Substrate processing device

Abstract

In a substrate processing device (1), a position change area (R3) is formed between a material block (5) and a batch processing area (R1), a single-wafer substrate transport area (R4) is adjacent to the material block (5) and the position change area (R3), and a single-wafer processing area (R5) is adjacent to the single-wafer substrate transport area (R4). A center robot (CR) of the single-wafer substrate transport area (R4) transports a substrate between the second position change mechanism (35) of the position change area (R3), the single-wafer processing chamber (SW1, SW2) of the single-wafer processing area (R5), and the buffer section (27). The center robot (CR) is equipped with a horizontally movable hand (37A) that maintains a substrate in a horizontal position, and a lifting platform (41) that raises and lowers the hand (37A), wherein the lifting platform (41) has a fixed position in the horizontal direction (XY).

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. Examples of substrates include semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical discs, substrates for magnetic discs, ceramic substrates, substrates for solar cells, etc. Examples of FPDs include liquid crystal display devices, organic EL (electroluminescence) display devices, etc. Background Technology

[0002] As a conventional substrate processing device, there is a hybrid substrate processing device equipped with a batch processing module (batch processing unit) that processes multiple substrates in batches and a single-wafer processing module (single-wafer processing unit) that processes the substrates processed by the batch processing module one by one (see, for example, Patent Documents 1 and 2).

[0003] The substrate processing device of Patent Document 1 comprises a load port used to receive a cassette, a first robot, two rotation mechanisms for rotating a wafer between a vertical position and a horizontal position, two sets arranged in a line between the two rotation mechanisms, a second robot capable of transporting a wafer in a vertical position between the two rotation mechanisms and the two sets, a plurality of single-wafer cleaning modules for performing cleaning and drying, and a third robot.

[0004] Multiple single-wafer cleaning modules are arranged in a line. A first robot extracts five wafers at a time from a cassette and returns these five wafers to a first rotary mechanism. A third robot extracts a wafer from a second rotary mechanism and returns the wafer to a single-wafer cleaning module. The first robot extracts one wafer from one of the multiple single-wafer cleaning modules and returns the wafer to the cassette.

[0005] The substrate processing device of Patent Document 2 comprises an input / output section having a cassette holder, a single-wafer processing section (region), an interface section, and a batch processing section (region). Additionally, the substrate processing device of Patent Document 3 comprises an orientation changing mechanism. Prior art literature

[0006] Japanese Published Patent Application No. 2016-502275, Japanese Published Patent Application No. 2021-064652, Japanese Published Patent Application No. 2018-056341 The problem to be solved

[0007] Conventional substrate processing devices have the following problems. For example, in the substrate processing device of Patent Document 1, the first robot moves along a plurality of single-wafer cleaning modules, extracts five wafers at a time from a cassette, and returns these five wafers to a first rotary mechanism. Additionally, the first robot moves along a plurality of single-wafer cleaning modules, extracts one wafer from one of the plurality of single-wafer cleaning modules, and returns the wafer to the cassette. As a result, the first robot is busy, and there is a possibility that it reduces the throughput of the substrate processing device.

[0008] In addition, in the substrate processing apparatus of Patent Document 2, the input / output section, the single-wafer processing section, the interface section, and the batch processing section are arranged in sequence. A substrate extracted from a cassette passes through the single-wafer processing section and is sent from the input / output section to the interface section. Then, in the interface section, a lot consisting of multiple substrates in a vertical position is formed for processing in the batch processing section. That is, the lot is not directly conveyed from the input / output section to the batch processing section. Therefore, there is a possibility that the throughput of the substrate processing apparatus is reduced.

[0009] The present invention is made in consideration of such circumstances and aims to provide a substrate processing apparatus capable of improving throughput. means of solving the problem

[0010] To achieve this objective, the present invention takes the following configuration. That is, the substrate processing device related to the present invention is a substrate processing device that continuously performs batch processing for processing a plurality of substrates collectively and single-wafer processing for processing substrates one by one, and comprises a carrier storage shelf for storing a carrier that stores a plurality of substrates in a horizontal position at a predetermined interval in a vertical direction, a transfer block adjacent to the carrier storage shelf, a processing block adjacent to the transfer block, and a substrate storage section for storing substrates, wherein the transfer block comprises a first position conversion mechanism for converting the plurality of substrates extracted from the carrier from a horizontal position to a vertical position, and a substrate handling mechanism for collectively transporting the plurality of substrates in a horizontal position between the carrier stored on the carrier storage shelf, the first position conversion mechanism, and the substrate storage section, and wherein the processing block comprises a batch processing area extending in a direction away from the transfer block, and a structure formed along the batch processing area, with one end extending to the transfer block and the other end extending in a direction away from the transfer block. The apparatus comprises a batch substrate transport area, an orientation conversion area formed between the transfer block and the batch processing area, a single-wafer substrate transport area adjacent to the transfer block and the orientation conversion area, and a single-wafer processing area adjacent to the single-wafer substrate transport area, wherein in the batch processing area, a plurality of batch processing units for processing the plurality of substrates in a vertical orientation in a batch are arranged in a direction extending from the batch processing area, and in the orientation conversion area, a second orientation conversion mechanism is formed for converting the batch-processed plurality of substrates from a vertical orientation to a horizontal orientation, and in the batch substrate transport area, a substrate receiving position determined within the transfer block,A batch substrate transport mechanism is formed to collectively transport the plurality of substrates in a vertical position between the plurality of batch processing tanks and the second position conversion mechanism, and in the single-wafer processing area, a plurality of single-wafer processing chambers are formed to process substrates in a horizontal position one by one, and in the single-wafer substrate transport area, a horizontal substrate transport mechanism is formed to transport substrates in a horizontal position one by one between the second position conversion mechanism, the plurality of single-wafer processing chambers, and the substrate placement section, and the horizontal substrate transport mechanism is characterized by having a horizontally movable hand that maintains a substrate in a horizontal position and a lifting platform that raises and lowers the hand, wherein the lifting platform has a fixed position in the horizontal direction.

[0011] According to the substrate processing apparatus related to the present invention, an orientation change area (including a second orientation change mechanism) is formed between a material block and a batch processing area. Additionally, a single-wafer substrate transport area is adjacent to the material block and the orientation change area. Additionally, a single-wafer processing area (including a plurality of single-wafer processing chambers) is adjacent to the single-wafer substrate transport area. Furthermore, the horizontal position of the lifting platform of the horizontal substrate transport mechanism formed in the single-wafer substrate transport area is fixed. Therefore, the material block, the second orientation change mechanism, and a plurality of single-wafer processing chambers can be arranged around the horizontal substrate transport mechanism. As a result, the transport distance of the substrate by, for example, the horizontal substrate transport mechanism can be shortened, thereby allowing the substrate to be transported efficiently. Additionally, the batch substrate transport mechanism can transport a plurality of substrates in batches between the substrate receiving position within the material block, a plurality of batch processing tanks, and the second orientation change mechanism. As a result, throughput can be improved.

[0012] In addition, in the substrate processing device described above, the second orientation change mechanism comprises a substrate waiting area and an orientation change execution area arranged along the direction in which the batch processing area extends, wherein the substrate waiting area has a substrate holding part formed therein that maintains the plurality of substrates conveyed by the batch substrate conveying mechanism in a vertical orientation, and the orientation change execution area has a orientation change part formed therein that includes two chucks that maintain the plurality of substrates, a vertical rotation part that rotates the two chucks around a horizontal axis, and a horizontal movement part that moves the two chucks and the vertical rotation part between the upper side of the substrate holding part and a preset position of the orientation change execution area, and the orientation change part preferably receives the plurality of substrates from the substrate holding part using the two chucks in the substrate waiting area, and changes the orientation of the plurality of substrates from vertical to horizontal using the vertical rotation part in the orientation change execution area.

[0013] In the width direction orthogonal to the direction in which the batch processing area extends, the width of the position conversion area where the second position conversion mechanism is placed becomes smaller. Therefore, the width of the substrate processing device can be kept small.

[0014] In addition, in the substrate processing apparatus described above, it is preferable that the horizontal substrate transport mechanism be suspended at a position above the single-wafer transport area. This prevents the horizontal substrate transport mechanism from being contaminated by a droplet falling from the wet substrate. For example, it prevents the horizontal substrate transport mechanism from failing due to contamination.

[0015] In addition, in the substrate processing apparatus described above, it is preferable that the single-wafer processing area be formed on the opposite side of the material block through the single-wafer substrate transport area and also be formed adjacent to the orientation change area. In the width direction orthogonal to the direction in which the batch processing area extends, the width of the material block is relatively large. Since the single-wafer substrate transport area is positioned to face the material block, the width of the substrate processing apparatus can be kept small.

[0016] In addition, in the substrate processing apparatus described above, it is preferable that the processing block further comprises a second single-wafer processing area formed on the opposite side of the orientation change area through the single-wafer substrate transport area. Since the single-wafer processing area is larger, many single-wafer processing chambers can be arranged. Therefore, the throughput of single-wafer processing can be improved.

[0017] Furthermore, a substrate processing apparatus related to the present invention is a substrate processing apparatus that continuously performs batch processing, which processes a plurality of substrates collectively, and single-wafer processing, which processes substrates one by one. It comprises a carrier storage shelf for storing a carrier that stores a plurality of substrates in a horizontal position at a predetermined interval in a vertical direction, a transfer block adjacent to the carrier storage shelf, and a processing block adjacent to the transfer block. The transfer block comprises a first position conversion mechanism for converting the plurality of substrates extracted from the carrier from a horizontal position to a vertical position, and a horizontal substrate transport mechanism for transporting the substrate in a horizontal position. The processing block comprises a batch processing area extending in a direction away from the transfer block, a batch substrate transport area formed along the batch processing area, with one end extending to the transfer block and the other end extending in a direction away from the transfer block, a position conversion area formed between the transfer block and the batch processing area, a single-wafer substrate transport area adjacent to the transfer block and the position conversion area, and a single-wafer substrate transport area An adjacent single-wafer processing area is provided, wherein in the batch processing area, a plurality of batch processing tanks for processing the plurality of substrates in a vertical position collectively are arranged in the direction in which the batch processing area extends, and in the position conversion area, a second position conversion mechanism is formed for converting the batch-processed plurality of substrates from a vertical position to a horizontal position, and in the batch substrate transport area, a batch substrate transport mechanism is formed for transporting the plurality of substrates in a vertical position collectively between a substrate receiving position determined within the transfer block, the plurality of batch processing tanks, and the second position conversion mechanism, and in the single-wafer processing area, a plurality of single-wafer processing chambers for processing substrates in a horizontal position one by one are formed, and the horizontal substrate transport mechanism comprises the carrier placed on the carrier placement shelf, the first position conversion mechanism,A substrate in a horizontal position can be transported between the second position changing mechanism and the plurality of single-wafer processing chambers, and the horizontal substrate transport mechanism is characterized by having a horizontally movable hand that maintains the substrate in a horizontal position and a lifting platform that raises and lowers the hand, wherein the lifting platform has a fixed position in the horizontal direction.

