Electrical contacts, systems, and methods for electroplating

Abstract

Electrical contact apparatuses, systems, and techniques for electroplating are provided. The electrical contact apparatus may have a body portion extending around a center axis, and a plurality of electrical contact fingers arranged in a substantially equally spaced manner around the center axis and extending in a radial direction inwards towards the center axis. Each electrical contact finger may be flexible in a direction parallel to the center axis, may have a proximal portion connected to the body portion, and has a distal portion connected to the proximal portion and forming an included angle with the proximal portion that is between about 45 degrees and 145 degrees, and the distal portion of each electrical contact finger has an end portion configured to contact a substrate and that has a surface roughness Ra of about 50 micro-inches or less, is beveled, chamfered, and / or has one or more curved surfaces.

Description

Docket No. LAM1P065WOELECTRICAL CONTACTS, SYSTEMS, AND METHODS FOR ELECTROPLATINGCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] A PCT Request Form is filed concurrently with this specification as part of the present application. Each application that the present application claims benefit of or priority to as identified in the concurrently filed PCT Request Form is incorporated by reference herein in its entirety and for all purposes.BACKGROUND

[0002] Electroplating is a common technique used in integrated circuit (IC) fabrication to deposit one or more layers of conductive metal. In some fabrication processes it is used to deposit one or more levels of copper interconnects between various substrate features. An apparatus for electroplating typically includes an electroplating cell having a chamber for containing an electrolyte (sometimes called a plating bath) and a substrate holder designed to hold a semiconductor substrate during electroplating. In some designs, the wafer holder has a “clamshell” structure in which the substrate perimeter rests against a structure called a “cup.” A clamshell may also be referred to herein as a cup assembly.

[0003] During operation of the electroplating apparatus, a semiconductor substrate is submerged into the plating bath such that at least a plating surface of the substrate is exposed to electrolyte. One or more electrical contacts established with the substrate surface are employed to drive an electrical current through the electroplating cell and deposit metal onto the substrate surface from metal ions available in the electrolyte. Typically, the electrical contact elements are used to form an electrical connection between the substrate and a bus bar acting as a current source.

[0004] The background provided herein is for the purposes of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent that it is described in this background, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the disclosure.SUMMARY

[0005] Details of one or more implementations of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages will become apparent from the description, the drawings, andDocket No. LAM1P065WO the claims. The following, non-limiting implementations are considered part of the disclosure; other implementations will be evident from the entirety of this disclosure and the accompanying drawings as well.

[0006] In some implementations, an electroplating system may be provided. The system may have N electroplating cells having a first electroplating cell and a second electroplating cell. Each electroplating cell may be configured to perform an electroplating operation on a substrate having a notch, may have an electrical contact apparatus having a plurality of electrical contact fingers arranged around a center axis and extending in a radially inward direction toward the center axis, and may have a cup assembly fixedly connected to the electrical contact apparatus and configured to hold and position the substrate in contact with the plurality of electrical contact fingers during the electroplating operation, each electrical contact finger may have a width W transverse to the radial direction and is circumferentially offset from each adjacent electrical contact finger by an offset distance greater than W, each cup assembly may be configured to rotate the electrical contact apparatus to a plurality of rotational positions, the cup assembly of the first electroplating cell may be configured to be positioned in a first rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the first electroplating cell to contact a plurality of first locations on the substrate during a first electroplating operation in the first electroplating cell, the cup assembly of the second electroplating cell may be configured to be positioned in a second rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the second electroplating cell contact a plurality of second locations on the substrate during a second electroplating operation in the second electroplating cell, the first rotational position may be different than the second rotational position with respect to the notch of the substrate, and the first locations may be in different locations on the substrate than the second locations.

[0007] In some implementations, the system may further include a transfer robot having an end effector and configured to load the substrate into the first electroplating cell while the notch of the substrate is at a notch position with respect to the end effector, and load the substrate into the second electroplating cell while the notch of the substrate is at the notch position with respect to the end effector.

[0008] In some implementations, the system may further include a controller with one or more processors and one or more memories that store instructions for controlling the cup assembly of each electroplating cell. The instructions may be configured to cause the one or more processors to cause the cup assembly of the first electroplating cell to be positioned in the first rotational position for the first electroplating operation in the first electroplating cell, and theDocket No. LAM1P065WO cup assembly of the second electroplating cell to be positioned in the second rotational position, different than the first rotational position, for the second electroplating operation in the second electroplating cell.

[0009] In some such implementations, the instructions may be further configured to cause the one or more processors to cause the cup assembly of the second electroplating cell to rotate from another rotational position, different than the second rotational position, to the second rotational position before positioning the substrate into the second electroplating cell.

[0010] In some such implementations, the instructions may be further configured to cause the one or more processors to determine an available electroplating cell of the N electroplating cells that is available for the second electroplating operation, cause, in response to the determination, the available electroplating cell to be positioned in the second rotational position, cause the substrate to be transferred into the available electroplating cell after the available electroplating cell is in the second rotational position, and perform the second electroplating operation in the available electroplating cell while the electrical contact fingers of the available electroplating cell contact the plurality of second locations on the substrate.

[0011] In some implementations, the N electroplating cells further has a third electroplating cell, the cup assembly of the third electroplating cell is configured to be positioned in a third rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the third electroplating cell contact a plurality of third locations on the substrate during a third electroplating operation in the third electroplating cell, the third rotational position is different than the first rotational position and the second rotational position with respect to the notch of the substrate, and the third locations are in different locations on the substrate than the first locations and the second locations.

[0012] In some such implementations, a rotational direction between the first rotational position and the second rotational position may be a first rotational direction, and a rotational direction between the first rotational position and the third rotational position may be a second rotational direction opposite the first rotational position.

[0013] In some implementations, a rotational distance between the first rotational position and the second rotational position may be at least 0.1 degrees.

[0014] In some implementations, the cup assembly of the first electroplating cell may be configured to be positioned in a third rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the first electroplating cell to contact a plurality of third locations on the substrate during a third electroplating operation in the first electroplating cell, the third rotational position may be different than the first rotational positionDocket No. LAM1P065WO and the second rotational position with respect to the notch of the substrate, and the third locations may partially overlap with the first locations.

[0015] In some implementations, N may be greater than two, the electrical contact fingers of each electrical contact apparatus may be radially offset from immediately adjacent electrical contact fingers by an offset distance greater than W * (N -1), and the electroplating system may be configured to position the cup assembly of each electroplating cell such that the electrical contact fingers of each electroplating cell contact the substrate at different locations than where the electrical contact fingers of the other electroplating cells contact the substrate.

[0016] In some implementations, a method for electroplating is provided. The method mayh include providing a substrate having a notch to an electroplating system having N electroplating cells, in which each electroplating cell is configured to perform an electroplating operation, has an electrical contact apparatus having a plurality of electrical contact fingers, and has a cup assembly, in which the cup assembly is fixedly connected to the electrical contact apparatus, in which the cup assembly is configured to hold and position the substrate in contact with the plurality of electrical contact fingers during the electroplating operation, in which the electrical contact fingers are arranged in a substantially equally spaced arrangement around a center axis, extend radially inward toward the center axis, have a radial width W and are radially offset from immediately adjacent electrical contact fingers by an offset distance greater than W, and in which each cup assembly is configured to rotate the electrical contact apparatus to a plurality of rotational positions, positioning the cup assembly and electrical contact apparatus of a first electroplating cell in a first rotational position with respect to the notch of the substrate, positioning the substrate into the first electroplating cell while the cup assembly and electrical contact apparatus of the first electroplating cell are in the first rotational position with respect to the notch of the substrate and thereby causing the electrical contact fingers of the first electroplating cell to contact a plurality of first locations on the substrate, performing a first electroplating operation on the substrate in the first electroplating cell, positioning the cup assembly and electrical contact apparatus of a second electroplating cell in a second rotational position with respect to the notch of the substrate, in which the second rotational position is different than the first rotational position with respect to the notch of the substrate, positioning the substrate into the second electroplating cell while the cup assembly and electrical contact apparatus of the second electroplating cell are in the second rotational position with respect to the notch of the substrate and thereby causing the electrical contact fingers of the second electroplating cell to contact a plurality of second locations on the substrate, in which the first locations are in different locations on the substrate than the second locations, and performingDocket No. LAM1P065WO a second electroplating operation on the substrate in the second electroplating cell.

