Electronic device comprising anodized housing, and manufacturing method therefor

Abstract

An electronic device according to various embodiments of the present disclosure comprises a housing, wherein the housing may comprise: a base material; a surface treatment layer formed on at least a partial area of the surface of the base material; and a coating layer formed on at least a partial area of the surface treatment layer. The coating layer may include a phosphoric acid group attached to the surface treatment layer and a fluorocarbon chain having one end bonded to the phosphoric acid group and at least one carbon bonded to fluorine.

Description

Electronic device including an anodized housing and method for manufacturing the same

[0001] The various embodiments disclosed in this document relate to a housing for an electronic device, and more particularly, to an electronic device having an anodized housing and a method of manufacturing the same.

[0002] Electronic device housings can be made of metal, glass, plastic, or a combination thereof. Among these, metals are widely used for electronic device housings due to their high strength and impact toughness. For example, aluminum and / or alloys containing aluminum have low density and can achieve high strength through age hardening, making them suitable for electronic device housings. Metals are susceptible to corrosion, and forming a passivation layer on their surfaces can reduce corrosion and improve appearance.

[0003] Aluminum and / or alloys containing aluminum can be electrochemically oxidized by passing current through the surface of a base material in an electrolyte solution, thereby forming a thicker anodic oxide layer than a natural passive film, thereby improving corrosion resistance and enhancing appearance. Various coating layers can be disposed on the surface of the anodic oxide layer to provide texture control, gloss control, water repellency, and / or stain repellency.

[0004] When using an electronic device, moisture and / or oil may be transferred from the user's hand to the surface of the electronic device's housing, causing fingerprints and deteriorating the device's appearance. To reduce the appearance deterioration caused by fingerprints, an anti-fouling coating with low chemical affinity for moisture and oil may be applied to the surface of the electronic device's housing.

[0005] Antifouling coatings have low chemical affinity for water, making it difficult to dissolve coating agents in aqueous solvents. Furthermore, dissolving the coating agent in an organic solvent and dipping the coating target can increase costs due to increased solvent loss. Therefore, spraying the antifouling agent directly onto the target or depositing it under vacuum are widely used methods, rather than immersing it in a coating solution. However, spraying or depositing results in significant waste of coating agent, requires expensive, dedicated equipment like a vacuum chamber, requires significant capital investment, and can lead to longer process times.

[0006] According to various embodiments of the present disclosure, an electronic device including a coating layer capable of being coated by solution immersion may be provided. In addition, a coating method and a coating agent capable of being coated by solution immersion may be provided.

[0007] According to various embodiments of the present disclosure, an electronic device includes a housing, wherein the housing may include a base material. The housing may include a surface treatment layer formed on at least a portion of a surface of the base material. The housing may include a coating layer formed on at least a portion of the surface treatment layer. The coating layer may include a phosphate group attached to the surface treatment layer and a fluorocarbon chain having one end bonded to the phosphate group and at least one carbon bonded to fluorine.

[0008] A manufacturing method according to various embodiments of the present disclosure may be a method for manufacturing an electronic device including a housing, the method including: forming a surface treatment layer on a surface of a base material; washing the base material on which the surface treatment layer has been formed; and immersing the washed base material in a coating solution. The coating solution may include a coating agent including a phosphoric acid group and a fluorocarbon chain in which one end is bonded to the phosphoric acid group and at least one carbon is bonded to fluorine; and water as a solvent.

[0009] A coating solution composition according to various embodiments of the present disclosure may include a coating agent including a phosphoric acid group and a fluorocarbon chain having one end bonded to the phosphoric acid group and at least one carbon bonded to fluorine, and water as a solvent.

[0010] According to various embodiments of the present disclosure, an electronic device including a coating agent having improved chemical affinity with water by including a phosphoric acid group and easily attaching to an anodizing layer from an aqueous solution by surfactant adsorption and a coating layer formed thereby can be provided.

[0011] FIG. 1 is a block diagram of an exemplary electronic device capable of performing the operations described herein.

[0012] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0013] FIG. 2b is a perspective view of the rear surface of an electronic device according to various embodiments of the present disclosure.

[0014] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0015] FIG. 4A is a cross-sectional view showing a surface of a housing of an electronic device according to various embodiments.

[0016] FIG. 4b is a schematic diagram showing the surface of a housing of an electronic device according to various embodiments.

