Capacitor

Abstract

The present invention provides a capacitor that prevents the liquid resin from rising due to capillary action in the gap between the busbar and the insulating material when the liquid resin is injected during the capacitor manufacturing process. [Solution] The capacitor 100 comprises a first busbar 120 and a second busbar 130 connected to a capacitor element, an insulating member 140 disposed between the first and second busbars, a case 150 housing the capacitor element, and a filling resin 160 filled inside it. Parts of the first busbar 120, the second busbar 130, and the insulating member are exposed from the filling resin. The insulating member has a first opposing surface 143 facing the first busbar with a gap G1 between them, and a first protruding portion 144 in contact with the first busbar.

Description

Technical Field

[0001] The present disclosure generally relates to capacitors, and more particularly to capacitors having capacitor elements.

Background Art

[0002] Patent Document 1 discloses a capacitor module including a capacitor element, a pair of bus bars connected to the positive electrode or the negative electrode of the capacitor element, an insulating plate insulating between the pair of bus bars, and a resin package sealing part or all of these. A part of each of the pair of bus bars faces each other. The insulating plate is disposed between the pair of bus bars in a range where the pair of bus bars face each other. The insulating plate has convex portions near both longitudinal ends that can be placed on a contact surface with one of the pair of bus bars. The one bus bar has holes for receiving the convex portions. At least one protrusion that contacts the inner peripheral side surface of the hole is provided on a side surface of the convex portion in a state where the convex portion is inserted into the hole, and the insulating plate is fixed to the one bus bar by the at least one protrusion. The convex portion is sealed by the resin package.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the capacitor described in Patent Document 1, when filling the capacitor with liquid resin during the manufacturing process, the liquid resin may rise up through capillary action into the gap between the pair of busbars and the insulating plate. In such a capacitor, it is difficult to prevent the liquid resin from rising due to capillary action, which could lead to leakage of the liquid resin to the outside of the capacitor and misalignment due to the hardening of the filling resin at the fastening parts of the busbars.

[0005] The purpose of this disclosure is to provide a capacitor that can prevent liquid resin from rising due to capillary action in the gap between the busbar and the insulating member when liquid resin is injected during the manufacturing process of the capacitor. [Means for solving the problem]

[0006] A capacitor according to one aspect of the present disclosure comprises a capacitor element, a first busbar and a second busbar connected to the capacitor element, an insulating member disposed between the first busbar and the second busbar, a case housing the capacitor element, and a filling resin filled inside the case. Parts of each of the first busbar, the second busbar and the insulating member are exposed from the filling resin. The insulating member has a first opposing surface facing the first busbar with a gap between them, and a first protruding portion in contact with the first busbar. [Effects of the Invention]

[0007] According to this disclosure, it is possible to provide a capacitor that can prevent the liquid resin from rising due to capillary action in the gap between the busbar and the insulating member when the liquid resin is injected during the manufacturing process of the capacitor. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view showing a capacitor according to this embodiment. [Figure 2] Figure 2 is a perspective view of the same capacitor (filling resin is omitted). [Figure 3] Figure 3 is an exploded perspective view showing a portion of the capacitor mentioned above. [Figure 4] Figure 4 is a front view showing the same capacitor. [Figure 5] Figure 5 is a front view showing a portion of the capacitor shown above. [Figure 6] Figure 6 is a cross-sectional view taken along line 6-6 in Figure 4. [Figure 7] Figure 7 is an enlarged end view of the main part of Figure 6. [Modes for carrying out the invention]

[0009] 1. Overview In order to solve the problems of the capacitor module described in Patent Document 1 and the manufacturing defects of the capacitors that arise in connection with these problems, the present inventors conducted diligent research and have developed the following capacitor.

[0010] In other words, as shown in Figures 1 and 2, the capacitor 100 according to this embodiment comprises a capacitor element 110, a first busbar 120 and a second busbar 130 connected to the capacitor element 110, an insulating member 140 disposed between the first busbar 120 and the second busbar 130, a case 150 housing the capacitor element 110, and a filling resin 160 filled inside the case 150. Parts of the first busbar 120, the second busbar 130, and the insulating member 140 are exposed from the filling resin 160. The insulating member 140 has a first opposing surface 143 facing the first busbar 120 with a gap G1 between them, and a first protruding portion 144 in contact with the first busbar 120.

[0011] According to the capacitor 100 of this embodiment as described above, when injecting liquid resin during the manufacturing process of the capacitor 100, it is possible to prevent the liquid resin from rising due to capillary action in the gap G1 between the first busbar 120 and the insulating member 140. Therefore, it is possible to suppress the occurrence of defects such as defects in the appearance of the capacitor 100 due to leakage of liquid resin to the outside of the capacitor 100, and defects such as the capacitor 100 sticking to the manufacturing equipment due to the filling resin 160. In addition, it is possible to suppress the occurrence of misalignment due to the filling resin 160 sticking at the fastening portion 145 of the insulating member 140, thereby suppressing defects and variations in the dimensions of the capacitor 100.