[0017] In some implementations, the positioning the substrate into the first electroplating cell may include loading the substrate into the first electroplating cell while the notch of the substrate is at a notch position with respect to an end effector supporting the substrate, and the positioning the substrate into the second electroplating cell may include loading the substrate into the second electroplating cell while the notch of the substrate is at the notch position with respect to the end effector supporting the substrate.

[0018] In some implementations, positioning the cup assembly and electrical contact apparatus of the second electroplating cell in the second rotational position may include rotating the cup assembly and electrical contact apparatus from another rotational position, different than the second rotational position, to the second rotational position before positioning the substrate into the second electroplating cell.

[0019] In some implementations, the method further includes determining an available electroplating cell of the N electroplating cells that is available for the second electroplating operation, positioning, in response to the determining, the cup assembly and electrical contact apparatus of the available electroplating cell in the second rotational position, transferring the substrate from the first electroplating cell to the available electroplating cell after the cup assembly and electrical contact apparatus of the available electroplating cell are in the second rotational position, and performing the second electroplating operation in the available electroplating cell while the electrical contact fingers of the available electroplating cell contact the substrate at the plurality of second locations.

[0020] In some implementations, the method further includes positioning the cup assembly and electrical contact apparatus of a third electroplating cell in a third rotational position with respect to the notch of the substrate, in which the third rotational position is different than the first rotational position and the second rotational position with respect to the notch of the substrate, transferring the substrate from the second electroplating cell to the third electroplating cell, positioning the substrate into the third electroplating cell while the cup assembly and electrical contact apparatus of the third electroplating cell are in the third rotational position with respect to the notch of the substrate and thereby causing the electrical contact fingers of the third electroplating cell to contact a plurality of third locations on the substrate, in which the first locations and the second locations are in different locations on the substrate than the third locations, and performing a third electroplating operation on the substrate in the third electroplating cell.

[0021] In some implementations, a rotational distance between the first rotational position andDocket No. LAM1P065WO the second rotational position may be at least 0.1 degrees.

[0022] In some implementations, an electrical contact apparatus for an electroplating cup assembly is provided. The electrical contact apparatus may include a body portion extending at least partially around a central axis, and a plurality of electrical contacts arranged circumferentially around the central axis and extending radially inward toward the central axis from the body portion. Each electrical contact may have a proximal portion coupled to the body portion, and a distal portion configured to contact a substrate and move relative to the body portion in a direction parallel to the central axis and forming an included angle ranging from about 45 degrees to 145 degrees relative to the proximal portion, wherein the distal portion has an average surface roughness (Ra) of about 5 micro-inches or less.

[0023] In some implementations, the end portion of each electrical contact may have an average surface roughness (Ra) of about 3 micro-inches or less.

[0024] In some implementations, a top surface of the distal portion of each electrical contact may span from the proximal portion to a distal end of the distal portion, and may have a planar portion and the end portion, and the planar portion and the end portion may have an average surface roughness (Ra) of about 5 micro-inches or less.

[0025] In some such implementations, at least 70% of the top surface of the distal portion of each electrical contact may have an average surface roughness Ra of about 5 micro-inches or less.

[0026] In some such implementations, the edges of the top surface of the distal portion of each electrical contact may intersect with sides of the distal portion, and the edges may be curved.

[0027] In some implementations, the end portion of each electrical contact may have one or more curved surfaces.

[0028] In some implementations, the end portion of each electrical contact may have a curved surface that spans from the distal end to a planar portion, and may have a radius of about 0.0015 inches and 0.004 inches.

[0029] In some implementations, each electrical contact may have a width transverse to the radial direction and has a thickness, the thickness may be between about 0.00325 inches and 0.00275 inches, and the width may be between about 0.05 inches and 0.03 inches.

[0030] In some implementations, each electrical contact may have a width W transverse to the radial direction, may be interposed between two immediately adjacent electrical contact fingers, and may be circumferentially offset from each immediately adjacent electrical contact finger by an offset distance greater than 0.25W.

[0031] Additional aspects will be set forth in the detailed description which follows, and, inDocket No. LAM1P065WO part, will be apparent from the disclosure, or may be learned by practice of the disclosed implementations and / or the claimed subject matter.

[0032] The foregoing general description and the following detailed description are illustrative and explanatory and are intended to provide further explanation of the claimed subject matter.BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Various implementations disclosed herein are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings, in which like reference numerals refer to similar elements.

[0034] Figure 1 presents an example of an electroplating cell in which electroplating may occur.

[0035] Figure 2 provides a more detailed cross-sectional view of the substrate holding component of the electroplating apparatus of Figure 1.

[0036] Figure 3 depicts a cross-sectional schematic of a portion of a clamshell assembly of Figure 2.

[0037] Figure 4 depicts a plan view of an example electrical contact apparatus.

[0038] Figure 5A depicts a magnified portion of the electrical contact apparatus of Figure 4.

[0039] Figure 5B depicts a magnified portion of another electrical contact apparatus.

[0040] Figure 6 depicts a cross-sectional side view slice of the portion of the electrical contact apparatus of Figure 3.

[0041] Figure 7A depicts a magnified side view of a portion of the electrical contact finger of Figure 6.

[0042] 7B depicts a magnified side view of a portion of another electrical contact finger.

[0043] Figure 7C depicts a cross-sectional view of a distal portion of the electrical contact finger of Figure 7B taken along section line A- A in Figure 7B.

[0044] Figure 7D depicts a top view of the electrical contact finger of Figure 7B.

[0045] Figure 8 depicts a plan view of an electrical contact apparatus according to various implementations .

[0046] Figures 9 A depicts a magnified portion of the electrical contact apparatus of Figure 8.

[0047] Figure 9B depicts the electrical contact apparatus of Figure 9 A with additional aspects.

[0048] Figures 10A to 10C depict a substrate positioned on electrical contact apparatuses of three different electroplating cells.

[0049] Figure 11 depicts a first example technique for electroplating.

[0050] Figure 12 shows a schematic of a top view of an example electrodeposition apparatus.Docket No. LAM1P065WO

[0051] Figure 13 shows a schematic of a top view of another example electrodeposition apparatus.

[0052] Figure 14 depicts a plan view of another example electrical contact apparatus.

[0053] Figures 15A-15E depict a plurality of electrical contact apparatuses at three different rotational positions with respect to a wafer notch.

[0054] Figure 16 depicts a magnified, detail view of Figure 15E.

[0055] Figure 17 depicts another electroplating technique.

[0056] Figure 18 provides yet another electroplating technique.

[0057] Figure 19 depicts a magnified detail view of electrical contacts similar to that of Figure 16.DETAILED DESCRIPTION

[0058] In the following description, numerous specific details are set forth in order to provide a thorough understanding of various implementations. The disclosed implementations may be practiced without some or all of these specific details. In other instances, well-known process operations have not been described in detail to not unnecessarily obscure the disclosed implementations. While the disclosed implementations will be described in conjunction with specific implementations, it will be understood that it is not intended to limit the disclosed implementations .

[0059] In this application, the terms “semiconductor wafer,” “wafer,” “substrate,” “wafer substrate” and “partially fabricated integrated circuit” are used interchangeably. One of ordinary skill in the art would understand that the term “partially fabricated integrated circuit” can refer to a silicon wafer during any of many stages of integrated circuit fabrication thereon. A wafer or substrate used in the semiconductor device industry typically has a diameter of 200 mm, or 300 mm, or 450 mm. In addition to semiconductor wafers, other work pieces that may take advantage of the disclosed implementations include various articles, such as printed circuit boards, magnetic recording media, magnetic recording sensors, mirrors, optical elements, micro-mechanical devices, and the like.

[0060] Further, the terms “electrolyte,” “plating bath,” “bath,” and “plating solution” are used interchangeably. These terms may generally refer to catholyte (electrolyte present in a cathode chamber or cathode chamber recirculation loop), or to anolyte (electrolyte present in an anode chamber or anode chamber recirculation loop). The following detailed description assumes the disclosure is implemented on a wafer. However, the disclosure is not so limited. The wafer may be of various shapes, sizes, and materials. In addition to semiconductor wafers, otherDocket No. LAM1P065WO work pieces that may take advantage of this disclosure include various articles such as printed circuit boards and the like.Introduction and Context

[0061] During electroplating, an electrical current is driven through the electroplating cell and the substrate. Electrical contact is made with the substrate using a plurality of electrical contact fingers that can number at least 100, 200, 300, 400, or 500 electrical contact fingers, in some examples (the electrical contact fingers may also be referred to herein as “contact fingers” or “fingers). However, these electrical contact fingers can cause unwanted damage to the substrate. For example, some substrates may have one or more conductive top layers and one or more underlayers beneath the one or more conductive top layers, and some electrical contact fingers can penetrate and / or scratch the one or more conductive top layers and expose the one or more underlayers. This damage to the one or more conductive top layers and resulting exposure of the one or more underlayers may be unwanted; some processes may require limited or no damage to the one or more conductive top layers, and limited or no exposure of the one or more underlayers.

