Packaging system, packaging method, and control system

Abstract

To provide a packaging system capable of achieving both productivity and accuracy in mounting components on circuit boards.SOLUTION: A packaging system 1 includes: a mounting head 2; a mobile unit 4; an imaging unit 23; and a control unit 233. The imaging unit 23 is provided to the mounting head 2 for picking up images of an area including a component capturing point or a mounting point of the component on a circuit board. The control unit 233 is configured to correct the target position at which the capture unit 22 of the mounting head 2 is positioned based on an image picked up by the imaging unit 23. The control unit 233 includes a detection unit 235 and a correction unit 236. The detection unit 235 sets a search frame that includes the uncorrected target position in the picked-up image in the picked-up image to detect the capturing point or mounting point within the set search frame. The correction unit 236 is configured to correct the target position based on the capturing point or mounting point detected by the detection unit 235.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure generally relates to a mounting system, a mounting method, and a control system, and more particularly to a mounting system, a mounting method, and a control system for mounting components on a board. [Background technology]

[0002] Patent Document 1 describes a component mounting device (mounting system) that includes a mounting head, a control unit that controls the driving of the mounting head, and a camera module (imaging device) installed on the mounting head. The mounting head further includes a suction nozzle (capture unit) that picks up and mounts components. The camera module captures an image of an area including the mounting position on a printed circuit board (substrate).

[0003] In the component mounting device described in Patent Document 1, the control unit moves the suction nozzle that has picked up the component to above the mounting position on the printed circuit board, and then causes the camera module to capture an image of an area including the mounting position. The control unit then calculates the relative position of the mounting position with respect to the suction nozzle based on the image captured by the camera module, and controls the drive of the mounting head based on the relative position. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2014 / 174598 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, in the component mounting device (mounting system) described in Patent Document 1, the control unit calculates the relative position of the mounting position on the board with respect to the suction nozzle by scanning the entire captured image of the camera module (imaging device). This may result in a long time from when the component is picked up to when the component is mounted at the mounting position, resulting in a decrease in productivity. In other words, in the component mounting device described in Patent Document 1, it may be difficult to achieve both productivity and mounting accuracy of components on the board.

[0006] An object of the present disclosure is to provide a mounting system, a mounting method, and a control system that are capable of achieving both productivity and accuracy in mounting components on a board. [Means for solving the problem]

[0007] A mounting system according to an aspect of the present disclosure includes a mounting head, a moving device, an imaging device, and a control unit. The mounting head has a capturing unit that captures a component, and mounts the component captured by the capturing unit on a board. The moving device positions the capturing unit of the mounting head at a capture location of the component or a mounting location of the component on the board. The imaging device is provided on the mounting head and captures an image of an area including the capture location or the mounting location. The control unit corrects a target position at which the capturing unit is positioned based on an image captured by the imaging device. The control unit includes a detection unit and a correction unit. The detection unit sets a search frame in the captured image including the target position before correction in the captured image, and detects the capture location or the mounting location within the set search frame. The correction unit corrects the target position based on the position of the capture location or the mounting location detected by the detection unit.

[0008] A mounting method according to one aspect of the present disclosure includes an imaging step and a control step. In the imaging step, an imaging device provided on the mounting head captures an image of a capture location of the component or a region including a mounting location of the component on the board where the capture location of the component is positioned by the capture location of the mounting head, which mounts the component captured by the capture location on the board. In the control step, a target position where the capture location is positioned is corrected based on an image captured by the imaging device in the imaging step. The control step includes a detection step and a correction step. In the detection step, a search frame including the target position before correction in the captured image is set in the captured image, and the capture location or the mounting location within the set search frame is detected. In the correction step, the target position is corrected based on the position of the capture location or the mounting location detected in the detection step.

[0009] A control system according to an aspect of the present disclosure includes an imaging device and a control unit. The imaging device captures an image of a region including a capture location of the component or a mounting location of the component on the board where the capture location of a mounting head that mounts the component captured by the capture location on a board is positioned. The control unit corrects a target position where the capture location is positioned based on an image captured by the imaging device. The control unit has a detection unit and a correction unit. The detection unit sets a search frame in the captured image including the target position before correction in the captured image, and detects the capture location or the mounting location within the set search frame. The correction unit corrects the target position based on the position of the capture location or the mounting location detected by the detection unit. Effect of the Invention

[0010] According to a mounting system, a mounting method, and a control system according to an aspect of the present disclosure, it is possible to achieve both productivity and accuracy in mounting components on a board. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a block diagram of a mounting system according to an embodiment. [Diagram 2] FIG. 2 is a schematic configuration diagram of the mounting system. [Diagram 3] FIG. 3 is a schematic diagram showing an image captured by an imaging device in the mounting system. [Figure 4] FIG. 4 is a schematic diagram showing a state in which a search frame is added to an image captured by an imaging device in the mounting system. [Diagram 5] FIG. 5 is a schematic diagram showing a state in which a search frame and a corrected target position are added to an image captured by an imaging device in the mounting system. [Figure 6] FIG. 6 is another schematic diagram showing a state in which a search frame is added to an image captured by an imaging device in the mounting system. [Figure 7] FIG. 7 is yet another schematic diagram showing a state in which a search frame is added to an image captured by an imaging device in the mounting system. [Figure 8] FIG. 8 is a schematic diagram showing another captured image of the imaging device in the mounting system. [Figure 9] FIG. 9 is a schematic diagram showing the configuration of the mounting system. [Figure 10] FIG. 10 is another schematic diagram showing the configuration of the mounting system. [Figure 11] FIG. 11 is a graph showing a speed command for the mounting head in the mounting system. [Figure 12] FIG. 12 is a graph showing a speed command for the mounting head in the mounting system according to the first comparative example. [Figure 13] FIG. 13 is a graph showing a speed command for the mounting head in the mounting system according to the second comparative example. [Figure 14] FIG. 14 is another graph showing a speed command for the mounting head in the mounting system according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, a mounting system, a mounting method, and a control system according to an embodiment will be described with reference to the drawings. Each figure described in the following embodiment is a schematic diagram, and the ratio of the size and thickness of each component does not necessarily reflect the actual dimensional ratio. In addition, the configuration described in the following embodiment is merely an example of the present disclosure. The present disclosure is not limited to the following embodiment, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

[0013] (Embodiment) (1) Overview First, an overview of a mounting system 1 and a control system 10 according to the embodiment will be described with reference to FIGS. 1 and 2. FIG.

[0014] The mounting system 1 according to the embodiment is a mounting device for mounting (attaching) the component 100 captured by the capture unit 22 onto the substrate 200. The mounting system 1 is used in the production of various products such as electronic devices and automobiles in facilities such as factories, laboratories, offices, and educational facilities.

[0015] In this embodiment, a case where the mounting system 1 is used for manufacturing electronic devices in a factory will be described. A typical electronic device has various circuit boards, such as a power supply circuit and a control circuit. In manufacturing these circuit boards, as an example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) to a board (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (attached) to the board. In the soldering process, for example, the board on which the components are mounted is heated in a reflow furnace to melt the cream solder and perform soldering. In the mounting process, the mounting system 1 performs an operation of capturing the component 100 by the capture unit 22, and an operation of mounting (attaching) the component 100 captured by the capture unit 22 to the board 200.

[0016] As described above, the mounting system 1 used for mounting the components 100 on the board 200 includes a mounting head 2, a control device 3, a moving device 4, a transport device 5, a plurality of component supply devices 6 (only one of which is shown in FIGS. 1 and 2), a fixed camera 7, and a base 8, as shown in FIGS. 1 and 2. The transport device 5 has a pair of conveyor mechanisms 51 extending in the X-axis direction (perpendicular to the paper surface of FIG. 2) on the base 8, and transports the board 200 in the X-axis direction to position it in a predetermined mounting space. The plurality of component supply devices 6 have a plurality of tape feeders attached to a feeder base 12 of a carriage 11 connected to the base 8 in a line in the X-axis direction. Each of the plurality of component supply devices 6 pitch-feeds the carrier tape 14 supplied from the reel 13, and supplies the components 100 held on the carrier tape 14 to the component supply port 61. The reel 13 is held by the carriage 11. The fixed camera 7 is attached on a base 8, and captures an image of the upper part. On the base 8, a mounting head 2 and a moving device 4, which will be described later, are provided.

