Al-based composite structure, method for forming the same and heat dissipation component including the same

Abstract

An Al-based composite structure including a first Al-Cu-X composite material plate, a second Al-Cu-X composite material plate and an interface bonding layer is provided. The second Al-Cu-X composite material plate is overlapped with the first Al-Cu-X composite material plate. The interface bonding layer is disposed between the first Al-Cu-X composite material plate and the second Al-Cu-X composite material plate, wherein X includes an ingredient with high thermal conductivity, the interface bonding layer includes 60.0 wt% to 90.0 wt% of Al, 7.1 wt% to 37.1 wt% of Zn, and 0.1 wt% to 2.9 wt% of Cu, based on a total weight of the interface bonding layer, and the interface bonding layer includes Al 60-70Cu 30-40particles. A method for forming the Al-based composite structure and a heat dissipation component including the Al-based composite structure are also provided.

Description

[Technical Field]

[0001] This disclosure relates to a composite structure, a method of forming the same, and a heat dissipation element comprising the same, and more particularly to an aluminum-based composite structure, a method of forming the same, and a heat dissipation element comprising the same. [Previous Technology]

[0002] With the advent of the era of green energy, electric vehicles, and AIoT, high-frequency, high-power, and wide-bandgap radio frequency and power components have become the mainstream of market demand. For example, for high-power density power modules with ultra-high operating temperature (~200℃) and high voltage and high current characteristics required for power conversion such as electric vehicles or wind power generation, a comprehensive solution of packaging materials with high heat resistance, high voltage resistance, and high thermal conductivity is needed to enable the module to have the best performance.

[0003] A liquid cold plate is a mainstream heat dissipation component for high-power electronics. Its working principle is to form a flow channel in a metal shell, and electronic components are mounted on the surface of the liquid cold plate. Coolant enters and exits from the inlet and outlet of the flow channel of the liquid cold plate to quickly conduct the heat generated by the electronic components or any other surface with high heat density to the environment.

[0004] However, if the bonding strength of the liquid cooling plate shell is insufficient, it will cause the coolant in the liquid cooling plate to leak, resulting in a decrease in the reliability of the liquid cooling plate. In addition, the current liquid cooling plate manufacturing mainly uses vacuum hard welding to join the upper and lower shells, but the cost of vacuum hard welding equipment is high, and vacuum hard welding has extremely high requirements for welding conditions, which has always resulted in low production efficiency. [Summary of the Invention]

[0005] An embodiment of the aluminum-based composite structure disclosed herein includes a first Al-Cu-X composite layer, a second Al-Cu-X composite layer, and an interface bonding layer. The second Al-Cu-X composite layer overlaps the first Al-Cu-X composite layer. The interface bonding layer is located between the first Al-Cu-X composite layer and the second Al-Cu-X composite layer, wherein X comprises a high thermal conductivity component, and based on the total weight of the interface bonding layer, the interface bonding layer comprises 60.0 to 90.0 wt% Al, 7.1 to 37.1 wt% Zn, and 0.1 to 2.9 wt% Cu, and the interface bonding layer comprises Al 60-70Cu 30-40 particles.

[0006] A method for forming an aluminum-based composite structure according to an embodiment of the present disclosure includes sandwiching a bonding material between a first Al-Cu-X composite layer and a second Al-Cu-X composite layer, and heating the bonding material to a bonding temperature, wherein the bonding temperature is higher than a first melting point of the bonding material and lower than a second melting point of the first Al-Cu-X composite layer or the second Al-Cu-X composite layer.

[0007] One embodiment of the heat dissipation element disclosed herein includes a housing, wherein the housing includes the above-described aluminum-based composite structure.

Implementation Method

[0008] This disclosure can be understood by referring to the following detailed description and accompanying drawings. It should be noted that, in order to facilitate the reader's understanding and for the sake of simplicity, many of the drawings in this disclosure only depict a portion of the electronic device, and certain components in the drawings are not drawn to scale. Furthermore, the number and size of each component in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0009] Figures 1A to 1C are flowcharts of a method for forming an aluminum-based composite structure according to an embodiment of the present disclosure. Some embodiments of the present disclosure provide a method for forming an aluminum-based composite structure, and in some implementations, it is a method for tightly bonding two aluminum-copper-X (Al-Cu-X) composite laminates together.