[0062] Provided herein are new and novel electrical contact fingers, systems, and techniques for use in electroplating that reduce or prevent unwanted damage to the substrate. Some implementations have an electrical contact apparatus with a plurality of electrical contact fingers, e.g., at least 100, 200, 300, 400, or 500 contact fingers, arranged around a center axis and spaced substantially equally apart from each other around the center axis. For some wafers that have an outer diameter of about 300 mm, the number of contacts may range from about 50 to at least 500, in some instances, while for some wafers that have an outer diameter of 200 mm, the number of fingers may be less such as at least 25 to at least 200, for example. The electrical contact fingers provided herein have various features that may individually, or in combination, reduce or prevent damage to the substrate by the electrical contact fingers. For example, while many electrical contact fingers may have an average surface roughness, or Roughness Average Ra, of about 100 micro-inches (pin), some implementations of the electrical contact fingers provided herein have a roughness average Ra of 50 pin or less, 25 pin or less, 20 pin or less, 15 pin or less, 10 pin or less, 5 pin or less, or 3 pin or less, which reduces or prevents damage to the substrate.

[0063] In another example, the electrical contact fingers are configured to exert a lower force against the substrate by decreasing the thickness of each electrical contact finger. For instance, some electrical contact fingers have a thickness of about 0.004 inches and some implementations of the electrical contact fingers described herein have a thickness of aboutDocket No. LAM1P065WO0.003 inches or less which was found to decrease the amount of force exerted by each electrical contact finger against the substrate by about 50% as compared to the electrical contact fingers that are 0.004 inches thick. Some implementations may have a thickness of about 0.004 inches, between about 0.00325 inches and about 0.00275 inches, or less. In yet another example, some implementations of the electrical contact fingers herein may each have a distal end with a shape configured to reduce or prevent unwanted damage to the substrate. This may include a beveled edge, a chamfered edge, a tapered edge, and / or one or more rounded edges.

[0064] Some implementations may have an electroplating system with a plurality of electroplating cells (which may also be referred to herein as “cells”) and these systems are configured to provide electrical contact to a substrate at unique locations in the electroplating cells. For example, a single substrate may be electroplated in multiple electroplating cells and contacted by the electrical contact fingers of each cell at unique locations such that one location of the substrate is contacted by only one respective electrical contact finger. In other words, no electrical contact finger contacts the same location on the substrate as another electrical contact finger in the multiple cells. The electrical contact fingers of each electroplating cell therefore contact the substrate at different locations than where the electrical contact fingers of the other electroplating cells contact the substrate.

[0065] In some of the electroplating systems, the electrical contact fingers may be spaced away from each other by an offset distance greater than the width of each electrical contact finger, such as by at least 2, 3, or 4 times the width of each electrical contact finger. In some instances, this configuration may include orienting the electrical contact apparatus of each electroplating cell at the same angular, or clocking, position and the substrate may be rotated between each electroplating cell. This can result in the electrical contact fingers of each electroplating cell contacting the substrate at a new, unique location respective to all the other fingers in the other cells. In some instances, this configuration may include orienting the electrical contact apparatus of each electroplating cell at different angular, or clocking, positions and the substrate may or may not be rotated between each electroplating cell. This again can result in the electrical contact fingers of each electroplating cell contacting the substrate at a new location.

[0066] It has been found that damage on the wafer and its underlayers can be caused when an electrical contact finger exerts a certain local pressure that exceeds a critical delamination load (for a given measurement probe tip area) and causes the finger to penetrate through the thickness of one or more of these underlayers. The roughness Ra value can affect this pressure because it can locally cause high film delamination force at small protrusions and / or sharpDocket No. LAM1P065WO edges. The value of Ra may be affected by the pressure (force / area) applied to the substrate. For instance, a higher Ra can be used if the force exerted by the finger is less. This pressure may also be affected by the number of contacts, the pressure of the cup / clamshell, the individual contact finger geometries (length, amount of deflection, thickness, etc.), as well as the touch point surface area. The systems provided herein have various configurations for reducing or preventing unwanted damage to the substrate.Electroplating Systems and Techniques

[0067] Figure 1 presents an example of an electroplating cell in which electroplating may occur. Often, an electroplating apparatus includes one or more electroplating cells in which the substrates (e.g., wafers) are processed. Only one electroplating cell is shown in Figure 1 to preserve clarity. To optimize bottom-up electroplating, additives (e.g., accelerators, suppressors, and levelers) are added to the electrolyte; however, an electrolyte with additives may react with the anode in undesirable ways. Therefore anodic and cathodic regions of the plating cell are sometimes separated by a membrane so that plating solutions of different composition may be used in each region. Plating solution in the cathodic region is called catholyte; and in the anodic region, anolyte. A number of engineering designs can be used in order to introduce anolyte and catholyte into the plating apparatus.

[0068] Referring to Figure 1, a diagrammatical cross-sectional view of an electroplating apparatus 101 in accordance with one implementation is shown. The plating bath 103 contains the plating solution (having a composition as provided herein), which is shown at a level 105. The catholyte portion of this vessel is adapted for receiving substrates in a catholyte. A wafer 107 is immersed into the plating solution and is held by, e.g., a “clamshell” substrate holder 109, mounted on a rotatable spindle 111, which allows rotation of clamshell substrate holder 109 together with the wafer 107. A general description of a clamshell-type plating apparatus having aspects suitable for use with this invention is described in detail in US Patent 6,156,167 issued to Patton et al., and US Patent 6,800,187 issued to Reid et al., which are incorporated herein by reference in their entireties. As used herein a clamshell may also be referred to herein as a cup assembly.

[0069] An anode 113 is disposed below the wafer within the plating bath 103 and is separated from the wafer region by a membrane 115, preferably an ion selective membrane. For example, Nafion™ cationic exchange membrane (CEM) may be used. The region below the anodic membrane is often referred to as an “anode chamber.” The ion-selective anode membrane 115 allows ionic communication between the anodic and cathodic regions of the plating cell, while preventing the particles generated at the anode from entering the proximity of the wafer andDocket No. LAM1P065WO contaminating it. The anode membrane is also useful in redistributing current flow during the plating process and thereby improving the plating uniformity. Detailed descriptions of suitable anodic membranes are provided in US Patents 6,126,798 and 6,569,299 issued to Reid et al., both incorporated herein by reference in their entireties. Ion exchange membranes, such as cationic exchange membranes, are especially suitable for these applications. These membranes are typically made of ionomeric materials, such as perfluorinated co-polymers containing sulfonic groups (e.g. Nafion™), sulfonated polyimides, and other materials known to those of skill in the art to be suitable for cation exchange. Selected examples of suitable Nafion™ membranes include N324 and N424 membranes available from Dupont de Nemours Co.

[0070] During plating the ions from the plating solution are deposited on the substrate. The metal ions must diffuse through the diffusion boundary layer and into the TSV hole or other feature. A typical way to assist the diffusion is through convection flow of the electroplating solution provided by the pump 117. Additionally, a vibration agitation or sonic agitation member may be used as well as wafer rotation. For example, a vibration transducer 108 may be attached to the cup assembly substrate holder 109.

[0071] The plating solution is continuously provided to plating bath 103 by the pump 117. Generally, the plating solution flows upwards through an anode membrane 115 and a diffuser plate 119 to the center of wafer 107 and then radially outward and across wafer 107. The plating solution also may be provided into the anodic region of the bath from the side of the plating bath 103. The plating solution then overflows plating bath 103 to an overflow reservoir 121. The plating solution is then filtered (not shown) and returned to pump 117 completing the recirculation of the plating solution. In certain configurations of the plating cell, a distinct electrolyte is circulated through the portion of the plating cell in which the anode is contained while mixing with the main plating solution is prevented using sparingly permeable membranes or ion selective membranes.

[0072] A reference electrode 131 is located on the outside of the plating bath 103 in a separate chamber 133, which chamber is replenished by overflow from the main plating bath 103. Alternatively, in some implementations the reference electrode is positioned as close to the substrate surface as possible, and the reference electrode chamber is connected via a capillary tube or by another method, to the side of the wafer substrate or directly under the wafer substrate. In some of the preferred implementations, the apparatus further includes contact sense leads that connect to the wafer periphery and which are configured to sense the potential of the metal seed layer at the periphery of the wafer but do not carry any current to the wafer.

