X-ray reflection analysis system and x-ray reflection analysis method utilizing multi-order mode signals

Abstract

To provide an X-ray reflection analysis system and X-ray reflection analysis method utilizing multi-order mode signals.SOLUTION: An X-ray reflection analysis system includes an X-ray generator, an X-ray optical element group, an X-ray detector and a processing device. The X-ray generator generates a measurement X-ray beam (S10). The X-ray optical element group guides the measurement X-ray beam to a to-be-measured sample (S11). The X-ray detector receives the to-be-measured X-ray signal generated by the measurement X-ray beam irradiating the to-be-measured sample (S12). The processing device collects the to-be-measured X-ray signal and extracts mode signals (S13); performs a first fitting analysis process on the mode signals whose order is less than a predetermined order to generate initial parameter ranges (S14); and based on the initial parameter ranges, performs a second fitting analysis process on the mode signals whose order is greater than or equal to the predetermined order, to generate parameter fitting results (S15).SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an analysis system and an analysis method, and more particularly to an X-ray reflection analysis system and an X-ray reflection analysis method that utilize multi-mode signals. [Background technology]

[0002] In conventional X-ray measurement systems, when measuring a small area on a test sample, the obtained signal is very weak, requiring a long integration time to acquire analyzable data. Furthermore, if a small change occurs in the size of the sample, multiple measurement results must be acquired at different angles to reflect the change and maintain measurement accuracy. As a result, the cumulative total measurement time becomes very long.

[0003] Furthermore, if the structure of the test object is complex and the number of layers is large, it takes a lot of time to obtain the measurement results, and the fitting analysis requires a huge amount of computational resources and time, which affects the measurement efficiency. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide an X-ray reflectometry system and method that utilize multi-mode signals in response to the shortcomings of the prior art.

[0005] In order to solve the above-mentioned technical problems, one technical means of the present invention provides an X-ray reflectance analysis system using multi-order mode signals. The X-ray reflectance analysis system includes an X-ray generator, an X-ray optical element group, an X-ray detector, and a processing device. The X-ray generator is configured to generate a measurement X-ray beam. The X-ray optical element group guides the measurement X-ray beam to a test sample. The X-ray detector receives an X-ray test signal generated by the measurement X-ray beam irradiating the test sample. The processing device is configured to perform the following steps: collect the X-ray test signal and extract multiple mode signals of different orders; perform a first fitting analysis process on the mode signals having orders smaller than a predetermined order to generate multiple initial parameter ranges corresponding to multiple structural parameters; and perform a second fitting analysis process on the mode signals having orders equal to or greater than the predetermined order based on the initial parameter ranges to generate multiple parameter fitting results corresponding to the structural parameters.

[0006] To solve the above technical problems, another technical means of the present invention provides an X-ray reflection analysis method using multi-order mode signals, which includes configuring a processing device to perform the following steps: configuring an X-ray generator to generate a measurement X-ray beam; guiding the measurement X-ray beam to a test sample using an X-ray optical element group; receiving an X-ray test signal generated by the test sample being irradiated with the measurement X-ray beam using an X-ray detector; collecting the X-ray test signal and extracting a plurality of mode signals of different orders; performing a first fitting analysis process on the mode signals having orders smaller than a predetermined order to generate a plurality of initial parameter ranges respectively corresponding to a plurality of structural parameters; and performing a second fitting analysis process on the mode signals having orders equal to or greater than the predetermined order based on the initial parameter ranges to generate a plurality of parameter fitting results corresponding to the structural parameters.

[0007] One of the beneficial effects of the present invention is that in the X-ray reflectivity analysis system and method using multi-mode signals provided by the present invention, the sensitivity characteristics of higher-order mode signals to minute changes in three-dimensional structure can be obtained, thereby significantly reducing the required measurement angle range, thereby significantly shortening the measurement time and improving the throughput of measurement results.

[0008] Furthermore, the X-ray reflectivity analysis system and method using multi-mode signals provided by the present invention significantly reduce the time required for three-dimensional electromagnetic wave fitting models by using at least two types of fitting models, each of which has the characteristics of high-speed calculation and high accuracy.

