Liquid ejection substrate, liquid ejection head, recording device, and method for manufacturing liquid ejection substrate

Abstract

To provide a liquid dispensing substrate equipped with a common liquid chamber that can improve performance. [Solution] A liquid discharge substrate having a liquid flow channel formed inside, including a nozzle 205, an individual flow channel 207 communicating with a nozzle 2020, and a common liquid chamber communicating with the individual flow channel 207, comprising: a nozzle forming member 201 having a liquid discharge surface 200a into which the nozzle 20 is open; a first flow channel substrate 202 having a first surface 202a on which the nozzle forming member 201 is provided, a second surface 202b opposite to the first surface 202a, and a first wall portion 202c that constitutes the wall portion of the individual flow channel 207 and the common liquid chamber; and a second flow channel substrate 203 having a third surface 203a joined to the second surface 202b, and a second wall portion 203c that constitutes the wall portion of the common liquid chamber, wherein the second wall portion 203c includes a portion in which the cross-sectional area of ​​the cross section perpendicular to the first direction is different from that of the first wall portion 202c.

Description

Technical Field

[0001] The present invention relates to a liquid ejection substrate, a method for manufacturing the same, a liquid ejection head including the liquid ejection substrate, and a recording apparatus including the liquid ejection head.

Background Art

[0002] The liquid flow path formed in the liquid ejection substrate of a liquid ejection head used for inkjet printing or the like is composed of a nozzle for ejecting liquid, an individual supply port for supplying liquid to the nozzle, a common liquid chamber for supplying liquid to the individual supply port, and the like. Patent Document 1 discloses a configuration in which a common liquid chamber is formed inside a single substrate.

[0003] In some cases, a more complex shape configuration is required for the common liquid chamber of such a liquid ejection head. For example, from the viewpoint of improving the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles, it is preferable that the volume of the common liquid chamber is larger. Also, depending on the shape of the common liquid chamber, air bubbles or solute sticking may occur due to stagnation of the liquid flow.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Although it is known that the formation of a common liquid chamber is performed by dry etching or wet etching, these manufacturing methods have low freedom in the shape of the common liquid chamber. Therefore, since the shape of the common liquid chamber is limited to a simple one, it is difficult to form a common liquid chamber that contributes to improving the performance of the liquid ejection head.

[0006] An object of the present invention is to provide a liquid ejection substrate including a common liquid chamber capable of improving performance. [Means for solving the problem]

[0007] To achieve the above-mentioned objectives, the liquid discharge substrate of the present invention is A liquid discharge substrate used in a liquid discharge head, wherein a liquid flow path is formed inside the substrate, including a nozzle, individual flow paths communicating with the nozzle, and a common liquid chamber communicating with the individual flow paths, A nozzle forming member having a liquid discharge surface through which the nozzle is open, A first channel substrate having a first surface on which the nozzle forming member is provided, a second surface opposite to the first surface, and a first wall portion that constitutes the wall portion of the individual channel and the common liquid chamber, A second flow channel substrate having a third surface joined to the second surface of the first flow channel substrate in a first direction, and a second wall portion that constitutes the wall portion of the common liquid chamber, Equipped with, The second wall portion is characterized in that it includes a portion in which the cross-sectional area of ​​the section perpendicular to the first direction is different from that of the first wall portion. Furthermore, in order to achieve the above-mentioned objectives, the method for manufacturing a liquid discharge substrate of the present invention is as follows: A liquid discharge substrate used in a liquid discharge head, wherein a liquid flow path is formed inside the substrate, including a nozzle, individual flow paths communicating with the nozzle, and a common liquid chamber communicating with the individual flow paths, A first channel forming process for forming a first common liquid chamber, which constitutes a part of the aforementioned common liquid chamber, on a first channel substrate. To what extent, A second channel formation step in which the individual channels are formed on the first channel substrate, A third channel formation step involves forming a second common liquid chamber, which constitutes a part of the aforementioned common liquid chamber, on a second channel substrate, A substrate bonding step of joining the surface of the first channel substrate in which the first common liquid chamber is open and the surface of the second channel substrate in which the second common liquid chamber is open, It is characterized by including. [Effects of the Invention]

[0008] According to the present invention, a liquid discharge substrate having a common liquid chamber capable of improving performance can be provided.

Brief Description of the Drawings

[0009] [Figure 1] It is an explanatory diagram of the configuration of a liquid discharge substrate according to a comparative example. [Figure 2] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the first embodiment. [Figure 3] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the second embodiment. [Figure 4] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the third embodiment. [Figure 5] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the fourth embodiment. [Figure 6] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the fifth embodiment. [Figure 7] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the sixth embodiment. [Figure 8] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the seventh embodiment. [Figure 9] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the eighth embodiment. [Figure 10] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the ninth embodiment. [Figure 11] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the tenth embodiment. [Figure 12] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the eleventh embodiment. [Figure 13] It is an explanatory diagram of the relationship between the azimuth deviation and the opening width dimension. [Figure 14] It is an explanatory diagram of a configuration example of the second common liquid chamber according to the eleventh embodiment. [Figure 15] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the twelfth embodiment. [Figure 16] It is an explanatory diagram of the first common liquid chamber and the second common liquid chamber according to the twelfth embodiment. [Figure 17] It is an explanatory diagram of the configuration of a liquid discharge substrate according to the thirteenth embodiment. [Figure 18] It is an explanatory diagram of the configuration of a liquid ejection substrate according to the 14th embodiment. [Figure 19] It is an explanatory diagram of the configuration of a liquid ejection substrate according to the 1st example. [Figure 20] It is an explanatory diagram of the manufacturing method of a liquid ejection substrate according to the 1st example. [Figure 21] It is an explanatory diagram of the manufacturing method of a liquid ejection substrate according to the 2nd example. [Figure 22] It is an explanatory diagram of the manufacturing method of a liquid ejection substrate according to the 3rd example. [Figure 23] It is a diagram showing a schematic configuration of a recording apparatus including a liquid ejection head.

Mode for Carrying Out the Invention

[0010] Hereinafter, with reference to the drawings, modes for carrying out this invention will be exemplarily and specifically described based on examples. Note that dimensions, materials, shapes, relative arrangements, etc. of the components described in this embodiment should be appropriately changed according to the configuration of the apparatus to which the invention is applied and various conditions. That is, the scope of this invention is not intended to be limited to the following embodiments.

[0011] (Liquid ejection head and recording apparatus) The liquid ejection head according to the present invention and a recording apparatus including the liquid ejection head will be described. FIG. 23 is a diagram showing a schematic configuration of a liquid ejection apparatus including a liquid ejection head 11, particularly an inkjet recording apparatus (hereinafter also referred to as a recording apparatus) 10 that ejects ink as an example of a liquid to perform recording. The recording apparatus 10 includes a line type (page wide type) liquid ejection head 11 and a conveyance unit 12 that conveys a recording medium P. The liquid ejection head 11 is arranged such that its longitudinal direction is substantially orthogonal to the conveyance direction of the recording medium P, and includes a liquid ejection substrate in which a liquid flow path is formed inside, and a housing that supports the liquid ejection substrate. The recording apparatus 10 includes a plurality of records Continuous recording is performed in a single pass while the recording medium P is transported continuously or intermittently. The recording medium P is not limited to cut paper, but may also be continuous roll paper. Furthermore, the recording medium P is not limited to paper, but may also be film or other materials.

[0012] In the following description, the direction perpendicular to the liquid discharge surface of the liquid discharge head 11 is defined as the Z direction (first direction). Furthermore, when viewing the liquid discharge head 11 in the Z direction, the longitudinal direction of the liquid discharge head 11 is defined as the Y direction (second direction), and the short direction perpendicular to the longitudinal direction is defined as the X direction (third direction). The direction of liquid discharge from the liquid discharge head 11 is along the Z direction.

[0013] Liquid connection parts 13 are provided at both ends of the liquid discharge head 11 in the longitudinal direction (Y direction), which are connected to the liquid supply system of the recording device 10. The liquid supplied from the liquid storage section of the recording device 10 to the liquid connection parts 13 is discharged towards the recording medium P through the liquid flow path within the liquid discharge head 11. Alternatively, the liquid may be recovered from within the liquid discharge head 11 via the liquid connection parts 113. With such a configuration, the liquid can be circulated between the main body of the recording device 10 and the liquid discharge head 11.

[0014] The detailed configuration of the liquid discharge head 11 according to the present invention will be described below in terms of several embodiments. In each embodiment, the configuration of the liquid discharge substrate, in which the liquid flow path is formed, differs from one another. Therefore, the configuration of the liquid discharge substrate of the liquid discharge head 11 in each embodiment will be described below.

[0015] [Comparative Example] Prior to describing embodiments of the present invention, the configuration of the liquid discharge substrate 100 of the liquid discharge head 11 according to a comparative example will be described with reference to Figures 1(a) to (c). Figure 1(a) is a schematic plan view of the liquid discharge surface 100a of the liquid discharge substrate 100 according to the comparative example, viewed in the Z direction. Figure 1(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 1(a). Figure 1(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 1(a). Figures 1(b) and (c) show the liquid flow paths in the liquid discharge substrate 100, respectively. Note that the AA section is a cross-section passing through the nozzle 107, and the BB section is a cross-section not passing through the nozzle 107.

[0016] As shown in Figure 1, the liquid discharge substrate 100 has a configuration in which an electrothermal conversion element 104 and a nozzle layer 105 are laminated on a flow channel substrate 103 having individual supply ports 101 and a common liquid chamber 102, and a pitch conversion member 106 is joined to it. The nozzle layer 105 is a nozzle forming member having a liquid discharge surface on which a nozzle 107 is formed as a discharge port for discharging liquid such as ink. The pitch conversion member 106 has a pitch conversion flow channel 108 formed as a connecting flow channel for supplying liquid to the common liquid chamber 102. In other words, the pitch conversion member 106 can also be described as a connecting flow channel forming member with a connecting flow channel formed inside. The pitch conversion flow channel 108, common liquid chamber 102, individual supply ports 101, and nozzle 107 constitute a liquid flow channel through which the liquid discharged from the liquid discharge head 11 passes (flows). In the case of a configuration in which the liquid is circulated, individual flow channels such as individual recovery ports similar to the individual supply ports 101 may be provided to fluidly connect the nozzle 107 and the common liquid chamber 102.

[0017] The flow channel substrate 103 is made of, for example, Si. The common liquid chamber 102 can be formed, for example, by dry etching or wet etching. In this case, the shape of the common liquid chamber 102 is limited by the thickness of the flow channel substrate 103 and the characteristics of dry etching or wet etching. Therefore, the shape and volume of the common liquid chamber 102 formed on the flow channel substrate 103 are limited, and it is difficult to freely increase the volume or complicate the shape.

[0018] From the perspective of improving the efficiency of liquid replenishment to nozzle 107 and preventing crosstalk with adjacent nozzles, A larger volume for the common liquid chamber 102 is preferable. Furthermore, in order to prevent foam buildup and solute adhesion caused by stagnation of the liquid flow, it is preferable to adopt a shape that eliminates stagnant areas in the liquid flow. Therefore, a configuration that can improve the degree of freedom of the shape of the common liquid chamber will be described illustratively in several embodiments.

[0019] [First Embodiment] The liquid discharge substrate 200 of the liquid discharge head 11 according to the first embodiment will be described with reference to Figures 2(a) to (c). Figure 2(a) is a schematic plan view of the liquid discharge surface 200a of the liquid discharge substrate 200 according to the first embodiment, viewed in the Z direction. Figure 2(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 2(a). Figure 2(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 2(a). Figures 2(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively. Note that the AA section is a cross-section passing through the nozzle 205, and the BB section is a cross-section not passing through the nozzle 205.

[0020] (Configuration of the liquid dispensing substrate in the first embodiment) The liquid discharge substrate 200 has a laminated structure composed of a nozzle layer 201, a first channel substrate 202, a second channel substrate 203, and a pitch conversion member 204. These members are stacked in the Z-direction in the order of nozzle layer 201, first channel substrate 202, second channel substrate 203, and pitch conversion member 204. In other words, the stacking direction of the liquid discharge substrate 200 is parallel to the Z-direction.

[0021] The liquid discharge substrate 200 includes a nozzle 205, an electrothermal conversion element 206, individual supply ports 207, a first common liquid chamber 208, a second common liquid chamber 209, and a pitch conversion channel 210. The nozzle 205 is formed in the nozzle layer 201 so as to open in the Z direction. The individual supply ports 207 and the first common liquid chamber 208 are formed inside the first channel substrate 202. The individual supply port 207 is an individual channel that opens at one end in the Z direction and communicates with a channel formed in the nozzle layer 201. The first common liquid chamber 208, which communicates with the individual supply port 207, opens at the other end in the Z direction. The second common liquid chamber 209 is formed inside the second channel substrate 203 and communicates with the first common liquid chamber 208. The pitch conversion channel 210 is formed inside the pitch conversion member 204, communicates with the second common liquid chamber 209, and is a connecting channel for supplying liquid to the common liquid chamber. In other words, the pitch conversion member 204 is a connecting channel conversion member in which a connecting channel is formed inside. That is, in the first embodiment, the common liquid chamber of the liquid discharge substrate 200 is composed of a first common liquid chamber 208 and a second common liquid chamber 209. The electrothermal conversion element 206 is provided on the first channel substrate 202 so as to be positioned to overlap the nozzle 205 when viewed in the Z direction.

[0022] The first flow channel substrate 202 has a first surface 202a connected to the nozzle layer 201, a second surface 202b connected to the second flow channel substrate 203, and a first wall portion 202c that constitutes the individual supply port 207 and the first common liquid chamber 208. The first surface 202a is the surface on which the individual supply port 207 is open. The second surface 202b is the surface on which the first common liquid chamber 208 is open. The first surface 202a and the second surface 202b are surfaces facing opposite directions.

