Method for manufacturing a speaker diaphragm, speaker diaphragm, and speaker

Abstract

Provided is a manufacturing method for a speaker diaphragm, a speaker diaphragm, and a speaker whereby, even when a hole is opened, insulation properties can be ensured, and rigidity can also be ensured. The method for manufacturing a speaker diaphragm according to the present invention is a method for manufacturing a speaker diaphragm including: a conductive layer (21) that includes a through-hole (31) for passing a tinsel wire; and resin layers (22) disposed so as to sandwich the conductive layer (21). The method comprises: a first step for providing the through-hole (31) in the conductive layer (21); and a second step for closing a mold (30) provided with a convex punch (P) having a diameter smaller than that of the through-hole (31), thereby causing the punch (P) to press the resin layers (22) against a laminate (M1) on an inner side of the through-hole (31). In the second step, due to the pressing of the punch (P), leaked material (40) of the resin layers (22) flows in an inside surface direction of the through-hole (31), and flows into a void portion near an outside surface of the punch (P).

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a speaker diaphragm, a speaker diaphragm, and a speaker.

Background Art

[0002] Manufacturing technology for passing brocade thread through a speaker diaphragm has been developed. In the manufacturing method disclosed in Patent Document 1, for a metal speaker diaphragm, the brocade thread is inserted through a through-hole provided in a damper. At this time, the connection portion between the brocade thread and the voice coil is disposed on the outer peripheral surface of the voice coil bobbin.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] In Patent Document 1 described above, although insulation between a conductive metal speaker diaphragm and a brocade thread can be ensured, a general manufacturing technique of making a hole for the brocade thread in the speaker diaphragm cannot be applied. At this time, a separate part is required to ensure insulation, and there arises a problem that the rigidity of the speaker diaphragm is insufficient by making a large hole considering the thickness of the separate part.

[0005] The present invention has been made in view of such circumstances, and an object thereof is to provide a method for manufacturing a speaker diaphragm, a speaker diaphragm, and a speaker that can ensure insulation even when a hole is made in the speaker diaphragm and can also ensure rigidity.

[0006] The method for manufacturing a speaker diaphragm according to the present embodiment is a conductive layer, a resin layer disposed so as to sandwich the conductive layer, and is a method for manufacturing a speaker diaphragm having the same. A first step of providing a through-hole in the conductive layer for passing a brocade thread; A second step of closing a mold provided with a convex punch having a diameter smaller than the diameter of the through-hole in each of a first mold and a second mold, and pressing the resin layer against the laminate having the resin layer disposed on both sides of the conductive layer, with the punch inside the through-hole; and In the second step, due to the pressing of the punch, the flash of the resin layer flows in the direction of the inner surface of the through-hole and into the void near the outer surface of the punch.

[0007] The method for manufacturing a speaker diaphragm according to this embodiment can form a diaphragm that can ensure insulation even when holes are made and can also ensure rigidity.

[0008] The method for manufacturing a speaker diaphragm according to this embodiment includes a conductive layer, and a resin layer disposed so as to sandwich the conductive layer, and is a method for manufacturing a speaker diaphragm having: a first step of providing a through-hole in the conductive layer for passing a brocade thread; a second step of closing a mold provided with a recess having a diameter larger than the diameter of the through-hole in each of a first mold and a second mold, and pressing the resin layer against the laminate having the resin layer disposed on both sides of the conductive layer, outside the through-hole; and a third step of pressurizing the space formed by the mating of the recesses of the mold in the second step; and In the third step, the resin layer is pressurized and fused inside the through-hole.

[0009] In the method for manufacturing a speaker diaphragm according to this embodiment, since it is not necessary to align the positions of the holes previously made in the conductive material with the mold, it is easy to ensure insulation and rigidity.

[0010] The speaker diaphragm according to this embodiment A speaker diaphragm having a through-hole for inserting a silk thread, a conductive layer having the through-hole, a resin layer that sandwiches the conductive layer from both sides and covers the inner surface of the through-hole, a part of the resin layer covering the inner surface of the through-hole is formed by a part of the resin layer that was located near the center of the through-hole before the pressing step of pressing the resin layer from both sides of the conductive layer toward the inner surface of the through-hole and flowing in the direction of the inner surface of the through-hole by the pressing step. This is the gist of the invention.

