Test head frame and inspection device

Abstract

This technology provides efficient and accurate positioning of test heads while reducing their footprint. [Solution] The test head frame includes a holding member to which the test head is fixed, a rectangular first frame that holds the holding member on the outside of the holding member, a rectangular second frame that holds the first frame on the outside of the first frame, and a third frame that holds the second frame on the outside of the second frame. The holding member and the first frame are provided with a first adjustment mechanism that allows the holding member to move relative to the first frame in a first direction. The first frame and the second frame are provided with a second adjustment mechanism that allows the first frame to move relative to the second frame in a second direction perpendicular to the first direction. The second frame and the third frame are provided with a tilt adjustment mechanism that allows the second frame to be tilted relative to the third frame.

Description

Technical Field

[0001] The present disclosure relates to a test head frame and an inspection apparatus.

Background Art

[0002] Patent Document 1 discloses an inspection apparatus that outputs an electrical signal of a test head unit to a substrate (semiconductor wafer) to inspect the substrate. For this type of inspection apparatus, it is necessary to position the test head unit with high accuracy with respect to the interface of the probe apparatus (test apparatus main body) when installing the apparatus or the like. Therefore, the inspection apparatus described in Patent Document 1 includes a manipulator unit that holds the test head unit and is movable in six axes (X-axis, Y-axis, Z-axis, θX-axis, θY-axis, θZ-axis). [[ID=I4]]

Prior Art Documents

Patent Documents

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique that can efficiently and accurately perform positioning of a test head while reducing the footprint.

Means for Solving the Problems

[0005] According to one aspect of the present disclosure, a test head frame for mounting a test head to a prober device is provided, comprising: a holding member to which the test head is fixed; a rectangular first frame that holds the holding member on the outside of the holding member; a rectangular second frame that holds the first frame on the outside of the first frame; and a third frame that holds the second frame on the outside of the second frame, wherein the holding member and the first frame are provided with a first adjustment mechanism that allows the holding member to move relative to the first frame in a first direction; the first frame and the second frame are provided with a second adjustment mechanism that allows the first frame to move relative to the second frame in a second direction orthogonal to the first direction; and the second frame and the third frame are provided with a tilt adjustment mechanism that allows the second frame to be tilted relative to the third frame. [Effects of the Invention]

[0006] According to one embodiment, the positioning of the test head can be performed efficiently and accurately while reducing the footprint. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic partial side cross-sectional view showing an inspection apparatus according to an embodiment. [Figure 2] Figure 2(A) is a schematic side view showing the configuration in which a test head is attached to the prober device. Figure 2(B) is a view of Figure 2(A) from the negative Y-axis direction. [Figure 3] This is a perspective view showing the overall configuration of the test head frame. [Figure 4] Figure 4(A) is a plan view showing the first adjustment mechanism. Figure 4(B) is a perspective view showing a magnified view of the corner of the first frame. [Figure 5] Figure 5(A) is a plan view showing the second adjustment mechanism. Figure 5(B) is a perspective view showing a magnified view of the corner of the second frame. [Figure 6]Figure 6(A) is a plan view partially showing the assembly of the first to third frames on the negative X-axis side. Figure 6(B) is a plan cross-sectional view partially showing the assembly of the first to third frames on the negative X-axis side. Figure 6(C) is a side view showing the plate on the negative X-axis side of the second frame, which has a tilt adjustment mechanism. [Figure 7] Figure 7(A) is a plan view showing an enlarged view of the ball roller member. Figure 7(B) is a perspective view showing an enlarged view of the adjustment member. Figure 7(C) is a cross-sectional view showing an enlarged view of the pull screw and push screw of the adjustment member. [Figure 8] This diagram schematically illustrates tilt adjustment using the tilt adjustment mechanism. [Figure 9] This flowchart shows the method for positioning the test head. [Figure 10] Figures 10(A) to 10(G) schematically illustrate the operation of the test head frame in the positioning method. [Figure 11] Figure 11(A) is a schematic side view showing the mounting state of the verification jig. Figure 11(B) is a perspective view showing the marker jig of the verification jig. Figure 11(C) is a perspective view showing the receiving jig of the verification jig. [Modes for carrying out the invention]

[0008] The following describes embodiments for implementing this disclosure with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0009] <Overall configuration of inspection device 1> Figure 1 is a schematic partial side cross-sectional view showing the inspection apparatus 1 according to an embodiment. As shown in Figure 1, the inspection apparatus 1 performs electrical testing on a substrate W on which a plurality of semiconductor devices (devices under test) are formed. The substrate W according to the embodiment is a wafer on which a plurality of semiconductor devices are arranged. Note that the substrate W is not limited to a wafer, but may also be a carrier on which semiconductor devices are arranged, a glass substrate, a single chip, an electronic circuit board, etc.

[0010] The inspection apparatus 1 comprises a loader 10 for transporting substrates W, a housing 20 positioned adjacent to the loader 10, a test head 30 positioned above the housing 20, a stage 40 housed within the housing 20, and a control unit 90 for controlling each component of the inspection apparatus 1.

[0011] The loader 10 removes the substrate W from a container such as a FOUP (Front Opening Unified Pod) (not shown) and places the substrate W onto a stage 40 that has moved inside the housing 20. The loader 10 then removes the inspected substrate W from the stage 40 and places it back into the container.

[0012] The housing 20 is formed as a roughly rectangular box and has an inspection space 21 inside for inspecting the substrate W. A stage 40 for transporting the substrate W is installed in the inspection space 21. The stage 40 receives and holds the substrate W from the loader 10 in the inspection space 21 and moves within the inspection space 21 in three dimensions (X-axis direction, Y-axis direction, Z-axis direction). The housing 20 and the stage 40 form a prober device 25 that moves the substrate W for inspection and adjusts the position of the substrate W.

[0013] A probe card 32 is held in the upper part of the enclosure 20 via an interface 31. The interface 31 has a performance board (not shown) and several pogo blocks and electrically connects the motherboard of the test head 30 to the probe card 32. The test head 30 is connected to the control unit 90 of the inspection device 1 and performs inspection of the substrate W based on commands from the control unit 90.

[0014] The probe card 32 has multiple probes 33 (probes) that protrude downward into the inspection space 21. Each probe 33 contacts the pads or solder bumps of each semiconductor device on the substrate W, which has been moved to an appropriate three-dimensional coordinate position by the stage 40 during inspection by the inspection device 1. With each probe 33 in contact with each semiconductor device, the test head 30 performs an electrical inspection of each semiconductor device.

