Print circuit board

Abstract

To provide a print circuit board having a high quality.SOLUTION: A print circuit board includes: an insulation layer; a conductive layer 10 formed onto the insulation layer; an adhesion layer 100 that is formed on to the insulation layer 10, and is made from an organic material; and a resin insulation layer 20 that is formed onto the insulation layer and the conductive layer 10. The resin insulation layer 20 includes a resin 80 and an inorganic particle 90 that is scattered into the resin 80. A front surface of the insulation layer 10 is substantially a flatness. The adhesion layer 100 is formed by a smooth film 110 and a projection part 120 projected from the smooth film 110. The projection part 120 is formed by a plurality of projections 122. A space 130 between the plurality of projections 122 is filled with the resin insulation layer 20. The number of inorganic particles 90 in the space 130 per predetermined area is smaller than the number of inorganic particles 90 of the outside of the space 130 per predetermined area.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The technology disclosed in this specification relates to printed wiring boards. [Background technology]

[0002] Patent Document 1 discloses a method for manufacturing a multilayer printed wiring board, which includes sequentially laminating a conductor circuit and an interlayer resin insulating layer on a substrate, and forming a layer containing a triazine compound on at least a part of the surface of the conductor circuit. The conductor circuit and the interlayer resin insulating layer are bonded via the layer containing a triazine compound. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-203462 A Summary of the Invention

[0004] [Problem of Patent Document 1] In a printed wiring board manufactured using the technology of Patent Document 1, if a large stress acts between the conductor circuit and the interlayer resin insulation layer, peeling is predicted to occur between the conductor circuit and the interlayer resin insulation layer. For example, if the number of conductor layers in the build-up layer is 5 or more, it is considered that the stress acting between the conductor circuit and the interlayer resin insulation layer will increase. If the number of conductor layers in the build-up layer is 5 or more, peeling is predicted to occur between the conductor circuit and the interlayer resin insulation layer. For example, if the length of each side of the printed wiring board exceeds 50 mm, peeling is predicted to occur between the conductor circuit and the interlayer resin insulation layer. [Means for solving the problem]

[0005] The printed wiring board of the present invention comprises an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer and made of an organic material, and a resin insulating layer formed on the insulating layer and the conductor layer. The resin insulating layer contains resin and inorganic particles dispersed in the resin. The surface of the conductor layer is approximately smooth. The adhesive layer is formed of a smooth film and a protruding portion protruding from the smooth film. The protruding portion is formed of a plurality of protrusions. The space between the plurality of protrusions is filled with the resin insulating layer. The number (B1) of the inorganic particles within the space per given area is smaller than the number (B2) of the inorganic particles outside the space per given area.

[0006] The printed wiring board according to the embodiment of the present invention has an adhesive layer sandwiched between a conductor layer and a resin insulating layer. The adhesive layer bonds the conductor layer and the resin insulating layer. The adhesive layer is formed of a substantially smooth film and a protruding portion protruding from the smooth film. The adhesive layer has irregularities formed by the protruding portion and the smooth film. The protruding portion has irregularities formed by a plurality of protrusions. Therefore, the conductor layer and the resin insulating layer are sufficiently adhered to each other via the adhesive layer. The coefficient of thermal expansion (CTE) of the adhesive layer is different from the CTE of the resin insulating layer. When the printed wiring board is subjected to a thermal shock, the deformation amount of the resin insulating layer filling the space between the protrusions of the adhesive layer is different from the deformation amount of the adhesive layer. In particular, when the resin insulating layer filling the space contains inorganic particles, the difference in the deformation amount between the two is large. If the difference in the deformation amount between the two is large, the protrusions are easily destroyed. In the printed wiring board according to the embodiment, the number of inorganic particles within the space per given area (B1) is smaller than the number of inorganic particles outside the space per given area (B2). The difference in the deformation amount between the resin insulating layer filling the space and the adhesive layer is small. The projections are less likely to be broken. The resin insulating layer is less likely to peel off from the conductor layer. A high-quality printed wiring board is provided. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a cross-sectional view illustrating a printed wiring board according to an embodiment. [Diagram 2] FIG. 2 is an enlarged cross-sectional view illustrating a schematic view of a portion of a printed wiring board. [Figure 3A]1A to 1C are cross-sectional views each showing a schematic diagram of a method for manufacturing a printed wiring board according to an embodiment. [Figure 3B] 1A to 1C are cross-sectional views each showing a schematic diagram of a method for manufacturing a printed wiring board according to an embodiment. [Figure 3C] 1A to 1C are cross-sectional views each showing a schematic diagram of a method for manufacturing a printed wiring board according to an embodiment. [Figure 3D] 1A to 1C are cross-sectional views each showing a schematic diagram of a method for manufacturing a printed wiring board according to an embodiment. [Figure 3E] 1A to 1C are cross-sectional views each showing a schematic diagram of a method for manufacturing a printed wiring board according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] [Embodiment] FIG. 1 is a cross-sectional view showing a printed wiring board 2 of an embodiment. As shown in FIG. 1, the printed wiring board 2 has an insulating layer 4, a first conductor layer 10, a resin insulating layer 20, a second conductor layer 30, and a via conductor 40. The first conductor layer 10 is an example of a conductor layer. The via conductor 40 is formed in an opening 26 formed in the resin insulating layer 20. The printed wiring board 2 has an adhesive layer 100 on the first conductor layer 10. The adhesive layer 100 is sandwiched between the first conductor layer 10 and the resin insulating layer 20. The first conductor layer 10 and the second conductor layer 30 are adjacent to each other. There is no conductor layer between the first conductor layer 10 and the second conductor layer 30.