[0012] 2. Embodiments (1) Capacitor The capacitor 100 according to this embodiment will be described below with reference to Figures 1 to 7. Each figure is a schematic representation, and the ratios of the size and thickness of each component in each figure do not necessarily reflect the actual dimensional ratios. In particular, Figure 7 is partially exaggerated for the sake of clarity. The arrows indicating directions in each figure are not intended to define the direction in which the capacitor 100 is used, but are merely there to make the explanation easier to understand and do not represent actual dimensions. In Figures 1 to 7, the up-down direction, the left-right direction, and the front-back direction are defined. These directions are orthogonal to each other. Viewing along the up-down direction is sometimes called a "plan view," viewing along the left-right direction is sometimes called a "side view," and viewing along the front-back direction is sometimes called a "front view."

[0013] (composition) As shown in Figures 1 and 2, the capacitor 100 according to this embodiment comprises a capacitor element 110, a first busbar 120, a second busbar 130, an insulating member 140, a case 150, and a filling resin 160.

[0014] <Capacitor element> The capacitor 100 includes at least one capacitor element 110. The capacitor element 110 is not particularly limited, and examples thereof include a wound or multilayer film capacitor element. The capacitor element 110 has an element main body portion 111 and an electrode portion 112.

[0015] The shape of the element main body portion 111 is not particularly limited. In the present embodiment, the element main body portion 111 is a rounded rectangular column having a rounded rectangular shape in plan view and a rectangular shape in front view and side view. Although not shown, inside the element main body portion 111, a pair of internal electrodes face each other through a dielectric such as a polymer film.

[0016] The material of the internal electrode is not particularly limited, and examples thereof include aluminum (Al), gold (Au), magnesium (Mg), tin (Sn), nickel (Ni), chromium (Cr), iron (Fe), copper (Cu), titanium (Ti), and alloys containing these.

[0017] The material of the polymer film used as the dielectric is not particularly limited, and examples thereof include polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polycarbonate (PC), polystyrene (PS), and the like.

[0018] The electrode portion 112 is formed on both end faces of the element main body portion 111, for example, by metal spraying. In the present embodiment, the end faces of the element main body portion 111 are the upper surface and the lower surface. That is, the electrode portion 112 has a rounded rectangular shape. The metal used as the electrode portion 112 is not particularly limited, and examples thereof include zinc (Zn), tin (Sn), and alloys containing these.

[0019] The number of capacitor elements 110 provided by the capacitor 100 is not particularly limited. In this embodiment, the capacitor 100 includes four capacitor elements 110. The four capacitor elements 110 are arranged vertically with their electrode portions 112 facing up and down. Of the four capacitor elements 110, three are arranged with the longer sides of their electrode portions 112 facing front to back and aligned in the left to right direction. The remaining capacitor element 110 has the longer side of its electrode portion 112 facing left to right, with the right end of the three capacitor elements 110 and the right end of the remaining element aligned in a straight line, and is positioned behind the three capacitor elements 110. When the capacitor 100 includes multiple capacitor elements 110, the arrangement of these elements is not particularly limited.

[0020] <First bus bar> The first busbar 120 is a conductive member. The material of the first busbar 120 is not particularly limited, but examples include copper (Cu), aluminum (Al), and alloys thereof.

[0021] As shown in Figure 3, the first busbar 120 has a cross-sectional shape that combines an inverted L-shape positioned above and an L-shape positioned below when viewed from the right. The plate-like portion of the upper inverted L-shape that extends in the vertical and horizontal directions is the first plate 121, and the plate-like portion that extends in the front-to-back and horizontal directions is the second plate 122. The plate-like portion of the lower L-shape that extends in the vertical and horizontal directions is the third plate 123, and the plate-like portion that extends in the front-to-back and horizontal directions is the fourth plate 124. Furthermore, the first plate 121 may extend further to the left and right than the other plate-like portions (122, 123, 124), as shown in Figures 1 and 4, for example.

[0022] The first busbar 120 faces the second busbar 130 in the front-rear direction via an insulating member 140. Specifically, the first plate 121 faces the first plate 131 of the second busbar 130, which will be described later, in the front-rear direction via an insulating member 140. Also, the fourth plate 124 faces the second plate 132 of the second busbar 130, which will be described later, in the vertical direction via a capacitor element 110.

[0023] The first busbar 120 has an external terminal 125, an insertion hole 126, an internal terminal 127, and an element guide plate 128. The external terminal 125, the insertion hole 126, the internal terminal 127, and the element guide plate 128 are integrated. The first busbar 120 is formed, for example, by punching a metal plate into a desired shape and bending it.

[0024] The external terminals 125 are electrically connected to external equipment (not shown). The external equipment is not particularly limited, but examples include components that make up an inverter. That is, the capacitor 100 can be part of an inverter, for example. The position and number of external terminals 125 are not particularly limited, but in this embodiment, three external terminals 125 are arranged above the first plate 121.

[0025] The fastening portion 145a of the insulating member 140, described later, is inserted into the insertion hole 126, locking the first busbar 120 and the insulating member 140. The position and number of insertion holes 126 are not particularly limited, but in this embodiment, one is located below each of the two left external terminals 125 on the first plate 121. In this disclosure, "locking" means engaging and stopping.