[0009] In order to further understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the drawings, but the drawings provided are for reference and illustration purposes only and are not used to limit the present invention. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram of an X-ray analysis system using multi-mode signals according to an embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view of a test sample according to an embodiment of the present invention. [Figure 3] 10A to 10C are reflection spectrum diagrams of mode signals of different orders obtained with different structural parameters in an embodiment of the present invention. [Figure 4] 10 is a curve diagram of the change in reflectivity caused by different order mode signals with different structural parameters according to an embodiment of the present invention; [Figure 5] 1 is a flowchart of an X-ray analysis method using multi-mode signals according to an embodiment of the present invention. [Figure 6] 10 is a detailed flowchart of step S13. [Figure 7] 3A and 3B are schematic diagrams of diffraction patterns generated after a test pattern reflects a measurement X-ray beam according to an embodiment of the present invention. [Figure 8] 4A and 4B are curve diagrams of mode signals of each order separated according to an embodiment of the present invention. [Figure 9] FIG. 1 is a schematic diagram of fitting using an EMA model according to an embodiment of the present invention. [Figure 10] 10 is a detailed flowchart of step S15. [Figure 11] 1 is a flowchart of a pre-simulation process according to an embodiment of the present invention. [Figure 12] FIG. 10 is a curve diagram showing a comparison of signal strength and line width according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] The following describes the embodiments of the "X-ray reflectance analysis system and X-ray reflectance analysis method using multi-mode signals" disclosed in the present invention through specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the disclosed content. The present invention can be implemented or applied through other different specific embodiments, and various detailed descriptions herein can be modified and changed in various ways based on different perspectives and applications without departing from the spirit of the present invention. It should be noted that the drawings of the present invention are merely schematic and are not drawn to actual scale. The following embodiments will further explain the technical content of the present invention, but the disclosed content is not intended to limit the scope of protection of the present invention. Furthermore, the term "or" in this specification should be understood to include any one or more combinations of the relevant listed items, depending on the actual situation.

[0012] FIG. 1 is a schematic diagram of an X-ray analysis system using multi-mode signals according to an embodiment of the present invention. As shown in FIG. 1, the embodiment of the present invention provides an X-ray analysis system 1 including an X-ray generator 10, an X-ray optical group 12, an X-ray detector 14, and a processing device 16. The X-ray generator 10 may include an X-ray tube having an electron beam emitter and a target material therein that generates a measurement X-ray beam Lx by the impact of an accelerated electron beam. Note that by selecting different target materials, such as copper (Cu), iron (Fe), or molybdenum (Mo), measurement X-ray beams Lx of different energies or wavelengths (or frequencies) can be generated.

[0013] The X-ray optical element group 12 guides the measurement X-ray beam Lx to the test sample SP, which may be, for example, a gate-all-around and complementary field effect transistor (GAA-FET) structure or a three-dimensional NAND flash memory with a high aspect ratio structure that is repeatedly stacked and interconnected vertically.

[0014] The test sample SP may be mounted on a multi-axis sample stage 11, such as a multi-axis movable stage. Examples of multi-axis movable stages include a three-axis tilt stage or a ball-and-socket tilt stage for supporting the test sample SP. The multi-axis sample stage 11 may have a stage movement mechanism and a stage rotation mechanism. The stage movement mechanism may include, for example, stepping motors corresponding to three axes to move the test sample SP along one or more of the X-axis, Y-axis, and Z-axis. By controlling the stepping motors for each axis, the test sample SP can be accurately moved to various positions. In the case of a ball-and-socket tilt stage, for example, the stage rotation mechanism may be, for example, a ball-and-socket joint connected to the stage portion, and can rotate the test sample SP around one or more of the X-axis, Y-axis, and Z-axis. Specifically, the rotation mechanism of the multi-axis sample stage 11 includes controlling the azimuth angle θ of rotation around the Y-axis and the azimuth angle Φ of rotation around the Z-axis, thereby enabling the test sample SP to be scanned in all directions.

