Colloidal silica and its manufacturing method
Patent Information
- Application Number
- JP2025099186
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-22
- Estimated Expiration
- 2043-07-19
AI Technical Summary
Conventional methods for producing colloidal silica with reduced fine particles are insufficient to meet the requirements of advanced semiconductor manufacturing processes, leading to residue issues that affect yield and surface quality.
A method involving a specific heat treatment process for colloidal silica production, including controlled pH, stirring power, and alkoxysilane addition rates, followed by solvent replacement and heat treatment, to reduce fine particle content.
The method produces colloidal silica with a significantly lower fine particle content, reducing residual particles on polished surfaces and improving surface roughness during CMP processes.
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Abstract
Citation Information
Patent Citations
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