[0015] Stage 40 includes a moving part 41 movable in three-dimensional directions, a mounting table 45, and a stage controller 49. The moving part 41 moves the mounting table 45 in the X-axis direction, Y-axis direction, and Z-axis direction based on power supply from the stage controller 49.

[0016] Specifically, the moving part 41 includes an XY stage that moves the mounting table 45 in the horizontal direction (X-Y axis direction), and a Z-axis drive mechanism 44 that moves the mounting table 45 in the vertical direction (Z-axis direction). Further, the XY stage has a Y-axis drive mechanism 42 that moves the mounting table 45 in the Y-axis direction and an X-axis drive mechanism 43 that moves the mounting table 45 in the X-axis direction. The Y-axis drive mechanism 42 is installed on the frame of the housing 20 so as to be movable in the Y-axis direction. The X-axis drive mechanism 43 is installed on the movable plate 421 of the Y-axis drive mechanism 42 so as to be movable in the X-axis direction. The Z-axis drive mechanism 44 is installed on the movable plate 431 of the X-axis drive mechanism 43 so as to be movable in the Z-axis direction. The mounting table 45 is installed on the movable block of this Z-axis drive mechanism 44.

[0017] The Y-axis drive mechanism 42 has a movable plate 421, a Y-axis motor 422 that outputs a driving force for moving the movable plate 421, and a Y-axis rail 423 provided on the frame of the housing 20 to guide the movement of the movable plate 421 in the Y-axis direction. Similarly, the X-axis drive mechanism 43 has a movable plate 431, an X-axis motor 432 that outputs a driving force for moving the movable plate 431, and an X-axis rail 433 provided on the movable plate 421 of the Y-axis drive mechanism 42 to guide the movement of the movable plate 431 in the X-axis direction.

[0018] The mounting table 45 of the stage 40 has a mounting surface 45s for mounting the substrate W on the upper surface. Further, the mounting table 45 includes fixing means (not shown) for fixing the substrate W to the mounting surface 45s after the substrate W is mounted. The fixing means is not particularly limited, and may be, for example, a suction mechanism that sucks and vacuum-adsorbs the substrate W, or a physical mechanism that mechanically holds the substrate W.

[0019] The stage controller 49 includes, for example, an integrated control unit that controls the operation of the entire stage 40, a PLC, motor driver, and power supply unit that control the operation of the moving unit 41. The stage controller 49 is connected to the control unit 90, and when it receives a control command from the control unit 90 that includes the target position (three-dimensional coordinates) of the mounting table 45, it outputs a command to the motor driver to move the moving unit 41 so that the mounting table 45 moves to this target position.

[0020] For example, the stage controller 49 moves the mounting table 45 and the substrate W to the target two-dimensional coordinates (X coordinate, Y coordinate) by linking the Y-axis drive mechanism 42 and the X-axis drive mechanism 43. The stage controller 49 also moves the mounting table 45 and the substrate W to the target height position (Z coordinate) by operating the Z-axis drive mechanism 44. In addition to moving the mounting table 45 in the X-axis, Y-axis, and Z-axis directions, the moving unit 41 may also be configured to rotate the mounting table 45 around the vertical axis (θ direction).

[0021] Returning to Figure 1, the control unit 90 includes a control body 91 that controls the entire inspection apparatus 1, and a user interface 95 connected to the control body 91. The control body 91 is an information processing unit having a processor 92, memory 93, an input / output interface (not shown), and electronic circuits. The processor 92 is a combination of one or more of the following: CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), and circuits consisting of multiple discrete semiconductors. The memory 93 includes a main memory device consisting of semiconductor memory, and an auxiliary memory device consisting of disks and semiconductor memory (flash memory). The memory 93 can be configured by appropriately combining volatile memory and non-volatile memory (e.g., compact discs, DVDs (Digital Versatile Discs), hard disks, flash memory, etc.).

[0022] The processor 92 controls each component of the inspection device 1 to inspect the substrate W by reading and executing the program 94 and inspection recipe stored in the memory 93. In other words, the control unit 90 of this disclosure is an electronic circuit having a CPU, GPU, ASIC, FPGA, etc., and performs the various control operations described in this specification by executing instruction codes stored in the memory 93 or by circuit design for special applications.

[0023] On the other hand, the user interface 95 can be a keyboard for the user to input commands, etc., or a display that visualizes and displays the operating status of the inspection device 1. Alternatively, the user interface 95 may be a touch panel, mouse, microphone, speaker, or other device.

[0024] As described above, the control unit 90 controls the loader 10 and the stage 40 to place the substrate W on the mounting surface 45s of the mounting table 45 and fix the substrate W in place during inspection. Subsequently, the control unit 90 controls the Y-axis drive mechanism 42 and the X-axis drive mechanism 43 of the moving unit 41 to move the mounting table 45 and the substrate W horizontally (in the XY axis direction) to perform horizontal positioning. Next, the control unit 90 controls the Z-axis drive mechanism 44 of the moving unit 41 to move the mounting table 45 and the substrate W vertically (in the Z axis direction) to bring each probe 33 of the probe card 32 into contact with a group of semiconductor devices on the substrate W. Furthermore, the control unit 90 overdrives the substrate W slightly upward using the Z-axis drive mechanism 44 to ensure that each probe 33 makes secure contact with each semiconductor device.

[0025] The control unit 90 controls the test head 30 based on the contact state between each probe 33 and each semiconductor device to inspect each semiconductor device. During inspection, the test head 30 transmits an electrical signal to each semiconductor device and receives the device signal in response from each semiconductor device to determine, for example, whether or not there is an abnormality in each semiconductor device. After inspecting each semiconductor device, the control unit 90 lowers the mounting table 45 and the substrate W using the Z-axis drive mechanism 44, then changes the horizontal position using the Y-axis drive mechanism 42 and the X-axis drive mechanism 43, and raises the mounting table 45 and the substrate W again using the Z-axis drive mechanism 44. In this way, the control unit 90 brings each probe 33 into contact with each semiconductor device in the other group on the substrate W and inspects each semiconductor device in the other group using the test head 30. By repeating this operation, the inspection device 1 inspects all of the semiconductor devices on the substrate W.