[0026] The internal terminals 127 are connected to the lower electrode portions 112a. Specifically, the four internal terminals 127 correspond one-to-one with the lower electrode portions 112a of the four capacitor elements 110. That is, the first busbar 120 has the same number of internal terminals 127 as the capacitor elements 110. The connection between the internal terminals 127 and the electrode portions 112a is carried out, for example, by welding, soldering, etc. The internal terminals 127 protrude in one direction from the perforated and notched portions of the fourth plate 124. In this embodiment, they protrude rearward from the front edge of each perforated and notched portion of the fourth plate 124.

[0027] The element guide plate 128 extends upward along the direction normal to the fourth plate 124 of the first busbar 120. The element guide plate 128 may be positioned between adjacent capacitor elements 110, acting as a partition plate, or it may be positioned on the outer periphery of the fourth plate 124. The arrangement of the element guide plate 128 is not particularly limited, but in this embodiment, two are positioned between each of the three capacitor elements 110 arranged in the left-right direction, and one is positioned to the right rear of the outer periphery of the capacitor elements 110. The element guide plate 128 may or may not be in contact with the capacitor elements 110.

[0028] <Second bus bar> The second busbar 130 is a conductive component, just like the first busbar 120. The material of the second busbar 130 is also the same as that of the first busbar 120.

[0029] As shown in Figure 3, the second busbar 130 has an L-shaped cross-section when viewed from the right. The plate-like portion extending vertically and horizontally in the L-shape is the first plate 131, and the plate-like portion extending horizontally and vertically is the second plate 132. Furthermore, as shown in Figures 2 and 4, the first plate 131 may extend further horizontally than the second plate 132.

[0030] As described above, the second busbar 130 faces the first busbar 120 in the front-rear direction via the insulating member 140.

[0031] The second busbar 130, like the first busbar 120, has an external terminal 133, an insertion hole 134, an internal terminal 135, and an element guide plate 136. The external terminal 133, the insertion hole 134, the internal terminal 135, and the element guide plate 136 are integrated. The second busbar 130 is formed, for example, in the same way as the first busbar 120.

[0032] The external terminal 133 is electrically connected to an external device (not shown), similar to the external terminal 125. The position and number of the external terminals 133 are not particularly limited, but in this embodiment, three external terminals 133 are arranged above the first plate 131.

[0033] Similar to the insertion hole 126, the fastening portion 145b of the insulating member 140 is inserted into the insertion hole 134, securing the second busbar 130 and the insulating member 140. The position and number of insertion holes 134 are not particularly limited, but in this embodiment, one is located below each of the two left external terminals 133 on the first plate 131.

[0034] The internal terminals 135 are connected to the upper electrode portions 112b. Specifically, the four internal terminals 135 correspond one-to-one with the electrode portions 112b of the four capacitor elements 110. That is, the second busbar 130 has the same number of internal terminals 135 as the capacitor elements 110. The connection between the internal terminals 135 and the electrode portions 112b is similar to, for example, the connection between the internal terminals 127 and the electrode portions 112a. The internal terminals 135 protrude in one direction from each of the perforated and notched portions of the second plate 132. In this embodiment, they protrude rearward from the front edge of each of the perforated and notched portions of the second plate 132.

[0035] The element guide plate 136 extends downward along the direction normal to the second plate 132. The element guide plate 136 may be positioned between adjacent capacitor elements 110, acting as a partition plate, or it may be positioned on the outer periphery of the second plate 132. The arrangement of the element guide plate 136 is not particularly limited, but in this embodiment, two are positioned between each of the three capacitor elements 110 arranged in the left-right direction, similar to the element guide plate 128, and one is positioned to the right rear of the outer periphery of the capacitor elements 110, arranged in the vertical direction. In this embodiment, the element guide plate 128 and the element guide plate 136 are also arranged in the vertical direction in each arrangement. The element guide plate 136 may or may not be in contact with the capacitor elements 110.

[0036] <Insulating material> The insulating member 140 is an electrically insulating member. The material of the insulating member 140 is not particularly limited, but examples include polyphenylene sulfide (PPS). The insulating member 140 has an intervening portion 141 and an element guide portion 142.

[0037] The intervening portion 141 is positioned between the first busbar 120 and the second busbar 130. Specifically, it is positioned between the first plate 121 of the first busbar 120 and the first plate 131 of the second busbar 130. Furthermore, as shown in Figures 1 and 5, the intervening portion 141 may extend outward in the left-right direction beyond the element guide portion 142.

[0038] As shown in Figures 5, 6, and 7, the insulating member 140 has a first opposing surface 143 that faces the first busbar 120 via a gap G1, and a first protruding portion 144 that is in contact with the first busbar 120, in the intervening portion 141.

[0039] Specifically, the first opposing surface 143 faces the rear surface of the first plate 121 of the first busbar 120 via a gap G1. The size of the gap G1 is not particularly limited, but for example, it is 0.05 mm or more and 1.0 mm or less.

