Bonding device, method, and program

Abstract

To improve mounting quality by suppressing a displacement of a mounting position with a change of a mounting height.SOLUTION: A bonding device comprises: a bonding tool to which an imaging reference is attached; a first imaging section for imaging the imaging reference attached to the bonding tool; a support member which supports the bonding tool in a vertically drivable manner and supports the first imaging section; a measurement section which measures a first position of the imaging reference at a first height and a second position of the imaging reference at a second height different from the first height on the basis of image data picked up by the first imaging section; and a detection section for detecting a first relative position of the first position and the second position.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a bonding apparatus, a bonding method, and a program. [Background technology]

[0002] A bonding device is a device that bonds (mounts) a semiconductor chip onto a substrate or another semiconductor chip. Bonding devices include die bonding devices that fix the surface of a semiconductor chip opposite to its electrode surface to a substrate using adhesives, and flip chip bonding devices that flip a semiconductor chip picked up from a wafer and directly bond the electrode surface of the semiconductor chip to a substrate, etc. For example, a flip chip bonding device directly bonds the electrodes of the semiconductor chip and the electrodes of the substrate, so it is necessary to accurately align the positions of the electrodes of the semiconductor chip and the electrodes of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6256486 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology described in Patent Document 1 is equipped with a dual-view camera that simultaneously captures images from above and below, which generates measurement errors due to temperature increases. In this technology, when the dual-view camera exceeds a predetermined temperature, a correction sequence is executed to detect the amount of correction for the offset. As a result, the technology described in Patent Document 1 can appropriately correct measurement errors that occur in the dual-view camera, thereby suppressing positional deviations of the mounting device over time and improving mounting quality.

[0005] However, generally, when the bonding device moves in the height direction, measurement errors (deviations) may occur due to the movement in the height direction, which may cause a problem that the semiconductor chip cannot be mounted in the correct mounting position.

[0006] Therefore, the present invention has been made to solve such problems, and has an object to suppress deviation of the mounting position caused by changes in the mounting height and improve mounting quality. [Means for solving the problem]

[0007] A bonding apparatus in one embodiment of the present invention includes a bonding tool having an imaging reference attached thereto, a first imaging unit that images the imaging reference attached to the bonding tool, a support member that supports the bonding tool so that it can be moved in the vertical direction and supports the first imaging unit, a measurement unit that measures a first position of the imaging reference at a first height and a second position of the imaging reference at a second height different from the first height based on image data captured by the first imaging unit, and a detection unit that detects a first relative position between the first position and the second position.

[0008] A method in one embodiment of the present invention is a method for controlling a bonding apparatus comprising a bonding tool to which an imaging reference is attached, a first imaging unit that images the imaging reference attached to the bonding tool, and a support member that supports the bonding tool so that it can be moved in the vertical direction and supports the first imaging unit, the method including imaging a first position of the imaging reference at a first height by the first imaging unit, imaging a second position of the imaging reference at a second height different from the first height by the first imaging unit, measuring the first position of the imaging reference at the first height and the second position of the imaging reference at the second height based on image data captured by the first imaging unit, and detecting a relative position between the first position and the second position.

[0009] A program in one embodiment of the present invention causes a computer of a bonding control unit in a bonding apparatus comprising a bonding tool to which an imaging reference is attached, a first imaging unit for imaging the imaging reference attached to the bonding tool, a support member for supporting the bonding tool so that it can be moved in an upward and downward direction and supporting the first imaging unit, and a bonding control unit to perform the following operations: imaging a first position of the imaging reference at a first height using the first imaging unit, imaging a second position of the imaging reference at a second height different from the first height using the first imaging unit, measuring the first position of the imaging reference at the first height and the second position of the imaging reference at the second height based on image data captured by the first imaging unit, and detecting the relative position of the first position and the second position. Effect of the Invention

[0010] According to the present invention, it is possible to suppress deviation of the mounting position caused by a change in mounting height, and to improve mounting quality. [Brief description of the drawings]

