Diaphragm of sound production device and sound production device

Abstract

The present application belongs to the field of electroacoustic technology, and particularly relates to a diaphragm of a sound emitting device and the sound emitting device. The diaphragm of the sound emitting device comprises at least one phenyl silicone rubber layer, the phenyl silicone rubber layer contains a network polymer, the phenyl silicone rubber layer is formed by curing a liquid phenyl silicone rubber compound, and the liquid phenyl silicone rubber compound comprises methylphenylvinyl polysiloxane, methylphenylvinyl silicone resin and phenyl hydrogen-containing silicone oil. The diaphragm with the phenyl silicone rubber layer can significantly improve the adhesion of the diaphragm, the shell and the voice coil. Meanwhile, the phenyl hydrogen-containing silicone oil and the methylphenylvinyl polysiloxane have good compatibility, so that the curing uniformity of the phenyl silicone rubber layer is better, the mechanical properties are more balanced and the failure is less likely to occur. In addition, the diaphragm has high damping performance, can significantly reduce the THD distortion of the diaphragm, and has better acoustic performance.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electroacoustic, and particularly relates to a vibrating diaphragm of a sound emitting device and the sound emitting device. BACKGROUND

[0002] It is known that silicone rubber is widely used in the production of vibrating diaphragms of sound emitting devices due to its high resilience, high temperature resistance and good waterproof performance. However, the adhesion of the vibrating diaphragm made of silicone rubber to the shell and voice coil of the sound emitting device is relatively low due to the low surface energy of the silicone rubber. In order to improve the adhesion of the silicone rubber to other materials, a primer treatment is usually performed on the other materials to improve the adhesion. However, this will complicate the process flow and increase the production cost of the product. Moreover, the primer treatment will cause problems such as solvent evaporation during the treatment process, which will affect the health of the operators.

[0003] Therefore, the vibrating diaphragm and the sound emitting device still need to be improved. SUMMARY

[0004] The main purpose of the present application is to provide a vibrating diaphragm of a sound emitting device and the sound emitting device. The vibrating diaphragm with a phenyl silicone rubber layer in the present application can significantly improve the adhesion of the vibrating diaphragm to the shell and the voice coil, has high damping performance, and can significantly reduce the THD distortion of the vibrating diaphragm, and has better acoustic performance.

[0005] In order to achieve the above purpose, the present application provides the following technical solutions.

[0006] In a first aspect, the present application provides a vibrating diaphragm of a sound emitting device, the vibrating diaphragm comprising at least one phenyl silicone rubber layer, the phenyl silicone rubber layer being formed by curing a liquid phenyl silicone rubber compound, the liquid phenyl silicone rubber compound comprising methylphenylvinyl polysiloxane, methylphenylvinyl silicone resin and phenyl hydrogen-containing silicone oil; the phenyl silicone rubber layer containing a network polymer, the network polymer comprising a chain segment: wherein the R group is at least one of a methyl group and a phenyl group, The mass percentage of the phenyl group in the chain segment in the entire phenyl silicone rubber layer is 3% to 30%.

[0007] In some embodiments of the present application, the hardness of the phenyl silicone rubber layer is 30A to 90A; and / or,

[0008] The tensile strength of the phenyl silicone rubber layer is 1MPa to 10MPa; and / or,

[0009] The loss factor of the phenyl silicone rubber layer is 0.15 to 0.4; and / or,

[0010] The light transmittance of the phenyl silicone rubber layer is 20% to 75%.

[0011] In some embodiments of the present application, the phenyl group in the segment accounts for 8% to 20% of the mass percentage of the entire phenyl silicone rubber layer. In some embodiments of the present application, the mass percentage of the methyl phenyl vinyl silicone resin in the liquid phenyl silicone rubber compound is 2wt% to 25wt%; and / or,

[0012] In some embodiments of the present application, the mass percentage of the methyl phenyl vinyl silicone resin in the liquid phenyl silicone rubber compound is 2wt% to 25wt%; and / or,

[0013] The mass percentage of the phenyl hydrogen-containing silicone oil is 0.1-5wt%; and / or,

[0014] The mass percentage of the methyl phenyl vinyl polysiloxane is 45wt% to 90wt%.

[0015] In some embodiments of the present application, the mass percentage of the phenyl group in the phenyl hydrogen-containing silicone oil is 2wt% to 50wt%, and the mass percentage of the hydrogen group in the phenyl hydrogen-containing silicone oil is 0.05wt% to 1.5wt%; and / or,

[0016] The mass percentage of the vinyl group in the methyl phenyl vinyl polysiloxane is 0.05wt% to 9wt%, and the mass percentage of the phenyl group in the methyl phenyl vinyl polysiloxane is 3wt% to 45wt%.

[0017] In some embodiments of the present application, the liquid phenyl silicone rubber compound further comprises a reinforcing agent.

[0018] In some embodiments of the present application, the reinforcing agent is selected from silica; and / or,

[0019] The mass percentage of the reinforcing agent is 5wt% to 45wt%.

[0020] In some embodiments of the present application, the liquid phenyl silicone rubber compound further comprises at least one of an inhibitor and a catalyst.

[0021] In some embodiments of the present application, the mass percentage of the inhibitor is 0.01wt% to 0.2wt%; and / or,

[0022] The mass percentage of the catalyst is 0.005wt% to 0.2wt%.

[0023] In some embodiments of the present application, the inhibitor comprises at least one of an alkyne alcohol inhibitor, a multi-vinyl polysiloxane inhibitor; and / or,

[0024] The catalyst is selected from a platinum gold catalyst.

[0025] In some embodiments of the present application, the liquid phenyl silicone rubber compound further comprises a methyl phenyl silicone resin, and the mass percentage of the methyl phenyl silicone resin in the liquid phenyl silicone rubber compound is 0-20wt% and not 0.

[0026] In some embodiments of the present application, the mass percentage of the phenyl group in the methyl phenyl silicone resin is 2wt%-50wt%.

[0027] In some embodiments of the present application, the diaphragm of the sound generating device comprises at least one phenyl silicone rubber layer, and the phenyl silicone rubber layer is formed by curing a liquid phenyl silicone rubber compound, wherein the liquid phenyl silicone rubber compound comprises a methyl phenyl vinyl polysiloxane, a methyl phenyl vinyl silicone resin, a phenyl hydrogen-containing silicone oil, a reinforcing agent, an inhibitor and a catalyst.

[0028] In some embodiments of the present application, the diaphragm of the sound generating device comprises at least one phenyl silicone rubber layer, and the phenyl silicone rubber layer is formed by curing a liquid phenyl silicone rubber compound, wherein the liquid phenyl silicone rubber compound comprises a methyl phenyl vinyl polysiloxane, a methyl phenyl vinyl silicone resin, a phenyl hydrogen-containing silicone oil, a methyl phenyl silicone resin, a reinforcing agent, an inhibitor and a catalyst.