[0023] The second channel substrate 203 has a third surface 203a that is joined in the Z direction to the second surface 202b of the first channel substrate 202, a fourth surface 203b that is joined to the pitch conversion member 204, and a second wall portion 203c that constitutes the second common liquid chamber 209. The second common liquid chamber 209 is open to the third surface 203a and the fourth surface 203b. The third surface 203a and the fourth surface 203b are surfaces facing opposite directions.

[0024] The pitch conversion member 204 has a surface 204a that is joined to the fourth surface 203b of the second channel substrate 203. The second surface 202b and the third surface 203a are joined to each other by adhesive 215, and the fourth surface 203b and surface 204a are joined to each other by adhesive 216. Surface 204a has a pitch conversion The exchange channel 210 is open.

[0025] The liquid flow path of the liquid discharge substrate 200 consists of a nozzle 205, individual supply ports 207, a first common liquid chamber 208, a second common liquid chamber 209, and a pitch conversion flow path 210. The liquid that flows into the liquid flow path via the pitch conversion flow path 210 flows into the individual supply ports 207 via the second common liquid chamber 209 and the first common liquid chamber 208, and is discharged from the nozzle 205 by the drive of the electrothermal conversion element 206.

[0026] The first flow channel substrate 202 has a plurality of individual supply ports 207 and a plurality of first common liquid chambers 208. As shown in Figure 2(b), a beam 202d, which constitutes part of the first wall 202c, is provided between two first common liquid chambers 208 in the X direction. In other words, the two first common liquid chambers 208 are separated in the X direction by the beam 202d. Similarly, the two individual supply ports 207 are separated in the X direction by the beam 202d.

[0027] Multiple second common liquid chambers 209 are formed in the second flow channel substrate 203. As shown in Figure 2(b), a beam 203d, which constitutes part of the second wall 203c, is provided between two second common liquid chambers 209 in the X direction. In other words, the two second common liquid chambers 209 are separated in the X direction by the beam 203d. The beam 203d is wider and thicker in the X direction compared to the beam 202d.

[0028] As shown in Figure 2(c), the first common liquid chamber 208 is a space with the Y direction as its longitudinal direction, and multiple individual supply ports 207 are connected to it. Similarly, the second common liquid chamber 209 is a space with the Y direction as its longitudinal direction, and is connected to the first common liquid chamber 208 and the pitch conversion channel 210.

[0029] In a cross-section perpendicular to the Z direction, the cross-sectional areas of the first common liquid chamber 208 and the second common liquid chamber 209 are constant in the Z direction. In other words, the wall surface of the first wall portion 202c constituting the first common liquid chamber 208 and the wall surface of the second wall portion 203c constituting the second common liquid chamber 209 are parallel to the Z direction. Furthermore, the cross-sectional area of ​​the first common liquid chamber 208 is larger than the cross-sectional area of ​​the second common liquid chamber 209. That is, the connection between the first wall portion 202c and the second wall portion 203c is discontinuous, and at the connection between the first common liquid chamber 208 and the second common liquid chamber 209, the cross-sectional areas of the first common liquid chamber 208 and the second common liquid chamber 209 are different from each other. Thus, according to the configuration of the first embodiment, since the common liquid chamber constituting the liquid flow path of the liquid discharge head 11 is composed of two flow path substrates, there is a high degree of freedom in the shape of the common liquid chamber. In the following explanation, unless otherwise specified, the cross-sectional area of ​​the common liquid chamber refers to the cross-sectional area perpendicular to the Z direction.

[0030] When comparing the configuration of the first embodiment (Figures 2(a) to (c)) with the configuration of the comparative example (Figures 1(a) to (c)), even if the thickness (length in the Z direction) of the liquid discharge substrate is the same, the configuration of the first embodiment allows for a larger volume of the common liquid chamber of the liquid discharge head 11. This is because the first wall portion 202c, including the beam 202d, can be formed thinner. In the configuration of the comparative example, in order to increase the volume of the common liquid chamber, the entire wall portion must be thinned, which can significantly reduce the substrate strength and may not be able to secure the necessary strength. On the other hand, in the configuration of the first embodiment, only the first wall portion 202c of the first flow channel substrate 202 is thinned, suppressing the reduction in substrate strength and ensuring the necessary strength while increasing the volume of the common liquid chamber. With such a configuration, the performance of the liquid discharge head can be improved, such as by improving the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles.

[0031] (Method for manufacturing a liquid discharge substrate according to the first embodiment) A method for manufacturing the liquid channel of the liquid discharge substrate 200 according to the first embodiment will be described. In the channel formation process, individual supply ports 207 and a first common liquid chamber 208 are formed in the first channel substrate 202, a second common liquid chamber 209 is formed in the second channel substrate 203, and a pitch conversion channel 210 is formed in the pitch conversion member 204. Si can be used as the material for the first channel substrate 202, the second channel substrate 203, and the pitch conversion member 204. As a method for forming the channels, processing methods such as dry etching and wet etching using a photoresist as a mask can be used.

[0032] Next, in the joining process, the first channel substrate 202 and the second channel substrate 203 are joined, and the second channel substrate 203 and the pitch conversion member 204 are joined. The second surface 202b of the first channel substrate 202 and the third surface 203a of the second channel substrate 203 are joined with adhesive 215. The fourth surface 203b of the second channel substrate 203 and the surface 204a of the pitch conversion member 204 are joined with adhesive 216. The joining method can include a joining method that includes heating and pressurizing. Adhesives 215 and 216 are preferably materials with high adhesion, and preferably contain any resin selected from the group consisting of epoxy resin, acrylic resin, silicone resin, benzocyclobutene resin, polyamide resin, polyimide resin, and urethane resin.

[0033] Next, as a nozzle formation process, a nozzle layer 201 is formed on the first surface 202a of the first channel substrate 202. For example, a negative-type photoresist can be used as the material for the nozzle layer 201. By exposing and developing the nozzle layer 201, a nozzle 205 is formed.

[0034] [Second Embodiment] In the liquid discharge head 11 according to the second embodiment, the relationship between the cross-sectional areas of the first flow channel substrate and the second flow channel substrate differs from that of the first embodiment. Below, the differences between the configuration of the second embodiment and that of the first embodiment will be mainly described, and similar points will not be explained.

[0035] The liquid discharge substrate 300 of the liquid discharge head 11 according to the second embodiment will be described with reference to Figures 3(a) to (c). Figure 3(a) is a schematic plan view of the liquid discharge surface 300a of the liquid discharge substrate 300 according to the second embodiment, viewed in the Z direction. Figure 3(b) is a schematic cross-sectional view of Figure 3(a) in section AA perpendicular to the Y direction. Figure 3(c) is a schematic cross-sectional view of Figure 3(a) in section BB perpendicular to the X direction. Figures 3(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0036] (Configuration of the liquid discharge substrate in the second embodiment) The liquid discharge substrate 300 has a laminated structure consisting of a nozzle layer 301, a first flow channel substrate 302, a second flow channel substrate 303, and a pitch conversion member 304. The liquid flow channels of the liquid discharge substrate 300 consist of the nozzle 305 of the nozzle layer 301, the individual supply ports 307 and the first common liquid chamber 308 of the first flow channel substrate 302, the second common liquid chamber 309 of the second flow channel substrate 303, and the pitch conversion flow channel 310 of the pitch conversion member 304.

[0037] Similar to the first embodiment, the first flow channel substrate 302 has a plurality of first common liquid chambers 308 formed therein. As shown in Figure 3(b), a beam 302d, which constitutes part of the first wall portion 302c of the first flow channel substrate 302, is provided between two first common liquid chambers 308 in the X direction. The second flow channel substrate 303 has a plurality of second common liquid chambers 309 formed therein. A beam 303d, which constitutes part of the second wall portion 303c of the second flow channel substrate 303, is provided between two second common liquid chambers 309 in the X direction. In the second embodiment, the beam 303d is narrower and has a smaller width in the X direction compared to the beam 302d.

[0038] In a cross-section perpendicular to the Z direction, the cross-sectional area of ​​the first common liquid chamber 308 and the cross-sectional area of ​​the second common liquid chamber 309 are constant in the Z direction. In the second embodiment, the second common liquid chamber The cross-sectional area of ​​309 is larger than the cross-sectional area of ​​the first common liquid chamber 308. In other words, the connection between the first wall portion 302c and the second wall portion 303c is discontinuous, and at the connection between the first common liquid chamber 308 and the second common liquid chamber 309, the cross-sectional areas of the first common liquid chamber 308 and the second common liquid chamber 309 are different from each other. Thus, according to the configuration of the second embodiment, since the common liquid chamber constituting the liquid flow path of the liquid discharge head 11 is composed of two flow path substrates, there is a high degree of freedom in the shape of the common liquid chamber.

[0039] In the configuration of the second embodiment, as in the first embodiment, the volume of the common liquid chamber of the liquid discharge head 11 can be increased compared to the configuration of the comparative example. This is because the second wall portion 303c, including the beam 303d, can be made thinner. Thus, in order to increase the volume of the common liquid chamber, it is sufficient to have a configuration in which either the first common liquid chamber or the second common liquid chamber can be expanded. With such a configuration, it is possible to improve the functionality of the liquid discharge head, such as improving the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles.

[0040] In the first and second embodiments, the opening width of the first common liquid chamber on the second common liquid chamber side was shown to be larger or smaller than the opening width of the second common liquid chamber on the first common liquid chamber side in both the X and Y directions, but the configuration is not limited to this. For example, the opening width of the first common liquid chamber in the X direction may be larger than the opening width of the second common liquid chamber in the X direction, and the opening width of the first common liquid chamber in the Y direction may be smaller than the opening width of the second common liquid chamber in the Y direction. Even when the relative sizes differ in the X and Y directions, it is still possible to obtain the effect of increasing the volume while ensuring substrate strength.

[0041] [Third Embodiment] The liquid discharge head 11 according to the third embodiment differs from that of the second embodiment in the shape of the wall portion of the second flow channel substrate. Below, the differences between the configuration of the third embodiment and that of the second embodiment will be mainly described, and similar points will not be explained.

[0042] The liquid discharge substrate 400 of the liquid discharge head 11 according to the third embodiment will be described with reference to Figures 4(a) to (c). Figure 4(a) is a schematic plan view of the liquid discharge surface 400a of the liquid discharge substrate 400 according to the third embodiment, viewed in the Z direction. Figure 4(b) is a schematic cross-sectional view of Figure 4(a) in section AA perpendicular to the Y direction. Figure 4(c) is a schematic cross-sectional view of Figure 4(a) in section BB perpendicular to the X direction. Figures 4(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0043] (Configuration of the liquid discharge substrate in the third embodiment) The liquid discharge substrate 400 has a laminated structure composed of a nozzle layer 401, a first channel substrate 402, a second channel substrate 403, and a pitch conversion member 404. The liquid channels of the liquid discharge substrate 400 are composed of a nozzle 405 of the nozzle layer 401, individual supply ports 407 and a first common liquid chamber 408 of the first channel substrate 402, a second common liquid chamber 409 of the second channel substrate 403, and a pitch conversion channel 410 of the pitch conversion member 404.

[0044] In the third embodiment, the second wall portion 403c of the second flow channel substrate 403 is configured such that the cross-sectional area of ​​the second common liquid chamber 409 gradually increases as it approaches the pitch conversion flow channel 410 (pitch conversion member 404) from the first common liquid chamber 408 (first flow channel substrate 402). That is, the wall surface of the second wall portion 403c, including the beam 403d, is inclined with respect to the Z direction. Thus, the second wall portion 403c includes a tapered surface inclined with respect to the Z direction.

[0045] The cross-sectional area of ​​the first common liquid chamber 408 is constant in the Z direction, while the cross-sectional area of ​​the second common liquid chamber 409 gradually changes. The first wall portion 402c and the second wall portion 403c are configured such that the cross-sectional area of ​​the second common liquid chamber 409 is always larger than the cross-sectional area of ​​the first common liquid chamber 408. Furthermore, the minimum cross-sectional area of ​​the second common liquid chamber 409 and the cross-sectional area (opening width) of the end on the Z-direction side of the first common liquid chamber 408 are larger than the cross-sectional area (opening width) of the first common liquid chamber 408. Also, the connection between the first wall portion 402c and the second wall portion 403c is discontinuous, and at the connection between the first common liquid chamber 408 and the second common liquid chamber 409, the cross-sectional areas of the first common liquid chamber 408 and the second common liquid chamber 409 are different from each other. Thus, according to the configuration of the third embodiment, since the common liquid chamber constituting the liquid flow path of the liquid discharge head 11 is composed of two flow path substrates, there is a high degree of freedom in the shape of the common liquid chamber. With such a configuration, it is possible to improve the functionality of the liquid discharge head, such as improving the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles.

[0046] Furthermore, according to the configuration of the third embodiment, compared to the second embodiment, the width (thickness C) in the X direction of the beam 403d on the first channel substrate 402 side can be increased while keeping the volume of the second common liquid chamber the same. This is because the wall surface of the second wall portion 403c is inclined with respect to the Z direction. Therefore, according to the configuration of the third embodiment, compared to the second embodiment, the area of ​​the joint surface between the first channel substrate and the second channel substrate can be increased, thereby improving the joint strength between the first channel substrate and the second channel substrate.

[0047] [Fourth Embodiment] The liquid discharge head 11 according to the fourth embodiment differs from that of the second embodiment in that a protrusion is provided on the second flow channel substrate. Below, the differences between the configuration of the fourth embodiment and that of the second embodiment will be mainly described, and similar points will not be explained.