[0010] First, referring to FIG. 1A, the bonding material 130 is sandwiched between the Al-Cu-X composite laminate 110 and the Al-Cu-X composite laminate 120. For example, the bonding material 130 may be placed on the Al-Cu-X composite laminate 110 first, and then the Al-Cu-X composite laminate 120 may be placed on the bonding material 130. In some embodiments, the Al-Cu-X composite laminate 120 may completely overlap the Al-Cu-X composite laminate 110. In some embodiments, the Al-Cu-X composite laminate 110 and the Al-Cu-X composite laminate 120 are the same size, but this disclosure is not limited thereto. In some embodiments, the Al-Cu-X composite laminate 110 and the Al-Cu-X composite laminate 120 are different sizes.

[0011] The Al-Cu-X composite laminate 110 and Al-Cu-X composite laminate 120 may include Al-Cu alloy grains and a high thermal conductivity component X. The Al-Cu alloy grains are formed by mechanical alloying of a solid solution formed by adding Cu to Al, which can have both solid solution strengthening and grain refinement strengthening effects. The high thermal conductivity component X may include, for example, BN (boron nitride), SiC (silicon carbide), C (carbon), or combinations thereof, and the high thermal conductivity component X may be located at the boundaries of the Al-Cu alloy grains, thereby enabling the Al-Cu-X composite laminates 110 and 120 to have relatively high thermal conductivity. In some embodiments, the Al-Cu-X composite laminate is an aluminum-copper-boron nitride (Al-Cu-BN), aluminum-copper-silicon carbide (Al-Cu-SiC), or aluminum-copper-carbon (Al-Cu-C) composite laminate. For example, the Al-Cu-X composite laminate is a 94Al-5Cu-1BN composite laminate, a 94Al-5Cu-1SiC composite laminate, or a 94Al-5Cu-1C composite laminate, but this disclosure is not limited to these.

[0012] The Al-Cu-X composite layer 110 and Al-Cu-X composite layer 120 can be formed by mechanical alloying and hot pressing. For example, Al powder, Cu powder and BN powder with a predetermined ratio are first subjected to mechanical alloying. Mechanical alloying is, for example, a process that gradually achieves alloying by causing atomic diffusion. In detail, Al powder, Cu powder and BN powder can be placed in a planetary ball mill for ball milling. During the ball milling process, the powders are subjected to collision and compression by the grinding balls, causing severe plasticity, deformation, fracture and / or cold welding. That is, the powders are continuously refined to allow atomic diffusion, thereby obtaining alloyed Al-Cu-BN powder.

[0013] Subsequently, the alloyed Al-Cu-BN powder can be subjected to a hot pressing forming method. In some embodiments, the hot pressing forming method includes vacuum hot pressing sintering. Vacuum hot pressing sintering is, for example, a process combining sintering and pressure forming. Specifically, the alloyed Al-Cu-BN powder can be placed in a patterned mold, and then the mold containing the alloyed Al-Cu-BN powder can be placed in a hot press furnace to simultaneously press and sinter the alloyed Al-Cu-BN powder. After vacuum hot pressing sintering of the alloyed Al-Cu-BN powder, heat treatment can be continued to form an Al-Cu-BN composite laminate.

[0014] The Al-Cu-X composite laminate 110 and Al-Cu-X composite laminate 120 disclosed herein have relatively high mechanical strength and thermal conductivity, and are suitable for use in heat dissipation components, such as liquid cooling plates, but this disclosure is not limited thereto.

[0015] The bonding material 130 may include a ductile alloy or solder, such as a Zn-Al-Cu alloy. In some embodiments, the bonding material 130 comprises 82Zn-15Al-3Cu, but this disclosure is not limited thereto. For example, the preparation of the bonding material 130 may include the following steps. First, the components of the bonding material 130 are mixed in a formulation ratio (e.g., 82 grams of zinc powder, 15 grams of aluminum powder, and 3 grams of copper powder are mixed) to form a bonding mixture. Next, the bonding mixture may be hot-pressed to form a bonding block, wherein the hot pressing may be performed continuously at a temperature of about 400°C and a pressure of about 40 MPa for about 1 hour. Next, the bonding block may be rolled to form a bonding sheet for subsequent application. In some embodiments, the melting point of the bonding material 130 is lower than the melting point of the Al-Cu-X composite laminates 110 and 120. In some embodiments, the melting point of the bonding material 130 may be 380 to 500°C.

