Vehicle lighting devices and vehicle lamps
The vehicle lighting device efficiently transfers heat from the LED module to the socket using a thermally conductive resin socket and integrated heat transfer fins, addressing overheating issues and maintaining LED performance.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOSHIBA LIGHTING & TECHNOLOGY CORP
- Filing Date
- 2024-12-12
- Publication Date
- 2026-06-24
AI Technical Summary
Existing vehicle lighting devices with LED elements face challenges in efficiently transferring heat generated by the light-emitting module to the socket, leading to potential failure and reduced luminous flux due to increased temperature.
A vehicle lighting device design featuring a socket made of highly thermally conductive resin with a plate-shaped flange, a heat transfer portion integrally formed with the socket, and a light-emitting module connected to a base portion with fins extending inside the socket, enhancing heat dissipation through improved adhesion and thermal conductivity.
The design effectively transfers heat from the light-emitting module to the socket, preventing overheating and maintaining the longevity and luminous flux of the LED elements.
Smart Images

Figure 2026103235000001_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present invention relate to a vehicle lighting device and a vehicle lamp.
Background Art
[0002] From the viewpoints of energy saving and long life, instead of a vehicle lighting device including a lamp having a filament, a vehicle lighting device including a light-emitting element such as a light-emitting diode has been increasingly popularized. Such a vehicle lighting device includes a socket and a light-emitting module provided on one end side of the socket and having a light-emitting element.
[0003] Here, when an electric current flows through the light-emitting element, light is irradiated from the light-emitting element and heat is generated. Due to the generated heat, for example, if the temperature of the light-emitting element exceeds the maximum junction temperature, the life of the light-emitting element may be shortened, the light-emitting element may fail, or the luminous flux irradiated from the light-emitting element may decrease.
[0004] Therefore, a technique of providing a heat transfer portion containing a metal between the light-emitting module and the socket has been proposed. If the heat transfer portion is provided, it becomes easier to transfer the heat generated in the light-emitting module to the socket. For example, it is possible to suppress the temperature of the light-emitting element from exceeding the maximum junction temperature.
[0005] However, in recent years, a higher luminous flux has been desired. Therefore, the current flowing through the light-emitting element increases, and the generated heat tends to increase.
[0006] In this case, improving the adhesion between the heat transfer unit and the socket would allow the heat generated in the light-emitting module to be efficiently transferred to the socket. For example, by forming the heat transfer unit and the socket as a single unit using an insert molding method, the adhesion between the heat transfer unit and the socket can be improved. However, simply forming the heat transfer unit and the socket as a single unit using an insert molding method may result in a portion between the heat transfer unit and the socket that is not filled with resin. If a portion between the heat transfer unit and the socket is not filled with resin, there is a risk that the heat generated in the light-emitting module will not be efficiently transferred to the socket.
[0007] Therefore, there was a need to develop a technology that could efficiently transfer the heat generated in the light-emitting module to the socket. [Prior art documents] [Patent Documents]
[0008] [Patent Document 1] Japanese Patent Publication No. 2013-247061 [Overview of the Initiative] [Problems that the invention aims to solve]
[0009] The problem that this invention aims to solve is to provide a vehicle lighting device and a vehicle lamp that can efficiently transfer the heat generated in the light-emitting module to the socket. [Means for solving the problem]
[0010] A vehicle lighting device according to this embodiment comprises: a socket made of a highly thermally conductive resin, having a plate-shaped flange, a mounting portion provided on one side of the flange, and at least one heat dissipation fin provided on the flange opposite to the mounting portion side; a heat transfer portion formed integrally with the socket, having a base portion having a first end exposed from the end of the mounting portion opposite to the flange side, and a plurality of fins provided at a second end of the base portion opposite to the first end, extending inside the socket and arranged in one direction at intervals; a light-emitting module having a light-emitting element, provided at the first end of the base portion; and at least one trace portion on the outer wall of the socket, provided at a position opposite to the end of the heat transfer portion where the space between the plurality of fins opens. [Effects of the Invention]
[0011] According to embodiments of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can efficiently transfer heat generated in a light-emitting module to a socket. [Brief explanation of the drawing]
[0012] [Figure 1] This is a schematic exploded view illustrating a vehicle lighting device according to this embodiment. [Figure 2] This is a cross-sectional view of the vehicle lighting device shown in Figure 1, along line AA. [Figure 3] This is a schematic perspective view illustrating the heat transfer section. [Figure 4] (a) and (b) are schematic perspective views illustrating heat transfer sections according to other embodiments. [Figure 5] This is a schematic partial cross-sectional view illustrating a vehicle lighting fixture. [Modes for carrying out the invention]
[0013] The embodiments will be illustrated below with reference to the drawings. In each drawing, similar components are denoted by the same reference numerals, and detailed descriptions will be omitted as appropriate.
[0014] (Vehicle lighting device)
[0015] The vehicle lighting device 1 according to the present embodiment can be provided, for example, in an automobile or a railway vehicle. Examples of the vehicle lighting device 1 provided in an automobile include, for example, a front combination lamp (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc. as appropriate), and a rear combination lamp (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc. as appropriate). However, the use of the vehicle lighting device 1 is not limited to these.
[0016] FIG. 1 is a schematic exploded view for illustrating the vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view taken along line A-A of the vehicle lighting device 1 in FIG. 1. As shown in FIGS. 1 and 2, the vehicle lighting device 1 is provided with, for example, a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40.
[0017] The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15.
[0018] The mounting portion 11 is provided on one surface side of the flange 13. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a concave portion 11a that opens at an end opposite to the flange 13 side.