[0040] The first protrusion 144 is in contact with the first busbar 120. On the first opposing surface 143, the first protrusion 144 has a rectangular band shape with its shorter side in the vertical direction, its longer side in the horizontal direction, and its thickness in the front-to-back direction. The longer side of the first protrusion 144 is parallel to the coordinate axis in the horizontal direction. The thickness of the first protrusion 144 is the same as the size of the gap G1. In other words, the first protrusion 144 is interposed between the first plate 121 and the first opposing surface 143, with its front end in contact with the first plate 121. In the horizontal direction, the first protrusion 144 has approximately the same length as the element guide portion 142. That is, the length of the first protrusion 144 is approximately the same as the length from the left end to the right end of the element guide portion 142.

[0041] Furthermore, the first protrusion 144 may extend further upward in a straight line from the right end of the element guide portion 142. In this embodiment, it extends upward from the first protrusion 144, and the height of the upper end (position in the vertical direction) is about the same as the height of the fastening portion 145a, which will be described later.

[0042] On the other hand, the first protrusion 144 is absent in the portion of the intervening portion 141 that extends to the right of the element guide portion 142.

[0043] The first protrusion 144 may be integrally formed as part of the insulating member 140, or it may be formed separately from the insulating member 140 and integrated by adhesive or the like. If formed separately, the material of the first protrusion 144 is not particularly limited, but examples include a resin member made of polyphenylene sulfide (PPS), adhesive, adhesive tape, non-adhesive tape, etc.

[0044] As shown in Figures 5, 6, and 7, the insulating member 140 may have at least one projection 146 on the first opposing surface 143.

[0045] The projection 146 is in contact with the first busbar 120. The number and shape of the projection 146 are not particularly limited, but examples include a columnar shape, a conical shape, a frustum shape, etc. As for the columnar shape, it may be a single rectangular band shape having thickness in the front-rear direction, similar to the first protruding portion 144, or it may be a plurality of columnar shapes, conical shapes, or frustum shapes having thickness in the front-rear direction. In this embodiment, the projection 146 is a plurality of rounded rectangular columnar shapes having thickness in the front-rear direction. The thickness of the projection 146 is the same as the size of the gap G1. That is, the projection 146 is interposed between the first plate 121 and the first opposing surface 143, similar to the first protruding portion 144, and its front is in contact with the first plate 121. Furthermore, it is preferable that the total area of ​​the surfaces of the plurality of projections 146 that are in contact with the first plate 121 is less than or equal to the area of ​​the surface of the first protruding portion 144 that is in contact with the first plate 121.

[0046] Each of the multiple protrusions 146 is aligned parallel to the left-right coordinate axis and arranged in a straight line. That is, the row of protrusions 146 is parallel to each other in the left-right direction with respect to the long side of the first ridge 144. Furthermore, the protrusions 146 are positioned above the opening of the case 150. Therefore, they are also positioned above the first ridge 144.

[0047] A portion of the projection 146 may have a projection 146a that is arranged in the front-rear direction alongside the fastening portion 145a. In other words, the projection 146a and the fastening portion 145a may be formed in that order from the intervening portion 141 toward the front. When the projection 146a and the fastening portion 145a are arranged side by side, the projection 146a is larger than the insertion hole 126 in at least one of the left-right or up-down directions. This allows the projection 146a to come into contact with the first bus bar 120.

[0048] Preferably, the sum of the area of ​​the surface of the first protruding portion 144 that contacts the first plate 121 and the area of ​​the surface of the projection portion 146 that contacts the first plate 121 is half or less of the area of ​​the first opposing surface 143.

[0049] The projection 146 may be formed integrally with the insulating member 140 as part of the first protruding portion 144, or it may be formed separately from the insulating member 140 and then integrated by adhesive or the like. The material of the projection 146 when it is formed separately is the same as that of the first protruding portion 144.

[0050] As shown in Figures 3, 6, and 7, the insulating member 140 may further have a second opposing surface 147 that faces the second busbar 130 via a gap G2, and a second protruding portion 148 that contacts the second busbar 130, in the intervening portion 141.

[0051] The second opposing surface 147 has almost the same characteristics as the first opposing surface 143. The differences between the second opposing surface 147 and the first opposing surface 143 are as follows. Specifically, the second opposing surface 147 faces the front side surface of the first plate 131 of the second busbar 130 via a gap G2. The size of the gap G2 is not particularly limited, but is about the same as the gap G1, and in the second embodiment, for example, it is 0.05 mm or more and 1.0 mm or less.

[0052] The second protrusion 148 on the second opposing surface 147 is mirror-image to the first protrusion 144 on the first opposing surface 143 and has almost identical characteristics. The differences between the second protrusion 148 and the first protrusion 144 are as follows: The second protrusion is in contact with the second busbar 130. The thickness of the second protrusion 148 is the same as the size of the gap G2. In other words, the second protrusion 148 is interposed between the first plate 131 and the second opposing surface 147, and its rear is in contact with the first plate 131.

[0053] As shown in Figure 3, the insulating member 140 may further have at least one projection 149 on the second opposing surface 147. The projection 149 on the second opposing surface 147 has substantially the same characteristics as the projection 146 on the first opposing surface 143. The differences between the projection 149 and the projection 146 are as follows: The projection 149 is in contact with the second busbar 130. The projection 149, like the second ridge 148, is interposed between the first plate 131 and the second opposing surface 147, and its rear end is in contact with the first plate 131. Preferably, the total area of ​​the surfaces of the multiple projections 149 that are in contact with the first plate 131 is less than or equal to the area of ​​the surface of the second ridge 148 that is in contact with the first plate 131. The projection 149 is positioned above the opening of the case 150. Therefore, it is also positioned above the second ridge 148.

