Circuit Board

Abstract

To provide a circuit board capable of reducing the electric field strength near a high potential electrode.SOLUTION: A circuit board according to the present invention includes an insulation board, a thin film resistor (1) arranged on the surface of the insulation board, electrodes (3a, 3b) electrically connected to both sides of the thin film resistor, and the thin film resistor is formed in a pattern in which a resistance wiring (5) is repeatedly folded back, and a dummy wiring (6) for reducing the electric field strength is formed on the electrode side having a high potential.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a circuit board having a thin film resistor on an insulating substrate. [Background technology]

[0002] The circuit board used in the thin film resistor is provided with a thin film resistor having a predetermined pattern formed by deposition or photolithography technology. The thin film resistor is formed in a repeatedly folded pattern (also called a meander pattern) (see Patent Document 1). Electrodes are electrically connected to both ends of the thin film resistor. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-130174 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional thin film resistors, the electric field strength is high near the high potential electrode, which results in a large change in resistance value over time, which in turn shortens the product life.

[0005] Therefore, the present invention has been made in consideration of the above problems, and an object of the present invention is to provide a circuit board capable of reducing the electric field strength in the vicinity of a high potential electrode. [Means for solving the problem]

[0006] The present invention provides a circuit board having an insulating substrate, a thin-film resistor disposed on a surface of the insulating substrate, and electrodes electrically connected to both sides of the thin-film resistor, the thin-film resistor being formed in a pattern in which a resistive wiring is repeatedly folded back, and a dummy wiring for reducing an electric field strength is formed on the electrode side having a high potential, and the dummy wiring is electrically connected to the resistive wiring and / or the electrode. and a terminal extending from the folded pattern between the electrodes in parallel to the pattern on the side of the electrode with the higher potential, the terminal not facing the resistance wiring in the extending direction, is provided. It is characterized by:

[0007] In the present invention, it is preferable that the dummy wiring is formed continuously with the folded pattern of the resistive wiring. For example, the dummy wiring may be formed by folding back from the resistive wiring located at the outermost position of the folded pattern to the outside.

[0008] In the present invention, the dummy wiring is preferably formed by branching off from the resistive wiring, For example, the dummy wiring may be formed by branching off from a folded-back apex of the resistive wiring.

[0009] In the present invention, it is preferable that a plurality of the dummy wirings are provided. Effect of the Invention

[0010] In the present invention, by disposing a dummy wiring on the high potential electrode side, it is possible to reduce the electric field strength, which in turn makes it possible to reduce the change in resistance value over time and to extend the life of the product. [Brief description of the drawings]

[0011] [Figure 1] 1 is a plan view of a thin-film resistor according to a first embodiment of the present invention. [Diagram 2] 2 is a partially enlarged plan view of a portion of the thin-film resistor shown in FIG. 1. [Diagram 3] 2(a) is a partially enlarged plan view of the area surrounded by the dotted line in FIG. 1. (b) is a potential distribution map on the potential / electric field strength measurement line shown in (a), and (c) is an electric field strength distribution map. [Figure 4] FIG. 4 is a plan view of a thin-film resistor according to a second embodiment of the present invention. [Diagram 5] 5(a) is a partially enlarged plan view of the area surrounded by the dotted line in FIG. 4, (b) is a potential distribution map at the potential / electric field strength measurement points shown in (a), and (c) is an electric field strength distribution map. [Figure 6] 1 is a graph showing the relationship between evaluation time and ΔR in a humidity resistance load life test for an example and a comparative example. [Figure 7] 1 is a partial cross-sectional view of a thin-film resistor provided with a circuit board according to an embodiment of the present invention. [Figure 8] FIG. 4 is a plan view of a thin-film resistor in a comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] An embodiment of the present invention (hereinafter, abbreviated as "embodiment") will be described in detail below. Note that the present invention is not limited to the following embodiment, and can be practiced in various modifications within the scope of the gist of the present invention.

[0013] The circuit board of the present embodiment is applied to chip resistors, resistor networks, and the like. For example, a thin-film resistor 10 including the circuit board of the present embodiment has a cross-sectional view shown in FIG.