[0018] According to the substrate processing apparatus related to the present invention, an orientation change area (including a second orientation change mechanism) is formed between a material block and a batch processing area. Additionally, a single-wafer substrate transport area is adjacent to the material block and the orientation change area. Additionally, a single-wafer processing area (including a plurality of single-wafer processing chambers) is adjacent to the single-wafer substrate transport area. Furthermore, the horizontal position of the lifting platform of the horizontal substrate transport mechanism formed in the material block is fixed. Therefore, a carrier placed on a carrier placement shelf, a first orientation change mechanism, a second orientation change mechanism, and a plurality of single-wafer processing chambers can be arranged around the horizontal substrate transport mechanism. By doing so, the transport distance of the substrate by, for example, the horizontal substrate transport mechanism can be shortened, thereby allowing the substrate to be transported efficiently. Additionally, the batch substrate transport mechanism can transport a plurality of substrates in batches between the substrate receiving position within the material block, a plurality of batch processing tanks, and the second orientation change mechanism. In addition, in particular, the substrate removed from the single-wafer processing chamber can be directly transferred to the carrier of the carrier stacking shelf. As a result, throughput can be improved. Effects of the invention

[0019] According to the substrate processing device related to the present invention, throughput can be improved. Brief explanation of the drawing

[0020] FIG. 1 is a plan view showing the schematic configuration of a substrate processing device related to Example 1. Figure 2 is a side view showing a substrate handling mechanism. Figures 3 (a) to (f) are side views for explaining the first posture change mechanism (posture change part and pusher mechanism) of the material block. Figure 4 (a) is a plan view showing the second attitude change mechanism, and (b) is a front view showing the second attitude change mechanism. FIG. 5 is a front view illustrating two chucks (horizontal and vertical) of the posture conversion unit. Figure 6 is a flowchart for explaining the operation of a substrate processing device. Figure 7 is a flowchart illustrating the operation of the second posture conversion mechanism. Figures 8 (a) to (c) are front views illustrating the overall operation of the second posture change mechanism. Figures 9 (a) to (c) are plan views illustrating the overall operation of the second posture change mechanism. Figures 10 (a) to (c) are front views illustrating the operation of the latter part of the second posture change mechanism. Figures 11 (a) to (c) are plan views for explaining the operation of the latter part of the second posture change mechanism. Figure 12 (a) is a plan view showing a second posture change mechanism related to Example 2, and (b) is a front view showing a second posture change mechanism related to Example 2. FIG. 13 is a plan view showing the schematic configuration of a substrate processing device related to Example 3. FIG. 14 is a plan view showing the schematic configuration of a substrate processing device related to a modified example. FIG. 15 is a plan view showing the schematic configuration of a substrate processing device related to a modified example. FIG. 16 is a side view showing a center robot related to a modified example. Specific details for implementing the invention

[0021] Example 1

[0022] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the schematic configuration of a substrate processing apparatus (1) related to Example 1. FIG. 2 is a side view showing a substrate handling mechanism (HTR).

[0023] <1. Overall Composition>

[0024] Refer to FIG. 1. A substrate processing device (1) comprises a stoker block (3), a material block (5), and a processing block (7). The stoker block (3), the material block (5), and the processing block (7) are arranged in a single row in the horizontal direction in sequence.

[0025] The substrate processing device (1) performs, for example, chemical treatment, cleaning treatment, drying treatment, etc. on the substrate (W). The substrate processing device (1) performs batch processing and single-wafer processing in succession on the substrate (W). That is, after performing batch processing, the substrate processing device (1) performs single-wafer processing on the substrate (W). Batch processing is a processing method that processes multiple substrates (W) in batches. Single-wafer processing is a processing method that processes substrates (W) one by one.

[0026] In this specification, for convenience, the direction in which the stoker block (3), material block (5), and processing block (7) are arranged is referred to as the "front-back direction (X)." The front-back direction (X) is horizontal. Among the front-back direction (X), the direction from the material block (5) toward the stoker block (3) is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-back direction (X) is referred to as the "width direction (Y)." One direction of the width direction (Y) is appropriately referred to as the "right direction." The direction opposite to the right direction is referred to as the "left direction." The direction perpendicular to the horizontal direction is referred to as the "vertical direction (Z)." For example, in FIG. 1, the front, back, right, left, up, and down directions are appropriately indicated for reference.

[0027] <2. Stalker Block>

[0028] The stoker block (3) accommodates at least one carrier (C). One or more (e.g., two) load ports (9) are formed in the stoker block (3). The stoker block (3) is equipped with a carrier conveying mechanism (robot) (11) and a shelf (13).

[0029] The carrier conveying mechanism (11) conveys the carrier (C) between the load port (9) and the shelf (13). The carrier conveying mechanism (11) is equipped with a gripping part that grips a protrusion on the upper surface of the carrier (C), or a hand that supports the carrier (C) while in contact with the bottom surface of the carrier (C). The shelf (13) is classified into a shelf (13A) for taking out and storing a substrate (W) and a shelf (13B) for storage.

[0030] A shelf (13A) is positioned adjacent to the material block (5). A mechanism for attaching and detaching the cover portion of the carrier (C) may be formed on the shelf (13A). At least one shelf (13A) is formed. The carrier (C) is placed on the shelf (13A). The carrier (C) stores multiple substrates (W) in a horizontal position at a predetermined interval (e.g., 25 substrates) in a vertical direction (Z). Additionally, the substrates (W) are aligned in the thickness direction of the substrates (W). For example, a FOUP (Front Opening Unify Pod) is used as the carrier (C). The FOUP is a sealed container. The carrier (C) may be an open container, and the type is irrelevant. Additionally, the shelf (13A) corresponds to the carrier placement shelf of the present invention.

[0031] <3. Lee Jae Block>

[0032] The material block (5) is positioned adjacent to the rear (X) of the stoker block (3). The material block (5) is equipped with a substrate handling mechanism (robot) (HTR) and a first posture change mechanism (15). Additionally, the substrate handling mechanism (HTR) corresponds to the substrate handling mechanism of the present invention.

[0033] The substrate handling mechanism (HTR) is formed on the right (Y) side within the material block (5). The substrate handling mechanism (HTR) can collectively transport multiple substrates (e.g., 25 substrates) in a horizontal position between a carrier (C) placed on a shelf (13A), a first position changing mechanism (15), and a buffer section (27) (described later).

[0034] Refer to FIG. 2. A substrate handling mechanism (HTR) is equipped with a plurality (e.g., 25) of hands (17). In FIG. 2, for convenience of illustration, the substrate handling mechanism (HTR) is equipped with three hands (17). Each hand (17) holds one substrate (W).

[0035] Additionally, the substrate handling mechanism (HTR) is equipped with a hand support part (19), a reciprocating part (20), and a lifting / rotating part (21). The hand support part (19) supports a plurality of hands (17). Thus, the plurality of hands (17) move as a whole. The reciprocating part (20) advances and retracts the plurality of hands (17) through the hand support part (19). The lifting / rotating part (21) rotates the plurality of hands (17), etc., around the vertical axis (AX1) by rotating the reciprocating part (20) around the vertical axis (AX1). Also, the lifting / rotating part (21) raises and lowers the plurality of hands (17), etc., by raising and lowering the reciprocating part (20). The lifting / rotating part (21) is fixed to the bottom surface. That is, the lifting / rotating part (21) does not move in the horizontal direction. Additionally, the forward / backward section (20) and the lifting / rotating section (21) are each equipped with an electric motor. Furthermore, the substrate handling mechanism (HTR) may be equipped with a hand (not shown) for conveying one substrate (W) separately from the hand (17) and the hand support section (19).

[0036] Refer to FIG. 1. The first position changing mechanism (15) changes a plurality of substrates (W) extracted from a carrier (C) from a horizontal position to a vertical position. The first position changing mechanism (15) is equipped with a position changing unit (23) and a pusher mechanism (25). In FIG. 1, the substrate handling mechanism (HTR), the position changing unit (23), and the pusher mechanism (25) are arranged in order to the left (Y). FIG. 3(a) to FIG. 3(f) are side views for explaining the first position changing mechanism (15) (position changing unit (23) and pusher mechanism (25)) of the material block (5).

[0037] As shown in FIG. 1 and FIG. 3(a), the posture changing unit (23) comprises a support (23A), a pair of horizontal holding members (23B), a pair of vertical holding members (23C), and a rotary driving unit (23D). A pair of horizontal holding members (23B) and a pair of vertical holding members (23C) are formed on the support (23A). The horizontal holding members (23B) and the vertical holding members (23C) receive a plurality of substrates (W) that are conveyed by a substrate handling mechanism (HTR). When the substrate (W) is in a horizontal posture, a pair of horizontal holding members (23B) support the substrate (W) from below while in contact with the lower surface of each substrate (W). Also, when the substrate (W) is in a vertical position, a pair of vertical holding members (23C) hold the substrate (W).

[0038] The rotary drive unit (23D) rotatably supports the support (23A) around the horizontal axis (AX2). Additionally, the rotary drive unit (23D) changes the position of the multiple substrates (W) held in the holding unit (23B, 23C) from horizontal to vertical by rotating the support (23A) around the horizontal axis (AX2).

[0039] As shown in FIGS. 1 and FIGS. 3(f), the pusher mechanism (25) comprises a pusher (25A), a lifting rotating part (25B), a horizontal moving part (25C), and a rail (25D). The pusher (25A) supports the lower portion of each of a plurality of substrates (W) in a vertical position (e.g., 50 substrates). Additionally, in FIGS. 3(a) to FIGS. 3(f), for convenience of illustration, the pusher (25A) is configured to support 6 substrates (W).

[0040] The lifting rotation part (25B) is connected to the lower surface of the pusher (25A). The lifting rotation part (25B) raises the pusher (25A) in the up and down direction by extending and retracting. Also, the lifting rotation part (25B) rotates the pusher (25A) around the vertical axis (AX3). The horizontal movement part (25C) supports the lifting rotation part (25B). The horizontal movement part (25C) moves the pusher (25A) and the lifting rotation part (25B) horizontally along the rail (25D). The rail (25D) is formed to extend in the width direction (Y). Additionally, the rotation drive part (23D), the lifting rotation part (25B), and the horizontal movement part (25C) are each equipped with an electric motor.

[0041] Here, the operation of the first orientation change mechanism (15) is explained. The batch processing group (BT1 to BT6) described later in the processing block (7) processes 50 substrates (W) in batches, for example, two carriers (C). The first orientation change mechanism (15) changes the orientation of the 50 substrates (W) in batches of 25. In addition, the first orientation change mechanism (15) arranges multiple substrates (W) in a face-to-face manner at a predetermined interval (half pitch). The half pitch is, for example, a 5 mm interval. The pusher mechanism (25) conveys these 50 substrates (W) to the conveying mechanism (WTR).

[0042] Additionally, 25 substrates (W) in the first carrier (C) are described as substrates (W1) of the first substrate group. 25 substrates (W) in the second carrier (C) are described as substrates (W2) of the second substrate group. Also, in FIGS. 3(a) to 3(f), for the sake of illustration, the number of substrates (W1) of the first substrate group is 3, and the number of substrates (W2) of the second substrate group is 3. Also, when there is no particular distinction between substrate (W1) and substrate (W2), substrates (W1 and W2) are described as "substrates (W)."