[0009] The insulating layer 4 is formed using a thermosetting resin. The insulating layer 4 may be a photocurable resin. The insulating layer 4 may contain inorganic particles such as silica. The insulating layer 4 may contain a reinforcing material such as glass cloth. The insulating layer 4 has a third surface 6 and a fourth surface 8 opposite to the third surface 6.

[0010] The first conductor layer 10 is formed on the third surface 6 of the insulating layer 4. The first conductor layer 10 includes a signal wiring 12 and a pad 14. Although not shown in the figure, the first conductor layer 10 also includes a conductor circuit other than the signal wiring 12 and the pad 14. The first conductor layer 10 is mainly formed of copper. The first conductor layer 10 is formed of a seed layer 10a on the insulating layer 4 and an electrolytic plating layer 10b on the seed layer 10a. The surface (top and side) of the first conductor layer 10 is smooth. The surface roughness of the first conductor layer 10 is represented by the root mean square roughness (Rq). The Rq of the surface of the first conductor layer 10 is 0.23 μm or less. It is preferable that the Rq of the surface of the first conductor layer 10 is 0.18 μm or less. It is more preferable that the Rq of the surface of the first conductor layer 10 is 0.1 μm or less.

[0011] The surface of pad 14 is formed of first surface 14a and second surface 14b. First surface 14a is exposed from opening 26 formed in resin insulating layer 20. Second surface 14b is a surface other than first surface 14a. Second surface 14b has a root mean square roughness (Rq) of 0.23 μm or less. First surface 14a is not covered with adhesive layer 100. Second surface 14b is covered with adhesive layer 100. The surface (top and side surfaces) of signal wiring 12 is covered with adhesive layer 100. The side surfaces of first conductor layer 10 are covered with adhesive layer 100.

[0012] The adhesive layer 100 is made of a resin. The adhesive layer 100 is made of an organic material (organic resin). The adhesive layer 100 does not contain inorganic particles. Alternatively, the adhesive layer 100 contains inorganic particles such as silica. When the adhesive layer 100 contains inorganic particles, the diameter of the inorganic particles is several nm. The organic material is a nitrogen-based organic compound. An example of the nitrogen-based organic compound is a tetrazole compound. An example of the nitrogen-based organic compound is disclosed in JP 2015-54987 A. The adhesive layer 100 does not cover the third surface 6 exposed from the first conductor layer 10. The adhesive layer 100 is sandwiched between the first conductor layer 10 and the resin insulating layer 20. The adhesive layer 100 bonds the first conductor layer 10 and the resin insulating layer 20.