[0029] In some embodiments of the present application, the diaphragm is a single-layer structure, and the diaphragm is composed of one phenyl silicone rubber layer; or,

[0030] The diaphragm is formed as a composite layer structure, and the composite layer structure comprises at least one phenyl silicone rubber layer and a composite layer, and the composite layer comprises at least one of a thermoplastic elastomer layer, an engineering plastic layer and a film layer.

[0031] In the second aspect of the present application, a sound generating device is provided, and the sound generating device comprises the diaphragm of the sound generating device of the first aspect.

[0032] In some embodiments of the present application, the sound generating device comprises a shell, and the diaphragm of the sound generating device is integrally heated, cured and formed with the shell; and / or,

[0033] The waterproof level of the sound generating device is at least 1 ATM.

[0034] Compared with the prior art, the present application achieves the following technical effects:

[0035] The diaphragm in the present application significantly improves the adhesion of the diaphragm to the shell and the voice coil through the design of the phenyl silicone rubber layer, and the mechanical properties of the diaphragm are more balanced, and the diaphragm has high damping performance, which can significantly reduce the THD distortion of the diaphragm, and has better acoustic performance.

[0036] The liquid phenyl silicone rubber mixing rubber forming the phenyl silicone rubber layer is designed in the application, the synergistic effect of methyl phenyl vinyl silicone resin, methyl phenyl vinyl polysiloxane and phenyl hydrogen-containing silicone oil can significantly improve the hardness and tensile strength of the diaphragm, the adhesion of the diaphragm to the shell and the voice coil, and the damping performance of the diaphragm is also higher. At the same time, the diaphragm has good light transmittance, when the diaphragm and the voice coil are bonded by UV glue, the UV glue can be quickly and comprehensively cured, thereby improving the adhesion between the diaphragm and the voice coil; in addition, the phenyl hydrogen-containing silicone oil and the methyl phenyl vinyl polysiloxane have good compatibility, so that the curing uniformity of the phenyl silicone rubber layer is better, thereby the mechanical properties of the diaphragm are more balanced and less likely to fail.

[0037] The above description is only a summary of the technical scheme of the application, in order to more clearly understand the technical means of the application, the content of the specification can be implemented, and in order to make the above and other purposes, characteristics and advantages of the application more obvious and easy to understand, the following specific embodiments of the application are described. BRIEF DESCRIPTION OF DRAWINGS

[0038] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not meant to limit the present application. Furthermore, the same reference numerals are intended to identify the same components throughout the various drawings. In the drawings:

[0039] Figure 1 A cross-sectional view of a sound production device according to some embodiments of the application;

[0040] Figure 2 A THD curve diagram of a diaphragm according to Comparative Example 1 and Example 2 of the application.

[0041] REFERENCE NUMERALS

[0042] 100, a sound production device;

[0043] 10, a shell; 20, a diaphragm; 30, a voice coil; 40, a magnetic circuit system. DETAILED DESCRIPTION

[0044] Exemplary embodiments of the present application will be described in greater detail below with reference to specific embodiments. It should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present application can be more thoroughly and completely understood, and so that the scope of the present application can be conveyed to those skilled in the art.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0046] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0047] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0048] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0049] Currently, phenyl silicone rubber is generally reinforced with methyl vinyl silicone resin. However, due to the poor compatibility between methyl vinyl silicone resin and methyl phenyl vinyl silicone oil, the light transmittance of phenyl silicone rubber deteriorates, affecting UV light transmittance. This leads to an increase in the UV adhesive curing time between the diaphragm and the voice coil, resulting in insufficient adhesion.

[0050] In addition, conventional hydrogen-containing silicone oil is often used as a crosslinking agent in general phenyl silicone rubber. However, conventional hydrogen-containing silicone oil has poor compatibility with methylphenyl vinyl silicone oil and poor dispersibility in phenyl liquid silicone rubber. This leads to poor local crosslinking uniformity and poor local mechanical properties of phenyl silicone rubber. As a result, local damage occurs during the reliability verification process of the speaker, leading to speaker failure.

[0051] Therefore, the present invention provides a diaphragm for a sound-generating device, the diaphragm comprising at least one phenyl silicone rubber layer, the phenyl silicone rubber layer being formed by curing a liquid phenyl silicone rubber compound, the liquid phenyl silicone rubber compound comprising methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, and phenyl hydrogen-containing silicone oil; the phenyl silicone rubber layer containing a network polymer, the network polymer comprising chain segments: wherein the R group is at least one of a methyl group, a phenyl group, The phenyl group in the chain segment accounts for 3% to 30% of the mass percentage of the entire phenyl silicone rubber layer.

[0052] The liquid phenyl silicone rubber compound used to form the phenyl silicone rubber layer in the present application uses methyl phenyl vinyl silicone resin as a reinforcing material. The methyl phenyl vinyl silicone resin contains a phenyl structure, and the polarity of the phenyl structure is relatively strong, so the methyl phenyl vinyl silicone resin has relatively high polarity, which can significantly improve the hardness and tensile strength of the phenyl silicone rubber layer, and more significantly, significantly improve the adhesion of the phenyl silicone rubber layer to the shell and the voice coil, and the damping performance of the phenyl silicone rubber layer is also higher. Moreover, the methyl phenyl vinyl silicone resin has good compatibility with methyl phenyl vinyl polysiloxane, and the diaphragm made therefrom has good light transmittance. When the diaphragm and the voice coil are bonded by UV glue, the UV glue can be quickly and comprehensively cured, improving the adhesion between the diaphragm and the voice coil; the phenyl hydrogen-containing silicone oil has good compatibility with the methyl phenyl vinyl polysiloxane, which can be better dispersed in the liquid phenyl silicone rubber compound, thereby making the curing uniformity of the phenyl silicone rubber layer better, and the mechanical properties are balanced. In the reliability verification process, it works normally and does not fail.

[0053] Methyl phenyl vinyl polysiloxane is a product obtained by introducing methyl phenyl siloxane units or diphenyl siloxane units into the molecular chain of methyl vinyl polysiloxane. The introduction of phenyl groups on the side groups of methyl vinyl polysiloxane greatly reduces the crystallization temperature of the polymer and expands the low-temperature application range of the polymer material due to the destruction of the regularity of the dimethyl siloxane structure.

[0054] According to the different phenyl content, it can be divided into low-phenyl polysiloxane, medium-phenyl polysiloxane and high-phenyl polysiloxane. In low-phenyl polysiloxane, the phenyl content is 5wt% to 10wt%; in medium-phenyl polysiloxane, the phenyl content is 10wt% to 30wt%; in high-phenyl polysiloxane, the phenyl content is higher than 30wt%.