[0043] Refer to FIG. 3(a). The orientation changer (23) receives 25 substrates (W1) of a first substrate group, which are conveyed by a substrate handling mechanism (HTR), from the holding unit (23B, 23C). At this time, the 25 substrates (W1) are in a horizontal orientation, and the device surface is facing upward. The 25 substrates (W1) are arranged at a predetermined interval (full pitch). The full pitch is, for example, 10 mm interval. The full pitch is also called the normal pitch.

[0044] Also, a half pitch is a spacing that is half the length of a full pitch. Also, the device surface of a substrate (W (W1, W2)) is the surface where an electronic circuit is formed and is called the "surface." Also, the back surface of a substrate (W) refers to the surface where no electronic circuit is formed. The back surface is the surface opposite to the device surface.

[0045] Refer to FIG. 3(b). The orientation changer (23) rotates the holding member (23B, 23C) by 90 degrees around the horizontal axis (AX2) to change the orientation of 25 substrates (W1) from horizontal to vertical. Refer to FIG. 3(c). The pusher mechanism (25) raises the pusher (25A) to a position higher than the holding member (23B, 23C) of the orientation changer (23). By doing so, the pusher (25A) receives 25 substrates (W) from the holding member (23B, 23C). The 25 substrates (W1) held by the pusher (25A) face to the left (Y). In addition, among FIGS. 3(a) to 3(f), the arrow (AR) given to the substrate (W) indicates the direction of the device surface of the substrate (W).

[0046] Refer to FIG. 3(d). The pusher mechanism (25) rotates 25 substrates (W) in a vertical position 180 degrees around the vertical axis (AX3). As a result, the 25 substrates (W1) are inverted and face to the right (Y). Additionally, the inverted 25 substrates (W1) move to the left (Y) by a half-pitch (e.g., 5 mm) from their position before rotation. Furthermore, the holding parts (23B, 23C) of the position change unit (23) are rotated -90 degrees around the horizontal axis (AX2) to a state where the next substrate (W2) can be received. After that, the position change unit (23) receives the 25 substrates (W2) of the second group of substrates, which were conveyed by the substrate handling mechanism (HTR), from the holding parts (23B, 23C). At this time, the 25 substrates (W2) are in a horizontal position, and the device surface is upward. Also, the position conversion unit (23) and the pusher mechanism (25) operate so as not to interfere with each other.

[0047] Refer to FIG. 3(e). The pusher mechanism (25) lowers the pusher (25A) holding the 25 substrates (W1) of the first substrate group to a retracted position. Then, the position changing unit (23) changes the position of the 25 substrates (W2) from horizontal to vertical. After the position change, the 25 substrates (W2) face left (Y). Refer to FIG. 3(f). Then, the pusher mechanism (25) raises the pusher (25A) holding the 25 substrates (W2) of the second substrate group. By doing so, the pusher mechanism (25) receives an additional 25 substrates (W2) from the position changing unit (23).

[0048] Thus, the pusher (25A) holds 50 substrates (W (W1, W2)) of the first substrate group and the second substrate group. The 50 substrates (W) are arranged such that 25 substrates (W1) and 25 substrates (W2) are arranged alternately. The 50 substrates (W) are arranged at a half pitch (e.g., 5 mm interval). Additionally, the 25 substrates (W1) are oriented in the opposite direction to the 25 substrates (W2). Therefore, the 50 substrates (W) are arranged in a face-to-face manner. That is, two adjacent substrates (W1, W2) have two device faces (or two back faces) facing each other.

[0049] After that, the pusher mechanism (25) moves the pusher (25A), which holds 50 substrates (W), along the rail (25D) to the substrate receiving position (PP) below the pair of chucks (29, 30) of the conveying mechanism (WTR).

[0050] <4. Processing Block (7)>

[0051] The processing block (7) is adjacent to the material transfer block (5). The processing block (7) is positioned at the rear (X) of the material transfer block (5). The processing block (7) includes a batch processing area (R1), a batch substrate transport area (R2), an orientation change area (R3), a single-wafer substrate transport area (R4), and a single-wafer processing area (R5). Additionally, the substrate processing device (1) includes a buffer section (27) for placing a substrate (W). Furthermore, the buffer section (27) corresponds to the substrate placement section of the present invention.

[0052] <4-1. Batch Processing Area (R1)>

[0053] The batch processing area (R1) is adjacent to the batch substrate transport area (R2), the orientation change area (R3), and the single-wafer processing area (R5). Additionally, the batch processing area (R1) extends in a direction away from the material block (5) (rear (X)).

[0054] In the batch processing area (R1), for example, six batch processing units (BT1 to BT6) are formed. The six batch processing units (BT1 to BT6) are arranged in a line in the forward and backward direction (X) where the batch processing area (R1) extends. In addition, the number of batch processing units is not limited to six, and multiple units may be used.

[0055] Each of the six batch treatment tanks (BT1 to BT6) immerses and treats multiple substrates (W) in a vertical position in batches. For example, the six batch treatment tanks (BT1 to BT6) consist of four chemical treatment tanks (BT1 to BT4) and two water washing treatment tanks (BT5, BT6). Specifically, two chemical treatment tanks (BT1, BT2) and a water washing treatment tank (BT5) form one set. Then, two chemical treatment tanks (BT3, BT4) and a water washing treatment tank (BT6) form another set.

[0056] Four chemical treatment tanks (BT1 to BT4) each perform etching treatment with a chemical solution. For example, phosphoric acid is used as the chemical solution. Chemical treatment tank (BT1) stores the chemical solution supplied from a chemical discharge pipe not shown. The chemical discharge pipe is formed on the inner wall of the chemical treatment tank (BT1). Three chemical treatment tanks (BT2 to BT4) are each configured in the same way as chemical treatment tank (BT1).

[0057] Each of the two rinsing tanks (BT5, BT6) performs a pure water cleaning treatment to wash away the chemical solution attached to the multiple substrates (W) with pure water. For example, deionized water (DIW) is used as the pure water. Each of the two rinsing tanks (BT5, BT6) stores pure water supplied from a cleaning solution discharge pipe not shown. The cleaning solution discharge pipe is formed on the inner wall of each rinsing tank (BT5, BT6).

[0058] Six lifters (LF1 to LF6) are formed in each of the six batch processing tanks (BT1 to BT6). For example, a lifter (LF1) holds multiple substrates (W) in a vertical position arranged at a predetermined interval (half pitch). Additionally, the lifter (LF1) raises and lowers the multiple substrates (W) between a processing position inside the batch processing tank (chemical processing tank) (BT1) and a receiving position above the batch processing tank (BT1). The other five lifters (LF2 to LF6) are configured in the same way as the lifter (LF1).

[0059] <4-2. Batch Board Transport Area (R2)>

[0060] The batch substrate transport area (R2) is adjacent to the material transfer block (5), the batch processing area (R1), and the position change area (R3). The batch substrate transport area (R2) is formed along the batch processing area (R1). One end of the batch substrate transport area (R2) extends to the material transfer block (5), and the other end extends in a direction away from the material transfer block (5) (rear (X)). The batch substrate transport area (R2) extends parallel to the batch processing area (R1).

[0061] The batch substrate transport area (R2) has a transport mechanism (robot) (WTR). That is, a transport mechanism (WTR) is formed in the batch substrate transport area (R2). The transport mechanism (WTR) transports multiple substrates (e.g., 50 substrates) in a vertical position in batches between a predetermined substrate receiving position (PP) within the material block (5), for example, six batch processing tanks (BT1 to BT6), and a second position changing mechanism (35) (lifter (LF9)). Additionally, when the transport mechanism (WTR) passes the second position changing mechanism (35), the transport mechanism (WTR) moves above the horizontal moving part (95) of the position changing part (63) described later.

[0062] The conveying mechanism (WTR) comprises a pair of chucks (29, 30) and a guide rail (33). Each chuck (29, 30) has 50 retaining grooves to hold, for example, 50 substrates (W). Each of the two chucks (29, 30) extends parallel to each other in the Y direction (Fig. 1) when viewed from a plane. The conveying mechanism (WTR) opens or closes the two chucks (29, 30). The conveying mechanism (WTR) moves the pair of chucks (29, 30) along the guide rail (33). The conveying mechanism (WTR) is driven by an electric motor.

[0063] <4-3. Attitude Transformation Region (R3)>

[0064] The position change area (R3) is formed between the material block (5) and the batch processing area (R1). Also, the position change area (R3) is positioned between the batch substrate transport area (R2), the single-wafer substrate transport area (R4), and the single-wafer processing area (R5). Accordingly, the position change area (R3) is adjacent to the material block (5), the batch processing area (R1), the batch substrate transport area (R2), the single-wafer substrate transport area (R4), and the single-wafer processing area (R5).

[0065] In the orientation conversion area (R3), a second orientation conversion mechanism (35) is formed. The second orientation conversion mechanism (35) converts a plurality of substrates (W) processed in batches from a vertical orientation to a horizontal orientation. Details of the second orientation conversion mechanism (35) will be described later.

[0066] <4-4. Single-wafer substrate transport area (R4)>

[0067] The single-wafer substrate transport area (R4) is adjacent to the material block (5), the orientation change area (R3), and the single-wafer processing area (R5). Additionally, the single-wafer substrate transport area (R4) is formed on the opposite side of the placement substrate transport area (R2) through the orientation change area (R3).

[0068] A center robot (CR) is formed in the single-wafer substrate transport area (R4). The center robot (CR) can transport a substrate (W) in a horizontal position one by one between the second position change mechanism (35), the single-wafer processing chambers (SW1, SW2) (described later), and the buffer section (27). Additionally, a material block (5), the second position change mechanism (35), and the single-wafer processing chambers (SW1, SW2) can be arranged around the center robot (CR). By doing so, the transport distance of the substrate (W) by the center robot (CR) can be shortened, allowing the substrate (W) to be transported efficiently.

[0069] The center robot (CR) is equipped with two hands (37A, 37B), two articulated arms (39A, 39B), and a lifting platform (41). Each of the two hands (37A, 37B) holds a single substrate (W) in a horizontal position. Each of the two hands (37A, 37B) is capable of horizontal movement. Each of the two articulated arms (39A, 39B) is configured, for example, as a scalar type. The tip of the articulated arm (39A) supports the hand (37A), and the tip of the articulated arm (39B) supports the hand (37B). The multi-joint arm (39A) moves the hand (37A) in the horizontal direction (forward / backward direction (X) and width direction (Y)), and the multi-joint arm (39B) moves the hand (37B) in the horizontal direction.

[0070] The lifting platform (41) supports the respective base portions of the two multi-joint arms (39A, 39B). The lifting platform (41) is configured to be extendable in the vertical direction. Therefore, the lifting platform (41) raises the two hands (37A, 37B) and the two multi-joint arms (39A, 39B). The horizontal position of the lifting platform (41) is fixed and does not move. This allows, for example, the conveying distance of the substrate (W) caused by the lifting platform (41) moving in the horizontal direction to be shortened. Also, the movement of the lifting platform (41) can be omitted.