[0011] [Figure 1] 1 is a side view showing a schematic configuration of a bonding apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 13 is a diagram showing the position of an imaging reference at a reference height. [Diagram 3] 13 is a diagram showing the amount of deviation of the imaging reference at a bonding position higher than the reference height. FIG. [Figure 4] FIG. 11 is a diagram illustrating an example of a deviation amount database. [Diagram 5] 11 is a flowchart showing the flow of a mounting process including a correction sequence. [Figure 6] 13A and 13B are diagrams illustrating an example of a schematic configuration and operation of a bonding apparatus according to a modified example. [Figure 7] 13A and 13B are diagrams illustrating deviations in the reference height of a bonding apparatus according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] <<Configuration>> The configuration of a bonding apparatus 100 according to this embodiment will be described with reference to Fig. 1. Fig. 1 is a side view showing a schematic configuration of the bonding apparatus 100 according to this embodiment.

[0013] 1, bonding apparatus 100 includes a wafer holding unit 10, a handling unit 20, a bonding head unit 30, a bonding stage unit 40, and a bonding control unit 50. In the following description, directions parallel to the bonding target surface are defined as the X direction and the Y direction, and a direction perpendicular to the bonding target surface is defined as the Z direction.

[0014] The bonding apparatus 100 is an example of a mounting apparatus for mounting a semiconductor chip 61 (also called a "die") of a wafer 60 on a substrate 70. An integrated circuit pattern is formed on the surface of the semiconductor chip 61. The bonding apparatus 100, for example, aligns the semiconductor chip 61 with the substrate 70 and bonds the semiconductor chip 61 to the substrate 70 so that the back surface of the semiconductor chip 61 faces the substrate 70. The bonding apparatus 100 is, for example, a flip chip bonder or a die bonding apparatus.

[0015] The wafer holding unit 10 is a member that holds the wafer 60. The wafer 60 includes a plurality of semiconductor chips 61 that have been diced into a grid pattern. The wafer holding unit 10 holds the plurality of semiconductor chips 61, for example, by vacuum suction. The wafer holding unit 10 may hold the plurality of semiconductor chips 61 by, for example, attaching the wafer 60 onto a film.

[0016] The handling unit 20 includes, for example, a stepping motor 21, a rotating shaft 22, an arm 23, a base 24, and a pickup tool 25. The stepping motor 21 rotates the rotating shaft 22 to invert the base 24 and the pickup tool 25. One end of the arm 23 is attached to the rotating shaft 22 and extends obliquely downward in the Z direction from the rotating shaft 22, and the other end is attached to an upper surface 24a in the Z direction of the base 24. The base 24 is fixed to the tip of the arm 23 with a bolt or the like. The pickup tool 25 is attached to a lower surface 24b in the Z direction of the base 24. The pickup tool 25 is configured to be movable in the Z direction.

[0017] The handling unit 20 moves the handling unit 20 to above the wafer holding part 10 with the pickup tool 25 facing downward. The handling unit 20 also adsorbs the semiconductor chip 61 from above using the pickup tool 25. Meanwhile, the stepping motor 21 rotates the rotation shaft 22 and inverts the base 24 and the pickup tool 25, so that the lower surface 24b of the base 24 faces upward in the Z direction and the pickup tool 25 faces upward. As a result, the handling unit 20 inverts the picked-up semiconductor chip 61.

[0018] The bonding head unit 30 adsorbs the semiconductor chip 61 picked up from the wafer holder 10, carries it to the position of the substrate 70, and bonds the semiconductor chip 61 to the substrate 70.

[0019] A bonding tool 32 is attached to the bonding head 30 via a Z-axis drive mechanism 31. A first imaging unit 33 is also attached to the bonding head 30 via a Z-axis drive mechanism (not shown). The bonding head 30 is configured to be movable in the X and Y directions by an XY table 34. The bonding tool 32 and the first imaging unit 33 are configured to be movable together with the bonding head 30 in the X and Y directions.

[0020] The bonding tool 32 is, for example, configured in a rectangular parallelepiped or truncated cone shape, and holds the surface of the semiconductor chip 61 on which an integrated circuit pattern is formed. The bonding tool 32 has, for example, a central axis Ca parallel to the Z direction, and is fixed to the bonding head unit 30 by the Z-axis driving mechanism 31 and the XY table 34 so as to be movable in the Z direction, the X direction, and the Y direction, respectively.

