Composition for heat transfer fluid, heat transfer device, and heat transfer method

Abstract

To provide a composition for heat transfer fluid as a novel mixture.SOLUTION: The present invention provides a composition for heat transfer fluid containing a hexafluoropropene trimer represented by C9F18, (i) CmF2m and / or CnF(2n-2) (in the formula, m is an integer from 4 to 12 other than 9. n is an integer from 4 to 12), (ii) water (the content of water is 0.0001-0.1 pt.mass relative to 100 pts.mass of the total amount of the hexafluoropropene trimer represented by C9F18), and / or (iii) fluoride ions (the content of the fluoride ions is 0.0000001 to 5 pts.mass relative to 100 pts.mass of the total amount of the hexafluoropropene trimer represented by C9F18).SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to a composition for a heat transfer fluid, a heat transfer device, and a heat transfer method.

Background Art

[0002] It is known that a trimer of hexafluoropropene (HFP) can be used as a composition for a heat transfer fluid (Patent Document 1).

[0003] Since the trimer of HFP has a low global warming potential (GWP) and low toxicity, it has attracted attention as an alternative to chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In view of the above circumstances, an object of the present disclosure is to provide a composition for a heat transfer fluid as a novel mixture.

Means for Solving the Problems

[0006] As a result of intensive studies to solve the above problems, the present inventors have found that a composition for a heat transfer fluid as a novel mixture can be provided by coexisting a predetermined fluorocarbon with an HFP trimer, a predetermined amount of water, and / or a predetermined amount of fluoride ions.

[0007] That is, the present disclosure includes the following aspects. [Item 1] C9F 18The hexafluoropropene trimer represented by , (i) C m F 2m and / or C n F (2n-2) 〔wherein, m is an integer of 4 or more and 12 or less and other than 9. n is an integer of 4 or more and 12 or less.〕, (ii) water (wherein the content of such water is 0.0001 to 0.1 part by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the above C9F 18 ), and / or (iii) fluoride ion (wherein the content of such fluoride ion is 0.0000001 to 5 parts by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by C9F 18 ), a composition for a heat transfer fluid. [Item 2] The composition for a heat transfer fluid according to Item 1, wherein the hexafluoropropene trimer contains at least one selected from the group consisting of compounds represented by the following formulas (I) to (III). [Chemical formula 1] TIFF2025092530000001.tif154101[Item 3] The composition for a heat transfer fluid according to Item 2, wherein the compound represented by the formula (I) is 85% by mass or more based on the total amount of the hexafluoropropene trimer. [Item 4] The composition for a heat transfer fluid according to Item 2, wherein the compound represented by the formula (I) is less than 85% by mass based on the total amount of the hexafluoropropene trimer. [Item 5] The composition for a heat transfer fluid according to Item 2, wherein the compound represented by the formula (I) is 50% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropene trimer. [Item 6] C9F 18 The composition for a heat transfer fluid according to Item 1, which contains the hexafluoropropene trimer represented by , (i) C m F 2m and / or C n F (2n-2) 〔wherein, m is an integer of 4 or more and 12 or less and other than 9. n is an integer of 4 or more and 12 or less.〕. [Item 7] The composition for a heat transfer fluid according to item 1, wherein m is an integer of 6 or more and 11 or less, excluding 9, and n is an integer of 6 or more and 11 or less. [Item 8] C m F 2m and / or C n F (2n-2) The content of is 0.0001 to 10 parts by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by C9F 18 The composition for a heat transfer fluid according to item 1. [Item 9] C9F 18 The composition for a heat transfer fluid according to item 1, comprising the hexafluoropropene trimer represented by and (ii) water. [Item 10] C9F 18 The composition for a heat transfer fluid according to item 1, comprising the hexafluoropropene trimer represented by and (iii) fluoride ions. [Item 11] C 12 F 24 The composition for a heat transfer fluid according to item 1, further comprising a hexafluoropropene tetramer represented by, wherein the content of the hexafluoropropene trimer is 80% by mass or more based on the total of the hexafluoropropene trimer and the hexafluoropropene tetramer. [Item 12] The composition for a heat transfer fluid according to item 11, wherein the content of the hexafluoropropene trimer is 90% by mass or more and 99.99% by mass or less based on the total of the hexafluoropropene trimer and the hexafluoropropene tetramer. [Item 13] The composition for a heat transfer fluid according to item 11, wherein the hexafluoropropene tetramer includes 1,1,1,2,5,6,6,6 - octafluoro - 2,3,5 - tris(trifluoromethyl) - 4 - (perfluoropropyl - 2 - yl) - 3 - hexene. [Item 14] The composition for a heat transfer fluid according to item 1, further comprising a conductive substance, wherein the content of the conductive substance is 100 ppm by mass or less. [Item 15] The composition for a heat transfer fluid according to item 1, further comprising a conductive substance and having a content of insoluble matter of 5 μm or more of 10 pieces / mL or less. [Item 16] A heat transfer fluid comprising the composition for a heat transfer fluid according to item 1 or 2. [Item 17] Use of the composition for a heat transfer fluid according to item 1 or 2 as a heat transfer fluid. [Item 18] A heat transfer device comprising a device and a mechanism for transferring heat to or from the device, the mechanism comprising the composition for a heat transfer fluid according to item 1 or 2. [Item 19] A heat transfer method comprising a step of preparing a device and a step of transferring heat to or from the device using the composition for a heat transfer fluid according to item 1 or 2. [Advantages of the Invention]

[0008] The composition according to the present disclosure as described above can provide a composition for a heat transfer fluid as a novel mixture. [Modes for Carrying Out the Invention]

[0009] In this specification, "containing" is a concept encompassing any of "comprise", "consist essentially of", and "consist of". Also, in this specification, when a numerical range is indicated as "A to B", it means A or more and B or less.

[0010] (1. Composition for Heat Transfer Fluid) The composition for a heat transfer fluid of the present disclosure comprises (i) C m F 2m and / or C n F (2n-2) [wherein, m is an integer of 4 or more and 12 or less and other than 9. n is an integer of 4 or more and 12 or less.], (ii) water (wherein the content of such water is the C9F 18The total amount of hexafluoropropene trimer represented by is 0.0001 to 0.1 parts by mass with respect to 100 parts by mass, and / or (iii) fluoride ions (where the content of such fluoride ions is C9F 18 is 0.0000001 to 5 parts by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by).

[0011] As the hexafluoropropene trimer, known ones represented by C9F 18 can be widely adopted and are not particularly limited.

[0012] As such a hexafluoropropene trimer, specifically, at least one trimer selected from the group consisting of compounds represented by the following formulas (I) to (III) can be exemplified.

[0013] [Chemical formula]

[0014] In this specification, the compound represented by the above formula (I) includes both the E-form and Z-form of the diastereomer unless otherwise specified.

[0015] As the hexafluoropropene trimer contained in the composition for a heat transfer fluid of the present disclosure, only one of the compounds represented by the above formulas (I) to (III) may be included, or a mixture containing two or three of these may be used.

[0016] Regarding the mixing ratio of the compound represented by the above formula (I) in the total amount of HFP trimers (that is, the total of the compounds represented by formulas (I), (II), and (III)), it is preferably 1% by mass or more, more preferably 10% by mass or more, still more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and particularly preferably 50% by mass or more with respect to the total amount of HFP trimers. Further, the compound represented by formula (I) may be 85% by mass or more with respect to the total amount of HFP trimers. In this case, the viscosity of the HFP trimer mixture becomes low. Also, the compound represented by formula (I) is preferably 99% by mass or less, more preferably 90% by mass or less, still more preferably 85% by mass or less (or less than) with respect to the total amount of HFP trimers, even more preferably 80% by mass or less, particularly preferably 70% by mass or less, and most preferably 60% by mass or less. Regarding the mixing ratio of the compound represented by the above formula (I), it may be, for example, 10% by mass or more and 90% by mass or less, 30% by mass or more and 90% by mass or less, 10% by mass or more and 85% by mass or less, 35% by mass or more and 85% by mass or less, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 40% by mass or more and 80% by mass or less, 55% by mass or more and 80% by mass or less, 60% by mass or more and 75% by mass or less, or 65% by mass or more and 70% by mass or less, 35% by mass or more and 60% by mass or less, 50% by mass or more and 60% by mass or less, and is preferably 30% by mass or more and 90% by mass or less, preferably 40% by mass or more and less than 85% by mass, more preferably 40% by mass or more and 80% by mass or less, still more preferably 45% by mass or more and 70% by mass or less, and even more preferably 50% by mass or more and 60% by mass or less.