[0026] <Test head positioning device 50> Figure 2(A) is a schematic side view showing the configuration in which the test head 30 is attached to the prober device 25. Figure 2(B) is a view of Figure 2(A) from the negative Y-axis direction. As shown in Figures 2(A) and 2(B), the inspection device 1 is configured to allow the test head 30 to be attached to and detached from the interface 31, and to allow the test head 30 to be separated from the prober device 25 and moved. For this reason, the inspection device 1 is equipped with a test head positioning device 50 for attaching the test head 30 to the prober device 25 when the device is installed at a work site or the like.

[0027] The test head positioning device 50 includes a test head frame 60 that holds the test head 30, and a hinge device 51 that pivots (ups and downs) the test head 30 held by the test head frame 60 in the vertical direction. For example, the hinge device 51 is installed at an adjacent position on the negative Y-axis side of the probe device 25 (housing 20).

[0028] The hinge device 51 comprises a main body 52 and a swivel support portion 53 that protrudes from the upper part of the main body 52 in the X-axis direction and supports the test head frame 60 so that it can rotatably support it. The main body 52 is long in the X-axis direction and is formed in an L-shape that protrudes vertically (Z-direction) at approximately the same height as the probe device 25. The swivel support portion 53 has a mounting projection 53a that protrudes vertically upward at approximately the midpoint of the probe device 25. The mounting projection 53a is used to attach the mounting portion 62 of the test head frame 60.

[0029] The test head frame 60 includes a holding body 61 for holding the test head 30 and a mounting portion 62 connected to the negative Y-axis side of the holding body 61. The mounting portion 62 has a disc-shaped contact portion 62a (see also Figure 3) that contacts and is fixed to the mounting projection 53a of the hinge device 51. The mounting projection 53a and the contact portion 62a of the mounting portion 62 overlap in the X-axis direction and are firmly fixed by fixing means such as bolts, so that the test head frame 60 is supported so as to be able to pivot vertically with respect to the hinge device 51.

[0030] <Test head frame 60> Figure 3 is a perspective view showing the overall configuration of the test head frame 60. The holding body 61 of the test head frame 60 is formed in a rectangular shape in plan view. The inside of the holding body 61 is penetrating vertically, forming a holding space 61s through which the test head 30 can be inserted and positioned. The length of the holding body 61 along the vertical direction is shorter than the height of the test head 30. Therefore, when the test head 30 is held in the holding body 61, the upper and lower parts of the test head 30 are exposed from the holding body 61.

[0031] The holding body 61 includes a holding member 63 for fixing the test head 30, a first frame 64 positioned outside the holding member 63, a second frame 65 positioned outside the first frame 64, and a third frame 66 positioned outside the second frame 65. The holding body 61, with the holding member 63 and the first frame 64, forms a first adjustment mechanism 67 that allows the test head 30 to move in a first direction. The holding body 61, with the first frame 64 and the second frame 65, forms a second adjustment mechanism 68 that allows the test head 30 to move in a second direction perpendicular to the first direction. The first and second directions are horizontal directions (XY axis directions). Specifically, the first direction is the X axis direction and the second direction is the Y axis direction. However, the first direction may be the Y axis direction and the first direction may be the Z axis direction. Furthermore, the holding body 61, along with the second frame 65 and the third frame 66, forms a tilt adjustment mechanism 69 that allows adjustment of the tilt (angle of inclination) of the test head 30 relative to the vertical direction.

[0032] Specifically, the retaining members 63 of the test head frame 60 are provided in pairs at the innermost part of the retaining body 61. The pair of retaining members 63 are rectangular flat plates and extend parallel to each other across the retaining space 61s. The test head frame 60 can firmly fix the test head 30 to the retaining body 61 by screwing the inner surfaces of each retaining member 63 to the outer surface of the test head 30 with a plurality of screws 632.

[0033] On the other hand, the first frame 64 has a rectangular shape in plan view. The first frame 64 is formed by assembling four plates to create an endless frame, and forms a holding space 61s for the holding body 61 on its inside. The longitudinal ends of each plate of the first frame 64 are firmly fixed together by multiple bolts (not shown). The vertical lengths of each holding member 63 and the first frame 64 are set to be approximately the same.

[0034] The first adjustment mechanism 67 is configured by attaching each retaining member 63 to both inner surfaces of the first frame 64 in the Y-axis direction so that they can move freely. In other words, the first adjustment mechanism 67 is a mechanism that allows each retaining member 63 to move relative to the inner surface of the first frame 64 in the Y-axis direction, in the first direction, the X-axis direction.

[0035] Figure 4(A) is a plan view showing the first adjustment mechanism 67. Figure 4(B) is a perspective view showing an enlarged view of the corner of the first frame 64. Note that in Figure 4(B), for the sake of easier understanding of the figure, the multiple bolts that fix the plates of the first frame 64 together are omitted, while only the screw recesses 649 into which each bolt is inserted are shown.

[0036] As shown in Figure 4(A), the first adjustment mechanism 67 guides the movement of each retaining member 63 using the first frame 64. The first adjustment mechanism 67 comprises rail protrusions 631, guide grooves 641, and one or more (two in Figure 4(A)) holders 642. The rail protrusions 631 are provided on the surface (plate surface) of each retaining member 63 facing the first frame 64. Each rail protrusion 631 extends linearly in the X-axis direction and is housed in the guide grooves 641 provided in the first frame 64.

[0037] Furthermore, the guide groove 641 is provided on the opposing surface (inner surface in the Y-axis direction) of the holding member 63 in the first frame 64 and extends linearly along the X-axis direction. The holder 642 holds the rail protrusion 631 movably inside each guide groove 641. Multiple balls are provided at the points where the rail protrusion 631 is held in the holder 642. As a result, the first frame 64 guides the rail protrusion 631 slidably by each holder 642, and the range of movement of the rail protrusion 631 can be defined by the ends of the guide groove 641. The range of movement of each holding member 63 (in other words, the test head 30) in the X-axis direction by the first adjustment mechanism 67 is, for example, about 2 mm to 20 mm. In this embodiment, the range of movement in the X-axis direction is set to 10 mm (= ±5 mm).