[0011] The speaker diaphragm according to this embodiment can ensure insulation even when holes are made and can also ensure rigidity.

[0012] The speaker according to this embodiment has the above speaker diaphragm.

[0013] The speaker according to this embodiment can ensure insulation even when holes are made and can also ensure rigidity.

[0014] According to this embodiment, it is possible to provide a method for manufacturing a speaker diaphragm, a speaker diaphragm, and a speaker that can ensure insulation even when holes are made and can also ensure rigidity.

Brief Description of the Drawings

[0015]

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Embodiments for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each drawing, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions are omitted as necessary for clarity of explanation. Also, some reference numerals are omitted so that the drawings do not become complicated. Of course, the right-handed xyz orthogonal coordinates shown in the drawings are for convenience in explaining the positional relationship of the components. Usually, the positive direction of the z-axis is vertically upward, and the xy plane is the horizontal plane.

[0017] (Embodiment 1) <Configuration of the Molded Speaker Diaphragm> First, with reference to FIGS. 1 and 2, a speaker diaphragm formed using the manufacturing method of the speaker diaphragm according to the first embodiment will be described. FIG. 1 is a perspective view of a speaker diaphragm 10 formed using the manufacturing method of the speaker diaphragm according to the first embodiment. As shown in FIG. 1, the speaker diaphragm 10 is provided with a curved surface 101, an edge portion 102, and brocade thread holes 11. The curved surface 101 has a concave shape from the outer periphery toward the center direction. Further, the curved surface 101 is provided with a hollow hole 13 at the center of the curved surface 101 and brocade thread holes 11 on the curved surface 101. The brocade thread 12 is passed through the brocade thread holes 11. In FIG. 1, there are four brocade thread holes 11, but the number of brocade thread holes is not limited to four, and two may be sufficient. The edge portion 102 is provided outside along the outer periphery of the curved surface 101 on a plane perpendicular to the normal direction passing through the center of the hole 13. The speaker diaphragm 10 vibrates with the edge portion 102 as a fixed end and the curved surface 101 vibrating. Hereinafter, the view in which the curved surface 101 is concave as viewed from the normal direction of the hollow hole 13 of the speaker diaphragm 10 is defined as the top view. Also, the view seen from a direction perpendicular to the normal direction of the hollow hole 13 of the speaker diaphragm 10 is referred to as the cross-sectional view.

[0018] FIG. 2 is a cross-sectional view passing through the brocade thread holes 11 in the curved surface 101 of the speaker diaphragm 10 formed using the manufacturing method of the speaker diaphragm according to the first embodiment. As shown in FIG. 2, the speaker diaphragm 10 according to the first embodiment has a conductive layer 21 and a resin layer 22. The resin layer 22 is arranged so as to sandwich the conductive layer 21 and is fused at the fusion surface 200. That is, the resin layer 22 in the speaker diaphragm 10 according to the first embodiment is arranged so as to enclose the conductive layer 21. A laminate in which the resin layer 22 is arranged on both sides of the conductive layer 21 is defined as laminate M1. The resin layer 22 is, for example, a polypropylene sheet of 5, 10, or 15 μm. Also, the thickness of the speaker diaphragm 10 is preferably 200 μm or less or 100 μm or less. Here, since the conductive layer 21 is a conductor, it conducts electricity, but since the resin layer 22 is an insulator, it does not conduct electricity. In the speaker diaphragm manufactured using the manufacturing method of the speaker diaphragm according to the first embodiment, even if the brocade thread is passed through the brocade thread hole 11, only the resin layer 22 comes into contact with the brocade thread, so there is no short circuit.