[0017] Similarly, the compounding ratio of the compound represented by the formula (II) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more with respect to the total amount of the HFP trimer. Further, the compound represented by the formula (II) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less with respect to the total amount of the HFP trimer.

[0018] Similarly, the compounding ratio of each of the compounds represented by the formula (III) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more with respect to the total amount of the HFP trimer. Further, the compound represented by the formula (III) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less in 100% by mass of the total amount of the HFP trimer.

[0019] In the composition for a heat transfer fluid of the present disclosure, the mass ratio of the compound represented by the formula (II) and the compound represented by the formula (III) is not particularly limited, and for example, it may be 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0020] The compounds represented by the above formulas (I) to (III) may be produced by a conventional method. For example, they can be obtained by the method described in International Publication No. 2018 / 172919, but of course, it is not limited thereto. Further, they may be obtained by trimerizing HFP as a raw material, and it is not necessarily limited thereto, and known methods may be widely adopted.

[0021] The composition for a heat transfer fluid of the present disclosure may contain a hexafluoropropene trimer represented by C9F 18 other than the compounds represented by the formulas (I) to (III).

[0022] The composition for a heat transfer fluid of the present disclosure may contain hexafluoropropene dimer.

[0023] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0024] In one aspect, the composition for a heat transfer fluid of the present disclosure may contain hexafluoropropene tetramer.

[0025] The hexafluoropropene tetramer may include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0026] In the composition for a heat transfer fluid of the present disclosure, the content of the hexafluoropropene trimer is 80% by mass or more, preferably 85% by mass or more, more preferably 90% by mass or more, for example 95% by mass or more, 98% by mass or more, 99% by mass or more, 99.9% by mass or more, based on the total of the hexafluoropropene trimer and the hexafluoropropene tetramer.

[0027] In the composition for a heat transfer fluid of the present disclosure, the content of the hexafluoropropene trimer is preferably 99.999% by mass or less, more preferably 99.99% by mass or less, for example 99.9% by mass or less, 99% by mass or less, 95% by mass or less, 90% by mass or less, or 85% by mass or less, based on the total of the hexafluoropropene trimer and the hexafluoropropene tetramer.

[0028] In the composition for a heat transfer fluid of the present disclosure, the content of hexafluoropropene trimer is preferably 80% by mass or more and 99.999% by mass or less, more preferably 85% by mass or more and 99.99% by mass or less, for example 90% by mass or more and 99.99% by mass or less, 95% by mass or more and 99.99% by mass or less, 99% by mass or more and 99.99% by mass or less, or 99% by mass or more and 99.9% by mass or less, based on the total of hexafluoropropene trimer and hexafluoropropene tetramer.

[0029] The total amount of hexafluoropropene trimer and hexafluoropropene tetramer is preferably 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and even more preferably 95% by mass or more, for example 98% by mass or more, 99% by mass or more, or 99.9% by mass or more, in the composition for a heat transfer fluid. The total amount of hexafluoropropene trimer and hexafluoropropene tetramer may be substantially 100% by mass in the composition for a heat transfer fluid. In other words, the composition for a heat transfer fluid of the present disclosure may be a mixture of hexafluoropropene trimer and hexafluoropropene tetramer.

[0030] (1-1.C m F 2m and / or C n F (2n-2) ) In one aspect, the composition for a heat transfer fluid of the present disclosure contains a hexafluoropropene (HFP) trimer represented by C9F 18 and C m F 2m and / or C n F (2n-2) [wherein m is an integer of 4 or more and 12 or less and other than 9. n is an integer of 4 or more and 12 or less.].

[0031] m is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Also, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. However, m does not include 9. Further, m is particularly preferably 8.

[0032] n is an integer of 4 or more, preferably an integer of 5 or more, more preferably an integer of 6 or more. Further, n is an integer of 12 or less, preferably an integer of 11 or less, more preferably an integer of 10 or less. Furthermore, n is particularly preferably 9.

[0033] C m F 2m may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called alkene, and may be linear or branched.

[0034] C n F (2n-2) may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called diene or an alkyne, and may be linear or branched.

[0035] The present disclosure is based on the finding that a composition in which C m F 2m and / or C n F (2n-2) coexists with an HFP trimer surprisingly functions as a heat transfer fluid. Further, in the composition for a heat transfer fluid of the present disclosure, C m F 2m and / or C n F (2n-2) is included, whereby the stability of the HFP trimer is improved.

[0036] Also, C m F 2m and / or C n F (2n-2) The content of is preferably 0.0001% by mass or more based on the entire composition for a heat transfer fluid of the present disclosure.

[0037] On the other hand, C m F 2m and / or C n F (2n-2)The content is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less, based on the total amount of the heat transfer fluid composition of the present disclosure.

[0038] In one aspect, in the heat transfer fluid composition, C m F 2m and / or C n F (2n-2) The content is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and even more preferably 0.1 part by mass or more, based on 100 parts by mass in total of the HFP trimers.

[0039] On the other hand, in the heat transfer fluid composition, C m F 2m and / or C n F (2n-2) The content is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, based on 100 parts by mass in total of the HFP trimers.

[0040] Note that when a plurality of types of C m F 2m and / or C n F (2n-2) are included, the above content means the total amount thereof.

[0041] C m F 2m and / or C n F (2n-2) By setting the content of to the above range, the decomposition of the HFP trimer represented by C9F 18 can be suppressed, and thus an increase in fluoride ions and an increase in acidity can be suppressed.

[0042] (1-2. Water) In one aspect, the composition for a heat transfer fluid of the present disclosure may contain water. The water content may be 1 ppm by mass or more in the composition for a heat transfer fluid, and preferably 5 ppm by mass or more. By setting the water content to a certain level or more, for example, 1 ppm by mass or more, it is possible to suppress the charging of the composition due to a decrease in the stability of the composition for a heat transfer fluid. Further, the water content is 1000 ppm by mass or less in the composition for a heat transfer fluid, preferably 500 ppm by mass or less, more preferably 100 ppm by mass or less, and even more preferably 20 ppm by mass or less. By setting the water content to a certain level or less, for example, 1000 ppm by mass or less, the decomposition of the HFP trimer represented by C9F 18 can be suppressed, and thus an excessive increase in fluoride ions and an increase in acidity can be suppressed.

[0043] In one aspect, the water content is preferably 0.0001 part by mass or more, more preferably 0.0005 part by mass or more, and even more preferably 0.001 part by mass or more with respect to 100 parts by mass in total of the compounds represented by C9F 18 .

[0044] On the other hand, the water content is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less with respect to 100 parts by mass in total of the compounds represented by C9F 18 .

[0045] The composition for a heat transfer fluid of the present disclosure has improved dielectric strength by containing a predetermined amount of water. The dielectric strength of the composition for a heat transfer fluid of the present disclosure can preferably be 40 kV or more, preferably 50 kV or more, and more preferably 60 kV or more.

[0046] (1-3. Fluoride ions) In one aspect, the composition for a heat transfer fluid of the present disclosure may contain fluoride ions in an amount of 0.0000001% by mass or more based on the entire composition. The amount of fluoride ions is preferably 0.000001% by mass or more, more preferably 0.0001% by mass or more, and still more preferably 0.001% by mass or more based on the entire composition. By setting the fluoride ion concentration to 0.0000001% by mass or more, the stability of the composition for a heat transfer fluid can be maintained, and the charging of the composition can be suppressed.

[0047] Further, the amount of fluoride ions contained in the composition for a heat transfer fluid of the present disclosure is 5% by mass or less, preferably 1% by mass or less, and more preferably 0.1% by mass or less based on the entire composition. By setting the fluoride ions to 5% by mass or less, the decomposition of the compound represented by C9F 18 can be suppressed during heating.

[0048] In one aspect, the amount of fluoride ions is preferably 0.0000001 part by mass or more, more preferably 0.000001 part by mass or more, still more preferably 0.0001 part by mass or more, and still more preferably 0.001 part by mass or more with respect to 100 parts by mass in total of the compounds represented by C9F 18 .

