Membrane for applying pressure to pad in chemical mechanical polishing

The flexible membrane in the chemical mechanical polishing system addresses non-uniformity issues by adjusting pressure distribution, enhancing polishing uniformity and extending pad lifespan.

WO2026019514A1 Publication Date: 2026-01-22APPLIED MATERIALS INC
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Patent Information

Application Number
PCT/US2025/033847
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-19
Filing Date
2025-06-16
Publication Date
2026-01-22

AI Technical Summary

Technical Problem

Chemical mechanical polishing processes often result in thickness non-uniformity across the surface of substrates, leading to under-polished regions and radially non-uniform polishing, which can be challenging to address effectively.

Method used

A chemical mechanical polishing system with a flexible membrane that forms individually pressurizable chambers between a pad carrier and a support arm, allowing for adjustable pressure distribution across the polishing pad to compensate for radial velocity gradients and improve polishing uniformity.

Benefits of technology

The system reduces within-wafer and wafer-to-wafer non-uniformity by enabling localized and precise polishing, maintaining high throughput while extending the lifespan of polishing pads by decoupling them from the pressurizable chambers.

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Abstract

A chemical mechanical polishing system includes a chuck assembly that has a chuck to hold a substrate, a motor to rotate the chuck about a first axis, and a pad carrier assembly. The pad carrier assembly includes a support that is movably along a radial direction relative to the first axis, a lateral actuator coupled the support to cause the support to move along the radial direction, a support arm extending from the support over the chuck, a pad carrier suspended from the support arm, the pad carrier configured to receive and hold a polishing pad, and a flexible membrane secured to the support arm to form a plurality of individually pressurizable chambers between the pad carrier and the support arm such that variation of a pressure difference between the chambers adjusts a radial distribution of pressure on the pad carrier.
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