[0017] A pair of support legs (not shown) are installed on the base 8. The pair of support legs are located on both sides of the transport device 5 in the X-axis direction (direction perpendicular to the paper surface of FIG. 2) and extend in the Y-axis direction. A guide rail (Y-axis drive unit 412) is provided on each of the pair of support legs, and both ends of an axis member (X-axis drive unit 411) that holds the head unit 21 in a state that allows it to move in the X-axis direction is attached to the pair of guide rails. A Y-axis motor 414 (see FIG. 1) of the moving device 4 is provided on each support leg, and the Y-axis motor 414 moves the axis member (X-axis drive unit 411) and the head unit 21 along the guide rail (Y-axis drive unit 412) in the Y-axis direction. Furthermore, a guide member extending in the X-axis direction and an X-axis motor 413 (see FIG. 1) of the moving device 4 are provided on the axis member (X-axis drive unit 411), and the X-axis motor 413 moves the head unit 21 in the X-axis direction along the guide member.

[0018] The mounting head 2 has a capturing unit 22 capable of capturing the component 100. The capturing unit 22 is, for example, a suction nozzle, and captures the component 100 in a state in which it can be released (i.e., released from capture). The mounting system 1 lowers the capturing unit 22 so as to approach the component supply port 61 of the component supply device 6, and causes the capturing unit 22 to capture the component 100. Furthermore, with the capturing unit 22 capturing the component 100, the mounting system 1 lowers the capturing unit 22 so as to approach the board 200, and mounts (mounts) the component 100 on the board 200.

[0019] The mounting system 1 according to the embodiment includes a mounting head 2, a moving device 4, an imaging device 23, and a control unit 233. The mounting head 2 has a capturing unit 22 that captures a component 100, and mounts the component 100 captured by the capturing unit 22 on a board 200. The moving device 4 positions the capturing unit 22 of the mounting head 2 at a capturing location Pa1 of the component 100 or a mounting location Pa2 of the component 100 on the board 200. The imaging device 23 is provided on the mounting head 2, and captures an image of an area including the capturing location Pa1 or the mounting location Pa2. The control unit 233 corrects a target position Po1 (see FIG. 3) at which the capturing unit 22 is positioned based on an image 300 (see FIG. 3) captured by the imaging device 23. The control unit 233 includes a detection unit 235 and a correction unit 236. The detection unit 235 sets a search frame 301 (see FIG. 4) including a target position Po11 (see FIG. 3) before correction in the captured image 300 in the captured image 300, and detects a capture point Pa1 or a mounting point Pa2 in the set search frame 301. The correction unit 236 corrects the target position Po1 based on the position of the capture point Pa1 or the mounting point Pa2 detected by the detection unit 235.

[0020] 1 and 2, the mounting system 1 according to the embodiment includes a control system 10. In the present embodiment, as an example, the control system 10 is an imaging device 23 provided in the mounting head 2. The control system 10 according to the embodiment includes the imaging device 23 and a control unit 233. The imaging device 23 captures an image of a region including a capture location Pa1 of the component 100 or a mounting location Pa2 of the component 100 on the board 200 where the capture unit 22 of the mounting head 2 that mounts the component 100 captured by the capture unit 22 on the board 200 is positioned. The control unit 233 corrects a target position Po1 (see FIG. 3) where the capture unit 22 is positioned based on an image 300 (see FIG. 3) captured by the imaging device 23. The control unit 233 includes a detection unit 235 and a correction unit 236. The detection unit 235 sets a search frame 301 (see FIG. 3) including a target position Po11 (see FIG. 4) before correction in the captured image 300 in the captured image 300, and detects a capture point Pa1 or a mounting point Pa2 in the set search frame 301. The correction unit 236 corrects the target position Po1 based on the position of the capture point Pa1 or the mounting point Pa2 detected by the detection unit 235.

[0021] In the mounting system 1 and the control system 10 according to the embodiment, the control unit 233 may scan the inside of the search frame 301 set in the captured image 300 when detecting the capture location Pa1 of the component 100 or the mounting location Pa2 of the component 100 on the board 200. This makes it possible to reduce the time required to detect the capture location Pa1 or the mounting location Pa2 compared to scanning the entire captured image 300, and as a result, it is possible to improve productivity. In addition, since the target position Po1 is corrected based on the position of the capture location Pa1 or the mounting location Pa2 in the search frame 301, it is also possible to improve the mounting accuracy of the component 100 on the board 200. That is, according to the mounting system 1 and the control system 10 according to the embodiment, it is possible to achieve both productivity and mounting accuracy of the component 100 on the board 200.

[0022] (2)Details Next, the mounting system 1 and the control system 10 according to the embodiment will be described in detail with reference to FIGS.

[0023] (2.1) Premise In this embodiment, as an example, a case will be described in which the mounting system 1 is used to mount the component 100 by surface mount technology (SMT). That is, the component 100 is a surface mount component (SMD: Surface Mount Device), and is mounted by being placed on the mounting surface 201 of the board 200. However, this is not the only example, and the mounting system 1 may be used to mount the component 100 by insertion mount technology (IMT: Insertion Mount Technology). In this case, the component 100 is a component for insertion mounting having lead terminals, and is mounted on the mounting surface 201 of the board 200 by inserting the lead terminals into holes in the board 200. That is, in this disclosure, "mounting a component on a board" includes placing the component on the mounting surface of the board and inserting the lead terminals of the component into holes in the board.

[0024] In the present disclosure, the captured image of the imaging device 23 includes a still image (still image) and a video (moving image). Furthermore, "video" includes a captured image composed of a plurality of still images obtained by stop-motion photography or the like. The captured image of the imaging device 23 does not have to be the data itself output from the imaging device 23. For example, the captured image of the imaging device 23 may be appropriately compressed as necessary, converted into another data format, or processed to cut out a part of the captured image of the imaging device 23, or to adjust the focus, brightness, or contrast. In the present embodiment, as an example, the captured image of the imaging device 23 is a full-color video.

[0025] In the following, as an example, three mutually orthogonal axes, an X-axis, a Y-axis, and a Z-axis, are set, and the axes parallel to the surface of the substrate 200 are defined as the "X-axis" and "Y-axis", and the axis parallel to the thickness direction of the substrate 200 is defined as the "Z-axis". Furthermore, one of the two directions along the Z-axis is defined as the upward direction, and the other direction is defined as the downward direction. For example, when the capture unit 22 faces the substrate 200, the substrate 200 is located below the capture unit 22. Note that the X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X", "Y", and "Z" in the drawings are merely indicated for the purpose of explanation, and none of them have any substance. Furthermore, these directions are not intended to limit the directions when the mounting system 1 is used.

[0026] Further, pipes for circulating cooling water, cables for supplying power, pipes for supplying air pressure (including positive pressure and vacuum), and the like are connected to the mounting system 1, but in this embodiment, illustration of these is omitted as appropriate.

[0027] (2.2) Overall structure Next, each component of the mounting system 1 and the control system 10 according to the embodiment will be described with reference to FIGS.

[0028] 1 and 2, a mounting system 1 according to an embodiment includes a mounting head 2, a control device 3, a moving device 4, a transport device 5, a plurality of component supply devices 6, and a fixed camera 7. However, the control device 3, the transport device 5, the plurality of component supply devices 6, and the fixed camera 7 are not essential components of the mounting system 1. In other words, all or some of the control device 3, the transport device 5, the plurality of component supply devices 6, and the fixed camera 7 do not have to be included as components of the mounting system 1. Also, as described above, the control system 10 is the imaging device 23 provided in the mounting head 2.