[0017] Figure 5a is a schematic diagram showing a manufacturing process of a housing according to various embodiments.

[0018] FIG. 5b is a flowchart illustrating a method for manufacturing a housing according to various embodiments.

[0019] Figure 5c is a schematic diagram showing the formation of a coating layer in various embodiments.

[0020] FIG. 6a is a graph showing the analysis results of X-ray photoelectron spectroscopy on the surface of a housing according to embodiments of the present invention.

[0021] FIG. 6b is a graph showing the analysis results of X-ray photoelectron spectroscopy on the surface of a housing according to embodiments of the present invention.

[0022] Figure 6c is a graph showing the results of secondary ion mass analysis on the surface of a housing according to embodiments of the present invention.

[0023] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described in this document.

[0024] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0025] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0026] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0027] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0028] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0029] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0030] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0031] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0032] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0033] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0034] Various embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., a processor (110)) of the machine (e.g., an electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0035] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0036] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0037] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A according to various embodiments of the present disclosure.

[0038] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (100) of FIG. 1 or may include various embodiments of the electronic device.

[0039] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (210C) may be formed by a side frame (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side frame (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0040] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side frame (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0041] According to one embodiment, the electronic device (200) may include at least one of a display (300), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0042] The display (300) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (300) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (300) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0043] The input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210). In some embodiments, the electronic device (200) may include a tray member (2181) disposed through at least a portion of the side frame (218).

[0044] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (300) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0045] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0046] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (300). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (300).

[0047] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0048] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0049] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (300). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (300). In one embodiment, an area where the display (300) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (300) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (300) facing the sensor module may not require a perforated opening.

[0050] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to various embodiments of the present disclosure.

[0051] Referring to FIG. 3, the electronic device (200) may include a frame (301), a front plate (202) (e.g., a front cover), a display (300), a substrate (240), a battery (250), a support bracket (260) (e.g., a rear case or support member), an antenna (270), and a rear plate (211) (e.g., a rear cover). At least one of the components of the electronic device (200) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or 2B, and any redundant description will be omitted below.

[0052] According to various embodiments, the frame (301) may include a side frame (218) (e.g., the side frame 218 of FIGS. 2A and 2B) and an inner frame (2181a) (e.g., an extension member or a support member). The inner frame (2181a) may be disposed inside the electronic device (200) and structurally coupled to the side frame (218) or may be formed integrally with the side frame (218). The inner frame (2181a) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The inner frame (2181a) may have a display (300) coupled to one surface and a substrate (240) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory.

[0053] In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the inner frame (2181a), or the support bracket (260)) or may additionally include other components.

[0054] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multi-media card) connector, or an audio connector.

[0055] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as the substrate (240), for example. The battery (250) may be integrally disposed within the electronic device (200). In one embodiment, the battery (250) may be disposed so as to be detachable from the electronic device (200).

[0056] Antenna (270) may be positioned between the rear plate (211) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a portion of the side frame (218) and / or the inner frame (2181a) or a combination thereof.

[0057] FIG. 4A is a cross-sectional view showing the surface of a housing (401) of an electronic device (400) according to various embodiments. FIG. 4B is a schematic diagram showing the surface of a housing (401) of an electronic device (400) according to various embodiments. FIG. 4B is a schematic diagram of a portion M of FIG. 4A.

[0058] Referring to FIG. 4a, a housing (401) (e.g., housing (210) of FIGS. 2a and 2b, frame (301) of FIG. 3) of an electronic device (e.g., electronic device (100) of FIG. 1, electronic device (200) of FIGS. 2a to 3) may include a base material (410), a surface treatment layer (420), and a coating layer (430).

[0059] In various embodiments, the base material (410) may include various metal and / or polymer materials. The metal material may be, for example, an alloy including aluminum and / or titanium. Aluminum and titanium have high specific strength due to their low density and high strength, and thus may be used in the housing (401) of the electronic device (400). The polymer material may include, for example, polycarbonate, polyamide, acrylonitrile butadiene styrene copolymer (ABS), and / or mixtures or copolymers thereof.