[0019] The bayonet 12 is provided, for example, on the side portion 11a2 of the mounting portion 11. The bayonet 12 protrudes outward from the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 can be provided. The bayonet 12 is used when mounting the vehicle lighting device 1, for example, to the housing 101 of the vehicle lamp 100 described later. The bayonet 12 can be used for a twist lock.
[0020] The flange 13 is plate-shaped. The side portion of the flange 13 is located outside the vehicle lighting device 1 with respect to the side portion of the bayonet 12.
[0021] The heat radiation fins 14 are provided on the side of the flange 13 opposite to the mounting portion 11 side. At least one heat radiation fin 14 can be provided. For example, when a plurality of heat radiation fins 14 are provided, as shown in FIGS. 1 and 2, the plurality of heat radiation fins 14 can be arranged side by side in a predetermined direction. The heat radiation fins 14 are, for example, plate-shaped or cylindrical.
[0022] The connector holder 15 is provided on the side of the flange 13 opposite to the mounting portion 11 side. The connector holder 15 can be provided side by side with the heat radiation fins 14. The connector holder 15 is cylindrical, and a connector 105 having a seal member 105a inside is inserted therein.
[0023] The socket 10 has a function of holding the light emitting module 20 and the power supply unit 30, and a function of transferring the heat generated in the light emitting module 20 to the outside. Therefore, the socket 10 is formed of a material having a high thermal conductivity. In recent years, weight reduction of the vehicle lighting device 1, and thus weight reduction of the socket 10, has been desired. Therefore, the socket 10 is preferably formed of, for example, a high thermal conductivity resin. The high thermal conductivity resin contains, for example, a resin and a filler using an inorganic material. The high thermal conductivity resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon (Nylon) mixed with a filler using carbon or aluminum oxide.
[0024] The light-emitting module 20 (substrate 21) is provided on one end side of the socket 10. For example, the light-emitting module 20 is provided on the end portion 40a1 (41a1) (corresponding to an example of the first end portion) of the base portion 40a (41a) of the heat transfer portion 40 (41), which will be described later. The light-emitting module 20 includes, for example, a substrate 21, a light-emitting element 22, a frame portion 23, a sealing portion 24, and a circuit element 25.
[0025] The substrate 21 is bonded, for example, to the end portion 40a1 (41a1) of the base portion 40a (41a) of the heat transfer portion 40 (41). In this case, it is preferable to use an adhesive with high thermal conductivity. For example, the adhesive can be an adhesive mixed with an inorganic material filler.
[0026] The substrate 21 is plate-shaped. The planar shape of the substrate 21 (shape when viewed from a direction along the central axis 1a of the vehicle lighting device 1) is, for example, approximately rectangular. The substrate 21 can be formed from, for example, inorganic materials such as ceramics (e.g., aluminum oxide or aluminum nitride), organic materials such as paper phenol or glass epoxy. The substrate 21 may also be a metal core substrate in which the surface of a metal plate is coated with an insulating material. When the light-emitting element 22 generates a large amount of heat, it is preferable to form the substrate 21 using a material with high thermal conductivity from the viewpoint of heat dissipation. Examples of materials with high thermal conductivity include ceramics such as aluminum oxide or aluminum nitride, high thermal conductivity resins, and metal core substrates. The substrate 21 may also have a single-layer structure or a multilayer structure.
[0027] Furthermore, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a is formed from, for example, a material mainly composed of silver or a material mainly composed of copper. A covering portion can also be provided to cover the wiring pattern 21a and film-like resistors, which will be described later. The covering portion may include, for example, a glass material.
[0028] The light-emitting element 22 is located on the substrate 21 (on the side of the substrate 21 opposite to the heat transfer section 40(41) side). The light-emitting element 22 is electrically connected to the wiring pattern 21a.
[0029] At least one light-emitting element 22 can be provided. If multiple light-emitting elements 22 are provided, they can be connected in series. The light-emitting element 22 can be, for example, a light-emitting diode, an organic light-emitting diode, a laser diode, or the like.
[0030] The light-emitting element 22 can be a chip-shaped light-emitting element, a surface-mount type such as a PLCC (Plastic Leaded Chip Carrier), or a leaded light-emitting element such as a bullet-shaped element. The light-emitting element 22 illustrated in Figures 1 and 2 is a chip-shaped light-emitting element. In this case, considering the miniaturization of the light-emitting module 20 and, consequently, the vehicle lighting device 1, it is preferable to use a chip-shaped light-emitting element. In the following, as an example, the case in which the light-emitting element 22 is a chip-shaped light-emitting element will be described.
[0031] The chip-shaped light-emitting element 22 can be mounted on the wiring pattern 21a using COB (Chip On Board). The chip-shaped light-emitting element 22 may be an upper electrode type light-emitting element, an upper and lower electrode type light-emitting element, or a flip-chip type light-emitting element.
[0032] The frame portion 23 is provided on the substrate 21. The frame portion 23 is bonded to the substrate 21. The frame portion 23 has a frame shape and surrounds the light-emitting element 22. The frame portion 23 can be formed from, for example, a thermoplastic resin.
[0033] The frame portion 23 can have the function of defining the formation range of the sealing portion 24 and the function of a reflector. Therefore, the frame portion 23 may contain titanium dioxide particles or a white resin in order to improve reflectivity.
[0034] Furthermore, the frame portion 23 can be omitted. However, if the frame portion 23 is provided, the utilization efficiency of the light emitted from the light-emitting element 22 can be improved. In addition, since the area in which the sealing portion 24 is formed can be reduced, the light-emitting module 20 can be miniaturized, and consequently the vehicle lighting device 1 can be miniaturized.
[0035] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area enclosed by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a light-transmitting resin. The resin is, for example, a silicone resin. The sealing portion 24 may also contain a phosphor.
