Liquid dispensing head and device for dispensing liquid

Abstract

To provide a liquid dispensing head and a liquid dispensing device that can suppress the deterioration of liquid dispensing performance. [Solution] The liquid discharge head comprises an actuator member 2, which is a substrate component laminated on a substrate having a liquid chamber that communicates with a nozzle, and having a diaphragm that forms part of the wall surface of the liquid chamber, and a piezoelectric element laminated on the side of the diaphragm opposite to the side that forms the wall surface of the liquid chamber, and a frame member 3, which is a reinforcing member that has a communication hole 3a that communicates with the liquid chamber and is joined to the actuator member 2 by adhesive. In addition to the communication hole 3a, the frame member 3 has a plurality of voids 3b.

Description

Technical Field

[0006] , , , , ,

[0001] The present invention relates to a liquid ejection head and an apparatus for ejecting a liquid.

Background Art

[0002] Conventionally, there is known a liquid ejection head including an actuator substrate having a diaphragm that forms part of a wall surface of a liquid chamber and laminated on a surface of the diaphragm opposite to the side forming the wall surface of the liquid chamber, and a piezoelectric element laminated on the surface of the diaphragm opposite to the side forming the wall surface of the liquid chamber, and a reinforcing member having a communication portion communicating with the liquid chamber and joined to the substrate component with an adhesive.

[0003] Patent Document 1 describes a frame-shaped reinforcing frame as a reinforcing member for reinforcing a front head unit as the substrate component, which is joined to the front head unit with an adhesive.

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, there has been a risk of deterioration in liquid ejection performance.

Means for Solving the Problems

[0005] In order to solve the above-described problems, the present invention provides a liquid ejection head including a substrate component having a diaphragm that forms part of a wall surface of a liquid chamber and laminated on a surface of the diaphragm opposite to the side forming the wall surface of the liquid chamber, and a piezoelectric element laminated on the surface of the diaphragm opposite to the side forming the wall surface of the liquid chamber, and a reinforcing member having a communication portion communicating with the liquid chamber and joined to the substrate component with an adhesive, wherein the reinforcing member has a plurality of void portions in addition to the communication portion.

Effects of the Invention

[0006] According to the present invention, it is possible to suppress a decrease in liquid ejection performance.

Brief Description of the Drawings

[0007] [Figure 1] A schematic diagram showing the main components of the liquid dispensing head. [Figure 2] A schematic diagram showing a configuration in which the upper electrode is a common electrode and the lower electrode is an individual electrode. [Figure 3] A diagram illustrating the liquid dispensing head of a comparative example. [Figure 4] A diagram illustrating the liquid dispensing head of Example 1. [Figure 5] A diagram illustrating the liquid dispensing head of Example 2. [Figure 6] A graph showing the compressive stress at various positions along the longitudinal direction of the liquid discharge head on the actuator member in the Comparative Example, Example 1, and Example 2. [Figure 7] Schematic diagram of a piezoelectric element wafer. [Figure 8] A graph showing the average ejection velocity distribution in the characteristics of the actuator substrate at each position on the piezoelectric element wafer. [Figure 9] This diagram illustrates an example of a liquid dispensing head in Example 3. [Figure 10] (a) is a graph showing the average discharge rate distribution in the characteristics of the actuator substrate, and (b) is a graph showing the average discharge rate distribution after joining a frame member having a gap corresponding to the average discharge rate distribution in the characteristics of the actuator substrate. [Figure 11] This figure shows a first modified example of the void portion of the frame member in Example 3. [Figure 12] This figure shows a second modified example of the void portion of the frame member in Example 3. [Figure 13] This figure shows a third modified example of the void portion of the frame member in Example 3. [Figure 14] This figure shows a fourth modified example of the void portion of the frame member in Example 3. [Figure 15] A side view illustrating the mechanism of the inkjet recording device according to this embodiment. [Figure 16] A schematic diagram illustrating a printing device as another example of an inkjet recording device. [Figure 17]Plan view diagram of an example of a head unit of the printing device. [Figure 18] A plan view illustrating the main components of a modified inkjet recording device. [Figure 19] Side view of the main part of a modified inkjet recording device. [Figure 20] A plan view illustrating the main components of another example of a liquid dispensing unit. [Figure 21] A front view illustrating yet another example of a liquid dispensing unit. [Modes for carrying out the invention]

[0008] The best mode for carrying out the present invention will be described below with reference to the drawings. Figure 1 is a schematic diagram showing the main parts of the liquid discharge head 1, and is a cross-sectional view of the liquid discharge head 1 in the short direction. The liquid discharge head 1 includes an actuator member 2, which is a substrate component, and a frame member 3, which is a reinforcing member, joined to the actuator member 2 by adhesive 50. The actuator member 2 includes a nozzle substrate 10, an actuator substrate 20, and a support substrate 30. The actuator member 2 is formed by joining the actuator substrate 20, the support substrate 30, and the nozzle substrate 10.

[0009] The nozzle substrate 10 has a plurality of nozzle holes 10a formed therein for discharging liquid. The actuator substrate 20 has a pressurized liquid chamber substrate 21, a vibrating plate 22, and a piezoelectric element 23 that generates liquid discharge energy. The pressurized liquid chamber substrate 21 has pressurized liquid chamber partitions 21a formed therein that separate a plurality of pressurized liquid chambers 21b (individual liquid chambers), each of which communicates with the plurality of nozzle holes 10a. The pressurized liquid chamber substrate 21 also has individual flow paths formed therein that lead to each pressurized liquid chamber 21b. The pressurized liquid chamber 21b is formed by the vibrating plate 22 of the actuator substrate 20, the nozzle substrate 10, and the pressurized liquid chamber partitions 21a of the pressurized liquid chamber substrate 21.

[0010] The diaphragm 22 faces the nozzle forming wall in which the nozzle holes 10a of the pressure liquid chamber 21b are formed, forms a deformable wall portion, and a piezoelectric element 23 is provided on the surface of the diaphragm 22 on the side opposite to the pressure liquid chamber side.

[0011] In the present embodiment, the pressure liquid chamber substrate 21 and the diaphragm 22 are integrally formed as the same member using an SOI (Silicon On Insulator) substrate. That is, an SOI substrate formed with a silicon oxide film, a silicon layer, and a silicon oxide film in this order on a silicon substrate is used. The silicon substrate is used as the pressure liquid chamber substrate 21, and the diaphragm 22 can be formed by the silicon oxide film, the silicon layer, and the silicon oxide film. In this configuration, the layer structure of the silicon oxide film, the silicon layer, and the silicon oxide film of the SOI substrate becomes the diaphragm 22. Thus, the diaphragm 22 is composed of a material formed on the surface of the pressure liquid chamber substrate 21. Also, the pressure liquid chamber substrate 21 and the diaphragm 22 may be configured as separate members.

[0012] The piezoelectric element 23 is composed of a piezoelectric body 23a, a common electrode 23b (also referred to as a lower electrode), and an individual electrode 23c (also referred to as an upper electrode). The piezoelectric body 23a is sandwiched between the common electrode 23b and the individual electrode 23c. The piezoelectric element 23 is covered with an insulating film 24, and lead-out wirings 25 respectively drawn from the common electrode 23b and the individual electrode 23c are formed on this insulating film 24. The lead-out wirings 25 are electrically connected to a drive control unit that applies a voltage to the common electrode 23b and the individual electrode 23c of an external device through a connection portion provided at the end of the liquid ejection head 1. The lead-out wirings 25 are coated with a passivation film 26.

[0013] The support substrate 30 is joined to the actuator substrate 20 by an adhesive 27, and a common liquid chamber leading to each individual flow path and a gap portion 30a (a countersink) that enables the wall portion of the pressure liquid chamber 21b of the diaphragm 22 to deform are formed. The piezoelectric element 23 is disposed in this gap portion 30a, and the support substrate 30 covers the piezoelectric element 23.

[0014] The reinforcing frame member 3 is joined to the support substrate 30 by a thermosetting adhesive 50, reinforcing the actuator member 2 and suppressing deformation of the actuator member 2 by external forces. The frame member 3 has a communication hole 3a (see Figure 3, etc.) that communicates with a common liquid chamber formed in the support substrate 30 and penetrates the frame member 3, and the common liquid chamber is connected to an external liquid tank through this communication hole 3a.

[0015] The actuator member 2 may also be configured by further laminating a damper member on the support substrate 30. The damper member consists of a damper and a damper holding member that holds the damper. The damper forms the deformable wall surface of the common liquid chamber of the support substrate 30 and is made of palladium-nickel alloy (PdNi) or the like. The damper holding member is made of silicon (Si) or the like, and recesses are formed at locations opposite to the wall surface of the common liquid chamber of the damper so that the constituent parts can be deformed.

[0016] The damper member suppresses the influence (e.g., crosstalk) that pressure fluctuations generated when liquid is discharged from the nozzle hole 10a have on liquid discharge from other nozzles via the common liquid chamber. Specifically, by properly performing its damping function, the damper member suppresses the occurrence of crosstalk, where vibrations (pressure fluctuations) during liquid discharge propagate through the liquid in the common liquid chamber and affect liquid discharge from adjacent nozzles, thereby stabilizing the liquid discharge accuracy from each nozzle.