[0029] (2.2.1) Mounting head The mounting head 2 has a capturing unit 22 that captures the component 100, and mounts the component 100 captured by the capturing unit 22 on the board 200. The mounting head 2 has at least one capturing unit 22. In this embodiment, the mounting head 2 has one capturing unit 22. The mounting head 2 moves (lowers) the capturing unit 22 so as to approach a capturing location Pa1 (see FIG. 2), and causes the capturing unit 22 to capture the component 100 located at the capturing location Pa1. The capturing location (suction location) Pa1 is an area where the component 100 is captured (sucked) by the component supply device 6 that supplies the component 100. In the mounting system 1, the component supply device 6 supplies the component 100 to the component supply port 61, and therefore the component supply port 61 corresponds to the capturing location Pa1.

[0030] Furthermore, with the component 100 captured by the capturing unit 22, the mounting head 2 moves (lowers) the capturing unit 22 so as to approach the mounting location Pa2 (see FIG. 2) on the mounting surface 201 of the board 200, and mounts (attaches) the component 100 at the mounting location Pa2. The mounting location Pa2 is an area on the mounting surface 201 of the board 200 where the component 100 is mounted. In the mounting system 1, a pad or a land provided on the mounting surface 201 of the board 200 corresponds to the mounting location Pa2. In other words, the mounting head 2 holds the capturing unit 22 so that it can move toward the capturing location Pa1 and the mounting location Pa2.

[0031] The capturing unit 22 is, for example, a suction nozzle. The capturing unit 22 is controlled by the control device 3 and is switchable between a suction state in which the component 100 is sucked (held) and a release state in which the component 100 is released (released from suction). However, the capturing unit 22 is not limited to a suction nozzle, and may be configured to capture (hold) the component 100 by gripping (picking) the component 100 like a robot hand or a mechanical chuck. That is, in the present disclosure, "capturing a component" includes sucking the component and gripping the component.

[0032] Regarding the capturing of the component 100 by the capturing part 22, the mounting head 2 operates by receiving air pressure (vacuum) as a power source. That is, the mounting head 2 switches the capturing part 22 between an adsorption state and a release state by opening and closing a valve on the air pressure (vacuum) supply path connected to the capturing part 22.

[0033] In addition to the capturing portion 22, the mounting head 2 further has a head unit 21 that holds the capturing portion 22. In this embodiment, one capturing portion 22 is attached to one head unit 21. This allows the mounting head 2 to hold (capture) one component 100.

[0034] The head unit 21 is made of metal, for example, and is formed in a rectangular parallelepiped shape. The head unit 21 holds the capture unit 22 and the vertical drive unit 42 by assembling the capture unit 22 and a vertical drive unit 42 (see FIG. 1) described later to the head unit 21. In this embodiment, the capture unit 22 is indirectly held by the head unit 21 via the vertical drive unit 42 in a state in which the capture unit 22 is movable in the Z-axis direction and in the θ-direction described later. In addition, the mounting head 2 moves in the XY plane by moving the head unit 21 in the XY plane by a horizontal drive unit 41 (see FIG. 1) described later. The "XY plane" here is a plane that includes the X-axis and the Y-axis and is perpendicular to the Z-axis.

[0035] According to the above-mentioned configuration, the mounting head 2 can move (lower) the capturing portion 22 so as to approach the capturing location Pa1 (see FIG. 2), and can cause the capturing portion 22 to capture the component 100 located at the capturing location Pa1 (component supply port 61). Furthermore, with the capturing portion 22 capturing (sucking) the component 100, the mounting head 2 can move (lower) the capturing portion 22 so as to approach the mounting location Pa2 (see FIG. 2) on the mounting surface 201 of the board 200, and can mount (attach) the component 100 at the mounting location Pa2.

[0036] The mounting head 2 further includes an imaging device 23 in addition to the head unit 21 and the capturing section 22. The imaging device 23 is provided in the mounting head 2, and captures an image of an area including the capturing location Pa1 or the mounting location Pa2. In this embodiment, as described later, a case will be described as an example in which the imaging device 23 captures an image of an area including the capturing location Pa1.

[0037] The imaging device 23 is fixed to the head unit 21 of the mounting head 2 as shown in Fig. 2. The imaging device 23 is, for example, a video camera that captures moving images. The imaging device 23 captures an image of an area including the capture location Pa1 while the mounting head 2 is moving. The imaging device 23 also captures an image of the area including the capture location Pa1 before the capture section 22 reaches the pre-correction target position Po11 (see Fig. 3).

[0038] As shown in FIG. 1, the imaging device 23 has an imaging element 231 and an optical system 232. The optical system 232 forms an image 300 (see FIG. 3) by imaging an area including the capture location Pa1 on the imaging element 231. The imaging element 231 is, for example, an image sensor such as a CCD (Charge Coupled Devices) or a CMOS (Complementary Metal-Oxide Semiconductor). The imaging element 231 converts the image formed on the light receiving surface into an electrical signal and outputs it. The optical system 232 includes one or more lenses and mirrors. As an example in this embodiment, the optical system 232 is realized by a combination of a plurality of lenses (lens group). The optical system 232 forms an image of light from the area including the capture location Pa1 on the light receiving surface of the imaging element 231. Note that the optical system 232 is not limited to the above-mentioned configuration.

[0039] 2, the imaging device 23 is disposed below the head unit 21 and to the side of the capturing section 22 in a plan view from the Z-axis direction. In this manner, the imaging device 23 is attached to the head unit 21 together with the capturing section 22, and moves on the XY plane together with the capturing section 22. The imaging device 23 may be configured to move relative to the capturing section 22. For example, the head unit 21 may include an axis for moving the imaging device 23.

[0040] Furthermore, the imaging device 23 has an imaging optical axis (not shown) that intersects with the Z axis (vertical direction). In other words, the imaging optical axis of the imaging device 23 extends obliquely with respect to the vertical direction. That is, the imaging device 23 is fixed to the head unit 21 so that the imaging direction of the imaging device 23 intersects with the vertical direction, and images the area including the capture location Pa1 from obliquely above. As a result, the mounting system 1 can shorten the time required for mounting and improve productivity. Note that the horizontal direction is a direction along the XY plane, and the vertical direction is a direction perpendicular to the horizontal direction (a direction along the Z axis).

[0041] Moreover, the imaging device 23 further includes a control unit 233 and a storage unit 234 in addition to the imaging element 231 and the optical system 232 (see FIG. 1). The control unit 233 corrects the target position Po1 (FIGS. 3 to 5) at which the capturing unit 22 is positioned, based on the captured image 300 (see FIG. 3 to FIG. 5) of the imaging device 23. In an operation in which the capturing unit 22 captures the component 100, the target position Po1 is, for example, the center point P0 of the capture location Pa1 (see FIG. 3). In an operation in which the component 100 captured by the capturing unit 22 is mounted on the board 200, the target position Po1 is, for example, the center point of the mounting location Pa2. The control unit 233 corrects the target position Po1 while the mounting head 2 is moving. In addition, the control unit 233 corrects the target position Po1 before the capturing unit 22 reaches the target position Po11 before correction (see FIG. 3 to FIG. 5).

[0042] The control unit 233 includes a detection unit 235 and a correction unit 236, as shown in FIG. 1. The detection unit 235 sets a search frame 301 in a captured image 300 of the imaging device 23, as shown in FIG. 4. The search frame 301 is a frame for detecting a capture point Pa1 included in the captured image 300, and is set to a size at least larger than the capture point Pa1 so as to include the target position Po11 before correction. The detection unit 235 detects the capture point Pa1 in the set search frame 301. That is, the detection unit 235 sets the search frame 301 including the target position Po11 before correction in the captured image 300 in the captured image 300, and detects the capture point Pa1 in the set search frame 301. The correction unit 236 corrects the target position Po1 based on the position of the capture point Pa1 detected by the detection unit 235. More specifically, in order to capture the component 100 located at the capture point Pa1, the correction unit 236 sets the center point P0 (see FIG. 3) of the capture point Pa1 as the corrected target position Po12, as shown in FIG.