[0049] On the other hand, the water content is preferably 5 parts by mass or less, more preferably 1 part by mass or less, and still more preferably 0.1 part by mass or less with respect to 100 parts by mass in total of the compounds represented by C9F 18 .

[0050] The amount of fluoride ions can be measured with a fluoride ion meter using, for example, a sample to which a double amount (by weight) of distilled water is added, shaken for about 20 seconds to extract F ions into the aqueous layer, then withdrawing 2.5 to 3.0 mL of the aqueous layer with a pipette, and using the solution mixed with twice the amount of TISAB solution (total ion strength adjustment buffer solution) as a sample.

[0051] As the fluoride ion source, known fluoride ion sources can be widely used without particular limitation. Specifically, hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride ions can be exemplified. Only one of these may be included, or a plurality of types may be included. Preferably, the fluoride ion source is hydrogen fluoride.

[0052] (1-4. Other components) In addition to hexafluoropropene trimer, the composition for a heat transfer fluid of the present disclosure may contain perfluorotripropylamine. A composition for a heat transfer fluid containing hexafluoropropene trimer and perfluorotripropylamine can be an azeotropic-like liquid. When the composition for a heat transfer fluid is an azeotropic-like liquid, even when the composition for a heat transfer fluid vaporizes, the change in composition is small and handling becomes easy.

[0053] Here, the azeotropic-like liquid means a liquid in which the difference in the mole fraction of each component contained in the azeotropic-like liquid between the gas phase and the liquid phase is within 10%.

[0054] Perfluorotripropylamine is also called tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, and has the general formula: N(CF2CF2CF3) a (CF(CF3)CF3) 3-a (a is an integer from 0 to 3). Perfluorotripropylamine may contain only one of the compounds represented by the above general formula, or may contain a plurality of types. N(CF2CF2CF3)3 is preferred, but N(CF2CF2CF3) a (CF(CF3)CF3) 3-a (a is an integer from 0 to 2) may be included. Specifically, product names such as "Fluorinate (registered trademark)" (manufactured by 3M) (FC-3283) can be mentioned.

[0055] The composition for a heat transfer fluid of the present disclosure may further contain perfluoropolyether, a mixture of methoxytridecafluoroheptene isomers, perfluorotributylamine, and the like.

[0056] The perfluoropolyether is preferably General formula: RO-Rf 1 -R’ represented by wherein R and R’ are the same or different and are monovalent groups represented by -C m F 2m+1 where m is an integer from 1 to 8, and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, and the repeating units are: (i) -CFXO- (where X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or (v) -CF2CF2CF2CF2O- represented by, or Rf 1 is (vi) -(CF2) n -CFY-O- (where n is an integer from 0 to 3, and Y is a monovalent group represented by the general formula -ORf 2 Z, where Rf 2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different and is F or CF3, and Z is a monovalent C 1-5 perfluoroalkyl group), which is a divalent group represented by.

[0057] Perfluoropolyethers specifically include product names such as GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0058] The methoxytridecafluoroheptene isomer mixture specifically includes methyl-perfluoroheptene ether (MPHE) (C7F 13 OCH3). Specifically, product names such as "Opteon SF10" (manufactured by Chemours) can be mentioned.

[0059] When the composition for a heat transfer fluid of the present disclosure contains perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture, since their characteristics as a heat transfer fluid are similar to those of the compound represented by C9F 18 the characteristics of the entire composition for a heat transfer fluid are basically unchanged regardless of their content ratios. Therefore, in this case, the composition for a heat transfer fluid of the present disclosure preferably contains the compound represented by C9F 18 in an amount of 40% to 99.9% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, based on the entire composition for a heat transfer fluid.

[0060] (1 - 5. Impurities)

[0061] The composition for a heat transfer fluid of the present disclosure may contain a conductive substance. The content of the conductive substance is 100 mass ppm or less, preferably 75 mass ppm or less, more preferably 50 mass ppm or less, and even more preferably 10 mass ppm or less. Since there is a possibility that the conductive substance, especially metals and metal ions, may enter through the gaps of the device and cause a short circuit in the circuit, the content of the conductive substance in the present disclosure can also be considered by focusing on "at least one of metal and metal ion" as needed.

[0062] In another aspect, the composition for a heat transfer fluid of the present disclosure has a content of insolubles of 5 μm or more (including resin pieces of the container, dust mixed from the air, solid components such as dust, regardless of the presence or absence of conductivity) that is preferably 10 pieces / mL or less, more preferably 5 pieces / mL or less, and still more preferably 3 pieces / mL or less.

[0063] (1-6. Method for producing a composition for a heat transfer fluid with reduced impurities) The present disclosure provides a method for producing a composition for a heat transfer fluid with reduced impurities. The method for producing a composition for a heat transfer fluid of the present disclosure includes a step of purifying a composition containing a heat transfer fluid compound and a conductive substance to obtain a composition for a heat transfer fluid with the conductive substance reduced from the composition. (1) The heat transfer fluid compound contains at least one selected from the group consisting of a compound represented by C9F 18 and at least one selected from the group consisting of perfluoroalkene ethers and perfluoropolyethers. (2) The purification treatment is a treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption. It is characterized by this. In the present disclosure, "reduction" in purification means reducing the content ratio of the conductive substance in the composition.

[0064] According to the research of the present inventors, conventionally known so-called heat transfer fluids contain conductive substances (such as metals, metal ions, carbon, conductive polymers, superconducting ceramics, etc.). These conductive substances are not only inevitably mixed due to the process during the production of the heat transfer fluid, but also include those that are mixed incidentally during use after production. When these heat transfer fluids are used for the purpose of transferring heat to or from a device, there is a possibility that the conductive substances may penetrate from the gaps of the device and cause a short circuit in the circuit. In addition, when the heat transfer fluid is repeatedly used, there is a possibility of causing blockage of the pipes through which the heat transfer fluid circulates. Conventionally known heat transfer fluids can also be expressed as "compositions containing a heat transfer fluid and a conductive substance" in terms of containing conductive substances. The method for producing the composition for a heat transfer fluid of the present disclosure is characterized by subjecting a composition containing a heat transfer fluid and a conductive substance (hereinafter also referred to as "pre-purification composition") to a specific purification treatment to obtain a composition for a heat transfer fluid with reduced conductive substances.

[0065] (1-6-1) Composition (pre-purification composition) containing a heat transfer fluid compound and a conductive substance The pre-purification composition may contain a heat transfer fluid compound and a conductive substance. Here, as the heat transfer fluid compound, it contains at least one selected from the group consisting of compounds represented by C9F 18 , perfluoroalkene ethers, and perfluoropolyethers.

[0066] (1-6-2) Compound represented by C9F 18 The compound represented by C9F 18 is the hexafluoropropene trimer described above.

[0067] (1-6-3) Perfluoroalkene ether The perfluoroalkene ether preferably widely employs a known one represented by the following formula (V): C7F 13 OR (V) [wherein, R is Me or Et. ​

[0068] Examples of the perfluoroalkene ether represented by the above formula (V) include, for example, CF3(CF2) x CF=CFCF(OR)(CF2) y CF3, CF3(CF2) x C(OR)=CFCF2(CF2) y CF3, CF3CF=CFCF(OR)(CF2) x (CF2) y CF3, and CF3(CF2) x CF=C(OR)CF2(CF2) y CF3, [wherein, R is Me or Et. x and y are independently 0, 1, 2 or 3, and x + y = 1, 2 or 3.] At least one unsaturated fluoroether selected from the group consisting of can be exemplified.

[0069] Specific examples of the perfluoroalkene ether represented by the above formula (V) include 5-methoxyperfluoro-3-heptene, 3-methoxyperfluoro-3-heptene, 4-methoxyperfluoro-2-heptene, 3-methoxyperfluoro-2-heptene, 4-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-2-pentene, 3-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-3-pentene, cis- and trans-2-methoxyperfluoro-2-octene, 2-methoxyperfluoro-3-octene and the like.

[0070] A preferred structure of the perfluoroalkene ether represented by the above formula (V) is methyl perfluoroheptene ether. This methyl perfluoroheptene ether may contain a mixture of two or more structures and / or stereoisomers. As a specific example, methyl perfluoroheptene ether is a mixture of about 48 to about 52% by mass of 5-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 3-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 4-methoxyperfluoro-2-heptene, and about 6 to about 10% by mass of 4-methoxyperfluoro-3-heptene.