[0036] If the frame portion 23 is omitted, for example, a dome-shaped sealing portion 24 is formed on the substrate 21. Furthermore, if the light-emitting element 22 is a surface-mount type light-emitting element, or if the light-emitting element 22 is a bullet-shaped or other type of light-emitting element with lead wires, the frame portion 23 and the sealing portion 24 can be omitted.
[0037] The circuit element 25 can be a passive or active element used to constitute a light-emitting circuit having a light-emitting element 22. The circuit element 25 is provided, for example, around the frame portion 23 and electrically connected to the wiring pattern 21a.
[0038] The circuit element 25 can be, for example, a resistor 25a, a protection element 25b, and a control element 25c. However, the types of circuit elements 25 are not limited to those exemplified, and can be appropriately changed depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to those mentioned above, the circuit elements 25 may also be capacitors, positive characteristic thermistors, negative characteristic thermistors, inductors, surge absorbers, varistors, transistors, integrated circuits, computing elements, etc.
[0039] The resistor 25a is mounted on the substrate 21. The resistor 25a is electrically connected to the wiring pattern 21a. The resistor 25a can be, for example, a surface-mount resistor, a resistor with lead wires (metal oxide film resistor), or a film-type resistor formed using a screen printing method. The resistor 25a shown in Figure 1 is a film-type resistor. The material of the film-type resistor is, for example, ruthenium oxide (RuO2). Film-type resistors are formed, for example, using a screen printing method and a firing method.
[0040] The resistor 25a is provided to reduce variations in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitted from the light-emitting element 22, which are caused by variations in the forward voltage characteristics of the light-emitting element 22. In this case, by changing the resistance value of the resistor 25a connected in series with the light-emitting element 22, the value of the current flowing through the light-emitting element 22 is made to fall within a predetermined range.
[0041] If resistor 25a is a surface-mount type resistor or a resistor with leads, select a resistor 25a with an appropriate resistance value according to the forward voltage characteristics of the light-emitting element 22. If resistor 25a is a film-type resistor, the resistance value can be increased by removing a portion of resistor 25a. For example, a portion of the film-type resistor can be easily removed by irradiating it with laser light. Furthermore, the resistor 25a can also have the function of preventing excessive current from flowing through the light-emitting element 22.
[0042] The protection element 25b is provided on the substrate 21. The protection element 25b is electrically connected to the wiring pattern 21a. The protection element 25b is provided, for example, to prevent reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from being applied to the light-emitting element 22 from the reverse direction. The protection element 25b can be, for example, a diode or a field-effect transistor. The protection element 25b illustrated in Figure 1 is a surface-mount type diode.
[0043] The control element 25c is provided on the substrate 21. The control element 25c is electrically connected to the wiring pattern 21a. The control element 25c changes the number of light-emitting elements 22 to be lit according to the voltage (input voltage) applied to the vehicle lighting device 1. The control element 25c may also, for example, switch the voltage applied to the light-emitting elements 22 or perform temperature derating.
[0044] In addition, optical elements may be provided as needed. These optical elements can be provided, for example, on the sealing portion 24. Examples of optical elements include convex lenses, concave lenses, and light guides.
[0045] The power supply unit 30 has, for example, a plurality of power supply terminals 31 and a holding unit 32. The multiple power supply terminals 31 can be rod-shaped. The multiple power supply terminals 31 can be arranged in a line in one direction, for example. One end of the multiple power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of the multiple power supply terminals 31 is soldered to a wiring pattern 21a provided on the substrate 21. The multiple power supply terminals 31 are electrically connected to the light-emitting element 22 and the circuit element 25 via the wiring pattern 21a. The other end of the multiple power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted to the multiple power supply terminals 31 exposed inside the hole of the connector holder 15. The multiple power supply terminals 31 can be formed from a metal such as a copper alloy, for example.
[0046] As mentioned above, it is preferable that the socket 10 be made from a material with high thermal conductivity. However, materials with high thermal conductivity may also be electrically conductive. For example, a highly thermally conductive resin containing a carbon filler is electrically conductive. Therefore, the retaining portion 32 is provided to insulate the multiple power supply terminals 31 from the conductive socket 10. The retaining portion 32 also has the function of holding the multiple power supply terminals 31. Note that if the socket 10 is made from a highly thermally conductive resin with insulating properties (for example, a highly thermally conductive resin containing an aluminum oxide filler), the retaining portion 32 can be omitted. In this case, the socket 10 holds the multiple power supply terminals 31. The retaining portion 32 is made from, for example, a resin with insulating properties. The retaining portion 32 can be, for example, press-fitted into a hole provided in the socket 10 or bonded to the inner wall of the hole.
[0047] The heat transfer unit 40 is provided between the light-emitting module 20 and the socket 10. For example, the heat transfer unit 40 can be formed integrally with the socket 10 using an insert molding method. Figure 3 is a schematic perspective view illustrating the heat transfer section 40.
[0048] As shown in Figures 2 and 3, the heat transfer section 40 has a base 40a and a plurality of fins 40b. The base 40a and the plurality of fins 40b can be formed integrally. The heat transfer section 40 is formed from a material with a higher thermal conductivity than a high thermal conductivity resin. The heat transfer section 40 can be formed from a metal such as aluminum, aluminum alloy, copper, or copper alloy.
[0049] The base portion 40a is, for example, plate-shaped. The thickness of the base portion 40a (dimension in the direction along the central axis 1a of the vehicle lighting device 1) can be, for example, 2 mm or more and 30 mm or less. The planar dimensions of the base portion 40a (dimension in the direction intersecting the central axis 1a of the vehicle lighting device 1) may be the same as or different from the planar dimensions of the substrate 21. The planar shape of the base portion 40a can be, for example, approximately rectangular. In this case, the base portion 40a may be provided with notches to avoid short circuits with the multiple power supply terminals 31.