[0043] In addition, in FIG. 3 to FIG. 5, the capture location Pa1 is made larger than the part 100 so that the capture location Pa1 and the part 100 can be easily distinguished from each other, but in reality, they are the same size.

[0044] Here, the timing at which the control unit 233 acquires the captured image 300 is, for example, at intervals of 1 ms. Therefore, when the detection unit 235 of the control unit 233 sets the search frame 301 and detects the capture point Pa1 using the set search frame 301, the captured image 300 is the image acquired 1 ms before. At this time, the mounting head 2 is located at a position Po22 that has been moved 1 ms toward the pre-correction target position Po11 as shown in Fig. 6, and as a result, the search frame 301 including the pre-correction target position Po11 is set to a position that does not include the capture point Pa1.

[0045] The timing at which the control unit 233 acquires the position information I2 from the encoder 44 (see FIG. 9 and FIG. 10), which will be described later, is, for example, 50 μs. The position information I2 includes a time series position Po2 indicating the current position of the mounting head 2. Therefore, the control unit 233 can acquire the current position (time series position Po2) of the mounting head 2 in real time. The control unit 233 associates data of a plurality of time series positions Po2 with the acquisition time and stores them in the storage unit 234. Then, the control unit 233 acquires data of the time series position Po2 synchronized with the captured image 300 from the data of the plurality of time series positions Po2 stored in the storage unit 234. The detection unit 235 sets a search frame 301 in the captured image 300 based on the acquired data of the time series position Po2. This makes it possible to set the search frame 301 so as to include the capture location Pa1 (component 100), as shown in FIG. 7. In the present disclosure, "the captured image 300 and the time series position Po2 are synchronized" means that the difference between the acquisition time of the captured image 300 and the acquisition time of the time series position Po2 is less than 50 μs.

[0046] Incidentally, as shown in FIG. 8, when there is another component 100 adjacent to the pre-correction target position Po11 in the captured image 300, the control unit 233 may adjust the size of the search frame 301 based on information on the distance between the pre-correction target position Po11 and the other component 100. For example, in the search frame 301 having the size shown in FIG. 4 and FIG. 5, the component 100 adjacent to the pre-correction target position Po11 may be included in the search frame 301, and the detection accuracy of the mounting location Pa2 may decrease. Therefore, in this embodiment, the control unit 233 adjusts (reduced) the size of the search frame 301 so that the component 100 adjacent to the pre-correction target position Po11 is not included in the search frame 301 (see FIG. 8). As a result, only the mounting location Pa2 is included in the search frame 301, and as a result, it is possible to suppress the decrease in the detection accuracy of the mounting location Pa2.

[0047] Furthermore, the control unit 233 may adjust the size of the search frame 301 read from the storage unit 234 based on information on the size of the capture location Pa1 (or mounting location Pa2) detected by the detection unit 235, and update the search frame 301 stored in the storage unit 234 to the adjusted search frame 301. Specifically, the control unit 233 may adjust the size of the search frame 301 based on the size, part number, or board data of the component 100. For example, when the size of the search frame 301 read from the storage unit 234 is larger than the size of the capture location Pa1 (component 100), the control unit 233 adjusts (reduces) the size of the search frame 301 to match the size of the capture location Pa1. This makes it possible to reduce the time required to detect the capture location Pa1 when capturing a component 100 of the same size placed at the same capture location Pa1 thereafter.

[0048] The storage unit 234 includes, for example, a semiconductor memory such as a Read Only Memory (ROM), a Random Access Memory (RAM), or an Electrically Erasable Programmable Read Only Memory (EEPROM). Note that the storage unit 234 is not limited to a semiconductor memory, and may be a hard disk drive or the like.

[0049] The storage unit 234 stores, for example, data of a plurality of time-series positions Po2. The plurality of time-series positions Po2 are the time-series positions (current positions) of the mounting head 2 acquired by the encoder 44 (see FIG. 9 and FIG. 10) provided on the moving device 4 while the mounting head 2 is moving. That is, the control unit 233 stores, in the storage unit 234, a plurality of time-series positions Po2, which are the time-series positions of the mounting head 2 acquired by the encoder 44 provided on the moving device 4 while the mounting head 2 is moving. In addition, the storage unit 234 further stores, for example, a search frame 301. More specifically, the storage unit 234 stores the size of the capture location Pa1 and the size of the search frame 301 in association with each other with respect to the operation of the capture unit 22 capturing the component 100. In addition, the storage unit 234 stores the size of the mounting location Pa2 in association with the size of the search frame 301 in association with each other with respect to the operation of mounting the component 100 captured by the capture unit 22 on the board 200.

[0050] In this embodiment, as described above, the imaging device 23 corresponds to the control system 10. That is, the control system 10 includes the imaging device 23 and the control unit 233. The imaging device 23 captures an image of an area including a capture location Pa1 of the component 100 where the capture unit 22 of the mounting head 2 that mounts the component 100 captured by the capture unit 22 on the board 200 is positioned. The control unit 233 corrects the target position Po1 where the capture unit 22 is positioned based on the captured image 300 of the imaging device 23. The control unit 233 includes a detection unit 235 and a correction unit 236. The detection unit 235 sets a search frame 301 including a target position Po11 before correction in the captured image 300 in the captured image 300, and detects the capture location Pa1 in the set search frame 301. The correction unit 236 corrects the target position Po1 based on the position of the capture location Pa1 detected by the detection unit 235.

[0051] (2.2.2) Control device The mounting system 1 according to the embodiment includes a control device 3, as shown in FIGS.

[0052] The control device 3 controls each part of the mounting system 1. The control device 3 is electrically connected to, for example, each of the mounting head 2, the imaging device 23, the moving device 4, the transport device 5, the multiple component supply devices 6, and the fixed camera 7. The control device 3 outputs a control signal to the moving device 4, and controls the driving of the moving device 4 so that the component 100 captured by the capturing unit 22 is mounted on the mounting surface 201 of the board 200. The control device 3 also outputs a control signal to the imaging device 23 and the fixed camera 7, controls each of the imaging device 23 and the fixed camera 7, and acquires the captured images of the imaging device 23 and the fixed camera 7 from each of the imaging device 23 and the fixed camera 7.

[0053] The control device 3 also outputs a control signal to the transport device 5, and controls the transport device 5 so that the board 200 is positioned in the mounting space. The control device 3 also outputs a control signal to the multiple component supply devices 6, and controls the multiple component supply devices 6 so that the components 100 are positioned at the component supply ports 61.

[0054] More specifically, the control device 3 outputs the operation information I1 to the imaging device 23, as shown in Fig. 9. The operation information I1 includes data of a target position Po11 before correction. In the present embodiment, as an example, the data of the target position Po11 before correction includes position data in the X-axis direction and position data in the Y-axis direction. Note that the data of the target position Po1 may include data in the Z-axis direction in addition to data in the X-axis direction and data in the Y-axis direction.

[0055] Furthermore, the control device 3 controls the driving of the motor 43. In this embodiment, the motor 43 includes an X-axis motor 413 and a Y-axis motor 414. That is, the control device 3 controls the driving of each of the X-axis motor 413 and the Y-axis motor 414.

[0056] 9, the imaging device 23 receives operation information I1 from the control device 3 and position information I2 from the encoder 44. Then, the control unit 233 of the imaging device 23 sets a search frame 301 based on the operation information I1 and position information I2, and outputs data I3 related to the capture location Pa1 of the component 100 or the mounting location Pa2 of the component 100 on the board 200 included in the search frame 301 to the control device 3.