[0073] A reference electrode 131 is typically employed when electroplating at a controlledDocket No. LAM1P065WO potential is desired. The reference electrode 131 may be one of a variety of commonly used types such as mercury / mercury sulfate, silver chloride, saturated calomel, or copper metal. A contact sense lead in direct contact with the wafer 107 may be used in some implementations, in addition to the reference electrode, for more accurate potential measurement (not shown).

[0074] A DC power supply 135 can be used to control current flow to the wafer 107. The power supply 135 has a negative output lead 139 electrically connected to wafer 107 through one or more slip rings, brushes and contacts (not shown). The positive output lead 141 of power supply 135 is electrically connected to an anode 113 located in plating bath 103. The power supply 135, a reference electrode 131, and a contact sense lead (not shown) can be connected to a system controller 147, which allows, among other functions, modulation of current and potential provided to the elements of electroplating cell. For example, the controller may allow electroplating in potential-controlled and current-controlled regimes. The controller may include program instructions specifying current and voltage levels that need to be applied to various elements of the plating cell, as well as times at which these levels need to be changed. When forward current is applied, the power supply 135 biases the wafer 107 to have a negative potential relative to anode 113. This causes an electrical current to flow from anode 113 to the wafer 107, and an electrochemical reduction (e.g. Cu2++ 2 c' = Cu°) occurs on the wafer surface (the cathode), which results in the deposition of the electrically conductive layer (e.g. copper) on the surfaces of the wafer. An inert anode 114 may be installed below the wafer 107 within the plating bath 103 and separated from the wafer region by the membrane 115.

[0075] The apparatus may also include a heater 145 for maintaining the temperature of the plating solution at a specific level. The plating solution may be used to transfer the heat to the other elements of the plating bath. For example, when a wafer 107 is loaded into the plating bath the heater 145 and the pump 117 may be turned on to circulate the plating solution through the electroplating apparatus 101, until the temperature throughout the apparatus becomes substantially uniform. In one implementation the heater is connected to the system controller 147. The system controller 147 may be connected to a thermocouple to receive feedback of the plating solution temperature within the electroplating apparatus and determine the need for additional heating.

[0076] The controller will typically include one or more memory devices and one or more processors. The processor may include a CPU or computer, analog and / or digital input / output connections, stepper motor controller boards, etc. In certain implementations, the controller controls all of the activities of the electroplating apparatus. Non-transitory machine-readableDocket No. LAM1P065WO media containing instructions for controlling process operations in accordance with the present implementations may be coupled to the system controller.

[0077] Figure 2 provides a more detailed cross-sectional view of the substrate holding component 109 (the cup / cone assembly or clamshell assembly) of the electroplating apparatus of Figure 1, including a cross-sectional view of cup 101 and cone 103. Note that the cup / cone assembly 109 depicted in Figure 2 is not intended to be proportionately accurate. Cup 101, having cup bottom 102, supports a lipseal 143, the electrical contact fingers 144, bus bar, and other elements, and is itself supported by top plate 105 via struts 104. Generally, a substrate 145 rests on the lipseal 143, just above the electrical contact fingers 144, which may be configured to support it. Cup 101 also includes an opening 191 through which an electroplating bath solution may contact the substrate 145. Note that electroplating takes place on the front side 142 of substrate 145. Thus, the periphery of substrate 145 rests on a bottom inward protrusion of the cup 101 (e.g., “knife- shaped” edge) referred to as the cup bottom 102, or more specifically on lipseal 143 which is positioned on the radially inward edge of the cup bottom 102. In some implementations, there may also be an additional seal 149 located between the cup 101 and the cone 103, which engages the surfaces of the cup 101 and cone 103 to generally form a substantially fluid-tight seal when the cone 103 engages the substrate 145.

[0078] Cone 103 presses down on the back side of substrate 145 to engage it and hold it in place and to seal it against lipseal 143 during submersion of the substrate into the electroplating bath during electroplating. The vertical force from cone 103, which is transferred through substrate 145 compresses lipseal 143 to form a fluid tight seal. The lipseal 143 may prevent electrolyte from contacting the backside of substrate 145 (where it could introduce contaminating metal atoms directly into silicon) and from reaching sensitive components of apparatus 100, such as the electrical contact fingers that establish electrical connections to edge portions of substrate 145. This electrical connection and associated electrical contact fingers 144, themselves sealed and protected by the lipseal from becoming wet, is used to supply current to conductive portions of substrate 145 that are exposed to the electrolyte.

[0079] To load a substrate 145 into cup / cone assembly 109, cone 103 is lifted from its depicted position via spindle 106 until there is a sufficient gap between the cup 101 and the cone 103 to allow insertion of substrate 145 into the cup / cone assembly 109. The substrate 145 is then inserted, in some implementations by a robot arm, and allowed to rest lightly on the lipseal and cup bottom 102. In some implementations, the cone 103 is lifted from its depicted position until it touches top plate 105. Subsequently, the cone 103 is then lowered to press and engage the substrate against the periphery of cup 101 (the cup bottom 102) or attached lipseal 143 asDocket No. LAM1P065WO depicted in Figure 2. In some implementations, the spindle 106 transmits both a vertical force for causing the cone 103 to engage the substrate 145, and also the torque for rotating the cup / cone assembly 109 as well as the substrate 145 being held by the cup / cone assembly. Figure 2 indicates the directionality of the vertical force and rotational orientation of the torque by solid arrows 150 and dashed arrows 152, respectively. In some implementations, electroplating of the substrate 145 may occurs while the substrate 145 is stationary, while in other implementations the substrate 145 may be moved or rotated during electroplating. This may advantageously prevent the electrical contact fingers 144 from damaging the top surface 142 of the substrate 145. In some implementations, the substrate 145 has one or more conductive top layers, which may include the top surface 142, and one or more underlayers, and the electrical contact fingers 144 are in contact with the top surface 142 and the one or more conductive top layers.

[0080] As described herein, the assembly 109 has an electrical contact apparatus, which may be referred to as a contact ring in some implementations, having a plurality of flexible electrical contact fingers. When the cone 103 presses the substrate 145 downwards, the substrate 145 applies a force to the electrical contact fingers, causing the electrical contact fingers to flexibly move (e.g., in a spring-like action). This contact between the substrate 145 and the electrical contact fingers establishes an electrical connection. Figure 3 depicts a cross-sectional schematic of a portion of the cup assembly of Figure 2. Here, the portion of the assembly illustrates a portion of the cone 103, a portion of the substrate 145 with its one or more conductive top layers 142, and the cup 101 that has a plurality of electrical contact fingers 144; only one electrical contact finger is shown for clarity.

[0081] The electrical contact fingers 144 are configured to make a point contact with the substrate 145, and this point contact has a relatively small contact area. When a tip, or distal end, of the electrical contact finger 144 contacts the substrate 145, the electrical contact finger 144 flexibly moves or bends, but with sufficient resistance to provide a force against the substrate 145. Each electrical contact finger 144 has a proximal portion 160 and a distal portion 162. The proximal portion 160 of the electrical contact finger 144 is connected to a body portion of the electrical contact apparatus (not labeled here). The distal portion 162 is connected to the proximal portion 160 and has an end portion 166 that may have the tip or distal end of the finger which contacts the substrate 145.

[0082] As mentioned above, the contact by the electrical contact finger 144 against the substrate 145 can cause unwanted damage to the substrate 145, including the one or more conductive top layers and one or more underlayers. In some implementations, the electricalDocket No. LAM1P065WO contact fingers 144 have various configurations that reduce damage caused to the substrate.

[0083] Figure 4 depicts a plan view of an example electrical contact apparatus. The illustrated electrical contact apparatus 170 has a body portion 172 extending around a center axis 174. In some implementations, like shown, the body portion 172 may be a ring or have an annular shape. The electrical contact apparatus 170 also has a plurality of electrical contact fingers 144, four of which are labeled. Although the electrical contact apparatus 170 in Figure 4 has 85 electrical contact fingers, some implementations of the electrical contact apparatus may have at least 300 electrical contact fingers, at least 400 electrical contact fingers, or at least 500 electrical contact fingers. The plurality of electrical contact fingers is also arranged in an equally, or substantially equally (e.g., within 1%, 5%, or 10%), spaced manner about the center axis 174. When viewed along the center axis 174, like in Figure 4, each electrical contact finger extends in a radial direction R inwards towards the center axis 174.