[0055] In some embodiments of the present application, the mass percentage of the methyl phenyl vinyl polysiloxane in the liquid phenyl silicone rubber compound is 45wt% to 90wt%. Exemplarily, the mass percentage of the methyl phenyl vinyl polysiloxane can be one of 45wt%, 50wt%, 55wt%, 60wt%, 65wt%, 70wt%, 75wt%, 80wt%, 85wt%, 90wt% or any value meeting the above range. When the mass percentage of the methyl phenyl vinyl polysiloxane is < 45wt%, the viscosity of the liquid phenyl silicone rubber compound is too large, which causes the rubber to be unable to be injected in the production process, and also causes the rebound resilience of the phenyl silicone rubber layer to be poor, the elongation at break to be reduced, and the comprehensive performance to be poor; and if the mass percentage of the methyl phenyl vinyl polysiloxane is > 90wt%, the amount of the reinforcing component methyl vinyl phenyl silicone resin and the reinforcing agent is insufficient, which causes the hardness of the phenyl silicone rubber layer to be small, the modulus to be low, and the tensile strength to be small, and the diaphragm is prone to failure in the reliability verification process.

[0056] In some embodiments of the present application, the mass percentage of the vinyl group in the methyl phenyl vinyl polysiloxane is 0.05wt% to 9wt%. Exemplarily, the mass percentage of the vinyl group in the methyl phenyl vinyl polysiloxane can be one of 0.05wt%, 0.06wt%, 0.07wt%, 0.08wt%, 0.09wt%, 0.1wt%, 0.2wt%, 0.3wt%, 0.4wt%, 0.5wt%, 0.6wt%, 0.7wt%, 0.8wt%, 0.9wt%, 1wt%, 2wt%, 3wt%, 4wt%, 5wt%, 6wt%, 7wt%, 8wt%, 9wt% or any value meeting the above range. When the mass percentage of the vinyl group is < 0.05wt%, the crosslinking degree of the formed silicone rubber layer is too low, which causes the hardness to be too low, and thus the use requirement of the diaphragm cannot be met; and when the mass percentage of the vinyl group is > 9wt%, the crosslinking degree of the formed silicone rubber layer is too high, which causes the elongation at break of the silicone rubber layer to be significantly reduced, the tensile strength to be reduced, and the tearing performance to be reduced, the formed diaphragm is prone to failure in the reliability verification, and thus the use requirement cannot be met.

[0057] In some embodiments of the present application, the mass percentage of the phenyl group in the methyl phenyl vinyl polysiloxane is 3wt% to 45wt%. Illustratively, the mass percentage of the phenyl group in the methyl phenyl vinyl polysiloxane can be one of 3wt%, 5wt%, 8wt%, 10wt%, 15wt%, 20wt%, 25wt%, 30wt%, 35wt%, 40wt%, 45wt% or any value meeting the above range. When the mass percentage of the phenyl group is less than 3wt%, the damping of the silicone rubber layer formed by the methyl phenyl vinyl polysiloxane is small, which can increase the distortion of the diaphragm. When the mass percentage of the phenyl group is greater than 45wt%, the viscosity of the liquid phenyl silicone rubber compound formed is too large, which can not effectively produce the injection molding, and thus the injection molding of the diaphragm cannot be realized.

[0058] The methyl phenyl vinyl silicone resin is a synthetic resin formed by the condensation reaction of methyl phenyl vinyl monomers and siloxane monomers.

[0059] Compared with the traditional methyl vinyl silicone resin, the methyl phenyl vinyl silicone resin has good compatibility with the methyl phenyl vinyl polysiloxane, and thus the phenyl silicone rubber diaphragm has good light transmittance and high UV light transmittance. In the embodiments of the present application, the phenyl silicone rubber diaphragm is bonded with the voice coil by using UV glue, and the UV light can pass through the phenyl silicone rubber to make the UV glue quickly, efficiently and comprehensively cured. The UV glue has short curing time and strong bonding force, and thus the bonding strength between the diaphragm and the voice coil can be improved.

[0060] In some embodiments of the present application, the mass percentage of the methyl phenyl vinyl silicone resin in the liquid phenyl silicone rubber compound is 2wt% to 25wt%. Illustratively, the mass percentage of the methyl phenyl vinyl silicone resin can be one of 2wt%, 5wt%, 8wt%, 10wt%, 12wt%, 15wt%, 18wt%, 20wt%, 22wt%, 25wt% or any value meeting the above range. It is found in the verification that with the increase of the content of the methyl phenyl vinyl silicone resin, the hardness and tensile strength of the phenyl silicone rubber layer increase, which indicates that the methyl phenyl vinyl silicone resin has good reinforcing effect. When the mass percentage of the methyl phenyl vinyl silicone resin is less than 2wt%, the bonding force between the phenyl silicone rubber layer and the voice coil and the shell decreases obviously, and the diaphragm is easy to crack and fail during the vibration. When the mass percentage of the methyl phenyl vinyl silicone resin is greater than 25wt%, the tensile strength of the phenyl silicone rubber layer decreases, and the elongation at break sharply decreases, which can cause the diaphragm to be easy to break and fail in the high-power reliability verification.

[0061] In some embodiments of the present application, the mass percentage of the phenyl hydrogen-containing silicone oil in the liquid phenyl silicone rubber compound is 0.1wt% to 5wt%. Illustratively, the mass percentage of the phenyl hydrogen-containing silicone oil can be one of 0.1wt%, 0.2wt%, 0.5wt%, 0.8wt%, 1.0wt%, 1.2wt%, 1.5wt%, 1.8wt%, 2.0wt%, 2.2wt%, 2.5wt%, 2.8wt%, 3.0wt%, 3.2wt%, 3.5wt%, 3.8wt%, 4.0wt%, 4.2wt%, 4.5wt%, 4.8wt%, 5wt% or any value within the above range. When the mass percentage of the phenyl hydrogen-containing silicone oil is <0.1%, the cross-linking degree of the phenyl silicone rubber layer is insufficient, resulting in surface tackiness of the phenyl silicone rubber layer, easy adhesion of impurities, poor elasticity, reduced tensile strength, and poor comprehensive performance of the phenyl silicone rubber layer, which leads to easy membrane failure of the diaphragm in long-term high-power reliability verification. When the mass percentage of the phenyl hydrogen-containing silicone oil is >5wt%, the cross-linking degree of the phenyl silicone rubber layer is too high, resulting in small molecular weight between cross-linking points of the phenyl silicone rubber layer, small elongation at break of the phenyl silicone rubber layer, poor tear resistance, and easy membrane failure of the diaphragm in long-term vibration.