[0021] The bonding tool 32 is attached to the bonding head 30 via a θ-axis drive mechanism and a tilt drive mechanism (not shown). The bonding tool 32 is configured to be movable in a rotational direction around the Z axis and in a tilt direction (inclination direction) by these drive mechanisms.

[0022] The first imaging unit 33 includes, for example, an optical system such as a lens, and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. The first imaging unit 33 has, for example, an optical axis Oa1 along the Z direction, and when positioned above (on the +Z direction side) the bonding stage unit 40, captures an image of the upper surface (surface on the +Z direction side) of the bonding stage unit 40. The first imaging unit 33 is installed on the bonding head unit 30 so as to be movable in the Z direction, the X direction, and the Y direction, respectively, by, for example, a Z-axis driving mechanism (not shown) and an XY table 34. The first imaging unit 33 is also installed on the bonding head unit 30 so that, for example, the optical axis Oa1 and the central axis Ca of the bonding tool 32 are parallel to each other. The first imaging unit 33 also transmits image data, which is an image of an imaging reference 81 described later, to the bonding control unit 50.

[0023] The bonding stage section 40 is a stage for bonding the semiconductor chip 61 to the substrate 70. The bonding stage section 40 has a moving mechanism (not shown) that moves the substrate 70 in the X direction and the Y direction, and a heating mechanism (not shown) that heats the substrate 70.

[0024] The bonding control unit 50 is realized by, for example, a hardware processor such as a CPU (Central Processing Unit) executing a program (software). In addition, some or all of these components may be realized by hardware (including circuitry) such as an LSI (Large Scale Integration), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a GPU (Graphics Processing Unit), or may be realized by a combination of software and hardware. The program may be stored in advance in a storage device such as an HDD or flash memory of the bonding control unit 50, or may be stored in advance in a removable storage medium such as a DVD or CD-ROM, and installed in the HDD or flash memory of the bonding control unit 50 by mounting the storage medium in a drive device.

[0025] The bonding control unit 50 includes, for example, a measurement unit 51, a detection unit 52, a storage unit 53, and a mounting unit .

[0026] In bonding using the bonding tool 32, the positions of the semiconductor chip 61 in the X direction, Y direction, and rotation direction are relatively shifted depending on the height at which the semiconductor chip 61 is bonded to the substrate 70. This is because when the height of the bonding tool 32 is changed due to an increase in temperature of the bonding head unit 30 of the bonding device 100, the position of the bonding tool 32 may shift from a predetermined reference due to the influence of the temperature rise. This position shift causes the bonding position (mounting position) of the semiconductor chip 61 to shift from the predetermined reference, resulting in a problem that the electrodes of the semiconductor chip 61 and the electrodes of the substrate 70 cannot be accurately bonded. Therefore, the bonding control unit 50 measures the amount of position shift depending on the height, and corrects the amount of shift when bonding the semiconductor chip 61 to the substrate 70 to achieve accurate bonding.

[0027] 2 and 3, the processing (functional unit) of the bonding control unit 50 for measuring and storing the amount of misalignment for each height will be described. In order to measure and store the amount of misalignment, the bonding device 100 adsorbs a measurement chip (hereinafter referred to as "measurement chip 80") with an imaging reference 81 attached thereto by the bonding tool 32, and performs image analysis of image data obtained by imaging the imaging reference 81. The measurement chip 80 is, for example, a transparent glass chip having substantially the same thickness as the semiconductor chip 61. The imaging reference 81 is, for example, a mark that can be imaged by the first imaging unit 33 provided on one surface of the measurement chip. The imaging reference 81 has a center point Cp. The processing of each functional unit of the bonding control unit 50 will be specifically described below.

[0028] The measurement unit 51 performs image analysis on the image data of the imaging reference 81 captured by the first imaging unit 33, and measures the position of the imaging reference 81 at a predetermined height. The position of the imaging reference 81 is, for example, the relative position of the center point Cp of the imaging reference 81 with respect to the optical axis Oa1 of the first imaging unit 33. In the following, the reference height Z 0 The position of the imaging reference 81 at the rotation angle θ 0 ,X position 0 ,Y position Y 0 Let the reference height be Z 0 Height Z is higher than 1 The position of the imaging reference 81 at the rotation angle θ 1 ,X position 1 ,Y position Y 1 The reference height Z 0 is, for example, the height of the surface of the substrate 70. 1 For example, the thickness of one semiconductor chip 61 is set as a reference height Z 0 That is, the reference height Z 0 The predetermined height higher than the reference height Z 0 The height depends on the number of stacked semiconductor chips 61, with the reference being the height.