[0048] The liquid discharge substrate 500 of the liquid discharge head 11 according to the fourth embodiment will be described with reference to Figures 5(a) to (c). Figure 5(a) is a schematic plan view of the liquid discharge surface 500a of the liquid discharge substrate 500 according to the fourth embodiment, viewed in the Z direction. Figure 5(b) is a schematic cross-sectional view of Figure 5(a) in section AA perpendicular to the Y direction. Figure 5(c) is a schematic cross-sectional view of Figure 5(a) in section BB perpendicular to the X direction. Figures 5(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0049] (Configuration of the liquid dispensing substrate in the fourth embodiment) The liquid discharge substrate 500 has a laminated structure consisting of a nozzle layer 501, a first flow channel substrate 502, a second flow channel substrate 503, and a pitch conversion member 504. The liquid flow channels of the liquid discharge substrate 500 consist of the nozzle 505 of the nozzle layer 501, the individual supply ports 507 and the first common liquid chamber 508 of the first flow channel substrate 502, the second common liquid chamber 509 of the second flow channel substrate 503, and the pitch conversion flow channel 510 of the pitch conversion member 504.

[0050] In the fourth embodiment, a protrusion 511 is provided inside the second common liquid chamber 509, projecting from the bottom surface of the second common liquid chamber 509 toward the first common liquid chamber 508 along the Z direction. In the fourth embodiment, the bottom surface of the second common liquid chamber 509 is the surface of the pitch conversion member 504 that faces the same direction as the third surface 501a. As shown in Figure 5(c), the protrusion 511 extends from one end of the second common liquid chamber 509 (the end on the pitch conversion flow path 510 side) toward the other end (the end on the first common liquid chamber 508 side).

[0051] The liquid discharge substrate 500 is provided with a plurality of protrusions 511. The pitch conversion member 504 has a plurality of pitch conversion channels 510 formed at intervals in the Y direction. Each of the multiple protrusions 511 is positioned between two pitch conversion channels 510 aligned in the Y direction.

[0052] When multiple pitch conversion channels 510 are provided, stagnation of liquid flow is likely to occur in the intermediate portion between two adjacent pitch conversion channels 510. This stagnation of liquid flow can cause foam buildup and solute adhesion. The protrusions 511 control the liquid flow. This structure suppresses stagnation in the liquid flow. In other words, according to the configuration of the fourth embodiment, stagnation in the liquid flow can be suppressed, and the occurrence of foam buildup and solute adhesion can be prevented.

[0053] Note that the protrusions 511 shown in Figure 5(c) are merely examples, and their shape, number, and placement are not limited to those shown. For example, multiple protrusions 511 may be provided between two pitch conversion channels 510. The cross-sectional shape of the protrusions 511 may be polygonal or circular, and the cross-sectional shape and cross-sectional area may be configured to gradually change along the direction of extension.

[0054] [Fifth Embodiment] The liquid discharge head 11 according to the fifth embodiment differs from that of the first embodiment in that the liquid discharge substrate includes a third flow channel substrate. Hereinafter, the differences between the configuration of the fifth embodiment and that of the first embodiment will be mainly described, while similar points will not be explained.

[0055] The liquid discharge substrate 600 of the liquid discharge head 11 according to the fifth embodiment will be described with reference to Figures 6(a) to (c). Figure 6(a) is a schematic plan view of the liquid discharge surface 600a of the liquid discharge substrate 600 according to the fifth embodiment, viewed in the Z direction. Figure 6(b) is a schematic cross-sectional view of Figure 6(a) in section AA perpendicular to the Y direction. Figure 6(c) is a schematic cross-sectional view of Figure 6(a) in section BB perpendicular to the X direction. Figures 6(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0056] (Configuration of the liquid dispensing substrate in the fifth embodiment) The liquid discharge substrate 600 has a laminated structure composed of a nozzle layer 601, a first channel substrate 602, a second channel substrate 603, a third channel substrate 612, and a pitch conversion member 604. These components are stacked in the Z direction in the order of nozzle layer 601, first channel substrate 602, third channel substrate 612, second channel substrate 603, and pitch conversion member 604. The liquid channels of the liquid discharge substrate 600 are composed of the nozzle 605 of the nozzle layer 601, the individual supply ports 607 and the first common liquid chamber 608 of the first channel substrate 602, the second common liquid chamber 609 of the second channel substrate 603, the third common liquid chamber 613 of the third channel substrate 612, and the pitch conversion channel 610 of the pitch conversion member 604.

[0057] The third common liquid chamber 613 is a space whose longitudinal direction is in the Y direction, and it communicates with the second common liquid chamber 609 at one end in the Z direction and with the pitch conversion flow channel 610 at the other end in the Z direction. In other words, in the first embodiment, the common liquid chamber of the liquid discharge substrate 600 is composed of the first common liquid chamber 608, the second common liquid chamber 609 and the third common liquid chamber 613.

[0058] The third channel substrate 612 has a fifth surface 612a connected to the fourth surface 603b of the second channel substrate 603, a sixth surface 612b to which the pitch conversion member 604 is connected, and a third wall portion 612c that constitutes the third common liquid chamber 613. The fifth surface 612a and the sixth surface 612b are surfaces facing opposite directions. The fourth surface 603b and the fifth surface 612a are joined to each other by adhesive 614, and the sixth surface 612b and the surface 604a of the pitch conversion member 604 are joined to each other by adhesive 615.

[0059] Multiple third common liquid chambers 613 are formed in the third flow channel substrate 612. As shown in Figure 6(b), a beam 612d, which constitutes part of the third wall portion 612c of the third flow channel substrate 612, is provided between two third common liquid chambers 613 in the X direction.

[0060] In the fifth embodiment, the beam 612d of the third channel substrate 612 has a larger width in the X direction compared to the beam 602d of the first channel substrate 602 and the beam 603d of the second channel substrate 603. In other words, the configuration of the fifth embodiment is the same as the second channel substrate 203 of the second embodiment (Figures 3(a) to (c)). This configuration is similar to that of a section of wall 203c that has been thickened.

[0061] In a cross-section perpendicular to the Z direction, the cross-sectional area of ​​the third common liquid chamber 613 is constant in the Z direction. That is, the cross-sectional area of ​​the third common liquid chamber 613 is smaller than that of the first common liquid chamber 608 and the second common liquid chamber 609. More specifically, the opening width of the third common liquid chamber 613 in the X direction is smaller than that of the first common liquid chamber 608 and the second common liquid chamber 609, and the opening width of the third common liquid chamber 613 in the Y direction is smaller than that of the first common liquid chamber 608 and the same as that of the second common liquid chamber 609. Therefore, at the connection point between the second common liquid chamber 609 and the third common liquid chamber 613, the cross-sectional areas of the second common liquid chamber 609 and the third common liquid chamber 613 are different from each other. In addition, the connection point between the second wall portion 603c and the third wall portion 612c includes a discontinuous portion. Specifically, the X-direction end faces of the second common liquid chamber 609 and the third common liquid chamber 613 are discontinuous, while the Y-direction end faces are continuous across the adhesive 614 and lie on the same plane.

[0062] In this configuration, by providing a third channel substrate 612 sandwiched between the first channel substrate 602 and the second channel substrate 603, the beam 612d of the third channel substrate 612 can be made thinner, and the volume of the third common liquid chamber 613 can be increased. On the other hand, the beam 602d of the first channel substrate 602 and the beam 603d of the second channel substrate 603 can be kept thick to ensure strength. Consequently, the volume of the common liquid chambers (first common liquid chamber 608, second common liquid chamber 609, third common liquid chamber 613) of the liquid discharge substrate 600 can be increased while ensuring the strength of the liquid discharge substrate 600. Therefore, with this configuration, it is possible to improve the functionality of the liquid discharge head, such as improving the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles.

[0063] [Sixth Embodiment] The liquid discharge head 11 according to the sixth embodiment differs from that of the second embodiment in that a foam-catching filter is provided at the junction of the first flow channel substrate and the second flow channel substrate. Below, the differences between the configuration of the sixth embodiment and that of the second embodiment will be mainly described, and similar points will not be explained.

[0064] The liquid discharge substrate 700 of the liquid discharge head 11 according to the sixth embodiment will be described with reference to Figures 7(a) to (c). Figure 7(a) is a schematic plan view of the liquid discharge surface 700a of the liquid discharge substrate 700 according to the sixth embodiment, viewed in the Z direction. Figure 7(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 7(a). Figure 7(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 7(a). Figures 7(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0065] (Configuration of the liquid discharge substrate in the sixth embodiment) The liquid discharge substrate 700 has a laminated structure consisting of a nozzle layer 701, a first channel substrate 702, a second channel substrate 703, and a pitch conversion member 704. The liquid channels of the liquid discharge substrate 700 consist of a nozzle 705 of the nozzle layer 701, individual supply ports 707 and a first common liquid chamber 708 of the first channel substrate 702, a second common liquid chamber 709 of the second channel substrate 703, and a pitch conversion channel 710 of the pitch conversion member 704.

[0066] In the sixth embodiment, a bubble-catching filter 716 is provided between the first flow channel substrate 702 and the second flow channel substrate 703. The bubble-catching filter 716 is a filter that captures air bubbles contained in the liquid, such as ink, flowing from the second common liquid chamber 709 to the first common liquid chamber 708. The bubble-catching filter 716 can suppress the inflow of air bubbles into the nozzle 705. For the bubble-catching filter 716, it is preferable to use a resin material such as polyimide.

[0067] Figure 7(b) shows the connection between the first common liquid chamber 708 and the second common liquid chamber 709, where the liquid The diagram shows a configuration in which a foam-catching filter 716 is provided in the portion where liquid flows from the second common liquid chamber 709 to the first common liquid chamber 708. On the other hand, in the sixth embodiment, a foam-catching filter 716 is not provided in the portion where the liquid flows from the first common liquid chamber 708 to the second common liquid chamber 709. The portion where the foam-catching filter 716 is not provided is to constitute a flow path for recovering liquid that was not discharged from the nozzle 705. In other words, a foam-catching filter 716 is not necessarily required in the flow path that extends from the flow path formed in the nozzle layer 701 to the second common liquid chamber 709 via the individual recovery port 717 of the first flow path substrate 702 and the first common liquid chamber 708. Thus, it is preferable to have a configuration in which the foam-catching filter 716 is arranged according to the direction of liquid flow.

[0068] [Seventh Embodiment] The liquid discharge head 11 according to the seventh embodiment differs from that of the first embodiment in that the second flow channel substrate and the pitch conversion member are integrally formed. Hereinafter, the differences between the configuration of the seventh embodiment and that of the first embodiment will be mainly described, while similar points will not be explained.

[0069] The liquid discharge substrate 800 of the liquid discharge head 11 according to the seventh embodiment will be described with reference to Figures 8(a) to (c). Figure 8(a) is a schematic plan view of the liquid discharge surface 800a of the liquid discharge substrate 800 according to the seventh embodiment, viewed in the Z direction. Figure 8(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 8(a). Figure 8(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 8(a). Figures 8(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0070] (Configuration of the liquid dispensing substrate in the seventh embodiment) The liquid discharge substrate 800 has a laminated structure consisting of a nozzle layer 801, a first channel substrate 802, and a second channel substrate 803. The liquid channels of the liquid discharge substrate 800 consist of a nozzle 805 of the nozzle layer 801, individual supply ports 807 and a first common liquid chamber 808 of the first channel substrate 802, a second common liquid chamber 809 and a pitch conversion channel 817 of the second channel substrate 803.

[0071] In the seventh embodiment, the liquid discharge substrate 800 is not provided with a pitch conversion member; instead, a pitch conversion channel 817 is formed in the second channel substrate 803. In other words, the configuration of the eighth embodiment is such that the second channel substrate 203 and the pitch conversion member 204 in the first embodiment (Figures 2(a) to (c)) are integrated.

[0072] The second common liquid chamber 809 and the pitch conversion channel 817 are formed inside the second channel substrate 803. In other words, the second wall portion 803c of the second channel substrate 803 constitutes the pitch conversion channel 817 in addition to the second common liquid chamber 809. The second common liquid chamber 809 opens on the third surface 803a of the second channel substrate 803 and communicates with the first common liquid chamber 808. The pitch conversion channel 817, which communicates with the second common liquid chamber 809, opens on the fourth surface 803b of the second channel substrate 803. The fourth surface 803b faces the outside of the liquid discharge substrate 800.

[0073] The second channel substrate 803 according to the eighth embodiment can be manufactured by forming a second common liquid chamber 809 from the third surface 803a side and a pitch conversion channel 817 from the fourth surface 803b side. Dry etching using a photoresist as a mask is preferred as a method for forming channels such as the second common liquid chamber 809 and the pitch conversion channel 817. With such a manufacturing method, the walls constituting each channel are formed parallel to the Z direction, and the second common liquid chamber 809 and pitch conversion channel 817 can be manufactured with a constant cross-sectional area in the Z direction.

[0074] This configuration eliminates the need for joining the pitch conversion member, thus simplifying the manufacturing process compared to the first embodiment. Furthermore, similar to the configuration of the first embodiment, it improves the efficiency of liquid replenishment to the nozzle and prevents crosstalk with adjacent nozzles, etc. This will allow for improvements in functionality.

[0075] [Eighth Embodiment] The liquid discharge head 11 according to the eighth embodiment differs from that of the seventh embodiment in the shape of the flow path of the second flow path substrate. Below, the differences between the configuration of the eighth embodiment and that of the seventh embodiment will be mainly described, and similar points will not be explained.