[0038] As shown in Figure 4(B), the first adjustment mechanism 67 is equipped with a pair of first adjustment screws 671, one above the other, which move each retaining member 63 forward and backward in the X-axis direction from the outside of the first frame 64. Each first adjustment screw 671 has a head on the outer surface of the first frame 64 and a threaded portion extending from the head in the X-axis direction. The threaded portion of each first adjustment screw 671 is screwed into a female screw hole formed in the plate on the X-axis side of the first frame 64 and protrudes from the inner surface of the first frame 64.

[0039] One of the pair of first adjustment screws 671, the first adjustment screw 671a, is a push screw whose threaded end can push out the side of the retaining member 63 on the X-axis side. The other of the pair of first adjustment screws 671, the first adjustment screw 671b, is a pull screw whose threaded end can be inserted into the side of the retaining member 63 on the X-axis side, thereby pulling the retaining member 63 back.

[0040] Each of the first adjustment screws 671a and 671b, although not shown in the illustration, is positioned to be accessible from the outer surface of the third frame 66 (holding body 61) through through holes formed in the second frame 65 and the third frame 66 on the positive X-axis side. Therefore, the operator can insert a tool such as a wrench or screwdriver from outside the third frame 66 and push or pull the pair of first adjustment screws 671 relative to the first frame 64 to move each holding member 63 forward or backward in the X-axis direction. The first adjustment mechanism 67 can adjust the position of the test head 30 held by each holding member 63 in the X-axis direction based on the operator's operation.

[0041] Figure 5(A) is a plan view showing the second adjustment mechanism 68. Figure 5(B) is a perspective view showing an enlarged view of the corner of the second frame 65. Note that in Figure 5(B), for the sake of easier understanding of the figure, the multiple bolts that fix the plates of the second frame 65 together are omitted, while only the screw recesses 659 into which each bolt is inserted are shown.

[0042] As shown in Figure 5(A), the second frame 65 also has a rectangular shape in plan view. The second frame 65 is formed by assembling four plates to create an endless frame, and it forms a space capable of accommodating the first frame 64. The longitudinal ends of each plate of the second frame 65 are firmly fixed together by multiple bolts (not shown).

[0043] The second adjustment mechanism 68 is constructed by movably attaching the first frame 64 to both inner surfaces of the second frame 65 in the X-axis direction. In other words, the second adjustment mechanism 68 is a mechanism that allows the first frame 64 to move relative to the second frame 65 in the Y-axis direction, along the inner surface of the second frame 65 in the X-axis direction. The Y-axis plate of the second frame 65 and the Y-axis plate of the first frame 64 are fixed to each other by fixing bolts 658 (see also Figure 6(B)). Relative movement of the first frame 64 and the second frame 65 is performed by loosening the fixing bolts 658, and the two frames are fixed by tightening the fixing bolts 658 after the movement. For this reason, the holes in the second frame 65 into which the fixing bolts 658 are inserted are formed as elongated holes. In addition, spacers 657 are provided between the first frame 64 and the second frame 65 at the fixing points of the fixing bolts 658 in order to maintain the gap between the frames.

[0044] The second adjustment mechanism 68 guides the movement of the inner first frame 64 using the second frame 65. For this purpose, the second adjustment mechanism 68 includes rail protrusions 643, guide grooves 651, and a plurality of holders 652. The rail protrusions 643 are provided on the surfaces of the first frame 64 facing the second frame 65 (two outer surfaces in the X-axis direction). Each rail protrusion 643 extends linearly in the Y-axis direction and is housed in the guide grooves 651 provided in the second frame 65.

[0045] The guide grooves 651 are provided on the opposing surfaces (two inner surfaces in the X-axis direction) of the second frame 65 and extend linearly in the Y-axis direction. The holders 652 movably hold the rail protrusions 643 inside each guide groove 651. Multiple balls are provided at the points where the holders 652 hold the rail protrusions 643. As a result, the second frame 65 slides the rail protrusions 643 with each holder 652, and the range of movement of the rail protrusions 643 can be defined by the ends of the guide grooves 651. The range of movement of the first frame 64 (in other words, the test head 30) in the Y-axis direction by the second adjustment mechanism 68 is, for example, about 2 mm to 20 mm. In this embodiment, the range of movement in the Y-axis direction is set to 10 mm (= ±5 mm).

[0046] As shown in Figure 5(B), the second adjustment mechanism 68 is equipped with a pair of second adjustment screws 681, one above the other, which can adjust the Y-axis movement of the first frame 64 from the outside of the second frame 65. Each second adjustment screw 681 has a head on a fixing member 682 provided on the outer surface of the second frame 65, and a threaded portion extending in the Y-axis direction from the head. The threaded portion of each second adjustment screw 681 is screwed into a female screw hole formed in the plate on the Y-axis side of the second frame 65 and protrudes from the inner surface of the second frame 65. The fixing member 682 is inserted into an elliptical hole 661 provided in the Y-axis plate of the third frame 66 (see Figure 3).

[0047] Of the pair of second adjustment screws 681, one second adjustment screw 681a is a push screw whose threaded end can push out the side of the first frame 64 on the Y-axis side. The other second adjustment screw 681b of the pair of second adjustment screws 681 is a pull screw whose threaded end can be inserted into the side of the first frame 64 on the Y-axis side, thereby pulling the first frame 64 back.

[0048] Each of the second adjustment screws 681a and 681b is positioned to be accessible from the outer surface of the third frame 66 (holding body 61) through the elliptical hole 661 of the third frame 66. Therefore, the operator can insert a tool such as a wrench or screwdriver from outside the third frame 66 and push or pull the pair of second adjustment screws 681 relative to the second frame 65 to move the first frame 64 forward or backward in the Y-axis direction. The second adjustment mechanism 68 can adjust the Y-axis position of the test head 30 held via the first frame 64 and each holding member 63 based on the operator's operation.

[0049] Returning to Figure 3, the third frame 66 is formed by assembling three plates, creating a concave frame that surrounds three sides of the second frame 65 in a plan view. The longitudinal ends of the plates are firmly fixed together by multiple bolts (not shown). The mounting portion 62 described above is connected to the middle plate (negative Y-axis side) of the three plates of the third frame 66. The external appearance of the holding body 61 is composed of this third frame 66 and the positive Y-axis side of the second frame 65.