[0014] As shown in FIG. 7, reference numeral 2 denotes an insulating substrate, and a thin-film resistor 1 consisting of a pattern in which resistance wiring is repeatedly folded is formed on the surface of the insulating substrate 2. Wide portions 1e and 1f are formed on both ends of the thin-film resistor 1. Electrodes 3a and 3b are formed on the surfaces of the wide portions 1e and 1f, respectively, and the thin-film resistor 1 and the electrodes 3a and 3b are electrically connected. As shown in FIG. 7, each of the electrodes 3a and 3b is electrically connected to each of the terminals 11 via a wire 12. A die pad 13 is provided on the back surface of the insulating substrate 2. The terminals 11 and the die pad 13 form a lead frame.

[0015] The insulating substrate 2, the thin-film resistor 1, and the electrodes 3a, 3b constitute a circuit board 9.

[0016] 7, the surfaces of the thin film resistor 1 and the electrodes 3a, 3b are covered with a protective film 14. Furthermore, with the exception of the terminals 11, each member constituting the thin film resistor 10 is covered with a molding resin 15.

[0017] Although there is no limitation on the material, the insulating substrate 2 is made of, for example, ceramics such as sintered alumina having electrical insulation. The thin-film resistor 1 is made of, for example, ruthenium oxide (RuO2) or Cu-Ni. The terminal 11 is made of a material that can be used for reflow soldering. The electrodes 3a and 3b are made of a conductive material having better electrical conductivity than the thin-film resistor 1. The protective film 14 and the molded resin 15 are made of, for example, an epoxy-based insulating resin.

[0018] In addition, dummy wiring (described later), which is a feature of this embodiment, is omitted in FIG.

[0019] <Outline of Thin Film Resistor in Comparative Example> Fig. 8 shows a plan view of a thin-film resistor in a comparative example, where the X direction and the Y direction shown in Fig. 8 indicate two directions perpendicular to each other within the surface of the insulating substrate.

[0020] The thin film resistor 1 is formed on the surface of an insulating substrate 2 shown in FIG. 7, and constitutes a circuit board 9 together with the insulating substrate 2. However, in the drawing, the insulating substrate 2 is omitted and only the thin film resistor 1 is shown.

[0021] As shown in Fig. 8, the thin-film resistor 1 has a folded pattern 1a in which the resistive wiring extends in the Y direction and is folded back alternately to face each other at a predetermined interval in the X direction, and wide portions 1e and 1f that are wider than the wiring width are formed on both ends of the folded pattern. Electrodes 3a and 3b are formed on the surfaces of the wide portions 1e and 1f, respectively. As shown in Fig. 8, the electrodes 3a and 3b are arranged at positions spaced apart in the X direction.

[0022] As shown in FIG. 8, a resistance pattern 4 for adjusting the resistance value is provided between the electrode 3b (wide portion 1f) and the folded pattern 1a.

[0023] <Problems with thin film resistors in comparative examples> A high voltage of, for example, several hundred to several thousand volts is applied between the first electrode 3a and the second electrode 3b, which are spaced apart from each other in the X direction with the folded pattern 1a sandwiched therebetween. Therefore, near the high potential electrode (hereinafter referred to as the high potential electrode), the potential drops suddenly and the electric field strength becomes very high. As a result, corrosion is likely to occur near the high potential electrode, and a problem occurs in which the resistance value changes significantly over time.

[0024] <Outline of Thin Film Resistor in First Embodiment> Therefore, the inventors conducted extensive research and found that providing dummy wiring for reducing the electric field strength near the high potential electrode alleviates the sudden drop in potential and reduces the electric field strength near the high potential electrode compared to the comparative example in Fig. 8. As a result, it is possible to suppress corrosion near the high potential electrode and reduce the change in resistance value over time compared to the comparative example.

[0025] Fig. 1 is a plan view of a thin-film resistor in the first embodiment. As shown in Fig. 1, the thin-film resistor 1 is formed of a single folded pattern 1a in which a resistive wiring 5 extends in the Y1-Y2 direction and is repeatedly folded back at predetermined intervals in the X1-X2 direction perpendicular to the Y1-Y2 direction. Here, the number of turns and the extension length of the resistive wiring 5 in the Y1-Y2 direction can be changed in various ways depending on the required resistance value.

[0026] 7, the thin-film resistor 1 is formed on the surface of an insulating substrate 2, and constitutes a circuit board 9 together with the insulating substrate 2, but in the drawing, the insulating substrate 2 is omitted and only the thin-film resistor 1 is shown. The same applies to FIG. 4.

