RF Connectors

Abstract

To provide an RF connector which can reduce an overall size of a component.SOLUTION: An RF connector includes: a first printed circuit board on which a plurality of devices is mounted; at least one first signal transmission pin having one side portion fixed in an area adjacent to at least one side of the first printed circuit board; a second printed circuit board disposed to be spaced apart from the first printed circuit board; at least one connection terminal disposed at an area adjacent to at least one side of the second printed circuit board so as to be in contact with the other side portion of the at least one first signal transmission pin on a side opposite to the one side portion; a first push bar configured to apply a force to at least one surface of the at least one first signal transmission pin to keep the contact between the at least one first signal transmission pin and the at least one connection terminal; and a first metal shielding plate fixed to the first push bar and the second printed circuit board, and configured to shield at least a portion of the second printed circuit board and the first push bar.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to an RF connector. More specifically, the present disclosure relates to an RF connector using multiple signal transmission pins. This invention relates to an RF connector that transmits an RF signal (Radio Frequency signal). [Background technology]

[0002] The material described in this section is merely intended to provide background information for the present disclosure and may not constitute prior art.

[0003] RF connectors are generally used to transmit and receive RF (Radio Frequency) signals between PCBs (Printed Circuit Boards). There are two types of RF connectors: single connectors that transmit one frequency signal, and multi-connectors that transmit signals of different frequency bands. In particular, recently, there have been many connectors that transmit signals of various frequency bands. Multi-connectors are often used to process signals.

[0004] However, conventional multi-connectors are themselves large in size, and due to the structure of the multi-connector, there is a height difference between the PCBs when connecting them, which results in an increase in the overall size of the components.

[0005] In addition, there is a limit to the range of frequency bands that a multi-connector can process, and there is a problem that the overall unit cost of parts increases when there are many multi-connectors or when transmitting signals in a wide range of frequency bands. Summary of the Invention [Problem to be solved by the invention]

[0006] Therefore, the present disclosure is directed to solving these problems and has as its primary objective the provision of an RF connector that can reduce the overall component size by allowing RF signals to be transmitted in the same plane.

[0007] Another object of the present disclosure is to provide an RF connector capable of processing signals in a variety of frequency bands while at the same time reducing unit costs. [Means for solving the problem]

[0008] In order to achieve the above object, according to one embodiment of the present disclosure, there is provided a first printed circuit board on which a plurality of devices are mounted, a first bridge assembly mounted in an area adjacent to at least one side of the first printed circuit board and including a plurality of first signal transmission pins, a second printed circuit board disposed at a distance from the first printed circuit board, a plurality of connection terminals disposed in an area adjacent to at least one side of the second printed circuit board so as to be able to contact at least one side of the plurality of first signal transmission pins, and a contact between the plurality of first signal transmission pins and the plurality of first signal transmission pins. a first push bar configured to apply a force to at least one surface of the plurality of first signal transmission pins to maintain contact with a connection terminal; and a first metal shielding plate fixed to the first push bar and the second printed circuit board and configured to shield at least a portion of the second printed circuit board and the first push bar. provide. Effect of the Invention

[0009] As described above, according to this embodiment, by using a plurality of signal transmission pins, RF (Radio Frequency) signals of various frequency bands can be transmitted on the same plane, and the size of the component can be reduced. This has the effect of reducing the size and reducing the manufacturing cost compared to conventional RF connectors. [Brief description of the drawings]

[0010] [Figure 1] 1 is a perspective view of a printed circuit board to which a shielding plate according to an embodiment of the present disclosure is coupled; [Diagram 2] FIG. 1 is an exploded perspective view of an RF connector according to an embodiment of the present disclosure. [Diagram 3] 1 is an enlarged view of a side of an RF connector according to an embodiment of the present disclosure. [Figure 4] 1 is an enlarged view of a signal transmission pin of an RF connector according to an embodiment of the present disclosure. [Diagram 5] FIG. 13 is a diagram showing an isolation diagram in which the interval between each signal transmission pin through which a signal is transmitted is 6 mm according to an embodiment of the present disclosure. [Figure 6] FIG. 13 is a diagram showing an isolation diagram in which the interval between each signal transmission pin through which a signal is transmitted is 8 mm according to an embodiment of the present disclosure. [Figure 7] FIG. 13 is a diagram showing an isolation diagram in which shielding walls are arranged between each signal transmission pin through which a signal is transmitted according to an embodiment of the present disclosure, and the distance between each signal transmission pin is 6 mm. [Figure 8] FIG. 2 is a top view of a printed circuit board coupled with a shielding plate according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Some embodiments of the present disclosure will be described in detail below with reference to the drawings. When referring to components in each drawing, it should be noted that the same components are given the same reference numerals as much as possible even if they are shown in different drawings. In describing the present disclosure, if a detailed description of related publicly known configurations or functions is deemed to obscure the gist of the present disclosure, the detailed description will be omitted.