[0062] In some embodiments of the present application, the mass percentage of the phenyl group in the phenyl hydrogen-containing silicone oil is 2wt% to 50wt%. It needs to be noted that if the mass percentage of the phenyl group in the phenyl hydrogen-containing silicone oil is <2wt%, the compatibility of the phenyl hydrogen-containing silicone oil with the methyl phenyl vinyl polysiloxane is poor, resulting in poor compatibility of the phenyl hydrogen-containing silicone oil in the liquid phenyl silicone rubber compound, difficult dispersion, and finally uneven local cross-linking of the silicone rubber film layer and poor mechanical properties. If the mass percentage of the phenyl group in the phenyl hydrogen-containing silicone oil is >50wt%, the synthesis of the phenyl hydrogen-containing silicone oil is difficult. When the mass percentage of the phenyl group in the phenyl hydrogen-containing silicone oil is 2wt% to 50wt%, the cross-linking uniformity of the phenyl silicone rubber layer can be improved, and the mechanical properties of the diaphragm can be improved. Illustratively, the mass percentage of the phenyl group in the phenyl hydrogen-containing silicone oil can be one of 2wt%, 5wt%, 10wt%, 15wt%, 20wt%, 25wt%, 30wt%, 35wt%, 40wt%, 45wt%, 50wt% or any value within the above range.

[0063] In some embodiments of the present application, the mass percentage of hydrogen groups in the phenyl hydrogen-containing silicone oil is 0.05wt% to 1.5wt%. It needs to be pointed out that if the hydrogen content in the phenyl hydrogen-containing silicone oil is less than 0.05wt%, the phenyl hydrogen-containing silicone oil can only play a role in chain extension, resulting in too low crosslinking degree of the phenyl silicone rubber film layer and poor mechanical properties; and if the hydrogen content in the phenyl hydrogen-containing silicone oil is higher than 1.5wt%, it will cause too high crosslinking degree of the phenyl silicone rubber film layer, resulting in insufficient elasticity of the silicone rubber layer, increased brittleness, and unable to meet the actual use requirements of the diaphragm. When the mass percentage of hydrogen groups in the phenyl hydrogen-containing silicone oil is 0.05wt% to 1.5wt%, the phenyl silicone rubber film layer can maintain a suitable crosslinking degree, thereby improving the mechanical properties and rebound performance of the diaphragm. Exemplarily, the mass percentage of hydrogen groups in the phenyl hydrogen-containing silicone oil can be one of 0.05wt%, 0.08wt%, 0.1wt%, 0.2wt%, 0.3wt%, 0.4wt%, 0.5wt%, 0.6wt%, 0.7wt%, 0.8wt%, 0.9wt%, 1.0wt%, 1.2wt%, 1.5wt% or any value meeting the above range.

[0064] In some embodiments of the present application, in the liquid phenyl silicone rubber compound, the mass percentage of methyl phenyl vinyl silicone resin is 2wt% to 25wt%, the mass percentage of phenyl hydrogen-containing silicone oil is 0.1-5wt%, and the mass percentage of methyl phenyl vinyl polysiloxane is 45wt% to 90wt%.

[0065] In the present application, the phenyl silicone rubber layer has a network polymer, and the core segment of the network polymer is: In the present application, the phenyl silicone rubber layer has a network polymer, and the core segment of the network polymer is: The mass percentage of phenyl groups in the segment in the entire phenyl silicone rubber layer is 3% to 30%. If the mass percentage of phenyl groups in the segment is less than 3%, the damping performance of the phenyl silicone rubber layer is generally poor, the THD distortion of the formed diaphragm is too high, and the listening performance of the loudspeaker is affected; and if the mass percentage of phenyl groups is higher than 30%, the viscosity of the formed liquid phenyl silicone rubber compound is too large, so that the compound cannot be effectively injected into the mold, and production cannot be carried out. In some embodiments of the present application, The mass percentage of phenyl groups in the segment in the entire phenyl silicone rubber layer is 8% to 20%. Exemplarily, the mass percentage of phenyl groups in the entire phenyl silicone rubber layer can be one of 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30% or any value meeting the above range.

[0066] In the present application, the phenyl silicone rubber layer has a network polymer, which further comprises a chain segment

[0067] The phenyl structure contained in the methyl phenyl vinyl silicone resin increases the friction between the molecular chains due to the high steric hindrance effect of the phenyl structure during the movement of the molecular chain, thereby improving the damping of the silicone rubber layer; and the phenyl structure has high polarity, which can improve the induction force and orientation force between the bonding interfaces of the diaphragm, the shell and the voice coil, thereby significantly increasing the intermolecular force between the bonding interfaces, and thus improving the interface bonding force.

[0068] In the present application, the hardness of the phenyl silicone rubber layer is 30A-90A. The hardness of the phenyl silicone rubber layer can be changed by adjusting the content of the methyl phenyl vinyl silicone resin and the content ratio of other components in the liquid phenyl silicone rubber compound, so that the hardness of the phenyl silicone rubber layer is between 30A and 90A. Exemplarily, the hardness of the phenyl silicone rubber layer can be one of 30A, 35A, 40A, 45A, 50A, 55A, 60A, 65A, 70A, 75A, 80A, 85A, 90A or any value meeting the above range. By using the hardness in the range of 30A-90A, the required stiffness and elasticity of the diaphragm can be better met, and the use effect of the loudspeaker is ensured.

[0069] In the embodiment of the present application, the tensile strength of the phenyl silicone rubber layer is 1MPa-10MPa. The tensile strength of the phenyl silicone rubber layer can be adjusted according to the requirements of the diaphragm, for example, it can be one of 1MPa, 2MPa, 3MPa, 4MPa, 5MPa, 6MPa, 7MPa, 8MPa, 9MPa, 10MPa or any value meeting the above range. By making the tensile strength of the phenyl silicone rubber layer between 1MPa and 10MPa, the diaphragm can have certain elasticity while ensuring certain stiffness, and is not prone to problems such as film breaking and film folding, thereby improving the service life of the loudspeaker.

[0070] In the embodiments of the present application, the conventional loss factor of the phenyl silicone rubber layer is 0.15-0.4. Exemplarily, the loss factor of the phenyl silicone rubber layer can be one of 0.15, 0.16, 0.17, 0.18, 0.19, 0.2, 0.22, 0.24, 0.26, 0.28, 0.3, 0.32, 0.34, 0.36, 0.38, 0.4 or any value meeting the above range. The phenyl silicone rubber layer with the loss factor in the range can optimize the performance of the diaphragm, and significantly reduce the vibration THD of the phenyl silicone rubber layer. Generally, the higher the loss factor, the better the damping property of the material, and the improvement of the damping property of the diaphragm material is conducive to reducing the vibration during the vibration, reducing the product distortion, and improving the sound quality.

[0071] In the embodiments of the present application, the light transmittance of the phenyl silicone rubber layer is 20%-75%. Exemplarily, the light transmittance of the phenyl silicone rubber layer can be one of 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75% or any value meeting the above range. The phenyl silicone rubber layer has good light transmittance, high UV light transmittance, and the UV glue is used for bonding the diaphragm and the voice coil. The UV light can penetrate the phenyl silicone rubber layer to make the UV glue quickly, efficiently and comprehensively cured, and the UV glue has short curing time and firm bonding force.