[0050] The tilt adjustment mechanism 69 is configured by rotatably attaching the second frame 65 to both inner surfaces of the third frame 66 in the X-axis direction. In other words, the tilt adjustment mechanism 69 is a mechanism that allows the second frame 65 to rotate in the Z-axis direction relative to the third frame 66, which sandwiches the second frame 65 in the X-axis direction.

[0051] Figure 6(A) is a plan view partially showing the assembly of the first frame 64 to the third frame 66 on the negative X-axis side. Figure 6(B) is a plan cross-sectional view partially showing the assembly of the first frame 64 to the third frame 66 on the negative X-axis side. Figure 6(C) is a side view showing the plate on the negative X-axis side of the second frame 65 having a tilt adjustment mechanism 69. As shown in Figure 6(A), the tilt adjustment mechanism 69 includes a plurality of ball roller members 70 between the outer surface of the second frame 65 and the inner surface of the third frame 66, as well as a plurality of adjustment members 71 bridging the space between the upper edge of the second frame 65 and the upper edge of the third frame 66.

[0052] As shown in Figures 6(B) and 6(C), the second frame 65 and the third frame 66 are fixed together by a plurality of fixing bolts 691. The holes in the third frame 66 where the fixing bolts 691 are inserted are designed to have a slight gap between them and the body of the fixing bolts 691. This allows the second frame 65 to move slightly relative to the third frame 66 by the amount of the gap when each fixing bolt 691 is loosened. Furthermore, the mounting locations for each fixing bolt 691 are limited to approximately the midpoint in the Y-axis direction of the second frame 65 (third frame 66). Therefore, the second frame 65 can be tilted vertically at both ends in the Y-axis direction, starting from this approximately midpoint in the Y-axis direction. Spacers 692 are provided between the second frame 65 and the third frame 66 at the fixing locations of the fixing bolts 691 to maintain the gap between the frames.

[0053] The ball roller member 70 is installed on the plate in the X-axis direction of the second frame 65 so as to protrude outward (towards the plate side of the third frame 66). In the tilt adjustment mechanism 69 according to this embodiment, multiple (four) ball roller members 70 are arranged on each plate in the X-axis direction of the second frame 65. For example, the four ball roller members 70 are located on the negative Y-axis side, the upper middle of the Y-axis direction, the lower middle of the Y-axis direction, and the positive Y-axis direction, respectively. However, the number and position of the ball roller members 70 are not particularly limited and can be designed arbitrarily.

[0054] Figure 7(A) is an enlarged plan view showing the ball roller member 70. Figure 7(B) is an enlarged perspective view showing the adjustment member 71. Figure 7(C) is an enlarged cross-sectional view showing the pull screw 74 and push screw 75 of the adjustment member 71. As shown in Figure 7(A), the ball roller member 70 is partially housed in the placement hole 653 provided in the plate of the second frame 65.

[0055] The ball roller member 70 includes a ball 701 provided at a protruding end and a base 702 that holds the ball 701 so that it can roll. The base 702 protrudes a short distance from the bottom of the placement hole 653 and holds the ball 701. The ball 701 held by the base 702 is in contact with a receiving portion 703 fixed to the plate of the third frame 66. As a result, the ball roller member 70 allows the ball 701 to roll on the receiving portion 703 while maintaining the gap in the X-axis direction between the second frame 65 and the third frame 66. Consequently, the ball roller member 70 can displace the second frame 65 relative to the third frame 66.

[0056] On the other hand, as shown in Figures 7(B) and 7(C), the adjustment member 71 includes a rectangular block 72, one or more fixing screws 73 for fixing the block 72 to the third frame 66, and a displaceable tension screw 74 and a push screw 75 on the second frame 65. The block 72 is formed to be thick in the vertical direction, thereby providing sufficient rigidity. The block 72 is firmly fixed to the upper edge of the third frame 66 by multiple (two in Figure 7(B)) fixing screws 73, and protrudes from the third frame 66 toward the upper edge of the second frame 65. The location of the adjustment member 71 on the second frame 65 is a recessed portion 65a that is recessed vertically downward. A hard plate 76 is screwed to the portion of this recessed portion 65a facing the adjustment member 71. The hard plate 76 is a contact member for the push screw 75 and prevents deformation of the second frame 65.

[0057] The tension screw 74 is positioned near the center of the Y-axis direction on the plate of the second frame 65 on which the adjustment member 71 is installed. The tension screw 74 passes through a hole in the lower rigid plate 76 and is screwed into the female screw hole 654 of the second frame 65. By rotating the tension screw 74, the gap between the lower surface of the block 72 and the second frame 65 (the bottom of the recessed portion 65a) is adjusted, thereby adjusting the height position of the second frame 65 at the mounting location.

[0058] Furthermore, as shown in Figure 7(C), the draw screw 74 has a head 741 and a threaded portion 742 protruding from the head 741, and is fixed to the block 72 with a washer 77 in between. A hemispherical surface 741s is formed on the lower surface of the head 741 (the side connected to the threaded portion 742). The washer 77 has an arcuate surface 77s corresponding to the hemispherical surface 741s of the draw screw 74. In other words, the draw screw 74 makes rotatable surface contact with the washer 77, allowing for fine adjustment of the inclination of the draw screw 74 relative to the block 72. As a result, even when the second frame 65 is tilted due to tilt adjustment, the adjustment member 71 can maintain the angles of the block 72 and washer 77 fixed to the third frame 66 while the angle of the draw screw 74 changes.

[0059] On the other hand, the set screw 75 is formed as a rod-shaped member having screw threads on almost the entire outer surface. The lower end of this set screw 75 is pushed out onto the hard plate 76 by a rotational operation after the tilt of the second frame 65 is adjusted by the pull screw 74, and comes into contact with the hard plate 76. As a result, the set screw 75 functions as a stopper to maintain the tilted state of the second frame 65.

[0060] Figure 8 is a schematic diagram illustrating the tilt adjustment by the tilt adjustment mechanism 69. As shown in Figure 8, the tilt adjustment mechanism 69 allows the operator to adjust the adjustment member 71A fixed to the negative Y-axis side of the third frame 66 and the adjustment member 71B fixed to the positive Y-axis side of the third frame 66. This allows the test head frame 60 to adjust the tilt of the second frame 65 and the test head 30.