[0012] In describing components of the embodiments of the present disclosure, reference numerals such as 1, 2, i), ii), a), b) may be used. Such reference numerals are used to distinguish the components from other components, and do not limit the essence, order, sequence, etc. of the components. When a part in the specification "includes" or "has" a certain component, this does not mean that the other components are excluded, but that the part may further include the other components, unless explicitly stated to the contrary.

[0013] FIG. 1 is a perspective view of a printed circuit board to which a shielding plate according to an embodiment of the present disclosure is coupled.

[0014] FIG. 2 is an exploded perspective view of an RF connector according to an embodiment of the present disclosure.

[0015] FIG. 3 is an enlarged side view of an RF connector according to an embodiment of the present disclosure.

[0016] FIG. 4 is an enlarged view of a signal transmission pin of an RF connector according to an embodiment of the present disclosure.

[0017] FIG. 5 is a diagram showing an isolation diagram in which the interval between each signal transmission pin through which an RF signal is transmitted is 6 mm according to an embodiment of the present disclosure.

[0018] FIG. 6 is a diagram showing an isolation diagram in which the interval between each signal transmission pin through which a signal is transmitted is 8 mm according to an embodiment of the present disclosure.

[0019] 7A and 7B are diagrams showing the isolation diagrams of a case where a shielding wall is disposed between each signal transmission pin through which a signal is transmitted according to an embodiment of the present disclosure, and the interval between each signal transmission pin is 6 mm. FIG. 7A shows a case where the shielding wall is reduced in length due to manufacturing tolerance, and FIG. 7B shows a case where the shielding wall is Shown here is a properly constructed version.

[0020] 1 to 7, an RF connector according to an embodiment of the present disclosure includes a first printed circuit board 10, a second printed circuit board 20, a first bridge assembly 200, a plurality of first signal transmission pins 220, a plurality of connection terminals 260, a first push bar 240, a first metal shielding plate 100, and a plurality of shielding walls 500. Including all or part.

[0021] A plurality of devices are mounted on the first printed circuit board 10. In the RF connector according to the embodiment, the first printed circuit board 10 is an amplifier board. However, it is not necessarily limited to this.

[0022] The second printed circuit board 20 is disposed apart from the first printed circuit board 10 and has a plurality of elements mounted thereon. In the RF connector according to an embodiment of the present disclosure, the second printed circuit board 20 can be, but is not necessarily limited to, a digital board.

[0023] The first bridge assembly 200 includes a plurality of first signal transmission pins 220, and is mounted in an area adjacent to at least one side of the first printed circuit board 10. That is, the first bridge assembly 200 is configured to assemble the plurality of first signal transmission pins 220, and serves to fix one end of the plurality of first signal transmission pins 220.

[0024] The first signal transmission pins 220 are connected to the first printed circuit board 10 and the second printed circuit board 20 to transmit and receive signals. The first signal transmission pins 220 can transmit not only RF signals but also power and digital signals.

[0025] The multiple first signal transmission pins 220 are assembled at equal intervals to the first bridge assembly 200. However, they do not necessarily have to be assembled at equal intervals, and the intervals can be adjusted depending on the role of each signal transmission pin.

[0026] If the intervals between the signal transmission pins included in the plurality of first signal transmission pins 220 are very narrow, there is a risk of interference between signals occurring. Therefore, it is necessary to set the distance between each signal transmission pin appropriately depending on the purpose. As shown in FIG. 5, when the distance between each signal transmission pin that transmits a signal is 6 mm, the isolation value is about 48 dB in the 3.5 GHz frequency band. On the other hand, when the distance between each signal transmission pin that transmits a signal is 8 mm, the isolation value is about 55 dB in the 3.5 GHz frequency band, as shown in Fig. 6. Therefore, in order to maintain the isolation value at 55 dB or more, it is preferable that the interval between each signal transmission pin that transmits a signal is 8 mm or more.

[0027] For example, the plurality of first signal transmitting pins 220 may be configured to have 80 pins, with the eight or so pins spaced at regular intervals. The number of pins may be changed depending on the application, and the plurality of first signal transmitting pins 220 are easily manufactured since they are assembled to the first bridge assembly 200 mounted on a printed circuit board. Therefore, the use of the plurality of first signal transmitting pins 220 reduces unit costs compared to using an RF multi-connector to achieve the same performance.