[0057] (2.2.3) Mobile Devices The moving device 4 positions the capture portion 22 of the mounting head 2 at the capture location Pa1 of the component 100 or the mounting location Pa2 of the component 100 on the board 200. That is, the moving device 4 is a device for moving the mounting head 2 including the capture portion 22 and the imaging device 23. The moving device 4 moves the head unit 21 in the horizontal direction in the XY plane and moves the capture portion 22 in the vertical direction along the Z axis. That is, the moving device 4 moves the head unit 21 in the X-axis direction and the Y-axis direction. In this embodiment, since the capture portion 22 and the imaging device 23 are fixed to the head unit 21, the moving device 4 also moves the capture portion 22 and the imaging device 23 together with the head unit 21 in the X-axis direction and the Y-axis direction. In FIG. 2, the mounting head 2 moves by the moving device 4 between above the component supply port 61 of the component supply device 6 and above the board 200 positioned in the mounting space of the transport device 5.

[0058] Specifically, as shown in FIG. 1, the moving device 4 includes a horizontal driving unit 41 and a vertical driving unit .

[0059] The horizontal drive unit 41 has an X-axis drive unit 411 and a Y-axis drive unit 412. The X-axis drive unit 411 moves the mounting head 2 linearly in the X-axis direction. The Y-axis drive unit 412 moves the mounting head 2 linearly in the Y-axis direction. The Y-axis drive unit 412 moves the mounting head 2 linearly in the Y-axis direction by moving the mounting head 2 together with the X-axis drive unit 411 along the Y axis. The X-axis drive unit 411 includes an X-axis motor 413 and drives the X-axis motor 413. The Y-axis drive unit 412 includes a Y-axis motor 414 and drives the Y-axis motor 414. Each of the X-axis motor 413 and the Y-axis motor 414 is, for example, a linear motor. Therefore, in this embodiment, the X-axis drive unit 411 moves the mounting head 2 linearly in the X-axis direction by a driving force generated by the X-axis motor 413 upon receiving power supply. Furthermore, the Y-axis driving unit 412 receives power and uses a driving force generated by a Y-axis motor 414 to move the mounting head 2 linearly in the Y-axis direction.

[0060] The vertical drive unit 42 moves the capture unit 22 linearly in the Z-axis direction. Furthermore, the vertical drive unit 42 rotates the capture unit 22 in a rotation direction (hereinafter referred to as "θ direction") around an axis line along the Z-axis direction. That is, the vertical drive unit 42 is an actuator that moves the capture unit 22 linearly in the Z-axis direction and rotates the capture unit 22 in the θ direction. In the present embodiment, as an example, the vertical drive unit 42 drives the capture unit 22 in the Z-axis direction by a driving force generated by a linear motor. Furthermore, the vertical drive unit 42 drives the capture unit 22 in the θ direction by a driving force generated by a rotary motor. As described above, the head unit 21 of the mounting head 2 moves linearly in the X-axis direction and the Y-axis direction by the horizontal drive unit 41. As a result, the capture unit 22 attached to the head unit 21 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction by the horizontal drive unit 41 and the vertical drive unit 42.

[0061] As shown in FIG. 9 and FIG. 10, the moving device 4 further includes an encoder 44 in addition to the horizontal driving unit 41 and the vertical driving unit 42. The encoder 44 is, for example, a rotary encoder that detects the amount of rotation of the X-axis motor 413 and the Y-axis motor 414. The encoder 44 includes a first encoder and a second encoder. The first encoder detects the amount of rotation of the X-axis motor 413. The second encoder detects the amount of rotation of the Y-axis motor 414. The control unit 233 of the imaging device 23 acquires position information I2 including the amount of rotation of the X-axis motor 413 and the amount of rotation of the Y-axis motor 414 from the encoder 44. The control unit 233 can acquire a time-series position Po2 indicating the current position of the mounting head 2 based on the position information I2 from the encoder 44. In this embodiment, the encoder 44 corresponds to a sensor provided in the moving device 4.

[0062] (2.2.4) Transport device The transport device 5 is a device for transporting the board 200. The transport device 5 has a pair of conveyor mechanisms 51, for example, as shown in FIG. 2. The transport device 5 transports the board 200 in the X-axis direction (a direction perpendicular to the paper surface of FIG. 2) by the pair of conveyor mechanisms 51. The transport device 5 transports the board 200 to a mounting space at least below the mounting head 2, that is, facing the capture unit 22 in the Z-axis direction. Then, the transport device 5 stops the board 200 in the mounting space until the mounting head 2 completes mounting of the components 100 on the board 200.

[0063] (2.2.5) Parts supply device Each of the multiple component supplying devices 6 supplies the components 100 captured by the capturing portion 22 of the mounting head 2. As an example, each component supplying device 6 has a tape feeder that supplies the components 100 accommodated in the carrier tape 14. Each component supplying device 6 moves the components 100 to the component supplying port 61 by feeding the carrier tape 14 in the Y-axis direction by the tape feeder. Each component supplying device 6 may have a tray on which the multiple components 100 are placed, instead of or in addition to the tape feeder. Each component supplying device 6 may have a bulk feeder, instead of or in addition to the tape feeder.

[0064] (2.2.6) Fixed Camera Fixed camera (component recognition camera) 7 captures an image from below of mounting head 2 moving between above component supply port 61 of component supply device 6 and above board 200 positioned in the mounting space. Therefore, the image captured by fixed camera 7 shows component 100 captured by capture unit 22. That is, the image captured by fixed camera 7 contains information on the relative positions of capture unit 22 and component 100, in other words, information on the deviation of component 100 from capture unit 22.

[0065] It is preferable that the fixed camera 7 captures an image of the mounting head 2 moving from the component supply port 61 toward the board 200 from below. In this case, the fixed camera 7 does not capture images all the time, but captures images when the capturing unit 22 capturing the component 100 passes above the fixed camera 7. The fixed camera 7 may also be installed below the component supply port 61.

[0066] (2.2.7) Other In addition to the above configuration, the mounting system 1 may include, for example, a lighting device and a communication unit.

[0067] The lighting device illuminates the imaging area of ​​the imaging device 23. The imaging area is, for example, an area including the capture location Pa1. The lighting device only needs to be turned on at least at the timing when the imaging device 23 captures an image, and for example, emits light in accordance with the imaging timing of the imaging device 23. In this embodiment, since the captured image 300 (see FIG. 3) of the imaging device 23 is a full-color video, the lighting device outputs light in a wavelength range of the visible light region, such as red or blue. In this embodiment, as an example, the lighting device has a plurality of light sources such as LEDs (Light Emitting Diodes). The lighting device illuminates the imaging area of ​​the imaging device 23 by emitting light from these multiple light sources. The lighting device is realized by an appropriate lighting method, such as a diffusion type or an oblique light type. For example, the lighting device is fixed to the mounting head 2 together with the imaging device 23.

[0068] The communication unit is configured to communicate with a higher-level system directly or indirectly via a network or a repeater, etc. This allows the mounting system 1 to exchange data with the higher-level system.

[0069] (3) Operation Next, the operation of the mounting system 1 according to the embodiment will be described with reference to Fig. 11 to Fig. 14. Below, the operation will be described in comparison with the operations of the mounting systems according to Comparative Examples 1 and 2. In Fig. 11 to Fig. 14, the horizontal axis represents time, and the vertical axis represents speed.

[0070] (3.1) Example 1 Operation example 1 is an operation example in the case where correction of the target position Po1 of the mounting head 2 is not required in the mounting system 1 according to the embodiment.