[0060] The surface treatment layer (420) may be a layer that prevents corrosion and / or surface damage of the base material (410) and imparts surface texture and appearance characteristics (e.g., color). The surface treatment layer (420) may be formed by anodizing the metal of the base material (410) in an anodizing solution (511) (e.g., conducting electricity by making the base material (410) an anode in the anodizing solution (511). In other embodiments, the surface treatment layer (420) may be a layer formed by surface treatment that modifies the surface properties of the polymer material of the base material (410).

[0061] In various embodiments, the surface treatment layer (420) may include a porous aluminum oxide layer (421). The porous aluminum oxide layer (421) may be a layer grown on the surface of the base material (410) to have pores (422) by anodizing an aluminum component of the base material (410). In various embodiments, the surface treatment layer (420) may include a sealing layer (423) positioned on the porous aluminum oxide layer (421). The sealing layer (423) may be a layer that closes the pores (422) of the porous aluminum oxide layer (421). In some embodiments, the sealing layer (423) may also adjust the surface texture of the surface of the surface treatment layer (420). The sealing layer (423) may be formed by growing a layer of a compound, such as nickel fluoride or nickel acetate, on the surface of the porous aluminum oxide layer (421).

[0062] In various embodiments, a dye may be positioned in the pores (422) of the porous aluminum oxide layer (421). The dye may also color the housing (401) of the electronic device (400). In various embodiments, a coating agent, as described below, may remain in the pores (422) of the porous aluminum oxide layer (421).

[0063] In various embodiments, the coating layer (430) may be a layer that improves the antifouling performance of the housing (401). For example, the coating layer (430) may be a layer that reduces the adhesion of water-based contaminants or oil-based contaminants to the surface of the housing (401). The coating layer (430) may include a molecular structure having a low chemical affinity for water and oil, for example, a fluorinated carbon chain (492) (which may also be referred to as a fluorocarbon chain). The fluorinated carbon chain (492) may lower the surface energy of the coating layer (430). For example, the coating layer (430) may have a contact angle with water of 110 degrees or more on the surface. In various embodiments, the fluorinated carbon chain (492) may be a saturated fluorinated hydrocarbon (which may also be referred to as a fluoroalkyl group).

[0064] Referring to FIG. 4b, the coating layer (430) may include a phosphate group (491) and a fluorinated carbon chain (492).

[0065] The phosphate group (491) may be attached to the surface treatment layer (420). For example, the phosphate group (491) may be attached to the surface of the surface treatment layer (420) by van der Waals force. Also, for example, aluminum oxide (e.g., aluminum oxide (Al2O3)) may be exposed on the surface of the surface treatment layer (420), and the phosphate group (491) may chemically bond to the aluminum oxide of the surface treatment layer (420). As described below, since the phosphate group (491) has hydrophilicity, the coating solution (531) for forming the coating layer (430) according to embodiments of the present disclosure may be an aqueous solution (a solution using water as a solvent). In addition, due to the presence of the phosphate group (491), the surface treatment layer (420) having hydrophilicity and the coating agent molecules of the present disclosure may be easily bonded through the anodizing process.

[0066] In various embodiments, the fluorinated carbon chain (492) may be a chain-like hydrocarbon in which at least one hydrogen atom is replaced with fluorine. For example, it may be a chain-like hydrocarbon in which at least one hydrogen atom is replaced with fluorine in octane, which is a saturated hydrocarbon. One end of the fluorinated carbon chain (492) may be chemically bonded (e.g., an ester bond) to a phosphate group (491). A molecule having a fluorinated carbon chain (492) and a phosphate group (491) chemically bonded thereto may be referred to as a fluorocarbon phosphate ester or a fluorocarbon phosphate. Hereinafter, the phosphate group (491) portion of the fluorocarbon phosphate molecules included in the coating layer (430) may be referred to as a head (490a). Additionally, the opposite end of the fluorinated carbon chain (492) that is bonded to the phosphate group (491) can be referred to as a tail (490b).

[0067] In various embodiments, the fluorinated carbon chain (492) may have one end fluorinated and the opposite end may not be fluorinated. For example, the tail (490b) portion of the fluorinated carbon chain (492) may be fluorinated and the portion adjacent to the head (490a) may not be fluorinated. Since the phosphate group (491) of the head (490a) is bonded to the surface treatment layer (420), the tail (490b) portion located opposite to the head (490a) may be aligned toward the surface of the coating layer (430). The tail (490b) portion is nonpolar as a carbon chain and has low chemical bonding strength with other molecules due to fluorination, so that moisture and oil may not be attached to the molecules of the coating layer (430).