[0028] A protruding unit 400 is formed on one surface of the first signal transmission pins 220. The protruding portion 400 is provided so that the first signal transmission pins 220 are connected to the connection terminals 260. It is formed to be touched.

[0029] The plurality of connection terminals 260 are configured to be able to come into contact with at least one surface of the plurality of first signal transmission pins 220, and are disposed in an area adjacent to at least one side of the second printed circuit board 20. That is, they may be disposed in areas adjacent to both sides of the second printed circuit board 20. In the RF connector according to an embodiment of the present disclosure, the plurality of connection terminals 260 may be of a pad type, but are not necessarily limited thereto, and may be of an insertion type.

[0030] The first signal transmitting pins 220 correspond to the connection terminals 260, respectively. For example, one signal transmitting pin is in contact with one connection terminal, but is not limited thereto, and some of the first signal transmitting pins 220 may be in contact with ground. Also, the first signal transmitting pins 220 are in contact with one side of the connection terminals 260, respectively, in an overlapping manner.

[0031] The first push bar 240 is configured to apply a force to at least one surface of the plurality of first signal transmission pins 220, thereby maintaining contact between the plurality of first signal transmission pins 220 and the plurality of connection terminals 260. For example, the first push bar 240 is disposed on the surface opposite to the surface on which the protrusions 400 of the plurality of first signal transmission pins 220 are located, i.e., the other surface. The first push bar 240 applies a force to the other surface of the plurality of first signal transmission pins 220, thereby causing the protrusions 400 to come into contact with the plurality of connection terminals 260 without being spaced apart, thereby enabling the plurality of first signal transmission pins 220 to stably transmit signals.

[0032] The first push bar 240 is made of an insulating material, such as, but not limited to, a plastic material.

[0033] The shape of the first push bar 240 may be, for example, wedge-shaped, with the apex of the wedge being located between the first printed circuit board 10 and the second printed circuit board 20. However, it does not necessarily have to be wedge-shaped, and other shapes are possible as long as the protrusions 400 of the multiple first signal transmission pins 220 are firmly contacted with the multiple connection terminals 260.

[0034] When the first push bar 240 is wedge-shaped and the apex of the wedge applies force to the other side of the first signal transmitting pins 220, the first signal transmitting pins 220 form a bending unit 280 between the first printed circuit board 10 and the second printed circuit board 20. By forming the bending unit 280 in this manner, the protrusions 400 of the first signal transmitting pins 220 are firmly contacted with the connection terminals 260 according to the principle of leverage.

[0035] The first metal shielding plate 100 is fixed to the first push bar 240 and the second printed circuit board 20, and is configured to shield at least a part of the second printed circuit board 20 and the first push bar 240. When the first metal shielding plate 100 engages with the first push bar 240, it is preferable that the first push bar 240 is coupled to apply a force to one side of the plurality of first signal transmission pins 220. The thickness of the first metal shielding plate 100 may be changed according to the noise environment around the printed circuit board, and the position where the first metal shielding plate 100 is fixed to the second printed circuit board 20 may also be changed.

[0036] The shielding walls 500 are disposed between two adjacent first signal transmission pins and are in contact with the grounds of the first printed circuit board 10 and the second printed circuit board 20. The shielding walls 500 serve to prevent signal interference from occurring between the signal transmission pins. In other words, the use of the shielding walls 500 ensures isolation between the signal transmission pins. The shielding walls 500 are made of a metal material.

[0037] When the RF connector according to an embodiment of the present disclosure includes a plurality of shielding walls 500, the first push bar 240 is composed of a plurality of unit push bars (not shown). For example, the unit push bars are configured to be arranged at positions corresponding to one side of each of the first signal transmission pins 220, and the plurality of shielding walls 500 are arranged between each of the signal transmission pins. However, the shape is not necessarily limited to the above.

[0038] As shown in FIG. 7, when a shielding wall is formed between each signal transmission pin that transmits a signal and the distance between each signal transmission pin is 6 mm, the isolation value is It represents about 69 dB. Even if the length of the shielding wall is reduced due to manufacturing tolerances, the isolation value represents about 65 dB in the 3.5 GHz frequency band. Therefore, the isolation value is increased In order to achieve this, it is preferable that the above-mentioned shielding walls are formed between each of the signal transmission pins that transmit signals.