[0029] The rotation angle, X position, and Y position will be described with reference to FIG. 2. FIG. 2 shows the reference height Z 02(b) is a diagram showing the position of the imaging reference 81 in the imaging section 33. The rotation angle is the inclination angle of the center line LC of the first imaging section 33 with respect to the reference line LB of the imaging reference 81. The reference line LB is, for example, a virtual line that is set midway between two end sides in the XY plane that are parallel to the direction extending from the bonding head unit 30 toward the first imaging section 33 in the rectangular measurement chip 80. The center line LC is, for example, a virtual line that is perpendicular to the optical axis Oa1 of the first imaging section 33. Hereinafter, as an example, the reference height Z 0 In the following description, the center line LC overlaps with the reference line LB. That is, in FIG. 2, the rotation angle θ 0 is "0." Furthermore, the X position and the Y position are, for example, the relative positions of the center point Cp of the imaging reference with respect to the optical axis Oa1.

[0030] The detection unit 52 detects the rotation angle, the X position, and the Y position deviation (first relative position) at each height. The deviation is, for example, the difference between the relative position of the center point Cp with respect to the optical axis Oa1 at the first height and the relative position of the center Cp with respect to the optical axis Oa1 at the second height higher than the first height. The detection unit 52 detects, for example, the reference height Z 0 Height Z relative to the position of the imaging reference 81 1 The amount of deviation in the rotation direction, the amount of deviation in the X direction, and the amount of deviation in the Y direction at the position of the imaging reference 81 are detected. 0 Rotation angle θ 0 ,X position 0 ,Y position Y 0 Height Z for 1 The amount of deviation in the rotation direction, the amount of deviation in the X direction, and the amount of deviation in the Y direction at the position of the imaging reference 81 are each defined as a rotational deviation Δθ 1 ,X deviation amount ΔX 1 ,Y deviation amount ΔY 1 This is explained as follows.

[0031] Referring to FIG. 3, the rotational deviation Δθ 1 ,X deviation amount ΔX 1 ,Y deviation amount ΔY 1 FIG. 3 shows the reference height Z 03B is a diagram showing the amount of deviation of the imaging reference 81 at a bonding position higher than the rotational deviation Δθ 1 is the rotation angle θ 1 and the rotation angle θ 0 The angle difference (θ 1 -θ 0 As shown in FIG. 3(c), the X deviation amount ΔX 1 and Y deviation amount ΔY 1 Each of these is, for example, a rotational deviation amount Δθ 1 After correcting, the X position X 0 and Y position Y 0 and X position X 1 and Y position Y 1 Specifically, the amount of X shift ΔX 1 is the reference height Z 0 The X-position X indicates the relative position of the center point Cp of the imaging reference with respect to the optical axis Oa1. 0 and height Z 1 The X-position X indicates the relative position of the center point Cp of the imaging reference with respect to the optical axis Oa1. 1 In Fig. 3(c), the reference height Z 0 Since the optical axis Oa1 of the imaging reference and the center point Cp of the imaging reference overlap, the X position X 0 Since it is "0", the X position X 1 is the amount of deviation ΔX 1 The Y shift amount ΔY 1 is calculated in a similar manner, and therefore the explanation thereof will be omitted.

[0032] The storage unit 53 stores the amount of misalignment for each height detected by the detection unit 52. The storage unit 62 includes a misalignment database D62. The misalignment database D62 will be described with reference to FIG. 4. FIG. 4 is a diagram showing an example of the misalignment database D62. As shown in FIG. 4, the misalignment database D62 stores, for example, the height Zn as a primary key, the rotational misalignment amount Δθ n , X deviation amount ΔX n , Y deviation amount ΔY nFurthermore, the deviation amount database D62 may store the height Z, the temperature indicated by a temperature sensor that measures the temperature of the bonding head portion 30, and the number of bonding operations in association with each other.