[0016] Referring to FIG. 1B, the bonding material 130 is subjected to a heat treatment TH to perform a transient liquid phase bonding process. The heat treatment TH can raise the bonding material 130 to a bonding temperature, which can be higher than the melting point of the bonding material 130 and lower than the melting point of the Al-Cu-X composite layers 110 and 120. In some embodiments, the bonding temperature is about 490 to 550°C, for example, 500°C or 520°C. The Al-Cu-X composite layers 110 and 120 can also be heated simultaneously with the heating of the bonding material 130. Simultaneously with the heat treatment TH of the bonding material 130, the Al-Cu-X composite layers 110 and / or Al-Cu-X composite layers 120 can also be subjected to a pressure treatment PZ to perform a transient liquid phase bonding process, thereby improving the bonding strength between the Al-Cu-X composite layers 110 and 120. In some embodiments, the pressure of the pressurization process is 3 to 15 MPa, 6 MPa or 12 MPa, but this disclosure is not limited thereto.

[0017] During the transient liquid phase bonding process, the bonding material 130 first transforms into a molten bonding material 130', allowing the metallic components therein to diffuse into each other. After heating and pressurizing for a certain period of time, the molten bonding material 130' can be completely transformed into an intermetallic compound (IMC), i.e., the interface bonding layer 140, as shown in FIG1C. The fabrication of the aluminum-based composite structure 10 is completed after heating and pressurizing are stopped. In some embodiments, the duration of the heat treatment TH and the pressurization treatment PZ is 0.5 to 12 hours, for example, 1 hour, 3 hours, or 5 hours. Since the heating temperature of the heat treatment TH does not need to be high and the pressure applied in the pressurization treatment PZ does not need to be high, the implementation efficiency of the transient liquid phase bonding process can be improved, thereby improving the production efficiency of the aluminum-based composite structure.

[0018] After the transient liquid phase bonding process is completed, the melting point of the formed interface bonding layer 140 may be higher than the bonding temperature used in the transient liquid phase bonding process. That is, the bonding materials 130 can be bonded in a relatively low-temperature transient liquid phase bonding process, and the formed interface bonding layer 140 can be applied or used in a relatively high-temperature environment. In some embodiments, the bonding temperature is higher than the melting point of the bonding materials 130, and the melting point of the interface bonding layer 140 is higher than the melting point of the bonding materials 130.

[0019] Experimental Example

[0020] The following experimental examples will further illustrate this disclosure, but these experimental examples are only for illustrative purposes and are not intended to limit the scope of this disclosure.

[0021] [Example 1]

[0022] An 82Zn-15Al-3Cu (melting point 460℃) bonding material with a thickness of approximately 120μm was sandwiched between two 94Al-5Cu-1BN composite layers. A transient liquid phase bonding process was then performed at a bonding temperature of 500℃ and a bonding pressure of 12 MPa, and held at this temperature and pressure for 1 hour. Subsequently, the temperature was lowered to room temperature and the pressure was reduced to atmospheric pressure. The bonding strength between the two 94Al-5Cu-1BN composite layers was measured to be 40 MPa, as shown in Table 1 below.

[0023] In addition, the interface bonding layer 140A formed between the two 94Al-5Cu-1BN composite laminates 110A and 120A in Example 1 was subjected to microstructure analysis. Figure 2A is a scanning electron microscope (SEM) image of the interface bonding layer 140A in Example 1. As can be seen from Figure 2A, the thickness T of the interface bonding layer 140A is about 130 μm, and a white precipitate exists in the interface bonding layer 140A. Analysis of its composition shows that this white precipitate includes Al yCu 100-y particles, where 60 ≤ y ≤ 70. That is, this white precipitate includes Al 60-70Cu 30-40 particles. The Al yCu 100-y precipitate can have a particle size of about 0.1 μm-10 μm, and its average particle size can be about 5 μm. In some embodiments, the white precipitate is Al 2Cu particles.

[0024] Furthermore, as can be seen from Figure 2A, the interface bonding layer 140A of Embodiment 1 can be roughly divided into a region 141 near the 94Al-5Cu-1BN composite layer 110A, a region 142 near the 94Al-5Cu-1BN composite layer 120A, and an intermediate region 143 located between region 141 and region 142. The Al composition ratio of the intermediate region 143 is generally less than that of regions 141 and 142, and the Zn composition ratio of the intermediate region 143 is generally more than that of regions 141 and 142.