[0013] Fig. 2 is an enlarged cross-sectional view showing a part of the adhesive layer 100 formed on the second surface 14b of the pad 14. As shown in Fig. 2, the adhesive layer 100 is formed of a substantially smooth film 110 and a plurality of protrusions 120 protruding from the smooth film 110. The adhesive layer 100 formed on the side of the pad 14 is formed of a smooth film 110 and a plurality of protrusions 120 similar to the adhesive layer 100 shown in Fig. 2. The shape is also similar. The adhesive layer 100 formed on the upper surface and side of the signal wiring 12 is formed of a smooth film 110 and a plurality of protrusions 120 similar to those in Fig. 2. The shape is also similar.

[0014] The smooth film 110 has a substantially uniform thickness T. The thickness T of the smooth film 110 is 10 nm or more and 120 nm or less. The ratio (S1 / S2) of the area (S1) of the smooth film 110 exposed from the protrusion 120 to the area (S2) of the adhesive layer 100 is 0.1 or more and 0.5 or less. The smooth film 110 on the upper surface of the first conductor layer 10 is formed to substantially conform to the shape of the upper surface of the first conductor layer 10. The smooth film 110 on the second surface 14b of the first conductor layer 10 is formed to substantially conform to the shape of the second surface 14b of the first conductor layer 10. The smooth film 110 on the side surface of the first conductor layer 10 is formed to substantially conform to the shape of the side surface of the first conductor layer 10. When undulations are formed on the upper surface and side surface of the first conductor layer 10, the smooth film 110 follows the undulations.

[0015] The protruding portion 120 is formed of a plurality of protrusions 122. The plurality of protrusions 122 form unevenness on the upper surface of the protruding portion 120. 2 The number of protrusions 122 per unit area is 5 or more and 15 or less. The protrusions 120 have heights H1, H2 between the upper surface of the smooth film 110 and the tops of the protrusions 120. The maximum values ​​of the heights H1, H2 are 10 times or more and 30 times or less the thickness T of the smooth film 110. The heights H1, H2 are 200 nm or more and 450 nm or less.

[0016] The resin insulating layer 20 is formed on the first conductor layer 10 via the adhesive layer 100. The resin insulating layer 20 is bonded to the first conductor layer 10 by the adhesive layer 100. The resin insulating layer 20 has a first surface 22 and a second surface 24 opposite to the first surface 22. The second surface 24 of the resin insulating layer 20 faces the first conductor layer 10. The second surface 24 is in contact with the adhesive layer 100. The resin insulating layer 20 has an opening 26 that exposes the pad 14. The first surface 22 of the resin insulating layer 20 has no irregularities. The first surface 22 is not roughened. The first surface 22 is formed smoothly. The thickness of the resin insulating layer 20 is at least twice the thickness of the second conductor layer 30. The thickness of the resin insulating layer 20 is the distance between the first surface 22 and the upper surface of the first conductor layer 10.

[0017] The resin insulation layer 20 has a resin 80 and a large number of inorganic particles 90 dispersed in the resin 80. The resin insulation layer 20 is formed of a resin 80 and a large number of inorganic particles 90 dispersed in the resin 80. The resin 80 is an epoxy resin. Examples of the resin are a thermosetting resin and a photocurable resin. The inorganic particles 90 are, for example, silica or alumina. The amount of the inorganic particles 90 in the resin insulation layer 20 is 70 wt % or more.

[0018] As shown in FIG. 2, there are spaces 130 between the multiple protrusions 122 that form the protruding portion 120 of the adhesive layer 100. The number of spaces 130 is plural. Each space 130 is filled with the resin insulation layer 20. The resin insulation layer 20 in each space 130 necessarily contains the resin 80 derived from the resin insulation layer 20. The resin insulation layer 20 in each space 130 may or may not contain the inorganic particles 90 derived from the resin insulation layer 20. The number (B1) of inorganic particles 90 in the space 130 per given area is smaller than the number (B2) of inorganic particles 90 outside the space 130 per given area. The ratio (number B1 / number B2) of the numbers B1 and B2 is smaller than 0.5. The ratio (number B1 / number B2) may be smaller than 0.1. The ratio (number B1 / number B2) may be 0. When the ratio is 0, the ratio (number B1 / number B2) is expressed as a ratio 0. The resin insulating layer 20 in the space 130 corresponding to the ratio 0 does not contain inorganic particles 90 in the space 130. The number B1 and the number B2 are measured using a cross section of the printed wiring board 2. The cross section used for the measurement is obtained by cutting the printed wiring board 2 on a plane perpendicular to the first surface 22. An example of the predetermined area is 4 μm 2 or more, 25μm 2 The number of measurement points is preferably more than one. Each measurement point is different. An example of the number of measurement points is 5 or more and 30 or less. Number B1 and number B2 are the average values ​​of the numbers of inorganic particles 90 at each measurement point.