[0054] A portion of the projection 149 may have a projection 149a that is arranged in the front-rear direction alongside the fastening portion 145b, which will be described later. In other words, the projection 149a and the fastening portion 145b may be formed in that order from the intervening portion 141 towards the rear. When the projection 149a and the fastening portion 145b are arranged side by side, the projection 149a is larger than the insertion hole 134 in at least one of the left-right or up-down directions. This allows the projection 149a to come into contact with the second bus bar 130.

[0055] Preferably, the sum of the area of ​​the surface of the second protrusion 148 that contacts the first plate 131 and the area of ​​the surface of the projection 149 that contacts the first plate 131 is half or less of the area of ​​the second opposing surface 147.

[0056] The projections 146 and 149 may be arranged so as to overlap via the intervening portion 141 in the front-rear direction, or so as to partially overlap, or so as not to overlap. Furthermore, the positions of the projections 146 and 149 in the vertical direction may be the same or different.

[0057] The insulating member 140 has fastening portions 145 (145a, 145b) that protrude forward or backward on the intervening portion 141. That is, the insulating member 140 has fastening portion 145a on the first opposing surface 143 and fastening portion 145b on the second opposing surface 147. The shape of the fastening portion 145 is not particularly limited, but in this embodiment, it is L-shaped in side view and rectangular in front view and top view. As described above, the fastening portion 145 is inserted into the insertion holes 126 and 134 and locks the first bus bar 120 and the second bus bar 130. In this embodiment, there are two fastening portions 145 at the front and two at the rear, corresponding one-to-one with the two insertion holes 126 and the two insertion holes 134. That is, the intervening portion 141 has the same number of fastening portions 145 as the total number of insertion holes 126 and 134. The fastening portion 145 is positioned above the first protruding portion 144 and is exposed from the filler resin 160.

[0058] The element guide portion 142 is interposed between the first busbar 120 and the upper electrode portion 112b, and is a portion that indicates the position where the capacitor element 110 is placed during the manufacturing of the capacitor 100. Specifically, the element guide portion 142 is interposed opposite the upper parts of the second plate 122 and the third plate 123 of the first busbar 120. The front of the element guide portion 142 may be arched. The element guide portion 142 may or may not be in contact with the capacitor element 110.

[0059] <Case> The case 150 houses the capacitor elements 110. In this embodiment, it houses four capacitor elements 110. The case 150 also houses a portion of the first busbar 120, the second busbar 130, and the insulating member 140. Furthermore, the case 150 is open at the top. Therefore, a portion of the first busbar 120, the second busbar 130, and the insulating member 140 is housed in the case 150, while the portions of the first busbar 120, the second busbar 130, and the insulating member 140 that are not housed are exposed upward from the opening side of the case 150.

[0060] The material for Case 150 is not particularly limited, but examples include polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), epoxy resin (EP), etc.

[0061] The case 150 may have at least one mounting portion. In this embodiment, the left side and bottom side of the case 150 each have one mounting portion (see Figure 5).

[0062] <Filling resin> The filler resin 160 is a cured liquid resin and has electrical insulating properties. The material of the liquid resin is not particularly limited, but examples include thermosetting resins and photocurable resins. More specifically, examples include epoxy resins.

[0063] The filling resin 160 is filled inside the case 150 (see Figure 1). The surface S of the filling resin 160 that does not come into contact with the case 150 (hereinafter also referred to as the exposed surface S) is located slightly below the opening of the case 150. The exposed surface S is parallel to the coordinate axes in the left-right and front-back directions. That is, the exposed surface S, the long side of the first protrusion 144, the row of multiple projections 146, the second protrusion 148, and the multiple projections 149 are parallel to each other in the left-right direction.

[0064] As described above, the capacitor element 110 is housed in the case 150 and therefore exists within the filling resin 160. Parts of the first busbar 120, the second busbar 130, and the insulating member 140 are housed in the case 150, so parts of each of the first busbar 120, the second busbar 130, and the insulating member 140 are within the filling resin 160, with the remaining parts exposed from the filling resin 160. In other words, the filling resin 160 seals the capacitor element 110 and parts of each of the first busbar 120, the second busbar 130, and the insulating member 140. Specifically, at least parts of the external terminals 125, 133 and insertion holes 126, 134 of the first busbar 120 and the second busbar 130, and the first protrusion 144 of the insulating member 140 are exposed. In this embodiment, as shown in Figure 7, the filling resin 160 fills the gap G1 up to the height of the lower surface of the first protrusion 144, and the upper and front surfaces of the first protrusion 144 are exposed and not contained within the filling resin 160. Furthermore, as described above, the projection 146 is positioned above the first protrusion 144. That is, the projection 146 is positioned at a greater distance from the filling resin 160 than the first protrusion 144. Similarly, the filling resin 160 fills the gap G2 up to the height of the lower surface of the second protrusion 148, and the upper and front surfaces of the second protrusion 148 are exposed and not contained within the filling resin 160. Furthermore, as described above, the projection 149 is positioned above the second protrusion 148. That is, the projection 149 is positioned at a greater distance from the filling resin 160 than the second protrusion 148.