[0015] The X-ray optical element group 12 may include one or more X-ray optical elements. For example, the X-ray optical element group 12 may include an X-ray lens group, an X-ray slit, and an X-ray optical collimator, which are arranged in this order between the X-ray generator 10 and the test sample SP. The X-ray lens group may have a multilayer film structure for horizontally and vertically focusing the measurement X-ray beam Lx. The X-ray slit may be used to control the flux of the measurement X-ray beam Lx incident on the test sample SP and also to control the vertical divergence angle. The measurement X-ray beam Lx is primarily used in X-ray analysis techniques and may be, for example, a light beam having a wavelength range exceeding 0.1 nanometers. It may also include a hard X-ray beam, a soft X-ray beam, or a gamma ray beam.

[0016] When the measurement X-ray beam Lx strikes the test sample SP, an X-ray test signal Lx' is generated by reflection, diffraction, scattering, or transmission according to different incident angles. The X-ray detector 14 can be installed at an appropriate position to receive the X-ray test signal Lx' generated by the reflection, diffraction, scattering, or transmission and generate corresponding X-ray spectrum information. The X-ray detector 14 may be a one-dimensional or higher-resolution detector capable of receiving the X-ray test signal Lx' with an energy greater than 1 keV. The X-ray detector 14 may be, for example, a two-dimensional array of charge-coupled devices (CCDs) or CMOS image sensors, or may use one or more sensor units (e.g., silicon drift detectors (SDDs)) to acquire a complete diffraction pattern. In an embodiment of the present invention, a vertical integration mode is employed for the two-dimensional sensor array signals to process the received signals and acquire multi-order mode signals. Corresponding mode signals are acquired at specific angular positions according to the order, and subsequent fitting analysis is performed.

[0017] The processing device 16 may be, for example, a computer system including a processor and memory, and may be configured to execute a stored set of instructions or program code to control the X-ray generator 10 to generate the measurement X-ray beam Lx and to subsequently analyze the X-ray test signal Lx′ received by the X-ray detector 14.

[0018] In the measurement process, the processing device 16 may control the movement and / or rotation of the multi-axis sample stage 11 to cause the X-ray detector 14 to receive multiple X-ray test signals Lx' generated at multiple X-ray measurement angles, and generate multiple pieces of X-ray spectrum information corresponding to these X-ray test signals Lx'.

[0019] FIG. 2 is a cross-sectional schematic diagram of a test sample according to an embodiment of the present invention. FIG. 3 is a reflection spectrum diagram of mode signals of different orders obtained with different structural parameters in an embodiment of the present invention. FIG. 4 is a curve diagram of reflectivity changes occurring in mode signals of different orders with different structural parameters in an embodiment of the present invention. As shown in FIGS. 2 to 4, the test sample SP may have a plurality of target structures in a periodic arrangement. These target structures may be, for example, multilayer elements. The target structures have a plurality of structural parameters. The plurality of structural parameters may include, for example, one or more of the thickness, line width, and roughness of each layer.

[0020] For example, the test sample SP may include a periodic array of multiple GAA-FETs. As shown in FIG. 2, each GAA-FET includes multiple silicon germanium (SiGe) layers T1 and silicon layers T2 stacked on top of each other, with a silicon nitride layer T3 and a silicon dioxide layer T4 sequentially stacked on top of each other. The dimensions of the silicon germanium (SiGe) layers in the X and Y directions are generally considered to be critical dimensions (CDs), which are important indicators that determine the power and performance characteristics of the GAA-FET device.