[0084] In some implementations, the electrical contact apparatus may have a plurality of segments, with each segment having a set of the electrical contact fingers. Figure 14 depicts a plan view of another example electrical contact apparatus. Here, the apparatus 1470 has four segments 1480A-1480D that each has a body portion segment and a subset of electrical contact fingers 144.

[0085] Each electrical contact finger is configured to be movable, such as flexibly movable or elastically movable, in a direction parallel to the center axis 174. Referring back to Figure 3, the center axis 174 is illustrated and the electrical contact finger 144 is configured to move in the direction of the center axis 174. Figure 6 depicts a cross-sectional side view slice of the portion of the electrical contact apparatus of Figure 3. For this electrical contact apparatus 170, the body portion 172 and one electrical contact finger 144 are shown. Similar to Figure 3, the electrical contact finger 144 here in Figure 6 has the proximal portion 160 connected to the body portion 172. The distal portion 162 is connected to the proximal portion 160 and an included angle 9 is formed between the distal portion 162 and the proximal portion 160. In some implementations, the included angle 9 may range between about 45 degrees and 145 degrees, between about 100 degrees and about 120 degrees, and may be, for example, about 90 degrees, about 100 degrees, about 120 degrees.

[0086] In some implementations, the electrical contact finger 144 is also offset below the body portion 172 along the center axis 174 when viewed perpendicular to the center axis 174. The electrical contact finger 144 is also shown extending, in part, in the radial direction R towards the center axis 174, and also offset at a second angle y with respect to the plane of the body portion 172. The second angle y may range from about 15 degrees to about 75 degrees, or fromDocket No. LAM1P065WO about 30 degrees to about 60 degrees, in some instances. The included angle 9 and the second angle y may provide sufficient interaction with the cup, lipseal, and substrate.

[0087] The distal portion 162 of the electrical contact finger 144 has the end portion 166 which is encircled with a dashed ellipse. This end portion 166 may have the tip or distal end of the finger 144 which contacts the substrate 145. In some implementations, the average surface roughness Ra of the end portion 166 may be about 50 micro-inches or less, about 30 microinches or less, about 25 micro-inches or less, about 20 micro-inches or less, about 15 microinches or less, about 12 micro-inches or less, about 10 micro-inches or less, about 5 pin or less, about 4 pin or less, or about 3 pin or less. These ranges of average surface roughness Ra have been found to reduce or eliminate damage to the substrate.

[0088] In some implementations, the shape of the electrical contact finger 144 may be configured to reduce or eliminate damage to the substrate. For example, the end portion 166 of the electrical contact finger 144 in some implementations may be chamfered, beveled, have a varying cross-sectional thickness, e.g., tapered, have one or more curved surfaces, or a combination thereof. Figure 7 A depicts a magnified side view of a portion of the electrical contact finger of Figure 6. Here, the included angle 9 between the distal portion 162 and the proximal portion 160 is visible along with the end portion 166 of the distal portion 162. In this example, the end portion 166 is chamfered and has a plurality of curved surfaces 176A-176C. In some instances, the combination of curved surfaces and chamfering or beveling may reduce or eliminated damage to the substrate. In some implementations, the end portion 166 may be considered to have a varying cross-sectional thickness tl, like depicted in Figure 7A. This varying thickness may be considered a tapering. This cross-sectional thickness tl may range from 0.0 inches to about 0.003 inches, in some implementations.

[0089] The electrical contact finger 144 may have an average nominal thickness that is configured to reduce the force exerted on the substrate, in some implementations. For example, the proximal portion 160 and the distal portion 162 may have the same average nominal thickness t2, as identified in Figure 7A. In some implementations, the thickness t2 may range from about 0.0045 inches to about 0.002 inches. In some instances, this thickness t2 may range between about 0.00325 inches and 0.00275 inches and may be, in some instances, about 0.003 inches + / - 0.0005 inches. In some implementations, the thickness t2 may be less than 0.00275 inches, such as 0.0025 inches or less, 0.00225 inches or less, or 0.002 inches or less. In one instance, it was advantageously found that electrical contact fingers having a thickness t2 of about 0.003 inches exerted a force against the substrate that was about 50% less than the force exerted against a substrate by electrical contact fingers having a thickness t2 of about 0.004Docket No. LAM1P065WO inches. Many existing electrical contact fingers have a thickness t2 of about 0.004 inches, and by reducing the thickness to between about 0.00325 inches and 0.00275 inches, the force exerted against the substrate can be significantly decreased. This reduced force advantageously reduces or prevents, alone or in combination with the other features of the electrical contact fingers provided herein, damage to the substrate.

[0090] In some implementations, the shape of the electrical contact finger may have one or more curved surfaces. Figure 7B depicts a magnified side view of a portion of another electrical contact finger. This electrical contact finger 744 may be similar to electrical contact finger 144 shown in Figure 7A, with noted differences. As can be seen, the end portion 766 of the electrical contact finger 744 has one or more curved surfaces, such as a partial oval or partial elliptical section. In this example of Figure 7B, the end portion 766 has the curved surface 176A like in Figure 7A and another curved surface 776B, highlighted with a heavy-weight line width, that spans from the distal end 777 to a planar portion 779. In some implementations, the curved surface 776B may have a radius, such as between 0.0015 inches and 0.004 inches, such as 0.002 and 0.003 inches.

[0091] This planar portion 779 and curved surface 776B may have the average surface roughness provided herein, such as about 10 micro-inches or less, about 5 pin or less, about 4 pin or less, or about 3 pin or less. In some implementations, like illustrated, the distal portion 162 has a top surface 781 that spans from the proximal portion 160 to the distal end 777 and includes the planar portion 779 and the curved portion 776B. This top surface 781, including the planar portion 779 and the curved surface 776B, may have the average surface roughness described herein, such as about 5 pin or less, about 4 pin or less, or about 3 pin or less. This may include at least 50% of the planar portion, at least 60% of the planar portion, at least 70% of the planar portion, at least 80% of the planar portion, and at least 90% of the planar portion having this average surface roughness. In some instances, this configuration having curved surfaces may advantageously reduce or eliminate damage to the substrate. In some implementations, the end portion 766 may be considered to have a varying cross-sectional thickness t2, like depicted in Figure 7B. This cross-sectional thickness tl may range from 0.001 inches to about 0.003 inches, in some implementations.

[0092] In some implementations, additional edges of the distal portion may be radiused. This may include the edges of the top surface. Figure 7C depicts a cross-sectional view of a distal portion of the electrical contact finger of Figure 7B taken along section line A- A in Figure 7B. As can be seen, the electrical contact finger 744 has a width W and the top surface 781 of the distal portion 162 has the planar portion 779. Further, in this example illustration, the edges ElDocket No. LAM1P065WO and E2 of the top surface 781 are curved which advantageously prevents unwanted damage to a wafer. These curved edges El and E2 may have radiuses may range from about 0.005 inches to about 0.03 inches, including about 0.01 inches and 0.02 inches. These edges El and E2 may also have the average surface roughness provided herein, such as about 10 micro-inches or less, about 5 pin or less, about 4 pin or less, or about 3 pin or less. These edges El and E2 intersect with sides SI and S2, respectively, of the distal portion 162.

[0093] Similarly, Figure 7D depicts a top view of one example electrical contact finger of Figure 7B. Here, the sides SI and S2 are shown along with edges of the distal portion 162. These edges E3 and E4, viewed from the top, may have radiuses which may range from about 0.005 inches to about 0.03 inches, including about 0.01 inches and 0.02 inches.

[0094] Each electrical contact finger 144 may also have a width transverse to the radial direction. Figure 5A depicts a magnified portion of the electrical contact apparatus of Figure 4. Here in Figure 5A, four electrical contact fingers 144 are shown and labeled 144A-144D. Each of the electrical contact fingers 144 has a width W transverse, or perpendicular, to the radial direction R. The width W of electrical contact fingers 144A and 144D is identified. In some implementations, the width W of each electrical contact finger may be between about 0.05 inches and 0.025 inches, such as about 0.04 inches or about 0.03 inches. As also shown in Figures 4-5B, the electrical contact fingers 144 are offset from each other such that a gap, or offset, exists between each electrical contact finger 144. For example, each electrical contact finger 144 is interposed between two immediately adjacent electrical contact fingers and is circumferentially offset from each immediately adjacent electrical contact finger by an offset distance. In some implementations, this offset distance may be less than the width W, such as about half the width, and in other implementations, the offset distance may be greater than the width W.

