Package structure for a semiconductor device
NL2039111B1Active Publication Date: 2026-06-15NEXPERIA BV
Patent Information
- Application Number
- NL2039111
- Authority / Receiving Office
- NL · NL
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2026-06-15
- Estimated Expiration
- 2044-11-19
Abstract
What is disclosed is a package structure for a semiconductor device comprising: a substrate layer configured for thermal management and electrical insulation; one or more semiconductor dies on the substrate layer, each semiconductor die comprising: a first power contact configured to connect to a first terminal of the package, a second power contact configured to connect to a second terminal of the package, and a gate contact configured to connect to a gate terminal of the package; an integrated resistor structure disposed within the substrate layer. (Figure 1)
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Citation Information
Patent Citations
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