[0071] The buffer section (27) is positioned across the material block (5) and the single-wafer substrate transport area (R4). That is, it is formed at the boundary between the material block (5) and the single-wafer substrate transport area (R4). Additionally, the buffer section (27) may be formed only in the material block (5) or the single-wafer substrate transport area (R4). Therefore, the buffer section (27) may be fixedly formed at the boundary between the material block (5) and the single-wafer substrate transport area (R4), the material block (5), and the single-wafer substrate transport area (R4). Furthermore, the center robot (CR) was equipped with two sets of hands (37A, 37B) and multi-joint arms (39A, 39B), but the center robot (CR) may be equipped with one set or three or more sets of hands and multi-joint arms.

[0072] The buffer section (27) is equipped with a plurality of stacking shelves. Each of the plurality of stacking shelves is in a horizontal position. Each of the plurality of stacking shelves can stack one substrate (W). The buffer section (27) stacks the plurality of substrates (W) in a horizontal position at a predetermined interval (full pitch) in the vertical direction (Z). That is, the plurality of stacking shelves are arranged at a predetermined interval (full pitch) and also in the vertical direction (Z). The buffer section (27) is configured to stack at least 25 substrates (W) that can be transported by the substrate handling mechanism (HTR). The buffer section (27) is configured to stack, for example, 50 substrates (W). If necessary, the number of stacking shelves of the buffer section (27) may be 2 or more and 24 or less.

[0073] <4-5. Single-wafer processing area (R5)>

[0074] The single-wafer processing area (R5) is adjacent to the batch processing area (R1), the position change area (R3), and the single-wafer substrate transport area (R4). The single-wafer processing area (R5) is formed on the opposite side of the transfer block (5) through the single-wafer substrate transport area (R4).

[0075] In the single-wafer processing area (R5), a plurality (e.g., 2) of single-wafer processing chambers (SW1, SW2) are formed. The two single-wafer processing chambers (SW1, SW2) are arranged along the width direction (Y) which is orthogonal to the front-rear direction (X) where the batch processing area (R1) extends. Each single-wafer processing chamber (SW1, SW2) processes one substrate (W) in a horizontal position. The first single-wafer processing chamber (SW1) is placed to the right (Y) of the position change area (R3). The second single-wafer processing chamber (SW2) is placed to the right (Y) of the first single-wafer processing chamber (SW1).

[0076] In addition, the single-wafer processing chambers (SW1, SW2) may be configured in multiple stages. For example, the six single-wafer processing chambers (SW1, SW2) may be arranged with two in the width direction (Y) (horizontal direction) and three in the vertical direction (Z). In addition, the number of single-wafer processing chambers is not limited to two or six.

[0077] For example, the first single-wafer processing chamber (SW1) is equipped with a rotation processing unit (45) and a nozzle (47). The rotation processing unit (45) is equipped with a spin chuck that holds a single substrate (W) in a horizontal position and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate (W). The spin chuck may hold the lower surface of the substrate (W) by vacuum suction. Additionally, the spin chuck may be equipped with three or more chuck pins that hold the outer edge of the substrate (W).

[0078] The nozzle (47) supplies a processing liquid to the substrate (W) held in the rotary processing unit (45). The nozzle (47) moves across a standby position away from the rotary processing unit (45) and a supply position above the rotary processing unit (45). As the processing liquid, for example, pure water (DIW) and IPA (isopropyl alcohol) are used. The single-wafer processing chamber (SW1) may, for example, perform a cleaning treatment with pure water on the substrate (W) and then form a liquid film of IPA on the upper surface of the substrate (W).

[0079] A single-wafer processing chamber (SW2) performs a drying process using, for example, a supercritical fluid. For example, carbon dioxide is used as the fluid. The single-wafer processing chamber (SW2) is equipped with a chamber body (container) (48), a support tray, and a cover. The chamber body (48) is equipped with a processing space formed inside, an opening for placing a substrate (W) into the processing space, a supply port, and an exhaust port. The substrate (W) is supported by the support tray and accommodated in the processing space. The cover blocks the opening of the chamber body (48). For example, the single-wafer processing chamber (SW2) each makes the fluid into a supercritical state and supplies the supercritical fluid from the supply port to the processing space inside the chamber body (48). At this time, the processing space inside the chamber body (48) is exhausted from the exhaust port. A drying process is performed on the substrate (W) by the supercritical fluid supplied to the processing space.

[0080] A supercritical state is obtained by applying a critical temperature and critical pressure inherent to the fluid. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. By performing a drying treatment on the substrate (W) with a supercritical fluid, the collapse of the pattern formed on the substrate (W) can be suppressed.

[0081] <5. Control Unit>

[0082] A substrate processing device (1) is equipped with a control unit (59) and a memory unit (not shown). The control unit (59) controls each component of the substrate processing device (1). The control unit (59) is equipped with one or more processors, such as a central processing unit (CPU). The memory unit is equipped with at least one of, for example, ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The memory unit stores computer programs necessary to control each component of the substrate processing device (1).

[0083] <6. Second Position Change Mechanism>

[0084] FIG. 4(a) is a plan view of the second posture change mechanism (35). FIG. 4(b) is a front view of the second posture change mechanism (35). FIG. 5 is a front view illustrating two chucks (71, 72) (horizontal holding part (79, 81) and vertical holding part (80, 82)) of the posture change part (63).

[0085] The second posture change mechanism (35) comprises a substrate waiting area (R31) and a posture change execution area (R32). The substrate waiting area (R31) and the posture change execution area (R32) are arranged along the front-rear direction (X) where the batch processing area (R1) or six batch processing groups (BT1 to BT6) extend.

[0086] The second attitude change mechanism (35) is equipped with a lifter (LF9) and an attitude change unit (63). The lifter (LF9) is formed in the substrate waiting area (R31). Accordingly, the attitude change unit (63) is formed in the attitude change execution area (R32). Next, details regarding the lifter (LF9) and the attitude change unit (63) will be described.

[0087] <6-1. Lifter (LF9)>

[0088] The lifter (LF9) holds a plurality of substrates (e.g., 50 substrates) conveyed by a conveying mechanism (WTR) in a vertical position. The lifter (LF9) is equipped with a substrate holding part (65) and a lifting part (67) that raises and lowers the substrate holding part (65) in the vertical direction (Z). The substrate holding part (65) corresponds to the substrate holding part of the present invention.

[0089] The substrate holding member (65) holds, for example, 50 substrates (W) arranged at a predetermined interval (e.g., half pitch) from below. The substrate holding member (65) is provided with, for example, three holding members (68) each extending in the Y direction. Each of the three holding members (68) is provided with a number of holding grooves (68A) equal to the number of substrates (W) (50) to hold 50 substrates (W). The inside of each holding groove (68A) is formed in a V shape. The lifting member (67) raises the substrate holding member (65). The lifting member (67) is provided with, for example, an electric motor or an air cylinder.

[0090] In addition, the lifter (LF9) (substrate holding part (65)) and the six batch processing tanks (BT1 to BT6) are arranged in a straight line in the forward and backward direction (X) so that the conveying mechanism (WTR) can convey 50 substrates (W) in a straight line.

[0091] <6-2. Attitude Transformation Section>

[0092] The position changing unit (63) receives a plurality of substrates (W) from the substrate holding unit (65) and changes the position of the plurality of substrates (W) from vertical to horizontal. The position changing unit (63) is equipped with two chucks (71, 72), two arms (75, 76), and an arm support (78).

[0093] The position conversion unit (63) receives multiple substrates (e.g., 25 substrates) from the substrate holding unit (65) using two chucks (71, 72) in the substrate waiting area (R31), and converts the position of the multiple substrates (W) from vertical to horizontal using a vertical rotation unit (94) in the position conversion execution area (R32). This will be explained in detail.

[0094] Two chucks (71, 72) hold multiple substrates (W) (e.g., 25). The first chuck (71) is provided with a first horizontal holding portion (79) and a first vertical holding portion (80). Additionally, the second chuck (72) is provided with a second horizontal holding portion (81) and a second vertical holding portion (82). The two horizontal holding portions (79, 81) and the two vertical holding portions (80, 82) are each formed to extend in the direction in which the multiple substrates (W) are aligned.

[0095] Two horizontal support members (79, 81) accommodate two sides facing the radial direction of each substrate (W) included in the plurality of substrates (W). When the plurality of substrates (W) are in a horizontal position, the two horizontal support members (79, 81) arrange the plurality of substrates (W) at a predetermined interval (e.g., half pitch). Two vertical support members (80, 82) accommodate two sides of each substrate (W) included in the plurality of substrates (W). When the plurality of substrates (W) are in a vertical position, the two vertical support members (80, 82) are formed below the horizontal support members (79, 81). Also, when the plurality of substrates (W) are in a vertical position, the two vertical support members (80, 82) maintain the plurality of substrates (W) in a vertical position. Additionally, when the multiple substrates (W) held by the two vertical holding members (80, 82) are in a vertical position, the two horizontal holding members (79, 81) are arranged in a horizontal direction (XY) while holding the multiple substrates (W). Likewise, when the substrates (W) are in a vertical position, the two vertical holding members (80, 82) are arranged in a horizontal direction (XY) while holding the multiple substrates (W).

[0096] Refer to FIG. 5. Two horizontal support members (79, 81) are provided with multiple pairs (e.g., 50 pairs) of horizontal mounting guide grooves (85, 86). 50 first horizontal mounting guide grooves (85) are formed in the horizontal support member (79). 50 second horizontal mounting guide grooves (86) are formed in the horizontal support member (81). For example, two horizontal mounting guide grooves (85A, 86A) are arranged opposite each other. Additionally, when multiple substrates (W) are in a vertical position, multiple pairs of horizontal mounting guide grooves (85, 86) each have the same function as the through grooves (91, 92) described later.

[0097] Additionally, the two horizontal retaining parts (79, 81) may be provided with, for example, 25 pairs of horizontal mounting guide grooves (85, 86). Also, the number of pairs of horizontal mounting guide grooves (85, 86) is not limited to 50 pairs or 25 pairs. The number of pairs of retaining grooves (89, 90) and passing grooves (91, 92) described later is also not limited to 25 pairs.

[0098] Two vertical retaining members (80, 82) are provided with multiple pairs (e.g., 25 pairs) of retaining grooves (89, 90) and multiple pairs (25 pairs) of passing grooves (91, 92). Each of the multiple pairs of retaining grooves (89, 90) retains one substrate (W). Each of the multiple pairs of passing grooves (91, 92) passes one substrate (W). The multiple pairs of retaining grooves (89, 90) and the multiple pairs of passing grooves (91, 92) are arranged alternately in pairs. Additionally, two retaining grooves (89A, 90A) are arranged opposite each other.

[0099] 25 retaining grooves (89) and 25 passing grooves (91) are formed in the first vertical retaining part (80). The 25 retaining grooves (89) and 25 passing grooves (91) are arranged alternately one by one. 25 retaining grooves (90) and 25 passing grooves (92) are formed in the second vertical retaining part (82). The 25 retaining grooves (90) and 25 passing grooves (92) are arranged alternately one by one. The inside of each retaining groove (89, 90) is formed in the shape of a cross-section V. Therefore, each retaining groove (89, 90) can hold one substrate (W) in a vertical position. As a result, it does not fall over to an adjacent substrate (W).

