electronic machines

Abstract

To provide an electronic apparatus that can improve the reliability at extension.SOLUTION: An electronic apparatus according to one embodiment includes: an insulating base material including a plurality of island-shaped parts and a plurality of band-shaped parts that connect the adjacent island-shaped parts among the plurality of island-shaped parts, and having an elastic property; an electric element existing in the plurality of island-shaped parts; and a plurality of wires existing in the plurality of band-shaped parts and connecting electrically the electric elements. Each of the band-shaped parts includes a curved part. A ratio R / W of a radius of curvature R of the curved part to a width W of the curved part satisfies 10≤R / W≤20.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] Embodiments of the present invention relate to electronic devices.

Background Art

[0002] In recent years, the use of flexible substrates having flexibility and stretchability has been studied in various fields. For example, a usage form in which a flexible substrate having electrical elements arranged in a matrix is attached to a curved surface such as a housing of an electronic device or a human body can be considered. As the electrical elements, for example, various sensors such as touch sensors and temperature sensors, and display elements can be applied.

[0003] In a flexible substrate, it is necessary to take measures so that the wiring is not broken by stress due to bending or stretching. As such measures, for example, providing a honeycomb-shaped opening in a base material that supports the wiring, or making the wiring into a meandering shape (a meander shape) has been proposed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0005] One object of the present embodiment is to provide an electronic device capable of improving reliability during elongation.

Means for Solving the Problems

[0006] An electronic device according to one embodiment includes a plurality of island-shaped portions and a plurality of strip-shaped portions connecting adjacent island-shaped portions among the plurality of island-shaped portions, and comprises an expandable insulating substrate and located on the plurality of island-shaped portions multiple An electrical element, and located in the plurality of strip-shaped portions, multiple Electrical elements each other It comprises a plurality of electrically connected wires. Each of the plurality of strip-shaped portions includes a curved portion, and the ratio R / W of the radius of curvature R in the curved portion to the width W in the curved portion is 10 ≤ R / W ≤ 20. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic plan view of an electronic device according to one embodiment. [Figure 2] Figure 2 is a magnified plan view of a portion of the flexible substrate shown in Figure 1. [Figure 3] Figure 3 is a schematic cross-sectional view of the hinge portion shown by line III-III in Figure 2. [Figure 4] Figure 4 shows the structure of the sample, including the hinge. [Figure 5] Figure 5 is a graph showing the simulation results of the dependence of the strain amount on the ratio R / W at an elongation rate of 30%. [Modes for carrying out the invention]

[0008] Hereinafter, this embodiment will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and any modifications that a person skilled in the art could easily conceive while maintaining the spirit of the invention are naturally included within the scope of the present invention. Furthermore, the drawings may schematically represent the width, thickness, shape, etc., of each part compared to the actual embodiment in order to clarify the explanation; however, these are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and in each drawing, components that perform the same or similar functions as those described above in previously shown drawings are denoted by the same reference numerals, and redundant detailed explanations may be omitted as appropriate.

[0009] Figure 1 is a schematic plan view of the electronic device 1 according to this embodiment. In this embodiment, the first direction D1, the second direction D2, and the third direction D3 are defined as shown in the figure. The first direction D1 and the second direction D2 are parallel to the main surface of the electronic device 1 and intersect each other. The third direction D3 is perpendicular to the first direction D1 and the second direction D2 and corresponds to the thickness direction of the electronic device 1. In this embodiment, the first direction D1 and the second direction D2 intersect perpendicularly, but they may intersect at angles other than perpendicular. In this specification, the direction toward the tip of the arrow indicating the third direction D3 is referred to as "up," and the direction opposite to the tip of the arrow is referred to as "down." Furthermore, it is assumed that there is an observation position for observing the electronic device 1 on the side of the tip of the arrow indicating the third direction D3, and viewing the D1-D2 plane defined by the first direction D1 and the second direction D2 from this observation position is called a plan view.