[0025] Figure 2B is a compositional analysis diagram of the interface bonding layer 140A of Example 1. As can be seen from Figure 2B, in the interface bonding layer 140A, the Al composition ratio increases approximately from 70.0% in the middle region 143 towards regions 141 and 142 to 81.0% or more, while the Zn composition ratio decreases approximately from 29.0% in the middle region 143 towards regions 141 and 142 to 17.0% or less, and the Cu composition ratio is approximately between 2.0% and 2.3%. In other words, the 82Zn-15Al-3Cu bonding material has been transformed into an interface bonding layer 140A with a completely different composition ratio. Figure 2C is a phase diagram of the Zn-Al alloy. As shown in Figure 2C, when the Al content is 70%, the melting point of the Zn-Al alloy is approximately 630°C, and when the Al content is 80%, the melting point of the Zn-Al alloy is approximately 640°C. Therefore, the melting point of the interface bonding layer 140A can reach above 630°C. In some embodiments, the melting point of the interface bonding layer 140A is approximately 630°C to 640°C.

[0026] [Comparative Example 1]

[0027] The transient liquid phase bonding process was performed in the same manner as in Example 1, except that 77Zn-20Al-3Cu was used instead of 82Zn-15Al-3Cu as the bonding material. After the transient liquid phase bonding process was completed, the bonding strength between the two 94Al-5Cu-1BN composite laminates was measured to be 12 MPa, as shown in Table 1 below.

[0028] In addition, after performing microstructure analysis on the interface bonding layer generated between the two 94Al-5Cu-1BN composite laminates in Comparative Example 1, it was found that since the melting point of 77Zn-20Al-3Cu (melting point 495°C) is close to the bonding temperature (500°C), the transient liquid phase bonding process cannot be completed, so a portion of 77Zn-20Al-3Cu remains.

[0029] [Examples 2-5]

[0030] The transient liquid phase bonding process was performed in the same manner as in Example 1, except that the transient liquid phase bonding process was performed at bonding pressures of 0 MPa, 3 MPa, 6 MPa, and 15 MPa, respectively. After the transient liquid phase bonding process was completed, the bonding strength between the two 94Al-5Cu-1BN composite laminates was measured to be 3 MPa, 17 MPa, 36 MPa, and 21 MPa, respectively, as listed in Table 1 below.

[0031] [Example 6]

[0032] The transient liquid phase bonding procedure was performed in the same manner as in Example 1, except that two 94Al-5Cu-1SiC composite laminates were used instead of two 94Al-5Cu-1BN composite laminates. After the transient liquid phase bonding procedure was completed, the bonding strength between the two 94Al-5Cu-1SiC composite laminates was measured to be 37.2 MPa, as shown in Table 1 below.

[0033] In addition, the interface bonding layer 140B formed between the two 94Al-5Cu-1SiC composite laminates 110B and 120B of Example 6 was subjected to microstructure analysis. Figures 3A to 3D are X-ray energy-dispersive X-ray spectroscopy (EDS) images of the interface bonding layer 140B of Example 6. Among them, Figure 3A is the EDS image of Al, Zn, Cu, Si and C, Figure 3B is the EDS image of Al, Figure 3C is the EDS image of Zn, and Figure 3D is the EDS image of Cu. As can be seen from Figure 3A, the 94Al-5Cu-1SiC composite laminates 110B and 120B do indeed contain SiC. As shown in Figure 3B, the interface bonding layer 140B of Example 6 can be roughly divided into region 141 near the 94Al-5Cu-1SiC composite layer 110B, region 142 near the 94Al-5Cu-1SiC composite layer 120B, and an intermediate region 143 located between region 141 and region 142. The Al composition ratio of the intermediate region 143 is generally less than that of regions 141 and 142. As shown in Figure 3C, the Zn composition ratio of the intermediate region 143 is generally more than that of regions 141 and 142. As shown in Figure 3D, the Cu composition ratio of the intermediate region 143 is generally slightly more than that of regions 141 and 142.