[0072] The diaphragm of the sound generating device in the embodiments of the present application comprises at least one phenyl silicone rubber layer, that is, the diaphragm in the present application can be formed as a single-layer structure or a multi-layer composite structure. When the diaphragm is a single-layer structure, the diaphragm is made of one phenyl silicone rubber layer in the present application. When the diaphragm is a multi-layer composite structure, the diaphragm comprises at least one phenyl silicone rubber layer, and the diaphragm can be composed of the phenyl silicone rubber layer in the present application and a film layer of other materials.

[0073] In some embodiments of the present application, when the diaphragm comprises multiple phenyl silicone rubber layers, the two adjacent phenyl silicone rubber layers can be spaced apart, that is, a film layer of other materials can be arranged between the two adjacent phenyl silicone rubber layers, or the two adjacent phenyl silicone rubber layers can be arranged in abutment, which can be selected according to actual use requirements, and the present application does not make specific limitation thereon.

[0074] In some embodiments of the present application, the diaphragm comprises a phenyl silicone rubber layer and other composite layers, which are one or more of a thermoplastic elastomer layer or an engineering plastic layer or a film layer. The thermoplastic elastomer layer comprises at least one of a polyester thermoplastic elastomer, a polyurethane thermoplastic elastomer, a polystyrene thermoplastic elastomer, and a polyamide thermoplastic elastomer. The material of the engineering plastic layer comprises at least one of polyether ether ketone (PEEK), polyarylate (PAR), polymethylacrylimide (PMI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), nylon (PA), polyetherimide (PEI), and liquid crystal polymer (LCP). The film layer comprises at least one of an acrylic film and a silicone film.

[0075] In the present application, the liquid phenyl silicone rubber compound further comprises a reinforcing agent, which mainly serves to improve the tensile and tear properties of the silicone film. Optionally, the reinforcing agent is selected from silica.

[0076] In some embodiments of the present application, the mass percentage of the reinforcing agent is 5wt% to 45wt%. Exemplarily, the mass percentage of the reinforcing agent can be one of 5wt%, 6wt%, 7wt%, 8wt%, 9wt%, 10wt%, 15wt%, 20wt%, 25wt%, 30wt%, 35wt%, 40wt%, 45wt% or any value within the above range. If the mass percentage of the reinforcing agent is less than 5wt%, the reinforcing effect on the silicone rubber layer is insufficient, and the tensile and tear properties of the silicone rubber layer are poor. If the mass percentage of the reinforcing agent is higher than 45wt%, the viscosity of the liquid phenyl silicone rubber compound is too large, the injection of the compound is difficult during production, and the elongation at break of the silicone film is too low, which is prone to rupture and failure during large-amplitude vibration.

[0077] In the present application, the liquid phenyl silicone rubber compound further comprises at least one of an inhibitor and a catalyst.

[0078] In some embodiments of the present application, the mass percentage of the inhibitor is 0.01wt% to 0.2wt%. Exemplarily, the mass percentage of the inhibitor can be one of 0.01wt%, 0.02wt%, 0.03wt%, 0.04wt%, 0.05wt%, 0.06wt%, 0.07wt%, 0.08wt%, 0.09wt%, 0.10wt%, 0.12wt%, 0.14wt%, 0.16wt%, 0.18wt%, 0.2wt% or any value within the above range. When the mass percentage of the inhibitor is less than 0.01wt%, the inhibition effect is generally poor, resulting in rapid increase of the viscosity of the liquid phenyl silicone rubber compound during storage at room temperature, which leads to failure of injection. When the mass percentage of the inhibitor is greater than 0.2wt%, the inhibitor is excessive, which leads to slow vulcanization rate of the liquid phenyl silicone rubber compound, thereby resulting in long molding cycle and affecting the molding efficiency of the product.

[0079] In some embodiments of the present application, the inhibitor includes at least one of acetylenic alcohol inhibitor and polyvinyl polysiloxane inhibitor. For example, the inhibitor can be specifically 3-methyl-1-butyne-3-ol, 3-methyl-1-pentyne-3-ol, 3,5-dimethyl-1-hexyne-3-ol, 1-ethynyl-1-cyclohexanol, 3-phenyl-1-butyne-3-ol; the polyvinyl inhibitor includes 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane.

[0080] In some embodiments of the present application, the catalyst is selected from platinum catalysts. It is worth mentioning that the platinum catalysts mainly include three types: the first type: chloroplatinic acid (H2PtCl6·6H2O) is dissolved in organic solvents such as ethanol, isopropanol and tetrahydrofuran to form a complex, which is called “Speier catalyst”. This catalyst is simple and fast to make and easy to use; the second type: platinum catalyst is a complex of platinum and vinyl double caps, which is called Karstedt’s catalyst. It has high reactivity, can be stably stored, and has good compatibility with various types of polysiloxanes. It is the most widely used catalyst for addition type silicone release agents; which includes: platinum-1,3-divinyltetramethyldisiloxane complex, platinum-1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane complex; the third type: platinum catalyst is a complex of chloroplatinic acid with other unsaturated compounds, ketones, cyclopentadiene, esters, alcohols, crown ethers, heteroatom-containing crown ethers and polysiloxanes, etc. which is used as a catalyst. Which includes: platinum-bis(acetylenic)(cycloalkadienyl) complex.

[0081] In some embodiments of the present application, the mass percentage of the platinum catalyst in the liquid phenyl silicone rubber compound is 0.005wt% to 0.2wt%. Exemplarily, the mass percentage of the platinum catalyst can be one of 0.005wt%, 0.006wt%, 0.007wt%, 0.008wt%, 0.009wt%, 0.01wt%, 0.02wt%, 0.03wt%, 0.04wt%, 0.05wt%, 0.06wt%, 0.07wt%, 0.08wt%, 0.09wt%, 0.1wt%, 0.12wt%, 0.14wt%, 0.16wt%, 0.18wt%, 0.2wt% or any value within the above range. It should be noted that when the mass percentage of the platinum catalyst is <0.0001%, the curing rate of the liquid phenyl silicone rubber compound is too slow, resulting in long curing time of the product and affecting the production efficiency of the product; and when the mass percentage of the platinum catalyst is >0.005%, the curing rate of the liquid phenyl silicone rubber compound is too fast, and its viscosity will increase rapidly during storage at room temperature, causing unstable process; and during the curing process, the phenyl silicone rubber layer is prone to deformation due to insufficient release of internal stress caused by too fast curing.

[0082] In the present application, the liquid phenyl silicone rubber compound also comprises a methyl phenyl silicone resin, and the mass percentage of the methyl phenyl silicone resin in the liquid phenyl silicone rubber compound is 0 to 20wt% and not 0. It should be noted that if the mass percentage of the methyl phenyl silicone resin is greater than 20wt%, the elongation at break of the molded silicone rubber layer will be significantly reduced, and the diaphragm is prone to rupture and failure during large-amplitude vibration. Exemplarily, the mass percentage of the methyl phenyl silicone resin in the liquid phenyl silicone rubber compound can be one of 0.1wt%, 0.3wt%, 0.5wt%, 0.8wt%, 1wt%, 3wt%, 5wt%, 8wt%, 10wt%, 12wt%, 15wt%, 18wt%, 20wt% or any value within the above range.