[0100] As shown in FIG. 4(b), the first arm (75) supports the first horizontal support member (79) and the first vertical support member (80). The second arm (76) supports the second horizontal support member (81) and the second vertical support member (82). The arm support member (78) supports the upper end (base) of each of the two arms (75, 76). The arm support member (78) and the two arms (75, 76) are formed in a C shape or a U shape.

[0101] The arm support (78) is positioned on the opposite side of the two vertical support members (80, 82) through the two horizontal support members (79, 81). Therefore, the arm support (78), etc., supports the two horizontal support members (79, 81) and the two vertical support members (80, 82) from the opposite side of the two vertical support members (80, 82) through the two horizontal support members (79, 81).

[0102] Also, as indicated by the solid line and dotted line in FIG. 5, the two vertical holding members (80, 82) are configured to open and close in a horizontal direction. That is, the position changing member (63) is equipped with an opening / closing member (87) (see FIG. 4). The opening / closing member (87) is equipped with, for example, an electric motor or an air cylinder. The opening / closing member (87) moves the two vertical holding members (80, 82) in a straight line between a holding position (PP2) that narrows the gap between the two vertical holding members (80, 82) to hold the substrate (W) in the two vertical holding members (80, 82) and a passing position (PP3) that widens the gap between the two vertical holding members (80, 82) to pass each substrate (W) between the two vertical holding members (80, 82).

[0103] When the two vertical holding members (80, 82) are in the holding position (PP2), they are in a closed state. For example, when multiple substrates (W) are in a vertical position, the two vertical holding members (80, 82) are spaced apart. The two vertical holding members (80, 82) are moved from the opening / closing part (87) to the holding position (PP2) to hold multiple substrates (W) in a vertical position held by the substrate holding member (65), and the two horizontal holding members (79, 81) receive the multiple substrates (W) held by the two vertical holding members (80, 82). Also, when the two vertical holding members (80, 82) are in the passing position (PP3), they are in an open state. For example, the opening / closing part (87) moves two vertical holding parts (80, 82) to a passing position (PP3) when the vertical rotation part (94), described later, rotates the position of the substrate (W) from vertical to horizontal. That is, when multiple substrates (W) are in a horizontal position, the spacing between the two vertical holding parts (80, 82) is widened.

[0104] Additionally, the position changing unit (63) is equipped with a lateral rotation unit (93), a vertical rotation unit (94), a horizontal movement unit (95), a rotation shaft (97), and a vertical arm (98). The lateral rotation unit (93) rotatably supports the arm support unit (78). When the two vertical holding units (80, 82) hold the substrate (W) in a vertical position, the lateral rotation unit (93) rotates two chucks (71, 72) and the arm support unit (78), etc., around a rotation axis (vertical axis) (AX4) that is orthogonal to the direction in which the substrate (W) is aligned. The lateral rotation unit (93) and the vertical rotation unit (94) are each equipped with, for example, an electric motor.

[0105] The front end of the rotating shaft (97) is connected to the transverse rotation part (93). The base end of the rotating shaft (97) is rotatably connected to the longitudinal rotation part (94). The rotating shaft (97) extends in the horizontal direction (forward / backward direction (X)). Therefore, the central axis of the rotating shaft (97) is the horizontal axis (AX5). The horizontal axis (central axis) (AX5) is formed at a position higher than the substrate (W) in a vertical position maintained by the two vertical support parts (80, 82). The longitudinal rotation part (94) rotates the two chucks (71, 72) and the arm support part (78), etc., around the horizontal axis (AX5) in order to rotate the position of the substrate (W) from vertical to horizontal. The longitudinal rotation part (94) is supported at the lower end of the vertical arm (98).

[0106] The horizontal movement unit (95) moves two chucks (71, 72), an arm support (78), an opening / closing unit (87), a horizontal rotation unit (93), and a vertical rotation unit (94) in a horizontal direction. Additionally, the horizontal movement unit (95) moves the arm support (78) and the vertical rotation unit (94) in a horizontal direction across a substrate waiting area (R31) where a substrate holding unit (65) is placed, and a posture change execution area (R32) for changing a plurality of substrates (W) from a vertical position to a horizontal position.

[0107] The horizontal moving part (95) is formed at a position higher than each substrate (W) in a vertical position maintained by the two vertical holding parts (80, 82). As a result, the two chucks (71, 72) are suspended. This prevents droplets attached to the substrate (W) from falling and contaminating the moving part and the rotating part. This prevents the moving part and the rotating part from malfunctioning due to contamination by droplets.

[0108] The horizontal movement unit (95) comprises an X-direction movement unit (101) and a Y-direction movement unit (102). The X-direction movement unit (101) moves two chucks (71, 72) and an arm support (78), etc., along the front-rear direction (X). The Y-direction movement unit (102) moves two chucks (71, 72) and an arm support (78), etc., along the width direction (Y). Each of the two movement units (101, 102) is equipped with a linear actuator having an electric motor. In FIG. 4(a), the upper end of the vertical arm (98) is movably connected to the Y-direction movement unit (102). The Y-direction movement unit (102) moves the vertical arm (98) along the width direction (Y).

[0109] <7. Operation Description>

[0110] Next, the operation of the substrate processing device (1) will be described with reference to the flowcharts of FIGS. 6 and 7. Refer to FIG. 1. An external transport robot, not shown, transports two carriers (C) to the load port (9) in sequence.

[0111] [Step S01] Return of substrate from carrier

[0112] The carrier conveying mechanism (11) of the stocker block (3) conveys the first carrier (C) from the load port (9) to the shelf (13A). The substrate handling mechanism (HTR) of the material block (5) extracts 25 substrates (W1) in a horizontal position from the first carrier (C) placed on the shelf (13A) and conveys them to the position changing unit (23). After that, the carrier conveying mechanism (11) conveys the empty first carrier (C) to the shelf (13B). After that, the carrier conveying mechanism (11) conveys the second carrier (C) from the load port (9) to the shelf (13A). The substrate handling mechanism (HTR) takes 25 substrates (W2) in a horizontal position from the second carrier (C) placed on the shelf (13A) and returns them to the position changing unit (23).

[0113] [Step S02] Transition to Vertical Position

[0114] Fifty substrates (W (W1, W2)) of two carriers (C) are conveyed to the orientation changer (23). As shown in FIGS. 3(a) to FIGS. 3(f), the orientation changer (23) and the pusher mechanism (25) change the orientation of the 50 substrates (W) from a horizontal orientation to a vertical orientation while aligning the 50 substrates (W) in a face-to-face manner and at a half pitch (5 mm). The pusher mechanism (25) conveys the 50 substrates (W) in a vertical orientation to a predetermined substrate receiving position (PP) within the material block (5).

[0115] [Step S03] Chemical Treatment (Batch Treatment)

[0116] The conveying mechanism (WTR) receives 50 substrates (W) in a vertical position from the pusher mechanism (25) at the substrate receiving position (PP) and conveys the 50 substrates (W) to any one of the four lifters (LF1 to LF4) of the four chemical treatment tanks (BT1 to BT4). Additionally, when the conveying mechanism (WTR) passes through the position change area (R3), the conveying mechanism (WTR) passes, for example, above the second position change mechanism (35) so as not to interfere with the second position change mechanism (35).

[0117] For example, the conveying mechanism (WTR) conveys 50 substrates (W) to the lifter (LF1) of the chemical treatment tank (BT1). The lifter (LF1) receives the 50 substrates (W) from an upper position of the chemical treatment tank (BT1). The lifter (LF1) immerses the 50 substrates (W) in phosphoric acid as a treatment solution in the chemical treatment tank (BT1). In this way, an etching treatment is performed on the 50 substrates (W). After the etching treatment, the lifter (LF1) pulls the 50 substrates (W) out of the phosphoric acid in the chemical treatment tank (BT1). In addition, even when 50 substrates (W) are returned to each of the lifters (LF2 to LF4) of other chemical treatment tanks (BT2 to BT4), the same treatment as in the chemical treatment tank (BT1) is performed.

[0118] [Step S04] Pure Cleaning Treatment (Batch Process)

[0119] The conveying mechanism (WTR) receives 50 substrates (W) in a vertical position from, for example, a lifter (LF1) (or a lifter (LF2)) and conveys the 50 substrates (W) to a lifter (LF5) of a water washing treatment tank (BT5). The lifter (LF5) receives the 50 substrates (W) at an upper position of the water washing treatment tank (BT5). The lifter (LF5) immerses the 50 substrates (W) in pure water within the water washing treatment tank (BT5). In this way, the 50 substrates (W) undergo a cleaning treatment.

[0120] Additionally, when the conveying mechanism (WTR) receives 50 substrates (W) in a vertical position from one of the lifters (LF3, LF4), the conveying mechanism (WTR) conveys the 50 substrates (W) to the lifter (LF6) of the water washing treatment tank (BT6). The lifter (LF6) receives the 50 substrates (W) from an upper position of the water washing treatment tank (BT6). The lifter (LF6) immerses the 50 substrates (W) in pure water within the water washing treatment tank (BT6).

[0121] [Step S05] Transition to Horizontal Position

[0122] The second orientation change mechanism (35) changes the orientation of the substrate (W) that has undergone cleaning treatment from vertical to horizontal. Here, the following problem exists. That is, if the orientation of 50 substrates (W) arranged at half pitch (5 mm interval) is changed all at once, there may be cases where each hand (37A, 37B) of the center robot (CR) cannot properly enter the gap between two adjacent substrates (W) among the 50 substrates (W).

[0123] Also, when the substrate (W) is aligned in a face-to-face manner, the substrate (W) converted to a horizontal position may have a device surface facing upward and a device surface facing downward. For example, it is not desirable for each hand (37A, 37B) of the center robot (CR) to come into contact with the device surface of the substrate (W). Also, it is not desirable for substrates (W) with different device surface orientations to be returned to each single-wafer processing chamber (SW1, SW2).

[0124] Therefore, in this embodiment, the spacing between two adjacent substrates (W) is widened, and the orientation of the device surfaces of 50 substrates (W) is aligned with each other. This will be explained in detail with reference to the flowchart of FIG. 7, FIG. 1, and FIG. 8(a) to FIG. 11(c).

[0125] Also, FIGS. 8(a) to 8(c) and FIGS. 10(a) to 10(c) are front views of the second posture change mechanism (35). FIGS. 9(a) to 9(c) and FIGS. 11(a) to 11(c) are top views of the second posture change mechanism (35). For example, FIG. 9(a) corresponds to FIG. 8(a). Also, FIG. 11(b) corresponds to FIG. 10(b).

[0126] [Step S11] Return of the substrate to the lifter (LF9)

[0127] Refer to FIG. 1. The conveying mechanism (WTR) conveys 50 substrates (W) from one side of the lifters (LF5, LF6) to the substrate holding part (65) of the lifter (LF9) of the second position changing mechanism (35). The substrate holding part (65) of the lifter (LF9) holds 50 substrates (W) in a vertical position arranged in a half-pitch and face-to-face manner. Additionally, the 50 substrates (W) are aligned along the width direction (Y).