[0065] Furthermore, the vertical positions of the first protrusion 144 and the second protrusion are not particularly limited. In this embodiment, the height of the exposed surface S is between the height of the upper surface and the height of the lower surface of the first protrusion 144 and the second protrusion, respectively.

[0066] (Manufacturing method) A method for manufacturing the capacitor 100 according to this embodiment will be described.

[0067] First, the insulating member 140 is combined with the first busbar 120 and the second busbar 130 by inserting the fastening portion 145 into the insertion holes 126 and 134. Next, the capacitor element 110 is positioned so that the internal terminals 127 and 135 are connected to the electrode portions 112a and 112b, respectively, according to the element guide portion 142 of the insulating member 140 and the positioning portions of the first busbar 120 and the second busbar 130. Then, the capacitor element 110 is housed in the case 150, and liquid resin is injected into the case 150 by casting. Next, the injected liquid resin is cured to form the filler resin 160. Through the above steps, a capacitor 100 as shown in Figure 1 is manufactured.

[0068] (2) Effects In this embodiment, when liquid resin is injected during the manufacturing process of the capacitor 100, the rise of liquid resin due to capillary action can be prevented in the gap G1 between the first busbar 120 and the insulating member 140. Similarly, when liquid resin is injected during the manufacturing process of the capacitor 100, the rise of liquid resin due to capillary action can be prevented in the gap G2 between the second busbar 130 and the insulating member 140.

[0069] If the capacitor 100 does not have the first protrusion 144 and the second protrusion 148, when injecting liquid resin into the gaps G1 and G2, there is a risk that the liquid resin will rise above the liquid level (corresponding to the exposed surface S of the filling resin) due to capillary action. If the risen liquid resin leaks out from above the gaps G1 and G2, the filling resin 160 may adhere to undesirable areas, potentially causing a defect in the appearance of the capacitor 100. Also, as shown in Figure 1, if the capacitor 100 has the first bus bar 120, the second bus bar 130 and the insulating member 140 that protrude outside the case 150, there is a risk that the liquid resin may leak out of the capacitor 100 through the gaps G1 and G2 due to capillary action. If the liquid resin leaks outside the capacitor 100, it may not only cause cosmetic defects in the capacitor 100, but also lead to production problems due to the filling resin 160 adhering to the capacitor 100 and the manufacturing equipment. Furthermore, if the liquid resin hardens and the filling resin 160 adheres while rising above the liquid level, it may cause misalignment at the fastening portion 145 of the insulating member 140. Such misalignment can lead to problems such as dimensional defects and large variations in the capacitor 100.

[0070] However, in this embodiment, the insulating member 140 of the capacitor 100 has a first protrusion 144 that contacts the first busbar 120 in the gap G1, and a second protrusion 148 that contacts the second busbar 130 in the gap G2. Because the insulating member 140 has the first protrusion 144 and the second protrusion 148, the gaps G1 and G2 are sealed, and it is possible to prevent the liquid resin from rising above the first protrusion 144 and the second protrusion 148 due to capillary action. Therefore, leakage of liquid resin to the outside of the capacitor 100 is suppressed, and thus the occurrence of defects in the appearance of the capacitor 100, manufacturing defects in the manufacture of the capacitor 100, and defects in the dimensions of the capacitor 100 can be suppressed.

[0071] In this embodiment, the insulating member 140 further has a projection 146 that is spaced further above the exposed surface S than the first protrusion 144. The projection 146 is in contact with the first bus bar 120. This prevents the first bus bar 120 from bending toward the insulating member 140. Similarly, the insulating member 140 further has a projection 149 that is spaced further above the exposed surface S than the second protrusion 148. The projection 149 is in contact with the second bus bar 130. This prevents the second bus bar 130 from bending toward the insulating member 140. By suppressing the bending of the first bus bar and the second bus bar 130, dimensional variations in the capacitor 100 can be suppressed.

[0072] Furthermore, in this embodiment, the area of ​​the portion of the projection 146 that contacts the first busbar 120 is less than or equal to the area of ​​the portion of the first ridge 144 that contacts the first busbar 120. As a result, the contact pressure between the first busbar 120 and the projection 146 is greater than or equal to the contact pressure between the first busbar 120 and the first ridge 144. Therefore, the projection 146 is more likely to contact the first busbar 120 than the first ridge 144, thus further suppressing the warping of the first busbar 120. Similarly, the area of ​​the portion of the projection 149 that contacts the second busbar 130 is less than or equal to the area of ​​the portion of the second ridge 148 that contacts the second busbar 130. As a result, the contact pressure between the second busbar 130 and the projection 149 is greater than or equal to the contact pressure between the second busbar 130 and the second ridge 148. Therefore, the projection 149 is more likely to contact the second busbar 130 than the second ridge 148, thus further suppressing the warping of the second busbar 130. In addition, reducing the contact area between the first busbar 120 and the projection 146, and between the second busbar 130 and the projection 149, contributes to thinning the insulating member 140. This suppresses the occurrence of warping of the insulating member 140 caused by manufacturing. As a result, by suppressing the warping of the first busbar 120 and the second busbar, as well as the warping of the insulating member 140, the dimensional variation of the capacitor 100 can be further suppressed.