[0017] With each pressurized liquid chamber 21b of the liquid discharge head 1 filled with liquid, such as recording fluid (ink), a voltage pulse based on image data is applied from the transmission circuit of the drive control unit to the individual electrodes 23c corresponding to the nozzle holes 10a from which the recording fluid is to be discharged, via the lead wiring 25. As a result, the piezoelectric element 23a extends in a direction perpendicular to the diaphragm 22 due to the electrostrictive effect, causing the diaphragm 22 to displace. This increases the pressure in the pressurized liquid chamber 21b, causing the recording fluid to be discharged from the nozzle holes 10a communicating with the pressurized liquid chamber 21b. After the pulse voltage is applied, the extended piezoelectric element 23a returns to its original position, causing the bent diaphragm 22 to return to its original position. This creates a negative pressure in the pressurized liquid chamber 21b compared to the common liquid chamber, and the recording fluid in the supply liquid chamber is supplied to the pressurized liquid chamber 21b. In addition, recording fluid is supplied from an external liquid tank to the common liquid chamber of the support substrate 30 via the communication hole 3a of the frame member 3 (see Figure 3, etc.). By repeating this process, droplets can be continuously ejected, forming an image on the recording medium (paper) positioned opposite the liquid ejection head 1.

[0018] Next, we will describe the manufacturing process of the liquid dispensing head 1. (a) A diaphragm 22 is formed on a pressurized liquid chamber substrate 21 made of a silicon single crystal substrate with a (110) plane orientation (for example, with a thickness of 400 μm or 600 μm). The diaphragm 22 has a structure in which silicon oxide films and silicon nitride films are laminated using methods such as LP-CVD. Other materials may be used, such as silicon or zircon oxide, or other elements may be implanted for stress control. Alternatively, the active layer of an SOI (Silicon on Insulator) wafer may be used for formation. Furthermore, the silicon plane orientation of the pressurized liquid chamber substrate 21 is not limited to (110), and any orientation suitable for flow in subsequent processes may be selected.

[0019] (b) Next, a common electrode 23b consisting of a platinum (Pt) layer with a thickness of 150 nm and a titanium oxide (TiO2) layer with a thickness of 40 nm is deposited by sputtering. Then, lead zirconate titanate (PZT) is deposited as the piezoelectric material 23a in multiple steps, for example, by a sol-gel method using spin coating, until a final thickness of 2 μm is achieved. Specifically, lead zirconate titanate (PZT) is applied to the top of the common electrode 23b by spin coating and then fired. This firing is carried out in three steps: drying (120°C), calcination (380°C), and final firing (700°C). This makes it possible to obtain good crystallinity with PZT(100) as the piezoelectric material 23a on the common electrode 23b. Note that the method of depositing the piezoelectric material 23a is not limited to the sol-gel method using spin coating, but may also be used, for example, by sputtering, ion plating, aerosol, or inkjet.

[0020] Next, individual electrodes 23c, consisting of strontium ruthenate (SRO) with a film thickness of 40 nm and platinum (Pt) with a film thickness of 100 nm, are deposited by sputtering. Titanium (Ti), gold (Au), copper (Cu), etc., may also be used as materials for the individual electrodes 23c. Then, piezoelectric material 23a and individual electrodes 23c are formed by litho-etching at positions corresponding to the pressurized liquid chamber 21b that will be formed later.

[0021] (c) Next, after forming the insulating film 24, holes for connecting the lead wiring 25 to the common electrode 23b and the lead wiring 25 to the individual electrodes 23c are formed in the insulating film 24 by photolithography and etching. Next, for the lead wiring 25, for example, titanium nitride (TiN) with a thickness of 30 nm and aluminum (Al) with a thickness of 3 μm are each formed by sputtering. The titanium nitride (TiN) is formed in the holes formed in the insulating film 24 and constitutes the connection part with the common electrode 23b and the connection part with the individual electrodes 23c. The aluminum (Al) is formed on the insulating film 24.

[0022] The connection points of the lead wire 25 to the common electrode 23b and to the individual electrodes 23c are made of titanium nitride (TiN) for the following reason: If the Pt material of the individual electrodes 23c or the common electrode 23b comes into direct contact with the Al material of the lead wire 25, alloying may occur due to the thermal history in subsequent processes, potentially leading to film peeling due to stress caused by volume changes. By making the connection points of the lead wire 25 to the common electrode 23b and to the individual electrodes 23c out of titanium nitride (TiN), the titanium nitride (TiN) functions as a barrier layer to prevent alloying. The lead wire 25 can be made of any material with low resistance, and may be formed from materials containing gold (Au), nickel (Ni), chromium (Cr), etc. In this embodiment, the individual electrodes 23c are upper electrodes laminated on the piezoelectric body 23a, and the common electrode 23b is the lower electrode on which the piezoelectric body 23a is laminated, but as shown in Figure 2, their functions may be reversed.

[0023] (d) Next, after forming the passivation film 26, a void 30a (counterbore) is formed at the position corresponding to the piezoelectric element 23 by litho-etching to fabricate the support substrate 30. At this time, silicon (Si) processing is performed by dry etching. After that, the support substrate 30 and the area of ​​the actuator substrate 20 where the passivation film 26 has been formed are joined with adhesive 27. At this time, the adhesive 27 is applied to the support substrate 30 side to a thickness of about 1 μm using a general thin film transfer apparatus. After that, in order to form the pressurized liquid chamber 21b, the pressurized liquid chamber substrate 21 is polished to a desired thickness t (for example, a thickness of 80 μm) using a known technique. In addition to polishing, etching or other methods may also be used.

[0024] (e) Next, the surface of the pressurized liquid chamber substrate 21 to which the nozzle substrate 10 is joined is coated with resist by lithography. Then, anisotropic wet etching is performed with an alkaline solution (potassium hydroxide (KOH) solution or tetramethylammonium hydroxide solution (TMAH solution)) to form a pressurized liquid chamber 21b on the pressurized liquid chamber substrate 21. In addition to anisotropic etching with an alkaline solution, the pressurized liquid chamber 21b may also be formed by dry etching using an ICP etcher (inductively coupled plasma etching).

[0025] (f) Next, a nozzle substrate 10, which has a nozzle hole 10a formed in a position corresponding to the separately formed pressurized liquid chamber 21b, is joined to it. The actuator member 2 is formed by the above steps (a) to (f).

[0026] (g) Next, a frame member 3 made of glass epoxy resin, which has a communication hole 3a (see Figure 3, etc.) for introducing recording fluid (ink) into the common fluid chamber of the support substrate 30, is joined to the support substrate 30 on the side opposite to the side of the support substrate 30 that is joined to the actuator substrate 20, using a thermosetting adhesive 50. The frame member 3 is joined to the support substrate 30 by applying the thermosetting adhesive 50 to the joining surface 3d of the frame member 3 and heating and curing the adhesive 50 while applying pressure from above and below. To further improve resistance to ink, the adhesive 50 is heated to 100°C and cured. This completes the liquid ejection head 1.

[0027] The material of the frame member 3 is not limited to glass epoxy resin, but it is preferable to use a material with a low coefficient of thermal expansion with the silicon base material of the actuator member 2 when the adhesive 50 is heat-cured during joining.

[0028] [Comparative Example] Figure 3 illustrates the liquid discharge head 1Z of a comparative example (conventional), where Figure 3(a) is a schematic cross-sectional view and Figure 3(b) is a schematic view from the liquid discharge side. As shown in Figure 3, in the comparative example liquid discharge head 1Z, the frame member 3 has no voids other than the communication hole 3a for supplying recording fluid to the common fluid chamber formed in the support substrate 30, and has a large volume configuration.

[0029] As described above, when joining the actuator member 2 and the frame member 3, a thermosetting adhesive 50 is applied to the joining surface 3d of the frame member 3, and the adhesive 50 is heated and cured while applying pressure from above and below.

[0030] After the thermosetting adhesive 50 hardens and joins the actuator member 2 and the frame member 3, the actuator member 2 and the frame member 3 undergo thermal contraction as they return to room temperature. The coefficient of linear expansion of the frame member 3, which is made of resin, is greater than that of the actuator member 2, which is mainly made of a silicon substrate. As a result, the amount of thermal contraction of the frame member 3 is greater than that of the actuator member 2, and the actuator member 2 is subjected to stress (hereinafter referred to as thermal stress) in the direction indicated by arrow A in the figure at the adhesive interface due to the difference in the amount of thermal contraction between it and the frame member 3.

[0031] In this comparative example, the frame member 3 has a large volume configuration with only a communication hole 3a as a connecting part, resulting in a large amount of thermal shrinkage of the frame member 3 when it returns to room temperature after the adhesive has cured. As a result, the difference in thermal shrinkage between the frame member 3 and the actuator member 2 is large, and the thermal stress on the actuator member 2 is large.

[0032] The thermal stress in the direction of arrow A shown in Figure 3 causes a change in the rigidity of the pressurizing section, which consists of a diaphragm 22 that pressurizes the pressurized liquid chamber 21b and a piezoelectric element 23. In the liquid discharge head 1, the pulse voltage (power waveform) applied to the piezoelectric element 23 is set based on the resonance frequency determined by the dimensions between the pressurizing section and the pressurized liquid chamber 21b, as well as the dimensions between the pressurized liquid chamber 21b and the common liquid chamber, and the recording fluid (ink) used. Therefore, if the rigidity of the pressurizing section changes, the resonance frequency will change, and the desired discharge characteristics cannot be obtained. In addition, the thermal stress may cause warping of the actuator member 2. Warping of the actuator member 2 may cause variations in the discharge direction of the liquid discharged from the nozzle hole 10a.

[0033] [Example 1] Figure 4 illustrates the liquid discharge head 1A of Example 1, where (a) is a schematic cross-sectional view and (b) is a schematic view from the liquid discharge side. As shown in Figure 4, the liquid discharge head 1A of Embodiment 1 has a configuration in which, in addition to the communication hole 3a, three through holes are formed in the frame member 3 that penetrate through the frame member 3, and in addition to the communication hole 3a, there are multiple voids 3b.