[0095] For instance, referring to Figure 5A, electrical contact finger 144B is interposed between two immediately adjacent electrical contact fingers 144 A and 144C. Electrical contact finger 144B is also circumferentially offset from these two immediately adjacent electrical contact fingers 144A and 144C by an offset distance OD. Similarly, electrical contact finger 144C is interposed between two immediately adjacent electrical contact fingers 144B and 144D. Electrical contact finger 144C is also circumferentially offset from these two immediately adjacent electrical contact fingers 144B and 144D by the same offset distance OD. This may be the case for all the electrical contact fingers of the electrical contact apparatus 170 of Figure 4. As illustrated, some implementations may have the electrical contact fingers offset by the same, or substantially same (e.g., within at least 0.05%, 0.1%, 1%, or 5%), offsetDocket No. LAM1P065WO distance OD. Spacing the electrical contact fingers substantially equally around the center axis 174 advantageously provides uniform electroplating on the substrate.

[0096] In some implementations, the offset distance between the electrical contact fingers may be less than the width W of each electrical contact finger. Figure 5B depicts a magnified portion of another electrical contact apparatus. This portion is similar to that of Figure 5 A, with noted differences. As can be seen in Figure 5B, five electrical contact fingers 544 are shown and labeled 544A-544E. Each of the electrical fingers 544A-544E has the width W and a third offset distance OD3 between each of the electrical fingers 544A-544E is less than the width W. In some cases, the third offset distance OD3 may be equal to or less than the width W, such as W, equal to or less than 0.75W, equal to or less than 0.5, or equal to or less than 0.25W.

[0097] In some instances, the electrical contact apparatus 170 may be considered to have an annular body 172 having a central axis 174, and a plurality of electrical contact fingers 144 arranged circumferentially along an inner circumference 173 of the annular body 172 and directed radially inward toward the central axis. As illustrated in Figure 6, each contact finger 144 may have a proximal portion 160 coupled to the annular body 172, a distal portion 162, and being configured to flexibly move when a force is applied to the distal portion 162. In some implementations, the distal portion 162 has a surface roughness of 50 microinches or less and forms an angle 9 relative to the proximal portion 160 ranging from 45 degrees to 145 degrees.

[0098] Similar to above, in some implementations, the distal portion 162 of each contact finger 144 may have a tapered end portion 166, a beveled end portion 166, or a curved end portion 166. For example, Figures 7A-7C illustrate tapered and curved ends and edges. In some instances, each pair of adjacent electrical contact fingers 144 are circumferentially spaced from one another, such as shown in Figures 5A and 5B. Each electrical contact finger 144 may also be evenly spaced from the two immediate adjacent electrical contact fingers 144, as illustrated in Figures 4, 5A, 5B, and 8, for example. In some implementations, at least one electrical contact finger 144 is circumferentially offset from an adjacent electrical contact finger by an offset distance, such as the offset distance OD illustrated in Figure 5A, the third offset distance OD3 in Figure 5B, or the second offset distance OD2 in Figure 8. In some instances, each electrical contact finger 144 may have a width, like width W in Figure 5A, and the offset distance OD or OD2 may be greater than the width W of the electrical contact fingers 144. In some implementations, each electrical contact finger 144 has the width W and the offset distance OD is at least twice the width W of the electrical contact fingers 144. Similar to Figure 14, this annular body may instead be an annular segment that is not a full circle, in some instances. In some other cases, like illustrated in Figure 5B, each of the electrical fingers 544A-Docket No. LAM1P065WO544E may be offset from each other by the third offset distance OD3 which is less than the width W. The third offset distance OD3 may be equal to or less than W, equal to or less than 0.75W, equal to or less than 0.5, or equal to or less than 0.25W.

[0099] In some implementations, a substrate may undergo electroplating in an electroplating system with multiple electroplating cells. The electroplating system may have N electroplating cells and N may be two or more than two, such as at least three, four, five, six, eight, ten, or twelve. During such processing, the electrical contact fingers of each electroplating cell may be positioned in the same, or substantially same positions, e.g., clocking or rotational positions. When the substrate is placed in each electroplating cell of the system, it may be placed in the same rotational, or clocking position, as in other electroplating cells which in turn may cause the electrical contact fingers to contact the same locations on the substrate. By repeatedly contacting the substrate at the same locations in each electroplating, the substrate may be subjected to damage by the electrical contact fingers.

[0100] Accordingly, some electroplating systems provided herein may have electrical contact apparatuses in each electroplating cell that have electrical contact fingers circumferentially offset from each other by offset distances greater than the width W of each electrical contact finger, such as at least 2x, 3x, 4x, 5x, or lOx greater than the widths. This spacing of the electrical contact fingers is configured to provide unique contact locations between the electrical contact fingers and the substrate. For example, the electrical contact fingers of each electroplating cell contact the substrate at locations different than where the electrical contact fingers of the other electroplating cells contact the substrate. This may result in the substrate being contacted by each electrical contact finger at a unique and different location than any other electrical contact finger. This configuration may include rotating the wafer between each electroplating cell, rotating the electrical contact apparatus respectively between each electroplating cell (described farther below), or both.

[0101] Figure 8 depicts a plan view of an electrical contact apparatus according to various implementations. This apparatus 870 is similar to the apparatus 170 of Figure 4 and there are some noted differences. As can be seen, the electrical contact apparatus 870 has electrical contact fingers 844 that are spaced farther apart from each other than the apparatus 170 of Figure 4. In Figure 8, the electrical contact fingers 844 may be the same as provided above, such as having one or more of the features described in Figures 6-7C and which may include having an average surface roughness Ra less than 5 micro-inches and / or an end portion with beveled, chamfered, and or curved edges. The electrical contact fingers 844 of apparatus 870 are circumferentially offset from each immediately adjacent electrical contact finger by aDocket No. LAM1P065WO second offset distance OD2 that is greater than W and greater than the offset distance OD in Figures 4-5B, for example. Here, the second offset distance OD2 may be considered 2x, 3x, or 4x the width W.

[0102] Figure 9A depicts a magnified portion of the electrical contact apparatus of Figure 8 and Figure 9B depicts the electrical contact apparatus of Figure 9A with additional aspects. Figure 9A is similar to Figure 5 and here, the electrical contact fingers 844A and 844B are immediately adjacent from each other and offset from each other by the second offset distance OD2. In Figure 9B, the electrical contact fingers 144B and 144C from Figure 5 are shown as dashed lines to illustrate the larger spacing between electrical contact fingers 844A and 844B, and illustrate that such fingers may be considered removed in the example of electrical contact apparatus 870. By providing an offset distance between electrical contact fingers greater than the width W, or multiple times greater than the width W, of each electrical contact finger, unique contact locations can be provided between the substrate and the electrical contact fingers of the multiple electroplating cells.

[0103] In some instances, the spacing between the electrical contact fingers may be based, or dependent on, the number of electroplating cells, N, where the substrate will be positioned. In other words, the offset spacing between electroplating cells may be based on a relationship between the width W of each electrical contact finger and the number of electroplating cells the substrate will be positioned in. For example, the offset distance may be greater than the width W multiplied by one less than the number of electroplating cells, or W * (A-l). For example, if the substrate is to undergo electroplating in three different electroplating cells, then N is 3, and the offset distance is W * (3-1), which equals W * 2 or 2W. In this example, referring to Figures 9A and 9B, the second offset distance OD2 is greater than W * 2. Here, for illustration, the removed two electrical contact fingers 144B and 144C of Figure 5 show that electrical contact locations to the wafer have been removed in these locations to thereby provide unique contact locations for the wafer.

[0104] This concept is further illustrated in Figures 10A to 10C which depict a substrate positioned on electrical contact apparatuses of three different electroplating cells. In Figure 10A, a portion of a first electroplating cell is shown, and it has a portion of a first electrical contact apparatus 870A having the body portion 872A and three electrical contact fingers 844A1, 844B1, and 844C1; fingers 844A1 and 844B1 may be the same as those in Figures 9A and 9B. For example, these electrical contact fingers 844A1, 844B 1, and 844C1 are offset from each other by the second offset distance OD2 which may be greater than W * 2. Since this example in Figures 10A-10C has three electroplating cells, N is 3 and the resulting secondDocket No. LAM1P065WO offset distance is W * 2 or greater, per the above example.

[0105] In Figure 10A, the substrate 145 has been positioned on the first electrical contact apparatus 870A such that the three electrical contact fingers 844A1, 844B1, and 844C1 contact the substrate 145 at a plurality of first locations which are labeled as first locations 1078A, 1078B, and 1078C. Once in this position, the substrate 145 may undergo an electroplating operation in the first electroplating cell. Following this electroplating operation, the substrate 145 may be transferred by a transfer mechanism, such as a robot arm, from the first electroplating cell to a second electroplating cell.