[0021] In this embodiment, the length of the silicon germanium (SiGe) layer in the X and Y directions is referred to as the linewidth. The zero-order mode signal, first-order mode signal, and second-order mode signal obtained at different linewidths, such as 110 Å, 120 Å, and 130 Å, are shown in FIG. 3 , and the signal variations due to changes in linewidth are shown in FIG. 4 . As can be seen from FIGS. 3 and 4 , within a certain angle range, the higher-order mode signals (first-order and second-order mode signals) exhibit more significant variations in reflectivity with the same linewidth change than the lower-order mode signal (zero-order mode signal). That is, the higher-order mode signals (first-order and second-order mode signals) have a high sensitivity to linewidth at a certain angle. Based on the above phenomenon, the higher-order mode signals of different orders measured within a certain angle range can be considered as important information for fitting analysis, thereby determining the critical dimension (i.e., the structural parameter of the test sample SP). It should be noted that although the sensitivity of the zero-order mode signal is low, it is still useful as a reference for roughly estimating the range of the structural parameter.

[0022] Based on the above analysis, an embodiment of the present invention further provides an X-ray reflectance analysis method using multi-mode signals. Please refer to Fig. 5. Fig. 5 is a flowchart of the X-ray analysis method using multi-mode signals according to an embodiment of the present invention. The X-ray reflectance analysis method includes at least the following steps:

[0023] Step S10: Configure the X-ray generator to generate a measurement X-ray beam.

[0024] Step S11: The measurement X-ray beam is guided to the test sample by the X-ray optical element group.

[0025] Step S12: The X-ray detector receives an X-ray test signal generated by irradiating the test sample with the measurement X-ray beam.

[0026] The X-ray reflectance analysis method further includes configuring the processing unit 16 to perform the following steps:

[0027] Step S13: Collect X-ray test signals and extract multiple mode signals of different orders.

[0028] Please refer to Fig. 6. Fig. 6 is a detailed flowchart of step S13. As shown in Fig. 6, step S13 includes the following steps:

[0029] Step S130: The X-ray detector acquires a plurality of diffraction patterns within a predetermined angle range.

[0030] Step S131: For each diffraction pattern, multiple intensity signals corresponding to different orders are extracted. See FIG. 7. FIG. 7 is a schematic diagram of a diffraction pattern generated after a test pattern reflects a measurement X-ray beam according to an embodiment of the present invention. For example, first, an axial region (indicated by a dotted line in FIG. 7) with the strongest light intensity is found from the diffraction pattern, and then a Lorentzian function is used to fit the light intensity data based on this region, thereby separating the mode signals of each order.

[0031] Step S132: Intensity signals of the same order within a predetermined angle range are integrated, and multiple reflection spectra corresponding to different orders are calculated and obtained as mode signals.

[0032] Please refer to FIG. 8, which is a curve diagram of the separated mode signals of each order according to an embodiment of the present invention. In this step, after obtaining the mode signals of each order, the mode signals at different angles may be further integrated to generate data on the change in reflected light intensity with angle. Then, based on the values ​​of the reflected light intensity, the reflectivity at different angles may be calculated (see FIG. 8).

[0033] Step S14: A first fitting analysis process is performed on modal signals having orders smaller than the predetermined order to generate a plurality of initial parameter ranges respectively corresponding to a plurality of structural parameters.

[0034] In step S14, the first fitting analysis process generates a plurality of initial parameter ranges corresponding to the structural parameters by fitting modal signals having orders smaller than a predetermined order based on the target structure of the test sample SP through an effective medium approximation (EMA) model. In this embodiment, the predetermined order can be obtained based on a low-sensitivity modal signal (e.g., a zero-order modal signal) obtained through the aforementioned analysis. Therefore, the predetermined order is first order, and modal signals smaller than the first order can be used to quickly estimate the parameter range of the structural parameters in step S14.