[0019] When the resin insulating layer 20 in the multiple spaces 130 is observed, each space 130 is classified into a first space 131 and a second space 132. The first space 131 is filled with only the resin 80. The second space 132 is filled with the inorganic particles 90 and the resin 80. The ratio (N1 / N2) of the number (N1) of the first spaces 131 to the total number (N2) of the spaces 130 is 0.5 or more. More than half of the spaces 130 do not contain the inorganic particles 90. The ratio (N1 / N2) is preferably 0.7 or more. The ratio (N1 / N2) is more preferably 0.85 or more. The ratio (N1 / N2) may be 1. The total number (N2) of the spaces 130 used to calculate the ratio (N1 / N2) is preferably 10 or more. The total number (N2) is the sum of the number of the first spaces 131 and the number of the second spaces 132. The total number (N2) may be represented by the number of measurement points. For example, if ten spaces 130 are evaluated for the presence or absence of inorganic particles, then the total number (N2) is ten.

[0020] As shown in FIG. 1, the second conductor layer 30 is formed on the first surface 22 of the resin insulating layer 20. The second conductor layer 30 includes a first signal wiring 32, a second signal wiring 34, and a land 36. Although not shown in the figure, the second conductor layer 30 also includes a conductor circuit other than the first signal wiring 32, the second signal wiring 34, and the land 36. The first signal wiring 32 and the second signal wiring 34 form a pair wiring. The second conductor layer 30 is mainly formed of copper. The second conductor layer 30 is formed of a seed layer 30a on the first surface 22 and an electrolytic plating layer 30b on the seed layer 30a.

[0021] The via conductor 40 is formed in the opening 26. The via conductor 40 connects the first conductor layer 10 and the second conductor layer 30. In Fig. 1, the via conductor 40 connects the pad 14 and the land 36. The via conductor 40 is formed of a seed layer 30a and an electrolytic plating layer 30b on the seed layer 30a.

[0022] In the embodiment, the length of each side of the printed wiring board 2 is 50 mm or more. The length of each side is preferably 100 mm or more. The length of each side is 250 mm or less.

[0023] [Method of manufacturing a printed wiring board according to an embodiment] 3A to 3E show a method for manufacturing a printed wiring board 2 of an embodiment. Fig. 3A to Fig. 3E are cross-sectional views. Fig. 3A shows an insulating layer 4 and a first conductor layer 10 formed on a third surface 6 of the insulating layer 4. The first conductor layer 10 is formed by a semi-additive method.

[0024] As shown in FIG. 3B, an adhesive layer 100 is formed on the upper surface and side surface of the first conductor layer 10. For example, the adhesive layer 100 is formed by immersing the intermediate substrate shown in FIG. 3A in a chemical solution containing a nitrogen-based organic compound. The pH of the chemical solution is 7 or less. By immersing the intermediate substrate in the chemical solution, an adhesive layer 100 including a smooth film 110 and a protruding portion 120 is formed on the upper surface and side surface of the first conductor layer 10. Before the intermediate substrate is immersed in the chemical solution, the oxide film on the upper surface and side surface of the first conductor layer 10 is removed. In the modified example, the adhesive layer 100 is formed by applying a chemical solution on the first conductor layer 10. When the adhesive layer 100 is formed, the intermediate substrate is removed from the chemical solution. The adhesive layer 100 is dried. The upper surface of the adhesive layer 100 before drying may be smooth. In that case, a part of the adhesive layer 100 is coagulated by drying. By coagulation, an adhesive layer 100 including a smooth film 110 and a protruding portion 120 is formed.