[0076] The liquid discharge substrate 900 of the liquid discharge head 11 according to the eighth embodiment will be described with reference to Figures 9(a) to (c). Figure 9(a) is a schematic plan view of the liquid discharge surface 900a of the liquid discharge substrate 900 according to the eighth embodiment, viewed in the Z direction. Figure 9(b) is a schematic cross-sectional view of Figure 9(a) in section AA perpendicular to the Y direction. Figure 9(c) is a schematic cross-sectional view of Figure 9(a) in section BB perpendicular to the X direction. Figures 9(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0077] (Configuration of the liquid dispensing substrate in the 8th embodiment) The liquid discharge substrate 900 has a laminated structure consisting of a nozzle layer 901, a first channel substrate 902, and a second channel substrate 903. The liquid channels of the liquid discharge substrate 900 consist of a nozzle 905 of the nozzle layer 901, individual supply ports 907 and a first common liquid chamber 908 of the first channel substrate 902, a second common liquid chamber 909 and a pitch conversion channel 917 of the second channel substrate 903.

[0078] In the eighth embodiment, similar to the seventh embodiment, the liquid discharge substrate 900 is not provided with a pitch conversion member; instead, a pitch conversion channel 917 is formed in the second channel substrate 903. In the eighth embodiment, the second wall portion 903c of the second channel substrate 903 is configured such that the cross-sectional area of ​​the second common liquid chamber 909 gradually decreases as it approaches the pitch conversion channel 917 from the first common liquid chamber 908 (first channel substrate 902). That is, the wall surface of the second wall portion 903c constituting the second channel substrate 903 is inclined with respect to the Z direction. In other words, the second wall portion 903c includes a tapered surface inclined with respect to the Z direction.

[0079] The cross-sectional area of ​​the first common liquid chamber 908 is constant in the Z direction, while the cross-sectional area of ​​the second common liquid chamber 909 gradually changes. The connection between the first wall 902c and the second wall 903c is discontinuous, and at the connection between the first common liquid chamber 908 and the second common liquid chamber 909, the cross-sectional areas of the first common liquid chamber 908 and the second common liquid chamber 909 are different from each other. Furthermore, the second wall 903c is configured such that the cross-sectional area of ​​the second common liquid chamber 909 gradually decreases as it moves away from the first common liquid chamber 908. However, at the connection between the first common liquid chamber 908 and the second common liquid chamber 909, the opening width in the X direction and the opening width in the Y direction of the first common liquid chamber 908 and the second common liquid chamber 909 may be the same, and their cross-sectional areas may be the same.

[0080] The second channel substrate 903 according to the eighth embodiment can be manufactured by forming a second common liquid chamber 909 from the third surface 903a side and a pitch conversion channel 917 from the fourth surface 903b side. Wet etching is preferred as the method for forming the second common liquid chamber 909, and dry etching is preferred as the method for forming the pitch conversion channel 917. With such a manufacturing method, a second common liquid chamber 909 whose cross-sectional area changes in the Z direction and a pitch conversion channel 917 whose cross-sectional area is constant in the Z direction can be formed within a single substrate.

[0081] This configuration simplifies the manufacturing process compared to the first and eighth embodiments. Furthermore, even in the configuration where the pitch conversion channel is formed on the second channel substrate, as in the eighth embodiment, the common liquid chamber constituting the liquid channel of the liquid discharge head 11 is composed of two channel substrates, thus offering greater flexibility in the shape of the common liquid chamber. This configuration makes it possible to improve the functionality of the liquid discharge head, such as increasing the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles.

[0082] [Ninth Embodiment] The liquid discharge head 11 according to the ninth embodiment differs from that of the eighth embodiment in the shape of the flow path of the second flow path substrate. Below, the differences between the configuration of the ninth embodiment and that of the eighth embodiment will be mainly described, and similar points will not be explained.

[0083] The liquid discharge substrate 1000 of the liquid discharge head 11 according to the ninth embodiment will be described with reference to Figures 10(a) to (c). Figure 10(a) is a schematic plan view of the liquid discharge surface 1000a of the liquid discharge substrate 1000 according to the ninth embodiment, viewed in the Z direction. Figure 10(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 10(a). Figure 10(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 10(a). Figures 10(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0084] (Configuration of the liquid dispensing substrate in the ninth embodiment) The liquid discharge substrate 1000 has a laminated structure consisting of a nozzle layer 1001, a first channel substrate 1002, and a second channel substrate 1003. The liquid channels of the liquid discharge substrate 1000 consist of a nozzle 1005 of the nozzle layer 1001, individual supply ports 1007 and a first common liquid chamber 1008 of the first channel substrate 1002, a second common liquid chamber 1009 and a pitch conversion channel 1017 of the second channel substrate 1003.

[0085] In the ninth embodiment, the second wall portion 1003c of the second channel substrate 1003 is configured such that the cross-sectional area of ​​the pitch conversion channel 1017 gradually increases as it moves away from the second common liquid chamber 1009. That is, in the ninth embodiment, the wall surface of the second wall portion 1003c constituting the second channel substrate 1003 and the wall surface of the second wall portion 1003c constituting the pitch conversion channel 1017 are inclined with respect to the Z direction.

[0086] The second channel substrate 1003 according to the ninth embodiment can be manufactured by forming a second common liquid chamber 1009 from the third surface 1003a side and a pitch conversion channel 1017 from the fourth surface 1003b side. Wet etching is preferred as a method for forming channels such as the second common liquid chamber 1009 and the pitch conversion channel 1017. The crystal plane orientation of the second channel substrate 1003 according to the ninth embodiment is <100> A silicon substrate is used. At this time, the taper angle of the wall surface of the second wall portion 1003c formed by wet etching is <111> The exposed area will be at 54.7°.

[0087] The pitch conversion channel 1017 is configured to widen (increase in cross-sectional area) from the second common liquid chamber 1009 toward the fourth surface 1003b, which makes it easier to keep bubbles entering the pitch conversion channel 1017 from the second common liquid chamber 1009 away from the nozzle 1005. Consequently, the reduction in discharge function due to bubbles can be suppressed.

[0088] [Tenth Embodiment] The liquid discharge head 11 according to the 10th embodiment differs from that of the 9th embodiment in the shape of the flow path of the second flow path substrate. Below, the differences between the configuration of the 10th embodiment and that of the 9th embodiment will be mainly described, and similar points will not be explained.

[0089] The liquid discharge substrate 1100 of the liquid discharge head 11 according to the 10th embodiment will be described with reference to Figures 11(a) to (c). Figure 11(a) is a schematic plan view of the liquid discharge surface 1100a of the liquid discharge substrate 1100 according to the 10th embodiment, viewed in the Z direction. Figure 11(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 11(a). Figure 11(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 11(a). Figures 11(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0090] (Configuration of the liquid dispensing substrate in the 10th embodiment) The liquid discharge substrate 1100 has a laminated structure consisting of a nozzle layer 1101, a first channel substrate 1102, and a second channel substrate 1103. The liquid channels of the liquid discharge substrate 1100 consist of a nozzle 1105 of the nozzle layer 1101, individual supply ports 1107 and a first common liquid chamber 1108 of the first channel substrate 1102, a second common liquid chamber 1109 and a pitch conversion channel 1117 of the second channel substrate 1103.

[0091] In the tenth embodiment, the second common liquid chamber 1109 and the pitch conversion channel 1117 are not directly connected, but are configured independently of each other. As shown in Figure 11(b), in a cross-section perpendicular to the Y direction, the second common liquid chamber 1109 and the pitch conversion channel 1117 are separated in the X direction by the second wall portion 1103c. In other words, the second common liquid chamber 1109 and the pitch conversion channel 1117 are arranged side by side in the X direction. Also, as shown in Figure 11(c), in a cross-section perpendicular to the X direction, the second common liquid chamber 1109 and the pitch conversion channel 1117 are separated in the Y direction by the protrusion portion 1118. In other words, the second common liquid chamber 1109 and the pitch conversion channel 1117 are arranged side by side in the Y direction.

[0092] The second common liquid chamber 1109 opens onto the third surface 1103a of the second flow channel substrate 1103 and communicates with the first common liquid chamber 1108. On the other hand, the pitch conversion flow channel 1117 opens onto the third surface 1103a of the second flow channel substrate 1103 and communicates with the first common liquid chamber 1108, and opens onto the fourth surface 1103b and communicates with the outside of the liquid discharge substrate 1100. The connection between the first wall portion 1102c and the second wall portion 1103c is discontinuous, and at the connection between the first common liquid chamber 1108 and the second common liquid chamber 1109, the cross-sectional areas of the first common liquid chamber 1108 and the second common liquid chamber 1109 are different from each other. Similarly, at the connection between the first common liquid chamber 1108 and the pitch conversion flow channel 1117, the cross-sectional areas of the first common liquid chamber 1108 and the pitch conversion flow channel 1117 are different from each other. However, these cross-sectional areas may be the same as each other.

[0093] The protrusion 1118 is provided on the bottom surface of the second flow channel substrate 1103 and protrudes in a direction inclined with respect to the Z direction toward the first common liquid chamber 1108. The bottom surface of the second flow channel substrate 1103 constitutes the wall surface of the second common liquid chamber 1109. The protrusion 1118 constitutes the wall portion of the second common liquid chamber 1109 and the pitch conversion flow channel 1117. In other words, the protrusion 1118 can also be considered as part of the second wall portion 1103c of the second flow channel substrate 1103.

[0094] In the tenth embodiment, the second wall portion 1103c of the second channel substrate 1103 is configured such that the cross-sectional area of ​​the pitch conversion channel 1117 gradually increases as it moves away from the second common liquid chamber 1109, and then gradually decreases from a certain point. In other words, in cross-sections perpendicular to the X direction and cross-sections perpendicular to the Y direction, the cross-sectional shape of the pitch conversion channel 1117 is approximately hexagonal.

[0095] The second channel substrate 1103 according to the 10th embodiment can be manufactured by forming the second common liquid chamber 1109 and the pitch conversion channel 1117 by wet etching. The crystal plane orientation of the second channel substrate 1103 according to the 10th embodiment is <100> A silicon substrate is used. At this time, the taper angle of the wall surface of the second wall portion 1103c formed by wet etching is <111> The exposed portion is 54.7°. However, the configuration is not limited to this, and the pitch conversion channel 1117 can also be formed by dry etching, and the pitch conversion channel 1117 can be configured to extend linearly in the Z direction.

[0096] The provision of the protrusion 1118 suppresses stagnation of the liquid flow and prevents the occurrence of foam buildup and solute adhesion, similar to the fourth embodiment. In other words, the protrusion 1118 changes the liquid flow from laminar to turbulent during printing and the recovery sequence, stirring the liquid inside the liquid ejection substrate 1110 and improving the bubble discharge performance in the common channel.

[0097] Furthermore, in the tenth embodiment, since the second common liquid chamber 1109 and the pitch conversion channel 1117 are formed independently, the shape controllability of each is improved. Consequently, the desired shape can be formed more stably, and a more complex configuration can be adopted.

[0098] [Embodiment No. 11] The liquid discharge head 11 according to the 11th embodiment differs from that of the 10th embodiment in the configuration of the second common liquid chamber. Below, the differences between the configuration of the 11th embodiment and that of the 10th embodiment will be mainly described, and similar points will not be explained.

[0099] The liquid discharge substrate 1200 of the liquid discharge head 11 according to the 11th embodiment will be described with reference to Figures 12(a) to (c). Figure 12(a) is a schematic plan view of the liquid discharge surface 1200a of the liquid discharge substrate 1200 according to the 11th embodiment, viewed in the Z direction. Figure 12(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 12(a). Figure 12(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 12(a). Figures 12(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0100] (Configuration of the liquid discharge substrate in the 11th embodiment) The liquid discharge substrate 1200 has a laminated structure consisting of a nozzle layer 1201, a first flow channel substrate 1202, and a second flow channel substrate 1203. The liquid flow channels of the liquid discharge substrate 1200 consist of a nozzle 1205 of the nozzle layer 1201, individual supply ports 1207 and a first common liquid chamber 1208 of the first flow channel substrate 1202, a second common liquid chamber 1209 and a pitch conversion channel 1217 of the second flow channel substrate 1203.

[0101] The second common liquid chamber 1209 opens onto the third surface 1203a of the second flow channel substrate 1203 and communicates with the first common liquid chamber 1208. On the other hand, the pitch conversion flow channel 1217 opens onto the third surface 1203a of the second flow channel substrate 1203 and communicates with the first common liquid chamber 1208, and opens onto the fourth surface 1203b and communicates with the outside of the liquid discharge substrate 1200.

[0102] In the 11th embodiment, the second common liquid chamber 1209 is divided into multiple sections by the protrusions 1219. Alternatively, it can be said that multiple second common liquid chambers 1209 are arranged in the Y direction with the protrusions 1219 in between. In other words, the configuration of the 11th embodiment is similar to that of the 10th embodiment, but with the second common liquid chamber 1109 divided into multiple sections in the Y direction.

[0103] The wall portion constituting the second common liquid chamber 1209 includes a protrusion 1219 and a protrusion 1218 that separates the second common liquid chamber 1209 from the pitch conversion channel 1217. In other words, the protrusion 1218 can also be considered as part of the second wall portion 1203c of the second channel substrate 1203. The protrusion 1219, like the protrusion 1218, is provided on the bottom surface of the second channel substrate 1203 and protrudes in a direction inclined with respect to the Z direction toward the first common liquid chamber 1208.

[0104] With this configuration, the number of protrusions is greater compared to the 11th embodiment, further improving the effect of preventing liquid stagnation. Preferably, the protrusions 1219 are formed such that the opening width Wd in the Y direction at the end of the second common liquid chamber 1209 on the first common liquid chamber 1208 side is 2 mm or less.