[0068] In various embodiments, the total length of the fluorinated carbon chain (492) may be 6 or more carbon atoms. Since the carbon chain covalently bonded to fluorine (-CF2-, -CF3) has low electrical attraction to other molecules and is hydrophobic, the longer the fluorinated carbon chain (492), the better the antifouling performance of the coating layer (430). In addition, the longer the total length of the fluorinated carbon chain (492), the greater the distance between the fluorinated tail (490b) portion located on the surface of the coating layer (430) and the hydrophilic head (490a), and thus the better the antifouling performance of the coating layer (430).

[0069] In various embodiments, the number of fluorinated carbon atoms in the fluorinated carbon chain (492) may be 6 or less. The fluorinated carbon chain (492) has a very low chemical attraction with other molecules, but is highly resistant to decomposition factors (photons, catalysts, and / or various biological enzymes) for organic molecules existing in nature, so it can persist for a long time and cause bioaccumulation when released into the nature. The fluorinated carbon chain (492) that causes such pollution is called PFAS (polyfluoroalkyl substances), and some of these substances are subject to environmental regulations. The resistance to decomposition of the fluorinated carbon chain (492) can increase as the number of carbons bonded to fluorine increases, and therefore regulations are also centered on long-chain PFAS. Therefore, by setting the number of fluorinated carbon atoms in the fluorocarbon phosphate (490) molecule of the coating layer (430) of the present invention to 6 or less, the environmental impact of wastewater generated in the process of manufacturing the housing (401) of the electronic device (400) according to embodiments of the present disclosure can be reduced.

[0070] In various embodiments, the portion of the fluorinated carbon chain (492) adjacent to the phosphate group (491) of the fluorocarbon phosphate (490) molecule (i.e., the portion of the fluorinated carbon chain (492) adjacent to the head (490a) of the fluorocarbon phosphate (490) molecule) may not be fluorinated. For example, the fluorinated carbon chain (492) may be a 3,3,4,4,5,5,6,6,6 nonafluorohexyl group or a 3,3,4,4,5,5,6,6,7,7,8,8,8 tridecafluorooctyl group. That is, for example, when numbering the carbons of the fluorinated carbon chain (492) in order of proximity to the phosphate group (491), carbons 1 and 2 may not be bonded to fluorine. When only a limited number (e.g., 6 or less) of carbons within the fluorinated carbon chain (492) are bonded to fluorine, the antifouling performance can be improved by arranging the carbon atoms bonded to fluorine in the tail (490b) facing the surface of the coating layer (430).

[0071] FIG. 5a is a schematic diagram showing a manufacturing process of a housing (401) according to various embodiments. FIG. 5b is a flowchart showing a method of manufacturing a housing (401) according to various embodiments. FIG. 5c is a schematic diagram showing the formation of a coating layer (430) according to various embodiments.

[0072] Referring to FIGS. 5a and 5b, a method for manufacturing a housing (401) according to the present invention may include an operation (501) of anodizing a base material (410), an operation (502) of washing the anodized base material (410), and an operation (503) of immersing the washed base material (410) in a coating solution (531).

[0073] The anodizing operation (501) may be an operation of forming a surface treatment layer (420) by anodizing on the surface of the base material (410) by immersing the base material (410) in an anodizing solution in an electrolytic cell (510) and passing current through the anode to the base material (410). In various embodiments, the anodizing solution of the anodizing step may include an electrolyte solution such as sulfuric acid, oxalic acid, phosphoric acid, chromic acid, or a similar solution.

[0074] In various embodiments, the anodizing operation (501) may include a sealing operation, i.e., an operation of immersing the anodized base material (410) in a sealing solution to form a sealing layer (423). The sealing solution may be an aqueous solution containing, for example, nickel (Ni) and fluorine (F). The sealing solution may include, for example, nickel fluoride, or a mixture of nickel acetate and ammonium fluoride.

[0075] It will be apparent to those skilled in the art that in the manufacturing method of the present invention, additional operations such as degreasing, etching, demutting and / or dyeing may be performed on the surface of the base material (410) and / or the surface of the porous aluminum oxide layer (421) and / or the sealing layer (423) after the anodizing operation.