[0027] As shown in FIG. 1, at both ends of the resistive wiring 5 in the X1-X2 direction, wide portions 1e and 1f, which are wider than the line width of the resistive wiring 5, are formed integrally with the folded pattern 1a. That is, the wide portions 1e and 1f are arranged apart in the X1-X2 direction perpendicular to the Y1-Y2 direction, which is the extension direction of the resistive wiring 5. As shown in FIG. 1, the first wide portion 1e is provided at the Y1-side tip of the resistive wiring 5a located at the outermost position on the X1 side of the folded pattern 1a in the figure. On the other hand, the second wide portion 1f located on the X2 side in the figure is provided at the X2-side end of the folded pattern 1a via a resistive pattern 4 for adjusting the resistance value. The resistive pattern 4 is formed integrally with the folded pattern 1a and the wide portion 1f. The shape and the formation location of the resistive pattern 4 can be changed arbitrarily. The resistance can be adjusted by trimming the resistive pattern 4.

[0028] 1, a first electrode 3a is formed on the surface of the first wide portion 1e, and a second electrode 3b is formed on the surface of the second wide portion 1f. As a result, the electrodes 3a and 3b are spaced apart in the X1-X2 direction perpendicular to the Y1-Y2 direction in which the resistive wiring 5 extends. Although not limited thereto, each of the electrodes 3a and 3b is formed to have an area slightly smaller than each of the wide portions 1e and 1f.

[0029] The resistive wiring 5 and the electrodes 3a, 3b can be formed into a predetermined pattern shape by forming a resistive film and an electrode film by sputtering or vapor deposition, and then using photolithography technology.

[0030] 1, the extension length of the resistive wiring 5 in the Y1-Y2 direction is shortened stepwise from the X2 side in the figure toward the X1 direction in the figure. In this embodiment, the extension length of the resistive wiring 5 is shortened on the X1 side in the figure so as to leave space on the Y1 side in the figure. This allows the first wide portion 1e and the first electrode 3a to be efficiently disposed in the space that is left.

[0031] FIG. 2 shows a part of the folded pattern 1a shown in FIG. 1 (particularly, the vicinity of the folded top), but as shown in FIG. 2, a resistance pattern 16 for adjusting resistance may be integrally connected between the folded tops 5b of the resistive wiring 5 constituting the folded pattern 1a. The resistance can be adjusted by trimming the resistive pattern 16. The resistive pattern 16 can be provided on the folded tops 5b of the resistive wiring 5 folded on the Y2 side shown in FIG. 1 or on the folded tops 5b of the resistive wiring 5 folded on the Y1 side shown in FIG. However, on the Y1 side shown in FIG., it is preferable to arrange the resistive pattern 16 on the folded tops 5b of the resistive wiring 5 whose extension length is long and far from the first electrode 3a, rather than on the resistive wiring 5 whose extension length is gradually short and close to the first electrode 3a. This makes it easier to adjust the resistance by trimming.

[0032] In this embodiment, as shown in Fig. 1, a dummy wiring 6 is formed that continues from a resistive wiring 5a located at the outermost position on the X1 side of the folded pattern 1a via a first wide portion 1e. The dummy wiring 6 is folded back to the outside of the resistive wiring 5a.

[0033] In this embodiment, by forming the dummy wiring 6 in the vicinity of the first electrode 3a, which is the electrode on the high potential side, it becomes possible to alleviate the drop in potential and reduce the electric field intensity.

[0034] 1, the dummy wiring 6 is folded back to the outside of the outermost resistive wiring 5a, but it may be folded back to the inside. However, folding back to the outside provides more space for forming the dummy wiring 6, making it easier to form the dummy wiring 6, and also allows the dummy wiring 6 to be formed to the same length as the resistive wiring 5a, making it possible to more effectively reduce the electric field strength. The dummy wiring 6 may be provided both outside and inside the resistive wiring 5a.

[0035] Further, although the line width of the dummy wiring 6 is not limited, in this embodiment, the line width of the dummy wiring 6 is set to be approximately equal to the line width of the resistive wiring 5a.

[0036] <Outline of Thin-Film Resistor in Second Embodiment> Next, the pattern of the thin film resistor in the second embodiment will be described with reference to FIG.

[0037] 4, the dummy wirings 7, 8 are formed branching off from the resistive wiring 5 constituting the folded pattern 1a. The dummy wirings 7, 8 will be referred to as branched dummy wirings 7, 8 hereinafter.