[0073] In this embodiment, the sum of the area of ​​the portion of the first protrusion 144 that contacts the first busbar 120 and the area of ​​the portion of the projection 146 that contacts the first busbar 120 is less than half the area of ​​the first opposing surface 143. This increases the contact pressure between the first busbar 120 and the first protrusion 144 and projection 146. Consequently, the first busbar 120 and the first protrusion 144 are more likely to come into contact, and when injecting liquid resin during the manufacturing process of the capacitor 100, it is possible to prevent the liquid resin from rising due to capillary action in the gap G1 between the first busbar 120 and the insulating member 140. Similarly, the sum of the area of ​​the portion of the second protrusion 148 that contacts the second busbar 130 and the area of ​​the portion of the projection 149 that contacts the second busbar 130 is less than half the area of ​​the second opposing surface 147. This increases the contact pressure between the second busbar 130 and the second protrusion 148 and projection 149. Consequently, the second busbar 130 and the second protrusion 148 are more likely to come into contact, preventing the liquid resin from rising due to capillary action in the gap G2 between the second busbar 130 and the insulating member 140 when the liquid resin is injected during the manufacturing process of the capacitor 100. Furthermore, if recesses were to be provided on the first opposing surface 143 and the second opposing surface 147 of the insulating member 140 to prevent the liquid resin from rising due to capillary action in the gaps G1 and G2, the recesses would need to be made deep enough to prevent capillary action, thus requiring an increase in the thickness of the intervening portion 141. On the other hand, in this embodiment, the first protrusion 144 and projection 146 are formed to protrude forward from the first opposing surface 143, and the second protrusion 148 and projection 149 are formed to protrude backward from the second opposing surface 147, so they are not affected by the thickness of the intervening portion 141. In other words, the thickness of the intervening portion 141 can be reduced, which contributes to thinning the insulating member 140 and suppresses the occurrence of warping of the insulating member 140 caused by manufacturing. Note that the thickness of the intervening portion 141 refers to the distance in the front-rear direction between the first opposing surface 143 and the second opposing surface 147.

[0074] 3. Variant The embodiments described above are only a selection of the various embodiments of this disclosure. The invention is not limited to these embodiments, and various modifications are possible depending on the design and other factors, as long as the objectives of this disclosure are achieved.

[0075] In the modified example 1, the capacitor 100 has a first opposing surface 143 facing the first busbar 120 via a gap G1, a first protrusion 144 in contact with the first busbar 120, a second opposing surface 147 facing the second busbar 130 via a gap G2, and a second protrusion 148 in contact with the second busbar 130. In other words, the insulating member 140 does not have projections 146 and 149. Even in this case, the capacitor 100 can prevent the liquid resin from rising due to capillary action in the gaps G1 and G2 between the first and second busbars and the insulating member when the liquid resin is injected during the manufacturing process of the capacitor 100.

[0076] Furthermore, in the modified example 1, the insulating member 140 may have a projection 146 or a projection 149. If a projection 146 is present, it is possible to suppress the first busbar 120, which is in contact with the projection 146, from bending towards the insulating member 140. Moreover, the area of ​​the portion of the projection 146 that contacts the first busbar 120 is less than or equal to the area of ​​the portion of the first ridge 144 that contacts the first busbar 120, and the contact pressure of the projection 146 to the first busbar 120 is greater than or equal to the contact pressure of the first ridge 144 to the first busbar 120. Therefore, the projection 146 is more likely to contact the first busbar 120 than the first ridge 144, thus further suppressing the bending of the first busbar 120. In addition, by reducing the contact area of ​​the projection 146 to the first busbar 120, it contributes to thinning the insulating member 140, and thus suppresses the occurrence of bending of the insulating member 140 due to manufacturing. As described above, by suppressing the warping of the first busbar 120 and the insulating member 140, dimensional variations of the capacitor 100 can be further suppressed. When a projection 149 is present, the warping of the second busbar 130 in contact with the projection 149 toward the insulating member 140 can be suppressed. Furthermore, the area of ​​the portion where the projection 149 contacts the second busbar 130 is less than or equal to the area of ​​the portion where the second ridge 148 contacts the second busbar 130, and the contact pressure of the projection 149 on the second busbar 130 is greater than or equal to the contact pressure of the second ridge 148 on the second busbar 130. Therefore, the projection 149 is more likely to contact the second busbar 130 than the second ridge 148, thus further suppressing the warping of the second busbar 130. Furthermore, by reducing the contact area of ​​the projection 149 with the second busbar 130, it contributes to thinning the insulating member 140, thereby suppressing the occurrence of warping of the insulating member 140 due to manufacturing. As a result, by suppressing the warping of the second busbar 130 and the insulating member 140, dimensional variations of the capacitor 100 can be further suppressed.