[0071] Perfluoroalkene ethers specifically include methyl-perfluoroheptene ether (MPHE) (C7F 13 OCH3). Specifically, product names such as "Opteon SF10" (manufactured by Chemours) can be mentioned.

[0072] (1-6-4) Perfluoropolyether Perfluoropolyether (PFPE) preferably has the following formula (IV): RO-Rf 1 -R’ (IV) represented by In the formula, R and R’ are the same or different and are monovalent groups represented by -C m F 2m +1, where m is an integer from 1 to 8, and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, and the repeating units are: (i) -CFXO- (where X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or (v) -CF2CF2CF2CF2O- represented by, or Rf 1 is (vi) -(CF2) n -CFY-O- (where n is an integer from 0 to 3, and Y is a monovalent group represented by the general formula -ORf 2 Z, where Rf 2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different and is F or CF3, and Z is a monovalent C 1-5It is a divalent group represented by (a perfluoroalkyl group). Here, as the PFPE represented by the above formula (IV), known ones can be widely adopted.

[0073] A preferred structure of the PFPE represented by the above formula (IV) is that m is an integer from 1 to 3, and Rf is selected from the following: (1)-(CF2O) a -(CF2CF2O) b -(CF2-(CF2) z’ -CF2O) c (In the formula, a, b, and c are integers of 100 or less. z' is an integer of 1 or 2. a ≥ 0, b ≥ 0, c ≥ 0, and a + b > 0. Among such conditions, in particular, a, b, and c are integers of 50 or less, each of a and b is > 0, and b / a is preferably included between 0.1 and 10.); (2)-(C3F6O) c’ -(C2F4O) b -(CFXO) t - (In the formula, X is independently selected from -F and -CF3 each time it appears. b, c', and t are integers of 100 or less, c' > 0, b ≥ 0, t ≥ 0. Among such conditions, in particular, b and t > 0, c' / b is preferably included between 0.2 and 5.0, and (c' + b) / t is preferably included between 5 and 50.); or (3)-(C3F6O) c’ -(CFXO) t -(In the formula, X is independently selected from -F and -CF3 each time it appears. c' and t are integers of 100 or less, c' > 0, t ≥ 0. Among such conditions, particularly preferably t > 0, and c' / t is preferably included between 5 and 50.).

[0074] Specific examples of the perfluoropolyether include product names such as GALDEN (registered trademark) "HT135", GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0075] (1-6-5) Optionally contained additional heat transfer fluid compounds The heat transfer fluid in the present disclosure is at least one selected from the group consisting of the aforementioned three components (compounds represented by C9F 18 ), perfluoroalkene ethers, and perfluoropolyethers, which are also collectively referred to as "the three components of the present disclosure"). It may contain an additional heat transfer fluid compound different from the above (also referred to as an "additional component"). The additional component may be one or more kinds. Examples of the additional component include hexafluoropropene dimer, hexafluoropropene tetramer, perfluorotripropylamine, perfluorotributylamine, etc.

[0076] The hexafluoropropene dimer may contain (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0077] The hexafluoropropene tetramer may contain 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0078] Perfluorotripropylamine is also called tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, and has the general formula: N(CF2CF2CF3) n (CF(CF3)CF3) 3-n (n is an integer from 0 to 3). Perfluorotripropylamine may contain only one kind of the compounds represented by the above general formula, or may contain a plurality of kinds. N(CF2CF2CF3)3 is preferred, but N(CF2CF2CF3) n (CF(CF3)CF3) 3-n(n is an integer from 0 to 2) may be included. Specifically, product names such as "FLORINATE (registered trademark)" (manufactured by 3M) (FC-3283) can be mentioned.

[0079] When the composition for a heat transfer fluid in the present disclosure contains the three components of the present disclosure and additional components, it is preferable that the three components of the present disclosure account for 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and most preferably 95% by mass or more based on the entire heat transfer fluid. In the manufacturing method of the present disclosure, since the characteristics of the kinematic viscosity, freezing point, and boiling point of the composition (pre-purification composition) containing the heat transfer fluid compound and the conductive substance are affected by the efficiency of removing the conductive substance from the pre-purification composition in relation to a predetermined purification treatment (treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption), it is preferable that the heat transfer fluid compound consists essentially of only the three components of the present disclosure. However, when additional components are contained, as described above, it is preferable that the three components of the present disclosure account for 80% by mass or more based on the entire heat transfer fluid.

[0080] In both cases where additional components are included and where they are not included, in addition to the three components of the present disclosure, for example, as the composition (pre-purification composition) containing the heat transfer fluid compound and the conductive substance, various synthetic products or commercially available products of each of the three components of the present disclosure as described above, and / or those in which conductive substances are subsequently mixed by using them as a heat transfer fluid for a certain period can be widely adopted.

[0081] (1-6-6) Conductive substance Examples of the conductive material include at least one selected from the group consisting of metals, metal ions, metal oxides, metal nitrides, carbon, conductive polymers, and superconducting ceramics. When a heat transfer fluid containing a conductive material is used for transferring heat to or from a device, there is a possibility that the conductive material may enter through the gaps of the device and cause a short circuit in the circuit. Also, when the heat transfer fluid is repeatedly used, it may cause blockage of the pipes through which the heat transfer fluid circulates. Therefore, in order to enhance the performance of the heat transfer fluid, it is important to reduce the content of these conductive materials. The shape and size of the conductive material vary depending on the type of the conductive material, but generally, they are about 0.001 to 10 μm.

[0082] Examples of the metal species in metals, metal ions, metal oxides, and metal nitrides as the conductive material include Al, Ba, Be, Bi, Ca, Co, Cr, Cu, Fe, Ga, K, Li, Mg, Mn, Na, Ni, Pb, Sr, V, Zn, etc.

[0083] The metal as the conductive material may be a single substance or an alloy. The metal as the conductive material is typically contained in the form of fine particles.

[0084] The ions as the conductive material include all ionic forms that each metal species can take. The ions as the conductive material may exist in a dissolved form as ions having any valence, or may exist in the form of ions in a substance, for example, in a coordinated form.

[0085] The metal oxide as the conductive material may be an oxide of one metal species or an oxide of a plurality of metal species (i.e., a composite oxide).

[0086] The metal nitride as the conductive material may be a nitride of one metal species or a nitride of a plurality of metal species (i.e., a composite nitride).

[0087] Examples of carbon as the conductive material include carbon black.

[0088] Examples of conductive polymers as the conductive material include polyacetylene and polythiophene.

[0089] The content of the conductive material contained in the pre-purification composition is not limited. For example, if it is 150 mass ppm or more (more preferably 500 mass ppm or more), in the production method of the present disclosure, the content of the conductive material can be effectively reduced. The content of the conductive material can be measured as described in the examples using an inductively coupled plasma mass spectrometer (ICP-MS).

[0090] In addition, the pre-purification composition may contain insoluble substances including resin pieces of the container, dust mixed from the air, and solids such as dust, regardless of whether it has conductivity. For example, if the content of insoluble substances of 5 μm or more is 50 pieces / mL or more (more preferably 100 pieces / mL or more), in the purification treatment of the present disclosure for reducing the content of the conductive material, the content of the insoluble substances can be effectively reduced at the same time. The number of insoluble substances (fine particles) of the conductive material contained in the composition can be measured as described in the examples using a liquid particle counter.

[0091] (1-6-7) Physical properties of the pre-purification composition The pre-purification composition is a composition containing a heat transfer fluid and a conductive material, and in the production method of the present disclosure, it is subjected to a purification treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption.

[0092] When reducing the content of the conductive substance by the above purification treatment, it is preferable from the viewpoint of purification efficiency that the composition before purification has a low kinematic viscosity, a low freezing point, and a high boiling point. By using the three components of the present disclosure described above as the main component of the heat transfer fluid (preferably 80% by mass or more), it is easy to have the physical properties of the composition before purification, such as a low kinematic viscosity, a low freezing point, and a high boiling point.

[0093] The kinematic viscosity of the composition before purification at -40 °C is preferably 15 cSt or less, more preferably 10 cSt or less, and even more preferably 7 cSt or less. Since the kinematic viscosity is as low as 15 cSt or less, the filterability is improved, and in particular, the efficiency of the purification treatment using a filtration filter, a metal ion removal filter, etc. can be enhanced. The method for measuring the kinematic viscosity at -40 °C in the present disclosure is the method described in the examples.