[0034] Figures 3E and 3F are SEM images of the interface bonding layer 140B of Example 6. As can be seen from Figure 3E, white precipitates AlyCu100-y particles are present in the interface bonding layer 140B, where 60 ≤ y ≤ 70. Furthermore, as can be seen from Figure 3F, in the interface bonding layer 140B, the Al composition ratio increases approximately from 66.4% in the central region 143 to 79.9% or more in regions 141 and 142, while the Zn composition ratio decreases approximately from 32.8% in the central region 143 to 19.9% ​​or less in regions 141 and 142, and the Cu composition ratio is approximately between 0.1% and 1.3%. In other words, the 82Zn-15Al-3Cu bonding material has been transformed into an interface bonding layer 140B with a completely different composition ratio. As can be seen from the Zn-Al phase diagram in Figure 2C, when the Al content is 66.4%, the melting point of the Zn-Al alloy is approximately 620°C, and when the Al content is 80%, the melting point of the Zn-Al alloy is approximately 640°C. Therefore, the melting point of the interface bonding layer 140B can reach above 620°C. In some embodiments, the melting point of the interface bonding layer 140B is approximately 620°C to 640°C.

[0035] [Example 7]

[0036] The transient liquid phase bonding procedure was performed in the same manner as in Example 1, except that two 94Al-5Cu-1C composite laminates were used instead of two 94Al-5Cu-1BN composite laminates. After the transient liquid phase bonding procedure was completed, the bonding strength between the two 94Al-5Cu-1C composite laminates was measured to be 33.6 MPa, as shown in Table 1 below.

[0037] In addition, the microstructure of the interface bonding layer 140C formed between the two 94Al-5Cu-1C composite laminates 110C and 120C in Example 7 was analyzed. Figures 4A to 4D are X-ray energy-dispersive X-ray spectroscopy (EDS) images of the interface bonding layer 140C in Example 7. Figure 4A is an EDS image of Al, Zn, Cu, and C; Figure 4B is an EDS image of Al; Figure 4C is an EDS image of Zn; and Figure 4D is an EDS image of Cu. As can be seen from Figure 4A, the 94Al-5Cu-1C composite laminates 110C and 120C do indeed contain C. As shown in Figure 4B, the interface bonding layer 140C of Example 7 can be roughly divided into region 141 near the 94Al-5Cu-1C composite layer 110C, region 142 near the 94Al-5Cu-1C composite layer 120C, and an intermediate region 143 located between region 141 and region 142. The Al composition ratio of the intermediate region 143 is generally less than that of regions 141 and 142. As shown in Figure 4C, the Zn composition ratio of the intermediate region 143 is generally more than that of regions 141 and 142. As shown in Figure 4D, the Cu composition ratio of the intermediate region 143 is generally slightly more than that of regions 141 and 142.

[0038] Figures 4E and 4F are SEM images of the interface bonding layer 140C of Example 7. Figure 4G is a compositional analysis diagram of the interface bonding layer 140C of Example 7. As can be seen from Figure 4E, white precipitates Al yCu 100-y particles are present in the interface bonding layer 140C, where 60 ≤ y ≤ 70. In addition, as can be seen from Figures 4F and 4G, in the interface bonding layer 140C, the composition ratio of Al increases approximately from 70.2% in the middle region 143 to 83.1% or more in regions 141 and 142, the composition ratio of Zn decreases approximately from 29.0% in the middle region 143 to 14.8% or less in regions 141 and 142, and the composition ratio of Cu is approximately between 0.8% and 2.1%. That is to say, the 82Zn-15Al-3Cu bonding material has been transformed into an interface bonding layer 140C with a completely different composition ratio. As can be seen from the Zn-Al phase diagram in Figure 2C, when the Al content is 70%, the melting point of the Zn-Al alloy is approximately 630°C, and when the Al content is 83.1%, the melting point of the Zn-Al alloy is approximately 645°C. Therefore, the melting point of the interface bonding layer 140C can reach above 630°C. In some embodiments, the melting point of the interface bonding layer 140C is approximately 630°C to 645°C.