[0019] <Method for manufacturing a speaker diaphragm> FIGS. 3 and 4 are schematic views of a mold used in the method for manufacturing a speaker diaphragm according to the first embodiment. With reference to FIGS. 3 and 4, the mold 30 used in the method for manufacturing a speaker diaphragm according to the first embodiment will be described. As shown in FIG. 3, the mold 30 includes a pair of movable molds 301 and 302 that can be opened and closed. The movable molds 301 and 302 in FIG. 3 have a movable direction parallel to the Z-axis. The movable molds 301 and 302 are provided with a convex punch P. The punch P is provided symmetrically with respect to the center line parallel to the movable direction of the movable molds 301 and 302. Also, the diameter of the punch P is smaller than the diameter of the through hole 31 described later. Here, the punch P may be provided on only one side with respect to the center line parallel to the movable direction of the movable molds 301 and 302. The laminate M1 is placed in the mold 30. At this time, the through hole 31 of the speaker diaphragm 10 is arranged so as to be pressed by the punch P of the mold 30. In FIG. 3, since it is a cross-sectional view of the speaker diaphragm 10, the through hole 31 is not shown. As shown in FIG. 4, by closing the pair of movable molds 301 and 302, the laminate M1 is pressed. Then, the pair of movable molds 301 and 302 are opened, and the formed laminate M2 is taken out. Note that one of the movable molds 301 and 302 may be a fixed mold. Furthermore, the movable mold 301 is referred to as the first mold, and the movable mold 302 is referred to as the second mold. It does not matter if the movable mold 301 is the second mold and the movable mold 302 is the first mold. In FIG. 4, for convenience of explanation, the punch P is omitted from the movable mold 301 and the movable mold 302.

[0020] Next, with reference to FIGS. 5 and 6, a method for manufacturing a speaker diaphragm according to the first embodiment will be described. FIG. 5 is a flowchart showing the method for manufacturing a speaker diaphragm according to the first embodiment. FIG. 6 is a schematic diagram showing the method for manufacturing a speaker diaphragm according to the first embodiment. Note that the silk thread holes 11 of the speaker diaphragm in FIG. 6 are two examples. In FIG. 6, steps ST1 to ST3 and steps ST6 to ST7 are top views of the speaker diaphragm 10, while steps ST4 and ST5 are cross-sectional views of the speaker diaphragm 10.

[0021] First, a conductive layer 21 is prepared (step ST1). At this time, the conductive layer 21 in FIG. 6 is substantially square, but it may be circular. Next, a through hole 31 having a diameter larger than the diameter of the silk thread is provided in the conductive layer 21 (step ST2). Note that the through hole 31 is formed by, for example, a punching tool or cutting. Subsequently, a resin layer 22 is installed so as to sandwich the conductive layer 21 to form a laminate M1 (step ST3). At this time, the resin layer 22 in FIG. 6 is substantially square, but it may be circular. Also, it is preferable that the shape of the conductive layer 21 and the resin layer 22 are the same. Here, the laminate M1 prepared in step ST3 is installed in a mold 30 (step ST4). At this time, the through hole 31 of the speaker diaphragm 10 is arranged to be pressed by the punch P of the mold 30. It is pressed by closing the movable molds 301 and 302 (step ST5). The shaped laminate M2 is taken out (step ST6), a silk thread hole 11 is formed inside the through hole 31 in the laminate M2, and further a hole 13 is formed in the laminate M2. Then, the laminate M2 is cut into a circular shape according to the outer shape of the speaker diaphragm to obtain the speaker diaphragm 10 (step ST7). At this time, of course, the diameter of the silk thread hole 11 is smaller than the diameter of the through hole 31.