[0128] [Step S12] Movement of the attitude conversion unit to the substrate waiting area

[0129] Refer to FIG. 8(a) and FIG. 9(a). When 50 substrates (W) in a vertical position are held by the substrate holding member (65), the horizontal moving member (95) (mainly the X-direction moving member (101)) of the position conversion member (63) moves two chucks (71, 72) and an arm support member (78), etc., from the position conversion execution area (R32) to the upper side of the substrate holding member (65) in the substrate waiting area (R31). Also, the Y-direction moving member (102) of the horizontal moving member (95) moves two chucks (71, 72) and an arm support member (78), etc., to a first substrate holding position. Additionally, the first substrate holding position is a position where 25 pairs of holding grooves (89, 90) can hold 25 substrates (W1) of the first substrate group.

[0130] Also, the opening / closing part (87) of the posture changing part (63) is opened by horizontally moving the two vertical holding parts (80, 82) away from each other (see passing position (PP3) in FIG. 5).

[0131] [Step S13] Receipt of the first substrate group by the attitude conversion unit

[0132] Two vertical holding members (80, 82) are moved from the opening / closing member (87) to the holding position (PP2) to hold a first divided substrate group (25 substrates (W1)) aligned at intervals of 1 sheet among 50 substrates (W) in a vertical position held in the substrate holding member (65) in 25 pairs of holding grooves (89, 90), and two horizontal holding members (79, 81) receive the first divided substrate group (25 substrates (W1)). This will be explained in detail.

[0133] The substrate holding member (65) holds 50 substrates (W (W1, W2)) in a vertical position. The lifting member (67) of the lifter (LF9) raises the substrate holding member (65) to a height capable of guiding the substrates (W). At this time, the 50 substrates (W) pass between the two vertical holding members (80, 82) and enter each of the 50 pairs of horizontal mounting guide grooves (85, 86) of the two horizontal holding members (79, 81).

[0134] After that, the opening / closing part (87) moves horizontally in a direction that brings the two vertical holding parts (80, 82) closer to each other, so that it is closed (see holding position (PP2) in FIG. 5). Thus, the 50 substrates (W) that the substrate holding part (65) holds in a vertical position are accommodated by 25 pairs of holding grooves (89, 90) and 25 pairs of passing grooves (91, 92) arranged alternately in pairs, as shown in the two lower frames of FIG. 5.

[0135] After that, the lifting part (67) of the lifter (LF9) lowers the substrate holding part (65) to a lower standby position. As a result, 25 substrates (W1) of the first substrate group are delivered to the position changing part (63), while 25 substrates (W2) of the second substrate group are left in the substrate holding part (65). That is, the position changing part (63) holds and extracts 25 substrates (W1) of the first substrate group, which are aligned at intervals of 1 of the 50 substrates (W) from the substrate holding part (65), from 25 pairs of holding grooves (89, 90). Also, the multiple substrates (W1) of the first substrate group are called the first divided substrate group. Also, the multiple substrates (W2) of the second substrate group are called the second divided substrate group.

[0136] Additionally, 25 substrates (W1) extracted at intervals of 1 sheet are aligned at full pitch. Also, 25 substrates (W2) left in the substrate holding part (65) are also arranged at full pitch. The 25 substrates (W2) left in the substrate holding part (65) are put into a standby state.

[0137] [Step S14] Move to the posture transformation execution area

[0138] Refer to FIG. 8(b) and FIG. 9(b). The horizontal moving unit (95) (X-direction moving unit (101) and Y-direction moving unit (102)) moves two chucks (71, 72) and an arm support (78), etc., from above the substrate holding unit (65) of the substrate waiting area (R31) to a predetermined position in the posture change execution area (R32) while holding 25 substrates (W1) in the two vertical holding units (80, 82). That is, the posture change unit (63) returns 25 substrates (W1) of the first substrate group in a vertical position to the posture change execution area (R32).

[0139] [Step S15] Horizontal orientation conversion of the first substrate group by the orientation conversion unit

[0140] Refer to FIG. 8(c) and FIG. 9(c). Then, in the posture change execution area (R32), the posture change unit (63) changes the posture of the 25 extracted substrates (W1) to a horizontal posture. Specifically, the vertical rotation unit (94) of the posture change unit (63) rotates the substrates (W1), two chucks (71, 72), and arm support (78) 90 degrees around the horizontal axis (AX5) so that the two vertical holding units (80, 82) face the center robot (CR) (see FIG. 1).

[0141] In this state, the center robot (CR) cannot extract the substrate (W1) from the posture conversion unit (63). Therefore, the opening / closing unit (87) of the posture conversion unit (63) moves the two vertical holding units (80, 82) horizontally in a direction away from each other to open the unit. That is, when 25 substrates (W1) converted to a horizontal posture are placed on the two horizontal holding units (79, 81), the opening / closing unit (87) moves the two vertical holding units (80, 82) to a passing position (PP3). This allows the substrate (W1) to pass between the two vertical holding units (80, 82). Additionally, the 25 substrates (W1) are placed on each of the 25 horizontal mounting guide grooves (85, 86). Since 25 substrates (W1) are aligned at full pitch, the center robot (CR) can easily extract the substrates (W).

[0142] After that, the center robot (CR) uses two hands (37A, 37B) to take out one substrate (W1) at a time from 25 substrates (W1) in a horizontal position while passing between two vertical holding members (80, 82) that have been moved to a passing position (PP3), and returns the taken-out substrate (W1) to a single-wafer processing chamber (SW1).

[0143] [Step S16] Movement of the attitude conversion unit to the substrate waiting area

[0144] Refer to FIG. 10(a) and FIG. 11(a). After all 25 substrates (W1) are returned from the orientation change unit (63), the horizontal movement unit (95) (mainly the X-direction movement unit (101)) moves two chucks (71, 72) and an arm support (78), etc., from the orientation change execution area (R32) to the upper side of the substrate holding unit (65) in the substrate waiting area (R31). Also, the Y-direction movement unit (102) of the horizontal movement unit (95) moves two chucks (71, 72) and an arm support (78), etc., to a second substrate holding position. Additionally, the second substrate holding position is a position where 25 pairs of holding grooves (89, 90) can hold 25 substrates (W2) of the second substrate group.

[0145] Also, the opening / closing part (87) of the posture changing part (63) is opened by horizontally moving the two vertical holding parts (80, 82) away from each other (see passing position (PP3) in FIG. 5).

[0146] [Step S17] Receipt of the second substrate group by the attitude conversion unit

[0147] The substrate holding member (65) holds 25 substrates (W2) of the second substrate group in a vertical position. The lifting member (67) of the lifter (LF9) raises the substrate holding member (65) to a height capable of guiding the substrates (W2). At this time, the 25 substrates (W2) pass between the two vertical holding members (80, 82) and each enter 25 pairs of horizontal mounting guide grooves (85, 86) out of 50 pairs of horizontal mounting guide grooves (85, 86).

[0148] After that, the opening / closing part (87) moves horizontally in a direction that brings the two vertical holding parts (80, 82) closer to each other to close the opening / closing part (see holding position (PP2) in FIG. 5). Thus, the 25 substrates (W2) held in a vertical position by the substrate holding part (65) are accommodated by the 25 pairs of holding grooves (89, 90).

[0149] After that, the lifting part (67) of the lifter (LF9) lowers the substrate holding part (65) to a lower standby position. In this way, 25 substrates (W2) of the second substrate group are delivered to the position changing part (63). That is, the position changing part (63) receives the 25 substrates (W2) of the second substrate group from the substrate holding part (65) by holding them in 25 pairs of holding grooves (89, 90).

[0150] [Step S18] Move to the posture transformation execution area

[0151] Refer to FIG. 10(b) and FIG. 11(b). The horizontal moving unit (95) (X-direction moving unit (101) and Y-direction moving unit (102)) moves two chucks (71, 72) and an arm support (78), etc., from above the substrate holding unit (65) of the substrate waiting area (R31) to a predetermined position in the posture change execution area (R32) while holding 25 substrates (W2) in two vertical holding units (80, 82). That is, the posture change unit (63) conveys 25 substrates (W2) in a vertical position to the posture change execution area (R32).

[0152] [Step S19] 180-degree rotation of the second substrate group by the lateral rotation part

[0153] Additionally, in the orientation change execution area (R32), the horizontal rotation part (93) of the orientation change part (63) rotates the vertical orientation substrate (W2) and arm support part (78), etc., 180 degrees around the rotation axis (AX4). As a result, the direction of the device surface indicated by the arrow (AR) is rotated 180 degrees from the left (Y) to the right (Y). Therefore, when the horizontal orientation is changed, the direction of the device surface of each substrate (W2) can be turned upward.

[0154] [Step S20] Horizontal orientation conversion of the second substrate group by the orientation conversion unit

[0155] Refer to FIG. 10(c) and FIG. 11(c). After that, the posture conversion unit (63) converts the posture of the 25 substrates (W2) being held to a horizontal posture. Specifically, the vertical rotation unit (94) of the posture conversion unit (63) rotates the substrates (W2), two chucks (71, 72), and arm support (78) around the horizontal axis (AX5) by 90 degrees so that the two vertical holding units (80, 82) face the center robot (CR) (see FIG. 1).

[0156] After that, the opening / closing part (87) of the position change part (63) is opened by horizontally moving the two vertical holding parts (80, 82) away from each other (see passing position (PP3) in FIG. 5). This allows the substrate (W2) to pass between the two vertical holding parts (80, 82). Also, 25 substrates (W2) are placed in each of the 25 horizontal mounting guide grooves (85, 86).

[0157] After that, the center robot (CR) uses two hands (37A, 37B) to move between two vertical holding members (80, 82) to a passing position (PP3) to extract one substrate (W2) at a time from 25 substrates (W2) in a horizontal position, and returns the extracted substrates (W2) to a single-wafer processing chamber (SW1). Additionally, as shown in FIG. 10C and FIG. 11C, the next 50 substrates (W) are returned to the substrate holding member (65) of the lifter (LF9) by a return mechanism (WTR).

[0158] [Step S06] 1st Single-wafer Processing

[0159] Returning to the explanation of the flowchart in FIG. 6. For example, the center robot (CR) conveys substrates (W (W1, W2)) one by one from the orientation conversion unit (63) to the first single-wafer processing chamber (SW1). The first single-wafer processing chamber (SW1) supplies pure water to the device surface from the nozzle (47) while rotating the substrate (W) with the device surface facing upward, for example, by the rotation processing unit (45). After that, the first single-wafer processing chamber (SW1) supplies IPA from the nozzle (47) to the device surface (upper surface) of the substrate (W) to replace the pure water of the substrate (W) with IPA.

[0160] [Step S07] 2nd Single-wafer Processing (Drying Process)

[0161] After that, the center robot (CR) removes the substrate (W) wetted with IPA from the first single-wafer processing chamber (SW1) and returns the substrate (W) to the second single-wafer processing chamber (SW2). The second single-wafer processing chamber (SW2) performs a drying treatment on the substrate (W) using supercritical carbon dioxide (supercritical fluid). By using a supercritical fluid for the drying treatment, pattern collapse on the pattern surface (device surface) of the substrate (W) is suppressed.