[0010] The electronic device 1 comprises a flexible substrate 2, a circuit board 3, and a controller 4. The flexible substrate 2 is flexible and stretchable. Specific examples of configurations for achieving the stretchability of the flexible substrate 2 will be described later.

[0011] The flexible substrate 2 comprises a plurality of first wirings 11, a plurality of second wirings 12, a plurality of electrical elements 13, a first driver DR1, and a second driver DR2. The plurality of first wirings 11 and the plurality of second wirings 12 are examples of a plurality of wirings.

[0012] The first wiring 11 is a general term for wiring that extends generally along the first direction D1. Multiple first wirings 11 are aligned in the second direction D2. At least some of the multiple first wirings 11 are electrically connected to the first driver DR1.

[0013] The second wiring 12 is a general term for wirings that generally extend along the second direction D2. A plurality of second wirings 12 are arranged side by side in the first direction D1. At least a part of the plurality of second wirings 12 is electrically connected to the second driver DR2. These plurality of first wirings 11 and plurality of second wirings 12 include a plurality of types of wirings such as scanning lines, signal lines, power supply lines, and various control lines.

[0014] A plurality of electrical elements 13 are arranged in a matrix in the first direction D1 and the second direction D2 on the flexible substrate 2. More specifically, the plurality of electrical elements 13 are respectively located at the intersections of the plurality of first wirings 11 and the plurality of second wirings 12, and are electrically connected to the plurality of first wirings 11 and the plurality of second wirings 12.

[0015] The electrical element 13 is, for example, a sensor, a semiconductor element, or an actuator. For example, as the sensor, an optical sensor that receives visible light or near-infrared light, a temperature sensor, a pressure sensor, or a touch sensor can be applied. For example, as the semiconductor element, a light-emitting element, a light-receiving element, a diode, or a transistor can be applied.

[0016] When the electrical element 13 is a light-emitting element, a flexible display having flexibility and stretchability can be realized. As the light-emitting element, for example, a light-emitting diode having a size of around 100 μm such as a mini LED or a micro LED or an organic electroluminescence element can be applied.

[0017] When the electrical element 13 is an actuator, for example, a piezoelectric element can be applied. Note that the electrical element 13 is not limited to those exemplified here, and other elements having various functions can be applied. The electrical element 13 may be a capacitor or a resistor.

[0018] The first driver DR1 and the second driver DR2 are, for example, arranged on the flexible substrate 2, but may be arranged on the circuit board 3, the controller 4, or other substrates.

[0019] The circuit board 3 is, for example, a flexible printed circuit board and is electrically connected to each terminal in the terminal region TA of the flexible board 2. The controller 4 is mounted on the circuit board 3, but may be mounted on the flexible board 2.

[0020] FIG. 2 is an enlarged plan view of a part of the flexible board 2 shown in FIG. 1. The flexible board 2 further includes an insulating base material 14 that supports a plurality of first wirings 11 and a plurality of second wirings 12. The insulating base material 14 has flexibility and stretchability and can be formed of, for example, polyimide, but is not limited to this example.

[0021] The insulating base material 14 includes a plurality of body portions 15 (island portions) and a plurality of hinge portions 16, 17 (band-shaped portions). The plurality of body portions 15 and the plurality of hinge portions 16, 17 are integrally formed, for example, by patterning a polyimide film.

[0022] The plurality of body portions 15 are arranged in a matrix in the first direction D1 and the second direction D2 at intervals from each other. Each of the body portions 15 has, for example, a quadrangular shape (rhombic shape) in plan view. Note that the body portion 15 may have other polygonal shapes, or may have a circular shape or an elliptical shape.

[0023] The body portion 15 corresponds to the intersection of the hinge portion 16 and the hinge portion 17. The hinge portion 16 and the hinge portion 17 are connected to the corner portions of the body portion 15 in the example shown in FIG. 2, but may be connected to the sides of the body portion 15.