[0034] As a result, the volume of the frame member 3 can be reduced compared to the comparative example shown in Figure 3, and the amount of thermal shrinkage of the frame member 3 when it returns to room temperature after the adhesive has cured can be reduced. Therefore, the difference in the amount of thermal shrinkage between the frame member 3 and the actuator member 2 can be made smaller compared to the comparative example, and the thermal stress on the actuator member 2 can be reduced.

[0035] Furthermore, in Example 1, a partition portion 3e is provided that extends in the short direction of the liquid discharge head 1 and partitions the void portion 3b, so that there are multiple void portions 3b in the longitudinal direction of the liquid discharge head 1. For example, by making the frame member 3 frame-shaped and having a large rectangular through-hole in the central part, the volume of the frame member 3 can be further reduced, and the thermal stress on the actuator member 2 can be further suppressed. However, if the frame member 3 is frame-shaped, the rigidity of the frame member 3 will decrease. As a result, there is a risk that the original function of the frame member 3, which is to reinforce the actuator member 2 and suppress deformation of the actuator member 2 due to external forces, may not be performed.

[0036] On the other hand, in Example 1, a partition portion 3e is provided that extends in the short direction of the liquid discharge head and partitions the gap portion 3b, and the gap portion 3b is configured to have multiple gap portions in the longitudinal direction of the liquid discharge head. As a result, the frame member 3 is reinforced by the partition portion 3e, and a decrease in the rigidity of the frame member 3 can be suppressed. As a result, the actuator member 2 can be well reinforced by the frame member 3, and deformation of the actuator member 2 due to external forces can be suppressed.

[0037] In Example 1, multiple voids 3b are provided in the longitudinal direction of the liquid discharge head. However, a partition portion extending in the longitudinal direction to divide the voids 3b may also be provided to provide multiple voids 3b in the short direction. However, providing multiple voids 3b in the longitudinal direction, as in Example 1, offers the following advantages compared to a configuration where multiple voids 3b are provided in the short direction. Specifically, if the thickness of the partition portion is the same for both cases, the configuration with multiple voids in the short direction allows for a reduction in the volume of the frame member 3. Therefore, by providing multiple voids in the longitudinal direction, the rigidity of the frame member 3 can be maintained while reducing the volume of the frame member 3 compared to the case where multiple voids are provided in the short direction. As a result, the thermal stress on the actuator member 2 can be reduced compared to the case where multiple voids are provided in the short direction.

[0038] Furthermore, the multiple voids 3b provided in the frame member 3 may be closed spaces without openings, voids with a concave cross-section that open only on the surface 3f opposite to the joint surface 3d, or voids with a concave cross-section that open only on the joint surface 3d. Also, the multiple voids do not have to be the same shape, and may be a combination of the voids with the above-described configurations (through voids, closed spaces, voids that open only on the surface 3f opposite to the joint surface 3d, and voids that open only on the joint surface 3d).

[0039] In particular, it is preferable that the multiple voids have openings in the joint surface 3d. By configuring the multiple voids in this way, the volume of the frame member 3 on the joint surface side can be reduced, and the amount of thermal shrinkage on the joint surface side can be reduced. As a result, the thermal stress applied to the actuator member 2 through the joint can be reduced, and changes in the rigidity of the pressurizing section, which is composed of the diaphragm 22 that pressurizes the pressurized liquid chamber 21b and the piezoelectric element 23, can be suppressed.

[0040] [Example 2] Figure 5 illustrates the liquid discharge head 1B of Example 2, where (a) is a schematic cross-sectional view and (b) is a schematic view from the liquid discharge side. The liquid discharge head 1B of Example 2 has a through-gap 3b-1 that penetrates the frame member 3 in the center of its longitudinal direction, and concave-shaped gaps 3b-2 that open only to the joint surface 3d on both sides of the frame member 3 in the longitudinal direction. This configuration increases the rigidity of the frame member 3 compared to Example 1, in which all of the gaps are through-gap 3 that penetrate the frame member 3. Furthermore, by having a through-gap 3b-1 in the center of its longitudinal direction and concave-shaped gaps 3b-2 that open only to the joint surface 3d on both sides in the longitudinal direction, the rigidity balance of the frame member 3 can be improved. Also, in Example 2, since all three gaps 3b-1 and 3b-2 open towards the actuator member, as described above, the amount of thermal shrinkage on the joint surface side of the frame member 3 can be reduced, and the thermal stress on the actuator member 2 can be reduced.

[0041] Furthermore, in the configuration of this embodiment 2, a thermistor 29, which is an electrical component and temperature measuring means for measuring the temperature of the actuator member 2, is inserted into the through-gap 3b-1. In addition, the through-gap 3b-1 is filled with a sealant 3c to seal the thermistor 29. This protects the thermistor 29 from moisture and other elements.

[0042] The sealant 3c is, for example, an ultraviolet-curing resin. After filling the through-void 3b-1, ultraviolet light is irradiated from the opening on the opposite side of the joint surface 3d of the through-void 3b-1 (the surface 3f) to cure it. In Example 2, an ultraviolet-curing resin with poor ultraviolet light transmission was used as the sealant 3c, so that ultraviolet light could only penetrate to a certain depth, leaving the sealant 3c on the actuator member side in an uncured state.

[0043] On the side of the sealant 3c opposite to the actuator member, the thermistor 29 can be sealed by the cured resin. On the other hand, since the side of the sealant 3c on the actuator member side remains uncured, stress due to curing shrinkage of the sealant 3c on the actuator member side is prevented from being applied to the actuator member 2. Therefore, changes in the rigidity of the pressurizing section, which consists of the diaphragm 22 and piezoelectric element 23 that pressurize the pressurized liquid chamber 21b of the actuator member 2, can be suppressed, and the impact on discharge performance can be suppressed.

[0044] On the other hand, the side of the frame member 3 opposite to the actuator member is affected by the curing shrinkage of the sealant 3c. However, the concave-shaped voids 3b-2 adjacent to the longitudinally adjacent through-void 3b-1 filled with sealant 3c are closed on the side opposite to the actuator member, and the rigidity of the frame member 3 on the side opposite to the actuator member is increased. Therefore, the frame member 3 does not deform due to the curing shrinkage of the sealant 3c on the side opposite to the actuator member. This suppresses changes in the rigidity of the pressurized section due to the deformation of the frame member 3, and thus suppresses any impact on the discharge performance.

[0045] The depth L2 of the concave-shaped gaps 3b-2 adjacent to the longitudinal side of the through-gap 3b-1 is set to (1 / 2) of the length L1 of the frame member 3 in the liquid discharge direction (a direction perpendicular to both the short and long directions of the liquid discharge head, and also the stacking direction of the members). In order to suppress thermal shrinkage on the joint surface side of the frame member 3 and suppress the discharge performance due to thermal stress of the actuator member 2, it is preferable to set the depth L2 to at least (1 / 3) of the above L1.

[0046] Figure 6 is a graph showing the compressive stress at various positions along the longitudinal direction of the liquid discharge head on the actuator member 2 in the comparative example, Example 1, and Example 2. The compressive stresses shown in Figure 6 are the results obtained by simulating the joining process of the frame member 3 to the actuator member 2 for Comparative Example 1, Examples 1 and 2, using Ansys's simulation software.

[0047] As can be seen from Figure 6, in Examples 1 and 2, which have multiple voids other than the communication hole 3a, the compressive stress was reduced to about half compared to the comparative example which does not have voids other than the communication hole 3a. As a result, it was confirmed that Examples 1 and 2 can suppress changes in the rigidity of the pressurizing section composed of the diaphragm 22 and the piezoelectric element 23, and can realize a liquid discharge head with suppressed deterioration in discharge performance compared to the comparative example.

[0048] [Example 3] Figure 7 is a schematic diagram of a piezoelectric element wafer 100 on which multiple actuator substrates 20 are formed. As shown in Figure 7, multiple actuator substrates 20 (chips) are formed on the piezoelectric element wafer 100 by the processes (a) to (e) described above for the manufacturing of the liquid discharge head 1. The multiple actuator substrates 20 on the piezoelectric element wafer 100 are then separated into individual pieces by dicing.

[0049] Figure 8(a) shows an example of the average discharge velocity distribution of a liquid discharge head using the actuator substrate 20 at the position opposite to the orientation flat 100a side of the piezoelectric element wafer 100 (position "T"). Figure 8(b) shows an example of the average discharge velocity distribution of a liquid discharge head using the actuator substrate 20 at the center position of the piezoelectric element wafer 100 (position "C"). Figure 8(c) shows an example of the average discharge velocity distribution of a liquid discharge head using the actuator substrate 20 at the orientation flat 100a side of the piezoelectric element wafer 100 (position "O").

[0050] The average discharge velocity distribution shown in Figure 8 is obtained by averaging the discharge velocity distributions measured using a dedicated measuring device, with several hundred actuator substrates 20 acting as heads at different positions (T, C, O) on the piezoelectric element wafer 100. Alternatively, the discharge velocity distribution of the actuator substrates at each position may be predicted by measuring the vibration frequency of the actuator substrates 20.

[0051] As shown in Figure 8(a), for the actuator substrate 20 at position "T" shown in Figure 7, the discharge speed tends to gradually increase from one end (left side in the figure) to the other end in the nozzle arrangement direction. As shown in Figure 8(b), the ejection speed of the actuator substrate 20 at position "C" shown in Figure 7 tends to be almost constant. As shown in Figure 8(c), for the actuator substrate 20 at position "O" shown in Figure 7, the discharge speed tends to gradually decrease from one end (left side in the figure) to the other end in the nozzle arrangement direction.