[0071] In the operation example 1, the mounting head 2 moves to the target position Po1 with a speed change as shown in FIG. 11. More specifically, the speed V1 of the mounting head 2 increases linearly from zero to a first speed V11 during the period from the start of the movement to time t1. Moreover, the speed V1 of the mounting head 2 maintains the first speed V11 during the period from time t1 to time t2. That is, the speed V1 of the mounting head 2 is constant during the period from time t1 to time t2. Moreover, the speed V1 of the mounting head 2 decreases linearly from the first speed V1 to zero during the period from time t2 to time t3. As a result, the mounting head 2 reaches the target position Po1 at time t3. Here, the period T1 from the start of the movement to time t3 is, for example, 250 ms.

[0072] (3.2) Example 2 Operation example 2 is an operation example when it is necessary to correct the target position Po1 of the mounting head 2 in the mounting system 1 according to the embodiment. First, the operation of the mounting systems according to comparative examples 1 and 2 will be described.

[0073] In the mounting system according to Comparative Example 1, a search frame for detecting a capture location or a mounting location is set in advance in the center of the captured image of the imaging device. In the mounting system according to Comparative Example 1, the control unit can correct the target position by scanning the search frame to detect the capture location or the mounting location at time t3 when the mounting head reaches the target position before correction. Note that the operation of the mounting head from the start of movement to time t3 is the same as that of the above-mentioned operation example 1 (see FIG. 11), and a description thereof will be omitted here. In the mounting system according to Comparative Example 1, the control unit corrects the target position of the mounting head in a period T22 from time t3 to time t4. Thereafter, the mounting head moves toward the corrected target position according to a speed command set based on the detection result of the control unit. In the example of FIG. 12, the speed V1 of the mounting head increases linearly from zero to a second speed V12 in the period from time t4 to time 5. In addition, the speed V1 of the mounting head decreases linearly from the second speed V12 to zero in the period from time t5 to time t6. As a result, the mounting head reaches the corrected target position at time t6.

[0074] 12, the period T21 from the start of operation to time t3 is, for example, 250 ms. The period T22 from time t3 to time t4 is the time to detect the capture location or mounting location from within the search frame, and is, for example, 8 ms. The period T23 from time t4 to time t6 is the time for the mounting head to move from the pre-correction target position to the corrected target position, and is, for example, 12 ms. Therefore, the period T2 from when the mounting head starts moving to when it reaches the corrected target position is, for example, 270 ms.

[0075] In the mounting system according to Comparative Example 2, the control unit detects the capture location or mounting location from the imaging field of view of the imaging device. In the example of FIG. 13, the detection of the capture location or mounting location is started at time t7 before the mounting head reaches the target position before correction. Therefore, it is necessary to set a wider area (for example, the imaging field of view) as the search frame so that the capture location or mounting location is included in the search frame. Then, the control unit ends the detection of the capture location or mounting location at time t4 after time t3 when the mounting head reaches the target position before correction. Note that the operation of the mounting head from the start of movement to time t3 is the same as that of the above-mentioned operation example 1, and a description thereof will be omitted here. In the mounting system according to Comparative Example 2, the control unit corrects the target position of the mounting head in the period T32 from time t7 to time t4. After that, the mounting head moves toward the corrected target position according to the speed command set based on the detection result of the control unit. Note that the operation after time t4 is the same as that of the mounting system according to Comparative Example 1, and a description thereof will be omitted here.

[0076] Here, in the example of Fig. 13, the period T31 from the start of operation to time t7 is, for example, 230 ms. Moreover, the period T32 from time t7 to time t4 is the time to detect the capture location or mounting location from the entire captured image of the imaging device, and is, for example, 50 ms. Moreover, the period T33 from time t4 to time t6 is the time for the mounting head to move from the target position before correction to the target position after correction, and is, for example, 12 ms. Therefore, the period T3 from when the mounting head starts operation to when it reaches the target position after correction is, for example, 292 ms.

[0077] In the mounting system 1 according to the embodiment, the detection unit 235 of the control unit 233 starts detecting the capture location Pa1 at time t8 before the mounting head 2 reaches the target position Po11 before correction (see FIG. 3). The detection unit 235 also ends the detection of the capture location Pa1 at time t9 before the mounting head 2 reaches the target position Po11 before correction. Note that the operation of the mounting head 2 from the start of movement to time t8 is similar to that of the mounting systems according to the comparative examples 1 and 2, and a description thereof will be omitted here. In the mounting system 1 according to the embodiment, the control unit 233 corrects the target position Po1 of the mounting head 2 in the period T421 from time t8 to time t9. Thereafter, the mounting head 2 moves toward the corrected target position Po12 according to a speed command set based on the detection result of the control unit 233. In the example of FIG. 14, the speed V1 of the mounting head 2 increases linearly from the third speed V13 at time t9 to the fourth speed V14 during the period from time t9 to time t10. Furthermore, the speed V1 of the mounting head 2 decreases linearly from the fourth speed V14 to zero during the period from time t10 to time t3. As a result, the mounting head 2 reaches the corrected target position Po12 (see FIG. 5) at time t3.

[0078] 14, the period T41 until time t8 when the detection unit 235 of the control unit 233 starts detecting the capture location Pa1 is, for example, 230 ms. The period T421 from time t8 to time t9 is the time to detect the capture location Pa1 from the search frame 301 set in the captured image 300 of the imaging device 23, and is, for example, 8 ms. The period T422 from time t9 to time t3 is the time for the mounting head 2 to move from the pre-correction target position Po11 to the corrected target position Po12, and is, for example, 12 ms. Therefore, the period T4 from when the mounting head 2 starts moving until when it reaches the corrected target position Po12 is, for example, 250 ms.

[0079] In this way, in the mounting system 1 according to the embodiment, the period T4 required to reach the target position Po12 when correction is required is the same as the period T1 required to reach the target position Po11 when correction is not required. Therefore, even when correction of the target position Po1 of the mounting head 2 is required, it is possible to maintain productivity.

[0080] (4) Mounting Method Next, a mounting method according to the embodiment will be described.

[0081] The mounting method according to the embodiment is, for example, a mounting method used in the mounting system 1 according to the embodiment described above.

[0082] The mounting method according to the embodiment includes an imaging step and a control step. In the imaging step, an area including the capture location Pa1 of the component 100 or the mounting location Pa2 of the component 100 on the board 200 where the capture unit 22 of the mounting head 2 is positioned is imaged by the imaging device 23 provided on the mounting head 2. In the control step, the target position Po1 where the capture unit 22 is positioned is corrected based on the captured image 300 of the imaging device 23 in the imaging step. The control step includes a detection step and a correction step. In the detection step, a search frame 301 including the target position Po11 before correction in the captured image 300 is set in the captured image 300, and the capture location Pa1 or the mounting location Pa2 in the set search frame 301 is detected. In the correction step, the target position Po1 is corrected based on the position of the capture location Pa1 or the mounting location Pa2 detected in the detection step.

[0083] In the mounting method according to the embodiment, when detecting the capture location Pa1 of the component 100 or the mounting location Pa2 of the component 100 on the board 200, the inside of a search frame 301 set in the captured image 300 may be scanned. Therefore, compared to scanning the entire captured image 300, it is possible to reduce the time required to detect the capture location Pa1 or the mounting location Pa2, and as a result, it is possible to improve productivity. In addition, since the target position Po1 is corrected based on the position of the capture location Pa1 or the mounting location Pa2 in the search frame 301, it is also possible to improve the mounting accuracy of the component 100 on the board 200. In other words, according to the mounting method according to the embodiment, it is possible to achieve both productivity and mounting accuracy of the component 100 on the board 200.

[0084] In the mounting method according to the embodiment, the step of the imaging device 23 capturing an image of an area including the capture location Pa1 or the mounting location Pa2 corresponds to the imaging step. Also, in the mounting method according to the embodiment, the step of the control unit 233 correcting the target position Po1 based on the captured image 300 of the imaging device 23 corresponds to the control step. Also, in the mounting method according to the embodiment, the step of the detection unit 235 of the control unit 233 setting a search frame 301 including the target position Po11 before correction in the captured image 300 and detecting the capture location Pa1 or the mounting location Pa2 in the set search frame 301 corresponds to the detection step. Also, in the mounting method according to the embodiment, the step of correcting the target position Po1 based on the position of the capture location Pa1 or the mounting location Pa2 detected by the detection unit 235 corresponds to the correction step.