[0024] The plurality of hinge portions 16 extend substantially in the first direction D1 and are arranged in the second direction D2. The plurality of hinge portions 16 connect the body portions 15 adjacent in the first direction D1. The plurality of hinge portions 17 extend substantially in the second direction D2 and are arranged in the first direction D1. The plurality of hinge portions 17 connect the body portions 15 adjacent in the second direction D2.

[0025] Each of the multiple hinge sections 16 and 17 is extendable and retractable. The multiple hinge sections 16 and 17 are each formed in a meandering shape (meander shape) in plan view. The multiple hinge sections 16 and 17 have one or more curved sections.

[0026] Each of the multiple hinge portions 16 and 17 is curved twice in the example shown in Figure 2. In other words, each of the multiple hinge portions 16 and 17 has an S-shape. Each of the multiple hinge portions 16 and 17 is formed into an S-shape by including multiple curved portions.

[0027] Multiple first wires 11 are located above the hinge portion 16. Multiple first wires 11 extend overlapping with the hinge portion 16. Multiple second wires 12 are located above the hinge portion 17. Multiple second wires 12 extend overlapping with the hinge portion 17. That is, multiple first wires 11 have a meandering shape similar to the hinge portion 16, and multiple second wires 12 have a meandering shape similar to the hinge portion 17.

[0028] Multiple first wires 11 and multiple second wires 12 are electrically connected to an electrical element 13 through contact holes (not shown) or the like. Multiple first wires 11 and multiple second wires 12 can be formed from, for example, a metallic material or a transparent conductive material. Multiple first wires 11 and multiple second wires 12 may have a single-layer structure or a laminated structure. As for the metallic material, for example, a titanium-based (Ti) and aluminum-based (Al) laminate can be used.

[0029] The electrical element 13 is located on the body portion 15. The electrical element 13 is, for example, smaller than the body portion 15. In the example shown in Figure 2, the body portion 15 extends beyond the edge of the electrical element 13. The placement position and shape of the electrical element 13 are not limited to the example shown in Figure 2.

[0030] The insulating substrate 14 further has a plurality of openings 18. The plurality of openings 18 penetrate the insulating substrate 14. The plurality of openings 18 are arranged in a matrix. In other words, the insulating substrate 14 is formed in a mesh shape.

[0031] One opening 18 is surrounded by two hinge portions 16 adjacent to the second direction D2 and two hinge portions 17 adjacent to the first direction D1. That is, the hinge portions 17 are located between the two openings 18 adjacent to the first direction D1, and the hinge portions 16 are located between the two openings 18 adjacent to the second direction D2. The shape of each of the openings 18 is substantially identical.

[0032] Thus, the insulating substrate 14 can be made expandable and contractible by being composed of multiple body parts 15 and multiple hinge parts 16, 17 connecting these body parts 15. When tensile or compressive stress is applied to the insulating substrate 14 in a specific direction, the hinge parts 16, 17 expand and contract in accordance with the tensile or compressive stress. As a result, the insulating substrate 14 deforms into a shape corresponding to the tensile or compressive stress.

[0033] Figure 3 is a schematic cross-sectional view of the hinge portion 16 shown by line III-III in Figure 2. While Figure 3 describes an example of the cross-sectional structure of the hinge portion 16, the cross-sectional structure shown in Figure 3 can also be applied to the cross-sectional structure of the hinge portion 17.

[0034] The flexible substrate 2 further comprises inorganic insulating layers 31-34, an organic insulating layer 35, and an expandable member 36. In the example shown in Figure 3, the first wiring 11 includes wiring 21 and wiring 22. The number of wirings included in the first wiring 11 is not limited to this example.