[0061] For example, the tilt adjustment mechanism 69 can adjust the tilt of the test head 30 so that the negative Y-axis side is higher and the positive Y-axis side is lower, as shown in the upper right diagram. Specifically, the operator reduces the gap between the block 72 and the second frame 65 using the pull screw 74 of adjustment member 71A, while increasing the gap between the block 72 and the second frame 65 using the pull screw 74 of adjustment member 71B. Then, the operator operates the push screws 75 of each adjustment member 71A and 71B to bring them into contact with the hard plate 76, thereby making the push screws 75 function as stoppers. This allows the tilt adjustment mechanism 69 to maintain the adjusted tilt of the test head 30.

[0062] Conversely, the tilt adjustment mechanism 69 can adjust the tilt of the test head 30 so that the negative Y-axis side is lower and the positive Y-axis side is higher, as shown in the lower right diagram. Specifically, the operator increases the gap between the block 72 and the second frame 65 using the pull screw 74 of the adjustment member 71A, while decreasing the gap between the block 72 and the second frame 65 using the pull screw 74 of the adjustment member 71B. Then, in the same manner as above, the operator operates the push screws 75 of each adjustment member 71A and 71B to bring them into contact with the hard plate 76, thereby making the push screws 75 function as stoppers. This allows the tilt adjustment mechanism 69 to maintain the adjusted tilt of the test head 30.

[0063] <Method for positioning the test head 30> The inspection apparatus 1 and test head frame 60 according to this embodiment are basically configured as described above. The method for positioning the test head 30 will be explained in detail below with reference to Figure 9 and Figures 10(A) to 10(G). Figure 9 is a flowchart showing the method for positioning the test head 30. Figures 10(A) to 10(G) are schematic diagrams showing the operation of the test head frame 60 in the positioning method.

[0064] In the method for positioning the test head 30, the operator first performs an attachment step (S101) in which the test head frame 60 holding the test head 30 is attached to the hinge device 51. At this time, as shown in Figure 10(A), the operator drives the hinge device 51 and rotates the attached test head frame 60, thereby moving the test head 30 and the test head frame 60 above the probe device 25. In this rotated state, the test head 30 is positioned at a distance from the probe device 25.

[0065] Next, the operator performs a height adjustment process (S102) to bring the test head 30 closer to the probe device 25 by lowering the test head 30 and the test head frame 60 vertically downward. During the lowering of the test head 30, the operator uses a jig (not shown) to gradually lower the test head 30 and the test head frame 60. In this height adjustment process, as shown in Figure 10(B), the test head 30 is tilted at an angle by the test head frame 60 attached to the hinge device 51.

[0066] Therefore, in the positioning method for the test head 30, the operator performs a tilt adjustment step (S103) to adjust the inclination of the test head 30 relative to the test head frame 60. The operator adjusts the inclination of the second frame 65 relative to the third frame 66 by operating each adjustment member 71 of the tilt adjustment mechanism 69 as described above (see Figure 10(C)). As a result, the lower surface of the test head 30 and the upper surface of the prober device 25 face each other in a substantially parallel manner.

[0067] Next, the operator performs a Y-axis adjustment step (S104) in which the Y-axis direction of the test head 30 and the test head frame 60 is adjusted using the second adjustment mechanism 68. In the Y-axis adjustment step, the operator operates each of the second adjustment screws 681 of the second adjustment mechanism 68 as described above to move the first frame 64 relative to the second frame 65 (see also Figure 10(D)). This allows the Y-axis position of the test head 30 to be adjusted with high precision.

[0068] Furthermore, the operator performs an X-axis adjustment step (S105) in which the X-axis direction of the test head 30 and the test head frame 60 is adjusted by the first adjustment mechanism 67. In the X-axis adjustment step, the operator operates each first adjustment screw 671 of the first adjustment mechanism 67 as described above to move each holding member 63 relative to the first frame 64 (see also Figure 10(E)). This allows the position of the test head 30 in the X-axis direction to be adjusted with high precision. Note that the order of the Y-axis adjustment step and the X-axis adjustment step may be reversed.

[0069] Subsequently, the operator performs a positional misalignment confirmation step (S108) to check the positional misalignment between the test head 30, which has been adjusted by the tilt adjustment step, Y-axis adjustment step, and X-axis adjustment step described above, and the prober device 25. In this positional misalignment confirmation step, the operator raises the test head frame 60 using the hinge device 51 and attaches the confirmation jigs 80 to the upper surface of the prober device 25 and the lower surface of the test head 30, respectively. Then, the operator lowers the test head frame 60 using the hinge device 51 and checks the positional misalignment between the confirmation jigs 80 at this time, thereby recognizing the positional misalignment between the prober device 25 and the test head 30.

[0070] Figure 11(A) is a schematic side view showing the mounting state of the verification jig 80. Figure 11(B) is a perspective view showing the marker jig 81 of the verification jig 80. Figure 11(C) is a perspective view showing the receiving jig 82 of the verification jig 80. As shown in Figures 11(A) to 11(C), the verification jig 80 is composed of two types of components (marker jig 81 and receiving jig 82) that can measure the amount of misalignment between the probe device 25 and the test head 30.

[0071] The marker jig 81 is attached to the underside of the test head 30 during the positional misalignment confirmation process and comes into contact with the receiving jig 82 as the hinge device 51 rotates, thereby forming a mark on the receiving jig 82. The marker jig 81 is enclosed on a positioning pin (not shown) that protrudes a short distance from the underside of the test head 30.

[0072] For example, the marker jig 81 includes a cylindrical portion 811 capable of housing a positioning pin, a conical tapered portion 812 provided at the tip of the cylindrical portion 811, and a clamping portion 813 that tightens the base end of the cylindrical portion 811. The clamping portion 813 integrates the positioning pin and the cylindrical portion 811 by fixing the portions that protrude radially outward with a screw (not shown) while the positioning pin is inserted into the cylindrical portion 811.

[0073] The tapered portion 812 protrudes briefly from the end face of the cylindrical portion 811, and its top is formed to be pointed. As a result, when the test head 30 rotates and approaches the probe device 25, the top of the tapered portion 812 makes point contact with the receiving jig 82, and a mark is formed at this point of contact.

[0074] On the other hand, the receiving jig 82 is inserted into and mounted in a hole for a positioning pin provided in the probe device 25, so that it protrudes slightly from the upper surface of the probe device 25. The receiving jig 82 includes a base body 821 which is formed in a substantially elliptical shape corresponding to the shape of the hole and is inserted into the hole, and a reference index 822 which is printed on the upper surface of the base body 821. The upper surface of the base body 821 has a recess 821a in which the inner part is recessed downward relative to the outer circumference, and the reference index 822 is drawn on the flat bottom surface of this recess 821a.