[0025] A resin insulating layer 20 is formed on the first conductor layer 10 covered with an adhesive layer 100. The second surface 24 of the resin insulating layer 20 faces the third surface 6 of the insulating layer 4. The second surface 24 contacts the adhesive layer 100. A space 130 exists between adjacent protrusions 122. The space 130 between the multiple protrusions 122 is filled with the resin insulating layer 20. Each space 130 is filled with the resin insulating layer 20. The size of the space 130 is small. The size of the space 130 varies. Complex unevenness is formed by the protrusions 122. Therefore, a space 132 filled with the resin insulating layer 20 containing the inorganic particles 90 and a space 131 filled with the resin insulating layer 20 not containing the inorganic particles 90 are mixed. Alternatively, the entire space is filled with the resin insulating layer 20 not containing the inorganic particles 90.

[0026] As shown in FIG. 3C, laser light L is irradiated from above the resin insulating layer 20. The laser light L penetrates the resin insulating layer 20. The laser light L penetrates the adhesive layer 100 covering the pad 14 and reaches the pad 14. Alternatively, the adhesive layer 100 is not completely removed by the laser light L. The bottom of the opening 26 is formed by the adhesive layer 100. An opening 26 for a via conductor leading to the pad 14 is formed. Alternatively, an opening 26 for a via conductor leading to the adhesive layer 100 is formed. The adhesive layer 100 covering the pad 14 is exposed by the opening 26. The laser light L is, for example, a UV laser light or a CO2 laser light. In the example of FIG. 3C, the bottom of the opening 26 is formed by the adhesive layer 100.

[0027] As shown in FIG. 3D, the inside of the opening 26 is cleaned. If the adhesive layer 100 is not completely removed by the laser light L, the adhesive layer 100 exposed from the opening 26 is removed by cleaning the inside of the opening 26. The first surface 14a of the pad 14 is exposed from the opening 26. Resin residue generated when the opening 26 is formed is removed. The inside of the opening 26 is cleaned by plasma. That is, the cleaning is performed by a dry process. In the embodiment, cleaning can be performed using a chemical solution containing an oxidizing agent. An example of the oxidizing agent is potassium permanganate. The cleaning includes a desmear process. The adhesive layer 100 formed between the second surface 24 of the resin insulating layer 20 and the pad 14 is not removed. Therefore, no gap is formed between the second surface 24 of the resin insulating layer 20 and the pad 14.

[0028] 3E, a seed layer 30a is formed on the first surface 22 of the resin insulating layer 20. The seed layer 30a is formed by electroless plating. The seed layer 30a may also be formed by sputtering.

[0029] A plating resist is formed on the seed layer 30a. The plating resist has openings for forming the first signal wiring 32, the second signal wiring 34, and the lands 36.

[0030] An electrolytic plating layer 30b is formed on the seed layer 30a exposed from the plating resist. The electrolytic plating layer 30b is made of copper. The electrolytic plating layer 30b fills the opening 26. The seed layer 30a and the electrolytic plating layer 30b on the first surface 22 form a first signal wiring 32, a second signal wiring 34, and a land 36. The second conductor layer 30 is formed. The seed layer 30a and the electrolytic plating layer 30b in the opening 26 form a via conductor 40. The via conductor 40 connects the pad 14 and the land 36. The first signal wiring 32 and the second signal wiring 34 form a pair wiring.

[0031] The plating resist is removed. The seed layer 30a exposed from the electrolytic plating layer 30b is removed. The second conductor layer 30 and the via conductors 40 are formed simultaneously. The printed wiring board 2 of the embodiment is obtained.

[0032] The printed wiring board 2 of the embodiment has an adhesive layer 100 sandwiched between the first conductor layer 10 and the resin insulating layer 20. The adhesive layer 100 bonds the first conductor layer 10 and the resin insulating layer 20. The adhesive layer 100 is formed of a substantially smooth film 110 and a protruding portion 120 protruding from the smooth film 110. The adhesive layer 100 has unevenness formed by the protruding portion 120 and the smooth film 110. The protruding portion 120 has unevenness formed by a plurality of protrusions 122. Therefore, the first conductor layer 10 and the resin insulating layer 20 are sufficiently adhered to each other via the adhesive layer 100. For example, even if the length of each side of the printed wiring board 2 is 50 mm or more, the resin insulating layer 20 is unlikely to peel off from the first conductor layer 10. Even if the length of each side of the printed wiring board 2 is 100 mm or more, cracks caused by the adhesive layer 100 are unlikely to occur in the resin insulating layer 20.