[0035] It should be noted that the effective medium approximation model is an analytical or theoretical model for describing the macroscopic properties of a composite material. This theory calculates the properties of the composite material by averaging the properties of each component within the composite material. Because the parameters of each component in a composite material are often different and inhomogeneous, completely accurate calculations are nearly impossible. Therefore, the effective medium approximation theory treats the composite material as a whole and approximates its parameters and properties. Figure 9 is a schematic diagram of fitting using an EMA model according to an embodiment of the present invention. As shown in Figure 9, when fitting based on a target structure using an EMA model, the target structure is considered a stacked structure having multiple material layers, and the properties of each layer are described by the volume and density of each layer. For example, if the size of a silicon germanium layer is smaller than the underlying silicon layer, the silicon germanium layer and the air on both sides of it are defined as a virtual layer L2, and the density of the virtual layer L2 is calculated using the following equations (1) and (2):

[0036]

number

[0037]

number

[0038] where ρ eff,L2 denotes the density of the virtual layer L2, and ρ bulk1,L2 indicates the density of the silicon germanium layer, and volume mater1,L2 denotes the volume of the silicon germanium layer, and ρ bulk2,L2 indicates the density of the air, and volume mater2,L2 indicates the volume of the air portion, and volume total,L2 denotes the total volume of the virtual layer L2, and Px, Py, and h denote the length, width, and height of the virtual layer L2, respectively.

[0039] Therefore, the above-described stacked structure having multiple material layers is an estimated model for fitting the zero-order mode signal. The purpose is to use the zero-order mode signal as a fitting target, estimate initial parameter ranges for critical dimensions such as the length and width (i.e., line width) of the silicon germanium layer, and when a fitting completion condition is met (e.g., when convergence is determined), use the initial parameter range as the fitting result. Furthermore, the structural parameters may also include critical dimensions such as thickness and roughness.

[0040] Step S15: Based on these initial parameter ranges, a second fitting analysis process is performed on modal signals having orders greater than the predetermined order to generate multiple parameter fitting results corresponding to these structural parameters.

[0041] Please refer to Fig. 10. Fig. 10 is a detailed flowchart of step S15. In step S15, the second fitting analysis process includes the following steps:

[0042] Step S150: Input mode signals having orders equal to or greater than a predetermined order into the three-dimensional electromagnetic wave optimization model. In this step, the predetermined order may be, for example, the first order. Therefore, high-order mode signals (including first-order mode signals and second-order mode signals) that are highly sensitive to changes in linewidth are input into the three-dimensional electromagnetic wave optimization model.

[0043] In some embodiments, the three-dimensional electromagnetic wave optimization model may include, for example, one or more of a Finite-Difference Time-Domain (FDTD) algorithm, a Distorted Wave Born Approximation (DWBA) algorithm, a Rigorous Coupled Wave Analysis (RCWA) algorithm, a Discrete Dipole Approximation (DDP) algorithm, and a Boundary Element Method (BEM).

[0044] Step S151: Using these initial parameter ranges and the target structure of the test sample as initial fitting conditions, fitting is performed on mode signals having orders greater than a predetermined order, and parameter fitting results corresponding to these structural parameters are generated.

[0045] For example, the transfer matrix method may be used to perform fitting using an initial parameter range as the initial fitting condition of a three-dimensional electromagnetic wave optimization model, with the first-order mode signal and the second-order mode signal as fitting targets, respectively, and parameter fitting results corresponding to multiple structural parameters (e.g., line width, thickness, and / or roughness) may be generated on the premise that a convergence condition is reached.

[0046] It should be further noted that the present invention can also determine a specific angle for acquiring each order of modal signal. Please refer to Figure 11. Figure 11 is a flowchart of a pre-simulation process according to an embodiment of the present invention. In some embodiments, the predetermined angle range may be acquired through the pre-simulation process. The pre-simulation process includes the following steps:

[0047] Step S20: Adjust one or more of the structural parameters of the target structure.

[0048] For example, adjustments may be made to the line width, thickness, and roughness, respectively, to identify the angular ranges that are highly sensitive to the modal signals of each order.

[0049] Step S21: After irradiating the adjusted target structure with X-rays, a plurality of simulation mode signals having different orders are generated at a plurality of simulation angles.

[0050] In this step, these simulation mode signals may be obtained using optical simulation methods based on the adjusted structural parameters.

[0051] Step S22: Based on the simulation mode signal, a sensitivity angle range that has high sensitivity to changes in these structural parameters is obtained as a predetermined angle range.