[0050] The base portion 40a is provided on one end side of the socket 10. The base portion 40a can be embedded in the bottom surface 11a1 of the recess 11a, for example, as shown in Figure 2. Alternatively, the base portion 40a can be provided on the bottom surface 11a1 of the recess 11a, or on the top surface of a protrusion provided on the bottom surface 11a1 of the recess 11a.
[0051] For example, the base portion 40a has an end portion 40a1 that is exposed from the end of the mounting portion 11 opposite to the flange 13 side. For example, the end portion 40a1 of the base portion 40a is exposed from the bottom surface 11a1 of the recess 11a. For example, the end portion 40a1 of the base portion 40a can be a flat surface substantially perpendicular to the central axis 1a of the vehicle lighting device 1.
[0052] As mentioned above, the light-emitting module 20 (substrate 21) is bonded to the end portion 40a1 of the base portion 40a. Therefore, it is preferable that the end portion 40a1 of the base portion 40a is positioned to protrude from the bottom surface 11a1 of the recess 11a. If the end portion 40a1 of the base portion 40a protrudes from the bottom surface 11a1 of the recess 11a, it is possible to suppress the adhesive from spreading up onto the surface of the substrate 21 on which the light-emitting element 22 is provided.
[0053] Multiple fins 40b are provided on the end 40a2 (corresponding to an example of a second end) of the base 40a, opposite the end 40a1. Multiple fins 40b extend inside the socket 10. Multiple fins 40b extend, for example, along the central axis 1a of the vehicle lighting device 1. The tips of the multiple fins 40b (the ends opposite to the end 40a1 side) are provided inside the socket 10.
[0054] In this case, if the distance between the tip of the fin 40b and the heat dissipation fin 14 is shortened, the heat generated in the light-emitting module 20 can be efficiently transferred to the heat dissipation fin 14 via the heat transfer section 40. Therefore, the heat dissipation performance of the light-emitting module 20 can be improved. For example, it is preferable that the tip of the fin 40b be located inside the flange 13, and even more preferable that it be located inside the heat dissipation fin 14.
[0055] The shape of the multiple fins 40b can be, for example, plate-like or columnar. The shape of the multiple fins 40b exemplified in Figure 3 is plate-like.
[0056] For example, multiple fins 40b can be arranged in a line in one direction with spacing between them. In the heat transfer section 40 illustrated in Figures 1 and 3, multiple fins 40b are provided, namely fins 40b1 and fins 40b2. For example, at least one fin 40b2 can be provided between a pair of opposing fins 40b1 in a direction intersecting the central axis 1a of the vehicle lighting device 1. In the heat transfer section 40 illustrated in Figures 2 and 3, two fins 40b2 are provided. For example, fins 40b1 and fins 40b2 can be provided so as to be substantially parallel to each other.
[0057] Here, since fin 40b2 is provided between fins 40b1 and fin 40b1, heat released from one fin 40b1 and heat released from the other fin 40b1 are incident on fin 40b2. If multiple fins 40b2 are provided, heat released from adjacent fins 40b2 and heat released from adjacent fins 40b1 are incident on fin 40b2. As a result, thermal interference between fins 40b1 and fin 40b2 increases, which may suppress heat dissipation from fin 40b2.
[0058] In contrast, in the case of fin 40b1, only the heat emitted from the adjacent fin 40b2 is incident. Therefore, thermal interference between fin 40b1 and fin 40b2 is reduced. Also, the heat emitted from the other side of fin 40b1 propagates through the inside of the socket 10 and is released to the outside from the mounting portion 11, flange 13, and heat dissipation fin 14. Therefore, the heat dissipation performance of fin 40b1 is higher than that of fin 40b2.
[0059] In this case, if the cross-sectional area of fin 40b1 in the direction in which the pair of fins 40b1 and fin 40b2 are aligned is made larger than the cross-sectional area of fin 40b2, the surface area of fin 40b1 can be made larger than the surface area of fin 40b2, or the thermal resistance of fin 40b1 can be made smaller than the thermal resistance of fin 40b2. Therefore, the heat dissipation performance of fin 40b1 can be further improved.
[0060] Improving the heat dissipation of the fins 40b1 allows the heat generated in the light-emitting module 20 to be transferred to the socket 10 more efficiently. This effectively prevents the temperature of the light-emitting element 22 and the circuit elements 25 from becoming too high.
[0061] For example, as shown in Figures 2 and 3, the dimension T1 (mm) of fin 40b1 in the direction in which a pair of fins 40b1 and fin 40b2 are aligned may be made larger than the dimension T2 (mm) of fin 40b2.
[0062] For example, the dimensions T1 (mm) of fin 40b1 and T2 (mm) of fin 40b2 are given by "the cross-sectional area (mm) of fin 40b1". 2 ) / Cross-sectional area of fin 40b2 (mm 2 The value of ) can be made to be 1.5 or higher.
[0063] Furthermore, if multiple fins 40b2 are provided, the distance between fin 40b1 and fin 40b2 can be made larger than the distance between fins 40b2 themselves. In this way, thermal interference between fin 40b1 and fin 40b2 can be suppressed, thereby further improving the heat dissipation performance of fin 40b1.
[0064] Figures 4(a) and 4(b) are schematic perspective views illustrating a heat transfer section 41 according to another embodiment. Similar to the heat transfer section 40 described above, the heat transfer section 41 is provided between the light-emitting module 20 and the socket 10. The heat transfer section 41 can be formed integrally with the socket 10 using an insert molding method.