[0039] [Table 1] Composite laminate bonding materials Connection pressure (MPa) Bond strength (MPa) Example 1 94Al-5Cu-1BN 82Zn-15Al-3Cu 12 40 Example 2 94Al-5Cu-1BN 82Zn-15Al-3Cu 0 3 Example 3 94Al-5Cu-1BN 82Zn-15Al-3Cu 3 17 Example 4 94Al-5Cu-1BN 82Zn-15Al-3Cu 6 36 Example 5 94Al-5Cu-1BN 82Zn-15Al-3Cu 15 twenty one Example 6 94Al-5Cu-1SiC 82Zn-15Al-3Cu 12 37.2 Example 7 94Al-5Cu-1C 82Zn-15Al-3Cu 12 33.6 Comparative Example 1 94Al-5Cu-1BN 77Zn-20Al-3Cu 12 12

[0040] As shown in Table 1, Examples 1-5, which performed the transient liquid phase bonding process under pressures of 0-15 MPa, all achieved bonding strengths of 3 MPa or higher. Among them, Example 1, which performed the transient liquid phase bonding process under a pressure of 12 MPa, achieved a bonding strength as high as 40 MPa. In addition, Example 6, which bonded two 94Al-5Cu-1SiC composite laminates with 82Zn-15Al-3Cu, and Example 7, which bonded two 94Al-5Cu-1C composite laminates with 82Zn-15Al-3Cu, both achieved bonding strengths of 30 MPa or higher.

[0041] FIG5 is a perspective view of a heat dissipation element 50 according to an embodiment of the present disclosure. The heat dissipation element 50 is, for example, a liquid cold plate, which can be mounted on high-power electronic products (e.g., servers, electric vehicles, etc.) to help dissipate heat from the high-power electronic products. The heat dissipation element 50 may include a housing 500, wherein the housing 500 may include an aluminum-based composite structure formed by Al-Cu-X composite laminates 510, 520 and an interface bonding layer 540.

[0042] In some embodiments, the Al-Cu-X composite laminates 510 and 520 comprise 94Al-5Cu-1BN, and the interface bonding layer 540 comprises (70.0-81.0)Al-(17.0-29.0)Zn-(2.0-2.3)Cu. In some embodiments, the Al-Cu-X composite laminates 510 and 520 comprise 94Al-5Cu-1SiC, and the interface bonding layer 540 comprises (66.4-79.9)Al-(19.9-32.8)Zn-(0.1-1.3)Cu. In some embodiments, the Al-Cu-X composite laminates 510 and 520 comprise 94Al-5Cu-1C, and the interface bonding layer 540 comprises (70.2-83.1)Al-(14.8-29.0)Zn-(0.8-2.1)Cu. In some embodiments, the interface bonding layer 540 further includes Al yCu 100-y particles, wherein 60 ≤ y ≤ 70.

[0043] The heat dissipation element 50 may further include a flow channel 550, which is a hollow channel located between the Al-Cu-X composite layer 510 and the Al-Cu-X composite layer 520. The working fluid can flow into the flow channel 550 through the inlet 551 and enter the heat dissipation element 50, and flow out of the flow channel 550 through the outlet 552, thereby carrying away the heat around the heat dissipation element 50 to achieve the purpose of heat dissipation. For example, the working fluid is water, ethylene glycol / water solution, fluorocarbon, or polyalphaolefin (PAO), etc.

[0044] In summary, the aluminum-based composite structure disclosed herein achieves a bonding strength of over 3 MPa by bonding two Al-Cu-X composite layers together using a transient liquid phase bonding process with a bonding material. Furthermore, by combining the transient liquid phase bonding process with pressure treatment, a bonding strength as high as 40 MPa can be obtained. Additionally, the transient liquid phase bonding process is easy to operate, thus improving the production efficiency of the aluminum-based composite structure. Moreover, the melting point of the interface bonding layer generated by the transient liquid phase bonding process is higher than the melting point of the bonding material, enabling the aluminum-based composite structure to be applied to heat dissipation components requiring high heat resistance and high thermal conductivity. [Simplified Explanation of the Diagram]