[0162] [Step S08] Return of substrate from buffer to carrier

[0163] The center robot (CR) returns the substrate (W) after drying treatment from the second single-wafer processing chamber (SW2) to one of the storage shelves of the buffer section (27). When a lot (25 sheets) of substrates (W1) is returned to the buffer section (27), the substrate handling mechanism (HTR) returns the 25 substrates (W1) in bulk from the buffer section (27) to the empty first carrier (C) stored on the shelf (13A). After that, the carrier return mechanism (11) in the stocker block (3) returns the first carrier (C) to the load port (9).

[0164] Also, when one lot of substrates (W2) are placed in the buffer section (27), the substrate handling mechanism (HTR) conveys 25 substrates (W2) in a batch from the buffer section (27) to the empty second carrier (C) placed on the shelf (13A). After that, the carrier conveying mechanism (11) in the stocker block (3) conveys the second carrier (C) to the load port (9). An external conveying robot, not shown, conveys the two carriers (C) to the next destination in turn.

[0165] According to the present embodiment, the orientation change area (R3) (including the second orientation change mechanism (35)) is formed between the material block (5) and the batch processing area (R1). Additionally, the single-wafer substrate transport area (R4) is adjacent to the material block (5) and the orientation change area (R3). Additionally, the single-wafer processing area (R5) (including a plurality of single-wafer processing chambers (SW1, SW2)) is adjacent to the single-wafer substrate transport area (R4). Furthermore, the horizontal (XY) position of the lifting platform (41) of the center robot (CR) formed in the single-wafer substrate transport area (R4) is fixed. Therefore, the material block (5), the second orientation change mechanism (35), and a plurality of single-wafer processing chambers (SW1, SW2) can be arranged around the center robot (CR). Thus, the conveying distance of the substrate (W) by, for example, the center robot (CR) can be shortened, allowing the substrate (W) to be conveyed efficiently. In addition, the conveying mechanism (WTR) can convey multiple substrates (W) in batches between the substrate receiving position (PP) within the material block (5), six batch processing tanks (BT1 to BT6), and the second position change mechanism (35). As a result, throughput can be improved.

[0166] Additionally, the second posture change mechanism (35) comprises a substrate waiting area (R31) and a posture change execution area (R32) arranged along the front-rear direction (X) where the batch processing area (R1) extends. In the substrate waiting area (R31), a substrate holding part (65) is formed to maintain a plurality of substrates (W) transported by a transport mechanism (WTR) in a vertical position. In the posture change execution area (R32), a posture change part (63) is formed. The position change unit (63) comprises two chucks (71, 72) for holding a plurality of substrates (W), a vertical rotation unit (94) for rotating the two chucks (71, 72) around a horizontal axis (AX5), and a horizontal movement unit (95) for moving the two chucks (71, 72) and the vertical rotation unit (94) between the upper part of the substrate holding unit (65) and a preset position of the position change execution area (R32).

[0167] The position change unit (63) receives a plurality of substrates (W) from the substrate holding unit (65) using two chucks (71, 72) in the substrate waiting area (R31), and changes the position of the plurality of substrates (W) from vertical to horizontal using the vertical rotation unit (94) in the position change execution area (R32).

[0168] Thus, in the width direction (Y) orthogonal to the front-rear direction (X) where the batch processing area (R1) is extended, the width of the position conversion area (R3) where the second position conversion mechanism (35) is placed becomes smaller. Therefore, the width of the substrate processing device (1) can be kept small.

[0169] Additionally, the single-wafer processing area (R5) is formed on the opposite side of the material block (5) through the single-wafer substrate transport area (R4). In the width direction (Y) which is orthogonal to the front-rear direction (X) where the batch processing area (R1) extends, the width of the material block (5) is relatively large. Since the single-wafer processing area (R5) is positioned to face the material block (5), the width of the substrate processing device (1) can be kept small.

[0170] Example 2

[0171] Next, Example 2 of the present invention will be described with reference to the drawings. Also, descriptions that overlap with Example 1 will be omitted. FIG. 12(a) is a plan view showing a second posture change mechanism (35) related to Example 2. FIG. 12(b) is a front view of FIG. 12(a).

[0172] In Example 1, the second posture change mechanism (35) had a lifter (LF9) and a posture change part (63) having a lateral rotation part (93). In this respect, the second posture change mechanism (35) of Example 2 has a pusher mechanism (105) and a posture change part (63) that does not have a lateral rotation part (93).

[0173] The pusher mechanism (105) maintains a plurality of substrates (e.g., 50 sheets) conveyed by the conveying mechanism (WTR) in a vertical position. The pusher mechanism (105) is equipped with a pusher (107) and a lifting rotation part (109). Additionally, the pusher (107) corresponds to the substrate holding part of the present invention.

[0174] The pusher (107) holds, for example, 50 substrates (W) arranged at a predetermined interval (e.g., half pitch) from below. To hold the 50 substrates (W), the pusher (107) is provided with a number of holding grooves (not shown) equal to the number of substrates (W) (50). The inside of each holding groove of the pusher (107) is formed in a V shape. The lifting and rotating part (109) raises and lowers the pusher (107) and also rotates the pusher (107) around a vertical axis (AX6). The lifting and rotating part (109) is provided with, for example, one or more electric motors.

[0175] Also, as shown in FIG. 12(b), the posture changing part (63) of Example 2 does not have the lateral rotation part (93) shown in FIG. 4(b). Therefore, the tip of the rotation shaft (97) is fixed to the arm support part (78).

[0176] Next, referring to the flowchart of FIG. 7, the operation of the second position change mechanism (35) of Example 2 will be described. The operation of the second position change mechanism (35) basically operates as shown in the flowchart of FIG. 7. However, since the second position change mechanism (35) of Example 2 does not have a lateral rotation part (93), step S19 shown in FIG. 7 is not performed. Instead, the pusher mechanism (105) rotates 25 substrates (W2) of the second substrate group around the vertical axis (AX6).

[0177] In step S13 of FIG. 7, the position changer (63) holds and extracts 25 substrates (W1) aligned at intervals of 1 of 50 substrates (W) from the substrate holding part (65) in two vertical holding parts (80, 82) (25 pairs of holding grooves (89, 90)).

[0178] After that, the lifting and rotating part (109) of the pusher mechanism (105) rotates the 25 substrates (W2) held by the pusher (107) by 180 degrees around the vertical axis (AX6). By doing so, when the orientation of the substrates (W2) of the second substrate group is changed, the device surface can be turned upward, just like the substrate (W1) of the first substrate group. Also, the vertical axis (AX6) is set at the center of the 50 substrates (W) held by the pusher (107) when viewed from a plane. Therefore, due to the 180-degree rotation, the position of the substrates (W2) is offset by half a pitch in the alignment direction of the substrates (W). For this reason, two vertical holding members (80, 82) can hold the substrate (W1) of the second substrate group at the same position as the first substrate holding position, which can hold the substrate (W1) of the first substrate group in 25 pairs of holding grooves (89, 90). Additionally, a horizontal moving member (95) may move the two vertical holding members (80, 82), etc., to the first substrate holding position and the second substrate holding position, respectively.

[0179] After that, in step S17 of FIG. 7, the position conversion unit (63) holds and transports 25 substrates (W2) that have been rotated 180 degrees. Also, in Example 2, step S19 of FIG. 7 is not performed.

[0180] According to the present embodiment, the lifting rotation part (109) of the pusher mechanism (105) rotates the pusher (107) around the vertical axis (AX6). Therefore, the orientation change part (63) does not need to be equipped with the lateral rotation part (93) of Embodiment 1, and since the front and back directions of the substrate (W) can be changed on the side of the pusher (107), the configuration of the orientation change part (63) can be simplified.

[0181] Example 3

[0182] Next, Example 3 of the present invention will be described with reference to the drawings. Additionally, descriptions that overlap with Examples 1 and 2 will be omitted. FIG. 13 is a plan view showing the schematic configuration of a substrate processing apparatus (1) related to Example 3.

[0183] In Example 1, the substrate processing device (1) is equipped with a substrate handling mechanism (HTR), a center robot (CR), and a buffer section (27) (see FIG. 1). In this respect, in Example 3, the substrate processing device (1) is not equipped with a substrate handling mechanism (HTR) and a buffer section (27). That is, the center robot (CR2) additionally performs the role of the substrate handling mechanism (HTR).

[0184] Refer to FIG. 13. The material block (5) is equipped with a center robot (CR2). The single-wafer substrate transport area (R4) is not equipped with a transport robot including the center robot (CR2). The center robot (CR2) of the material block (5) is configured almost identically to the center robot (CR) of Example 1. The center robot (CR2) transports a substrate (W) between a carrier (C) placed on a shelf (13A), a first position change mechanism (15), a second position change mechanism (35) (position change unit (63)), and a plurality of single-wafer processing chambers (SW1, SW2).

[0185] For example, the center robot (CR2) uses each hand (37A, 37B) to take out one substrate (W) from the carrier (C) placed on the shelf (13A) and returns the one substrate (W) to the first position change mechanism (15). Also, the center robot (CR2) uses each hand (37A, 37B) to take out one substrate (W) from the second position change mechanism (35) and returns the one substrate (W) to the first single-wafer processing chamber (SW1).

[0186] Also, the center robot (CR2) takes one substrate (W) from the first single-wafer processing chamber (SW1) and returns the one substrate (W) to the second single-wafer processing chamber (SW2). Also, the center robot (CR2) takes one substrate (W) from the second single-wafer processing chamber (SW2) and returns the one substrate (W) to the carrier (C) placed on the shelf (13A).

[0187] According to the present embodiment, the orientation change area (R3) (including the second orientation change mechanism (35)) is formed between the material block (5) and the batch processing area (R1). Also, the single-wafer substrate transport area (R4) is adjacent to the material block (5) and the orientation change area (R3). Additionally, the single-wafer processing area (R5) (including a plurality of single-wafer processing chambers (SW1, SW2)) is adjacent to the single-wafer substrate transport area (R4). Also, the horizontal (XY) position of the lifting platform (41) of the center robot (CR2) formed in the material block (5) is fixed. Therefore, the carrier (C) placed on the placement shelf (13A), the first orientation change mechanism (15), the second orientation change mechanism (35), and a plurality of single-wafer processing chambers (SW1, SW2) can be placed around the center robot (CR2). Thus, the conveying distance of the substrate (W) by, for example, the center robot (CR2) can be shortened, allowing the substrate (W) to be conveyed efficiently. In addition, the conveying mechanism (WTR) can convey multiple substrates (W) in batches between the substrate receiving positions (PP) within the material block (5), for example, six batch processing tanks (BT1 to BT6) and the second position change mechanism (35). In particular, the substrate (W) removed from the single-wafer processing chamber (SW2) can be conveyed directly to the carrier (C) of the storage shelf (13A). As a result, the throughput can be improved.

[0188] The present invention is not limited to the above embodiments and can be modified as follows.