[0022] FIG. 7 is an enlarged view of the mold 30 in the method for manufacturing the speaker diaphragm according to the first embodiment. Further, FIG. 7 is an enlarged view corresponding to the 110 portion of the mold 30 shown in FIG. 6. Hereinafter, steps ST4 and ST5 will be described in detail. A laminate M1 composed of a conductive layer 21 and a resin layer 22 is placed on the mold 30. The laminate M1 and the mold 30 are arranged so that the center of the through hole 31 provided in the conductive layer 21 and the center of the punch P provided in the mold 30 are aligned (step ST4). When the pair of movable molds 301 and 302 in the mold 30 are moved in a direction approaching each other and closed, the laminate M1 is sandwiched between the movable molds 301 and 302 and pressed (step ST5). The movable mold 301 is provided with a convex punch P. Therefore, the punch P presses the resin layer 22 inside the through hole 31. The vertical (Z-axis direction) distance between the punch P of the movable mold 301 and the punch P of the movable mold 302 at the completion of pressing is set to be smaller than the plate thickness (thickness in the Z-axis direction) of the two resin layers 22. In this way, the punch P firmly fuses the upper and lower resin layers 22. On the other hand, the resin layer 22 outside the through hole 31, that is, the resin layer 22 sandwiching the conductive layer 21, is pressed by the mold 30 and its thickness becomes thinner. At this time, the resin layer 22 protrudes from the conductive layer 21 and the thickness of the resin layer 22 becomes slightly thinner.

[0023] FIG. 8 is an enlarged view when the punch P presses the resin layer 22 inside the through hole 31 by the method for manufacturing the speaker diaphragm according to the first embodiment. The through hole 31 in FIG. 8 is partially omitted for convenience of explanation. The resin layer 22 is pressed by the punch P. At this time, the diameter of the punch P is smaller than the diameter 31L of the through hole 31. That is, as shown in FIG. 8, the punch P and the conductive layer 21 are separated by a distance L1 in the horizontal direction (x direction). During pressing, since the laminate M1 existing near the punch P has two layers, a step is formed with respect to the three-layer portion, and a gap portion is formed near the outer surface of the punch P with a difference in thickness only near the root of the punch P. Therefore, when the punch P presses the resin layer 22 inside the through hole 31, the resin layer 22 flows in the direction of the inner surface of the through hole 31 and flows into the gap portion near the outer surface of the punch P. The resin layer 22 that flows at this time is defined as the bleeding 40. Thus, due to the bleeding 40 occurring by the method for manufacturing a speaker diaphragm according to the first embodiment, the conductive layer 21 is wrapped by the resin layer 22. The larger the amount of the bleeding 40, the larger the area of the fusion surface 200, and it is easier to ensure insulation. Also, the two-layer portion without the conductive layer 21 near the through hole 31 can have the same thickness as the three-layer portion of the laminate M1, and the rigidity of the opening can be increased.

[0024] In the method for manufacturing a speaker diaphragm according to the first embodiment, the step of providing the through hole 31 for passing the brocade thread through the conductive layer 21 is referred to as the first step. By closing the mold 30 having the convex punch P having a diameter smaller than the diameter of the through hole 31, the step of pressing the resin layer 22 against the laminate M1 with the punch P inside the through hole 31 is referred to as the second step.

[0025] Thus, by using the method for manufacturing a speaker diaphragm according to the first embodiment, insulation can be ensured even when a brocade thread hole is formed in the conductive speaker diaphragm, and rigidity can also be ensured.

[0026] Here, with reference to FIG. 2, a speaker diaphragm manufactured by the method for manufacturing a speaker diaphragm according to Embodiment 1 will be described. The speaker diaphragm has a conductive layer 21 having a through-hole for inserting a brocade thread, and resin layers 22 that sandwich both surfaces of the conductive layer 21 and cover the inner surface of the through-hole. A part of the resin layer 22 covering the inner surface of the through-hole is formed by a part of the resin layer 22 that was located near the center of the through-hole before the pressing step of pressing the resin layer 22 from both surfaces of the conductive layer 21 toward the center of the through-hole flowing in the direction of the inner surface of the through-hole by the pressing step.

[0027] (Embodiment 2) A method for manufacturing a speaker diaphragm according to a second embodiment will be described. FIG. 9 is an enlarged view when the punch P presses the resin layer 22 inside the through-hole 31 by the method for manufacturing a speaker diaphragm according to the second embodiment. The through-hole 31 in FIG. 9 is partially omitted for convenience of explanation. Since the mold 30 according to the second embodiment is the same as the method for manufacturing a speaker diaphragm according to Embodiment 1, the description thereof will be omitted. Here, the decompression tube 60 will be described.