[0035] The insulating substrate 14, inorganic insulating layer 31, wiring 21, inorganic insulating layer 32, wiring 22, inorganic insulating layer 33, organic insulating layer 35, and inorganic insulating layer 34 are laminated in this order in the third direction D3 at the hinge portion 16. The thickness of the insulating substrate 14 is, in one example, 5 to 10 μm. The insulating substrate 14 may be thicker than, for example, the other layers.

[0036] An inorganic insulating layer 31 is placed on the insulating substrate 14. Wiring 21 is placed on the inorganic insulating layer 31. The width of the wiring 21 is, for example, smaller than the width of the inorganic insulating layer 31. The wiring 21 is covered by an inorganic insulating layer 32.

[0037] Wiring 22 is placed on top of the inorganic insulating layer 32. The width of wiring 22 is, for example, smaller than the width of the inorganic insulating layer 32. Wiring 22 is covered by the inorganic insulating layer 33. The inorganic insulating layer 32 is located between wiring 21 and wiring 22.

[0038] An organic insulating layer 35 is placed on top of the inorganic insulating layer 33. In other words, the organic insulating layer 35 overlaps the wiring 21 and 22. The organic insulating layer 35 is sometimes called a sealing layer.

[0039] An inorganic insulating layer 34 is placed on top of the organic insulating layer 35. In other words, the inorganic insulating layer 34 overlaps the organic insulating layer 35. One of the functions of the inorganic insulating layer 34 is to suppress the intrusion of moisture and other substances toward the organic insulating layer 35 and the first wiring 11. This improves the reliability of the flexible substrate 2.

[0040] The insulating substrate 14, the inorganic insulating layers 31-34, and the organic insulating layer 35 are surrounded by an expandable member 36. The expandable member 36 has a lower part 361 located below the insulating substrate 14, an upper part 362 located above the inorganic insulating layer 34, a first side part 363, and a second side part 364.

[0041] The lower surface 141 of the insulating substrate 14 is in contact with the lower part 361. The upper surface 341 of the inorganic insulating layer 34 is in contact with the upper part 362. The first side surface 161 of the hinge portion 16 is in contact with the first side portion 363, and the second side surface 162 of the hinge portion 16 is in contact with the second side portion 364. The first side surface 161 and the second side surface 162 are formed by the insulating substrate 14, the inorganic insulating layers 31-34, and the organic insulating layer 35.

[0042] The inorganic insulating layers 31-34 are formed from inorganic insulating materials such as silicon oxide (SiO), silicon nitride (SiN), and silicon oxynitride (SiON), but are not limited to these examples.

[0043] The organic insulating layer 35 is formed of an organic insulating material such as a photosensitive acrylic resin. The expandable member 36 is formed of, for example, a stretchable transparent resin material. The expandable member 36 is formed of, for example, a resin with a lower elastic modulus (Young's modulus) than the insulating substrate 14.

[0044] Figure 4 shows the structure of sample S including the hinge portion 16. Here, the hinge portion 16 will be explained using sample S, but a similar structure can be applied to the hinge portion 17.

[0045] Sample S has a body portion 15 and a hinge portion 16. In Figure 4, one side of the body portion 15 connected to the hinge portion 16 is shown as body portion 15A, and the other side is shown as body portion 15B.

[0046] The hinge portion 16 connecting body portion 15A and body portion 15B has an S-shape, as explained with reference to Figure 2. The first wiring 11, although not shown, is formed across body portion 15A, hinge portion 16, and body portion 15B. The hinge portion 16 has curved portions 52, 54, straight portions 62, 64, and connecting portions 72, 74.

[0047] The curved section 52 is connected to the curved section 54. The hinge section 16 is formed in an S-shape by the curved sections 52 and 54. The straight section 62 is connected to the body section 15A. The straight section 64 is connected to the body section 15B.

[0048] In the example shown in Figure 4, the straight section 62 is located on the same straight line as the straight section 64. The direction in which the straight section 62 extends is the same as the direction in which the straight section 64 extends. The connecting section 72 connects the straight section 62 and the curved section 52, and the connecting section 74 connects the straight section 64 and the curved section 54.