[0076] The washing operation (502) may include an operation of immersing the base material (410) in which the anodizing operation (501) has been completed, in a washing solution (521) (e.g., water) within a washing tank (520). The washing operation (502) may be an operation configured to remove foreign substances such as anodizing solution remaining on the surface of the base material (410). In various embodiments, the washing operation (502) may include an operation of immersing the base material (410) in the washing solution (521) multiple times. For example, in the washing operation (502), after immersing the base material (410) in the washing solution (521) in the washing tank (520), the washing solution (521) may be replaced and the base material (410) may be immersed again to perform additional washing.

[0077] In various embodiments, the coating operation (503) may be an operation of immersing the washed base material (410) in a coating solution (531) to form a coating layer (430) on the surface of the surface treatment layer (420) formed on the base material (410).

[0078] In various embodiments, the coating operation (503) may be performed within the same tank as the washing tank (520) in which the washing operation (502) was performed. This has the advantage of not requiring separate equipment for forming the coating layer (430). This may also be possible because the coating solution (531) for the coating operation (503) according to an embodiment of the present disclosure is an aqueous solution. Furthermore, it will be apparent to those skilled in the art that in other embodiments of the present disclosure, the coating operation (503) may also be performed in a separate tank.

[0079] In various embodiments, the coating solution (531) may include water as a solvent and a coating agent dissolved in the water. The coating agent may include a fluorinated carbon chain (492) bonded to a phosphoric acid group (491), which may be referred to as a fluorocarbon phosphate (490). In various embodiments, the coating solution (531) may include 0.3 to 0.5 wt % of the coating agent.

[0080] Referring to FIG. 5c, the fluorocarbon phosphate (490) of the coating solution (531) can be bonded to the surface of the surface treatment layer (420).

[0081] In the anodic oxidation operation and / or the cleaning operation (502), the surface of the aluminum oxide (e.g., Al2O3) may be activated, so that dangling bonds (also referred to as dangling bonds) may exist on the surface. For example, the dangling bonds may be generated when the aluminum oxide of the surface treatment layer (420) combines with water in an aqueous solution to form hydroxyl groups on the surface of the surface treatment layer (420). For example, the dangling bonds may be formed through a process such as the chemical formula below.

[0082] [chemical formula]

[0083] Al2O3+ H2O →2AlO(OH)

[0084] Therefore, a hydroxyl group (-OH) having polarity may exist on the surface of the surface treatment layer (420), and the surface on which such a hydroxyl group is formed may exhibit hydrophilicity.

[0085] The fluorocarbon phosphate (490) molecules of the composition can be adsorbed onto the surface of the hydrophilic surface treatment layer (420). The fluorocarbon phosphate (490) has a fluorocarbon group tail (490b) that is hydrophobic as a nonpolar structure and a phosphate head (490a) that is hydrophilic as a polar structure, so it is amphiphilic and can be a surfactant. In addition, the phosphate group (491) portion of the fluorocarbon phosphate (490) can be adsorbed onto the surface of the hydrophilic surface treatment layer (420). The process in which the surfactant is adsorbed onto the hydrophilic surface can be referred to as surfactant adsorption. In addition, the negative charge of the phosphate group (491) can be attracted to the positive charge (δ) of the hydrogen of the hydroxyl group (-OH) by the phosphate head (490a) of the adsorbed fluorocarbon phosphate (490) by forming an Al-OP chemical bond with aluminum oxide and / or a van der Waals bond with the aluminum oxide surface, thereby forming a coating layer (430).

[0086] In various embodiments, the temperature of the coating solution (531) during the coating operation (503) may be 60 degrees Celsius or higher. The surfactant adsorption process may proceed at a faster rate as the temperature increases. If the temperature of the coating solution (531) is lower than 60 degrees Celsius, the coating layer (430) may not be formed even if the substrate (410) is immersed in the coating solution (531), or the coating speed may be impractically slow. The coating operation (503) may be performed by immersing the substrate (410) in the coating solution (531) at a temperature of 60 degrees Celsius or higher for 5 minutes or less.

[0087] In various embodiments, the coating solution (531) may further include a wetting agent. The wetting agent may be a component that enhances the wettability of the coating solution (531). In various embodiments, the wetting agent may include a fluoroalkyl ether. For example, the wetting agent may include polyethylene oxide, mono(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl) ether.