[0033] The mounting unit 63 mounts the semiconductor chip 61 on the substrate 70. The mounting unit 63 corrects the amount of misalignment according to the height based on the misalignment amount database D62, and mounts the semiconductor chip 61 on the substrate 70. Specifically, the mounting unit 63 corrects the amount of misalignment according to the height based on the misalignment amount database D62, for example, based on the rotational misalignment amount Δθ 1 In order to compensate for this, the bonding tool 32 is adjusted to a value Δθ 1 After that, the mounting unit 63 rotates the XY table 34 by, for example, the X-shift amount ΔX 1 and Y deviation amount ΔY 1 Move.

[0034] <<Operation>> The operation of the bonding apparatus 100 will be described with reference to Figures 2, 3, and 5. The following describes a mounting process including a sequence for correcting the amount of misalignment for each height in the bonding apparatus 100 (hereinafter, referred to as a "correction sequence"). Figure 5 is a flowchart showing the flow of the mounting process including the correction sequence.

[0035] In step S100, the bonding apparatus 100, for example, counts the number of bonding cycles, and if the number of bonding cycles reaches a predetermined threshold (step S100: YES), executes the correction sequence from step S101 onward. On the other hand, if the number of bonding cycles is equal to or less than the predetermined threshold (step S100: NO), the process may proceed to step S106 and bonding may be continued. Note that instead of or in addition to the process of determining whether the number of bonding cycles has reached the predetermined threshold, the bonding apparatus 100 may determine whether or not to execute the correction sequence by executing a process of determining whether or not the temperature of the bonding head unit 30 has reached a predetermined threshold.

[0036] When the number of bonding cycles reaches a predetermined threshold value (step S100: YES), in step S101, the bonding apparatus 100 adjusts the reference height Z 0 The offset amount (for example, the rotational deviation amount Δθ 0 ,X deviation amount ΔX 0 ,Y deviation amount ΔY 0 ) is measured using a specified method.

[0037] In step S102, the bonding apparatus 100 lowers the bonding head 30 onto the test chip 80 to adsorb the test chip 80, and picks up the test chip 80 as shown in FIG. 2(a).

[0038] In step S103, the bonding apparatus 100 raises the bonding tool 32 to a reference height Z 0 , and image data of the imaging reference 81 is acquired by the first imaging unit 33. At this time, the first imaging unit 33 is moved to a height Z 0 The bonding apparatus 100 performs image analysis on the image data to obtain the reference height Z 0 Rotation angle θ at 0 ,X position 0 ,Y position Y 0 Then, the bonding apparatus 100 measures the reference height Z 0 Rotational deviation Δθ 0 ,X deviation amount ΔX 0 ,Y deviation amount ΔY 0 is stored in the storage unit 62. 0 Rotational deviation Δθ 0 ,X deviation amount ΔX 0 ,Y deviation amount ΔY 0 is, for example, a reference offset amount in the bonding apparatus 100.

[0039] In step S104, the bonding apparatus 100 raises the bonding tool 32 to a height Z 1 , and image data of the imaging reference 81 is acquired by the first imaging unit 33. At this time, the first imaging unit 33 is moved to a height Z 1The bonding apparatus 100 performs image analysis on the image data to obtain the height Z 1 Rotation angle θ at 1 ,X position 1 ,Y position Y 1 Then, the bonding apparatus 100 measures the rotation angle θ 1 and the rotation angle θ 0 The difference between the rotational deviation Δθ 1 and stores it in the storage unit 62. The bonding apparatus 100 detects the rotational deviation amount Δθ 1 After correcting, the X position X 1 and X position X 0 The difference between the X and the X deviation amount ΔX 1 and stores it in the storage unit 62. Similarly, the bonding apparatus 100 detects the rotational deviation amount Δθ 1 After correcting, the Y position Y 1 and Y position Y 0 The difference between the Y deviation amount and ΔY 1 is detected and stored in the storage unit 62.

[0040] In step S105, the bonding apparatus 100 performs the same process as in step S104 at a height Z 1 At each of the higher heights, it runs up to a height (Zn) preset by the user.

[0041] If the bonding has been performed up to the height preset by the user (step S105: YES), in step S106, the bonding apparatus 100 resumes bonding.