[0049] The curved section 54 is constructed in the same manner as the curved section 52. The curved section 54 has a shape that is point-symmetrical to the curved section 52 with respect to the center of the S-shaped meandering section. The curved section 54 is curved in a different direction than the curved section 52.

[0050] When the sample S is stretched in a direction that separates body section 15A and body section 15B, the greatest tensile stress is applied to regions 82 and 84 on the inner circumference of the curved sections 52 and 54, as shown in Figure 4. Hereafter, regions 82 and 84 may be referred to as stress concentration points.

[0051] In the example shown in Figure 4, region 82 is located on the side of body portion 15A rather than the center of the entire length along the centerline of the curved portion 52. In the example shown in Figure 4, region 84 is located on the side of body portion 15B rather than the center of the entire length along the centerline of the curved portion 54.

[0052] Regions 82 and 84 correspond to the areas where the maximum amount of strain occurs when the hinge portion 16 is extended. Cracks are likely to occur in the areas where the maximum amount of strain occurs when the hinge portion 16 is extended. An example of a crack 100 is shown in Figure 3.

[0053] The crack 100 originates, for example, from the inorganic insulating layer 34 through the organic insulating layer 35 toward the first wiring 11. The occurrence of such a crack 100 may cause the first wiring 11 to break. In other words, as the hinge portion 16 extends, the first wiring 11 is most likely to break near regions 82 and 84.

[0054] Here, the radius of curvature in the curved sections 52 and 54 is defined as the radius of curvature R, and the width of the curved sections 52 and 54 is defined as the width W. The radius of curvature R is the radius of curvature of the central part of the curved sections 52 and 54 (the center line of the curved sections 52 and 54). The radius of curvature R of the curved sections 52 and 54 is, for example, constant. In one example, the radius of curvature R is 15 μm or more.

[0055] The width W is constant in, for example, the curved sections 52, 54, the straight sections 62, 64, and the connecting sections 72, 74. In one example, the width W is 5 μm or more, preferably 10 μm or more. Furthermore, the ratio of the radius of curvature R to the width W is defined as the ratio R / W. As the ratio R / W increases, the pitch of the body sections 15A and 15B increases.

[0056] Figure 5 is a graph showing the simulation results of the dependence of the strain amount on the ratio R / W at an elongation rate of 30%. In this simulation, the amount of strain in the region 82 of the curved portion 52 was calculated when the hinge portion 16 was extended in the direction that the body portion 15A and body portion 15B shown in Figure 4 move away from each other.

[0057] First, let's explain the elongation rate. The straight-line distance from the center of body section 15A to the center of body section 15B (or the pitch between body section 15A and body section 15B) is defined as distance L0 (shown in Figure 4).

[0058] When the hinge portion 16 is extended in the direction that moves the body portion 15A and the body portion 15B apart (in the direction that increases the distance L0), the straight-line distance from the center of the body portion 15A to the center of the body portion 15B (or the pitch between the body portions 15A and 15B) is defined as distance L1. The extension rate is calculated by dividing the increase in distance (L1-L0) by distance L0 and multiplying the result by 100. An extension rate of 30% corresponds to the hinge portion 16 being extended to a distance L1, which is 1.3 times the distance L0, due to the application of tensile stress.

[0059] Next, the amount of strain will be explained. The amount of strain is defined as 0% when the elongation rate is 0% (no tensile stress is applied to the curved portion 52), and represents the degree of strain in region 82 when the elongation rate is 30% (tensile stress is applied to the curved portion 52). It is known that the larger this amount of strain, the higher the probability that the hinge portion 16, including the first wiring 11, will break.

[0060] Figure 5 shows the simulation results for the first to fourth samples, S1 to S4.