[0052] In the aforementioned manufacturing process, the piezoelectric element wafer 100 develops a concentric characteristic distribution (from the center to the outer edge) due to factors such as the direction of process gas supply in the CVD method, the temperature distribution of the substrate on the sputtering / etching stage, and the influence of the coating method using spincodes, etc. For example, the thickness of the diaphragm 22 gradually increases in a concentric pattern.

[0053] Due to this characteristic distribution, in liquid discharge heads using actuator substrates 20 at positions "T" and "O" as shown in Figure 7, the discharge speed tends to increase or decrease monotonically from one end (left side in the figure) to the other end in the nozzle arrangement direction.

[0054] As explained using Figure 3, the actuator member 2 is subjected to thermal stress at the adhesive interface in the direction indicated by arrow A in Figure 3 due to the difference in thermal contraction between it and the frame member 3. This thermal stress compresses the diaphragm 22 in a loosening direction. As a result, the displacement of the piezoelectric element 23 becomes larger than when the diaphragm 22 is taut. The increased displacement of the piezoelectric element 23 leads to an increase in the discharge speed.

[0055] Therefore, in Embodiment 3, the amount of compression of the diaphragm 22 at each position in the nozzle arrangement direction is controlled by the gap 3b provided in the frame member 3, thereby suppressing the discharge velocity distribution due to the influence of the actuator substrate 20. A detailed explanation follows with reference to the drawings.

[0056] Figure 9 illustrates an example of the liquid discharge head 1C of Example 3, where (a) is a schematic cross-sectional view, (b) is a diagram illustrating the formation position of the void 3b, and (c) is a diagram illustrating the arrangement region of the piezoelectric element 23 on the actuator substrate 20. In Example 3, the gap 3b is made into a concave cross-sectional shape with an opening only on the side 3f opposite to the joining surface 3d of the frame member 3, making it easier for thermal stress to be applied to the actuator member 2 due to the difference in thermal contraction between it and the frame member 3. Furthermore, by making the gap 3b into a concave cross-sectional shape with an opening only on the side 3f opposite to the joining surface of the frame member 3, the degree of freedom in the layout of the flow path of the actuator member 2 can be increased. In addition, a decrease in the bonding area between the actuator member 2 and the frame member 3 can be suppressed, and a decrease in sealing performance can be suppressed.

[0057] By making the gap portion 3b a concave cross-sectional shape, the reduction in rigidity of the frame member 3 can be suppressed compared to a configuration with a through-hole gap. As a result, in Embodiment 3 as well, the actuator member 2 can be effectively reinforced by the frame member 3, and deformation of the actuator member 2 due to external forces can be suppressed.

[0058] As shown in Figures 9(b) and 9(c), the communication holes 3a that communicate with the common liquid chamber are formed on both sides of the frame member 3 in the short direction so as not to overlap with the piezoelectric element arrangement area 31 of the actuator substrate 20. The void 3b is provided in the center in the short direction, and as shown in Figure 9(c), the void 3b is provided so as to overlap with the piezoelectric element arrangement area 31 of the actuator substrate 20. The void 3b may extend beyond the piezoelectric element arrangement area 31.

[0059] In Example 3, the liquid discharge head uses the actuator substrate 20 at position T as shown in Figure 7. By using the actuator substrate 20 at position T, the discharge speed tends to gradually increase monotonically from one end (left side in the figure) to the other end in the nozzle arrangement direction.

[0060] In Example 3, based on the trend of discharge speed, the gap 3b was gradually deepened from one end (left side in the figure) in the nozzle arrangement direction to the other end, and the cross-sectional area perpendicular to the short side of the gap 3b (hereinafter simply referred to as the cross-sectional area) was monotonically increased. By shaping the cross-sectional area of ​​the gap 3b in this way, the volume of the frame member 3 gradually decreases from one end (left side in the figure) in the nozzle arrangement direction, and the amount of thermal contraction of the frame member 3 gradually decreases. As a result, at one end (left side in the figure) in the nozzle arrangement direction where the amount of thermal contraction of the frame member 3 is large, the amount of loosening of the diaphragm 22 increases, the amount of displacement of the piezoelectric element 23 increases, and the discharge speed increases. On the other hand, at the other end (right side in the figure) in the nozzle arrangement direction where the amount of thermal contraction of the frame member 3 is small, the loosening of the diaphragm 22 is small, the amount of displacement of the piezoelectric element 23 is almost negligible, and the discharge speed is almost negligible. Therefore, as shown in Figure 9, by monotonically increasing the cross-sectional area of ​​the void 3b, the discharge velocity distribution due to the influence of the void 3b (the effect of thermal contraction of the frame member 3) becomes monotonically decreasing.

[0061] As a result, as shown in Figure 10(a), the discharge velocity distribution, which initially shows a gradual increase from one end (left side in the figure) in the nozzle arrangement direction due to the influence of the actuator substrate 20, can be made to a nearly constant discharge velocity distribution as shown in Figure 10(b) due to the influence of the gap 3b (the effect of thermal contraction of the frame member 3).

[0062] Furthermore, as shown in Figure 9(c), when viewed from the liquid discharge direction, the communication hole 3a is formed so as not to overlap with the piezoelectric element arrangement region 31. This suppresses the influence of the structure of the communication hole 3a on the thermal stress applied to the adhesive interface of the piezoelectric element arrangement region 31. Therefore, it is no longer necessary to set the shape (cross-sectional area) of the void portion 3b considering the structure of the communication hole 3a, and the shape (cross-sectional area) of the void portion 3b that maintains a constant discharge velocity distribution can be easily set.

[0063] Furthermore, as shown in Figure 9(c), the void 3b is provided so as to overlap the piezoelectric element arrangement region 31 when viewed from the liquid discharge direction. As a result, the structure of the void 3b greatly affects the thermal stress on the adhesive interface of the piezoelectric element arrangement region 31, and the amount of thermal contraction of the actuator member 2 at that location can be well controlled by the shape (cross-sectional area) of the void 3b. This makes it possible to well suppress variations in discharge speed due to the characteristics of the actuator substrate 20 by the shape (cross-sectional area) of the void 3b.

[0064] The above description concerns the case where the actuator substrate 20 at position T shown in Figure 7 is used. When the actuator substrate 20 at position O shown in Figure 7 is used, the gap 3b is made progressively shallower from one end (left side in the figure) in the nozzle arrangement direction to the other end. This results in a gap with a monotonically decreasing cross-sectional area. Then, the frame member 3 having the gap with a monotonically decreasing cross-sectional area is joined to the actuator substrate 20. As a result, variations in discharge speed can be suppressed by the gap 3b.

[0065] When the actuator substrate 20 at position C shown in Figure 7 is used, a frame member 3 having a constant gap in the nozzle arrangement direction with a cross-sectional area is joined to the actuator member 2. This suppresses variations in discharge speed.

[0066] Thus, in Example 3, the thermal stress on the actuator member 2 can be reduced while maintaining the rigidity of the frame member 3, and variations in the discharge speed can be suppressed.

[0067] In Example 3, for example, three frame members are prepared: a frame member for position "T" having a gap 3b whose cross-sectional area monotonically increases from one end (left side in the figure) to the other end in the nozzle arrangement direction; a frame member for position "O" having a gap 3b whose cross-sectional area monotonically decreases from one end (left side in the figure) to the other end in the nozzle arrangement direction; and a frame member 3 for position "C" having a gap with a constant cross-sectional area in the nozzle arrangement direction. Then, based on the position of the piezoelectric element wafer 100 on the actuator substrate 20, one of the three frame members 3 is selected and bonded to the actuator substrate 20. This makes it possible to suppress variations in discharge speed caused by differences in the characteristic distribution depending on the position of the piezoelectric element wafer 100 on the actuator substrate 20.

[0068] Note that the shape of the void 3b shown in Figure 9 is just one example. Depending on the average ejection speed distribution due to the characteristics of the actuator substrate 20 at each position (O, C, T) of the piezoelectric element wafer 100, the void can be formed by appropriately combining regions with a monotonically increasing cross-sectional area, regions with a constant cross-sectional area, and regions with a monotonically decreasing cross-sectional area.

[0069] For example, depending on the manufacturing method of the piezoelectric element wafer 100, when the actuator substrate 20 at position "C" of the piezoelectric element wafer 100 is used, the discharge velocity distribution may be as shown in Figure 11(b) and Figure 12(b).

[0070] When using an actuator substrate 20 with characteristics such as the discharge velocity on both sides in the nozzle arrangement direction shown in Figure 11(b) gradually decreasing towards the ends and the discharge velocity in the center remaining almost constant, a frame member 3 is used that has a gap 3b with the cross-sectional area shown in Figure 11(a). The gap 3b of the frame member 3 shown in Figure 11(a) is a region 3b1 on one end (left side in the figure) in the nozzle arrangement direction where the cross-sectional area increases monotonically towards the center, the center is a region 3b2 where the cross-sectional area is constant, and the other end (right side in the figure) in the nozzle arrangement direction is a region 3bb where the cross-sectional area decreases monotonically towards the other end.

[0071] Furthermore, as shown in Figure 12(b), when using an actuator substrate 20 having characteristics such that the discharge speed on both sides in the nozzle arrangement direction gradually decreases towards the ends, and the discharge speed in the center remains almost constant, a frame member 3 with a gap as shown in Figure 12(a) is used. That is, a gap 3b is provided at one end (left side in the figure) and the other end (right side in the figure) in the nozzle arrangement direction. The gap 3b at one end (left side in the figure) in the nozzle arrangement direction has a cross-sectional area that decreases monotonically towards the center, while the gap 3b at the other end (right side in the figure) in the nozzle arrangement direction has a cross-sectional area that increases monotonically towards the other end.