[0094] The freezing point of the composition before purification is preferably -35 °C or lower, more preferably -50 °C or lower, even more preferably -70 °C or lower, and most preferably -100 °C or lower. Since the freezing point is as low as -35 °C or lower, the purification treatment at low temperatures is possible, so that the loss of the heat transfer fluid due to evaporation or the like can be reduced, and the efficiency of the purification treatment can be enhanced. The method for measuring the freezing point in the present disclosure is the method described in the examples.

[0095] The boiling point of the composition before purification is preferably 90 °C or higher, more preferably 95 °C or higher, and even more preferably 105 °C or higher. Since the boiling point is as high as 90 °C or higher, for the same reason as the low freezing point, the loss of the heat transfer fluid due to evaporation or the like can be reduced, and the efficiency of the purification treatment can be enhanced. The method for measuring the boiling point in the present disclosure is the method described in the examples.

[0096] (1-6-8) Purification treatment of the composition before purification In the production method of the present disclosure, the composition before purification is subjected to a purification treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption.

[0097] These purification means may be applied according to conventional methods. In the production method of the present disclosure, a purification treatment using a filtration filter is particularly preferred. The upper and lower limits of the filter pore diameter when using a filtration filter are not limited. For example, the upper limit can be set to 5 μm or less, 1 μm or less, 0.5 μm or less, or 0.1 μm or less. Also, for example, the lower limit can be set to 1.0 nm or more, 0.5 nm or more, 0.2 nm or more, or 0.1 nm or more.

[0098] As the above ion exchange resin, either a cation exchange resin or an anion exchange resin may be used. As the anion exchange resin, for example, an ion exchange resin having an amino group and / or a quaternary ammonium group as a functional group can be used. The ion exchange resin is preferably a strongly basic anion exchange resin. The basicity of the anion exchange resin can be variously set depending on the type of the polymer backbone and / or the functional group. Commercially available products may be used as the anion exchange resin. For example, “Diaion (registered trademark) SA” series manufactured by Mitsubishi Chemical Corporation, “A200” manufactured by Purolite, “Amberlite (registered trademark)” series manufactured by Organo, etc. can be used. As the cation exchange resin, for example, an ion exchange resin having a carboxylic acid group and / or a sulfonic acid group as a functional group can be used. The acidity of the cation exchange resin can be variously set depending on the type of the polymer backbone and / or the functional group. Commercially available products may be used as the cation exchange resin. For example, “Diaion (registered trademark) SK” series manufactured by Mitsubishi Chemical Corporation, “C100” manufactured by Purolite, “Amberlite (registered trademark)” series manufactured by Organo, etc. can be used.

[0099] Examples of the metal ion remover include chelating agents, activated carbon, etc. Examples of the chelating agent include CRB03, CRB05, CR20 (all manufactured by Mitsubishi Chemical Corporation), Si-Thiol, Si-Thiourea, Si-TMT, Si-DMT, Si-SCX-2, Si-Amine, Si-Trisamine, Si-Imidazole, Si-TBD, Si-PHI (all manufactured by SiliCycle), Muromac XMS-5418 (manufactured by Muromachi Chemical Co., Ltd.), IRC76-HG, IRC748, IRC747UPS (all manufactured by Organo Corporation), S910 (manufactured by Purolite), MPA (manufactured by Reaxa QuadraPure), etc. Examples of the activated carbon include "Shirasagi (registered trademark)" manufactured by Osaka Gas Chemical Co., Ltd., "Filtrasorb (registered trademark) CAL", "Diahope (registered trademark)", "DiaSorb (registered trademark)" manufactured by Calgon Carbon Japan Co., Ltd., "EvaDia (registered trademark)" series manufactured by Suisho Co., Ltd., etc.

[0100] By undergoing the above purification treatment, a composition for a heat transfer fluid (post-purification composition) with a reduced content of conductive substances can be obtained.

[0101] The above production method includes the step of the purification treatment, but in addition, it may also include steps such as blending additives such as stabilizers into the composition for a heat transfer fluid, and other steps.

[0102] (2. Heat Transfer Fluid) The composition for a heat transfer fluid of the present invention can be used in combination with components other than the composition for a heat transfer fluid (hereinafter, a fluid containing the composition for a heat transfer fluid and components other than the composition for a heat transfer fluid is referred to as a heat transfer fluid). The heat transfer fluid of the present disclosure includes the compounds represented by the above formulas (I) to (III), and C m F 2m and / or C n F (2n-2) , water and / or fluoride ions, and may contain any additives other than the composition for a heat transfer fluid within a range that does not inhibit its effects and purposes. Examples of such arbitrary additives include stabilizers, etc.

[0103] The stabilizer exerts a stabilizing effect and functions as a so-called acid acceptor or antioxidant. As the stabilizing effect, the main ones include the effect of preventing the decomposition of the HFP trimer by scavenging radicals generated in the system, and the acid acceptor effect of preventing further decomposition of the HFP trimer by acid, etc., by capturing the acid generated in the system.

[0104] As such a stabilizer, it is possible to widely adopt known stabilizers. Among them, since it can effectively suppress the generation of metal corrosion by the composition, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, amine-based stabilizers, phenol-based stabilizers, and epoxy-based stabilizers.

[0105] As the unsaturated alcohol-based stabilizer, it is possible to widely adopt known ones. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadien-1-ol, and oleyl alcohol can be used.

[0106] As the nitro-based stabilizer, it is possible to widely adopt known ones. As aliphatic nitro compounds, for example, nitromethane, nitroethane, 1-nitropropane, 2-nitropropane, etc. can be mentioned. As aromatic nitro compounds, for example, one or more selected from the group consisting of nitrobenzene, o-, m- or p-dinitrobenzene, o-, m- or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m- or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole can be used.

[0107] As the amine stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dibenzylamine, tribenzylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine and diethylhydroxylamine can be used.

[0108] As the phenolic stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of 2,6-di-tert-butyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0109] As the epoxy stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0110] By using a combination of stabilizers having different stabilizing effects, it is possible to more effectively prevent the decomposition of HFP trimers that may occur for various reasons. Therefore, it is preferably composed of the above-described epoxy-based stabilizer and one or more selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers.

[0111] From the viewpoint of effectively suppressing the acid dissociation from the above HFP trimer and suppressing the corrosion of metals by the liquid composition, the content of the stabilizer with respect to the entire heat transfer fluid is preferably 0.0001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, considering the point of avoiding unfavorable physical property changes of the liquid composition due to excessive addition of the stabilizer, the content of the stabilizer with respect to the entire heat transfer fluid is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0112] (3. Use of the Composition for Heat Transfer Fluid or the Heat Transfer Fluid) The composition for heat transfer fluid or the heat transfer fluid of the present disclosure is used to take heat from various objects to be heat-transferred or supply heat to the objects to be heat-transferred. The objects to be heat-transferred in the present disclosure are articles, devices, and atmospheres that are cooled, heated, or maintained at a temperature to be controlled. Examples of such objects to be heat-transferred include electrical parts, mechanical parts, and optical parts, as well as processed products and assembled products thereof. Specific examples of the objects to be heat-transferred in the present disclosure are not particularly limited, but include wafers used for manufacturing semiconductor devices, microprocessors, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, mounted and non-mounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, missile parts, and the like.

[0113] The composition for heat transfer fluid or the heat transfer fluid of the present disclosure can also be used as a two-phase liquid immersion cooling fluid, a chiller fluid, or a Rankine cycle working fluid.

[0114] The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can be used to replace the heat transfer fluid in use in a device designed to transfer heat using these in the device.

[0115] The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can be a drop-in replacement, near-drop-in replacement, or retrofit replacement for the heat transfer fluid in use. Note that "drop-in replacement" means that it can be replaced without any changes on the device side. "Near-drop-in replacement" means that it can be replaced with almost no changes on the device side. "Retrofit replacement" means that it can be replaced with a minimum amount of changes (without significant changes) on the device side. The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is preferably capable of being a drop-in replacement or near-drop-in replacement for the above heat transfer fluid.