[0065] As shown in Figures 4(a) and 4(b), the heat transfer section 41 has a base 41a and a plurality of fins 41b. The base 41a and the plurality of fins 41 can be formed integrally. The heat transfer section 41 is formed from a material with a higher thermal conductivity than a high thermal conductivity resin. The heat transfer section 41 can be formed from a metal such as aluminum, aluminum alloy, copper, or copper alloy.
[0066] The base portion 41a is, for example, plate-shaped. The thickness of the base portion 41a (dimension along the central axis 1a of the vehicle lighting device 1) can be, for example, 2 mm or more and 30 mm or less. The contour of the base portion 41a, when viewed from the direction along the central axis 1a of the vehicle lighting device 1, can be a shape that includes an arc. For example, as shown in Figures 4(a) and (b), the contour of the base portion 41a includes an arc and a chord connecting the two endpoints of the arc. The central angle of the arc can be 180° or more and 330° or less.
[0067] If the contour of the base portion 41a, which is provided inside the mounting portion 11 or on the bottom surface 11a1 of the recess 11a, includes an arc shape, then the dimensions of the base portion 41a in the direction intersecting the central axis 1a of the vehicle lighting device 1 can be increased compared to the base portion 40a with a rectangular contour as described above. As a result, the contact area between the base portion 41a and the socket 10 can be increased, thereby improving the heat dissipation performance of the heat transfer portion 41.
[0068] Furthermore, similar to the base portion 40a described above, the base portion 41a can be embedded in the bottom surface 11a1 of the recess 11a. Alternatively, the base portion 41a can be provided on the bottom surface 11a1 of the recess 11a, or on the top surface of a protrusion provided on the bottom surface 11a1 of the recess 11a. For example, the end portion 41a1 of the base portion 41a is exposed from the bottom surface 11a1 of the recess 11a. For example, the end portion 41a1 of the base portion 41a can be a flat surface substantially perpendicular to the central axis 1a of the vehicle lighting device 1.
[0069] When viewed from a direction along the central axis 1a of the vehicle lighting device 1, the contour of the end portion 41a1 can be a shape that includes an arc. For example, as shown in Figures 4(a) and (b), the contour of the end portion 41a1 includes an arc extending along the circumferential edge of the base portion 41a, a pair of straight lines with one end connected to the endpoint of the arc, and a straight line connecting the ends of the pair of straight lines on the opposite side from the arc. For example, the contour of the end portion 41a1 can be a shape in which one side of a rectangle is replaced with an arc. The central angle of the arc can be between 120° and 330°.
[0070] Similar to the end portion 40a1 of the base portion 40a described above, the light-emitting module 20 (substrate 21) is bonded to the end portion 41a1 of the base portion 41a. Therefore, it is preferable that the end portion 41a1 of the base portion 41a be positioned so as to protrude from the bottom surface 11a1 of the recess 11a. If the end portion 41a1 of the base portion 41a protrudes from the bottom surface 11a1 of the recess 11a, it is possible to suppress the adhesive from spreading up onto the surface of the substrate 21 on which the light-emitting element 22 is provided.
[0071] A step 41a2 can be provided on the periphery of the end portion 41a1 of the base portion 41a. The step 41a2 opens, for example, at the end portion 41a1 of the base portion 41a and at the circumferential end of the base portion 41a. The distance between the end portion 41a1 of the base portion 41a and the bottom portion 41a2a of the step 41a2 (the depth of the step 41a2) can be, for example, about 1 mm. The maximum distance between the circumferential end of the base portion 41a and the circumferential end of the end portion 41a1 when viewed from a direction along the central axis 1a of the vehicle lighting device 1 (the maximum width of the step 41a2) can be, for example, about 10 mm.
[0072] The step 41a2 can be omitted. However, if the step 41a2 is provided, it can be embedded inside the socket 10 (mounting portion 11). As a result, the contact area between the base portion 41a and the socket 10 can be increased by the depth of the step 41a2, thereby further improving the heat dissipation of the heat transfer portion 41. In addition, the bonding strength between the heat transfer portion 41 and the socket 10 can be increased, so even if vibrations due to driving are applied to the vehicle lighting device 1, or thermal stress is generated due to the turning on and off of the light-emitting element 22, it is possible to suppress the heat transfer portion 41 from falling off the socket 10 or the position of the heat transfer portion 41 from shifting, which would prevent the predetermined light distribution characteristics from being obtained.
[0073] Multiple fins 41b are provided on the end 41a3 (corresponding to an example of a second end) of the base 41a, opposite the end 41a1. Multiple fins 41b extend inside the socket 10. Multiple fins 41b extend, for example, along the central axis 1a of the vehicle lighting device 1. The tips of the multiple fins 41b (the ends opposite to the end 41a1 side) are provided inside the socket 10.
[0074] In this case, if the distance between the tip of the fin 41b and the heat dissipation fin 14 is shortened, the heat generated in the light-emitting module 20 can be efficiently transferred to the heat dissipation fin 14 via the heat transfer section 41. Therefore, the heat dissipation performance of the light-emitting module 20 can be improved. For example, it is preferable that the tip of the fin 41b be located inside the flange 13, and even more preferable that it be located inside the heat dissipation fin 14.
[0075] The shape of the fin 41b can be, for example, plate-shaped or columnar. The shape of the fin 41b illustrated in Figures 4(a) and (b) is plate-shaped.
[0076] For example, multiple fins 41b can be arranged in a line in one direction with spacing between them. In the heat transfer section 41 illustrated in Figures 4(a) and (b), multiple fins 41b are provided, namely fins 41b1 and fins 41b2. For example, at least one fin 41b2 can be provided between a pair of opposing fins 41b1 in a direction intersecting the central axis 1a of the vehicle lighting device 1. In the heat transfer section 41 illustrated in Figures 4(a) and (b), three fins 41b2 are provided. For example, fins 41b1 and fins 41b2 can be provided so that they are substantially parallel to each other.