[0033] The coefficient of thermal expansion (CTE) of the adhesive layer 100 and the CTE of the resin insulating layer 20 are different. For example, the amount of inorganic particles in each layer is different. Alternatively, the resin insulating layer 20 contains inorganic particles 90, and the adhesive layer 100 does not contain inorganic particles. Alternatively, the CTE of the resin forming the adhesive layer 100 and the CTE of the resin forming the resin insulating layer 20 are different. When the printed wiring board 2 is subjected to a thermal shock, the deformation amount of the adhesive layer 100 and the deformation amount of the resin insulating layer 20 are different. Alternatively, the deformation amount of the resin insulating layer 20 filling the space 130 and the deformation amount of the adhesive layer 100 are different. In particular, when the resin insulating layer 20 filling the space 130 contains inorganic particles 90, the difference in the deformation amount between the two is large. If the difference in the deformation amount between the two is large, the protrusion 122 is easily broken. In the printed wiring board 2 of the embodiment, the number (B1) of inorganic particles 90 in the space 130 per given area is smaller than the number (B2) of inorganic particles 90 outside the space 130 per given area. The difference between the amount of deformation of resin insulation layer 20 filling space 130 and the amount of deformation of adhesive layer 100 is small. Alternatively, the CTE of adhesive layer 100 is greater than the CTE of resin insulation layer 20 filling space 130, and the CTE of resin insulation layer 20 filling space 130 is greater than the CTE of resin insulation layer 20 outside the space. These CTEs gradually increase. Each CTE gradually changes. Therefore, protrusion 122 is less likely to be destroyed. Resin insulation layer 20 is less likely to peel off from first conductor layer 10. A high-quality printed wiring board 2 is provided.

[0034] In the printed wiring board 2 of the embodiment, the Rq of the surface (upper surface and side surface) of the first conductor layer 10 is 0.23 μm or less. Therefore, when data is transmitted through the conductor circuit included in the first conductor layer 10, there is little transmission loss. When high-speed signals are transmitted, noise is unlikely to occur. The printed wiring board 2 of the embodiment can transmit high-speed signals with low loss and suppress peeling between the conductor layer and the resin insulating layer. A high-quality printed wiring board 2 is provided.

[0035] [Example 1 of the embodiment] The printed wiring board 2 of the modified example 1 of the embodiment has a plurality of conductor layers, a plurality of interlayer resin insulation layers, and a plurality of via conductors. The conductor layers and the interlayer resin insulation layers are alternately laminated. Adjacent conductor layers are connected by via conductors. In the modified example 1, the number of conductor layers is 5 or more and 20 or less. The thickness of each interlayer resin insulation layer is approximately equal. In the printed wiring board 2, the conductor layers and the interlayer resin insulation layers can be bonded with the adhesive layer 100. In the embodiment and the modified example 1, the configuration and shape of the adhesive layer 100 are similar. The adhesive layer 100 is formed on the upper surface and the side surface of the conductor layer as in the embodiment. The adhesive layer 100 is sandwiched between the conductor layer and the interlayer resin insulation layer. Even if the number of conductor layers is 5 or more, the interlayer resin insulation layer is unlikely to peel off from the conductor layer. Since the number of conductor layers is 20 or less, cracks caused by the adhesive layer 100 are unlikely to occur in the interlayer resin insulation layer. The number of conductor layers is preferably 10 or more. It is more preferable that the number of conductor layers is 15 or more. The adhesive layer 100 works effectively.

[0036] The printed wiring board 2 in FIG. 1 has two conductor layers (a first conductor layer 10 and a second conductor layer 30). The number of the first conductor layers 10 is one. The number of the second conductor layers 30 is one. The first conductor layer 10 and the second conductor layer 30 are included in the conductor layers of the modified example 1. The resin insulating layer 20 in FIG. 1 is included in the interlayer resin insulating layer of the modified example 1. In the modified example 1, the conductor layer other than the first conductor layer 10 and the second conductor layer 30 is the third conductor layer. In the modified example 1, one of the multiple interlayer resin insulating layers is formed directly on the resin insulating layer 20 and the second conductor layer 30. The interlayer resin insulating layer formed directly on the resin insulating layer 20 and the second conductor layer 30 is the first interlayer resin insulating layer. In the modified example 1, an adhesive layer 100 is formed between the first interlayer resin insulating layer and the second conductor layer 30. Alternatively, the adhesive layer 100 is not formed between the first interlayer resin insulating layer and the second conductor layer 30. The conductor layer of the modified example 1 is similar to the first conductor layer 10 of the embodiment. The Rq of both is similar.