[0075] The reference index 822 may have, for example, a rectangular mark in the center and a cross extending linearly from the rectangular mark in the X-axis and Y-axis directions. The reference index 822 may also be configured to allow the amount of positional displacement to be recognized by referring to the scale on the rectangular mark. This reference index 822 serves as a reference that allows for comparison of how much the tapered portion 812 of the marker jig contacts the marking of the contact point formed on the bottom surface of the recess 821a. The reference index 822 should be formed at an appropriate position (for example, a position shifted according to the angle of the test head 30 relative to the center of the recess 821a) taking into consideration the protrusion height of the receiving jig 82 from the prober device 25 and the angle of the test head 30 due to the rotation of the hinge device 51.

[0076] Returning to Figure 9, once the positional misalignment confirmation process is complete, the operator performs a rotation confirmation process (S107) in which the test head 30 and test head frame 60 are rotated by the hinge device 51. This rotation confirmation process confirms the reproducibility of the positioning of the test head 30 when the rotational movement of the hinge device 51 is repeated (see Figure 10(G)).

[0077] In the positioning method for the test head 30, the operator performs a determination step (S108) to determine whether or not there is any misalignment of the test head 30 relative to the prober device 25 during the misalignment confirmation step (S106) and the rotation confirmation step (S107). If there is misalignment of the test head 30 (S108: NO), the operator returns to the tilt adjustment step (S103), etc., and repeats the same steps to readjust the position of the test head 30. In addition, during readjustment, the operator may return to the Y-axis direction adjustment step (S104) or the X-axis direction adjustment step (S105) based on the direction and amount of misalignment, or may perform only the steps that require readjustment.

[0078] On the other hand, if there is no misalignment of the test head 30 (S108: YES), the positioning method for the test head 30 is terminated. After this, the operator lowers the test head 30 and test head frame 60 onto the prober device 25 by the rotational movement of the hinge device 51, thereby mounting the test head 30 to the prober device 25. Because the test head 30 is precisely positioned, a stable electrical connection can be established with the interface 31 of the prober device 25.

[0079] The inspection apparatus 1 and test head frame 60 according to this embodiment are not limited to the above embodiment and can be modified in various ways. For example, the positional misalignment of the test head 30 relative to the prober device 25 is not limited to the use of the confirmation jig 80, and various methods may be used. One example of this is measuring the positional misalignment of the test head 30 relative to the prober device 25 using sensors (not shown) installed inside or outside the prober device 25 and the test head 30.

[0080] Furthermore, in the test head frame 60 according to this embodiment, the first adjustment mechanism 67, the second adjustment mechanism 68, and the tilt adjustment mechanism 69 are configured to be adjusted by manual operation by an operator. However, the first adjustment mechanism 67, the second adjustment mechanism 68, and the tilt adjustment mechanism 69 may also be configured to adjust their respective positions by installing a drive source such as a motor and driving the drive source. In this case, the control device (for example, the control unit 90) that controls the driving of the drive source may be linked with the hinge device 51, etc., in the positioning method to automatically operate the first adjustment mechanism 67, the second adjustment mechanism 68, and the tilt adjustment mechanism 69.

[0081] <Note> The technical concept and effects of this disclosure, as described in the embodiments above, are described below.

[0082] A first aspect of the present disclosure is a test head frame 60 for mounting a test head 30 to a probe device 25, comprising: a holding member 63 to which the test head 30 is fixed; a rectangular first frame 64 that holds the holding member 63 on the outside of the holding member 63; a rectangular second frame 65 that holds the first frame 64 on the outside of the first frame 64; and a third frame 66 that holds the second frame 65 on the outside of the second frame 65, wherein the holding member 63 and the first frame 64 are provided with a first adjustment mechanism 67 that allows the holding member 63 to move relative to the first frame 64 in a first direction; the first frame 64 and the second frame 65 are provided with a second adjustment mechanism 68 that allows the first frame 64 to move relative to the second frame 65 in a second direction perpendicular to the first direction; and the second frame 65 and the third frame 66 are provided with a tilt adjustment mechanism 69 that allows the second frame 65 to be tilted relative to the third frame 66.

[0083] As described above, the test head frame 60 is equipped with a first adjustment mechanism 67, a second adjustment mechanism 68, and a tilt adjustment mechanism 69, allowing the position of the test head 30, which is fixed to the holding member 63, to be individually adjusted within the test head frame 60. This suppresses frame deflection and other issues, enabling more accurate positioning compared to a configuration in which the test head frame 60 and test head 30 are positioned together using a jig outside the test head frame 60. Furthermore, although the test head 30 may tilt when the test head frame 60 is attached to the hinge device 51 and rotates, this tilt can be smoothly corrected by the tilt adjustment mechanism 69. Therefore, the test head frame 60 can efficiently and accurately position the test head 30. Moreover, since the test head frame 60 does not need to be attached to and moved by a large device such as a manipulator, its footprint can be reduced.

[0084] Furthermore, the tilt adjustment mechanism 69 is fixed to the third frame 66 and bridges the second frame 65, and includes multiple adjustment members 71 that can adjust the height position of the second frame 65. As a result, the test head frame 60 can easily adjust the tilt of the test head 30 by adjusting the height positions of the multiple adjustment members 71.

[0085] Furthermore, the adjustment member 71 includes a block 72 fixed to the third frame 66, a pull screw 74 provided on the block 72 that can adjust the height position of the second frame 65, and a push screw 75 provided on the block 72 that extends onto the second frame 65 after its height position has been adjusted and fixes the second frame 65. This allows the operator to adjust the height position of the second frame 65 by operating the pull screw 74, and then maintain the inclination of the second frame 65 well by operating the push screw 75.

[0086] Furthermore, the pull screw 74 has a hemispherical surface 741s on the bottom surface of its head 741, and the adjustment member 71 has an arcuate surface 77s that rotatably holds the hemispherical surface 741s of the pull screw 74. Due to this hemispherical surface 741s and arcuate surface 77s, the pull screw 74 of the adjustment member 71 can easily change its orientation and support the second frame 65 even when the second frame 65 is tilted.