[0072] Furthermore, depending on the manufacturing method of the piezoelectric element wafer 100, when the actuator substrate 20 at the "T" or "O" position of the piezoelectric element wafer 100 is used, the discharge velocity distribution may be as shown in Figures 13(b) and 14(b).

[0073] When using an actuator substrate 20 having a discharge velocity distribution where the discharge velocity at one end (left side in the figure) in the nozzle arrangement direction shown in Figure 13(b) is almost constant, and the discharge velocity from the center to the other end (right side in the figure) gradually decreases as it approaches the other end, a frame member 3 with a gap portion as shown in Figure 13(a) is used. That is, the frame member has a gap portion 3b at one end (left side in the figure) in the nozzle arrangement direction, where the cross-sectional area is a constant region 3b2, and the cross-sectional area decreases monotonically as it approaches the other end from the center 3b3.

[0074] Furthermore, when using an actuator substrate 20 having a discharge velocity distribution characteristic in which a region where the discharge velocity gradually increases from one end (left side in the figure) toward the other end in the nozzle arrangement direction, as shown in Figure 14(b), alternates with a region where the discharge velocity is almost constant, a frame member 3 with a gap portion as shown in Figure 14(a) is used. That is, a frame member having a gap portion 3b in which a region 3b1 in which the cross-sectional area monotonically increases toward the other end in the nozzle arrangement direction alternates with a region 3b2 in which the cross-sectional area is constant.

[0075] The above is just one example, and the gap 3b of the frame member 3 can be set appropriately based on the average discharge speed distribution of the actuator substrate 20 at each position of the piezoelectric element wafer 100, which has been determined in advance through experiments.

[0076] Furthermore, the void 3b of the frame member 3 in Embodiment 3 may be a closed space without an opening, or a void with a concave cross-section that opens only on the joint surface 3d side. Even with such a void, the reduction in rigidity of the frame member 3 can be suppressed compared to a configuration with a through-hole void. As a result, in Embodiment 3 as well, the actuator member 2 can be effectively reinforced by the frame member 3, and deformation of the actuator member 2 due to external forces can be suppressed.

[0077] Next, an embodiment of an inkjet recording device, which is a liquid ejection device equipped with the liquid ejection heads of Examples 1 to 3 described above as inkjet heads, will be explained.

[0078] Figure 15 is a side view illustrating the mechanism of the inkjet recording device according to this embodiment. In this embodiment, the inkjet recording device houses a printing mechanism 82, which consists of a carriage movable in the main scanning direction, an inkjet head (recording head) mounted on the carriage, and an ink cartridge that supplies liquid ink to the recording head, inside the main body 81 of the device. A paper feed cassette (or paper feed tray) 84 capable of holding multiple sheets of paper 83 can be attached to the bottom of the main body 81 in a removable manner. A manual feed tray 85 for manually feeding paper 83 can also be opened and closed. Paper 83 fed from the paper feed cassette 84 or manual feed tray 85 is taken in, an image is recorded by the printing mechanism 82, and then the paper is discharged into the output tray 86.

[0079] The printing mechanism 82 holds the carriage 93 so that it can slide freely in the main scanning direction using a main guide rod 91 and a secondary guide rod 92, which are guide members horizontally mounted on the left and right side plates. The carriage 93 is equipped with a liquid ejection head 1 that ejects ink of each color: yellow (Y), cyan (C), magenta (M), and black (Bk). The liquid ejection head 1 has a nozzle row in which multiple nozzle holes are arranged in a direction intersecting the main scanning direction, and is mounted on the carriage 93 so that the ink ejection direction faces downward. In addition, the carriage 93 is equipped with replaceable ink cartridges 95 for supplying ink of each color to the liquid ejection head 1.

[0080] The ink cartridge 95 has an air port at the top that communicates with the atmosphere, a supply port at the bottom that supplies ink to the liquid ejection head 1, and a porous body filled with ink inside. The capillary action of the porous body maintains a slight negative pressure for the ink supplied to the liquid ejection head 1. Although the liquid ejection head 1 is provided individually for each color, it may also be composed of a single recording head.

[0081] Here, the carriage 93 is slidably fitted onto the main guide rod 91 on its downstream side in the paper transport direction, and slidably mounted on the secondary guide rod 92 on its upstream side in the paper transport direction. To move and scan this carriage 93 in the main scanning direction, a timing belt 130 is stretched between a drive pulley 98 and a driven pulley 99, which are rotated by the main scanning motor 97, and this timing belt 130 is fixed to the carriage 93, so that the carriage 93 is driven back and forth by the forward and reverse rotation of the main scanning motor 97.

[0082] On the other hand, in order to transport the paper 83 set in the paper feed cassette 84 to the lower side of the liquid discharge head 1, a paper feed roller 131 and friction pad 132 are provided to separate and feed the paper 83 from the paper feed cassette 84, a guide member 133 is provided to guide the paper 83, a transport roller 134 is provided to invert and transport the fed paper 83, a transport roller 135 is provided to be pressed against the circumferential surface of the transport roller 134, and a tip roller 136 is provided to define the feeding angle of the paper 83 from the transport roller 134. The transport roller 134 is rotationally driven by a sub-scanning motor 137 via a gear train.

[0083] Furthermore, a print receiving member 139, which is a paper guide member, is provided to guide the paper 83, which is fed out from the transport roller 134 in accordance with the movement range of the carriage 93 in the main scanning direction, below the liquid discharge head 1. Downstream of this print receiving member 139 in the paper transport direction, a transport roller 141 and a spur 142 are provided, which are rotationally driven to feed the paper 83 in the paper discharge direction. In addition, a paper discharge roller 143 and a spur 144 that feed the paper 83 to the paper discharge tray 86, and guide members 145 and 146 that form the paper discharge path are also provided.

[0084] During recording, the liquid ejection head 1 is driven in accordance with the image signal while the carriage 93 is moved, ejecting ink onto the stationary paper 83 to record one line. After a predetermined amount of paper 83 has been transported, the next line is recorded. Upon receiving a recording completion signal or a signal indicating that the rear end of the paper 83 has reached the recording area, the recording operation is terminated and the paper 83 is ejected.

[0085] Furthermore, a recovery device 147 is positioned outside the recording area on the right end of the carriage 93's direction of movement to recover from any ejection problems with the liquid ejection head 1. The recovery device 147 includes a capping mechanism, a suction mechanism, and a cleaning mechanism. While waiting to print, the carriage 93 is moved towards the recovery device 147, where the liquid ejection head 1 is capped by the capping mechanism, keeping the nozzle holes moist and preventing ejection problems due to ink drying. Additionally, by ejecting ink unrelated to recording during the recording process, the ink viscosity at all nozzle holes is kept constant, maintaining stable ejection performance.

[0086] In the event of a dispensing malfunction, the nozzle hole of the liquid dispensing head 1 is sealed by a capping mechanism, and air bubbles and other debris are sucked out of the nozzle hole along with the ink through a tube by a suction mechanism. Any ink or debris adhering to the nozzle surface is removed by a cleaning mechanism, and the dispensing malfunction is resolved. The sucked-up ink is discharged into a waste ink reservoir located at the bottom of the main unit and absorbed and retained by an ink absorber inside the waste ink reservoir.

[0087] In the inkjet recording apparatus of this embodiment, by incorporating a liquid ejection head 1 consisting of the liquid ejection heads 1 of the above-described embodiments 1 and 2, stable ink ejection characteristics are obtained and image quality is improved.

[0088] Figure 16 is a schematic diagram of a printing apparatus 500 as another example of an inkjet recording apparatus. Figure 17 is a plan view illustrating an example of a head unit of the printing apparatus 500.

[0089] The printing apparatus 500 shown in Figure 16 includes a loading means 501 for loading the continuous body 510, and a guiding and transporting means 503 for guiding and transporting the continuous body 510 loaded from the loading means 501 to the printing means 505. The printing apparatus 500 also includes a printing means 505 for printing an image by discharging liquid onto the continuous body 510, a drying means 507 for drying the continuous body 510, and an unloading means 509 for unloading the continuous body 510.

[0090] The continuous body 510 is fed out from the main winding roller 511 of the loading means 501, guided and transported by the rollers of the loading means 501, the guiding and transporting means 503, the drying means 507, and the unloading means 509, and then wound up by the winding roller 591 of the unloading means 509. In the printing means 505, this continuous body 510 is transported on the transport guide member 559 facing the head unit 550, and an image is printed by the liquid discharged from the head unit 550.

[0091] In the printing apparatus 500 shown in Figure 16, the head unit 550 is equipped with two head modules 100A and 100B on a common base member 552.

[0092] Then, when the direction in which the liquid discharge heads 1 are arranged in a direction perpendicular to the transport direction of head modules 100A and 100B is defined as the head array direction, the head rows 1A1 and 1A2 of head module 100A discharge liquid of the same color. Similarly, the head rows 1B1 and 1B2 of head module 100A are paired, the head rows 1C1 and 1C2 of head module 100B are paired, and the head rows 1D1 and 1D2 are paired, and the required color liquid is discharged from each.

[0093] Next, further examples (modified versions) of the inkjet recording apparatus as a liquid ejection device according to this embodiment will be described with reference to Figures 18 and 19. Figure 18 is a plan view illustrating the main components of the inkjet recording apparatus of this modified example. Figure 19 is a side view illustrating the main components of the inkjet recording apparatus of this modified example.