[0037] [Another Example 2 of the embodiment] In Variant Example 2, a conductor layer is formed under the insulating layer 4 of the printed wiring board 2 in FIG. 1. The insulating layer 4 is formed of the resin insulating layer 20 in FIG. 1. The conductor layer and the first conductor layer 10 are connected by a via conductor that penetrates the resin insulating layer sandwiched between the conductor layer and the first conductor layer 10. Variant Example 2 is similar to the embodiment, except that a conductor layer is formed under the insulating layer 4, the insulating layer 4 is formed of the resin insulating layer 20, and a via conductor is formed in the resin insulating layer that sandwiches the conductor layer and the first conductor layer 10. The conductor layer in Variant Example 2 is similar to the first conductor layer 10 of the embodiment. The Rq of both is similar. [Explanation of symbols]

[0038] 2: Printed wiring board 4: Insulating layer 10: First conductor layer 20: Resin insulation layer 30: Second conductor layer 40: Via conductor 90: Inorganic particles 100: Adhesive layer 110: Smooth film 120:Protrusion 122: Protrusion 130: Space 131: First Space 132: Second Space T: Thickness H1,H2:Height

Claims

1. An insulating layer; A conductor layer formed on the insulating layer; an adhesive layer formed on the conductor layer and made of an organic material; A printed wiring board having the insulating layer and a resin insulating layer formed on the conductor layer, The resin insulation layer has a resin and inorganic particles dispersed in the resin, The surface of the conductor layer is substantially smooth, The adhesive layer is formed of a smooth film and a protruding portion protruding from the smooth film, The protruding portion is formed of a plurality of protrusions, The spaces between the protrusions are filled with the resin insulating layer, and the number (B1) of the inorganic particles within the spaces per given area is smaller than the number (B2) of the inorganic particles outside the spaces per given area.

2. 2. The printed wiring board according to claim 1, wherein the conductor layer has a surface having a root mean square roughness (Rq) of 0.23 μm or less.

3. 2. The printed wiring board according to claim 1, wherein a ratio of said number B1 to said number B2 (said number B1 / said number B2) is smaller than 0.

5.

4. 4. The printed wiring board according to claim 3, wherein the ratio (the number B1 / the number B2) is zero.

5. 2. The printed wiring board of claim 1, wherein the number of the spaces is multiple, the multiple spaces are classified into first spaces and second spaces, the first spaces are filled with only the resin, and the second spaces are filled with the inorganic particles and the resin, and a ratio (N1 / N2) of the number of the first spaces (N1) to the total number of the spaces (N2) is 0.5 or more.

6. 6. The printed wiring board according to claim 5, wherein the ratio (N1 / N2) is 1.

7. 2. A printed wiring board according to claim 1, wherein the smoothing film has a substantially uniform thickness, the protrusion has a height between an upper surface of the smoothing film and a top of the protrusion, and the maximum value of the height is 10 times or more and 30 times or less than the thickness.

8. 2. The printed wiring board of claim 1, wherein the smoothing film has a substantially uniform thickness, the thickness being 10 nm or more and 120 nm or less, and the protrusion has a height between an upper surface of the smoothing film and a top of the protrusion, the height being 200 nm or more and 450 nm or less.

9. 2. The printed wiring board according to claim 1, wherein a ratio of an area of ​​the smoothing film exposed from the protruding portion to an area of ​​the adhesive layer is 0.1 or more and 0.5 or less.

10. 2. The printed wiring board according to claim 1, wherein the adhesive layer does not cover the insulating layer that is exposed from the conductor layer.

11. 2. The printed wiring board of claim 1, ２ The number of the protrusions per unit area is 5 or more and 15 or less.

Images