[0042] In step S107, the bonding apparatus 100 checks whether all bonding has been completed, and if production is to be stopped due to the completion of all bonding, it stops operation (step S107: YES). On the other hand, if all bonding has not been completed (step S107: NO), the bonding apparatus 100 repeats the process from step S100.

[0043] The above correction sequence is a sequence that detects the amount of misalignment according to the height of the bonding head 30 relative to the offset amount due to thermal expansion or the like, and effectively suppresses positional misalignment during bonding while correcting the amount of misalignment. This allows the bonding device 100 to achieve an effect of improving bonding quality (mounting quality).

[0044] <<Modifications>> A bonding apparatus 100a according to a modified example will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is a diagram showing an example of a schematic configuration and operation of the bonding apparatus 100a according to a modified example. Fig. 7 shows the reference height Z 0 FIG.

[0045] The bonding apparatus 100a has a reference height Z 0 In the following, only the configuration different from the bonding apparatus 100 will be described, without mentioning the same configuration as the bonding apparatus 100.

[0046] 6, the bonding apparatus 100a further includes a second imaging unit 35. The second imaging unit 35 includes, for example, an optical system such as a lens, and an imaging element such as a CCD image sensor or a CMOS image sensor. The second imaging unit 35 has an optical axis Oa2 that is aligned in the vertical direction.

[0047] The second imaging unit 35 is installed, for example, on the upper surface of the bonding stage unit 40, and images the measuring chip 80 from the opposite side of the bonding tool 32 through the measuring chip 80. That is, the second imaging unit 35 is disposed so as to be able to image the imaging reference 81 of the measuring chip 80 adsorbed to the bonding tool 32 from the lower side (-Z direction side) of the bonding tool 32. The measuring chip 80 is formed of a transparent member so as to enable the second imaging unit 35 to image the bonding tool 32.

[0048] Reference height Z in the bonding apparatus 100a 0 A process of detecting the amount of deviation (absolute offset amount) of the second imaging unit 35 will be described. As shown in FIG. 6(a), the bonding device 100a moves the second imaging unit 35 to the lower side (-Z direction side) of the bonding tool 32 so that the central axis Ca of the bonding tool 32 and the optical axis Oa2 of the second imaging unit 35 overlap. Next, the bonding device 100a moves the bonding head unit 30 in the +X direction by a predetermined offset amount p (predetermined distance). Then, as shown in FIG. 6(b), the imaging reference 81 of the measuring chip 80 moves directly above the second imaging unit 35 so as to face the second imaging unit 35. Then, the second imaging unit 35 images the imaging reference 81 from the lower side (-Z direction side) to obtain the first image data IM1. At this time, the first imaging unit 33 images the imaging reference 81 from the upper side (+Z direction side) to obtain the second image data IM2.

[0049] The measurement unit 51 performs image analysis on the image data of the imaging reference 81 captured by the second imaging unit 35 to obtain the reference height Z 0 7(a), the measurement unit 51 determines that the center point Cp of the imaging reference 81 is shifted from the optical axis Oa2 of the second imaging unit 35 by a distance b1 in the +X direction and shifted by a distance b2 in the +Y direction in the image represented by the first image data IM1. That is, the measurement unit 51 measures the relative position of the center point Cp with respect to the optical axis Oa2 (hereinafter referred to as the "third relative position"). Also, as shown in FIG. 7(b), the measurement unit 51 determines that the center point Cp of the imaging reference 81 is shifted from the optical axis Oa1 of the first imaging unit 33 by a distance c1 in the -X direction and shifted by a distance c2 in the -Y direction in the image represented by the second image data IM2. That is, the measurement unit 51 measures the relative position of the center point Cp with respect to the optical axis Oa1 (hereinafter referred to as the "fourth relative position").

[0050] The detection unit 52 detects a reference height Z 0The detection unit 52 detects the amount of deviation (fifth relative position) of the bonding tool 32. Specifically, the detection unit 52 may specify, for example, the distance (b1+c1) as the X-axis deviation and the distance (b2+c2) as the Y-axis deviation. The detection unit 52 may also specify the amount of rotational deviation of the second reference position centered on the central axis Ca of the bonding tool 32 with respect to the first reference position. The detection unit 52 then detects the amount of rotational deviation of the second reference position centered on the central axis Ca of the bonding tool 32 with respect to the first reference position. 0 The rotation angle θ 0 ,X position 0 ,Y position Y 0 For the reference height Z 0 Considering the amount of deviation, height Z 1 Rotational deviation Δθ 1 ,X deviation amount ΔX 1 ,Y deviation amount ΔY 1 Detect.