[0038] As shown in FIG. 4, the branched dummy wirings 7 and 8 are provided near the first electrode 3a, which is a high potential electrode, and in this embodiment, they are formed to extend to a position facing the first electrode 3a in the X1-X2 direction. In addition, the branched dummy wirings 7 and 8 are both formed to branch in the Y1 direction from the folded apex 5b of the resistance wiring 5. In addition, the extension length of the resistance wiring 5 in the Y1-Y2 direction is shortened stepwise toward the illustrated X1 direction, so that a space is generated near the first electrode 3a. Therefore, by utilizing this space, the branched dummy wirings 7 and 8 can be branched from the folded apex 5b of the resistance wiring 5 and extended to a position facing the first electrode 3a in the X1-X2 direction. This makes it possible to form the branched dummy wirings 7 and 8 smoothly and effectively to reduce the electric field intensity.

[0039] In this embodiment, by forming the branched dummy wirings 7 and 8 in the vicinity of the first electrode 3a, which is the electrode on the high potential side, it becomes possible to alleviate the drop in potential and reduce the electric field intensity.

[0040] In the embodiment of Fig. 4, similarly to Fig. 1, the dummy wiring 6 is folded back on the outside of the resistive wiring 5a located at the outermost position of the folded pattern 1a. This makes it possible to more effectively mitigate the drop in potential and reduce the electric field strength.

[0041] However, in FIG. 4, the dummy wiring 6 may not be provided, and only the branched dummy wirings 7 and 8 may be provided.

[0042] In addition, the branched dummy wirings 7 and 8 shown in FIG. 4 branch off from the folded apex 5b of the resistive wiring 5 with approximately the same line width as the resistive wiring 5, and have a wider line width in the portion facing the first electrode 3a in the X1-X2 direction, but this does not limit the line width of the branched dummy wirings 7 and 8.

[0043] Furthermore, it is preferable to provide a plurality of dummy wirings, since this can more effectively mitigate the drop in potential and reduce the electric field strength.

[0044] The potential distribution and electric field strength distribution in the portion surrounded by the dotted line in the embodiment shown in FIG. 1 and FIG. 4 will be described below.

[0045] <Electric potential distribution and electric field strength distribution> Fig. 3(a) is an enlarged view of the area enclosed by the dotted line in Fig. 1. Fig. 3(a) shows a resistive wiring 5a located at the outermost position of the folded pattern 1a, and a dummy wiring 6 folded back at a distance to the outside of the resistive wiring 5a.

[0046] Fig. 3(b) shows the potential distribution when a voltage of 1000 V is applied between the electrodes 3a and 3b. The potential distribution in Fig. 3(b) is a distribution diagram at the potential measurement point indicated by the dashed line in Fig. 3(a).

[0047] The solid line in Fig. 3(b) is a potential distribution diagram of the embodiment with the dummy wiring 6, and the dotted line is a potential distribution diagram of the comparative example in Fig. 8 without the dummy wiring 6. As shown in Fig. 3(b), it was found that in the comparative example, the potential dropped sharply on both sides of the resistive wiring 5a. On the other hand, in the embodiment, by providing the dummy wiring 6, it was found that the potential at the formation position of the dummy wiring 6 could be increased, and the potential drop on both sides of the resistive wiring 5a could be effectively alleviated compared to the comparative example.

[0048] Fig. 3(c) shows the electric field strength distribution. The electric field strength distribution in Fig. 3(c) is a distribution diagram at the electric field strength measurement point shown by the dashed line in Fig. 3(a). The solid line in Fig. 3(c) is an electric field strength distribution diagram of the embodiment with the dummy wiring 6, and the dotted line is an electric field strength distribution diagram of the comparative example in Fig. 8 without the dummy wiring 6.

[0049] As shown in FIG. 3(c), in the example, the electric field strength can be reduced more than in the comparative example, and the simulation results show that the electric field strength can be reduced by about 39% compared to the comparative example.

[0050] Next, Fig. 5(a) is an enlarged view of the area surrounded by the dotted line in Fig. 4. Fig. 5(a) shows the first electrode 3a, the resistive wiring 5, and the branched dummy wirings 7 and 8 located between the first electrode 3a and the resistive wiring 5.

[0051] Fig. 5(b) shows the potential distribution when a voltage of 1000 V is applied between the electrodes 3a and 3b. The potential distribution in Fig. 5(b) is a distribution diagram at the potential measurement points indicated by the dashed line in Fig. 5(a).