[0088] Since the surface of the surface treatment layer (420) after anodizing is hydrophilic, the coating solution (531) can have good wettability on the surface of the surface treatment layer (420). After the coating layer (430) is formed on the surface of the surface treatment layer (420), since the coating layer (430) has low hydrophilicity, the coating solution (531) can have low wettability on the surface of the coating layer (430). Therefore, after the operation (501) of immersing the base material (410) in the coating solution is performed, the coating solution (531) may form droplets and remain on the surface of the coating layer (430). If the coating solution (531) forms droplets and remains on the surface of the coating layer (430), the possibility of stains occurring after the coating solution (531) dries increases, which may deteriorate the appearance quality of the electronic device (400).

[0089] In embodiments of the present disclosure, the wetting agent can enhance the wettability of the coating solution (531) on the surface of the coating layer (430), thereby allowing the coating solution (531) to form a liquid thin film rather than adhere to the surface of the coating layer (430) in the form of droplets. Accordingly, the coating solution (531) can prevent and / or reduce staining on the surface of the electronic device (400) by including the wetting agent.

[0090] In various embodiments, the coating solution (531) may contain a wetting agent in an amount of 0.15 wt% or less. If the wetting agent is contained in an amount of 0.15 wt% or more, the hydrophilic wetting agent may remain excessively in the coating layer (430), thereby reducing the antifouling performance of the coating layer (430).

[0091] FIG. 6a is a graph showing the analysis results of X-ray photoelectron spectroscopy on the surface of a housing (401) according to embodiments of the present invention. FIG. 6b is a graph showing the analysis results of X-ray photoelectron spectroscopy on the surface of a housing (401) according to embodiments of the present invention. FIG. 6c is a graph showing the secondary ion mass spectrometry results of the surface of a housing (401) according to embodiments of the present invention.

[0092] Referring to FIG. 6a, a peak of 688 eV derived from the CF bond of fluorocarbon is confirmed on the surface of the housing (401) according to embodiments of the present invention through X-ray photoelectron spectroscopy (XPS) analysis. Therefore, it can be seen that the coating layer (430) formed on the surface of the housing (401) according to the present invention has a fluorocarbon functional group, and the antifouling performance of the coating layer (430) is due to the water-repellent / antifouling effect of this fluorocarbon functional group.

[0093] Also, referring to FIG. 6b, a peak of 135 eV derived from the Al-OP bond on the surface of the housing (401) according to embodiments of the present invention is confirmed through X-ray photoelectron spectroscopy analysis. Therefore, it can be seen that the phosphate group (491) of the coating agent of the present invention forms an Al-OP chemical bond with the aluminum oxide on the surface of the housing (401), thereby forming a stable coating layer (430) chemically bonded to the surface of the housing (401).

[0094] Also, referring to FIG. 6c, secondary ion mass spectroscopy (SIMS) confirms that a peak with a mass / charge ratio of 94.97 corresponding to phosphoric acid (PO4-) is present on the surface of the housing (401) according to embodiments of the present invention. Accordingly, it can be seen that the phosphoric acid group (491) of the coating agent of the present invention is included on the surface of the coating layer (430).

[0095] To verify the durability and resilience of the coating layer (430) of the present invention, an abrasion test was conducted on the coating layer (430). The abrasion test was performed by rubbing a rubber eraser back and forth 1,000 times against the surface of the housing (401) according to the example of the present disclosure and the comparative example in which the coating layer (430) was not formed under a load of 490 gf, and then measuring the contact angle with respect to water. After approximately 1 hour, the contact angle was measured again. The results are shown in Table 1.

[0096] Classification Comparison Example Example Before the test 55 degrees 110-125 degrees After the test the same 81 degrees

[0097] Referring to Table 1, the surface of the housing (401) including the coating layer (430) according to the embodiment of the present disclosure including the coating layer (430) has a high hydrophobicity compared to the comparative example, and after the wear test, some of the fluorocarbon phosphate (490) molecules of the coating layer (430) are shed, resulting in a decrease in hydrophobicity, but it can be seen that the surface maintains a high hydrophobicity compared to the comparative example. In addition, after a certain period of time has passed since the coating layer (430) according to the embodiment of the present disclosure is worn away, the fluorocarbon phosphate (490) molecules among the coating component remaining in the pores (422) of the surface treatment layer (420) under the coating layer (430) may move to the coating layer (430), thereby acting to restore the coating layer (430). Therefore, the electronic device (400) according to the present disclosure may be capable of at least partially recovering wear of the coating layer (430) of the housing (401) even if it is worn away due to continued use. This action allows the antifouling performance to be maintained for a relatively longer period of time.