[0028] The decompression tube 60 is provided in a cavity where the flash 40 in the mold 30 flows, that is, in a cavity between the mold 30 and the laminate M1. Here, for example, a decompression pump (not shown) is connected to the decompression tube 60. The decompression tube 60 and the decompression pump together are referred to as a decompression device. The decompression device is not limited to a combination of a decompression tube and a decompression pump, and may be a pipe and a decompression pump or a pipe and a vacuum pump. When the punch P presses the resin layer 22 inside the through-hole 31, the flash 40 of the resin layer flows in the direction of the inner surface of the through-hole 31. At this time, simultaneous with the pressing by the punch P, decompression is performed by the decompression device. The resin layer 22 is drawn into the gap near the outer surface of the punch P. In this way, the decompression device induces the flash 40 to flow in the direction of the inner surface of the through-hole 31.

[0029] In the method for manufacturing a speaker diaphragm according to the second embodiment, the step of inducing the leakage flash 40 to flow in the direction of the inner surface of the through hole 31 is referred to as a pressure reduction step.

[0030] Thus, by using the method for manufacturing a speaker diaphragm according to the second embodiment, since the leakage flash generated by the punch is induced to flow, the degree of adhesion between the resin layer and the mold increases, and it becomes easier to ensure insulation and rigidity.

[0031] (Embodiment 3) A method for manufacturing a speaker diaphragm according to the third embodiment will be described. FIG. 10 is an enlarged view of the method for manufacturing a speaker diaphragm according to the third embodiment. The through hole 31 in FIG. 10 is partially omitted for convenience of explanation. Since the mold 30 according to the third embodiment is the same as the method for manufacturing a speaker diaphragm according to the first embodiment, the description thereof will be omitted. Here, the partition mold 70 will be described.

[0032] The partition mold 70 is provided on each of the first mold and the second mold in the vicinity of the inner surface of the through hole 31. The partition mold 70 stops the leakage flash 40 from moving in the direction of the inner surface of the through hole 31 in the gap near the outer surface of the punch P.

[0033] When the punch P presses the resin layer 22 inside the through hole 31, the leakage flash 40 flows in the direction of the inner surface of the through hole 31 and moves to the gap near the outer surface of the punch P. At this time, due to the presence of the partition mold 70, the leakage flash 40 is stopped from moving in the direction of the inner surface of the through hole 31 in the gap near the outer surface of the punch P.

[0034] FIG. 11 is a cross-sectional view passing through the brocade thread hole 11 on the curved surface 101 of the formed speaker diaphragm 10 using the method for manufacturing a speaker diaphragm according to the third embodiment. As shown in FIG. 11, the resin layer 22 is arranged so as to wrap the conductive layer 21, and the fusion surface 700 is fused. Concave grooves 701 are formed on the front and back surfaces of the curved surface 101 by the partition mold 70.

[0035] By using the method for manufacturing a speaker diaphragm according to Embodiment 3 in this way, flash caused by punching is surely induced to an assumed position, so that the area of the fusion surface becomes large and it becomes easy to ensure insulation and rigidity.

[0036] (Embodiment 4) A method for manufacturing a speaker diaphragm according to a fourth embodiment will be described. FIG. 12 is an enlarged view of the method for manufacturing a speaker diaphragm according to the fourth embodiment. The method for manufacturing a speaker diaphragm according to the fourth embodiment differs from steps ST4 and ST5 of the method for manufacturing a speaker diaphragm according to Embodiment 1. Steps ST04 and ST05 in FIG. 12 correspond to steps ST4 and ST5 in FIG. 5. Here, the mold 80 and steps ST04 and ST05 will be described.

[0037] As shown in FIG. 12, the mold 80 includes a pair of movable molds 801 and 802 that can be opened and closed. The movable mold 801 and the movable mold 802 partially have recesses provided with a predetermined length in the movable direction. In FIG. 12, the movable direction is the vertical direction (Z-axis direction). The diameters of the recesses in the movable mold 801 and the movable mold 802 are larger than the diameter of the through hole 31. Note that one of the movable molds 801 and 802 may be a fixed mold. Furthermore, the movable mold 801 is referred to as the first mold, and the movable mold 802 is referred to as the second mold. The movable mold 801 may be the second mold and the movable mold 802 may be the first mold.