[0105] When processing silicon substrates by wet etching, the misalignment between the crystal orientation of the silicon substrate and the orientation of the aperture pattern affects the aperture width dimension. The relationship between orientation misalignment and aperture width dimension is explained below. Figure 13 is an explanatory diagram of the relationship between orientation misalignment and aperture width dimension.

[0106] Figure 13 shows the opening OB formed when the azimuthal deviation is θ relative to the ideal opening OA. Opening OA is a rectangle with a long side width of HA and a short side width of WA, while opening OB is a rectangle with a long side width of HB and a short side width of WB. In Figure 13, the outline of opening OA is shown as a solid line and the interior as hatched, while the outline of opening OB is shown as a dotted line. Figure 13 also shows a diagram relating WA and WB.

[0107] As shown in Figure 13, WB / 2 can be calculated by the sum of (WA / 2)cosθ and {HA / 2-(2 / WA)tanθ}sinθ. That is, when 0°≦θ<45° and HA is sufficiently larger than WA, as HA increases, WB also increases, and the difference between WB and WA (WB-WA) also increases. Thus, when the longitudinal width of the opening is large, the amount of deviation in the short width of the opening due to azimuthal deviation tends to increase. Therefore, as in the 11th embodiment, by dividing the second common liquid chamber into multiple regions, it becomes possible to form the opening shape with high precision.

[0108] Next, an example of the configuration of the second channel substrate 1203 will be described. As an example, the second channel substrate 1203 of the 11th embodiment will be used. Figures 14(a) to (d) are explanatory diagrams of the configuration example of the second channel substrate 1203 according to the 11th embodiment. Figure 14(a) is a plan view of the first configuration example of the second channel substrate 1203 according to the 11th embodiment, viewed from the fourth surface 1203b side. Figure 14(b) is a schematic cross-sectional view of Figure 14(a) in the AA section perpendicular to the Y direction. Figure 14(c) is a plan view of the second configuration example of the second channel substrate 1203 according to the 11th embodiment, viewed from the fourth surface 1203b side. Figure 14(d) is a schematic cross-sectional view of Figure 14(c) in the AA section perpendicular to the Y direction.

[0109] The pitch conversion channel 1217 in the first configuration example is a decahedral space, including the opening faces (faces opening to the third face 1203a and the fourth face 1203b). Figures 14(a) and (b) show the vertices C and D of the decahedron of the pitch conversion channel 1217, and Figure 14(a) also shows the vertices E and F of the decahedron. When the pitch conversion channel is formed by wet etching, the etching stops when a crystal face with a slow etching rate is exposed. By wet etching, the pitch conversion channel 1217 penetrates the second channel substrate 1203, and etching continues until etching stops, forming a decahedral space like that in the first configuration example. At this time, all octahedrons where silicon is exposed <111> This is a surface. In this configuration, when pressure is applied from the surface (fourth surface 1203b) of the second channel substrate 1203, stress concentrates at the four vertices C, D, E, and F. Stress concentration may lead to substrate failure.

[0110] The pitch conversion channel 1217 in the second configuration example is a tetrahedron space, including the opening faces (faces opening to the third face 1203a and the fourth face 1203b). Figures 14(c) and (d) show the vertices G, H, I, J, K, L, M, and N of the tetrahedron of the pitch conversion channel 1217. The tetrahedron includes quadrilateral faces formed by vertices G, H, I, and J, and quadrilateral faces formed by vertices K, L, M, and N. By stopping the etching before vertices C, D, E, and F of the first configuration example are exposed, <100> The pitch conversion channel 1217 can be configured such that the quadrilateral faces GHIJ and KLMN remain. This configuration makes it difficult for stress to concentrate at the vertices. Therefore, from the viewpoint of maintaining substrate strength and suppressing damage, it is preferable to configure it as in the second example. However, the pitch conversion channel 1217 does not necessarily have to be configured as a tetrahedron; any polyhedron that suppresses the concentration of stress at the vertices, preferably a polyhedron composed of 14 or more faces, is acceptable.

[0111] [Twelfth Embodiment] The liquid discharge head 11 according to the 12th embodiment has a different flow path shape for the second flow path substrate compared to the 9th embodiment. The following describes the differences between the configuration of the 12th embodiment and the configuration of the 9th embodiment. This section will primarily explain the points mentioned above, and similar points will be omitted from the explanation.

[0112] The liquid discharge substrate 1500 of the liquid discharge head 11 according to the 12th embodiment will be described with reference to Figures 15(a) to (c). Figure 15(a) is a schematic plan view of the liquid discharge surface 1500a of the liquid discharge substrate 1500 according to the 12th embodiment, viewed in the Z direction. Figure 15(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 15(a). Figure 15(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 15(a). Figures 15(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0113] (Configuration of the liquid discharge substrate in the 12th embodiment) The liquid discharge substrate 1500 has a laminated structure consisting of a nozzle layer 1501, a first channel substrate 1502, and a second channel substrate 1503. The liquid channels of the liquid discharge substrate 1500 consist of a nozzle 1505 of the nozzle layer 1501, individual supply ports 1507 and a first common liquid chamber 1508 of the first channel substrate 1502, a second common liquid chamber 1509 and a pitch conversion channel 1517 of the second channel substrate 1503.

[0114] In the twelfth embodiment, the second common liquid chamber 1509 has a polygonal cross-sectional shape of pentagons or more in the AA cross-section. The cross-sectional shape in the AA cross-section is configured such that at the end furthest from the first common liquid chamber 1508 in the Z direction (substrate thickness direction), opposing sides (faces) form an acute angle. Furthermore, the cross-sectional shape in the AA cross-section is configured to include a portion in which the width in the X direction is greater than that of the first common liquid chamber 1508, so that the volume of the second common liquid chamber 1509 increases. In other words, at the end of the second common liquid chamber 1509, the second wall portion 1503c is tapered so that the side wall has an angle with respect to the Z direction.

[0115] In particular, during the initial stages of high-frequency printing, print irregularities can occur due to a momentary shortage of refill material at the start of continuous ejection. This is influenced by an increase in the inertance of the flow path, which corresponds to the coefficient of inertia when attempting to push the liquid through the flow path at a unit pressure. The inertance of the flow path is proportional to the fluid density and the length of the flow path, and inversely proportional to the cross-sectional area of ​​the flow path. Therefore, by increasing the cross-sectional area of ​​the second common liquid chamber, the inertance can be reduced, and print irregularities can be suppressed. This print irregularity is a problem that occurs regardless of the flow path configuration, and in a circulating flow path configuration, it is more likely to occur because the cross-sectional area of ​​the common liquid chamber decreases due to the formation of a separation wall, or because the individual supply ports become smaller. Therefore, the formation of a second common liquid chamber with an increased cross-sectional area, as in the 12th embodiment, is particularly suitable for a liquid-circulating type liquid ejection head.

[0116] Furthermore, the side walls of the second common liquid chamber 1509 are tapered, and the angle between opposing side walls at the end furthest from the nozzle 1505 is acute. With this configuration, air bubbles mixed into the liquid chamber tend to accumulate at the tip of the second common liquid chamber 1509 furthest from the nozzle 1505, thereby reducing the discharge effect of air bubbles. The air bubbles accumulated at the tip also act as dampers, improving the discharge function. In addition, the second common liquid chamber 1509 is partially connected to the pitch conversion channel 1517 in the longitudinal direction (Y direction), and the accumulated air bubbles escape to the outside of the liquid discharge substrate 1500 through the pitch conversion channel 1517.

[0117] Figure 15(b) shows an example where the cross-sectional shape of the second common liquid chamber 1509, including the opening, is octagonal. However, the configuration is not limited to this, and other polygonal shapes are also acceptable. Furthermore, the cross-sectional shapes of the second common liquid chamber 1509 and the pitch conversion channel 1517 are not limited to strictly polygonal shapes composed only of straight lines, but may include curved shapes resulting from the formation method.

[0118] Referring to Figure 16, the relationship between the first common liquid chamber 1508 and the second common liquid chamber 1509 is as follows: Let me explain in more detail. Figure 16 is an explanatory diagram showing the relationship between the first common liquid chamber 1508 and the second common liquid chamber 1509, and is a schematic cross-sectional view in the AA section perpendicular to the Y direction in Figure 15(a).

[0119] The first wall portion 1502c of the first flow channel substrate 1502 includes a first separation wall 1502d that separates two adjacent first common liquid chambers 1508 in the X direction. The first separation wall 1502d is formed in a columnar shape that extends linearly in the Z direction, and its width V1 in the X direction is constant in the Z direction. Similarly, the opening width W1 of the first common liquid chamber 1508 in the X direction is also constant in the Z direction.

[0120] The second wall portion 1503c of the second flow channel substrate 1503 includes a second separation wall 1503d that separates two adjacent second common liquid chambers 1509 in the X direction. The second separation wall 1503d is formed in a columnar shape, with a width in the X direction that changes in the Z direction. The width of the second separation wall 1503d in the X direction is V2, which is greater than the width V1 at the end portion including the third surface 1503a, which is the bonding surface to the first flow channel substrate 1502. In other words, at the connection portion between the first flow channel substrate 1502 and the second flow channel substrate 1503, the width V1 of the first separation wall 1502d is smaller than the width V2 of the second separation wall 1503d. Then, as you move away from the first flow channel substrate 1502 (as you move from the third surface 1503a towards the fourth surface 1503b), the width of the second separation wall 1503d in the X direction gradually decreases to a width V3, which is smaller than the width V1. Width V3 is the minimum width of the second separation wall 1503d. The second separation wall 1503d includes a vertical wall that extends linearly in the Z direction with a width of V3. Subsequently, as it moves away from the first flow channel substrate 1502, the width of the second separation wall 1503d in the X direction gradually increases from width V3. In other words, the second separation wall 1503d has a constriction with a width of V3.

[0121] The opening width of the second common liquid chamber 1509 in the X direction is W2, which is smaller than the opening width W1 at the end on the third surface 1503a side. In other words, at the connection point between the first common liquid chamber 1508 and the second common liquid chamber 1509, the opening width W2 of the second common liquid chamber 1509 is smaller than the opening width W1 of the first common liquid chamber 1508. Then, as you move away from the first common liquid chamber 1508 (first flow channel substrate 1502), the opening width of the second common liquid chamber 1509 in the X direction gradually increases, becoming an opening width W3, which is larger than the opening width W1. The opening width W3 is the maximum opening width of the second common liquid chamber 1509. After that, as you move away from the first common liquid chamber 1508, the opening width of the second common liquid chamber 1509 in the X direction gradually decreases from the opening width W3.

[0122] Thus, in the twelfth embodiment, the width W1 of the first common liquid chamber 1508 is made larger than the width W2 of the second common liquid chamber 1509, and the width V2 of the adhesive surface side of the second separation wall 1503d is made larger than the width V1 of the first separation wall 1502d. With this configuration, when joining the first flow channel substrate 1502 and the second flow channel substrate 1503, sufficient bonding area can be secured even if the substrates are joined while shifted from their ideal positions, and bonding strength can be maintained. In addition, since the width V2 of the second separation wall 1503d is larger than the width V1 of the first separation wall 1502d, the area of ​​the third surface 1503a of the second flow channel substrate 1503 is larger than the area of ​​the second surface 1502b of the first flow channel substrate 1502. With this configuration, when joining the substrates, the adhesive 1515 is prevented from creeping up to the second flow channel substrate 1503 side and overflowing outside the substrate. To obtain these effects, it is preferable that the width V2 of the second separation wall 1503d be 10 μm or more larger than the width V1 of the first separation wall 1502d.

[0123] Furthermore, to increase the cross-sectional area and volume of the second common liquid chamber 1509, the wider the opening width W3 of the second common liquid chamber 1509 is in the X direction, the narrower the width V3 of the constricted portion of the second separation wall 1503d becomes. If the width V3 of the constricted portion becomes too small, there is a concern that the second separation wall 1503d may be damaged, so it is preferable that the width V3 of the constricted portion be 15 μm or more.

[0124] Furthermore, the maximum depth Dp of the second common liquid chamber 1509 is set to be more than half the thickness (width in the Z direction) of the second flow channel substrate 1503 in order to further increase the volume of the second common liquid chamber 1509. It is preferable.

[0125] According to the configuration of the 12th embodiment, the volume of the second common liquid chamber 1509 can be increased while maintaining adhesive strength and suppressing adhesive overflow. Therefore, it becomes possible to improve the functionality of the liquid discharge head, such as improving the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles.

[0126] [13th Embodiment] The liquid discharge head 11 according to the 13th embodiment differs from that of the 12th embodiment in the configuration of the second flow channel substrate. Below, the differences between the configuration of the 13th embodiment and that of the 12th embodiment will be mainly described, and similar points will not be explained.

[0127] The liquid discharge substrate 1700 of the liquid discharge head 11 according to the 13th embodiment will be described with reference to Figures 17(a) to (c). Figure 17(a) is a schematic plan view of the liquid discharge surface 1700a of the liquid discharge substrate 1700 according to the 13th embodiment, viewed in the Z direction. Figure 17(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 17(a). Figure 17(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 17(a). Figures 17(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0128] (Configuration of the liquid dispensing substrate in the 13th embodiment) The liquid discharge substrate 1700 has a laminated structure consisting of a nozzle layer 1701, a first channel substrate 1702, and a second channel substrate 1703. The liquid channels of the liquid discharge substrate 1700 consist of a nozzle 1705 of the nozzle layer 1701, individual supply ports 1707 and a first common liquid chamber 1708 of the first channel substrate 1702, a second common liquid chamber 1709 and a pitch conversion channel 1717 of the second channel substrate 1703.