[0051] As described above, the bonding apparatus 100a can obtain a reference height, for example, Z 0 Since the offset amount can be detected, the device configuration can be simplified.

[0052] ===Summary=== <1> The bonding apparatus 100 includes a bonding tool 32 to which an imaging reference 81 is attached, a first imaging unit 33 that images the imaging reference 81 attached to the bonding tool 32, a bonding head unit 30 (support member) that supports the bonding tool 32 so as to be movable in the vertical direction and supports the first imaging unit 33, and a first height (e.g., a reference height Z 0 ) and the first position at the first height (reference height Z 0 ) a second height (for example height Z 1 ), a measuring unit 51 that measures the second position of the imaging reference 81 at the mounting height, and a detecting unit 52 that detects the amount of deviation between the first position and the second position (first relative position). This enables the bonding apparatus 100 to suppress deviation of the mounting position due to a change in the mounting height, and improve the mounting quality.

[0053] <2> The first imaging unit 33 in the bonding apparatus 100 is provided with a driving mechanism that can move in the vertical direction following the movement of the bonding tool 32. <1> The bonding apparatus 100 described above is thus capable of suppressing deviation of the mounting position caused by a change in mounting height, thereby improving mounting quality.

[0054] <3> The bonding tool 32 in the bonding apparatus 100 is supported by the bonding head unit 30 (support member) so as to be rotatable in a rotational direction along a plane perpendicular to the up-down direction, and the detection unit 52 detects the amount of deviation (first relative position) in the rotational direction between the first position and the second position. <1> or <2> The bonding apparatus 100 according to the present invention is capable of more reliably suppressing deviation of the mounting position caused by changes in the mounting height, thereby improving the mounting quality.

[0055] <4> The bonding apparatus 100 further includes a mounting unit 54 that mounts a semiconductor chip at a second position corrected based on the amount of deviation (first relative position). <1> from <3> 2. The bonding apparatus 100 according to claim 1, wherein the bonding position of the bonding pad 104 is changed from the mounting position of the bonding pad 104 to the mounting position of the bonding pad 104 ...

[0056] <5> The detection unit 52 in the bonding apparatus 100 detects a deviation (second relative position) in a predetermined direction along a plane between the first position and the second position corrected based on the first relative position, and the mounting unit 54 corrects the second position corrected based on the deviation (first relative position) based on the deviation (second relative position). <4> The bonding apparatus 100 according to the present invention is capable of more reliably suppressing deviation of the mounting position caused by changes in the mounting height, thereby improving the mounting quality.

[0057] <6> The bonding apparatus 100a further includes a second imaging unit 35 that is provided on a substrate 70 for bonding the semiconductor chip 61 and captures an image of the imaging reference 81 from the opposite side of the bonding tool 32 with respect to the imaging reference 81. When the bonding tool 32 and the first imaging unit 33 are moved a predetermined distance from a position where the second imaging unit 35 faces the bonding tool 32 to a position where the second imaging unit 35 faces the imaging reference 81, the detection unit 52 determines a first height (e.g., a reference height Z 0 ) between a predetermined reference and the first position (fifth relative position), and calculates a height Z based on the amount of deviation (fifth relative position) and the second position. 1 Detect the amount of deviation (first relative position) <1> from <5> The bonding apparatus 100 according to any one of claims 1 to 5, wherein the bonding apparatus 100a detects the offset amount serving as a reference in the bonding apparatus 100a by simple processing, thereby simplifying the apparatus configuration.

[0058] <7> The bonding apparatus 100 is then moved to a second height (e.g., height Z 1 The mounting unit 54 stores the second height (for example, height Z 1 The semiconductor chip 61 is mounted at a second position corrected based on the amount of deviation (first relative position) of the first relative position. <1> from <6> 2. The bonding apparatus according to claim 1, wherein the mounting position is changed by a change in mounting height. 3. The bonding apparatus according to claim 1, wherein the mounting position is changed by a change in mounting height.