[0083] In some embodiments of the present application, the mass percentage of the phenyl group in the methylphenyl silicone resin is 2wt% to 50wt%. If the mass percentage of the phenyl group in the methylphenyl silicone resin is less than 2wt%, the damping performance of the formed silicone rubber layer is general, and the adhesion between the diaphragm and the shell is insufficient. If the mass percentage of the phenyl group is greater than 50wt%, the viscosity of the liquid phenyl silicone rubber compound is too large, and it is difficult to inject the glue during production. Exemplarily, the mass percentage of the phenyl group in the methylphenyl silicone resin can be one of 2wt%, 3wt%, 4wt%, 5wt%, 6wt%, 7wt%, 8wt%, 9wt%, 10wt%, 15wt%, 20wt%, 25wt%, 30wt%, 35wt%, 40wt%, 45wt%, 50wt% or any value within the above range.

[0084] In some embodiments of the present application, the liquid phenyl silicone rubber compound comprises methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, phenyl hydrogen-containing silicone oil, silica, inhibitor and catalyst.

[0085] In some embodiments of the present application, the liquid phenyl silicone rubber compound comprises methylphenyl vinyl polysiloxane, methylphenyl vinyl silicone resin, phenyl hydrogen-containing silicone oil, silica, inhibitor, catalyst and methylphenyl silicone resin.

[0086] The present application also provides a sound generating device, which comprises the diaphragm of any one of the above embodiments.

[0087] In the embodiments of the present application, the sound generating device comprises a shell, and the diaphragm of the sound generating device is integrally heat-cured and formed with the shell. The material of the shell can be, but is not limited to, fiber-reinforced polycarbonate material or fiber-reinforced polyamide material.

[0088] The diaphragm provided by the present application can be used to form a sound generating device of any structure, for example, the following typical sound generating devices. Figure 1 As shown in the figure, the sound generating device 100 can be a loudspeaker, which comprises a shell 10, a vibration system arranged in the shell 10 and a magnetic circuit system 40 cooperating with the vibration system, the vibration system comprising a diaphragm 20 and a voice coil 30 combined on one side of the diaphragm. When the sound generating device 100 works, the voice coil 30 is energized and vibrates up and down under the action of the magnetic field force of the magnetic circuit system 40, so as to drive the diaphragm 20 to vibrate, and the diaphragm 20 can generate sound when it vibrates.

[0089] In the embodiments of the present application, the waterproof level of the sound production device is at least 1 ATM, which meets the 10m waterproof reliability verification requirement. It can be understood that, due to the use of methyl phenyl vinyl silicone resin as a reinforcing material in the liquid phenyl silicone rubber compound, the adhesion between the diaphragm and the shell is greatly improved, thereby improving the waterproof performance of the sound production device, so that the waterproof level of the sound production device is at least 1 ATM.

[0090] The present application also provides a preparation method of the sound production device with the diaphragm of any of the above embodiments, which comprises the following steps:

[0091] placing the shell into a mold;

[0092] injecting the liquid phenyl silicone rubber compound into the mold and closing the mold;

[0093] heating the mold to a temperature of 100-200℃, and integrally curing the liquid phenyl silicone rubber compound in the mold with the shell to form a diaphragm with a phenyl silicone rubber layer integrally bonded with the shell.

[0094] Exemplarily, the heating temperature of the mold can be one of 100℃, 120℃, 140℃, 150℃, 180℃, 200℃, or any value meeting the above range.

[0095] In the embodiments of the present application, the voice coil can be bonded, the magnetic circuit system and the shell can be packaged to form a sound production device product according to actual use requirements.

[0096] The chemical reagents and the like used in the specification and examples of the present application include any model or type conventionally used in the art, and the present application does not have special limiting requirements.

[0097] The diaphragm of the sound production device and the sound production device according to the embodiments of the present application will be described in detail below in conjunction with specific examples and comparative examples, and it should be understood that the following description is only exemplary and is not a specific limitation of the present application.

[0098] Example 1

[0099] A diaphragm of a sound production device is disclosed, which comprises a layer of phenyl silicone rubber layer, and the phenyl silicone rubber layer is formed by curing a liquid phenyl silicone rubber compound; the composition of the liquid phenyl silicone rubber compound is as follows:

[0100] methyl phenyl vinyl polysiloxane: 100 parts;

[0101] silicon dioxide (reinforcing agent): 20 parts;

[0102] methyl phenyl vinyl silicone resin: 15 parts;

[0103] phenyl hydrogen-containing silicone oil: 3 parts;

[0104] Chloroplatinic acid (platinum catalyst): 0.2 parts;

[0105] 3-methyl-1-pentyn-3-ol (inhibitor): 0.15 parts.

[0106] The mass percentage of the phenyl group in the phenyl-containing silicone oil is 15 wt%, and the mass percentage of the hydrogen group in the phenyl-containing silicone oil is 1 wt%. The mass percentage of the vinyl group in the methylphenylvinyl polysiloxane is 0.12 wt%, and the mass percentage of the phenyl group in the methylphenylvinyl polysiloxane is 20 wt%. The mass percentage of the vinyl group in the methylphenylvinyl silicone resin is 0.4 wt%, and the mass percentage of the phenyl group in the methylphenylvinyl silicone resin is 30 wt%.

[0107] The phenyl silicone rubber layer contains a network polymer, and the network polymer includes a segment: The R group is a phenyl group, and the mass percentage of the phenyl group in the segment in the entire phenyl silicone rubber layer is 18%.

[0108] The diaphragm of the sound generating device is integrally heated and cured to form a shell, and the heating temperature is 150°C.

[0109] Example 2

[0110] The remaining operations are the same as in Example 1, and the only difference from Example 1 is that the composition of the liquid phenyl silicone rubber compound is as follows:

[0111] Methylphenylvinyl polysiloxane: 100 parts;

[0112] Silicon dioxide (reinforcing agent): 40 parts;

[0113] Methylphenylvinyl silicone resin: 30 parts;

[0114] Phenyl-containing silicone oil: 3.5 parts;

[0115] Platinum-1,3-divinyltetramethyldisiloxane complex (platinum catalyst): 0.2 parts;

[0116] 3-methyl-1-pentyn-3-ol (inhibitor): 0.15 parts.

[0117] The mass percentage of the phenyl group in the phenyl-containing silicone oil is 25 wt%, and the mass percentage of the hydrogen group in the phenyl-containing silicone oil is 0.8 wt%. The mass percentage of the vinyl group in the methylphenylvinyl polysiloxane is 0.10 wt%, and the mass percentage of the phenyl group in the methylphenylvinyl polysiloxane is 13 wt%. The mass percentage of the vinyl group in the methylphenylvinyl silicone resin is 0.45 wt%, and the mass percentage of the phenyl group in the methylphenylvinyl silicone resin is 40 wt%.