[0129] The width in the X direction of the second separation wall 1703d, which is part of the second wall portion 1703c, is V2, which is greater than the width V1 at the end containing the third surface 1703a, which is the adhesion surface to the first flow channel substrate 1702. Then, as it moves away from the first flow channel substrate 1702, the width in the X direction of the second separation wall 1703d gradually decreases, and then gradually increases to a width V3, which is greater than the widths V1 and V2. The second separation wall 1703d includes a vertical wall that extends linearly in the Z direction with a width V3. Subsequently, as it moves away from the first flow channel substrate 1702, the width in the X direction of the second separation wall 1703d gradually increases from the width V3.

[0130] The opening width in the X direction of the second common liquid chamber 1709 is W2, which is smaller than the opening width W1 at the end on the third surface 1703a side. Then, as you move away from the first common liquid chamber 1708 (first flow channel substrate 1702), the opening width in the X direction of the second common liquid chamber 1709 gradually increases, then gradually decreases to an opening width W3, which is smaller than the opening widths W1 and W2. After that, as you move away from the first common liquid chamber 1708, the opening width in the X direction of the second common liquid chamber 1709 gradually decreases from the opening width W3.

[0131] Thus, by increasing the width V3 of the second separation wall 1703d, the mechanical strength of the separation wall is improved. Therefore, the configuration of the 13th embodiment is suitable when it is desired to make the second flow channel substrate and liquid discharge substrate smaller, i.e., when chip shrinking is desired.

[0132] [14th Embodiment] The liquid discharge head 11 according to the 14th embodiment differs from that of the 12th embodiment in the configuration of the second flow channel substrate. Below, the differences between the configuration of the 14th embodiment and that of the 12th embodiment will be mainly described, and similar points will not be explained.

[0133] The liquid discharge substrate 1800 of the liquid discharge head 11 according to the 14th embodiment will be described with reference to Figures 18(a) to (c). Figure 18(a) is a schematic plan view of the liquid discharge surface 1800a of the liquid discharge substrate 1800 according to the 14th embodiment, viewed in the Z direction. Figure 18(b) is a schematic cross-sectional view of the AA section perpendicular to the Y direction of Figure 18(a). Figure 18(c) is a schematic cross-sectional view of the BB section perpendicular to the X direction of Figure 18(a). Figures 18(b) and (c) show the liquid flow paths in the liquid discharge head 11, respectively.

[0134] (Configuration of the liquid discharge substrate in the 14th embodiment) The liquid discharge substrate 1800 has a laminated structure consisting of a nozzle layer 1801, a first channel substrate 1802, and a second channel substrate 1803. The liquid channels of the liquid discharge substrate 1800 consist of a nozzle 1805 of the nozzle layer 1801, individual supply ports 1807 and a first common liquid chamber 1808 of the first channel substrate 1802, a second common liquid chamber 1809 and a pitch conversion channel 1817 of the second channel substrate 1803.

[0135] In the 14th embodiment, the second wall portion 1803c that constitutes the second common liquid chamber 1809 and the pitch conversion channel 1817 has exposed silicon. <111> It is composed of a tapered shape formed by a surface. In other words, the side walls that constitute the second common liquid chamber 1809 and the pitch conversion channel 1817 are <111> The surface is exposed and inclined with respect to the Z direction. Furthermore, the maximum width of the second common liquid chamber 1809 in the X direction is greater than the maximum width of the first common liquid chamber 1808 in the X direction. With this configuration, the cross-sectional area of ​​the second common liquid chamber 1809 can be increased, thereby suppressing printing irregularities. Moreover, since the flow channel shape is determined by the crystal orientation of the silicon constituting the substrate, the second common liquid chamber and the pitch conversion flow channel can be manufactured with good processing accuracy.

[0136] Also, <111> The surface has high ink solubility. Therefore, <111> By exposing the surface, a highly reliable liquid dispensing head can be manufactured without the need to form a silicone protective film to prevent the silicone from dissolving from the ink.

[0137] The configurations of each of the above embodiments can be combined as appropriate. For example, the configuration of the third embodiment may be provided with a protrusion similar to that of the fourth embodiment. Also, for example, the configuration of the fifth embodiment may be provided with a filter similar to that of the sixth embodiment.

[0138] [First Embodiment] A specific manufacturing method for the liquid ejection substrate will be explained using an example. First, the first embodiment will be described with reference to Figures 19(a) to (c) and Figure 20. In the following, the differences between the configuration of the first embodiment and the configuration of the seventh embodiment will be mainly explained, and similar points will be omitted from the explanation.

[0139] Figure 19(a) is a schematic cross-sectional view of the liquid discharge substrate 1900 according to the first embodiment, viewed in a cross-section perpendicular to the Y direction. Figure 19(b) is a schematic cross-sectional view of the liquid discharge substrate 1900, viewed in a cross-section perpendicular to the X direction. Figure 19(c) is a schematic cross-sectional view of the liquid discharge substrate 1900 as seen in each cross-section shown in Figure 19(a). Note that in Figures 19(a) to (c), only a portion of the liquid discharge substrate 1900 is shown for simplification.

[0140] The liquid discharge substrate 1900 has a laminated structure composed of a nozzle layer 1901, a first channel substrate 1902, and a second channel substrate 1903. The liquid channels of the liquid discharge substrate 1900 are composed of nozzles 1905 of the nozzle layer 1901, individual supply ports 1907 and a first common liquid chamber 1908 of the first channel substrate 1902, a second common liquid chamber 1909 and a pitch conversion channel 1919 of the second channel substrate 1903. An electrothermal conversion element 1906 is provided on the first channel substrate 1902. In addition, inside the second common liquid chamber 1909, from the bottom surface of the second channel substrate 1903 to the first common Multiple protrusions 1911 are provided, extending in the Z direction toward the liquid chamber 1908.

[0141] Surface SA shown in Figure 19(a) is the nozzle-forming surface on which the nozzle 1905 of the nozzle layer 1901 is opened. Surface SB is the first surface 1902a on which the individual supply port 1907 of the first flow channel substrate 1902 is opened. Surface SC is the second surface 1902b on which the first common liquid chamber 1908 of the first flow channel substrate 1902 is opened. Surface SD is the third surface 1903a on which the second common liquid chamber 1909 of the second flow channel substrate 1903 is opened. Surface SE is the fourth surface 1903b on which the pitch conversion flow channel 1919 of the second flow channel substrate 1903 is opened.

[0142] Figure 20 is an explanatory diagram of the manufacturing method of the liquid discharge substrate 1900 of the first embodiment. The manufacturing method of the liquid discharge substrate 1900 will be explained in reference to Figure 20. First, the manufacturing method of the first channel substrate 1902 will be explained. For the first channel substrate 1902, a silicon substrate 2001 with a thickness of 625 μm having an electrothermal conversion element 1906 was used.

[0143] First, as the first mask fabrication step, a photoresist was applied to a thickness of 15 μm to the side 2002 of the silicon substrate 2001 opposite to the side on which the electrothermal conversion element 1906 was provided (the side that becomes the second surface 1902b of the first channel substrate 1902). Then, a photoresist mask 2003 was fabricated by irradiating the photoresist with UV light and developing it. At this time, the mask pattern (aperture pattern) of the photoresist mask 2003 for forming the first common liquid chamber 1908 was a rectangular shape with a length of 20,000 μm in the Y direction and a length of 200 μm in the X direction, and the pitch between common liquid chambers was 200 μm.

[0144] Next, as the first etching step, dry etching was performed by alternately forming a protective film using gas C4F8 and silicon etching using gas SF6. Silicon etching was performed from the surface 2002 side of the silicon substrate 2001 through the photoresist mask 2003 until a depth of 500 μm was reached. Next, as the first mask removal step, the photoresist mask 2003 was removed by ashing with O2. The first mask fabrication step, the first etching step, and the first mask removal step formed a space 2004 in the silicon substrate 2001 that would become the first common liquid chamber 1908. These first mask fabrication step, first etching step, and first mask removal step were combined to form the first channel formation step (first common liquid chamber formation step).

[0145] Next, as a second mask fabrication step, a photoresist was applied to the surface 2005 of the silicon substrate 2001 on which the electrothermal conversion element 1906 was provided (the surface that becomes the first surface 1902a of the first channel substrate 1902) to a thickness of 15 μm. Then, the photoresist mask 2006 was fabricated by irradiating the photoresist with UV light and developing it. At this time, the mask pattern of the photoresist mask 2006 for forming the individual supply ports 1907 was a square shape with a length of 50 μm in the Y direction and a length of 50 μm in the X direction, and the pitch between the individual supply ports was 50 μm.

[0146] Next, as a second etching step, silicon etching was performed from the surface 2005 side of the silicon substrate 2001 through the photoresist mask 2006 until it communicated with space 2004, using dry etching similar to the first etching step. Subsequently, as a second mask removal step, the photoresist mask 2006 was removed in the same manner as the first mask removal step. The second mask fabrication step, second etching step, and second mask removal step formed space 2007, which will become the second common liquid chamber 1909, in the silicon substrate 2001. These second mask fabrication step, second etching step, and second mask removal step are collectively referred to as the second channel formation step (individual supply port formation step). In this example, the individual supply port 1907 has a depth of 125 μm.

[0147] The first channel substrate 1902 is obtained by the first channel formation step and the second channel formation step described above. In the first channel substrate 1902, the depth (length in the Z direction) of the first common liquid chamber 1908 is 500 μm, and the depth of the individual supply port 1907 is 125 μm.

[0148] The manufacturing method for the second channel substrate 1903 will now be described. A silicon substrate 2009 with a thickness of 400 μm was used for the second channel substrate 1903.

[0149] First, as the third mask fabrication step, a photoresist was coated to a thickness of 15 μm onto surface 2010 of the silicon substrate 2009 (the surface that will become the third surface 1903a of the second channel substrate 1903). Then, a photoresist mask 2011 was fabricated by irradiating the photoresist with UV light and developing it. At this time, the mask pattern of the photoresist mask 2011 for forming the second common liquid chamber 1909 was a rectangular shape with a length of 21,000 μm in the Y direction and a length of 190 μm in the X direction. Furthermore, the mask pattern was designed so that a convex portion 1911 with a width of 3,000 μm in the Y direction and a width of 190 μm in the X direction was provided in the middle part (between one end and the other in the Y direction). The pitch in the X direction between the common liquid chambers was 200 μm.

[0150] Next, as the third etching step, dry etching was performed by alternating between protective film formation using gas C4F8 and silicon etching using gas SF6. Silicon etching was performed from the surface 2010 side of the silicon substrate 2009 through the photoresist mask 2011 until a depth of 300 μm was reached. Next, as the third mask removal step, the photoresist mask 2011 was removed by ashing with O2. The third mask fabrication step, the third etching step, and the third mask removal step formed a space 2012 in the silicon substrate 2009 that would become the second common liquid chamber 1909. These third mask fabrication step, third etching step, and third mask removal step were combined to form the third channel formation step (second common liquid chamber formation step).

[0151] Next, as the fourth mask fabrication step, a photoresist was applied to a thickness of 15 μm to the surface 2013 of the silicon substrate 2009 opposite to surface 2010 (the surface that will become the fourth surface 1903b of the second channel substrate 1903). Then, a photoresist mask 2014 was fabricated by irradiating the photoresist with UV light and developing it. At this time, the mask pattern of the photoresist mask 2014 for forming the pitch conversion channel 1917 was a square shape with a length of 170 μm in the Y direction and a length of 170 μm in the X direction, and the Y direction pitch between the pitch conversion channels was set to 9000 μm.

[0152] Next, as the fourth etching step, silicon etching was performed from the surface 2013 side of the silicon substrate 2009 through the photoresist mask 2014 until it communicated with space 2012, using dry etching similar to the third etching step. Subsequently, as the fourth mask removal step, the photoresist mask 2014 was removed in the same manner as the third mask removal step. The fourth mask fabrication step, the fourth etching step, and the fourth mask removal step formed space 2015 in the silicon substrate 2009, which would become the pitch conversion channel 1917. These fourth mask fabrication step, fourth etching step, and fourth mask removal step are collectively referred to as the fourth channel formation step (pitch conversion channel formation step). In this example, the pitch conversion channel 1917 has a depth of 100 μm.

[0153] The second channel substrate 1903 is obtained through the third channel formation step and the fourth channel formation step described above. In the second channel substrate 1903, the depth (length in the Z direction) of the second common liquid chamber 1909 is 300 μm, and the depth of the pitch conversion channel 1917 is 100 μm.

[0154] Next, in the substrate bonding process, surface 2002 (second surface 1902b) of the first channel substrate 1902 and surface 2013 (third surface 1903a) of the second channel substrate 1903 were bonded together by heating and pressurizing using an epoxy resin adhesive 2017. This substrate bonding process yields a channel substrate 2018 in which the first channel substrate 1902 and the second channel substrate 1903 are bonded together.

[0155] Finally, as a nozzle formation step, a photosensitive epoxy resin film was laminated onto surface 2005 (first surface 1902a) of the first channel substrate 1902, and then exposed and developed. Through this nozzle formation step, a nozzle layer 1901 including the liquid discharge port 2019 (nozzle 1905) was formed. Thus, the liquid ejection substrate 1900 is completed. At this point, the depth of the common liquid chamber of the liquid ejection substrate 1900 is the sum of the depth of the first common liquid chamber 1908 (500 μm) and the depth of the second common liquid chamber 1909 (300 μm), which is 800 μm.

[0156] By the above manufacturing method, a liquid discharge substrate can be obtained in which the common liquid chamber is composed of a first common liquid chamber of the first flow channel substrate and a second common liquid chamber of the second flow channel substrate. Therefore, by this manufacturing method, a liquid discharge substrate can be produced that has the function of improving the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles. In order to obtain such effects by increasing the volume of the common liquid chamber, it is preferable that the depth of the common liquid chamber be 600 μm or more. In addition, since a protrusion 1911 can be formed inside the second common liquid chamber, stagnation of the liquid flow can be suppressed and foam accumulation and solute adhesion can be prevented.