[0085] (5) Effects In the mounting system 1 according to the embodiment, when detecting the capture location Pa1 of the component 100, it is sufficient to scan the inside of a search frame 301 set in the captured image 300. Therefore, it is possible to reduce the time required to detect the capture location Pa1 compared to scanning the entire captured image 300, and as a result, it is possible to improve productivity. In addition, since the target position Po1 is corrected based on the position of the capture location Pa1 in the search frame 301, it is also possible to improve the mounting accuracy of the component 100 on the board 200. In other words, according to the mounting system 1 according to the embodiment, it is possible to achieve both productivity and mounting accuracy of the component 100 on the board 200.

[0086] Moreover, in the mounting system 1 according to the embodiment, the target position Po1 is corrected while moving the mounting head 2. This makes it possible to further improve productivity.

[0087] Moreover, in the mounting system 1 according to the embodiment, the target position Po1 is corrected before the capture unit 22 reaches the pre-correction target position Po11, which makes it possible to further improve productivity.

[0088] Moreover, in the mounting system 1 according to the embodiment, the detection unit 235 acquires a time series position Po2 synchronized with the captured image 300 from among the multiple time series positions Po2 stored in the storage unit 234, and sets the search frame 301 in the captured image 300 based on the acquired time series position Po2. This makes it possible to reduce the effect of an output delay of the captured image 300 on the detection accuracy of the capture point Pa1.

[0089] Moreover, according to the mounting system 1 according to the embodiment, it is possible to set the search frame 301 in accordance with the size of the trapping point Pa1, and as a result, it is possible to further shorten the time required to detect the trapping point Pa1.

[0090] Furthermore, according to the mounting system 1 of the embodiment, the search frame 301 can be set so as not to include the component 100 adjacent to the pre-correction target position Po11, thereby making it possible to further improve the detection accuracy of the capture location Pa1.

[0091] (6) Variations The above-described embodiment is merely one of various embodiments of the present disclosure. The above-described embodiment can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. In addition, functions similar to the mounting method according to the above-described embodiment may be embodied in a mounting system 1, a (computer) program, or a non-transitory recording medium on which a program is recorded, etc.

[0092] Modifications of the above-described embodiment are listed below. The modifications described below can be applied in appropriate combination.

[0093] The implementation subject of the mounting system 1, the control system 10, or the mounting method in the present disclosure includes a computer system. The computer system is mainly composed of a processor and a memory as hardware. The processor executes a program recorded in the memory of the computer system, thereby realizing the function of the implementation subject of the mounting system 1, the control system 10, or the mounting method in the present disclosure. The program may be pre-recorded in the memory of the computer system, may be provided through an electric communication line, or may be provided by being recorded in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuits such as IC or LSI referred to here are called by different names depending on the degree of integration, and include integrated circuits called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). Furthermore, a field-programmable gate array (FPGA) that is programmed after the manufacture of the LSI, or a logic device that can reconfigure the connection relationship inside the LSI or the circuit partition inside the LSI, can also be adopted as a processor. The electronic circuits may be integrated in one chip or distributed among multiple chips. The chips may be integrated in one device or distributed among multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Thus, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

[0094] Furthermore, it is not essential for the mounting system 1 that multiple functions are concentrated in one housing, and the components of the mounting system 1 may be distributed across multiple housings. Furthermore, at least some of the functions of the mounting system 1, for example, some of the functions of the control device 3, may be realized by the cloud (cloud computing) or the like. The same applies to the control system 10.

[0095] Conversely, in the above-described embodiment, at least some of the functions of the mounting system 1 that are distributed among multiple devices may be integrated into one housing. For example, some of the functions of the mounting system 1 that are distributed between the mounting head 2 and the control device 3 may be integrated into one housing.

[0096] In the above embodiment, the imaging device 23 captures an image of an area including the capture location Pa1 (see FIG. 2) of the component 100, and the detection section 235 of the control section 233 sets a search frame 301 within the captured image 300 of the imaging device 23, and detects the capture location Pa1 using the search frame 301. In contrast to this, the imaging device 23 may capture an image of an area including the mounting location Pa2 (see FIG. 2) of the component 100 on the board 200, and the detection section 235 of the control section 233 may set the search frame 301 within the captured image 300 of the imaging device 23, and detect the mounting location Pa2 using the search frame 301. Furthermore, both of these may be performed.

[0097] Also, in the above embodiment, while the mounting head 2 is moving, the detection unit 235 sets the search frame 301, the detection unit 235 detects the capture location Pa1, and the correction unit 236 corrects the target position Po1. In contrast to this, while the mounting head 2 is moving, only the setting of the search frame 301 by the detection unit 235 may be performed, or the setting of the search frame 301 by the detection unit 235 and the detection of the capture location Pa1 by the detection unit 235 may be performed. In other words, "the control unit 233 corrects the target position Po1 while the mounting head 2 is moving" means that at least the detection unit 235 sets the search frame 301 while the mounting head 2 is moving.

[0098] (Aspect) The present specification discloses the following aspects.

[0099] The mounting system (1) according to the first aspect includes a mounting head (2), a moving device (4), an imaging device (23), and a control unit (233). The mounting head (2) has a capturing unit (22) that captures a component (100), and mounts the component (100) captured by the capturing unit (22) on a board (200). The moving device (4) positions the capturing unit (22) of the mounting head (2) at a capturing location (Pa1) of the component (100) or a mounting location (Pa2) of the component (100) on the board (200). The imaging device (23) is provided on the mounting head (2) and captures an image of an area including the capturing location (Pa1) or the mounting location (Pa2). The control unit (233) corrects a target position (Po1) at which the capturing unit (22) is positioned based on an image (300) captured by the imaging device (23). The control unit (233) has a detection unit (235) and a correction unit (236). The detection unit (235) sets a search frame (301) including a target position (Po11) before correction in the captured image (300) in the captured image (300), and detects a capture point (Pa1) or a mounting point (Pa2) in the set search frame (301). The correction unit (236) corrects the target position (Po1) based on the position of the capture point (Pa1) or the mounting point (Pa2) detected by the detection unit (235).

[0100] In this embodiment, when detecting the capture location (Pa1) of the component (100) or the mounting location (Pa2) of the component (100) on the board (200), the search frame (301) set in the captured image (300) is scanned. Therefore, compared to scanning the entire captured image (300), it is possible to reduce the time required to detect the capture location (Pa1) or the mounting location (Pa2), which results in improved productivity. In addition, since the target position (Po1) is corrected based on the position of the capture location (Pa1) or the mounting location (Pa2) within the search frame (301), it is also possible to improve the mounting accuracy of the component (100) on the board (200). In other words, according to this embodiment, it is possible to achieve both productivity and mounting accuracy of the component (100) on the board (200).

[0101] In the mounting system (1) according to the second embodiment, in the first embodiment, the control unit (233) corrects the target position (Po1) during the movement of the mounting head (2).

[0102] According to this embodiment, since the target position (Po1) is corrected while the mounting head (2) is being moved, it is possible to further improve productivity.

[0103] In the mounting system (1) according to the third aspect, in the first or second aspect, the control unit (233) corrects the target position (Po1) before the capture unit (22) reaches the pre-correction target position (Po11).

[0104] According to this embodiment, the target position (Po1) is corrected before the capture portion (22) reaches the pre-correction target position (Po11), which makes it possible to further improve productivity.