[0052] Specifically, as shown in Figure 3, reflection spectrum diagrams of mode signals of different orders for different structural parameters are obtained, and the sensitivity angle range in which the sensitivity of each order of mode signal is significantly different is identified. This can be used as the predetermined angle range for fitting analysis of specific structural parameters.

[0053] Furthermore, for dimensional changes in relatively simple three-dimensional structures, the intensities of mode signals of multiple orders can be compared, and a correspondence relationship can be determined based on the structural changes corresponding to the comparison results. For example, a lookup table can be created that defines the relationship between the relative intensities of mode signals of each order and a specific amount of linewidth change within an appropriate sensitivity angle range. This relationship can be linear or nonlinear. By utilizing this relationship, when performing measurements within this sensitivity angle range, the amount of linewidth change can be determined simply by measuring the intensity of the mode signal of each order, thereby shortening the overall measurement time.

[0054] Please refer to FIG. 12, which is a curve diagram showing a comparison of signal intensity and linewidth according to an embodiment of the present invention. By recording the signal intensity ratios (e.g., zeroth order vs. first order and zeroth order vs. second order) at multiple different linewidths, the relative intensity relationship between the mode signals of each order can be defined. After that, the linewidth change can be directly determined based on the intensity of the separated signals of each order without the need for calculation by fitting analysis, which can further significantly improve the overall measurement speed.

[0055] [Beneficial Effects of Examples] One of the beneficial effects of the present invention is that in the X-ray reflectivity analysis system and method using multi-mode signals provided by the present invention, the sensitivity characteristics of higher-order mode signals to minute changes in three-dimensional structure can be obtained, thereby significantly reducing the required measurement angle range, thereby significantly shortening the measurement time and improving the throughput of measurement results.

[0056] Furthermore, the X-ray reflectivity analysis system and method using multi-mode signals provided by the present invention significantly reduce the time required for three-dimensional electromagnetic wave fitting models by using at least two types of fitting models, each of which has the characteristics of high-speed calculation and high accuracy.

[0057] The above disclosure is merely a preferred embodiment of the present invention and does not limit the scope of the claims of the present invention. Therefore, all equivalent technical modifications made using the specification and drawings of the present invention are included in the scope of the claims of the present invention. [Explanation of symbols]

[0058] 1: X-ray analysis system 10: X-ray generator 11: Multi-axis sample stage 12: X-ray optical element group 14: X-ray detector 16: Processing unit h: height Lx: measurement X-ray beam Lx': X-ray detection signal Px: length Py:Width S10, S11, S12, S13, S14, S15, S130, S131, S132, S150, S151, S20, S21, S22: Step SP: Test sample T1: Silicon germanium layer T2: Silicon layer T3: Silicon nitride layer T4: Silicon dioxide layer X, Y, Z: Axes θ, Ф: Azimuth

Claims

1. an x-ray generator configured to generate a measurement x-ray beam; an X-ray optical element group for guiding the measurement X-ray beam to the test sample; an X-ray detector for receiving an X-ray test signal generated by irradiating the test sample with the measurement X-ray beam; a processing device; Equipped with The processing device includes: acquiring the X-ray test signal and extracting a plurality of mode signals of different orders; performing a first fitting analysis process on the modal signals having orders smaller than a predetermined order to generate a plurality of initial parameter ranges respectively corresponding to a plurality of structural parameters; performing a second fitting analysis process on the modal signals having orders equal to or greater than a predetermined number based on the initial parameter range, to generate a plurality of parameter fitting results corresponding to the structural parameters; configured to perform 1. An X-ray reflection analysis system utilizing multi-mode signals, comprising:

2. The step of acquiring the X-ray test signal and extracting a plurality of mode signals of different orders includes: acquiring a plurality of diffraction patterns within a predetermined angular range with the X-ray detector; extracting, for each said diffraction pattern, a plurality of intensity signals corresponding to different orders; Integrating the intensity signals of the same order within the predetermined angle range, and calculating and acquiring a plurality of reflection spectra corresponding to different orders as the mode signals; Including, The X-ray reflectometry system of claim 1 .