[0077] The side of fin 41b1 facing the adjacent fin 41b2 can be tilted. The tilt angle of the side of fin 41b1 with respect to the central axis 1a of the vehicle lighting device 1 can be, for example, about 1°. The side of fin 41b2 facing the adjacent fin 41b2, or the side of fin 41b2 facing the adjacent fin 41b1, can be tilted. The tilt angle of the side of fin 41b2 with respect to the central axis 1a of the vehicle lighting device 1 can be, for example, about 1°.
[0078] In the heat transfer section 41 illustrated in Figures 4(a) and (b), the sides of fin 41b1 and fin 41b2 are inclined in a direction that decreases the cross-sectional area in the direction intersecting the central axis 1a of the vehicle lighting device 1 as they approach the tip. Alternatively, the sides of fin 41b1 and fin 41b2 may be inclined in a direction that increases the cross-sectional area in the direction intersecting the central axis 1a of the vehicle lighting device 1 as they approach the tip.
[0079] If the sides of fin 41b1 and fin 41b2 are inclined, the contact area between fin 41b and socket 10 can be increased, thereby further improving the heat dissipation performance of the heat transfer section 41.
[0080] Furthermore, as shown in Figures 4(a) and (b), the side portion 41b1a of the fin 41b1 opposite to the fin 41b2 side can be a curved surface that protrudes outward. For example, the side portion 41b1a of the fin 41b1 can be a curved surface that curves along the peripheral edge of the base portion 41a. If the side portion 41b1a of the fin 41b1 is a curved surface, the contact area between the side portion 41b1a of the fin 41b1 and the socket 10 can be increased, thereby further improving the heat dissipation performance of the heat transfer portion 41.
[0081] Here, since fin 41b2 is provided between fins 41b1 and fin 41b1, heat released from one fin 41b1 and heat released from the other fin 41b1 are incident on fin 41b2. When multiple fins 41b2 are provided, heat released from adjacent fins 41b2 and heat released from adjacent fins 41b1 are incident on fin 41b2. As a result, thermal interference between fins 41b1 and fin 41b2 increases, which may suppress heat dissipation from fin 41b2.
[0082] In contrast, in the case of fin 41b1, only the heat emitted from the adjacent fin 41b2 is incident. Therefore, thermal interference between fin 41b1 and fin 41b2 is reduced. Furthermore, the heat emitted from fin 41b1 propagates through the inside of the socket 10 and is released to the outside from the mounting portion 11, flange 13, and heat dissipation fin 14. Therefore, the heat dissipation performance of fin 41b1 is higher than that of fin 41b2.
[0083] In this case, if the cross-sectional area of fin 41b1 in the direction in which the pair of fins 41b1 and fin 41b2 are aligned is made larger than the cross-sectional area of fin 41b2, the surface area of fin 41b1 can be made larger than the surface area of fin 41b2, or the thermal resistance of fin 41b1 can be made smaller than the thermal resistance of fin 41b2. Therefore, the heat dissipation performance of fin 41b1 can be further improved.
[0084] Improving the heat dissipation of the fins 41b1 allows the heat generated in the light-emitting module 20 to be transferred to the socket 10 more efficiently. This effectively prevents the temperature of the light-emitting element 22 and the circuit elements 25 from becoming too high.
[0085] For example, as shown in Figure 4(b), the maximum dimension T3 (mm) of fin 41b1 in the direction in which the pair of fins 41b1 and fin 41b2 are aligned may be made larger than the maximum dimension T4 (mm) of fin 41b2.
[0086] For example, the maximum dimension T3 (mm) of fin 41b1 and the maximum dimension T4 (mm) of fin 41b2 are given by "the maximum cross-sectional area (mm) of fin 41b1". 2 ) / Maximum cross-sectional area of fin 41b2 (mm 2 The value of ) can be made to be 1.5 or higher.
[0087] Furthermore, if multiple fins 41b2 are provided, the maximum distance between fin 41b1 and fin 41b2 can be made larger than the maximum distance between fins 41b2 themselves. In this way, thermal interference between fin 41b1 and fin 41b2 can be suppressed, thereby further improving the heat dissipation performance of fin 41b1.
[0088] As mentioned above, the heat transfer section 40(41) can be formed integrally with the socket 10 using an insert molding method. In this way, the adhesion between the heat transfer section 40(41) and the socket 10 can be improved, so that the heat generated in the light-emitting module 20 can be efficiently transferred to the socket 10.
[0089] However, the heat transfer section 40 (41) has multiple fins 40b (41b). Also, since the high thermal conductivity resin has an inorganic filler added to it, its fluidity tends to decrease. Therefore, if the heat transfer section 40(41) and the socket 10 are simply formed integrally using an insert molding method, the flow of the molten high thermal conductivity resin may be disturbed by the multiple fins 40b(41b), resulting in a portion between the heat transfer section 40(41) and the socket 10 that is not filled with high thermal conductivity resin. If a portion between the heat transfer section 40(41) and the socket 10 is not filled with high thermal conductivity resin, the heat generated in the light-emitting module 20 may not be efficiently transferred to the socket 10.
[0090] Therefore, in the vehicle lighting device 1 according to this embodiment, when the heat transfer section 40(41) and the socket 10 are integrally formed using an insert molding method, the gate 200, which is an inlet for the high thermal conductivity resin to flow into the inside of the mold, is provided at a position opposite to the end of the heat transfer section 40(41) where the space between the multiple fins 40b(41b) opens.