[0045] Figures 1A to 1C are flowcharts of a method for forming an aluminum-based composite structure according to an embodiment of the present disclosure. Figure 2A is a scanning electron microscope (SEM) image of an interface bonding layer according to an embodiment of the present disclosure. Figure 2B is a compositional analysis diagram of an interface bonding layer according to an embodiment of the present disclosure. Figure 2C is a phase diagram of a Zn-Al alloy. Figures 3A to 3D are energy-dispersive X-ray spectroscopy (EDS) images of an interface bonding layer according to an embodiment of the present disclosure, wherein Figure 3A is an EDS image of Al, Zn, Cu, Si, and C, Figure 3B is an EDS image of Al, Figure 3C is an EDS image of Zn, and Figure 3D is an EDS image of Cu. Figures 3E and 3F are SEM images of an interface bonding layer according to an embodiment of the present disclosure. Figures 4A to 4D are EDS images of an interface bonding layer according to an embodiment of the present disclosure, wherein Figure 4A is an EDS image of Al, Zn, Cu, and C, Figure 4B is an EDS image of Al, Figure 4C is an EDS image of Zn, and Figure 4D is an EDS image of Cu. Figures 4E and 4F are SEM images of an interface bonding layer according to an embodiment of the present disclosure. Figure 4G is a compositional analysis diagram of an interface bonding layer according to an embodiment of the present disclosure. Figure 5 is a perspective view of a heat dissipation element according to an embodiment of the present disclosure.

Claims

1. An aluminum-based composite structure, comprising: A first aluminum-copper-X (Al-Cu-X) composite layer; a second Al-Cu-X composite layer overlapping the first Al-Cu-X composite layer; and an interface bonding layer located between the first Al-Cu-X composite layer and the second Al-Cu-X composite layer, wherein X comprises a high thermal conductivity component, and based on the total weight of the interface bonding layer, the interface bonding layer comprises 60.0 to 90.0 wt% Al, 7.1 to 37.1 wt% zinc (Zn), and 0.1 to 2.9 wt% Cu, and the interface bonding layer comprises Al60-70Cu30-40 particles, wherein the first Al-Cu-X composite layer and the second Al-Cu-X composite layer are 94Al-5Cu-1BN, 94Al-5Cu-1SiC, or 94Al-5Cu-1C.

2. The aluminum-based composite structure as claimed in claim 1, wherein the concentration of Al in the interface bonding layer increases from the interface bonding layer toward the first Al-Cu-X composite layer or the second Al-Cu-X composite layer.

3. The aluminum-based composite structure as claimed in claim 1, wherein the concentration of Zn in the interface bonding layer decreases from the interface bonding layer toward the first Al-Cu-X composite layer or the second Al-Cu-X composite layer.

4. The aluminum-based composite structure as claimed in claim 1, wherein, based on the total weight of the interface bonding layer, the interface bonding layer comprises 70.0 to 81.0 wt% Al, 17.0 to 29.0 wt% Zn, and 1.0 to 2.3 wt% Cu.

5. The aluminum-based composite structure as claimed in claim 1, wherein the interface bonding layer comprises Al2Cu particles.

6. The aluminum-based composite structure as claimed in claim 1, wherein the Al60-70Cu30-40 particles have a particle size of 0.1 to 10 μm.

7. The aluminum-based composite structure as claimed in claim 1, wherein the melting point of the interface bonding layer is 620°C to 645°C.

8. A method for forming an aluminum-based composite structure, comprising: A bonding material is sandwiched between a first Al-Cu-X composite layer and a second Al-Cu-X composite layer, wherein the bonding material comprises 82Zn-15Al-3Cu, and the first Al-Cu-X composite layer and the second Al-Cu-X composite layer are 94Al-5Cu-1BN, 94Al-5Cu-1SiC, or 94Al-5Cu-1C; and the bonding material is heated to a bonding temperature, wherein the bonding temperature is higher than a first melting point of the bonding material and lower than a second melting point of the first Al-Cu-X composite layer or the second Al-Cu-X composite layer.

9. The method of claim 8, wherein the duration of the heat treatment is 0.5 to 12 hours.

10. The method of claim 8, wherein the bonding temperature is 490 to 550°C.

11. The method of claim 8, wherein the first melting point is 380 to 500°C.

12. The method of claim 8 further includes performing a pressurization process simultaneously with the heat treatment, wherein the pressure of the pressurization process is 3 to 15 MPa.

13. The method of claim 12, wherein the heating treatment and the pressurization treatment cause the bonding material to undergo a transient liquid phase bonding process to transform it into an interface bonding layer, and the melting point of the interface bonding layer is higher than the first melting point.

14. The method of claim 13, wherein the melting point of the interface bonding layer is 620°C to 645°C.

15. A heat dissipation element, comprising: A housing, wherein the housing comprises an aluminum-based composite structure as described in claim 1.

16. The heat dissipation element as claimed in claim 15, wherein the heat dissipation element is a liquid cooling plate.