[0059] The embodiments described through the above embodiments of the invention can be combined or modified or improved as appropriate depending on the application, and the present invention is not limited to the above-mentioned embodiments. It is clear from the claims that such combinations, modifications, or improvements are also included in the technical scope of the present invention. [Explanation of symbols]

[0060] 30...bonding head unit, 31...Z-axis drive mechanism, 32...bonding tool, 33...first imaging unit, 34...XY table, 35...second imaging unit, 40...bonding stage unit, 50...bonding control unit, 51...measurement unit, 52...detection unit, 53...memory unit, 54...mounting unit, 60...wafer, 61...semiconductor chip, 70...substrate, 80...measurement chip, 81...imaging reference, 100...bonding apparatus.

Claims

1. a bonding tool having an imaging fiducial attached thereto; a first imaging unit that images the imaging reference attached to the bonding tool; a support member that supports the bonding tool so as to be drivable in a vertical direction and that supports the first imaging unit; a measurement unit that measures a first position of the imaging reference at a first height and a second position of the imaging reference at a second height different from the first height, based on image data captured by the first imaging unit; a detection unit that detects a first relative position between the first position and the second position; A bonding apparatus comprising:

2. the first imaging unit includes a drive mechanism that is movable in a vertical direction in response to a movement of the bonding tool; The bonding apparatus according to claim 1 .

3. the bonding tool is supported by the support member so as to be rotatable in a rotational direction along a plane perpendicular to the up-down direction; the detection unit detects the first relative position in the rotation direction between the first position and the second position. The bonding apparatus according to claim 1 .

4. a mounting unit that mounts a semiconductor chip at the second position corrected based on the first relative position, 4. The bonding apparatus according to claim 3.

5. the detection unit detects a second relative position in a predetermined direction along the plane between the first position and the second position corrected based on the first relative position; the mounting unit corrects the second position, which has been corrected based on the first relative position, based on the second relative position; 5. The bonding apparatus according to claim 4.

6. a second imaging unit that is provided on a substrate for bonding a semiconductor chip and that images the imaging reference from an opposite side of the bonding tool with respect to the imaging reference; The detection unit is when the bonding tool and the first imaging unit are moved a predetermined distance from a position where the second imaging unit faces the bonding tool to a position where the second imaging unit faces the imaging reference, a third relative position between the second imaging unit and the imaging reference, the third relative position being specified based on first image data captured by the second imaging unit of the imaging reference located directly above the second imaging unit; a fourth relative position between the first imaging unit and the imaging reference, the fourth relative position being specified based on second image data captured by the first imaging unit of the imaging reference located directly above the second imaging unit; a fifth relative position between a predetermined reference at the first height and the first position based on the detecting the first relative position based on the fifth relative position and the second position; The bonding apparatus according to claim 1 .

7. a storage unit that stores the second height and the first relative position in association with each other, the mounting unit mounts the semiconductor chip at the second position corrected based on the first relative position of the second height stored in the storage unit.

5. The bonding apparatus according to claim 4.

8. a bonding tool having an imaging fiducial attached thereto; a first imaging unit that images the imaging reference attached to the bonding tool; a support member that supports the bonding tool so as to be drivable in a vertical direction and that supports the first imaging unit; A method for controlling a bonding apparatus comprising: capturing an image of a first position at a first height of the imaging reference by the first imaging unit; capturing an image of a second position of the imaging reference at a second height different from the first height by the first imaging unit; Measuring a first position at a first height of the imaging reference and a second position at a second height of the imaging reference based on image data captured by the first imaging unit; Detecting a relative position between the first position and the second position; The method includes:

9. a bonding tool having an imaging fiducial attached thereto; a first imaging unit that images the imaging reference attached to the bonding tool; a support member that supports the bonding tool so as to be drivable in a vertical direction and that supports the first imaging unit; A bonding control unit; A computer of the bonding control unit in the bonding apparatus comprising: capturing an image of a first position at a first height of the imaging reference by the first imaging unit; capturing an image of a second position of the imaging reference at a second height different from the first height by the first imaging unit; Measuring a first position at a first height of the imaging reference and a second position at a second height of the imaging reference based on image data captured by the first imaging unit; Detecting a relative position between the first position and the second position; A program that executes the following.

Images