[0094] The inkjet recording device in this modified example is a serial type device, and the carriage 403 reciprocates in the main scanning direction by the main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, etc. The guide member 401 is stretched across the left and right side plates 491A and 491B and holds the carriage 403 in a movable position. The carriage 403 is then reciprocated in the main scanning direction by the main scanning motor 405 via a timing belt 408 stretched between a drive pulley 406 and a driven pulley 407.

[0095] The carriage 403 is equipped with a liquid discharge unit 440 that integrates the liquid discharge head 1 and head tank 441 according to the above-described embodiment. The liquid discharge head 1 of the liquid discharge unit 440 discharges liquids of various colors, such as yellow (Y), cyan (C), magenta (M), and black (K). The liquid discharge head 1 is also mounted with a nozzle row consisting of multiple nozzles arranged in a sub-scanning direction perpendicular to the main scanning direction, and with the discharge direction facing downwards.

[0096] A supply mechanism 494 for supplying liquid stored outside the liquid discharge head 1 to the liquid discharge head 1 supplies the head tank 441 with liquid stored in the liquid cartridge 450.

[0097] The supply mechanism 494 consists of a cartridge holder 451, which is a filling section for mounting the liquid cartridge 450, a tube 456, a liquid delivery unit 452 including a liquid delivery pump, and the like. The liquid cartridge 450 is detachably mounted in the cartridge holder 451. Liquid is delivered from the liquid cartridge 450 to the head tank 441 via the tube 456 by the liquid delivery unit 452.

[0098] The inkjet recording device of this modified example includes a transport mechanism 495 for transporting paper 410. The transport mechanism 495 includes a transport belt 412, which is a transport means, and a sub-scanning motor 416 for driving the transport belt 412.

[0099] The conveyor belt 412 attracts the paper 410 and transports it to a position opposite the liquid discharge head 404. This conveyor belt 412 is an endless belt and is stretched between the conveyor roller 413 and the tension roller 414. Attraction can be performed by electrostatic attraction or air suction.

[0100] Then, the conveyor belt 412 moves in a circular motion in the sub-scanning direction as the conveyor rollers 413 are rotationally driven by the sub-scanning motor 416 via the timing belt 417 and timing pulley 418.

[0101] Furthermore, a maintenance and recovery mechanism 420 for maintaining and recovering the liquid discharge head 1 is positioned on one side of the carriage 403 in the main scanning direction, next to the conveyor belt 412.

[0102] The maintenance and recovery mechanism 420 consists of, for example, a cap member 421 that caps the nozzle surface (the surface on which the nozzle is formed) of the liquid discharge head 1, and a wiper member 422 that wipes the nozzle surface.

[0103] The main scanning movement mechanism 493, the supply mechanism 494, the maintenance and recovery mechanism 420, and the transport mechanism 495 are mounted on a housing that includes side plates 491A, 491B, and a back plate 491C.

[0104] In this configured device, the paper 410 is fed onto the transport belt 412 and picked up, and the paper 410 is transported in the sub-scanning direction by the circumferential movement of the transport belt 412.

[0105] Therefore, by moving the carriage 403 in the main scanning direction and driving the liquid ejection head 1 in accordance with the image signal, liquid is ejected onto the stationary paper 410 to form an image.

[0106] Thus, by using the liquid ejection head 1 of the inkjet recording apparatus in this modified example as the liquid ejection head of Examples 1 to 3 described above, high-quality images can be stably formed.

[0107] Next, another example of the liquid discharge unit in this embodiment will be described with reference to Figure 20. Figure 20 is a plan view illustrating the main components of the liquid dispensing unit. This liquid ejection unit consists of a housing portion comprising side plates 491A, 491B and a back plate 491C, which are components of the inkjet recording device described above, a main scanning movement mechanism 493, a carriage 403, and a liquid ejection head 404. Furthermore, a liquid ejection unit can be configured by further attaching, for example, the side plate 491B of this liquid ejection unit to at least one of the aforementioned maintenance and recovery mechanism 420 and supply mechanism 494.

[0108] Next, yet another example of the liquid dispensing unit in this embodiment will be described with reference to Figure 21. Figure 21 is a front view diagram of the liquid dispensing unit. This liquid discharge unit consists of a liquid discharge head 1 to which a flow path component 444, which is a liquid supply member, is attached, and a tube 456 connected to the flow path component 444. The flow path component 444 is located inside a cover 442. A head tank 441 can also be included instead of the flow path component 444. A connector 443 for electrical connection to the liquid discharge head 404 is provided on the upper part of the flow path component 444.

[0109] In this application, the discharged liquid is not particularly limited as long as it has a viscosity and surface tension that can be discharged from the head, but it is preferable that its viscosity becomes 30 [mPa·s] or less at room temperature and atmospheric pressure, or when heated or cooled. More specifically, it is a solution, suspension, emulsion, or molten metal such as solder containing a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a polymerizable compound, a resin, a functional material such as a surfactant, a biocompatible material such as DNA, amino acids or proteins, calcium, or an edible material such as a natural pigment. These can be used, for example, as inkjet inks, surface treatment liquids, liquids for forming components of electronic elements and light-emitting elements or electronic circuit resist patterns, liquids for forming solder bumps, and material liquids for 3D modeling.

[0110] A "liquid dispensing unit" is a liquid dispensing head with integrated functional components and mechanisms, and includes an assembly of parts related to liquid dispensing. For example, a "liquid dispensing unit" may include a combination of a liquid dispensing head with at least one of the following components: a head tank, carriage, supply mechanism, maintenance and recovery mechanism, and main scanning and moving mechanism.

[0111] Here, integration includes, for example, cases where the liquid dispensing head and functional components or mechanisms are fixed to each other by fastening, bonding, engaging, etc., or where one is held movably relative to the other. Furthermore, the liquid dispensing head and functional components or mechanisms may be configured to be detachable from each other.

[0112] For example, some liquid dispensing units have a liquid dispensing head and head tank integrated into one unit. Others have a liquid dispensing head and head tank integrated into one unit, connected to each other by tubes or similar means. In these liquid dispensing units, a unit including a filter can also be added between the head tank and the liquid dispensing head.

[0113] Additionally, some liquid dispensing units have an integrated liquid dispensing head and carriage.

[0114] Furthermore, some liquid dispensing units integrate the liquid dispensing head and the scanning mechanism by movably holding the liquid dispensing head in a guide member that constitutes part of the scanning mechanism. Others integrate the liquid dispensing head, carriage, and main scanning mechanism.

[0115] Furthermore, some liquid dispensing units integrate the liquid dispensing head, carriage, and maintenance / recovery mechanism by fixing a cap component, which is part of the maintenance / recovery mechanism, to a carriage to which the liquid dispensing head is attached.

[0116] Furthermore, some liquid discharge units have a head tank or a liquid discharge head to which flow path components are attached, to which a tube is connected, integrating the liquid discharge head and the supply mechanism. Through this tube, the liquid from the liquid storage source is supplied to the liquid discharge head.

[0117] The main scanning movement mechanism shall include the guide member alone. The supply mechanism shall also include the tube alone and the loading section alone.

[0118] "A device for dispensing liquid" includes devices equipped with a liquid dispensing head or liquid dispensing unit, which dispensing liquid by driving the liquid dispensing head. A device for dispensing liquid includes not only devices capable of dispensing liquid onto surfaces to which liquid can adhere, but also devices that dispensing liquid into air or into liquid.

[0119] This "liquid dispensing device" may also include means for feeding, transporting, and dispensing paper onto materials to which liquid can adhere, as well as pre-treatment devices, post-treatment devices, etc.

[0120] For example, "devices that dispense liquids" include image forming machines, which dispense ink to form images on paper, and three-dimensional molding machines, which dispense molding liquid into a powder layer formed in layers to create three-dimensional objects.

[0121] Furthermore, "devices that dispense liquid" are not limited to those that visualize meaningful images such as letters or figures through the dispensed liquid. For example, devices that form patterns that do not have meaning in themselves, or devices that create three-dimensional images, are also included.

[0122] The term "material to which liquid can adhere" refers to any material to which liquid can adhere, at least temporarily, including materials that adhere and solidify, or materials that adhere and penetrate. Specific examples include recording media such as paper, recording paper, film, and cloth; electronic components such as electronic circuit boards and piezoelectric elements; powder layers; organ models; and inspection cells. Unless otherwise specified, it includes all materials to which liquid can adhere.

[0123] The materials referred to as "materials to which liquid can adhere" can be anything that allows liquid to adhere, even temporarily, such as paper, thread, fibers, fabrics, leather, metal, plastic, glass, wood, or ceramics.

[0124] Furthermore, "liquid dispensing devices" include devices in which the liquid dispensing head and the surface to which the liquid can adhere move relative to each other, but are not limited to these. Specific examples include serial-type devices in which the liquid dispensing head moves, and line-type devices in which the liquid dispensing head does not move.

[0125] Other examples of "devices that dispense liquids" include processing liquid coating devices that dispense processing liquid onto the surface of paper for purposes such as modifying the surface of the paper, and injection granulation devices that granulate fine particles of raw materials by spraying a compositional solution, in which raw materials are dispersed in a solution, through a nozzle.

[0126] In this application, the terms image formation, recording, printing, copying, printing, and shaping are all considered synonymous.

[0127] Although preferred embodiments of the present invention have been described above, the present invention is not limited to these specific embodiments, and various modifications and changes are possible within the scope of the spirit of the present invention as described in the claims, unless otherwise specifically limited in the above description.