[0087] Furthermore, the tilt adjustment mechanism 69 includes a ball roller member 70 positioned between the second frame 65 and the third frame 66. This allows the ball roller member 70 to smoothly slide either the second frame 65 or the third frame 66 during tilt adjustment, enabling relative movement in the Z-axis direction.

[0088] Furthermore, the first adjustment mechanism 67 includes a first adjustment screw 671 that moves the holding member 63 in a first direction by moving forward and backward relative to the first frame 64. This allows the operator to easily adjust the position of the holding member 63 and the test head 30 in a first direction by operating the first adjustment screw 671.

[0089] Furthermore, the second adjustment mechanism 68 includes a second adjustment screw 681 that moves the holding member 63 in a second direction by moving forward and backward relative to the second frame 65. This allows the operator to easily adjust the position of the holding member 63 and the test head 30 in a second direction by operating the second adjustment screw 681.

[0090] Furthermore, a verification jig 80 capable of measuring the amount of misalignment between the test head 30 and the prober device 25 is provided between the test head 30 and the prober device 25. By using this verification jig 80, the operator can easily recognize any misalignment of the test head 30 when positioning it.

[0091] Furthermore, the verification jig 80 includes a marker jig 81 attached to one of the test head 30 and the prober device 25, and a receiving jig 82 attached to the other of the test head 30 and the prober device 25, on which a marking is formed by contact with the marker jig 81. The receiving jig 82 has a reference index 822 that can be compared with the position of the marking. This allows the operator to easily recognize the positional misalignment (amount of misalignment, direction of misalignment) between the marking and the reference index 822 when checking the position of the test head 30, and enables them to perform position readjustment and other adjustments effectively.

[0092] Furthermore, a second aspect of the present disclosure is an inspection apparatus 1 comprising a prober device 25 capable of moving a substrate W, a test head 30 installed above the prober device 25 for inspecting the substrate W, and a test head frame 60 for attaching the test head 30 to the prober device 25, wherein the test head frame 60 comprises a holding member 63 to which the test head 30 is fixed, a rectangular first frame 64 that holds the holding member 63 on the outside of the holding member 63, a rectangular second frame 65 that holds the first frame 64 on the outside of the first frame 64, and The inspection device 1 includes a third frame 66 that holds the second frame 65 outside of the second frame 65, and the holding member and the first frame 64 are provided with a first adjustment mechanism 67 that allows the holding member to move relative to the first frame 64 in a first direction, the first frame 64 and the second frame 65 are provided with a second adjustment mechanism 68 that allows the first frame 64 to move relative to the second frame 65 in a second direction perpendicular to the first direction, and the second frame 65 and the third frame 66 are provided with a tilt adjustment mechanism 69 that allows the second frame 65 to be tilted relative to the third frame 66. Even in this case, the inspection device 1 can efficiently and accurately position the test head.

[0093] The test head frame 60 and inspection apparatus 1 according to the embodiments disclosed herein are illustrative and not restrictive in all respects. The embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The features described in the above embodiments can be otherwise configured and combined in a non-consistent manner. [Explanation of Symbols]

[0094] 25 Probe device 30 test heads 60 Test Head Frames 63 Retaining member 64. First Frame 65. Frame 2 66. Third Frame 67 1st adjustment mechanism 68 Second adjustment mechanism 69 Tilt adjustment mechanism

Claims

1. A test head frame for attaching a test head to a prober device, The holding member on which the test head is fixed, A rectangular first frame that holds the retaining member on the outside of the retaining member, A rectangular second frame that holds the first frame outside the first frame, A third frame that holds the second frame outside of the aforementioned second frame, The retaining member and the first frame are provided with a first adjustment mechanism that allows the retaining member to move relative to the first frame in a first direction. The first frame and the second frame are provided with a second adjustment mechanism that allows the first frame to move relative to the second frame in a second direction perpendicular to the first direction. The second frame and the third frame are provided with a tilt adjustment mechanism that allows the second frame to be tilted relative to the third frame. Test head frame.

2. The tilt adjustment mechanism comprises a plurality of adjustment members fixed to the third frame and bridging the second frame, which are capable of adjusting the height position of the second frame. The test head frame according to claim 1.

3. The aforementioned adjustment member is A block fixed to the third frame, A pull screw is provided on the block, which allows for adjustment of the height position of the second frame, The block includes a set screw that extends into the second frame, whose height position is adjusted, and fixes the second frame, The test head frame according to claim 2.

4. The aforementioned pull screw has a hemispherical surface on the bottom surface of its head. The adjustment member has an arcuate surface that rotatably holds the hemispherical surface of the pull screw. The test head frame according to claim 3.

5. The tilt adjustment mechanism includes a ball roller member positioned between the second frame and the third frame. A test head frame according to any one of claims 1 to 4.

6. The first adjustment mechanism includes a first adjustment screw that moves the retaining member in a first direction by moving forward and backward relative to the first frame. A test head frame according to any one of claims 1 to 4.

7. The second adjustment mechanism includes a second adjustment screw that moves the retaining member in the second direction by moving forward and backward relative to the second frame. A test head frame according to any one of claims 1 to 4.

8. A verification jig capable of measuring the misalignment between the test head and the prober device is provided between the test head and the prober device. A test head frame according to any one of claims 1 to 4.

9. The aforementioned verification jig is, A marker fixture attached to one of the test head and the prober device, The system includes a receiving jig attached to the other of the test head and the prober device, wherein a marking is formed by contact with the marker jig, The receiving jig has a reference index that can be compared with the position of the marking. The test head frame according to claim 8.

10. A prober device capable of moving the substrate, A test head is installed above the prober device to perform inspection of the substrate, An inspection apparatus comprising a test head frame for attaching the test head to the prober device, The aforementioned test head frame is The holding member on which the test head is fixed, A rectangular first frame that holds the retaining member on the outside of the retaining member, A rectangular second frame that holds the first frame outside the first frame, A third frame that holds the second frame outside of the aforementioned second frame, The retaining member and the first frame are provided with a first adjustment mechanism that allows the retaining member to move relative to the first frame in a first direction. The first frame and the second frame are provided with a second adjustment mechanism that allows the first frame to move relative to the second frame in a second direction perpendicular to the first direction. The second frame and the third frame are provided with a tilt adjustment mechanism that allows the second frame to be tilted relative to the third frame. Inspection device.

Images