[0189] (1) In each of the embodiments described above, for example in FIG. 1, the substrate waiting area (R31) of the second posture change mechanism (35) is adjacent to the placement processing area (R1), and the posture change execution area (R32) is adjacent to the material block (5). That is, the substrate waiting area (R31) and the posture change execution area (R32) of the second posture change mechanism (35) are arranged in the front-back direction (X). In this regard, as shown in FIG. 14, the substrate waiting area (R31) and the posture change execution area (R32) may be arranged in the width direction (Y).

[0190] In this case, the orientation change execution area (R32) is located to the left (Y) of the single-wafer substrate transport area (R4). The substrate waiting area (R31) is located to the left (Y) of the orientation change execution area (R32).

[0191] (2) In each of the embodiments and variations described above (1), the single-wafer processing area (R5) (single-wafer processing chambers (SW1, SW2)) is formed on the opposite side of the material block (5) through the single-wafer substrate transport area (R4) and is adjacent to the orientation change area (R3). In this regard, as shown in FIG. 15, the processing block (7) may additionally have a second single-wafer processing area (R6) formed on the opposite side of the orientation change area (R3) through the single-wafer substrate transport area (R4). In the second single-wafer processing area (R6), a third single-wafer processing chamber (SW3) is formed in the same manner as one of the single-wafer processing chambers (SW1, SW2). In addition, the second single-wafer processing area (R6) may have a plurality of third single-wafer processing chambers (SW3) arranged in the vertical direction (Z).

[0192] As a result, the single-wafer processing area is enlarged, allowing many single-wafer processing chambers to be arranged. That is, in FIG. 15, since a single-wafer processing chamber (SW3) is formed, the number of single-wafer processing chambers can be increased. Therefore, the throughput of single-wafer processing can be improved.

[0193] (3) In each embodiment and each variant described above, the lifting platform (41) of the center robot (CR) is formed on the bottom surface of the single-wafer transport area (R4). Alternatively, the center robot (CR), i.e., the lifting platform (41), may be suspended at an upper position of the single-wafer transport area (R4). At this upper position, the horizontal (XY) position of the lifting platform (41) is fixed. As shown in FIG. 16, the upper end (base) of the lifting platform (41) does not move in the horizontal (XY) direction and is fixed to the support frame (120) on the ceiling side above the single-wafer transport area (R4). The base of the multi-joint arms (39A, 39B) is formed at the lower part of the lifting platform (41). Two hands (37A, 37B) are formed on the tip (and lower side) of the multi-jointed arm (39A, 39B), respectively.

[0194] According to the present variation, contamination of the center robot (CR (CR2)) can be prevented by dropping a droplet from a wet substrate. For example, it can prevent the center robot (CR (CR2)) from failing due to contamination.

[0195] (4) In each embodiment and each variant described above, each batch processing unit (BT1 to BT6) processed 50 substrates (W) arranged in a half-pitch and face-to-face manner. In this regard, each batch processing unit (BT1 to BT6) may process substrates (W) arranged in a face-to-back manner where the device surfaces of all substrates (W) face the same direction. Each batch processing unit (BT1 to BT6) may process 25 substrates (W) per carrier (C) arranged in a full pitch. In addition, when 50 substrates (W) are arranged in a face-to-back manner in the substrate holding unit (65), the Y direction moving unit (102) moves two chucks (71, 72) in the width direction (Y) where the substrates (W) are aligned. That is, the Y direction moving unit (102) moves two chucks (71, 72) between the first substrate holding position and the second substrate holding position. By doing so, the position changing unit (63) can output 25 substrates (W1) or 25 substrates (W2).

[0196] (5) In each of the embodiments and variations described above, the single-wafer processing chamber (SW2) performs a drying treatment of the substrate (W) using a supercritical fluid. In this regard, the single-wafer processing chamber (SW2) may be equipped with a rotary processing unit (45) and a nozzle (47) in the same way as the single-wafer processing chamber (SW1). In this case, the single-wafer processing chambers (SW1, SW2) (or single-wafer processing chambers (SW1 to SW3)) each supply, for example, pure water and IPA to the substrate (W) in sequence, and then perform a drying treatment (spin drying) of the substrate (W).

[0197] (6) In each embodiment and each variant described above, for example, in step S13, when the posture changing unit (63) receives the substrate (W) from the substrate holding unit (65), the lifting unit (67) as a relative lifting unit raises the substrate holding unit (65). In this regard, the posture changing unit (63) may be equipped with a lifting unit and may receive the substrate (W) from the substrate holding unit (65) by raising two chucks (71, 72) and an arm support unit (78), etc. Also, when the posture changing unit (63) receives the substrate (W) from the substrate holding unit (65), the lifting unit of the posture changing unit (63) and the lifting unit (67) may be raised together. Explanation of the symbols

[0198] 1 : Substrate processing device 3: Stalker Block 5 : Lee Jae Block 7 : Processing block 13A : Shelf HTR: Substrate handling mechanism 15: First posture change mechanism PP: Substrate receiving position R1: Batch processing area R2: Batch substrate return area R3: Attitude transformation area R4: Single-wafer substrate transport area R5: Single-wafer processing area 27 : Buffer section BT1 ~ BT6: Batch treatment tanks WTR: Return mechanism 35: Second posture conversion mechanism CR, CR2: Center robot 41 : Elevator 59 : Control unit R31: Substrate waiting area R32: Posture Transformation Execution Area LF9 : Lifter 63: Attitude conversion section 65: Substrate holding part 71, 72 : Chuck 94 : Rotating section 95 : Horizontal movement part AX5: Horizontal axis

Claims

Claim 1 A substrate processing device for continuously performing batch processing for processing multiple substrates collectively and single-wafer processing for processing substrates one by one, comprising: a carrier storage shelf for storing a carrier that stores multiple substrates in a horizontal position at a predetermined interval in a vertical direction; a transfer block adjacent to the carrier storage shelf; a processing block adjacent to the transfer block; and a substrate storage section for storing substrates. The transfer block comprises a first position conversion mechanism for converting the multiple substrates extracted from the carrier from a horizontal position to a vertical position; and a substrate handling mechanism for collectively transporting the multiple substrates in a horizontal position between the carrier stored on the carrier storage shelf, the first position conversion mechanism, and the substrate storage section. The processing block comprises a batch processing area extending in a direction away from the transfer block; a batch substrate transport area formed along the batch processing area, with one end extending to the transfer block and the other end extending in a direction away from the transfer block; and the transfer block and the batch processing area The apparatus comprises an orientation conversion area formed between, a single-wafer substrate transport area adjacent to the material block and the orientation conversion area, and a single-wafer processing area adjacent to the single-wafer substrate transport area; in the batch processing area, a plurality of batch processing tanks for processing the plurality of substrates in a vertical orientation collectively are arranged in the direction in which the batch processing area extends; in the orientation conversion area, a second orientation conversion mechanism is formed to convert the batch-processed plurality of substrates from a vertical orientation to a horizontal orientation; in the batch substrate transport area, a batch substrate transport mechanism is formed to transport the plurality of substrates in a vertical orientation collectively between a substrate receiving position determined within the material block, the plurality of batch processing tanks, and the second orientation conversion mechanism; in the single-wafer processing area, a plurality of single-wafer processing chambers for processing substrates in a horizontal orientation one by one are formed; and in the single-wafer substrate transport area,A substrate processing apparatus characterized in that a horizontal substrate conveying mechanism capable of conveying a substrate in a horizontal position one by one is formed between the second position changing mechanism, the plurality of single-wafer processing chambers, and the substrate placement section, and the horizontal substrate conveying mechanism comprises a horizontally movable hand for maintaining a substrate in a horizontal position and a lifting platform for raising and lowering the hand, wherein the lifting platform has a fixed position in the horizontal direction. Claim 2 A substrate processing device according to claim 1, wherein the second orientation change mechanism comprises a substrate waiting area and an orientation change execution area arranged along the direction in which the batch processing area extends, wherein the substrate waiting area has a substrate holding part formed therein for maintaining the plurality of substrates conveyed by the batch substrate conveying mechanism in a vertical orientation, and the orientation change execution area has a orientation change part formed therein having two chucks for maintaining the plurality of substrates, a vertical rotation part for rotating the two chucks around a horizontal axis, and a horizontal movement part for moving the two chucks and the vertical rotation part between the upper side of the substrate holding part and a preset position of the orientation change execution area, and wherein the orientation change part receives the plurality of substrates from the substrate holding part using the two chucks in the substrate waiting area, and changes the orientation of the plurality of substrates from vertical to horizontal using the vertical rotation part in the orientation change execution area. Claim 3 A substrate processing apparatus according to claim 1 or 2, wherein the horizontal substrate transport mechanism is suspended at a position above the single-wafer substrate transport area. Claim 4 A substrate processing apparatus according to claim 1 or 2, wherein the single-wafer substrate transport area is formed between the material block and the single-wafer processing area, and the single-wafer processing area is formed adjacent to the position change area. Claim 5 A substrate processing apparatus according to claim 4, wherein the processing block further comprises a second single-wafer processing area, and the single-wafer substrate transport area is formed between the position conversion area and the second single-wafer processing area. Claim 6 A substrate processing device for continuously performing batch processing for processing multiple substrates in a batch and single-wafer processing for processing substrates one by one comprises: a carrier storage shelf for storing a carrier that stores multiple substrates in a horizontal position at a predetermined interval in a vertical direction; a transfer block adjacent to the carrier storage shelf; and a processing block adjacent to the transfer block. The transfer block comprises a first position conversion mechanism for converting the multiple substrates extracted from the carrier from a horizontal position to a vertical position, and a horizontal substrate transport mechanism for transporting the substrates in a horizontal position. The processing block comprises a batch processing area extending in a direction away from the transfer block; a batch substrate transport area formed along the batch processing area, with one end extending to the transfer block and the other end extending in a direction away from the transfer block; a position conversion area formed between the transfer block and the batch processing area; a single-wafer substrate transport area adjacent to the transfer block and the position conversion area; and a single-wafer processing area adjacent to the single-wafer substrate transport area. The apparatus is provided, wherein in the batch processing area, a plurality of batch processing tanks for processing the plurality of substrates in a vertical position collectively are arranged in the direction in which the batch processing area extends, and in the position conversion area, a second position conversion mechanism is formed for converting the batch-processed plurality of substrates from a vertical position to a horizontal position, and in the batch substrate transport area, a batch substrate transport mechanism is formed for transporting the plurality of substrates in a vertical position collectively between a substrate receiving position determined within the transfer block, the plurality of batch processing tanks, and the second position conversion mechanism, and in the single-wafer processing area, a plurality of single-wafer processing chambers for processing substrates in a horizontal position one by one are formed, and the horizontal substrate transport mechanism comprises the carrier placed on the carrier placement shelf, the first position conversion mechanism,A substrate processing apparatus capable of conveying a substrate in a horizontal position between the second position changing mechanism and the plurality of single-wafer processing chambers, wherein the horizontal substrate conveying mechanism comprises a horizontally movable hand for maintaining a substrate in a horizontal position and a lifting platform for raising and lowering the hand, wherein the lifting platform has a fixed position in the horizontal direction.

Images