[0038] As shown in FIG. 12, the laminate M1 is disposed on the movable mold 801 and the movable mold 802 (step ST04). By closing the pair of movable molds 801 and 802, the resin layer 22 is pressed outside the through hole 31. At this time, by closing the pair of movable molds 801 and 802, the recesses of the mold are combined to form a space S1. A pressure device 81 is inserted into the space S1 to press the resin layer 22 inside the through hole 31 (step ST05). As a result, the resin layer 22 inside the through hole 31 is compressed and fused in the direction of the through hole 31. Then, the pair of movable molds 801 and 802 are opened, and the shaped laminate M2 is taken out. The pressurizing device 81 is, for example, a pressurizing device combining an air gun, a pressurizing tube, and a pressurizing pump, or a pressurizing device combining an air gun and a compressor.

[0039] In the method for manufacturing a speaker diaphragm according to the fourth embodiment, the step of providing the through holes 31 for passing the brocade thread through the conductive layer 21 is referred to as the first step. Further, the step of pressing the resin layer 22 outside the through holes 31 against the laminate M1 by closing the mold 80 having a recess with a diameter larger than that of the through holes 31 is referred to as the second step. Furthermore, the step of pressurizing the space formed by the combination of the recesses of the mold 80 in the second step is referred to as the third step.

[0040] Thus, by using the method for manufacturing a speaker diaphragm according to the fourth embodiment, it is not necessary to align the positions of the through holes previously formed in the conductive material with the mold, so that it is easy to ensure insulation and rigidity.

[0041] (Embodiment 5) A method for manufacturing a speaker diaphragm according to the fifth embodiment will be described. FIG. 13 is an enlarged view of the method for manufacturing a speaker diaphragm according to the fifth embodiment. The method for manufacturing a speaker diaphragm according to the fifth embodiment is different from the method for manufacturing a speaker diaphragm according to the first embodiment in steps ST4 and ST5. Steps ST004 and ST005 in FIG. 13 correspond to steps ST4 and ST5 in FIG. 5. Here, the mold 91, the decompression tube 90, and steps ST004 and ST005 will be described.

[0042] The decompression tube 90 is inserted into the conductive layer 21. Here, the decompression tube 90 is connected to, for example, a decompression pump (not shown). The decompression tube 90 and the decompression pump together are referred to as a decompression device. The decompression device is not limited to the combination of the decompression tube and the decompression pump, and may be a combination of a pipe and a decompression pump or a pipe and a vacuum pump. Since the conductive layer 21 has air permeability ensured, it is depressurized by a decompression device. In conjunction with this, the resin layer 22 inside the through-hole 31 is compressed in the direction of the through-hole 31 and fused.

[0043] As shown in FIG. 13, the mold 91 includes a pair of movable molds 911 and 912 that can be opened and closed. The movable mold 911 and the movable mold 912 may have any shape as long as they are flat on the outside of the through-hole 31. Further, a partition mold 70 may be provided in the mold 91. Note that one of the movable molds 911 and 912 may be a fixed mold. At the same time as pressing the laminate M1 with the mold 91, the conductive layer 21 is depressurized by a decompression device. Further, the decompression of the conductive layer 21 may be performed simultaneously with the decompression of the cavity where the flash 40 occurs by another decompression device while pressing with another mold 30. Furthermore, the decompression of the conductive layer 21 may be performed simultaneously with pressurization by a pressurization device 81 while pressing with another mold 80.

[0044] As shown in FIG. 13, the laminate M1 is placed on the movable mold 911 and the movable mold 912 (step ST004). By closing the pair of movable molds 911 and 912, the laminate M1 is pressed. At the same time, the conductive layer 21 is depressurized by a decompression device (step ST005). As a result, the resin layer 22 inside the through-hole 31 is compressed in the direction of the through-hole 31 and fused. Then, the pair of movable molds 911 and 912 are opened, and the formed laminate M2 is taken out.