3. the first fitting analysis process includes generating the initial parameter ranges corresponding to the structural parameters by fitting the modal signals based on a target structure of the test sample through an effective medium approximation (EMA) model; The X-ray reflectometry system of claim 2 .

4. When fitting the target structure in the EMA model, the target structure is a layered structure having a plurality of material layers. The X-ray reflectometry system of claim 3 .

5. the second fitting analysis process includes a step of inputting the mode signals having orders greater than the predetermined order into a three-dimensional electromagnetic wave optimization model, performing fitting on the mode signals having orders greater than the predetermined order using the initial parameter range and a target structure of the test sample as initial fitting conditions, and generating the parameter fitting results corresponding to the structural parameters, respectively. The X-ray reflectometry system of claim 2 .

6. the target structure of the test sample is a multi-layer element, and the structural parameters include one or more of a thickness, a line width, and a roughness of each layer; The X-ray reflectometry system of claim 1 .

7. Obtaining the predetermined angle range through a pre-simulation process; The pre-simulation process includes: adjusting one or more of the structural parameters of the target structure; generating a plurality of simulation mode signals having different orders at a plurality of simulation angles after irradiating the adjusted target structure with X-rays; acquiring a sensitivity angle range having high sensitivity to changes in the structural parameters as the predetermined angle range based on the simulation mode signal; Including, 7. The X-ray reflectometry system of claim 6.

8. configuring an x-ray generator to generate a measurement x-ray beam; guiding the measurement X-ray beam to the test sample by an X-ray optical group; receiving, by an X-ray detector, an X-ray test signal generated by the measurement X-ray beam irradiating the test sample; configuring a processing device; Including, The processing device includes: acquiring the X-ray test signal and extracting a plurality of mode signals of different orders; performing a first fitting analysis process on the modal signals having orders smaller than a predetermined order to generate a plurality of initial parameter ranges respectively corresponding to a plurality of structural parameters; performing a second fitting analysis process for the modal signals having orders greater than a predetermined order based on the initial parameter range, to generate a plurality of parameter fitting results corresponding to the structural parameters; To execute 1. An X-ray reflection analysis method using multi-mode signals, comprising:

9. The step of acquiring the X-ray test signal and extracting a plurality of mode signals of different orders includes: acquiring a plurality of diffraction patterns within a predetermined angular range with the X-ray detector; extracting, for each said diffraction pattern, a plurality of intensity signals corresponding to different orders; Integrating the intensity signals of the same order within the predetermined angle range, and calculating and acquiring a plurality of reflection spectra corresponding to different orders as the mode signals; Including, The method of X-ray reflectometry according to claim 8.

10. the first fitting analysis process includes generating the initial parameter ranges corresponding to the structural parameters by fitting the modal signals based on a target structure of the test sample through an effective medium approximation (EMA) model; The method of X-ray reflectometry according to claim 9.

11. When fitting the target structure in the EMA model, the target structure is a layered structure having a plurality of material layers. The method of X-ray reflectometry according to claim 10.

12. the second fitting analysis process includes a step of inputting the mode signals having orders greater than the predetermined order into a three-dimensional electromagnetic wave optimization model, performing fitting on the mode signals having orders greater than the predetermined order using the initial parameter range and a target structure of the test sample as initial fitting conditions, and generating the parameter fitting results corresponding to the structural parameters, respectively. The method of X-ray reflectometry according to claim 9.

13. the target structure of the test sample is a multi-layer element, and the structural parameters include one or more of a thickness, a line width, and a roughness of each layer; The method of X-ray reflectometry according to claim 8.

14. Obtaining the predetermined angle range through a pre-simulation process; The pre-simulation process includes: adjusting one or more of the structural parameters of the target structure; generating a plurality of simulation mode signals having different orders at a plurality of simulation angles after irradiating the adjusted target structure with X-rays; acquiring a sensitivity angle range having high sensitivity to changes in the structural parameters as the predetermined angle range based on the simulation mode signal; Including, 14. The method of X-ray reflectometry according to claim 13.

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