Vehicle-mounted devices
JP2026101539APending Publication Date: 2026-06-22PANASONIC AUTOMOTIVE SYST CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- PANASONIC AUTOMOTIVE SYST CO LTD
- Filing Date
- 2024-12-10
- Publication Date
- 2026-06-22
AI Technical Summary
Technical Problem
Existing in-vehicle devices face challenges in weight reduction and assembly efficiency due to their complex construction methods, which involve stacking multiple parts and require numerous screws for fixation, leading to increased man-hours and potential for noise generation.
Method used
The in-vehicle device features a resin housing with integrated rails and side blocks that guide substrates for easy assembly, along with a tapered design for improved fitment, reducing the number of parts and screws, and incorporating heat sinks for efficient cooling.
Benefits of technology
This structure achieves weight reduction, enhances assembly efficiency, and improves cooling performance while minimizing noise and assembly time, thus addressing the challenges of conventional devices.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026101539000001_ABST
Abstract
To provide a vehicle-mounted device structure that allows for weight reduction and improved assembly. [Solution] The in-vehicle device comprises a housing 3, one or more substrates 51, 52, and side blocks 61, 62. The housing 3 is a resin container having an opening 32 on one of its six sides that form a box shape, and has a pair of rails 33 on a pair of opposing sides 32 of the four sides excluding the rear side facing the opening 32, with the rails 33 running in a direction toward the rear side. The side blocks 61, 62 are a pair of members to which both sides of the substrates 51, 52 are fixed, and have sliders 63 that are positioned with their longitudinal direction along both sides and are guided by the rails 33 and slide along the rails 33.
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Citation Information
Patent Citations
JP2020205490A