[0077] Furthermore, in the first and second embodiments and in Modification 1, the filling resin 160 is filled up to the height of the lower surfaces of the first protrusion 144 and the second protrusion 148, but is not limited thereto. The first protrusion 144 and the second protrusion 148 only need to be partially exposed from the filling resin 160, and in the gaps G1 and G2, the height of the filling resin 160 only needs to be less than or equal to the height of the upper surfaces of the first protrusion 144 and the second protrusion 148, and may also be below the lower surfaces of the first protrusion 144 and the second protrusion 148.

[0078] 4. Appearance As is clear from the embodiments described above, this disclosure includes the following aspects. In the following, reference numerals are enclosed in parentheses solely to indicate their correspondence with the embodiments.

[0079] The first embodiment is a capacitor (100) comprising a capacitor element (110), a first busbar (120) and a second busbar (130) connected to the capacitor element (110), an insulating member (140) disposed between the first busbar (120) and the second busbar (130), a case (150) housing the capacitor element (110), and a filling resin (160) filled inside the case (150). Parts of each of the first busbar (120), the second busbar (130), and the insulating member (140) are exposed from the filling resin (160). The insulating member (140) has a first opposing surface (143) facing the first busbar (120) with a gap (G1) between them, and a first protruding portion (144) in contact with the first busbar (120).

[0080] According to this embodiment, when filling the capacitor (100) with liquid resin during the manufacturing process, it is possible to prevent the liquid resin from rising due to capillary action in the gap (G1) between the first busbar (120) and the insulating member (140).

[0081] A second embodiment is a capacitor (100) based on the first embodiment. In the second embodiment, the first protrusion (144) extends parallel to the surface (S) of the filler resin (160) that is not in contact with the case (150).

[0082] According to this embodiment, when filling the capacitor (100) with liquid resin during the manufacturing process, it is possible to further prevent the liquid resin from rising due to capillary action in the gap (G1) between the first busbar (120) and the insulating member (140).

[0083] A third embodiment is a capacitor (100) based on the first or second embodiment. In the third embodiment, at least a portion of the first protrusion (144) is exposed from the filler resin (160).

[0084] According to this embodiment, the gap (G1) between the first busbar (120) and the insulating member (140) prevents the liquid resin from rising due to capillary action, thereby suppressing the leakage of the liquid resin to the outside of the capacitor (100) and the occurrence of displacement due to the fixing of the filling resin (160) at the fastening portion (145) of the insulating member (140).

[0085] A fourth embodiment is a capacitor (100) based on any one of the first to third embodiments. In the fourth embodiment, the insulating member (140) further has at least one projection (146) which is located further away from the filler resin (160) than the first protrusion (144).

[0086] According to this embodiment, warping of the first busbar (120) can be suppressed, and misalignment of the fastening portion (145) of the insulating member (140) can be suppressed.

[0087] The fifth embodiment is a capacitor (100) based on the fourth embodiment. In the fifth embodiment, the area of ​​the portion where the projection (146) contacts the first busbar (120) is less than or equal to the area of ​​the portion where the first ridge (144) contacts the first busbar (120).

[0088] According to this embodiment, warping of the first busbar (120) and the insulating member (140) can be suppressed, and displacement of the fastening portion (145) of the insulating member (140) can be further suppressed.

[0089] The sixth embodiment is a capacitor (100) based on any one of the first to fifth embodiments. In the sixth embodiment, the insulating member (140) further has a second opposing surface (147) that faces the second busbar (130) with a gap (G2) between them, and a second protruding portion (148) that is in contact with the second busbar (130).

[0090] According to this embodiment, when filling the capacitor (100) with liquid resin during the manufacturing process, it is possible to prevent the liquid resin from rising due to capillary action in the gap (G2) between the second busbar (130) and the insulating member (140). [Explanation of Symbols]

[0091] 100 Capacitors 110 Capacitor element 120 First Bus Bar 130 Second Bus Bar 140 Insulating material 143 First opposing surface 144 First protrusion 146 Protrusion 147 Second opposing surface 148 Second protrusion 150 cases 160 Filling resin G1, G2 gap

Claims

1. Capacitor element and A first busbar and a second busbar connected to the capacitor element, An insulating member disposed between the first busbar and the second busbar, A case housing the aforementioned capacitor element, The filling resin that is filled inside the case, Equipped with, A portion of each of the first busbar, the second busbar, and the insulating member is exposed from the filling resin. The insulating member has a first opposing surface that faces the first busbar with a gap between them, and a first protruding portion that contacts the first busbar. Capacitor.

2. The first protrusion extends parallel to the surface of the filling resin that does not come into contact with the case. The capacitor according to claim 1.

3. At least a portion of the first protrusion is exposed from the filler resin. The capacitor according to claim 1.

4. The insulating member further has at least one projection that is positioned further away from the filler resin than the first protruding portion. The capacitor according to claim 1.

5. The area of ​​the portion of the projection that contacts the first busbar is less than or equal to the area of ​​the portion of the first ridge that contacts the first busbar. The capacitor according to claim 4.

6. The insulating member further comprises a second opposing surface that faces the second busbar with a gap between them, and a second protruding portion that contacts the second busbar. The capacitor according to claim 1.

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