[0157] [Second Example] The second embodiment will be described with reference to Figure 21. The second embodiment differs from the first embodiment in that the second common channel and the pitch conversion channel are formed by wet etching instead of dry etching. Below, the manufacturing method of the liquid discharge substrate according to the second embodiment will be described mainly in terms of the differences from the first embodiment, and similar points will be omitted from the explanation.

[0158] The liquid discharge substrate 2100 according to the second embodiment has a laminated structure composed of a nozzle layer 2101, a first flow channel substrate 2102, and a second flow channel substrate 2103. The liquid flow channels of the liquid discharge substrate 2100 are composed of a nozzle 2105 of the nozzle layer 2101, individual supply ports 2107 and a first common liquid chamber 2108 of the first flow channel substrate 2102, a second common liquid chamber 2109 and a pitch conversion flow channel 2117 of the second flow channel substrate 2103.

[0159] Figure 21 is an explanatory diagram of the manufacturing method of the liquid discharge substrate 2100 of the second embodiment. The manufacturing method of the liquid discharge substrate 2100 will be described in reference to Figure 21. The flow path configuration of the second embodiment is the same as that of the 11th embodiment shown in Figures 12(a) to (c).

[0160] In the second embodiment, the first channel substrate 2102 is formed in the same manner as in the first embodiment. The manufacturing method of the second channel substrate 2103 according to the second embodiment will be described below. A silicon substrate 2150 with a thickness of 400 μm was used for the second channel substrate 2103. A thermal oxide film 2151 with a thickness of 500 nm is formed on the surface of the silicon substrate 2150.

[0161] First, as the third mask fabrication step, a photoresist was coated to a thickness of 15 μm on both sides of the silicon substrate 2150. Then, by irradiating the photoresist with UV light and developing it, a photoresist mask 2152 for the second common liquid chamber was fabricated on one side, and a photoresist mask 2153 for the pitch conversion channel (connecting channel) was fabricated on the other side. The mask pattern for the second common liquid chamber was a rectangle with a length of 2000 μm in the Y direction and a length of 200 μm in the X direction. The mask pattern for the pitch conversion channel was a rectangle with a length of 1000 μm in the Y direction and a length of 200 μm in the X direction.

[0162] Next, as the first patterning step, wet etching was performed with buffered hydrofluoric acid for a predetermined time until the silicon was exposed, and the thermal oxide film patterning was carried out. In addition, as the third mask removal step, the photoresist masks 2152 and 2153 were removed by wet treatment with a resist stripping solution.

[0163] Next, as a hole formation step, a lead hole 2154 was formed within the mask pattern (within the opening pattern) for the pitch conversion channel on the side of the second common liquid chamber 2109 of the second channel substrate 2103 where the opening is located. The lead hole 2154 is a hole with the Z direction as the depth direction. The lead hole 2154 was formed using a laser so that the pitch conversion channel penetrates through the silicon by wet etching. The lead holes 2154 were machined with a pitch of 100 μm intervals and the number of shots was adjusted to achieve a depth of 350 μm.

[0164] Next, as a third etching step, the silicon substrate 2150 was immersed in an aqueous solution of tetramethylammonium hydroxide (85°C, 20 wt%) for 300 minutes to perform crystalline anisotropic etching. This etching process forms a space 2155 which becomes the second common liquid chamber 2109 and a space 2156 which becomes the pitch conversion channel 2117 within the silicon substrate 2150. At this time, the angle of the side walls of spaces 2155 and 2156 is a tapered shape of 54.7°. In this example, the processing time is the processing time for the pitch conversion channel 2117 to be formed in a tetrahedron space.

[0165] Next, as a thermal oxide film removal step, the thermal oxide film 2151, which has formed into an overhang shape due to the recession of the silicon opening pattern by crystalline anisotropic etching, is removed by immersion in buffered hydrofluoric acid. At this time, the thermal oxide film may be completely removed. These third mask fabrication step, third mask removal step, hole formation step, third etching step, and thermal oxide film removal step are combined to form the third channel formation step (second common liquid chamber and pitch conversion channel formation step).

[0166] The second channel substrate 2103 is obtained by the third channel formation step described above. The subsequent substrate bonding step and nozzle formation step are the same as in the first embodiment.

[0167] By forming a second common liquid chamber using the above manufacturing method, a liquid discharge substrate is obtained that has the function of improving the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles. Furthermore, the side walls constituting the flow path of the second flow channel substrate include multiple inclined surfaces (tapered shapes), making it possible to manufacture a liquid discharge substrate that suppresses stagnation of liquid flow and prevents foam buildup and solute adhesion.

[0168] [Third Embodiment] Referring to Figure 22, the third embodiment will be described. The third embodiment differs from the second embodiment in that the second common channel and the pitch conversion channel are formed by wet etching and laser. Below, the method for manufacturing a liquid ejection substrate according to the second embodiment will be described mainly in terms of the differences from the second embodiment, and similar points will be omitted from the explanation.

[0169] The liquid discharge substrate 2200 according to the third embodiment has a laminated structure composed of a nozzle layer 2201, a first flow channel substrate 2202, and a second flow channel substrate 2203. The liquid flow channels of the liquid discharge substrate 2200 are composed of a nozzle 2205 of the nozzle layer 2201, individual supply ports 2207 and a first common liquid chamber 2208 of the first flow channel substrate 2202, a second common liquid chamber 2209 and a pitch conversion flow channel 2217 of the second flow channel substrate 2203.

[0170] Figure 22 is an explanatory diagram of the manufacturing method of the liquid discharge substrate 2200 of the third embodiment. The manufacturing method of the liquid discharge substrate 2200 will be described in reference to Figure 22. The flow path configuration of the third embodiment is the same as that of the twelfth embodiment shown in Figures 15(a) to (c).

[0171] In the third embodiment, the first channel substrate 2202 is formed in the same manner as in the first and second embodiments. The manufacturing method of the second channel substrate 2203 according to the third embodiment will be described below. A silicon substrate 2250 with a thickness of 400 μm was used for the second channel substrate 2203. A thermal oxide film 2251 with a thickness of 500 nm is formed on the surface of the silicon substrate 2250.

[0172] First, as the first laser processing step, the crystal plane orientation <100> An opening 2253 for the pitch conversion channel 2217 was formed on one side 2252 of the silicon substrate 2250 (the side that will become the fourth side 2203b of the second channel substrate 2203) using a laser. At this time, line processing was performed to form a frame-shaped opening 2253. This processing was followed by wet etching to form the opening 22 This is an opening patterning process to connect section 53, which serves as the pitch conversion channel 2217, to the second common liquid chamber 2209. Therefore, this process is not performed on sections that are not to be opened as the pitch conversion channel 2217. In the wire processing, the thermal oxide film and silicon were processed, and the laser frequency and movement speed were adjusted to create a groove with a depth of 20 μm. At this time, the opening pattern of the pitch conversion channel 2217 was set to a rectangular shape with a length of 1000 μm in the Y direction and a length of 160 μm in the X direction.

[0173] Next, as a second laser processing step, an opening 2255 for the second common liquid chamber 2209 was formed using a laser on the surface 2254 of the silicon substrate 2250 opposite to surface 2252 (the surface that will become the third surface 2203a of the second channel substrate 2203). At this time, the opening pattern was formed by line processing, similar to the first laser processing step. The opening pattern of the second common liquid chamber 2209 was a rectangular shape with a length of 30,000 μm in the Y direction and a length of 160 μm in the X direction. Note that the opening patterning of the second common liquid chamber 2209 and the pitch conversion channel 2217 can also be performed by resist patterning and thermal oxide film etching using photolithography, similar to the second embodiment. Line processing can also be performed by dry etching.

[0174] Next, as a hole formation process (third laser processing process), a lead hole 2256 was formed using a laser within the pattern for the second common liquid chamber 2209, so that the pitch conversion channel 2217 would penetrate through it by wet etching of silicon. The lead hole 2256 is a hole with the Z direction as the depth direction. The lead hole 2256 was processed by adjusting the number of shots so that it had a pitch of 100 μm intervals and a depth of 300 μm. In this example, the laser processing of the opening pattern for the second common liquid chamber 2209 (opening 2255) and the lead hole 2256 was performed after aligning and positioning them so that the patterns matched the opening pattern for the pitch conversion channel 2217 (opening 2253) that had been processed earlier. The lead hole 2256 can also be formed by patterning and dry etching using photolithography.

[0175] Next, as a third etching step, the silicon substrate 2250 was immersed in an aqueous solution of tetramethylammonium hydroxide (85°C, 20 wt%) for 90 minutes to perform crystalline anisotropic etching. This third etching step formed a space 2257, which would become the second common liquid chamber 2209, and a space 2258, which would become the pitch conversion channel 2217, inside the silicon substrate 2250. The processing time in this example is the time required for the opening width inside the second common liquid chamber 2209 to become a heptagonal shape, wider than the opening width of the opening surface. Furthermore, by shortening this immersion time, for example to 45 minutes, it is possible to form a second common liquid chamber and pitch conversion channel as in the 13th embodiment shown in Figures 17(b) and (c). Conversely, by lengthening the immersion time, for example to 420 minutes, it is possible to form a second common liquid chamber and pitch conversion channel across the entire side wall as in the 14th embodiment shown in Figures 18(b) and (c). <111> A second common liquid chamber with an exposed surface and a pitch conversion channel can be formed.

[0176] In addition to forming the pitch conversion channel using laser line processing and wet etching, the opening pattern of the pitch conversion channel can also be patterned using photolithography and then penetrated by dry etching.

[0177] Next, as a thermal oxide film removal step, the thermal oxide film 2251, which has formed into an overhang shape due to the recession of the silicon opening pattern portion by crystalline anisotropic etching, is removed by immersion in buffered hydrofluoric acid. At this time, the entire thermal oxide film may be removed. After forming the pitch conversion channel and the second common liquid chamber, a silicon protective film may be formed to prevent the exposed silicon in the liquid channel of the second channel substrate from dissolving from the ink. These first laser processing step, second laser processing step, hole formation step, third etching step, and thermal oxide film removal step are combined into a third channel formation step (second common liquid chamber and pitch conversion channel formation step).

[0178] The second channel substrate 2203 is obtained by the third channel formation step described above. The subsequent substrate bonding step and nozzle formation step are the same as in the first embodiment.

[0179] By forming a second common liquid chamber using the above manufacturing method, a liquid discharge substrate is obtained that has the function of improving the efficiency of liquid replenishment to the nozzle and preventing crosstalk with adjacent nozzles. Furthermore, a liquid discharge substrate can be manufactured in which the side walls constituting the flow channel of the second flow channel substrate include multiple inclined surfaces (tapered shape), and have the function of trapping air bubbles at the tip furthest from the nozzle and discharging them from the pitch conversion flow channel.