[0116] Whether a drop-in replacement, near-drop-in replacement, or retrofit replacement is possible can be determined by whether all of the following conditions are satisfied. (i) The boiling point of the heat transfer fluid is at least about 80% or more, preferably at least about 85% or more of the boiling point of the heat transfer fluid before replacement. (ii) The pour point of the heat transfer fluid is equal to or lower than the pour point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% or less, preferably at least about 150% or less of the kinematic viscosity of the heat transfer fluid before replacement. (iv) The heat transfer fluid is miscible with the heat transfer fluid before replacement in any ratio.

[0117] By setting the boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to at least about 80% or more, preferably at least about 85% or more of the boiling point of the heat transfer fluid before replacement, the occurrence of cavitation and leakage from the device can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but for example, it may be at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0118] By making the pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use it even at temperatures below the conventional operating temperature, and the operating temperature range can be increased. The upper limit of the pour point of the heat transfer fluid is not particularly limited, but for example, it may be at a temperature not higher than 30 °C higher than the pour point of the heat transfer fluid before replacement.

[0119] By making the kinematic viscosity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure at most about 200%, preferably at most about 150% of the kinematic viscosity of the heat transfer fluid before replacement, an increase in power consumption can be suppressed or the power consumption can be reduced. The kinematic viscosity is preferably compared at the kinematic viscosity at the operating temperature, but is not limited thereto, and for example, it can be compared at the kinematic viscosity at any temperature between -20 °C and -40 °C, specifically at the kinematic viscosity at -20 °C.

[0120] When the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is miscible with the heat transfer fluid before replacement in any ratio, replacement work becomes easy.

[0121] Furthermore, when the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure satisfies the following conditions, it is suitable for drop-in replacement, near drop-in replacement, or retrofit replacement. (v) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure has a relative permittivity of at most 120% of the relative permittivity of the heat transfer fluid before replacement. (vi) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure has a dielectric strength of at least 90% of the dielectric strength of the heat transfer fluid before replacement. (vii) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure has a specific heat of at least 90% of the specific heat of the heat transfer fluid before replacement. (viii) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure has a thermal conductivity of at least 90% of the thermal conductivity of the heat transfer fluid before replacement.

[0122] By setting the dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 120% or less of the dielectric constant of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The lower limit of the dielectric constant of the heat transfer fluid is not particularly limited, but for example, it may be 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0123] By setting the dielectric breakdown voltage of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 90% or more of the dielectric breakdown voltage of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the dielectric breakdown voltage of the heat transfer fluid is not particularly limited, but for example, it may be 120% or less of the dielectric breakdown voltage of the heat transfer fluid before replacement.

[0124] By setting the specific heat of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 90% or more of the specific heat of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the specific heat of the heat transfer fluid is not particularly limited, but for example, it may be 120% or less of the specific heat of the heat transfer fluid before replacement.

[0125] By setting the thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 90% or more of the thermal conductivity of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the thermal conductivity of the heat transfer fluid is not particularly limited, but for example, it may be 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0126] The boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can preferably be 105°C or higher, more preferably 108°C or higher. Also, the upper limit of the boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, but for example, it can be 150°C or lower, 130°C or lower, or 120°C or lower.

[0127] The pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can preferably be -80°C or lower, more preferably -100°C or lower, and even more preferably -110°C or lower. Also, the lower limit of the pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, but for example, it can be -180°C or higher, or -160°C or higher.

[0128] The kinematic viscosity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can be, at -20°C, preferably 6.0 cSt or less, more preferably 5.0 cSt or less, still more preferably 4.0 cSt or less, and even more preferably 3.5 cSt or less. Also, the lower limit of the kinematic viscosity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and can be, for example, 1.0 cSt or more.

[0129] The dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can be preferably 3.0 or less, more preferably 2.5 or less, and still more preferably 2.0 or less. Also, the lower limit of the dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and can be, for example, 1.1 or more.

[0130] The dielectric breakdown voltage of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can be preferably 40 kV or more, more preferably 50 kV or more. Also, the upper limit of the dielectric breakdown voltage of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and can be, for example, 150 kV or less, or 100 kV or less.

[0131] The specific heat of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure at 30°C can be preferably 800 J / kg·K or more, more preferably 900 J / kg·K or more, and still more preferably 1000 J / kg·K or more. Also, the upper limit of the specific heat of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and can be, for example, 2000 J / kg·K or less, or 1500 J / kg·K or less.

[0132] The thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure at 30°C can be preferably 0.055 W / mK or more, more preferably 0.060 W / mK or more, and still more preferably 0.065 W / mK or more. Also, the upper limit of the thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and can be, for example, 0.090 W / mK or less, or 0.080 W / mK or less.

[0133] The boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the temperature at which a peak derived from endotherm is observed when the temperature is raised from 25°C at a rate of 5°C / min using DSC (differential scanning calorimetry).

[0134] The pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the temperature at which a peak derived from endotherm is observed when the temperature is raised at a rate of 5°C / min after cooling to below the freezing point with liquid nitrogen using DSC.

[0135] The dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the value observed at a frequency of 1 kHz in an environment of a temperature of 25°C and a humidity of 60% using the capacitance method.

[0136] The kinematic viscosity and density of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure are the values measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0137] The dielectric breakdown voltage of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the dielectric breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined interval and the voltage is increased at a constant rate. The measurement conditions are as follows. Electrode shape: spherical (φ12.5 mm) Electrode interval: 2.5 mm Voltage increase rate: 2 kV / second Measurement atmosphere: in air (22°C, 57% RH)

[0138] The specific heat of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the value obtained under the following conditions using DSC. Measuring device: Differential Scanning Calorimeter DSC8500 manufactured by Perkin-Elmer Temperature increase rate: 10°C / min Standard sample: sapphire (-Al2O3) Atmosphere: in a dry nitrogen stream Sample container: aluminum sealed container

[0139] The thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the value obtained by the transient hot-wire method.

[0140] The compatibility of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is determined by whether it is miscible when mixed with the target solvent. Here, miscible means that when the two are mixed, they become a uniform state, that is, the phases do not separate.

[0141] (4. Heat transfer device) The present disclosure further discloses a heat transfer device including a device and a mechanism for transferring heat to or from the device, including the above-described composition for a heat transfer fluid.

[0142] Examples of the device include computers, server computers, servers including blade servers; disk arrays / storage systems; storage area networks; storage connected to a network; storage communication systems; workstations; routers; telecommunications infrastructure / switches; wired, optical, and wireless communication devices; cell processing devices; printers; power supply devices; displays; optical devices; measurement systems including handheld systems; military electronic equipment, etc.

[0143] The semiconductor element is a heat-generating element mounted on the device, and examples include CPUs, GPUs, SSDs, etc. The semiconductor element is composed of, for example, single-element silicon, germanium, compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), etc.

[0144] When the device is a server computer, one logic board or a plurality of logic boards are arranged in the internal space. The logic board includes a number of heat-generating electronic components including at least one processor such as a CPU or GPU. In addition, for example, other heat-generating components of a computer such as a chipset; memory, graphics chip, network chip, RAM, power supply device, daughter card; storage drives such as solid state drives and mechanical hard disks can also be used.

[0145] The heat transfer device is a heat transfer device for transferring heat between the heat transfer fluid and an object to be heat transferred, and heat transfer (transmission) is performed by making heat contact with the object to be heat transferred. For example, when taking heat from the object to be heat transferred, it is cooling, and when supplying heat, it is heating. Although it may be different mechanisms according to each case, one heat transfer device may cover both cooling and heating.

[0146] The heat transfer device is not particularly limited, and examples include a pump, a valve, a fluid confinement system, a pressure control system, a cooler, a heat exchanger, a heat source, a heat sink, a refrigeration system, an active temperature control system, a passive temperature control system, and the like.

[0147] More specifically, a temperature-controlled wafer chuck in a plasma-enhanced chemical vapor deposition (PECVD) tool, a temperature-controlled test head for die performance testing, a temperature-controlled working area in semiconductor process equipment, a heat shock test bath solution reservoir, a constant temperature bath, and the like can be mentioned.

[0148] The object to be heat transferred that is brought into thermal contact with the heat transfer device is an article, device, or atmosphere that is cooled, heated, or maintained at a temperature to be controlled. Such objects to be heat transferred include electrical components, mechanical components, and optical components, as well as processed products and assembled products thereof. Specific examples of the object to be heat transferred in the present disclosure include, for example, a microprocessor, a wafer used for manufacturing a semiconductor device, a power control semiconductor, an electrical branch switch, a power transformer, a circuit board, a multi-chip module, mounted and non-mounted semiconductor devices, a chemical reactor, a nuclear reactor, a fuel cell, a laser, a missile component, and the like, but are of course not limited thereto.