[0061] The radius of curvature R of the first sample S1 is 15 μm, the radius of curvature R of the second sample S2 is 30 μm, the radius of curvature R of the third sample S3 is 210 μm, and the radius of curvature R of the fourth sample S4 is 500 μm.

[0062] For the first sample S1, the width W was varied in two ways: 30 μm (R / W = 0.5) and 20 μm (R / W = 0.75).

[0063] For the second sample, S2, the width W was varied in three ways: 30 μm (R / W=1.0), 20 μm (R / W=1.5), and 10 μm (R / W=3.0).

[0064] For the third sample, S3, the width W was varied in three ways: 30 μm (R / W = 7.0), 20 μm (R / W = 10.5), and 10 μm (R / W = 21.0).

[0065] For the fourth sample, S4, the width W was varied in three ways: 30 μm (R / W ≈ 16.7), 20 μm (R / W = 25.0), and 10 μm (R / W = 50.0).

[0066] As shown in the graph in Figure 5, it was confirmed that in the range where the ratio R / W is less than 10, the amount of strain tends to decrease as the ratio R / W increases, and in the range where the ratio R / W is greater than 20, the amount of strain tends to increase as the ratio R / W increases. Furthermore, it was confirmed that the amount of strain is smallest when the ratio R / W is around 15.

[0067] Therefore, the ratio R / W is preferably 10 ≤ R / W ≤ 20, and more preferably 13 ≤ R / W ≤ 17. A ratio R / W of 15 is even more preferable.

[0068] The ratio R / W can be adjusted by making the width W smaller relative to the radius of curvature R, making the radius of curvature R larger relative to the width W, or making both the width W smaller and the radius of curvature R larger.

[0069] By adjusting the ratio R / W to the range or value described above, the amount of strain is suppressed, and the hinge portion 16 becomes less likely to break. In other words, by adjusting the ratio R / W to the range or value described above, it is possible to realize a hinge portion 16 that is less likely to break even if tensile stress is applied to a stress concentration point. By adjusting the ratio R / W to the range or value described above, the hinge portion 16 becomes more deformable (more mobile).

[0070] Figure 5 shows, as an example, the fracture strain of an inorganic insulating layer 34 made of silicon nitride (SiN) along line P3. Fracture strain corresponds to the amount of strain at which cracks may occur in the inorganic insulating layer when stretched. Line P3 represents a strain of 3%.

[0071] The amount of strain in the curved portion 52 is preferably smaller than the fracture strain of the inorganic insulating layer 34. When the ratio R / W is 10 ≤ R / W ≤ 20, the amount of strain can be made smaller than the fracture strain of the inorganic insulating layer 34, which is 3%. In other words, the amount of strain for a ratio R / W of 10 ≤ R / W ≤ 20 is below line P3.

[0072] In other words, by adjusting the ratio R / W to the range or value described above, the amount of strain in the curved portion 52 when the elongation rate is 30% is located below line P3, and thus an elongation rate of 30% for the hinge portion 16 can be achieved.

[0073] Although not shown in the figures, simulations have confirmed that other elongation rates (e.g., 10%, 20%) also exhibit similar profiles to the graph shown in Figure 5. In other words, the dependence of the strain ratio R / W at other elongation rates is the same as that at a 30% elongation rate.

[0074] In other words, in the range where the ratio R / W is less than 10, the amount of distortion tends to decrease as the ratio R / W increases, and in the range where the ratio R / W is greater than 20, the amount of distortion tends to increase as the ratio R / W increases, with the amount of distortion being smallest at around a ratio R / W of 15.

[0075] By adjusting the ratio R / W to the range or value described above, the amount of strain in the hinge portion 16 is suppressed, making it less likely for the hinge portion 16, including the first wiring 11, to break when the hinge portion 16 is extended.

[0076] From the above results, it was confirmed that the amount of strain in the hinge portion 16 can be controlled by the ratio R / W of the radius of curvature R to the width W. Here, we have described a method for controlling the amount of strain in the hinge portion 16, but the amount of strain in the hinge portion 17 can also be controlled by a similar method.