[0118] The phenyl silicone rubber layer contains a network polymer, the network polymer including a segment: wherein the R group is a phenyl group, the phenyl group in the segment accounting for 14.9% of the mass percentage of the entire phenyl silicone rubber layer.

[0119] The vibrating diaphragm of the sound production device is integrally heated and cured with the shell, and the heating temperature is 160°C.

[0120] Example 3

[0121] The remaining operations are the same as in Example 1, except that the composition of the liquid phenyl silicone rubber compound is as follows:

[0122] Methyl phenyl vinyl polysiloxane: 100 parts;

[0123] Silica (reinforcing agent): 60 parts;

[0124] Methyl phenyl vinyl silicone resin: 35 parts;

[0125] Phenyl hydrogen-containing silicone oil: 3.9 parts;

[0126] Platinum-1,3,5,7-tetraethenyl-1,3,5,7-tetramethylcyclotetrasiloxane complex (platinum-gold catalyst): 0.2 parts;

[0127] 3,5-Dimethyl-1-hexyne-3-ol (inhibitor): 0.15 parts.

[0128] wherein the mass percentage of the phenyl group in the phenyl hydrogen-containing silicone oil is 30wt%, the mass percentage of the hydrogen group in the phenyl hydrogen-containing silicone oil is 0.6wt%; the mass percentage of the vinyl group in the methyl phenyl vinyl polysiloxane is 0.07wt%, the mass percentage of the phenyl group in the methyl phenyl vinyl polysiloxane is 10wt%. The mass percentage of the vinyl group in the methyl phenyl vinyl silicone resin is 0.3wt%, the mass percentage of the phenyl group in the methyl phenyl vinyl silicone resin is 45wt%.

[0129] The phenyl silicone rubber layer contains a network polymer, the network polymer including a segment: wherein the R group is a methyl group, the phenyl group in the segment accounting for 13.5% of the mass percentage of the entire phenyl silicone rubber layer.

[0130] The vibrating diaphragm of the sound production device is integrally heated and cured with the shell, and the heating temperature is 150°C.

[0131] Example 4

[0132] The remaining operations are the same as in Example 1, except that the composition of the liquid phenyl silicone rubber compound is as follows:

[0133] methylphenylvinyl polysiloxane: 100 parts;

[0134] silica (reinforcing agent): 50 parts;

[0135] methylphenylvinyl silicone resin: 15 parts;

[0136] phenyl hydrogen-containing silicone oil: 3.1 parts;

[0137] platinum-bis(acetylenic)(cycloalkadienyl) complex (platinum catalyst): 0.2 parts;

[0138] 1-ethynyl-1-cyclohexanol (inhibitor): 0.15 parts;

[0139] methylphenyl silicone resin: 10 parts.

[0140] The mass percentage of the phenyl group in the phenyl hydrogen-containing silicone oil is 13 wt%, the mass percentage of the hydrogen group in the phenyl hydrogen-containing silicone oil is 0.45 wt%, the mass percentage of the vinyl group in the methylphenylvinyl polysiloxane is 0.08 wt%, the mass percentage of the phenyl group in the methylphenylvinyl polysiloxane is 18 wt%, the mass percentage of the phenyl group in the methylphenyl silicone resin is 20 wt%, the mass percentage of the vinyl group in the methylphenylvinyl silicone resin is 0.35 wt%, and the mass percentage of the phenyl group in the methylphenylvinyl silicone resin is 20 wt%.

[0141] The phenyl silicone rubber layer contains a network polymer, and the network polymer includes a segment: The mass percentage of the phenyl group in the segment is 13.2% of the entire phenyl silicone rubber layer.

[0142] The vibrating diaphragm of the sound generating device is integrally heated and cured to form a shell, and the heating temperature is 145°C.

[0143] Comparative Example 1

[0144] The remaining operations are the same as in Example 1, except that the composition of the liquid phenyl silicone rubber compound is as follows:

[0145] methylvinyl silicone oil: 100 parts;

[0146] silica (reinforcing agent): 50 parts;

[0147] methylvinyl silicone resin: 15 parts;

[0148] hydrogen-containing silicone oil: 3 parts;

[0149] chloroplatinic acid (catalyst): 0.2 parts;

[0150] 3-methyl-1-butyne-3-ol (inhibitor): 0.15 parts.

[0151] Comparative Example 2

[0152] The remaining operations are the same as in Example 1, except that the composition of the liquid phenyl silicone rubber compound is as follows:

[0153] Methyl phenyl vinyl polysiloxane: 100 parts;

[0154] Silica (reinforcing agent): 50 parts;

[0155] Methyl vinyl silicone resin: 15 parts;

[0156] Hydrogen-containing silicone oil: 3 parts;

[0157] Chloroplatinic acid (catalyst): 0.2 parts;

[0158] 3-methyl-1-butyne-3-ol (inhibitor): 0.15 parts.

[0159] The diaphragms prepared in the examples and comparative examples of the present application have the same outer dimensions, and the components and proportions of the liquid phenyl silicone rubber compound used to prepare the diaphragms in the examples and comparative examples are shown in Table 1.

[0160] Table 1 Components of the liquid phenyl silicone rubber compound used in the examples and comparative examples

[0161]

[0162]

[0163] Performance testing

[0164] Hardness: tested according to GBT 531.1-2008.

[0165] Tensile strength: tested according to GBT 528-2009.

[0166] Tear strength: tested according to GBT 529-2008.

[0167] Loss factor: the loss factor of the silicone rubber film was tested using DMA, and the test conditions were a temperature range of -100°C to 100°C and a temperature rise rate of 3°C / min.

[0168] Transmittance: tested according to GBT 2410-2008.

[0169] Adhesion of the diaphragm to the shell: a self-made test device was used, and the device included a fixed tool. During testing, the shell was fixed on the tool, and a force gauge was placed on the middle of the diaphragm. The maximum ejection force at which the diaphragm and the shell were broken was recorded as the adhesion of the diaphragm to the shell.

[0170] The diaphragms prepared in Examples 1-4 of the present application and the diaphragm prepared in Comparative Example 1-2 were subjected to performance tests of hardness, tensile strength, tear strength, loss factor, light transmittance, and adhesion of the diaphragm to the shell, and the test results are shown in Table 2.

[0171] Table 2: Performance test results of the diaphragms prepared in the examples and comparative examples

[0172]

[0173] As can be seen from Table 2, the diaphragms of the present application have excellent comprehensive performance, and in particular, the loss factor, light transmittance, adhesion of the diaphragm to the shell, and tear strength and tensile strength of the diaphragm are all superior to the corresponding performance of the diaphragm in the comparative examples under the same conditions. In Comparative Example 1, the adhesion of the diaphragm to the shell is only 0.5 N without primer treatment, and the adhesion value is too low, so the diaphragm is prone to local cracking and failure during vibration. Moreover, the loss factor of the diaphragm in Comparative Example 1 is 0.078, which is very low, and the THD distortion is too high, resulting in poor acoustic performance.