[0091] For example, as shown in Figure 1, the gate 200 can be provided on the side of the flange 13, opposite the end of the heat transfer section 40(41) where the space between the multiple fins 40b(41b) opens. Alternatively, the gate 200 can be provided on the side of the mounting section 11, opposite the end of the heat transfer section 40(41) where the space between the multiple fins 40b(41b) opens. By doing so, the molten high thermal conductivity resin can easily flow into the space between the multiple fins 40b(41b), thereby suppressing the occurrence of areas between the heat transfer section 40(41) and the socket 10 that are not filled with the high thermal conductivity resin.
[0092] Furthermore, as shown in Figure 2, for example, the gate 200 can also be provided at the tip of the heat dissipation fin 14, facing the heat transfer section 40(41). In this way, the gate 200 is provided at the end of the heat transfer section 40(41) where the space between the multiple fins 40b(41b) opens. As a result, the molten high thermal conductivity resin can easily flow into the space between the multiple fins 40b(41b), thus suppressing the occurrence of areas between the heat transfer section 40(41) and the socket 10 that are not filled with the high thermal conductivity resin. The gate 200 may be provided on at least one of the following: the side of the flange 13, the side of the mounting portion 11, or the tip of the heat dissipation fin 14.
[0093] Here, a trace portion 200a is formed at the position corresponding to the gate 200 of the socket 10. Therefore, at least one trace portion 200a is provided on the outer wall of the socket 10 at a position opposite to the end of the heat transfer portion 40(41) where the space between the multiple fins 40b(41b) opens. For example, the trace portion 200a is provided on at least one of the side of the flange 13, the side of the mounting portion 11, and the tip of the heat dissipation fin 14.
[0094] In this case, the trace portion 201a will be a protrusion, recess, or rough surface area, and if the trace portion 201a is formed, problems such as snagging may occur when attaching the vehicle lighting device 1 to the housing 101 of the vehicle lamp 100, or the aesthetic appearance may be impaired. For example, the trace portion 200a can be removed by machining, but this will increase manufacturing costs.
[0095] Therefore, a D-cut surface can be provided on at least one of the sides of the flange 13, the sides of the mounting portion 11, and the tip of the heat dissipation fin 14. The D-cut surfaces provided on the sides of the flange 13 and the sides of the mounting portion 11 can be, for example, flat surfaces extending in a direction substantially parallel to the central axis 1a of the vehicle lighting device 1. The D-cut surface provided at the tip of the heat dissipation fin 14 can be, for example, flat surfaces extending in a direction intersecting the central axis 1a of the vehicle lighting device 1. The trace portion 200a can then be provided on the D-cut surface. In the vehicle lighting device 1 illustrated in Figure 1, a D-cut surface 13a is provided on the side of the flange 13.
[0096] Furthermore, recesses can be provided on at least one of the sides of the flange 13, the sides of the mounting portion 11, and the tip of the heat dissipation fin 14. The trace portion 200a can then be provided on the bottom surface of the recess. In the vehicle lighting device 1 illustrated in Figures 1 and 2, a recess 11a3 is provided on the side of the mounting portion 11, and a recess 14a is provided at the tip of the heat dissipation fin 14.
[0097] Furthermore, if the mark portion 200a is provided at the tip of the heat dissipation fin 14, there is less risk of problems such as snagging occurring, so the mark portion 200a can also be directly provided at the tip of the heat dissipation fin 14. However, if a recess 14a or the like is provided at the tip of the heat dissipation fin 14, problems such as snagging and damage to the aesthetics can be effectively suppressed.
[0098] As described above, the vehicle lighting device 1 according to this embodiment is provided with a heat transfer section 40(41) having a plurality of fins 40b(41b) arranged in one direction. Furthermore, a trace portion 200a is provided on the outer wall of the socket 10 at a position opposite to the end of the heat transfer section 40(41) where the space between the plurality of fins 40b(41b) opens. Therefore, the heat dissipation performance of the heat transfer section 40 (41) can be improved, and the occurrence of areas between the heat transfer section 40 (41) and the socket 10 that are not filled with high thermal conductivity resin can be suppressed. As a result, the heat generated in the light-emitting module 20 can be efficiently transferred to the socket 10.
[0099] (Vehicle lighting fixtures) In one embodiment of the present invention, a vehicle lighting fixture 100 equipped with a vehicle lighting device 1 can be provided. The above-described vehicle lighting device 1 and its modified forms (for example, the heat transfer unit 41, or any additions, deletions, or design changes made by those skilled in the art to components, which will have the features of the present invention) can all be applied to the vehicle lighting fixture 100.
[0100] In the following explanation, we will use the example that the vehicle lighting fixture 100 is a front combination light installed on an automobile. However, the vehicle lighting fixture 100 is not limited to a front combination light installed on an automobile. The vehicle lighting fixture 100 can be any vehicle lighting fixture installed on an automobile, railway vehicle, etc.
[0101] Figure 5 is a schematic partial cross-sectional view illustrating a vehicle lighting fixture 100. As shown in Figure 5, the vehicle lighting fixture 100 includes, for example, a vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a sealing member 104, and a connector 105.
[0102] The vehicle lighting device 1 is mounted on the housing 101. The housing 101 holds the mounting portion 11. The housing 101 has a box shape with one end open. The housing 101 is made of, for example, a resin that does not transmit light. A mounting hole 101a is provided on the bottom surface of the housing 101 into which the portion of the mounting portion 11 with the bayonet 12 is inserted. A recess is provided around the periphery of the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Although the example shows the mounting hole 101a being directly provided on the housing 101, a mounting member having the mounting hole 101a may also be provided on the housing 101.
[0103] When attaching the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting part 11 with the bayonet 12 is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held in place by a fitting portion provided on the periphery of the mounting hole 101a. This type of mounting method is called a twist lock.
[0104] The cover 102 is provided to close the opening of the housing 101. The cover 102 is made of a light-transmitting resin or the like. The cover 102 may also have functions such as a lens.