[0149] (5. Heat transfer method) The present disclosure further discloses a heat transfer method including a step of preparing a device and a step of transferring heat to or from the device using the above-described composition for a heat transfer fluid. Here, heat can be transferred by disposing a heat transfer device so as to be in thermal contact with the device. The heat transfer device, when disposed so as to be in thermal contact with the device, removes heat from the device, supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer device.

[0150] As described above, the embodiments of the present invention have been described. However, the present invention is not limited to such examples, and it goes without saying that the present invention can be implemented in various forms without departing from the gist of the present invention.

Example

[0151] Hereinafter, based on examples, embodiments of the present invention will be described more specifically, but the present invention is not limited thereto.

[0152] (Production Example 1) Based on the method described in Chem Bar (1973), Vol. 106, pp2950-2959, an HFP trimer was obtained. The obtained HFP trimer was purified by distillation to remove impurities such as dimers and tetramers of hexafluoropropene. Further, the purified HFP trimer was separated by distillation into the compounds represented by formulas (I), (II), and (III). Each of the separated HFP trimers was dehydrated using silica gel.

[0153] The compounds represented by formulas (I), (II), and (III) obtained above were mixed so that the ratios of the compounds represented by formulas (I), (II), and (III) were the ratios shown in the following table to obtain trimer mixtures 1 to 4.

[0154]

Table 1

[0155] (Production Example 2) Based on the method described in Journal of the Chemical Society, Perkin Transactions 1: Organic and Bio-Organic Chemistry (1981), Vol. 4, pp1064-1067, C9F 16 was synthesized.

[0156] (Production Example 3) C8F 16 was purchased as a reagent manufactured by Wako Pure Chemical Industries, Ltd.

[0157] (Examples 1 to 43) Trimer mixtures 1 to 4 and C9F of Production Example 2 16 or C8F of Production Example 3 16 were mixed at the ratios shown in the following table to obtain the compositions for heat transfer fluids of Examples 1 to 43.

[0158] (Stability Test) The obtained composition for heat transfer fluid was put into a SUS autoclave, sealed, and heated and held under the conditions shown in the following table.

[0159] (Measurement of Fluoride Ion Concentration) An equal amount (by weight) of distilled water was added to the sample, shaken for about 20 seconds to extract F ions into the aqueous layer. Then, 2.5 to 3.0 mL of the aqueous layer was withdrawn with a pipette, and the solution mixed with twice the amount of TISAB solution (total ion strength adjustment buffer solution: manufactured by HORIBA) was used as a sample and measured with a fluoride ion meter (manufactured by HORIBA). Since it was diluted with the TISAB solution, three times the measured value was the fluoride ion concentration. The results are shown in the following table.

[0160] [Table 2]

[0161] [Table 3]

[0162] From the above results, C9F 16 or C8F 16 Examples 1 to 43 containing were confirmed to be stable with no increase in fluorine concentration observed even after long-term storage at high temperature.

[0163] <Measurement of Boiling Point, Pour Point and Dielectric Constant> The boiling point of the trimer mixture was taken as the temperature at which a peak derived from endotherm was observed when the temperature was raised from 25°C at a rate of 5°C / min using DSC (Differential Scanning Calorimetry). The pour point was taken as the temperature at which a peak derived from endotherm was observed when the temperature was raised at a rate of 5°C / min after cooling to below the freezing point with liquid nitrogen using DSC. The dielectric constant was measured at a frequency of 1 kHz by the capacitance method under an environment of temperature 25°C and humidity 60%.

[0164] <Measurement of Kinematic Viscosity and Density> The kinematic viscosity and density of the trimer mixture were measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0165] <Measurement of Specific Heat> The specific heat of the trimer mixture was measured using DSC. The measurement conditions were as follows. Measuring device: Differential Scanning Calorimeter DSC8500 manufactured by Perkin-Elmer Heating rate: 10°C / min Standard sample: Sapphire (-Al2O3) Atmosphere: In a dry nitrogen stream Sample container: Aluminum sealed container

[0166] <Measurement of Thermal Conductivity> The thermal conductivity of the trimer mixture was measured by the transient hot-wire method.

[0167] <Compatibility> The compatibility of the trimer mixture was evaluated by mixing equal amounts of each of the following three solvents and each trimer mixture. Galden HT135 (manufactured by Solvay) SF-10 (manufactured by Kemars) FC3283 (manufactured by 3M)

[0168]

Table 4

[0169] (Examples 44 - 59) The trimer mixtures 1 - 4 and water were mixed in the amounts shown in the following table to obtain the compositions of Examples 44 - 59.

[0170]

Table 5

[0171] (Stability test) The compositions of Examples 44 - 59 and Comparative Examples 3 - 6 were placed in an SUS autoclave, sealed, and heated and held under the conditions shown in the following table.

[0172] (Insulation resistance measurement) The insulation resistance was measured as the breakdown voltage when a liquid sample was immersed between spherical electrodes adjusted to a predetermined interval and the voltage was increased at a constant rate. The detailed measurement conditions were as follows. Electrode shape: spherical (φ12.5 mm) Electrode interval: 2.5 mm Voltage increase rate: 2 kV / second Measurement atmosphere: in air (22°C, 57% RH)

[0173]

Table 6

[0174] From the above results, it was confirmed that Examples 44 - 59 containing a predetermined amount of water were stable, with no increase in fluorine concentration observed even after long - term storage at high temperature. Also, it was confirmed that Examples 44 - 59 had high insulation resistance.

[0175] (Examples 60 - 83) Hydrofluoric anhydride was added to trimers 1 to 4 to prepare a reference solution, which was diluted with each trimer to obtain the compositions of Examples 60 to 83 in which the fluoride ion concentration was the concentration shown in the following table.

[0176] (Stability test) The sample was placed in an autoclave made of SUS, sealed, and heated and held under the conditions shown in the following table.

[0177] (Measurement of the purity of hexafluoropropene trimer) The purity of the hexafluoropropene trimer before and after the stability test was measured by gas chromatography.

[0178] [Table 7]

[0179] [Table 8]

[0180] From the above results, it was confirmed that Examples 60 to 83 containing a predetermined amount of fluoride ions maintained a high purity of the hexafluoropropene trimer even after being stored at a high temperature for a long period.

[0181] The compounds represented by the above formulas (I), (II) and (III) were mixed so that the ratios of the compounds represented by the formulas (I), (II) and (III) were the ratios shown in the following table to obtain trimers 5 to 6.

[0182] [Table 9]

[0183] (Production of hexafluoropropene tetramer) (Production Example 4) Based on the method described in Tetrahedron Lett. 1974, 24, 2129-2132, hexafluoropropene tetramer was obtained.

[0184] By mixing the trimer mixture 5 or 6 with the hexafluoropropene tetramer obtained in Production Example 4, the heat transfer fluid of the present disclosure can be obtained.

[0185] <Evaluation Method> (Boiling Point) The boiling point was measured as the temperature at which a peak derived from endotherm was observed when the temperature was raised from 25°C at a rate of 5°C / min using DSC.

[0186] (Kinematic Viscosity) The kinematic viscosity was measured at 25°C using an Ubbelohde viscometer based on JIS K 2283.

[0187] (Dielectric Constant) The dielectric constant was measured at a frequency of 1 kHz by the capacitance method in an environment of 25°C and 60% humidity.

[0188] (Examples 84 - 85) They were mixed at a weight ratio of trimer mixture 5:hexafluoropropene tetramer = 91:9 (Example 84) and trimer mixture 6:hexafluoropropene tetramer = 91:9 (Example 85). Each physical property was measured and the results are shown in Table 2.

[0189]

Table 10

[0190] <Examples 86 - 87> In Examples 86 to 87, a pre-purification composition (Composition 1 containing a heat transfer fluid and a conductive substance; 6FT) to be subjected to a purification process was prepared. Specifically, 750 g of DMF and 7.2 g of cesium fluoride were placed in an SUS autoclave and sealed. After degassing the inside of the autoclave under vacuum, 2268 g of hexafluoropropylene was added over 4.5 hours while maintaining the temperature inside the autoclave at 70 to 110°C. The lower layer was separated from the obtained reaction solution and washed with ultrapure water to obtain 2219 g of a composition (Composition 1 which is the pre-purification composition) containing HFP trimer. GCFID and GC-MS analyses were performed, and it was confirmed that the HFP trimer was contained in 87% by mass in the total amount of 100% by mass of the composition, and the compounds represented by the formulas (I), (II), and (III) described in this specification were contained in 78% by mass, 9% by mass, and 13% by mass, respectively, in the total amount of 100% by mass of the HFP trimer.