[0045] In the method for manufacturing a speaker diaphragm according to Embodiment 5, the step of depressurizing the conductive layer 21 to fuse the resin layer 22 inside the through-hole 31 is referred to as a depressurization step.

[0046] Thus, by using the method for manufacturing a speaker diaphragm according to Embodiment 5, it is not necessary to align the positions of the holes previously formed in the conductive material with the mold, so it becomes easy to ensure insulation and rigidity.

[0047] The speaker diaphragm manufactured by using the method for manufacturing a speaker diaphragm according to the foregoing Embodiments 1 to 5 and a speaker using the speaker diaphragm can ensure insulation and rigidity.

[0048] Note that the present invention is not limited to the above embodiments, and can be appropriately modified without departing from the gist thereof.

[0049] This application claims priority based on Japanese Patent Application No. 2022-032480 filed on March 3, 2022, and incorporates the entire disclosure thereof herein.

Industrial Applicability

[0050] The present invention can be used, for example, in a speaker device or the like.

Explanation of Signs

[0051] 10 Speaker diaphragm 11 Silk thread hole 12 Silk thread 13 Hole 21 Conductive layer 22 Resin layer 30, 80, 91 Mold 31 Through hole 31L Diameter 40 Flash 60, 90 Vacuum tube 70 Partition mold 81 Pressing device 101 Curved surface 102 Edge part 200, 700 Fused surface 701 Groove 301, 302, 801, 802, 911, 912 Movable mold M1, M2 Laminate P Punch

Claims

1. A conductive layer, A resin layer disposed so as to sandwich the conductive layer, and a method for manufacturing a speaker diaphragm having the same, A first step of providing a through-hole for passing a brocade thread through the conductive layer, By closing a mold provided with a convex punch having a diameter smaller than the diameter of the through-hole in each of a first mold and a second mold, the punch is disposed inside the through-hole with respect to a laminate in which the resin layer is disposed on both surfaces of the conductive layer. A second step of pressing the resin layer, In the second step, due to the pressing of the punch, the resin flash flows in the direction of the inner surface of the through-hole and flows into a void near the outer surface of the punch. A method for manufacturing a speaker diaphragm.

2. Further comprising a pressure-reducing step of inducing the resin flash to flow in the direction of the inner surface of the through-hole, The method for manufacturing a speaker diaphragm according to claim 1.

3. Each of the first mold and the second mold is provided with a partition mold that stops the resin flash from moving in the direction of the inner surface of the through-hole in a void near the outer surface of the punch. The method for manufacturing a speaker diaphragm according to claim 1.

4. A conductive layer, A resin layer disposed so as to sandwich the conductive layer, and a method for manufacturing a speaker diaphragm having the same, A first step of providing a through-hole for passing a brocade thread through the conductive layer, By closing a mold provided with a recess having a diameter larger than the diameter of the through-hole in each of a first mold and a second mold, the resin layer is pressed outside the through-hole with respect to a laminate in which the resin layer is disposed on both surfaces of the conductive layer. A second step, A third step of pressurizing a space formed by combining the recesses of the mold by the second step, In the third step, the resin layer is pressurized and fused inside the through-hole. A method for manufacturing a speaker diaphragm.

5. Further comprising a pressure-reducing step of reducing the pressure of the conductive layer and fusing the resin layer inside the through-hole, The method for manufacturing a speaker diaphragm according to any one of claims 1 to 4.

6. A speaker diaphragm having a through-hole for inserting a brocade thread, A conductive layer having the through-hole, It has a resin layer that sandwiches from both sides of the conductive layer and covers the inner surface of the through-hole. A part of the resin layer covering the inner surface of the through hole is formed by a part of the resin layer that was located near the center of the through hole before the pressing step of pressing the resin layer from both sides of the conductive layer toward the center of the through hole flowing in the direction of the inner surface of the through hole by the pressing step. Speaker diaphragm.

7. Having the speaker diaphragm according to claim 6, Speaker.

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