[0039] Using the above-mentioned configuration, signals can be transmitted between printed circuit boards on the same plane, which reduces the size of components.

[0040] FIG. 8 is a top view of a printed circuit board coupled with a shielding plate according to an embodiment of the present disclosure.

[0041] 3, 4, and 8, an RF connector according to an embodiment of the present disclosure includes a third printed circuit board 30, a second bridge assembly 300, and a plurality of second signal transmission pins. 320, a second push bar 340, and all or a portion of a second metal shielding plate 120.

[0042] The third printed circuit board 30 is disposed on the opposite side of the first printed circuit board 10 with a space therebetween with respect to the second printed circuit board 20, and a plurality of elements are mounted on the third printed circuit board 30. In the RF connector according to an embodiment of the present disclosure, the third printed circuit board 30 may be an amplifier (Amp) board. It is not necessarily limited to this.

[0043] The second bridge assembly 300 includes a plurality of second signal transmission pins 320, and is mounted in an area adjacent to at least one side of the third printed circuit board 30. That is, the second bridge assembly 300 is configured to assemble the plurality of second signal transmission pins 320, and serves to fix one end of the plurality of second signal transmission pins 320.

[0044] The second signal transmission pins 320 are connected to the second printed circuit board 20 and the third printed circuit board 30 to transmit and receive signals. The second signal transmission pins 320 can transmit not only RF signals but also power and digital signals. Depending on the characteristics of the first printed circuit board 10, the second printed circuit board 20, and the third printed circuit board 30, the second signal transmission pins 320 can also transmit signals with different characteristics from the first signal transmission pins 220.

[0045] The second signal transmission pins 320 are assembled to the second bridge assembly 300 at equal intervals. However, they do not necessarily have to be assembled at equal intervals, and the intervals can be adjusted depending on the role of each signal transmission pin. The intervals between each of the second signal transmission pins 320 are the same as those described above for the first signal transmission pins 220.

[0046] For example, the plurality of second signal transmission pins 320 includes more than 80 pins. The intervals between the pins are constant. As with the first signal transmitting pins 220, the number of pins can be changed depending on the application. The second signal transmitting pins 320 have a protrusion 400 formed on one surface thereof.

[0047] The second signal transmission pins 320 correspond to the connection terminals 260, respectively. For example, one signal transmission pin is in contact with one connection terminal, but this is not necessarily limited thereto, and some of the second signal transmission pins 320 may be in contact with ground.

[0048] The plurality of connection terminals 260 in contact with the plurality of second signal transmitting pins are located on the second printed circuit board 20, preferably in an area adjacent to the side opposite to the side where the plurality of first signal transmitting pins 220 are located. The plurality of second signal transmitting pins 320 are in contact with one side of the plurality of connection terminals 260 in an overlapping manner.

[0049] The second push bar 340 is configured to apply a force to at least one surface of the second signal transmitting pins 320, thereby maintaining contact between the second signal transmitting pins 320 and the connection terminals 260. Similar to the first push bar 240, the second push bar 340 is disposed on the opposite surface, i.e., the other surface, of the second signal transmitting pins 320 from where the protrusions 400 are located.

[0050] The shape of the second push bar 340 may be, for example, wedge-shaped, with the apex of the wedge being located between the second printed circuit board 20 and the third printed circuit board 30. However, it does not necessarily have to be wedge-shaped, and other shapes are also possible as long as the protrusions 400 of the plurality of second signal transmission pins 320 can firmly contact the plurality of connection terminals 260.

[0051] When the second push bar 340 is wedge-shaped and the apex of the wedge applies force to the other surface of the second signal transmitting pins 320, the second signal transmitting pins 320 form a bent portion 280 between the second printed circuit board 20 and the third printed circuit board 30. In this manner, the bent portion 280 is formed, and the protrusions 400 of the second signal transmitting pins 320 are firmly contacted with the connection terminals 260 according to the principle of leverage.

[0052] The second push bar 340 is made of an insulating material, such as, but not limited to, a plastic material.

[0053] The second metal shielding plate 120 is fixed to the second push bar 340 and the second printed circuit board 20, and is configured to shield at least a portion of the second printed circuit board 20 and the second push bar 340. When the second metal shielding plate 120 is coupled to the second push bar 340, it is preferable that the second push bar 340 is coupled to apply a force to one side of the plurality of second signal transmission pins 320. The thickness of the second metal shielding plate 120 may be changed according to the noise environment around the printed circuit board, and the position at which the second metal shielding plate 120 is fixed to the second printed circuit board 20 may also be changed.