[0098] According to various embodiments of the present disclosure, an electronic device including a housing may include a base material (410). The housing may include a surface treatment layer (420) formed on at least a portion of a surface of the base material (410). The housing may include a coating layer (430) formed on at least a portion of the surface treatment layer (420). The coating layer (430) may include a phosphate group (491) attached to the surface treatment layer (420) and a fluorocarbon chain (492) having one end bonded to the phosphate group (491) and one or more carbons bonded to fluorine.

[0099] In various embodiments, the base material (410) includes aluminum, the surface treatment layer (420) includes aluminum oxide in which the aluminum of the base material (410) is anodized, and the phosphate group of the coating layer (430) can form an Al-OP bond with the aluminum atoms of the surface treatment layer (420).

[0100] In various embodiments, the fluorocarbon chain (492) may have 6 or fewer carbon atoms bonded to fluorine.

[0101] In various embodiments, the carbon located at the opposite end of the fluorocarbon chain (492) may be bonded to fluorine.

[0102] In various embodiments, the fluorocarbon chain (492) may include at least one carbon that is located at the end bonded to the phosphate group (491) and is not bonded to fluorine.

[0103] In various embodiments, the housing may be manufactured by a method including an operation (501) of forming a surface treatment layer (420) on a surface of a base material (410), an operation (502) of washing the anodized base material (410), and an operation (503) of immersing the washed base material (410) in a coating solution. The coating solution may include a coating agent including a phosphoric acid group (491) and a fluorocarbon chain (492) having one end bonded to the phosphoric acid group (491) and at least one carbon bonded to fluorine, and water as a solvent.

[0104] In various embodiments, the coating solution may further comprise a polyethylene oxide-fluoroalkyl ether as a wetting agent.

[0105] In various embodiments, the coating solution may contain 0.3 to 0.5 wt% of the coating agent. The coating solution may contain 0.15 wt% or less of the wetting agent.

[0106] In various embodiments, in the operation (503) of immersing in the coating solution, the temperature of the coating solution may be 60 degrees Celsius or higher.

[0107] In various embodiments, the washing operation (502) may be performed in a washing tank (520), and the immersion operation (503) in the coating solution may be performed in the washing tank (520) in which the washing operation is performed.

[0108] A manufacturing method according to various embodiments of the present disclosure may be manufactured by a method including an operation (501) of forming a surface treatment layer (420) on a surface of a base material (410), an operation (502) of washing the base material (410) on which the surface treatment layer (420) is formed, and an operation (503) of immersing the washed base material (410) in a coating solution. The coating solution may include a coating agent including a phosphoric acid group (491) and a fluorocarbon chain (492) in which one end is bonded to the phosphoric acid group (491) and at least one carbon is bonded to fluorine; and water as a solvent.

[0109] In various embodiments, the coating solution may further comprise a polyethylene oxide-fluoroalkyl ether as a wetting agent.

[0110] In various embodiments, the coating solution may contain 0.3 to 0.5 wt% of the coating agent. The coating solution may contain 0.15 wt% or less of the wetting agent.

[0111] In various embodiments, in the operation (503) of immersing in the coating solution, the temperature of the coating solution may be 60 degrees Celsius or higher.

[0112] In various embodiments, the washing operation (502) may be performed in a washing tank (520), and the immersion operation (503) in the coating solution may be performed in the washing tank (520) in which the washing operation is performed.

[0113] A coating solution composition according to various embodiments of the present disclosure may include a coating agent including a phosphoric acid group (491) and a fluorocarbon chain (492) having one end bonded to the phosphoric acid group (491) and at least one carbon bonded to fluorine, and water as a solvent.

[0114] In various embodiments, the coating solution composition may further comprise a polyethylene oxide-fluoroalkyl ether as a wetting agent.

[0115] In various embodiments, the coating solution composition may comprise 0.3 to 0.5 wt% of the coating agent. In various embodiments, the coating solution composition may comprise 0.15 wt% or less of the wetting agent.