[0077] As described above, this embodiment provides an electronic device 1 that can improve reliability during extension. More specifically, by adjusting the ratio R / W in the hinge portions 16 and 17, the electronic device 1 becomes less prone to breakage of the hinge portions 16 and 17 during extension, as explained with reference to Figures 4 and 5. As a result, an electronic device 1 with improved reliability can be provided.

[0078] In this embodiment, the radius of curvature R and width W in the hinge portions 16 and 17 are adjusted so that the ratio R / W of the radius of curvature R to the width W is 10 ≤ R / W 20. More preferably, the radius of curvature R and width W in the hinge portions 16 and 17 are adjusted so that the ratio R / W is 13 ≤ R / W ≤ 17. This makes it possible to further reduce the amount of strain.

[0079] More preferably, the radius of curvature R and width W in the hinge portions 16 and 17 are adjusted so that the ratio R / W is 15. In the curved portions 52 and 54, by adjusting the ratio R / W to the range of 10 ≤ R / W ≤ 20, the hinge portions 16 and 17 are less likely to break even if the elongation rate is 30%, as explained with reference to Figure 5.

[0080] In this embodiment, the entire curved portion 52 and curved portion 54 are formed such that the ratio of the radius of curvature to the width satisfies the above range or value. However, the curved portion 52 and curved portion 54 may be formed such that the ratio of the width to the radius of curvature satisfies the above range or value in at least the area including regions 82 and 84 (stress concentration points).

[0081] In this embodiment, for example, one electrical element 13 is arranged in one body portion 15, but multiple electrical elements 13 may be arranged in one body portion 15.

[0082] In this embodiment, the hinge portions 16 and 17 are curved twice, but various shapes can be applied to the hinge portions 16 and 17, such as a shape that is curved once or a shape that is curved three or more times. The shape of the hinge portion 16 may be different from the shape of the hinge portion 17.

[0083] In this embodiment, the hinge portion 16 has straight sections 62 and 64, but the hinge portion 16 does not have to have straight sections 62 and 64, or it may have only one of the straight sections 62 or 64.

[0084] Although several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]

[0085] 1...Electronic device, 2...Flexible substrate, 3...Circuit board, 4...Controller, 11...First wiring, 12...Second wiring, 13...Electrical element, 14...Insulating substrate, 15...Body part (island-shaped part), 16,17...Hinge part (strip-shaped part), 18...Opening, 31~34...Inorganic insulating layer, 35...Organic insulating layer, 36...Expandable member, 52,54...Bent part, 62,64...Straight part, DR1...First driver, DR2...Second driver, R...Radius of curvature, W...Width.

Claims

1. An insulating substrate having elasticity, comprising a plurality of island-shaped portions and a plurality of strip-shaped portions connecting adjacent island-shaped portions among the plurality of island-shaped portions, Multiple electrical elements located in the aforementioned multiple island-shaped portions, The system comprises a plurality of wires located in the plurality of strip-shaped portions and electrically connecting the plurality of electrical elements to one another, Each of the aforementioned plurality of strip-shaped portions includes a curved portion, The ratio R / W of the radius of curvature R in the curved portion to the width W in the curved portion is 10 ≤ R / W ≤ 20. electronic equipment.

2. The ratio R / W is 13 ≤ R / W ≤ 17. The electronic device according to claim 1.

3. The ratio R / W is 15. The electronic device according to claim 1.

4. Each of the aforementioned plurality of strip-shaped portions has an S-shape including the curved portion. The electronic device according to claim 1.

5. The plurality of strip-shaped portions include an organic insulating layer overlapping the plurality of wirings and an inorganic insulating layer overlapping the organic insulating layer. The electronic device according to claim 1.

6. The aforementioned electrical element is a light-emitting element or a sensor. The electronic device according to claim 1.

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