[0128] The above is just one example; each of the following embodiments produces its own unique effects. (Aspect 1) In a liquid discharge head 1, a substrate component such as an actuator member 2 is laminated on a substrate such as a pressurized liquid chamber substrate 21, which has a liquid chamber such as a pressurized liquid chamber 21b that communicates with a nozzle, such as a nozzle hole 10a, and has a diaphragm 22 that forms part of the wall surface of the liquid chamber, and a piezoelectric element 23 laminated on the side of the diaphragm 22 opposite to the side that forms the wall surface of the liquid chamber, and a reinforcing member such as a frame member 3 that has a communication part such as a communication hole 3a that communicates with the liquid chamber and is joined to the substrate component by adhesive 50, the reinforcing member has a plurality of voids 3b in addition to the communication part. Generally, substrate components such as actuator members 2 are mainly made of silicon, while reinforcing members such as frame members 3 are made of resin materials with a higher coefficient of thermal expansion than the substrate components. Thus, because the coefficient of thermal expansion of the reinforcing members is greater than that of the substrate components, the amount of thermal expansion and contraction of the reinforcing members is greater than that of the substrate components. Thermosetting adhesives are generally used to join the substrate components and reinforcing members, and after the substrate components and reinforcing members are joined by heating and curing the adhesive, when the substrate components and reinforcing members are returned to room temperature, the amount of thermal contraction of the reinforcing members is greater than that of the substrate components. As a result, stress (hereinafter referred to as thermal stress) that tries to cause the substrate components to contract is generated through the joint between the substrate components and the reinforcing members. This thermal stress can change the rigidity of the diaphragm 22 and piezoelectric element 23 of the substrate components, which may affect the liquid discharge performance from the nozzle, such as the nozzle hole 10a. As described in Patent Document 1, by making the reinforcing member, such as a reinforcing frame, into a frame shape and having a large rectangular through-hole void in the reinforcing member, the volume of the reinforcing member can be reduced and the amount of thermal shrinkage of the reinforcing member can be suppressed. This can reduce the thermal stress on the substrate component. However, the reinforcing member in Patent Document 1 has low rigidity and may not be able to properly reinforce the substrate component, and may not be able to suppress deformation due to external forces. In contrast, in embodiment 1, the reinforcing member is configured to have multiple voids. This allows the reinforcing member to be reinforced by partitions 3e that separate the voids, thereby ensuring the rigidity of the reinforcing member. As a result, compared to a frame-shaped reinforcing member with a large through-hole in the center, the reinforcing member can better reinforce the substrate component and suppress deformation of the substrate component due to external forces. Furthermore, having multiple voids 3b reduces the volume of the reinforcing member, and after joining the reinforcing member to the substrate component, it is possible to suppress the amount of thermal shrinkage of the reinforcing member when it returns to room temperature. As a result, thermal stress on the substrate component can be reduced, changes in the rigidity of the diaphragm 22 and piezoelectric element 23 can be suppressed, and a decrease in liquid discharge performance can be suppressed.

[0129] (Aspect 2) In embodiment 1, multiple void portions 3b are formed in the longitudinal direction of the liquid discharge head. According to this, compared to the case where multiple voids are formed in the short direction of the liquid discharge head as described in Example 1, the rigidity of the frame member 3 can be ensured and the volume of the frame member 3 can be reduced.

[0130] (Aspect 3) In embodiment 1 or 2, the multiple voids 3b have openings in the joining surface 3d that joins the reinforcing member, such as the frame member 3, to a substrate component such as the actuator member 2. According to this, as explained in Example 1, thermal shrinkage on the joint surface side of reinforcing members such as frame member 3 can be reduced. This makes it possible to reduce thermal stress on substrate components such as actuator member 2 through the joint.

[0131] (Aspect 4) In embodiment 3, at least one of the multiple voids is a through-void 3b-1 that penetrates a reinforcing member such as a frame member 3, and the other voids are voids 3b-2 with a concave cross-section that open only to the joint surface 3d. According to this, as explained in Example 2, thermal shrinkage on the joint surface side of reinforcing members such as frame member 3 can be reduced, and the reduction in rigidity of the reinforcing members can be suppressed compared to the case where all of the multiple voids are through-voids that penetrate the reinforcing members such as frame member 3.

[0132] (Aspect 5) In embodiment 4, the gap 3b-1 that penetrates the reinforcing member such as the frame member 3 is provided at the center of the liquid discharge head 1 in the longitudinal direction. According to this, as explained in Example 2, the balance of rigidity of reinforcing members such as frame member 3 can be improved.

[0133] (Aspect 6) In embodiment 5, a sealant 3c that seals electrical components such as the thermistor 29 exposed from the through-void 3b-1 is filled into the through-void 3b-1. According to this, as explained in Example 2, electrical components such as the thermistor 29 can be protected from moisture and other elements.

[0134] (Aspect 7) In embodiment 6, the encapsulant 3c on the substrate component side, such as the actuator member 2, is in an uncured state. According to this, as explained in Example 2, the stress caused by the curing shrinkage of the encapsulant 3c on the substrate component side can be prevented from being applied to the substrate component, thereby suppressing any impact on the ejection performance.

[0135] (Pattern 8) In any of embodiments 4 to 7, the depth L2 of the void portion 3b-2 with a concave cross-section is 1 / 3 or more of the length L1 of the reinforcing member such as the frame member 3 in the direction perpendicular to the joint surface 3d. According to this, as explained in Example 2, thermal shrinkage on the joint surface 3d side of reinforcing members such as frame member 3 can be effectively suppressed, and the decrease in liquid discharge performance due to thermal force acting on substrate components such as actuator member 2 can be suppressed.

[0136] (Aspect 9) In a liquid discharge head 1, a substrate component such as an actuator member 2 is laminated on a substrate such as a pressurized liquid chamber substrate 21, which has a liquid chamber such as a pressurized liquid chamber 21b that communicates with a nozzle, such as a nozzle hole 10a, and laminated on the substrate component having a diaphragm 22 that forms part of the wall surface of the liquid chamber and a piezoelectric element 23 laminated on the side of the diaphragm 22 opposite to the side that forms the wall surface of the liquid chamber, and a reinforcing member such as a frame member 3 that has a communicating part such as a communicating hole 3a that communicates with the liquid chamber and is joined to the substrate component by adhesive 50, the reinforcing member has a void with a concave cross-section or a closed void. According to this, compared to a frame-shaped reinforcing member having a large through-hole in the center, as described in Example 3, the reinforcing member can better reinforce the substrate component and suppress deformation of the substrate component due to external forces. Furthermore, having multiple voids 3b reduces the volume of the reinforcing member, and after joining the reinforcing member to the substrate component, it is possible to suppress the amount of thermal shrinkage of the reinforcing member when it returns to room temperature. As a result, thermal stress on the substrate component can be reduced, changes in the rigidity of the diaphragm 22 and piezoelectric element 23 can be suppressed, and a decrease in liquid discharge performance can be suppressed.

[0137] (Aspect 10) In embodiment 9, the void portion includes at least one of the regions in which the cross-sectional area of ​​a cross section perpendicular to the orthogonal direction, which is perpendicular to both the nozzle arrangement direction and the liquid discharge direction of the nozzles, monotonically increases as you move from one end to the other in the nozzle arrangement direction, and the region in which the cross-sectional area monotonically decreases as you move from one end to the other in the nozzle arrangement direction. As described in Example 3, multiple substrates (actuator substrates 20) for substrate components such as actuator member 2 are formed on the piezoelectric element wafer 100. Then, deviations such as the thickness of the diaphragm occur concentrically on the piezoelectric element wafer. As a result, the substrates (actuator substrates 20) formed at the edge side of the piezoelectric element wafer are prone to having regions where the liquid discharge velocity distribution from the nozzle increases or decreases monotonically from one end to the other in the nozzle arrangement direction, due to the characteristics such as the thickness deviation of the diaphragm. In the nozzle arrangement direction, the amount of thermal contraction of supplementary members such as the frame member 3 is large, and the diaphragm 22 at that point is compressed in a loosening direction. As the diaphragm 22 loosens, the amount of displacement of the piezoelectric element 23 at that point becomes larger than when the diaphragm 22 is taut, and the discharge speed at that point increases. As the cross-sectional area of ​​the section perpendicular to the orthogonal direction, which is perpendicular to both the nozzle arrangement direction and the liquid discharge direction of the nozzles, narrows, the volume of the reinforcing member at that point increases, and the amount of thermal contraction of the reinforcing member increases. As a result, the loosening of the diaphragm 22 increases, and the discharge speed at that point increases. Therefore, in the nozzle arrangement direction, by monotonically increasing the cross-sectional area of ​​the gap from one end to the other in the nozzle arrangement direction, the discharge speed distribution due to the thermal contraction of the reinforcing member decreases monotonically. On the other hand, in the nozzle arrangement direction, by monotonically decreasing the cross-sectional area of ​​the gap from one end to the other in the nozzle arrangement direction, the discharge speed distribution due to the thermal contraction of the reinforcing member increases monotonically. Therefore, by making the region where the discharge speed monotonically increases from one end to the other in the nozzle arrangement direction and the region of the gap at the same position in the arrangement direction into a region where the cross-sectional area monotonically decreases from one end to the other, variations in discharge speed due to the characteristics of the substrate component's substrate (actuator substrate 20) can be suppressed. Furthermore, by making the region where the discharge speed monotonically decreases from one end to the other in the nozzle arrangement direction and the region of the gap at the same position in the arrangement direction into a region where the cross-sectional area monotonically increases from one end to the other, variations in discharge speed due to the characteristics of the substrate component's substrate (actuator substrate 20) can be suppressed. In this way, by providing the gap with at least one of a region that monotonically increases and a region that monotonically decreases as you move from one end to the other in the nozzle arrangement direction, it is possible to suppress variations in discharge speed due to the characteristics of the substrate of the substrate component (actuator substrate 20).

