it is less susceptible to the influence of thermal stress. It is possible to provide a magnetic sensor device 1 with stable output characteristics of the magnetic detection element array.

[0092] The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those illustrated, and can be changed as appropriate. In addition, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0093] Reference Signs List 1...magnetic sensor device, 2...support substrate, 2A...upper surface, 2B...lower surface, 2E...electrode, 3...sensor chip, 3A...upper surface, 3E...electrode, 3X...first sensor chip, 3Y...second sensor chip, 3Z...third sensor chip, 4...wiring layer, 5...sealing resin, 6...electrode, 6P...through hole, 10...sensor substrate, 10A...second surface (upper surface), 10B...first surface (lower surface), 11...hole portion (bottomed hole or through hole), 11C...inner surface of hole portion (inner wall surface), 11D... bottom surface of hole, 20... functional film, 30... magnetic detection element array, 31-38... first to eighth magnetic detection element arrays, 40... via, 40P... through hole, 41... first wiring layer, 42... second wiring layer, 51-53... resin layer, 200... camera module, 210... image sensor, 220... lens, 230... driving device, 231... first coil, 232... second coil, 233... first magnet, 241... second First holding member, 242...second holding member, 243...second magnet, 244...wire, 250...housing, 300...magnet, 400...current sensor, 410...bus bar, 420...coil, 430...feedback circuit, 440...current detector 440, A...output port, AD...adhesive, B...output port, C1, C2, C3, C4...corner, D...hole depth, DR...reference direction, E...magnetic detection element, E1...first magnetic detection element element, E2...second magnetic detection element, Itg...current, L1...first layer, L2...second layer, MF...magnetic field, MF1...first magnetic field, MF2...second magnetic field, O...central axis, O4...outline of wiring layer, O11...outline of hole, P, Q...position, S...magnetic field detection value, T...thickness of sensor board, U, V...direction of hand vibration, W...wiring, X...left-right direction (an example of an in-plane direction), Y...front-back direction (another example of an in-plane direction), Z...perpendicular to the plane, θ...angle.

Claims

1. A support substrate; a sensor substrate fixed to the support substrate; the sensor substrate has a first surface facing the support substrate, and a second surface located on the opposite side to the first surface, the second surface being provided with a functional film including a plurality of magnetic detection elements; The first surface has a hole formed therein, The contour of the hole includes at least one corner; each of the plurality of magnetic detection elements is arranged so as not to overlap any of the at least one corner in a plan view seen along a plane perpendicular to the surface from the second surface toward the first surface; Magnetic sensor device.

2. the sensor substrate is fixed to the support substrate using an adhesive; The hole is filled with the adhesive. The magnetic sensor device according to claim 1 .

3. Each of the plurality of magnetic detection elements is arranged so as not to overlap the contour in the plan view. The magnetic sensor device according to claim 1 .

4. some of the plurality of magnetic detection elements are disposed inside the contour in the plan view, and the remainder of the plurality of magnetic detection elements are disposed outside the contour in the plan view. The magnetic sensor device according to claim 3 .

5. All of the plurality of magnetic detection elements are disposed inside the contour in the plan view. The magnetic sensor device according to claim 3 .

6. All of the plurality of magnetic detection elements are disposed outside the contour in the plan view. The magnetic sensor device according to claim 3 .

7. Each of the plurality of magnetic detection elements is disposed at an interval of 1 μm or more from the contour in a direction perpendicular to the surface perpendicular direction. The magnetic sensor device according to claim 3 .

8. The plurality of magnetic detection elements include at least one first magnetic detection element arranged so as to overlap the contour in the plan view. The magnetic sensor device according to claim 1 .

9. the plurality of magnetic detection elements further include a plurality of second magnetic detection elements arranged so as not to overlap the contour in the plan view, some of the second magnetic detection elements are disposed inside the contour in the plan view, and the remainder of the second magnetic detection elements are disposed outside the contour in the plan view. The magnetic sensor device according to claim 8 .

10. the plurality of magnetic detection elements further include at least one second magnetic detection element arranged so as not to overlap the contour in the plan view, the at least one second magnetic detection element is entirely disposed inside the contour in the plan view; The magnetic sensor device according to claim 8 .

11. the plurality of magnetic detection elements further include at least one second magnetic detection element arranged so as not to overlap the contour in the plan view, the at least one second magnetic detection element is entirely disposed outside the contour in the plan view; The magnetic sensor device according to claim 8 .

12. the plurality of magnetic detection elements are disposed at intervals of 1 μm or more from the at least one corner in an in-plane direction perpendicular to the perpendicular direction; The magnetic sensor device according to claim 1 .

13. the hole portion is a bottomed hole recessed from the first surface toward the second surface, The depth of the bottomed hole is equal to or less than half the thickness of the sensor substrate in the direction perpendicular to the surface. The magnetic sensor device according to claim 1 .

14. A wiring layer is provided in a layer farther from the support substrate than the functional film in the direction perpendicular to the surface, Each of the plurality of magnetic detection elements is disposed inside an outline of the wiring layer in the plan view. The magnetic sensor device according to claim 1 .

15. The hole has an inner surface inclined with respect to the plane perpendicular direction, Each of the plurality of magnetic detection elements is arranged so as not to overlap with the inner surface in the plan view. The magnetic sensor device according to claim 1 .

16. A support substrate; a sensor substrate fixed to the support substrate; the sensor substrate has a first surface facing the support substrate, and a second surface located on the opposite side to the first surface, the second surface being provided with a functional film including a plurality of magnetic detection elements; A hole portion is formed in the first surface, the hole portion being a bottomed hole recessed from the first surface toward the second surface or a through hole penetrating from the first surface to the second surface, The contour of the hole is a circle with no corners. Magnetic sensor device.

17. A magnetic sensor device comprising the magnetic sensor device according to claim 1 or 16. Angle sensor.

18. A magnetic sensor device comprising the magnetic sensor device according to claim 1 or 16. Magnetic compass.

19. A magnetic sensor device comprising the magnetic sensor device according to claim 1 or 16. Current sensor.

20. An autofocus mechanism and / or an optical image stabilization mechanism including the magnetic sensor device according to claim 1 or 16. Camera module.

Images