[0052] The solid line in Fig. 5(b) is a potential distribution diagram of the embodiment having the branched dummy wirings 7, 8, and the dotted line is a potential distribution diagram of the comparative example in Fig. 8 without the branched dummy wirings 7, 8. As shown in Fig. 5(b), it was found that the potential dropped sharply near the first electrode 3a in the comparative example. On the other hand, in the embodiment, by providing the branched dummy wirings 7, 8, it was found that the potential at the formation position of the branched dummy wirings 7, 8 could be increased, and the potential drop near the first electrode 3a could be effectively alleviated compared to the comparative example.

[0053] Fig. 5(c) shows the electric field strength distribution. The electric field strength distribution in Fig. 5(c) is a distribution diagram at the electric field strength measurement point shown by the dashed line in Fig. 5(a). The solid line in Fig. 5(c) is an electric field strength distribution diagram of the embodiment having the branched dummy wirings 7 and 8, and the dotted line is an electric field strength distribution diagram of the comparative example in Fig. 8 without the dummy wiring.

[0054] As shown in FIG. 5(c), in the example, the electric field strength can be reduced more than in the comparative example, and the simulation results show that the electric field strength can be reduced by about 36% compared to the comparative example.

[0055] <Improvement effects> Next, the improvement effect of this embodiment will be described. Fig. 6 is a graph showing the relationship between evaluation time and ΔR in the humidity load life test of the embodiment and the comparative example. The embodiment was performed using the thin film resistor shown in Fig. 4. The comparative example was performed using the thin film resistor shown in Fig. 8.

[0056] In the experiment, the applied voltage was set to 1000V, and the change in resistance value over time was measured in an environment of 85°C temperature and 85% humidity.

[0057] As shown in Fig. 6, it was found that the resistance value change can be reduced in the embodiment compared to the comparative example. This is because the electric field strength can be reduced in the embodiment compared to the comparative example, and corrosion can be suppressed. Thus, it was found that the embodiment can reduce the resistance value change and promote the extension of the life.

[0058] According to the experiment, ion migration did not occur in the comparative example, and metal corrosion was a problem. The resistance pattern used in the experiment has a structure in which electrodes are arranged on both sides of a folded pattern in which the resistance wiring is repeatedly folded. The resistance wiring extends in the Y1-Y2 direction and is repeatedly folded back at intervals in the X1-X2 direction perpendicular to the Y1-Y2 direction, and the electrodes are arranged separately on both sides of the X1-X2 direction. In such a pattern arrangement, when a high voltage is applied between the electrodes, the metal corrosion becomes a problem due to the increase in the electric field strength near the high potential electrode. Therefore, in this embodiment, a dummy wiring for reducing the electric field strength is provided near the high potential electrode to suppress the occurrence of corrosion. [Industrial Applicability]

[0059] The thin film resistor of the present invention can reduce the electric field strength and reduce the change in resistance value over time. A circuit board having the thin film resistor of the present invention can be applied to chip resistors, resistor networks, and the like. [Explanation of symbols]

[0060] 1 Thin film resistor 1a Folding pattern 1e, 1f wide section 2. Insulating substrate 3a, 3b electrode 4, 16 Resistor Pattern 5, 5a resistor wiring 5b Folded top 6 Dummy wiring 7, 8 branched dummy wiring 9 Circuit Board 10 Thin film resistor 11 Terminal 12 Wire 13 Die pad 14 Protective film 15 Molding resin

Claims

1. A circuit board having an insulating substrate, a thin-film resistor disposed on a surface of the insulating substrate, and electrodes electrically connected to both sides of the thin-film resistor, The thin-film resistor is formed in a pattern in which a resistive wiring is repeatedly folded back, Dummy wiring is formed on the electrode side with a higher potential to reduce the electric field strength. the dummy wiring is electrically connected to the resistive wiring and / or the electrode, extends from the folded pattern between the electrodes in parallel to the pattern on the side of the electrode with a higher potential, and has a terminal end that does not face the resistive wiring in the extending direction; A circuit board comprising:

2. 2. The circuit board according to claim 1, wherein the dummy wiring is formed continuously with a folded pattern of the resistive wiring.

3. 3. The circuit board according to claim 2, wherein the dummy wiring is formed by folding back outward from the resistive wiring located at the outermost position of the folded back pattern.

4. 2. The circuit board according to claim 1, wherein the dummy wiring is formed by branching off from the resistive wiring.

5. 5. The circuit board according to claim 4, wherein the dummy wiring is formed by branching off from a folded-back top of the resistive wiring.

6. 6. The circuit board according to claim 1, wherein a plurality of the dummy wirings are provided.

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