[0180] This embodiment includes the following configurations and methods. (Composition 1) A liquid discharge substrate used in a liquid discharge head, wherein a liquid flow path is formed inside the substrate, including a nozzle, individual flow paths communicating with the nozzle, and a common liquid chamber communicating with the individual flow paths, A nozzle forming member having a liquid discharge surface through which the nozzle is open, A first channel substrate having a first surface on which the nozzle forming member is provided, a second surface opposite to the first surface, and a first wall portion that constitutes the wall portion of the individual channel and the common liquid chamber, A second flow channel substrate having a third surface joined to the second surface of the first flow channel substrate in a first direction, and a second wall portion that constitutes the wall portion of the common liquid chamber, Equipped with, The liquid discharge substrate is characterized in that the second wall portion includes a portion whose cross-sectional area in a cross-section perpendicular to the first direction is different from that of the first wall portion. (Configuration 2) When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The connection between the first common liquid chamber and the second common liquid chamber is characterized in that the cross-sectional areas of the sections perpendicular to the first direction of the first common liquid chamber and the second common liquid chamber are different from each other. Liquid dispensing substrate as described in Configuration 1. (Composition 3) At least one of the first wall portion and the second wall portion includes a tapered surface inclined with respect to the first direction, A liquid discharge substrate as described in configuration 1 or 2. (Composition 4) When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The second common liquid chamber is characterized by having a protrusion that extends from a surface facing the same direction as the third surface toward the first flow channel substrate along the first direction, A liquid dispensing substrate as described in any one of configurations 1 to 3. (Composition 5) The second channel substrate has a fourth surface opposite to the third surface, The present invention further comprises a third channel substrate having a fifth surface bonded to the fourth surface of the second channel substrate and a third wall portion that constitutes the wall portion of the common liquid chamber, A liquid discharge substrate as described in any one of configurations 1 to 4. (Composition 6) When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The invention further comprises a filter provided at the connection between the first common liquid chamber and the second common liquid chamber, A liquid discharge substrate as described in any one of configurations 1 to 5. (Composition 7) The liquid channel further includes a connecting channel that communicates with the common liquid chamber, The second channel substrate is further characterized by comprising a connecting channel forming member connected to a fourth surface opposite to the third surface, and having the connecting channel formed inside it, A liquid discharge substrate as described in any one of configurations 1 to 6. (Composition 8) The liquid channel further includes a connecting channel that communicates with the common liquid chamber, The second wall portion is characterized in that it constitutes the wall portion of the connecting channel. A liquid dispensing substrate as described in any one of configurations 1 to 7. (Composition 9) The portion of the second wall that constitutes the wall of the connecting channel is characterized in that it includes a tapered surface inclined with respect to the first direction. Liquid dispensing substrate as described in configuration 8. (Composition 10) When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The connecting channel and the second common liquid chamber are not directly connected, but are formed independently of each other. A liquid dispensing substrate as described in configuration 8 or 9. (Composition 11) When the longitudinal direction of the common liquid chamber as viewed in the first direction is defined as the second direction, The second wall portion forms a plurality of the second common liquid chambers arranged in the second direction, The opening width of the second common liquid chamber in the second direction is characterized by being 2 mm or less. Liquid discharge substrate as described in configuration 10. (Composition 12) The space constituting the aforementioned connecting channel is characterized by being a polyhedron composed of fourteen or more faces. A liquid dispensing substrate as described in any one of configurations 8 to 11. (Composition 13) Of the common liquid chambers, the portion formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber. When the longitudinal direction of the common liquid chamber as viewed in the first direction is designated as the second direction, and the short direction perpendicular to the second direction is designated as the third direction, The cross-sectional shape of the second common liquid chamber in a cross-section perpendicular to the third direction is a polygon with five or more sides, and the sides of the cross-sectional shape that are farther from the first common liquid chamber at the end of the cross-sectional shape are acute angles to each other. A liquid dispensing substrate as described in any one of configurations 1 to 11. (Composition 14) When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The length of the second common liquid chamber in the first direction is characterized by being at least half the width of the second flow channel substrate in the first direction. A liquid dispensing substrate as described in any one of configurations 1 to 13. (Composition 15) Of the common liquid chambers, the portion formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber. When the longitudinal direction of the common liquid chamber as viewed in the first direction is designated as the second direction, and the short direction perpendicular to the second direction is designated as the third direction, Inside the first flow channel substrate, a plurality of first common liquid chambers are formed in the third direction, and the first wall portion includes a first separation wall that separates the plurality of first common liquid chambers in the second direction. Inside the second flow channel substrate, a plurality of second common liquid chambers are formed in the third direction, and the second wall portion includes a second separating wall that separates the plurality of second common liquid chambers in the second direction. In the connection between the first common liquid chamber and the second common liquid chamber, the opening width of the first common liquid chamber in the third direction is larger than the opening width of the second common liquid chamber in the third direction. In the connection portion between the first channel substrate and the second channel substrate, the width of the second separation wall in the third direction is larger than the width of the first separation wall in the third direction. A liquid discharge substrate as described in any one of configurations 1 to 14. (Composition 16) The second separation wall includes a portion in which the width in the third direction gradually decreases as it moves away from the first flow channel substrate, and the minimum width of the second separation wall in the third direction is 15 μm or more. Liquid discharge substrate as described in configuration 15. (Composition 17) The length of the common liquid chamber in the first direction is characterized by being 600 μm or more. A liquid discharge substrate as described in any one of configurations 1 to 16. (Composition 18) The first channel substrate and the second channel substrate are characterized by being made of a silicon substrate. A liquid dispensing substrate as described in any one of configurations 1 to 17. (Composition 19) A liquid discharge substrate described in any one of configurations 1 to 18, A housing that supports the liquid discharge substrate, A liquid dispensing head characterized by having the following features. (Composition 20) A transport unit that transports the recording medium, A liquid discharge head according to configuration 19 for discharging liquid toward a recording medium being transported by the transport unit, A recording device characterized by comprising the following features. (Method 1) A liquid discharge substrate used in a liquid discharge head, wherein a liquid flow path is formed inside the substrate, including a nozzle, individual flow paths communicating with the nozzle, and a common liquid chamber communicating with the individual flow paths, A first channel formation step in which a first common liquid chamber, which constitutes a part of the aforementioned common liquid chamber, is formed on a first channel substrate, A second channel formation step in which the individual channels are formed on the first channel substrate, A third channel formation step involves forming a second common liquid chamber, which constitutes a part of the aforementioned common liquid chamber, on a second channel substrate, A substrate bonding step of joining the surface of the first channel substrate in which the first common liquid chamber is open and the surface of the second channel substrate in which the second common liquid chamber is open, A method for manufacturing a liquid discharge substrate, characterized by including the following: (Method 2) The first channel formation step includes a step of forming the first common liquid chamber by dry etching or wet etching, The third channel formation step is characterized by including a step of forming the second common liquid chamber by dry etching or wet etching. A method for manufacturing a liquid discharge substrate as described in Method 1. (Method 3) The liquid flow path includes a connecting flow path that communicates with the common liquid chamber. The third channel formation step includes the step of forming the connecting channel in the second common liquid chamber. Characterized by, A method for manufacturing a liquid discharge substrate as described in Method 1. (Method 4) The third channel formation step is characterized by including a step of forming the second common liquid chamber and the connecting channel by wet etching, Method 3 for manufacturing a liquid dispensing substrate. (Method 5) The third channel formation step is: A step of forming an opening pattern for the second common liquid chamber on the surface of the second flow channel substrate where the second common liquid chamber opens, A step of forming an opening pattern for the connecting channel on the surface of the second channel substrate where the connecting channel opens, A step of forming a hole in the opening pattern for the second common liquid chamber on the surface of the second flow channel substrate where the second common liquid chamber opens, Features including, Method for manufacturing a liquid discharge substrate as described in Method 4. (Method 6) The opening pattern for the second common liquid chamber and the opening pattern for the connecting channel are characterized by being mask patterns formed by coating and developing a photoresist mask. Method 5 for manufacturing a liquid dispensing substrate. (Method 7) The aforementioned holes are formed by dry etching. Method 5 for manufacturing a liquid dispensing substrate. (Method 8) The method for manufacturing a liquid discharge substrate according to method 5, characterized in that the opening pattern for the second common liquid chamber, the opening pattern for the connecting channel, and the holes are formed by laser processing. [Explanation of Symbols]

[0181] 11…Liquid discharge head, 201…Nozzle layer (nozzle forming member), 202…First flow path substrate, 202c…First wall section, 203…Second flow path substrate, 203c…Second wall section, 205…Nozzle, 207…Individual supply port (individual flow path)

Claims

1. A liquid discharge substrate used in a liquid discharge head, wherein a liquid flow path is formed inside the substrate, including a nozzle, individual flow paths communicating with the nozzle, and a common liquid chamber communicating with the individual flow paths, A nozzle forming member having a liquid discharge surface through which the nozzle is open, A first flow path substrate having a first surface on which the nozzle forming member is provided, a second surface opposite to the first surface, and a first wall portion that constitutes the wall portion of the individual flow path and the common liquid chamber, A second flow channel substrate having a third surface joined to the second surface of the first flow channel substrate in a first direction, and a second wall portion that constitutes the wall portion of the common liquid chamber, Equipped with, The liquid discharge substrate is characterized in that the second wall portion includes a portion whose cross-sectional area in a cross-section perpendicular to the first direction is different from that of the first wall portion.

2. When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The connection between the first common liquid chamber and the second common liquid chamber is characterized in that the cross-sectional areas of the sections perpendicular to the first direction of the first common liquid chamber and the second common liquid chamber are different from each other. The liquid dispensing substrate according to claim 1.

3. At least one of the first wall portion and the second wall portion includes a tapered surface inclined with respect to the first direction, The liquid dispensing substrate according to claim 1.

4. When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The second common liquid chamber is characterized by having a protrusion that extends from a surface facing the same direction as the third surface toward the first flow channel substrate along the first direction, The liquid dispensing substrate according to claim 1.

5. The second channel substrate has a fourth surface opposite to the third surface, The present invention further comprises a third channel substrate having a fifth surface bonded to the fourth surface of the second channel substrate and a third wall portion that constitutes the wall portion of the common liquid chamber, The liquid dispensing substrate according to claim 1.

6. When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The invention further comprises a filter provided at the connection between the first common liquid chamber and the second common liquid chamber, The liquid dispensing substrate according to claim 1.

7. The liquid channel further includes a connecting channel that communicates with the common liquid chamber, The second channel substrate is further characterized by comprising a connecting channel forming member connected to a fourth surface opposite to the third surface, and having the connecting channel formed inside it, The liquid dispensing substrate according to claim 1.

8. The liquid channel further includes a connecting channel that communicates with the common liquid chamber, The second wall portion is characterized in that it constitutes the wall portion of the connecting channel. The liquid dispensing substrate according to claim 1.

9. The portion of the second wall that constitutes the wall of the connecting channel is characterized in that it includes a tapered surface inclined with respect to the first direction. The liquid discharge substrate according to claim 8.

10. When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The connecting channel and the second common liquid chamber are not directly connected, but are formed independently of each other. The liquid discharge substrate according to claim 8.

11. When the longitudinal direction of the common liquid chamber as viewed in the first direction is defined as the second direction, The second wall portion forms a plurality of the second common liquid chambers arranged in the second direction, The opening width of the second common liquid chamber in the second direction is characterized by being 2 mm or less. The liquid dispensing substrate according to claim 10.

12. The space constituting the aforementioned connecting channel is characterized by being a polyhedron composed of fourteen or more faces. The liquid discharge substrate according to claim 8.

13. Of the common liquid chambers, the portion formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber. When the longitudinal direction of the common liquid chamber as viewed in the first direction is designated as the second direction, and the short direction perpendicular to the second direction is designated as the third direction, The cross-sectional shape of the second common liquid chamber in a cross-section perpendicular to the third direction is a polygon with five or more sides, and the sides of the cross-sectional shape that are farther from the first common liquid chamber form an acute angle with each other. The liquid dispensing substrate according to claim 1.

14. When the portion of the common liquid chamber formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber, The length of the second common liquid chamber in the first direction is characterized by being at least half the width of the second flow channel substrate in the first direction. The liquid dispensing substrate according to claim 1.

15. Of the common liquid chambers, the portion formed by the first wall is designated as the first common liquid chamber, and the portion formed by the second wall and connected to the first common liquid chamber is designated as the second common liquid chamber. When the longitudinal direction of the common liquid chamber as viewed in the first direction is designated as the second direction, and the short direction perpendicular to the second direction is designated as the third direction, Inside the first flow channel substrate, a plurality of first common liquid chambers are formed in the third direction, and the first wall portion includes a first separation wall that separates the plurality of first common liquid chambers in the second direction. Inside the second flow channel substrate, a plurality of the second common liquid chambers are formed in the third direction, and the second wall portion includes a second separating wall that separates the plurality of the second common liquid chambers in the second direction. In the connection between the first common liquid chamber and the second common liquid chamber, the opening width of the first common liquid chamber in the third direction is larger than the opening width of the second common liquid chamber in the third direction. In the connection portion between the first flow channel substrate and the second flow channel substrate, the width of the second separation wall in the third direction is larger than the width of the first separation wall in the third direction. The liquid dispensing substrate according to claim 1.

16. The second separation wall includes a portion in which the width in the third direction gradually decreases as it moves away from the first flow channel substrate, and the minimum width of the second separation wall in the third direction is 15 μm or more. The liquid discharge substrate according to claim 15.

17. The length of the common liquid chamber in the first direction is 600 μm or more. The liquid dispensing substrate according to claim 1.

18. The first channel substrate and the second channel substrate are characterized by being made of a silicon substrate. The liquid dispensing substrate according to claim 1.

19. A liquid discharge substrate according to any one of claims 1 to 18, A housing that supports the liquid discharge substrate, A liquid dispensing head characterized by having the following features.

20. A transport unit that transports the recording medium, A liquid dispensing head according to claim 19, which dispenses liquid toward a recording medium being transported by the transport unit, A recording device characterized by comprising the following features.

21. A liquid discharge substrate used in a liquid discharge head, wherein a liquid flow path is formed inside the substrate, including a nozzle, individual flow paths communicating with the nozzle, and a common liquid chamber communicating with the individual flow paths, A first channel formation step in which a first common liquid chamber, which constitutes a part of the aforementioned common liquid chamber, is formed on a first channel substrate, A second channel formation step in which the individual channels are formed on the first channel substrate, A third channel formation step involves forming a second common liquid chamber, which constitutes a part of the aforementioned common liquid chamber, on a second channel substrate, A substrate bonding step of joining the surface of the first flow channel substrate in which the first common liquid chamber is open and the surface of the second flow channel substrate in which the second common liquid chamber is open, A method for manufacturing a liquid discharge substrate, characterized by including the following:

22. The first channel formation step includes a step of forming the first common liquid chamber by dry etching or wet etching, The third channel formation step is characterized by including a step of forming the second common liquid chamber by dry etching or wet etching. A method for manufacturing a liquid dispensing substrate according to claim 21.

23. The liquid flow path includes a connecting flow path that communicates with the common liquid chamber. The third channel formation step is characterized by including the step of forming the connecting channel in the second common liquid chamber. A method for manufacturing a liquid dispensing substrate according to claim 21.

24. The third channel formation step is characterized by including a step of forming the second common liquid chamber and the connecting channel by wet etching. A method for manufacturing a liquid discharge substrate according to claim 23.

25. The third channel formation step is as follows: A step of forming an opening pattern for the second common liquid chamber on the surface of the second flow channel substrate where the second common liquid chamber opens, A step of forming an opening pattern for the connecting channel on the surface of the second channel substrate where the connecting channel opens, A step of forming a hole in the opening pattern for the second common liquid chamber on the surface of the second flow channel substrate where the second common liquid chamber opens, Features including, A method for manufacturing a liquid discharge substrate according to claim 24.

26. The opening pattern for the second common liquid chamber and the opening pattern for the connecting channel are characterized by being mask patterns formed by coating and developing a photoresist mask. A method for manufacturing a liquid dispensing substrate according to claim 25.

27. The aforementioned holes are formed by dry etching. A method for manufacturing a liquid dispensing substrate according to claim 25.

28. The method for manufacturing a liquid discharge substrate according to claim 25, characterized in that the opening pattern for the second common liquid chamber, the opening pattern for the connecting channel, and the holes are formed by laser processing.

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