Wiring board, semiconductor device, and method for manufacturing a wiring board

Abstract

To provide a wiring board that can improve the reliability of electrical connections. [Solution] The wiring board 10 has an insulating layer 14, a recess 14Y that is recessed downward from the upper surface of the insulating layer 14, a connection pad 15P formed in the recess 14Y, and a gap S1 provided between the side surface of the connection pad 15P and the inner wall surface of the recess 14Y. The wiring board 10 has a connection terminal 30 formed to cover the upper surface of the connection pad 15P and fill the gap S1. The upper part of the connection pad 15P protrudes above the upper surface of the insulating layer 14. The side surface of the connection pad 15P is formed to be inclined so as it approaches the center of the plane of the connection pad 15P from the lower surface toward the upper surface of the connection pad 15P. The inner wall surface of the recess 14Y is formed as a roughened surface R2 with a greater surface roughness than the side surface of the connection pad 15P exposed from the insulating layer 14.

Claims

1. Insulating layer and, The first recess is recessed downward from the upper surface of the insulating layer, A connecting pad formed in the first recess, A gap is provided between the side surface of the connecting pad and the inner wall surface of the first recess, A connection terminal formed to cover the upper surface of the connection pad and to fill the gap, The insulating layer has a wiring layer formed on its lower surface and electrically connected to the connecting pad, The upper part of the connection pad protrudes above the upper surface of the insulating layer. The side surface of the connecting pad is formed to be inclined so as it moves from the lower surface of the connecting pad toward the upper surface of the connecting pad, approaching the center of the plane of the connecting pad. A wiring board wherein the inner wall surface of the first recess is formed as a first roughened surface having a greater surface roughness than the side surface of the connection pad exposed from the insulating layer.

2. The wiring board according to claim 1, wherein the upper surface of the insulating layer is formed as a second roughened surface having a greater surface roughness than the first roughened surface.

3. The insulating layer comprises a resin and a filler. The wiring board according to claim 2, wherein the second roughened surface has a structure in which a portion of the filler protrudes upward from the upper surface of the resin.

4. The second roughened surface has a second recess that is recessed downward from the upper surface of the resin, The filler is formed in a spherical shape, The wiring board according to claim 3, wherein the inner surface of the second recess is formed in the shape of a concave spherical surface.

5. The wiring board according to claim 3, wherein the content of the filler on the upper surface of the insulating layer is higher than the content of the filler on the inner wall surface of the first recess.

6. The wiring board according to claim 5, wherein the inner wall surface of the first recess does not contain the filler.

7. The wiring board according to claim 1, wherein the lower surface of the connection pad is formed as a curved surface that curves downward toward the center of the plane of the connection pad.

8. The aforementioned connection terminal has a structure in which a first metal layer and a second metal layer are stacked in order. The first metal layer is formed to cover the entire upper surface of the connection pad and the entire side surface of the connection pad exposed from the insulating layer, and to fill the gap. The wiring substrate according to claim 1, wherein the second metal layer is formed to cover the surface of the first metal layer.

9. A wiring board according to any one of claims 1 to 8, A semiconductor device having a semiconductor element mounted as a flip chip on the aforementioned connection terminal.

10. The process of preparing the support, The steps include forming a connecting pad on the lower surface of the support, A process of roughening the side surface of the connecting pad to form a rough surface, The steps include forming an insulating layer on the lower surface of the support having a first recess for housing the connecting pad, and forming the inner wall surface of the first recess into a first roughened surface along the roughened surface, The process involves forming a wiring layer on the lower surface of the insulating layer that is electrically connected to the connection pad, The step of removing the support, The process involves thinning the insulating layer from the upper side and causing the upper part of the connecting pad to protrude above the upper surface of the insulating layer, A step of etching a portion of the connecting pad to form a gap between the side surface of the connecting pad and the inner wall surface of the first recess, and forming the side surface of the connecting pad into a smooth surface with a surface roughness less than that of the first roughened surface, A method for manufacturing a wiring board having

Images