[0138] (Aspect 11) In embodiment 10, the cross-sectional area of ​​the void portion 3b includes a certain region in the direction of nozzle arrangement. According to this, as explained in Figures 11 and 14, the discharge velocity distribution due to the characteristics of the substrate component substrate (actuator substrate 20) can be made to be almost constant in the nozzle arrangement direction, and the same void portion in the nozzle arrangement direction can be made to be a region with a constant cross-sectional area in the nozzle arrangement direction. This makes it possible to suppress variations in the region where the discharge velocity distribution due to the characteristics of the substrate component substrate (actuator substrate 20) is almost constant in the nozzle arrangement direction due to the influence of the void portion.

[0139] (Aspect 12) In embodiment 10, the cross-sectional area of ​​the void 3b is monotonically increasing or decreasing from one end to the other in the direction of arrangement. According to this, when the discharge speed distribution due to the characteristics of the substrate (actuator substrate 20) of the substrate component is monotonically increasing or decreasing from one end to the other in the nozzle arrangement direction, variations in discharge speed can be suppressed.

[0140] (Aspect 13) In any of embodiments 9 to 12, when viewed from the liquid discharge direction, the void 3b overlaps with the region where the piezoelectric element 23 of the substrate component (actuator member 2) is located. According to this, as explained in Example 3, the amount of shrinkage of the substrate component (actuator member 2) at that location can be well controlled by the shape (cross-sectional area) of the gap 3b. As a result, variations in the discharge speed due to the characteristics of the actuator substrate 20 can be well suppressed by the shape (cross-sectional area) of the gap 3b.

[0141] (Aspect 14) In any of embodiments 9 to 13, the void 3b is a void with a concave cross-section having an opening on the surface 3f opposite to the joining surface 3d side that joins the substrate component of the reinforcing member such as the frame member 3. According to this, as explained in Example 3, thermal stress due to the difference in thermal shrinkage between the substrate component (actuator member 2) and the reinforcing member (frame member 3) is effectively applied, and the amount of shrinkage of the substrate component (actuator member 2) at that location can be effectively controlled. As a result, variations in the discharge speed due to the characteristics of the actuator substrate 20 can be effectively suppressed by the shape (cross-sectional area) of the gap 3b. Furthermore, it is possible to increase the degree of freedom in the layout of the flow channels of the substrate components. In addition, it is possible to suppress the reduction in the bonding area between the substrate components and the frame member 3, thereby suppressing the reduction in sealing performance.

[0142] (Aspect 15) In any of embodiments 1 to 14, the coefficient of thermal expansion of the substrate component such as the actuator member 2 is smaller than the coefficient of thermal expansion of the reinforcing member such as the frame member 3, and the adhesive 50 is a thermosetting adhesive. According to this, thermal shrinkage of reinforcing members such as frame member 3 when returning to room temperature after adhesive heat curing can be reduced, thermal stress on substrate components such as actuator member 2 can be reduced, and a decrease in discharge performance can be suppressed.

[0143] (Aspect 16) In a liquid dispensing device equipped with a liquid dispensing head, any of the liquid dispensing heads from embodiments 1 to 15 was used as the liquid dispensing head. According to this, liquid can be dispensed effectively. [Explanation of Symbols]

[0144] 1: Liquid dispensing head 2: Actuator component 3: Frame members 3a:Communication hole 3b:Void part 3b1: Region where the cross-sectional area increases monotonically. 3b2: Region with a constant cross-sectional area 3b3: Region where the cross-sectional area decreases monotonically. 3c: Sealant 3d: joint surface 3e: Partition section 10: Nozzle substrate 10a: Nozzle hole 20: Actuator board 21: Pressurized liquid chamber substrate 21a: Pressurized liquid chamber partition 21b: Pressurized liquid chamber 22: Vibration plate 23: Piezoelectric element 23a: Piezoelectric material 23b: Common electrode 23c: Individual electrode 24: Insulating film 25: Output wiring 26: Passivation membrane 27: Adhesive 29: Thermistor 30: Support substrate 30a:Void part 50: Adhesive 81: Main unit of the device 82: Printing mechanism section 83: Paper 84: Paper feed cassette 85: Manual feed tray 86: Paper output tray 91: Main guide rod 92: Follow-guide rod 93: Carriage 94: Recording head 95: Ink Cartridge 97: Main scanning motor 98: Drive pulley 99: Driven pulley 100: Piezoelectric element wafer 100a: Orifura 104: Pressurized liquid chamber substrate 130: Timing belt 131: Paper feed roller 132: Friction Pad 133: Guide member 134: Conveyor roller 135: Conveyor rollers 136: Tip roller 137: Sub-scanning motor 139: Print receiving member 141: Transport roller 142: Spur 143: Paper output roller 144: Spur 145: Guide member 146: Guide member 147: Recovery device 401: Guide member 403: Carriage 404: Liquid dispensing head 405: Main scanning motor 406: Drive pulley 407: Driven pulley 408: Timing belt 410: Paper 412: Conveyor belt 413: Conveyor roller 414: Tension Roller 416: Sub-scanning motor 417: Timing belt 418: Timing pulley 420: Maintenance and recovery mechanism 421: Cap component 422: Wiper component 440: Liquid Dispensing Unit 441: Head Tank 442: Cover 443: Connector 444: Flow channel component 450: Liquid cartridge 451: Cartridge holder 452: Liquid transfer unit 456: Tube 491A: Side panel 491B: Side plate 491C: Back plate 493: Main scanning movement mechanism 494: Supply mechanism 495: Conveying mechanism [Prior art documents] [Patent Documents]

[0145] [License 1] Patent No. 4466825

Claims

1. A substrate component having a liquid chamber formed in a substrate communicating with a nozzle, a diaphragm laminated on the substrate and constituting a part of the wall surface of the liquid chamber, and a piezoelectric element laminated on the side of the diaphragm opposite to the side constituting the wall surface of the liquid chamber, A liquid dispensing head having a communication portion that communicates with the liquid chamber and a reinforcing member that is bonded to the substrate component by adhesive, The liquid dispensing head is characterized in that the reinforcing member has a plurality of voids in addition to the communication portion.

2. In the liquid discharge head according to claim 1, The liquid dispensing head is characterized in that the aforementioned voids are formed in multiple locations along the longitudinal direction of the liquid dispensing head.

3. In the liquid discharge head according to claim 1, A liquid dispensing head characterized in that the multiple void portions have openings on the bonding surface of the reinforcing member that is joined to the substrate component.

4. In the liquid dispensing head according to claim 3, A liquid dispensing head characterized in that at least one of the multiple voids is a through-void that penetrates the reinforcing member, and the other voids are voids with a concave cross-section that open only to the joint surface.

5. In the liquid discharge head according to claim 4, The liquid dispensing head is characterized in that the aforementioned through-void is provided in the center of the liquid dispensing head in the longitudinal direction.

6. In the liquid discharge head according to claim 5, A liquid dispensing head characterized in that a sealant for sealing electrical components exposed through the through-void is filled into the through-void.

7. In the liquid dispensing head according to claim 6, A liquid dispensing head characterized in that the sealant on the substrate component side is in an uncured state.

8. In the liquid discharge head according to claim 4, A liquid dispensing head characterized in that the depth of the void portion with a concave cross-section is 1 / 3 or more of the length of the reinforcing member in the direction perpendicular to the joint surface.

9. A substrate component having a liquid chamber formed in a substrate communicating with a nozzle, a diaphragm laminated on the substrate and constituting a part of the wall surface of the liquid chamber, and a piezoelectric element laminated on the side of the diaphragm opposite to the side constituting the wall surface of the liquid chamber, A liquid dispensing head having a communication portion that communicates with the liquid chamber and a reinforcing member that is bonded to the substrate component by adhesive, The reinforcing member is characterized by having a void portion with a concave cross-section or a closed void portion.

10. In the liquid dispensing head according to claim 9, A liquid discharge head characterized in that the cross-sectional area of ​​the gap portion perpendicular to the direction perpendicular to both the nozzle arrangement direction and the liquid discharge direction of the nozzles includes at least one of the regions in which the cross-sectional area monotonically increases as you move from one end to the other in the nozzle arrangement direction, and the regions in which the cross-sectional area monotonically decreases as you move from one end to the other in the nozzle arrangement direction.

11. In the liquid dispensing head according to claim 10, A liquid dispensing head characterized in that the cross-sectional area of ​​the gap portion includes a certain region in the direction of the arrangement of the nozzles.

12. In the liquid dispensing head according to claim 10, A liquid dispensing head characterized in that the cross-sectional area of ​​the gap portion increases or decreases monotonically from one end to the other in the direction of arrangement.

13. In the liquid dispensing head according to claim 9, A liquid dispensing head characterized in that, when viewed from the direction of liquid discharge of the nozzle, the void portion overlaps with the region where the piezoelectric element of the substrate component is arranged.

14. In the liquid dispensing head according to claim 9, The liquid dispensing head is characterized in that the void portion is a void with a concave cross-section having an opening on the side of the reinforcing member opposite to the bonding surface side that is joined to the substrate component.

15. In the liquid dispensing head according to claim 1 or 9, The coefficient of thermal expansion of the substrate component is smaller than that of the reinforcing member. The liquid dispensing head is characterized in that the adhesive is a thermosetting adhesive.

16. In a device for dispensing liquids equipped with a liquid dispensing head, A liquid dispensing device characterized in that the liquid dispensing head used is the liquid dispensing head described in claim 1 or 9.

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