Laser bonding apparatus and method

The laser bonding method uses conductive heat to melt a filler material between dissimilar materials, addressing the issue of lower base material damage in conventional welding, thereby improving battery pack manufacturing stability and reducing defects.

WO2026024050A1 Publication Date: 2026-01-29LG ENERGY SOLUTION LTD
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Patent Information

Application Number
PCT/KR2025/010797
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-23
Filing Date
2025-07-22
Publication Date
2026-01-29

AI Technical Summary

Technical Problem

Conventional laser welding methods for bonding dissimilar materials in battery packs risk damaging the lower base material due to laser penetration, leading to potential leakage and product defects, especially in cylindrical battery cells, and are difficult to control due to varying laser intensity based on material and thickness.

Method used

A laser bonding method that uses conductive heat from an upper base material to melt a filler material, such as solder or brazing, between dissimilar materials without penetrating the lower base material, controlled by temperature measurement and heat dissipation to prevent overheating.

Benefits of technology

Prevents damage to the lower base material, reduces the risk of leakage, and facilitates easier control of laser intensity, enhancing the stability and productivity of battery pack manufacturing.

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Abstract

The present invention relates to an apparatus and a method for bonding different materials without damage to a lower base material by using laser irradiation heat and a filler (solder or brazing) for bonding different materials during the manufacture of battery packs. The apparatus for bonding different materials, according to an embodiment of the present invention, comprises: an upper base material arrangement unit for arranging an upper base material at a bonding position; a lower base material arrangement unit for arranging, in an overlapped manner, such that the bonding position of the lower base material faces the bonding position of the upper base material; a bonding material injection unit for injecting, between the upper base material and the lower base material, a bonding material to be melted by conduction heat generated when the upper base material is heated; and a laser irradiation unit for heating the upper base material by irradiating the upper surface of the upper base material with a laser.
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