[0106] In Figure 10B, a portion of the second electroplating cell is shown, and it has a portion of a second electrical contact apparatus 870B having the body portion 872B and three electrical contact fingers 844A2, 844B2, and 844C2. The electrical contact apparatus 870B may be the same as electrical contact apparatus 870A. In Figure 10B, there has been relative rotation between the substrate 145 and the contact apparatus 870B, as indicated by the dashed arrow, such that when the substrate 145 is positioned on the second electrical contact apparatus 870B, the three electrical contact fingers 844A2, 844B2, and 844C2 contact the substrate 145 at a plurality of second locations, locations 1080A, 1080B, and 1080C. These second locations 1080A, 1080B, and 1080C are in different locations on the substrate 145 than the first locations 1078 A, 1078B, and 1078C (partially visible here). This relative motion between the first electrical contact apparatus 870A and the second electrical contact apparatus 870B may be a rotational distance RD of between about the width W or W *2. This amount of rotation advantageously provides for sufficient spacing for the substrate to be contacted by the electrical contact fingers of each electroplating cell.

[0107] The first locations 1078 A, 1078B, and 1078C are shown here in Figure 10B and as can be seen, the electrical contact fingers 844A2, 844B2, and 844C2 do not contact these first locations and instead contact different, unique locations on the substrate 145. In some implementations, the relative movement between the substrate 145 and the electrical contact apparatuses of the electroplating cells may be from rotation of the substrate, rotation of the electrical contact apparatus with respect to the two cells, or both. Once in this position, the substrate 145 may undergo an electroplating operation in the second electroplating cell. Following this electroplating operation, the substrate 145 may be moved by a transfer mechanism, such as a robot arm, from the second electroplating cell to a third electroplating cell.

[0108] In Figure 10C, a portion of the third electroplating cell is shown, and it has a portion of a third electrical contact apparatus 870C having the body portion 872C and three electricalDocket No. LAM1P065WO contact fingers 844A3, 844B3, and 844C3. The electrical contact apparatus 870C may be the same as electrical contact apparatuses 870A and 870C. In Figure IOC, there has been relative rotation between the substrate 145 and the contact apparatus 870C, as indicated by the dashed arrow, such that when the substrate 145 is positioned on the third electrical contact apparatus 870C, the three electrical contact fingers 844A3, 844B3, and 844C3 contact the substrate 145 at a plurality of third locations, locations 1082A, 1082B, and 1082C. These third locations 1082A, 1082B, and 1082C are in different locations on the substrate 145 than the first locations 1078 A, 1078B, and 1078C (not visible here) and the second locations 1080A, 1080B, and 1080C (partially visible here). This relative motion between the second electrical contact apparatus 870B and third electrical contact apparatus 870C may again be the rotational distance RD of between about the width W or W *2. This amount of rotation advantageously provides for sufficient spacing for the substrate to be contacted by the electrical contact fingers of each electroplating cell.

[0109] The first locations 1078A and 1078B, and second locations 1080A, 1080B, and 1080C are shown here in Figure 10C and as can be seen, the electrical contact fingers 844A3, 844B3, and 844C3 do not contact these first locations or second locations, and instead contact different and unique locations on the substrate 145. In some implementations, the relative movement between the substrate 145 and the electrical contact apparatuses of the electroplating cells may be from rotation of the substrate, rotation of the electrical contact apparatus, or both. Once in this position, the substrate 145 may undergo an electroplating operation in the third electroplating cell.

[0110] In some implementations, the electroplating system has a controller with one or more processors and one or more memories that store instructions for controlling each electroplating cell, including the respective cup assembly of each electroplating cell, and the instructions are configured to cause the one or more processors to cause the electroplating operation (or more than one electroplating operations) to occur in each electroplating cell, as well as to cause the rotation of the substrate prior to electroplating. The substrate may be rotated by the respective cup assembly of each electroplating cell, a substrate transfer robot, or both. For example, referring to Figures 10A-10C, the substrate 145 is positioned in the first electroplating cell in a first rotational position for electroplating therein. During this electroplating, the electrical contact fingers of the first electrical contact apparatus 170A contact the substrate 145 in the first locations, as illustrated in Figure 10A.

[0111] The substrate 145 is then transferred to the second electroplating cell, as illustrated in Figure 10B. The substrate 145 is positioned in the second electroplating cell in a secondDocket No. LAM1P065WO rotational position such that the electrical contact fingers of the second electrical contact apparatus 170B contact the substrate 145 in the second locations that are all different than the first locations. The controller, identified as block 1071, is configured to cause the cup assembly of the second electroplating cell, the substrate transfer robot, or both, to rotate the substrate 145 into the second rotational position. In some implementations, the rotational distance between the first rotational position and the second rotational position is at least 0.3 degrees, at least 0.35 degrees, at least 0.4 degrees, or at least 0.45 degrees. In some implementations, the rotational distance may be 360 degrees divided by the number of touch points, or electrical contact fingers.

[0112] Similarly, the substrate 145 is then transferred to the third electroplating cell, as illustrated in Figure 10C. The substrate 145 is positioned in the third electroplating cell in a third rotational position such that the electrical contact fingers of the third electrical contact apparatus 170C contact the substrate 145 in the third locations that are all different than the first locations and the second locations. The controller 1071 is configured to cause the cup assembly of the third electroplating cell, the substrate transfer robot, or both, to rotate the substrate 145 into the third rotational position. In some implementations, the rotational distance between the second rotational position and the third rotational position is at least 0.3 degrees, at least 0.35 degrees, at least 0.4 degrees, or at least 0.45 degrees. In some implementations, the substrate may remain stationary during the electroplating in the first, second, and third electroplating cells.

[0113] In some implementations, the electrical contact fingers of the electrical contact apparatuses in each respective electroplating cell may be positioned, or arranged, in the substantially same position relative to each other. For example, the first electroplating cell may have a common reference point within the electroplating cell and the electrical contact apparatus may be aligned with that common reference point such that, for instance, a first electrical contact finger is on that common reference point. The second electroplating cell may have a common reference point within the electroplating cell that is positioned in the same position as the first electroplating cell. The electrical contact apparatus of the second electroplating cell may be aligned with that common reference point such that, for instance, a second electrical contact finger is on that common reference point. When compared to each other, the electrical contact apparatuses of the first and second electroplating cells are in the same relative rotational or clocking positions. In some implementations, the electrical contact fingers of the first electroplating cell may be considered arranged in a plurality of azimuthal positions about the center axis of the electrical contact apparatus, and the electrical contactDocket No. LAM1P065WO fingers of the second electroplating cell may be considered arranged in the same azimuthal positions about the center axis of the electrical contact apparatus. In some such implementations, the substrate is rotated between electroplating cells in order for the electrical contact fingers of each electroplating cell to contact a different unique location on the substrate.

[0114] In some other implementations, the electrical contact fingers of the electrical contact apparatuses in each respective electroplating cell may be positioned, or arranged, in different positions relative to each other. For instance, the first electroplating cell may have a common reference point within the electroplating cell and the electrical contact apparatus may be aligned with that common reference point such that, for instance, a first electrical contact finger is on that common reference point. The second electroplating cell may have a common reference point within the electroplating cell that is positioned in the same position as the first electroplating cell. Here, the electrical contact apparatus of the second electroplating cell may be aligned differently with that common reference point such that, for instance, a second electrical contact finger is rotationally offset, or rotated from, that common reference point. When compared to each other, the electrical contact apparatuses of the first and second electroplating cells are in different relative rotational or clocking positions. For instance, the first electrical contact finger in the first electroplating cell may be at 0 degrees with respect to the common reference point and the second electrical contact finger in the second electroplating cell may be at least 0.2 degrees with respect to the common reference point.

[0115] In some such implementations, the electrical contact fingers of the first electroplating cell may be considered arranged in a plurality of first azimuthal positions about the center axis of the electrical contact apparatus. The electrical contact fingers of the second electroplating cell may be considered arranged in a plurality of second azimuthal positions about the center axis of the electrical contact apparatus, and the first azimuthal positions may be different than the second azimuthal positions. In some such implementations, the substrate may not be rotated between electroplating cells and the positioning of the electrical contact apparatuses result in the electrical contact fingers of each electroplating cell contacting a different unique location on the substrate.