[0105] In the mounting system (1) according to the fourth aspect, in the first to third aspects, the control unit (233) stores in the memory unit (234) a plurality of time-series positions (Po2) which are time-series positions of the mounting head (2) acquired by a sensor (44) provided on the moving device (4) during the movement of the mounting head (2). The control unit (233) acquires a time-series position (Po2) synchronized with the captured image (300) from the plurality of time-series positions (Po2) stored in the memory unit (234). The detection unit (235) sets a search frame (301) in the captured image (300) based on the acquired time-series position (Po2).

[0106] According to this aspect, it is possible to reduce the effect of an output delay of the captured image (300) on the detection accuracy of the capture location (Pa1) or the mounting location (Pa2).

[0107] In the mounting system (1) according to the fifth aspect, in any one of the first to fourth aspects, the control unit (233) adjusts the size of the search frame (301) read from the storage unit (234) that stores the search frame (301) based on information on the size of the capture location (Pa1) or the mounting location (Pa2) detected by the detection unit (235). The control unit (233) updates the search frame (301) stored in the storage unit (234) to the adjusted search frame (301).

[0108] According to this aspect, a search frame (301) can be set according to the size of the capture location (Pa1) or the mounting location (Pa2), thereby making it possible to further shorten the time required to detect the capture location (Pa1) or the mounting location (Pa2).

[0109] In the mounting system (1) according to the sixth aspect, in the fifth aspect, when a component (100) adjacent to the pre-correction target position (Po11) in the captured image (300) exists, the control unit (233) adjusts the size of the search frame (301) based on information regarding the distance between the pre-correction target position (Po11) and the adjacent component (100).

[0110] According to this embodiment, the search frame (301) can be set so as not to include adjacent components (100), which makes it possible to further improve the detection accuracy of the capture location (Pa1) or mounting location (Pa2).

[0111] The mounting method according to the seventh aspect includes an imaging step and a control step. In the imaging step, an area including a capture location (Pa1) of the component (100) or a mounting location (Pa2) of the component (100) on the board (200) where the capture location (22) of the capture unit (22) of the mounting head (2) is positioned is imaged by an imaging device (23) provided on the mounting head (2). In the control step, a target position (Po1) where the capture unit (22) is positioned is corrected based on an image (300) captured by the imaging device (23) in the imaging step. The control step includes a detection step and a correction step. In the detection step, a search frame (301) including a target position (Po11) before correction in the captured image (300) is set in the captured image (300), and the capture location (Pa1) or the mounting location (Pa2) in the set search frame (301) is detected. In the correction step, the target position (Po1) is corrected based on the position of the capture point (Pa1) or the mounting point (Pa2) detected in the detection step.

[0112] In this embodiment, when detecting the capture location (Pa1) of the component (100) or the mounting location (Pa2) of the component (100) on the board (200), the search frame (301) set in the captured image (300) is scanned. Therefore, compared to scanning the entire captured image (300), it is possible to reduce the time required to detect the capture location (Pa1) or the mounting location (Pa2), which results in improved productivity. In addition, since the target position (Po1) is corrected based on the position of the capture location (Pa1) or the mounting location (Pa2) within the search frame (301), it is also possible to improve the mounting accuracy of the component (100) on the board (200). In other words, according to this embodiment, it is possible to achieve both productivity and mounting accuracy of the component (100) on the board (200).

[0113] A control system (10) according to an eighth aspect includes an imaging device (23) and a control unit (233). The imaging device (23) captures an image of a region including a capture location (Pa1) of the component (100) or a mounting location (Pa2) of the component (100) on the board (200) where the capture unit (22) of the mounting head (2) that mounts the component (100) captured by the capture unit (22) on the board (200) is positioned. The control unit (233) corrects a target position (Po1) where the capture unit (22) is positioned based on an image (300) captured by the imaging device (23). The control unit (233) includes a detection unit (235) and a correction unit (236). The detection unit (235) sets a search frame (301) including a target position (Po11) before correction in the captured image (300) in the captured image (300), and detects a capture location (Pa1) or a mounting location (Pa2) in the set search frame (301). The correction unit (236) corrects the target position (Po1) based on the position of the capture location (Pa1) or the mounting location (Pa2) detected by the detection unit (235).

[0114] In this embodiment, when detecting the capture location (Pa1) of the component (100) or the mounting location (Pa2) of the component (100) on the board (200), the search frame (301) set in the captured image (300) is scanned. Therefore, compared to scanning the entire captured image (300), it is possible to reduce the time required to detect the capture location (Pa1) or the mounting location (Pa2), which results in improved productivity. In addition, since the target position (Po1) is corrected based on the position of the capture location (Pa1) or the mounting location (Pa2) within the search frame (301), it is also possible to improve the mounting accuracy of the component (100) on the board (200). In other words, according to this embodiment, it is possible to achieve both productivity and mounting accuracy of the component (100) on the board (200).

[0115] The configurations according to the second to sixth aspects are not essential to the mounting system (1) and can be omitted as appropriate. [Explanation of symbols]

[0116] 1. Mounting system 2 Mounting head 4. Mobile Devices 10. Control System 22 Capture unit 23 Imaging device 44 Encoder (sensor) 100 parts 200 boards 233 Control Unit 234 Storage section 235 Detector 236 Correction Section 300 captured images 301 Search Slot Pa1 capture location Pa2 implementation location Po1 target position Po2 Time series position Po11 Target position before correction

Claims

1. a mounting head having a capturing portion for capturing a component and for mounting the component captured by the capturing portion onto a board; a moving device that positions the capturing portion of the mounting head at a capturing location of the component or a mounting location of the component on the board; an imaging device provided in the mounting head for imaging an area including the capture location or the mounting location; a control unit that corrects a target position at which the capture unit is positioned based on an image captured by the imaging device, The control unit is a detection unit that sets a search frame in the captured image that includes the target position before correction in the captured image and detects the capture location or the mounting location within the set search frame; a correction unit that corrects the target position based on the position of the capture point or the mounting point detected by the detection unit, Implementation system.

2. The control unit corrects the target position during movement of the mounting head. The mounting system according to claim 1 .

3. The control unit corrects the target position before the capture unit reaches the target position before the correction. The mounting system according to claim 1 or 2.

4. The control unit is storing a plurality of time-series positions of the mounting head acquired by a sensor provided on the movement device during the movement of the mounting head in a storage unit; acquiring a time series position synchronized with the captured image from among the plurality of time series positions stored in the storage unit; the detection unit sets the search frame within the captured image based on the acquired time-series position. The mounting system according to claim 1 or 2.

5. The control unit is adjusting a size of the search frame read from a storage unit that stores the search frame based on information about a size of the capture portion or the mounting portion detected by the detection unit; updating the search frame stored in the storage unit to the adjusted search frame; The mounting system according to claim 1 or 2.

6. the control unit, when a component adjacent to the target position before correction in the captured image exists, adjusts a size of the search frame based on information regarding a distance between the target position before correction and the adjacent component. The mounting system according to claim 5 .

7. an imaging step of imaging an area including a capture location of the component or a mounting location of the component on the board where the capture location of the component is positioned by an imaging device provided on the mounting head, the capture location being mounted on the board by the capture location of the component of a mounting head; and a control step of correcting a target position at which the capture unit is positioned based on an image captured by the imaging device in the imaging step, The control step includes: a detection step of setting a search frame in the captured image including the target position before correction in the captured image, and detecting the capture location or the mounting location within the set search frame; and a correction step of correcting the target position based on the position of the capture point or the mounting point detected in the detection step. How to implement it.

8. an imaging device that images a capture location of the component or an area including a mounting location on the board where the capture location of the component is positioned, the capture location being a location of the component captured by the capture location of a mounting head that mounts the component onto a board; a control unit that corrects a target position at which the capture unit is positioned based on an image captured by the imaging device, The control unit is a detection unit that sets a search frame in the captured image that includes the target position before correction in the captured image and detects the capture location or the mounting location within the set search frame; a correction unit that corrects the target position based on the position of the capture point or the mounting point detected by the detection unit, Control system.

Images