[0116] In various embodiments, the fluorocarbon chain (492) may have 6 or fewer carbon atoms bonded to fluorine.

[0117] In various embodiments, the coating solution composition may be such that the carbon located at the opposite end of the one end of the fluorocarbon chain (492) can be bonded to fluorine.

[0118] In various embodiments, the coating solution composition may include at least one carbon that is not bonded to fluorine and is located at one end of the fluorocarbon chain (492) bonded to the phosphate group (491).

[0119] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In an electronic device including a housing, The above housing, Mother material (410); A surface treatment layer (420) formed on at least a portion of the surface of the above-mentioned parent material (410); and Including a coating layer (430) formed on at least a portion of the surface treatment layer (420), The above coating layer (430) is Phosphate group (491) attached to the surface treatment layer (420); and An electronic device comprising a fluorocarbon chain (492) in which one end is bonded to the above-described phosphate group (491) and at least one carbon is bonded to fluorine.

2. In paragraph 1, The above-mentioned parent material (410) contains aluminum, The above surface treatment layer (420) includes aluminum oxide in which the aluminum of the above base material (410) is anodized, An electronic device in which the phosphoric acid group of the coating layer (430) forms an Al-OP bond with the aluminum atom of the surface treatment layer (420).

3. In paragraph 1, The above fluorocarbon chain (492) is an electronic device in which the number of carbons bonded to fluorine is 6 or less.

4. In paragraph 1, An electronic device in which carbon located at the opposite end of the above-mentioned one end of the above-mentioned fluorocarbon chain (492) is bonded to fluorine.

5. In paragraph 1, An electronic device in which the fluorocarbon chain (492) is located at one end thereof and is bonded to the phosphate group (491) and includes at least one carbon that is not bonded to fluorine.

6. In paragraph 2, The above housing, An operation (501) of forming the surface treatment layer (420) on the surface of the above-mentioned parent material (410); An operation (502) of washing the above-mentioned anodized base material (410); and It is manufactured by a method including an operation (503) of immersing the washed above-mentioned base material (410) in a coating solution, The above coating solution, A coating agent comprising a phosphate group (491) and a fluorocarbon chain (492) having one end bonded to the phosphate group (491) and at least one carbon bonded to fluorine; and An electronic device containing water as a solvent.

7. In paragraph 6, An electronic device wherein the coating solution further comprises polyethylene oxide-fluoroalkyl ether as a wetting agent.

8. In paragraph 7, The above coating solution, Containing 0.3 to 0.5 wt% of the above coating agent, An electronic device comprising the above humectant in an amount of 0.15 wt% or less.

9. In paragraph 6, An electronic device in which the temperature of the coating solution is 60 degrees Celsius or higher in the operation (503) of immersing in the coating solution.

10. In paragraph 6, The above washing operation (502) is performed in a washing tank (520), The electronic device in which the operation of immersing in the coating solution (503) is performed in the washing tank (520) in which the washing operation is performed.

11. A method for manufacturing an electronic device including a housing, An operation (501) of forming a surface treatment layer (420) on the surface of the base material (410); An operation (502) of washing the base material (410) on which the surface treatment layer (420) is formed; and It is manufactured by a method including an operation (503) of immersing the washed above-mentioned base material (410) in a coating solution, The above coating solution, A coating agent comprising a phosphate group (491) and a fluorocarbon chain (492) having one end bonded to the phosphate group (491) and at least one carbon bonded to fluorine; and A method for manufacturing an electronic device comprising water as a solvent.

12. In paragraph 11, A method for manufacturing an electronic device, wherein the coating solution further comprises polyethylene oxide-fluoroalkyl ether as a wetting agent.

13. In paragraph 12, The above coating solution, Containing 0.3 to 0.5 wt% of the above coating agent, A method for manufacturing an electronic device comprising the above wetting agent in an amount of 0.15 wt% or less.

14. In paragraph 11, A method for manufacturing an electronic device, wherein in the operation (503) of immersing in the coating solution, the temperature of the coating solution is 60 degrees Celsius or higher.

15. In paragraph 11, The above washing operation (502) is performed in a washing tank (520), A method for manufacturing an electronic device, wherein the operation of immersing in the coating solution (503) is performed in the washing tank (520) in which the washing operation is performed.

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