[0191] <Example 88> The same operations as in Examples 86 to 87 were performed to isolate the compounds represented by the formulas (I), (II), and (III), and the compounds represented by the formulas (I), (II), and (III) were mixed in such a manner that they were 55% by mass, 15% by mass, and 30% by mass, respectively, to prepare 2200 g of a composition.

[0192] <Example 89> The same operations as in Examples 86 to 87 were performed to isolate the compounds represented by the formulas (I), (II), and (III), and the compounds represented by the formulas (I), (II), and (III) were mixed in such a manner that they were 3% by mass, 33% by mass, and 64% by mass, respectively, to prepare 2200 g of a composition.

[0193] <Example 90> The same operations as in Examples 86 to 87 were performed to isolate the compounds represented by the formulas (I), (II), and (III), and the compounds represented by the formulas (I), (II), and (III) were mixed in such a manner that they were 90% by mass, 5% by mass, and 5% by mass, respectively, to prepare 2200 g of a composition.

[0194] (Measurement of metal and metal ion contents in the pre-purification composition) The content of the conductive substance (in this example, particular attention was paid to the content of metals and metal ions) in the pre-purification composition was determined by the following procedure using an inductively coupled plasma mass spectrometer (ICP-MS) (the same applies to the post-purification composition). Each measured value was as shown in Table 1 below. (1) 2000 g of the pre-purification composition was poured into a beaker made of polytetrafluoroethylene (PTFE), and the beaker was placed on a hot plate at 250 °C to volatilize the volatile components. (2) Ultra-trace precision analytical nitric acid (manufactured by Wako Pure Chemical Industries, Ltd.) with a concentration of 70% was diluted with ultrapure water to obtain nitric acid with a concentration of approximately 4% by mass, and then approximately 50 mL of this was placed in a PTFE beaker. (3) The PTFE beaker was placed on a hot plate at 150 °C for 1 hour to dissolve the metal remaining in the beaker. (4) The amount of metal ions dissolved in the nitric acid was measured using ICP-MS. Using the amount of metal ions in the nitric acid, the amount of nitric acid, and the amount of the volatilized solution, the content of metals and metal ions in the solution was calculated. (5) All operations related to the above measurements were carried out in a cleanroom of class 10000 with a table coach manufactured by Koken Co., Ltd. installed, and the working environment was set as an environment equivalent to class 1.

[0195] (Measurement of the number of insoluble substances (fine particles) in the pre-purification composition) Regarding the number of particles with a particle size of 5.0 μm or more, the number of particles with a particle size of more than 1.0 μm and less than 5.0 μm, the number of particles with a particle size of more than 0.5 μm and less than 1.0 μm, and the number of particles with a particle size of more than 0.3 μm and less than 0.5 μm in the pre-purification composition, they were measured at a temperature of 23 °C using a liquid particle counter ("KL-22" manufactured by RION) (the same applies to the post-purification composition). All operations related to the measurement were carried out in a cleanroom of class 10000 with a table coach manufactured by Koken Co., Ltd. installed, and the working environment was set as an environment equivalent to class 1.

[0196] (Measurement of the boiling point, freezing point, and kinematic viscosity of the pre-purification composition) The boiling point was defined as the temperature at which a peak derived from endotherm was observed when the temperature was raised from 25 °C at a rate of 5 °C / min using DSC. The freezing point was defined as the temperature at which a peak derived from endotherm was observed when the temperature was raised at a rate of 5 °C / min after cooling to -150 °C or lower (the temperature at which solidification was confirmed) using liquid nitrogen with DSC. The kinematic viscosity was measured using an Ubbelohde viscometer based on JIS K 2283. Each measured value was as shown in Table 1 below.

[0197] (Purification treatment) As a filtration device, a unit in which one filter was packed in one container was prepared for each filter, and a multi-stage filtration device in which the required number of these units were connected in series was prepared.

[0198] The pre-purification composition was placed in a pressure vessel and cooled to -5 °C or lower, and under a high-purity argon atmosphere, it was pressure-filtered up to 0.02 MPa using the above filtration device to obtain a post-purification composition. At that time, as the filters packed in each unit of the filtration device, · Filter A (ION CLEAN SL manufactured by Nippon Pall Co., Ltd., filtration area: 0.58 m2), · Filter B (ULTRA PLEATS P-NYLON manufactured by Nippon Pall Co., Ltd., pore diameter: 0.15 μm, filtration area: 1.2 m2), and · Filter C (ULTRA PLEATS P-NYLON manufactured by Nippon Pall Co., Ltd., pore diameter: 40 nm, filtration area: 1.2 m2) were used as described in Table 1. The results are shown in Table 1.

[0199] From the results in Table 1, it was found that by subjecting the pre-purification composition to a predetermined purification treatment, the content of conductive substances (especially metals and metal ions) can be reduced.

[0200]

Table 11

[0201]

Table 12

Claims

1. C ９ F １８ (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） [wherein m is an integer of 4 or more and 12 or less, other than 9; and n is an integer of 4 or more and 12 or less], (ii) water (wherein the content of such water is determined by the above-mentioned C ９ F １８ and / or (iii) fluoride ions (wherein the content of such fluoride ions is within the range of C ９ F １８ and 0.0000001 to 5 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula:

2. The heat transfer fluid composition according to claim 1, wherein the hexafluoropropene trimer comprises at least one compound selected from the group consisting of compounds represented by the following formulas (I) to (III): 【Chemistry 1】

3. 3. The heat transfer fluid composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of 85 mass % or more based on the total amount of the hexafluoropropene trimer.

4. 3. The heat transfer fluid composition according to claim 2, wherein the compound represented by formula (I) is contained in an amount of less than 85 mass % based on the total amount of the hexafluoropropene trimer.

5. 3. The heat transfer fluid composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of 50% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropene trimer.

6. C ９ F １８ (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） 2. The heat transfer fluid composition of claim 1, comprising: wherein m is an integer between 4 and 12, inclusive, except for 9; and n is an integer between 4 and 12, inclusive.

7. 2. The heat transfer fluid composition of claim 1, wherein m is an integer between 6 and 11, inclusive, other than 9, and n is an integer between 6 and 11, inclusive.

8. C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The content of C ９ F １８ The heat transfer fluid composition according to claim 1, wherein the amount of the hexafluoropropene trimer represented by the formula (1) is 0.0001 to 10 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula (1).

9. C ９ F １８ 2. The heat transfer fluid composition of claim 1, comprising: (i) a hexafluoropropene trimer represented by the formula:

10. C ９ F １８ 2. The heat transfer fluid composition of claim 1, comprising a hexafluoropropene trimer represented by the formula:

11. C １２ F ２４ 2. The heat transfer fluid composition according to claim 1, further comprising a hexafluoropropene tetramer represented by the formula:

12. The heat transfer fluid composition according to claim 11, wherein the content of the hexafluoropropene trimer is 90% by mass or more and 99.99% by mass or less based on the total content of the hexafluoropropene trimer and the hexafluoropropene tetramer.

13. The heat transfer fluid composition of claim 11, wherein the hexafluoropropene tetramer comprises 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

14. The heat transfer fluid composition according to claim 1 , further comprising a conductive material, the content of the conductive material being 100 ppm by mass or less.

15. The heat transfer fluid composition according to claim 1 , further comprising a conductive material, and a content of insoluble matter having a size of 5 μm or more being 10 pieces / mL or less.

16. A heat transfer fluid comprising the heat transfer fluid composition according to claim 1 or 2.

17. Use of the heat transfer fluid composition according to claim 1 or 2 as a heat transfer fluid.

18. 3. An apparatus for heat transfer comprising a device and a mechanism for transferring heat to or from said device, said mechanism comprising the heat transfer fluid composition of claim 1 or 2.

19. 3. A method of heat transfer comprising the steps of providing a device and transferring heat to or from said device using the heat transfer fluid composition of claim 1 or 2.

Images