[0054] In addition to the first metal shielding plate 100 and the second metal shielding plate 120, a separate metal shielding plate is further combined to cover the first printed circuit board 10 and the third printed circuit board 30. This makes it possible to prevent noise from interfering with the path through which the wireless signal is transmitted.

[0055] Also, the semiconductor device may further include a plurality of shielding walls 500 disposed between two adjacent second signal transmission pins and in contact with the grounds of the second printed circuit board 20 and the third printed circuit board 30. The description of the plurality of shielding walls 500 is as described above.

[0056] The bridge assembly, signal transmission pin, push bar, and shield wall of the RF connector according to an embodiment of the present disclosure are used between each pair of printed circuit boards, for example, two pieces, but it is not necessary to use two pieces, and one piece or three or more pieces may be used depending on the application.

[0057] As described above, the RF connector according to the embodiment of the present disclosure can minimize the size of the components by transmitting signals on the same plane using multiple signal transmission pins. In addition, the RF connector is easier to manufacture than a multi-connector, and the unit price of the components is relatively low.

[0058] The above description is merely an illustrative example of the technical idea of ​​the present embodiment, and various modifications and variations are possible within the scope of the essential characteristics of the present embodiment, if one has ordinary knowledge in the technical field to which the present embodiment belongs. Therefore, the present embodiment is intended to explain, rather than limit, the technical idea of ​​the present embodiment, and the scope of the technical idea of ​​the present embodiment is not limited by such an embodiment. The scope of protection of the present embodiment should be interpreted according to the claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present embodiment. [Explanation of symbols]

[0059] 10: first printed circuit board, 20: second printed circuit board, 30: third printed circuit board, 100: first metal shielding plate, 120: second metal shielding plate, 200: first bridge assembly, 220: first signal transmission pin, 240: first push bar, 260: connection terminal, 280: bending portion, 300: second bridge assembly, 320: second signal transmission pin, 340: second push bar, 400: protrusion, 500: shielding wall

[0060] [CROSS-REFERENCE TO RELATED APPLICATION] This patent application claims priority to patent application No. 10-2020-0063073, filed in Korea on May 26, 2020, the entirety of which is incorporated herein by reference.

Claims

1. a first printed circuit board having a plurality of devices mounted thereon; at least one first signal transmission pin, one side of which is fixed to a region adjacent to one side of the first printed circuit board; a second printed circuit board spaced apart from the first printed circuit board; at least one connection terminal disposed in an area adjacent to one side of the second printed circuit board so as to be able to contact the other side of the at least one first signal transmitting pin opposite to the one side; a first push bar configured to apply a force to at least one side of the at least one first signal carrying pin to maintain contact between the at least one first signal carrying pin and the at least one connection terminal; a first metal shielding plate secured to the first push bar and the second printed circuit board and configured to shield at least a portion of the second printed circuit board and the first push bar.

2. There are a plurality of the first signal transmission pins, a shielding wall disposed between two adjacent first signal transmission pins; 2. The RF connector according to claim 1, wherein the shielding wall is in contact with grounds of the first printed circuit board and the second printed circuit board.

3. There are a plurality of the first signal transmission pins, 2. The RF connector of claim 1, wherein the first signal transmission pins are assembled at equal intervals to a first bridge assembly mounted in an area adjacent to one side of the first printed circuit board.

4. Each of the at least one first signal transmission pin corresponds to the at least one connection terminal; 2. The RF connector according to claim 1, wherein the at least one first signal transmission pin is overlapped and contacted with one surface of the at least one connection terminal.

5. 2. The RF connector according to claim 1, wherein a protruding unit for contacting the at least one connection terminal is formed on one surface of the at least one first signal transmission pin.

6. 6. The RF connector of claim 5, wherein the protrusion is configured to apply a force to the other side of the at least one first signal carrying pin.

7. 7. The RF connector of claim 6, wherein the first push bar is wedge-shaped, and a vertex of the wedge shape is located between the first printed circuit board and the second printed circuit board.

8. 8. The RF connector of claim 7, wherein the at least one first signal transmitting pin forms a bending unit between the first printed circuit board and the second printed circuit board.

9. 2. The RF connector of claim 1, wherein the at least one first signal transmitting pin transmits an RF signal, a power source, and a digital signal.

10. 2. The RF connector according to claim 1, wherein the at least one connection terminal is of a pad type.

11. 2. The RF connector of claim 1, wherein the first push bar is made of a plastic material.

12. the first printed circuit board is an amplifier board, 2. The RF connector of claim 1, wherein the second printed circuit board is a digital board.

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