[0105] Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 performs functions such as reflection, diffusion, guidance, focusing, and formation of a predetermined light distribution pattern of the light emitted from the vehicle lighting device 1. For example, the optical element 103 illustrated in Figure 5 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.
[0106] The sealing member 104 is provided between the flange 13 and the housing 101. The sealing member 104 is annular in shape and is made of an elastic material such as rubber or silicone resin.
[0107] When the vehicle lighting device 1 is attached to the vehicle lamp 100, the sealing member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the sealing member 104 can seal the internal space of the housing 101. In addition, the elastic force of the sealing member 104 presses the bayonet 12 against the housing 101. Therefore, it is possible to prevent the vehicle lighting device 1 from detaching from the housing 101.
[0108] The connector 105 is fitted onto the ends of the multiple power supply terminals 31 that are exposed inside the connector holder 15. The connector 105 is electrically connected to a lighting circuit and the like, which are located outside the vehicle lighting fixture 100. Therefore, by fitting the connector 105 onto the ends of the multiple power supply terminals 31, the lighting circuit and the light-emitting element 22 can be electrically connected.
[0109] Furthermore, the connector 105 is provided with a sealing member 105a. When the connector 105 having the sealing member 105a is inserted into the connector holder 15, the inside of the connector holder 15 is sealed to be watertight.
[0110] Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. Furthermore, the embodiments described above can be implemented in combination with each other.
[0111] The following are additional notes regarding the embodiments described above.
[0112] (Note 1) A socket comprising a plate-shaped flange, a mounting portion provided on one side of the flange, and at least one heat dissipation fin provided on the side of the flange opposite to the mounting portion, and containing a high thermal conductivity resin; A heat transfer portion formed integrally with the socket, comprising: a base having a first end exposed from the end opposite to the flange side of the mounting portion; and a plurality of fins provided at a second end of the base facing the first end, extending inside the socket and spaced apart and arranged in one direction; A light-emitting module having a light-emitting element is provided at the first end of the base; The outer wall of the socket, having at least one mark portion provided at a position opposite to the end of the heat transfer section where the space between the plurality of fins opens; A vehicle lighting device equipped with the following features.
[0113] (Note 2) The vehicle lighting device according to Appendix 1, wherein the trace portion is provided on at least one of the side of the flange, the side of the mounting portion, and the tip of the heat dissipation fin.
[0114] (Note 3) A D-cut surface is provided on at least one of the sides of the flange, the sides of the mounting portion, and the tip of the heat dissipation fin. The aforementioned mark portion is the vehicle lighting device described in Appendix 2, which is provided on the D-cut surface.
[0115] (Note 4) A recess is provided on at least one of the sides of the flange, the sides of the mounting portion, and the tip of the heat dissipation fin. The aforementioned mark portion is a vehicle lighting device as described in Appendix 2, provided on the bottom surface of the recess.
[0116] (Note 5) The vehicle lighting device according to any one of the appendices 1 to 4, wherein the contour of the base, when viewed from a direction along the central axis of the vehicle lighting device, includes an arc and a chord connecting the two endpoints of the arc.
[0117] (Note 6) A vehicle lighting device as described in any one of the appendices 1 to 5; The housing on which the aforementioned vehicle lighting device is mounted; A vehicle lighting fixture equipped with the following features. [Explanation of symbols]
[0118] 1 Vehicle lighting device, 1a central axis, 10 socket, 11 mounting part, 11a3 recess, 13 flange, 13a D cut surface, 14 heat dissipation fin, 14a recess, 20 light-emitting module, 21 substrate, 22 light-emitting element, 40 heat transfer part, 40a base, 40a1 end, 40a2 end, 40b fin, 40b1 fin, 40b2 fin, 41 heat transfer part, 41a base, 41b fin, 41b1 fin, 41b2 fin, 100 vehicle lamp, 101 housing, 200a trace part
Claims
1. A socket comprising a plate-shaped flange, a mounting portion provided on one side of the flange, and at least one heat dissipation fin provided on the side of the flange opposite to the mounting portion, and containing a high thermal conductivity resin; A heat transfer portion formed integrally with the socket, comprising: a base having a first end exposed from the end opposite to the flange side of the mounting portion; and a plurality of fins provided at a second end of the base facing the first end, extending inside the socket and spaced apart and arranged in one direction; A light-emitting module having a light-emitting element is provided at the first end of the base; The outer wall of the socket, comprising at least one mark portion provided at a position opposite to the end of the heat transfer portion where the space between the plurality of fins opens; A vehicle lighting device equipped with the following features.
2. The vehicle lighting device according to claim 1, wherein the trace portion is provided on at least one of the side of the flange, the side of the mounting portion, and the tip of the heat dissipation fin.
3. A D-cut surface is provided on at least one of the sides of the flange, the sides of the mounting portion, and the tip of the heat dissipation fin. The vehicle lighting device according to claim 2, wherein the aforementioned mark portion is provided on the D-cut surface.
4. A recess is provided on at least one of the sides of the flange, the sides of the mounting portion, and the tip of the heat dissipation fin. The vehicle lighting device according to claim 2, wherein the trace portion is provided on the bottom surface of the recess.
5. The vehicle lighting device according to claim 1 or 2, wherein the contour of the base portion, when viewed from a direction along the central axis of the vehicle lighting device, includes an arc and a chord connecting the two endpoints of the arc.
6. A vehicle lighting device according to any one of claims 1 to 4; A housing on which the aforementioned vehicle lighting device is attached; A vehicle lighting fixture equipped with the following features.
Citation Information
Patent Citations
Light source unit of semiconductor type light source for vehicle lamp and vehicle lamp
JP2013247061A