[0174] In Comparative Example 2, the methyl vinyl silicone resin, hydrogen-containing silicone oil, and methylphenyl vinyl polysiloxane have poor compatibility, causing local aggregation. Light reflection, scattering, and diffuse reflection occur at the local aggregation sites, resulting in low light transmittance of the diaphragm. Moreover, the hydrogen-containing silicone oil has poor compatibility and poor uniformity in distribution and dispersion in the liquid phenyl silicone rubber compound, so the local differences will cause uneven mechanical properties of the diaphragm, resulting in insufficient tear and tensile properties. In addition, the diaphragm has poor light transmittance, and the UV light transmittance is low during UV glue curing, so the curing time is long, affecting production efficiency and causing product cost to rise.

[0175] Reliability verification

[0176] High temperature and high humidity reliability: operated for 120 h under the conditions of 85°C, 85% humidity, and rated voltage.

[0177] High power reliability: operated for 72 h under the condition of 1.2 times the rated voltage.

[0178] High and low temperature cycle reliability: operated for 20 min at rated voltage and -20°C, and operated for 20 min at 65°C as one cycle, and operated for 120 cycles.

[0179] Waterproof performance test: tested for 10 m deep water to test whether there is a diaphragm rupture phenomenon. It was found through the test that the diaphragms in the examples of the present application did not have a diaphragm rupture phenomenon, had good waterproof effect, and met the waterproof requirements of acoustic equipment.

[0180] Table 3: Comparison of reliability results of the diaphragms in the examples and comparative examples

[0181] Name High temperature high humidity reliability High power reliability High low temperature cycle reliability Water resistance Example 1 Pass Pass Pass 1 ATM Example 2 Pass Pass Pass 1 ATM Example 3 Pass Pass Pass 1 ATM Example 4 Pass Pass Pass 1 ATM Comparative Example 1 Fail Fail Fail 1 ATM Comparative Example 2 Pass Fail Fail 1 ATM

[0182] In combination with Table 3 and Figure 2 It can be seen that the diaphragm in the present application passes all tests such as high temperature and high humidity reliability, high power reliability, high and low temperature cycle reliability, 1 ATM waterproof performance, etc. In the comparative example 1, the diaphragm is prone to stress concentration and local cracking failure during the reliability verification process due to insufficient adhesion between the diaphragm and the shell. The loss factor of the diaphragm in the comparative example 1 is too small, the damping performance is poor, and the THD distortion is too high.

[0183] In the comparative example 2, the diaphragm amplitude is large, the diaphragm stretching is large, and the stress concentration in the local area causes the diaphragm to break down in the weak area during the high power reliability verification process.

[0184] The above description is only a preferred embodiment of the present application, but the protection scope of the present application is not limited thereto, any changes or replacements within the technical range disclosed by the present application can be easily thought by those skilled in the art, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A diaphragm of a sound generating device, characterized by, The phenyl silicone rubber layer has a light transmittance of 50% to 75%; The phenyl silicone rubber layer is cured from a liquid phenyl silicone rubber compound, the liquid phenyl silicone rubber compound comprising methyl phenyl vinyl polysiloxane, methyl phenyl vinyl silicone resin, phenyl hydrogen-containing silicone oil, reinforcing agent, inhibitor and catalyst, the mass percentage of the phenyl hydrogen-containing silicone oil being 0.1wt%-5wt%, the mass percentage of the methyl phenyl vinyl silicone resin being 2wt%-25wt%, the mass percentage of the methyl phenyl vinyl polysiloxane being 45wt%-90wt%; the phenyl silicone rubber layer contains a network polymer, the network polymer comprising segments: ; wherein the R group is at least one of methyl, phenyl, The phenyl in the segment accounts for 3%-30% of the mass percentage of the entire phenyl silicone rubber layer.

2. The diaphragm of a sound production device of claim 1, wherein The phenyl silicone rubber layer has a hardness of 30A to 90A; and / or, The phenyl silicone rubber layer has a tensile strength of 1 MPa to 10 MPa; and / or, The phenyl silicone rubber layer has a loss factor of 0.15 to 0.

4.

3. The diaphragm of a sound production device of claim 1, wherein The The phenyl group in the segment accounts for 8% to 20% of the mass percentage of the entire phenyl silicone rubber layer.

4. The diaphragm of a sound production device of claim 1, wherein The phenyl silicone rubber layer has a mass percentage of phenyl groups in the phenyl-containing hydrogen silicone oil of 2wt% to 50wt%, and a mass percentage of hydrogen groups in the phenyl-containing hydrogen silicone oil of 0.05wt% to 1.5wt%; and / or, The methyl phenyl vinyl polysiloxane has a mass percentage of vinyl groups of 0.05wt% to 9wt%, and a mass percentage of phenyl groups of 3wt% to 45wt%.

5. The diaphragm of a sound production device of claim 1, wherein The reinforcing agent is selected from silica; and / or, The reinforcing agent has a mass percentage of 5wt% to 45wt%.

6. The diaphragm of a sound production device of claim 1, wherein The inhibitor has a mass percentage of 0.01wt% to 0.2wt%; and / or, The catalyst has a mass percentage of 0.005wt% to 0.2wt%.

7. The diaphragm of a sound production device of claim 1, wherein The inhibitor includes at least one of acetylenic alcohol inhibitors and polyvinyl polysiloxane inhibitors; and / or, The catalyst is selected from platinum gold catalysts.

8. The diaphragm of a sound production device of claim 1, wherein, The liquid phenyl silicone rubber compound further includes a methyl phenyl silicone resin, and the mass percentage of the methyl phenyl silicone resin in the liquid phenyl silicone rubber compound is 0 to 20wt% and not 0.

9. The diaphragm of a sound producing device of claim 8, wherein, The mass percentage of phenyl groups in the methyl phenyl silicone resin is 2wt% to 50wt%.

10. The diaphragm of a sound producing device of claim 1, wherein, The diaphragm is a single-layer structure, and the diaphragm is composed of one layer of the phenyl silicone rubber layer; or The diaphragm is formed into a composite layer structure, and the composite layer structure includes at least one layer of the phenyl silicone rubber layer and a composite layer, and the composite layer includes at least one of a thermoplastic elastomer layer, an engineering plastic layer, and a film layer.

11. A sound producing device, characterized by The sound generating device includes the diaphragm of the sound generating device according to any one of claims 1 to 10.

12. The sound production device of claim 11, wherein, The sound generating device includes a shell, and the diaphragm of the sound generating device is integrally heat-cured and formed with the shell; And / or, the waterproof level of the sound generating device is at least 1ATM.

Images