Encapsulated semiconductor package.

Abstract

A B S T R A C T An encapsulated semiconductor package is proposed, comprising a plurality of rivets, and a plurality of connection pins, each connection pin having a pin tip and a pin end, wherein the plurality of rivets are disposed in the encapsulant of the encapsulated semiconductor package, each rivet having a first rivet end and a second rivet end, each rivet being electrically mounted with a first rivet end on a corresponding bond pad of the semiconductor package; each rivet comprises a rivet cavity configured to receive the pin tip of the connection pin; the pin tip of the connection pin is configured as a press-fit pin tip having an outer diameter larger than an inner diameter of the rivet cavity and configured for friction-based engagement with the rivet cavity. [Fig. 2]