PCB processing system

The substrate processing system improves productivity by integrating efficient transfer and processing units with multi-axis robot arms, facilitating simultaneous substrate handling and preventing pattern collapse.

JP2026116434APending Publication Date: 2026-07-09TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2026075991
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-02-21
Filing Date
2026-04-30
Publication Date
2026-07-09

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Abstract

This technology can improve the productivity of substrate processing systems. [Solution] A substrate processing system according to one aspect of the present disclosure includes an loading / unloading unit for loading and unloading cassettes containing a plurality of substrates, a batch processing unit for processing lots containing a plurality of substrates at once, a single-wafer processing unit for processing the substrates in the lot one by one, and an interface unit for transferring the substrates between the batch processing unit and the single-wafer processing unit, wherein the batch processing unit includes a first transport device for transporting the lot, and the interface unit includes an immersion tank for immersing the lot, and a second transport device for transferring the lot between the first transport device and the immersion tank.
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Citation Information

Patent Citations

  • Substrate processing system, and substrate processing method

    JP2021064654A