[0116] Various electroplating techniques may be performed using the systems and electrical contact apparatuses provided herein. Figure 11 depicts a first example technique for electroplating. In block 1101, a substrate is provided to an electroplating cell having an electrical contact apparatus provided herein. This may include the electroplating apparatus of Figures 4-7C and / or 8. For example, the electrical contact apparatus may have the electrical contact fingers spaced apart from each other in a substantially equally spaced manner and offsetDocket No. LAM1P065WO from each immediately adjacent electrical contact finger by the offset distance OD or second offset distance OD2. In block 1103, as discussed above with respect to Figure 10A, the substrate may be provided to this first electroplating cell where the electrical contact fingers 844A1-844C1 are spaced apart from each other by the second offset distance OD2 and in contact with the substrate at the first locations 1078A-1078C. Once in this position, the substrate may be electroplated in the first electroplating cell, as indicated by block 1105.

[0117] The substrate is then transferred from the first electroplating cell to the second electroplating cell, as provided by block 1107. The second electroplating cell may have the same electrical contact apparatus as the first electroplating cell, like with the apparatuses 870A and HH70B of the first and second cells of Figures 10A and 10B. In block 1109, the substrate is positioned in the second electroplating cell such that the electrical contact fingers of the electrical contact apparatus in the second electroplating cell contact the substrate in a plurality of second locations different than the first locations. This is illustrated in Figure 10B and described above. Once in the second electroplating cell, the substrate is electroplated, per block 1111.

[0118] In some implementations, like described above, optional block 1113 may be performed in which the substrate is rotated when positioned into the second electroplating cell. This rotation may by the transfer robot, the electroplating cell (e.g., the cup assembly), or both. The substrate or the electroplating cell may be rotated to a different rotational position, angle, or clocking position as compared to the first electroplating cell such that the electrical contact fingers of the respective first and second electroplating cells contact different locations on the substrate.

[0119] In some implementations, unique contact positions between the substrate and the electrical contact fingers of different electroplating cells may be provided by rotating the cup and electrical contact apparatus to different rotational positions between each electroplating operation. The electrical contact apparatus may be those with offset contact fingers, like those described herein, such as apparatus 870 in Figures 8-9B. The substrate may be positioned, or loaded, into each electroplating cell in the same rotational position while the cup and electrical contact apparatus are rotated to different rotational positions relative to the other cells and to the substrate. For example, each substrate has a single notch in an outer location on the substrate. When moving a substrate, a transfer robot may be aligned with the substrate’s notch such that the substrate is in the same position on the robot each time the robot, or a plurality of robots, picks up and moves a substrate, including into each cell. The substrate may therefore be oriented at the same rotational, or clocking, position when it is loaded into each cell. ThisDocket No. LAM1P065WO alignment between the robot and the substrate during movement provides for repeatability of moving a wafer within an electroplating system. In some such instances, this may be considered positioning the substrate at the same clocking position with respect to the transfer robot while the clocking position of the cup and electrical contact apparatus of the cells is different.

[0120] Similar to above, relative motion between the substrate and the electrical contact fingers may be provided by rotating the cup and electrical contact apparatus with respect to the substrate. For instance, referring back to Figures 2 and 3, the electrical contact apparatus having the plurality of contact fingers 144 is identified as item 870. It shall be understood that this apparatus may be apparatus 170 of Figure 4, apparatus 870 of Figure 8, or any other apparatus provided herein. For simplicity, these apparatuses are collectively referred to as apparatus 870. In Figures 2 and 3, the apparatus 870 is fixedly connected to the cup 101. The cup 101 is configured to be rotated to a plurality of rotational positions, as indicated by arrows 152 in Figure 2 and arrows 153 in Figure 3. By fixedly connecting the apparatus 870 and the cup 101, rotational movement of the cup 101 also provides rotational movement of the electrical contact apparatus 870.

[0121] The performance of multiple electroplating operations with the cups and electrical contact apparatuses at different rotational positions will now be discussed. Figures 15A-15E depict a plurality of electrical contact apparatuses at three different rotational positions with respect to a wafer notch. In Figure 15A, a first cup 1501A with a fixedly connected electrical contact apparatus 870A of a first electroplating cell is depicted, along with four structural posts, or struts 1582A1 through 1582A4, of the first electroplating cell. The apparatus 870A is that provided above, and it has a first plurality of electrical contact fingers 844A that are offset by the second offset distance OD2 which may be greater than at least the width of one first contact finger 844A. A triangle is also shown in Figure 15 A, and it represents the location and orientation of the substrate notch 1584 when loaded into the first electroplating cell; the notch 1584 is shown in the 6 o’clock position here and in Figures 15B-16. The apparatus 870A is oriented at a first rotational position with respect to the notch 1584. As provided above, the rotation of the apparatus may be measured, or referenced, with respect to the notch of the wafer; further the substrate may be positioned into each cell in the same, uniform position and orientation.

[0122] When the substrate is provided into the first electroplating cell of Figure 15 A, the first plurality of electrical contact fingers 844A contact the substrate at a plurality of first locations. This is similar to provided herein above and illustrated in Figure 10A, for example. Once in the first electroplating cell of Figure 15 A, the substrate may undergo a first electroplatingDocket No. LAM1P065WO operation, such as the deposition of copper. After the substrate has undergone the first electroplating operation in the first electroplating cell of Figure 15 A, the substrate may undergo a second electroplating operation in a second electroplating cell with the electrical contact apparatus at a different rotational position than in the first cell. This may provide for different and unique contact locations between the substrate and the contacts of the second cell than in the first electrical cell.

[0123] Figure 15B provides a second electroplating cell with its cup and electrical contact apparatus in a different rotational position than in the first electroplating cell of Figure 15 A. This second electroplating cell has a second cup 1501B with a fixedly connected second electrical contact apparatus 870B with a second plurality of electrical contact fingers 844B. In some implementations, like shown, the first and second electrical contact apparatuses 870A and 870B, respectively, and the cups 1501A and 1501B, may be the same as each other. In Figure 15B, the notch 1584 is in the same position with respect to the second electroplating cell as with the first electroplating cell. Here, the second cup and second electrical contact apparatus 870B of the second cell have been rotated with respect to the notch 1584. In this example, the rotation is clockwise, with respect to the notch 1584, as provided by the dashed arrow. The second electrical contact apparatus 870B has been rotated into a second rotational position. In some instances, this may be considered the second electrical contact apparatus 870B being in a second or different clocking position, with respect to the notch, than the first electrical contact apparatus 870A of the first cell in Figure 15A.

[0124] To further illustrate this rotation, the struts 1582B1 through 1582B4 of the second cell may be in the same position with respect to the cup 1501B, but given the rotation of the second cup 1501B, they have also been rotated along with the second electrical contact apparatus 870B. With the second electrical contact apparatus 870B in the second rotational position of Figure 15B, the second plurality of electrical contact fingers 844B, shown with dark shading, of the second electroplating cell are in different rotational positions than those of the first cell in Figure 15 A. Further, the second plurality of electrical contact fingers 844B of the second electrical contact apparatus 870B, which is in the second rotational position, contact the substrate in a plurality of second locations different than the first locations of the first electroplating cell. This may provide for different and unique contact locations between the substrate and the contacts of the second cell than in the first cell, similar to provided herein above and illustrated in Figure 10B, for example. Once in the second electroplating cell of Figure 15B, the substrate may undergo a second electroplating operation, such as the deposition of a metal different than copper, or another layer of copper.Docket No. LAM1P065WO

[0125] Figure 15C illustrates a comparison of the different rotational positions and contact finger locations of the first and second electroplating cells of Figures 15A and 15B. Here, the first plurality of electrical contact fingers 844A of the first cell of Figure 15A are shown without shading and with dashed lines, and the second plurality of electrical contact fingers 844B of the second cell of Figure 15B are shown with shading. As can be seen, the first plurality of electrical contact fingers 844A are in different rotational positions than the second plurality of electrical contact fingers 844B. These different rotational positions, or different clocking positions, of the first plurality of electrical contact fingers 844A and the second plurality of electrical contact fingers 844B result in these fingers contacting the substrate in different locations. For instance, the first plurality of electrical contact fingers 844A contact the substrate in a plurality of first locations and the second plurality of electrical contact fingers 844B contact the substrate in a plurality of second locations different than the first locations.

[0126] After the substrate has undergone the second electroplating operation in the second electroplating cell of Figure 15B, the substrate may undergo a third electroplating operation in a third electroplating cell with the electrical contact apparatus at a different rotational position than in the first and second cells. This may provide for different and unique contact locations between the substrate and the contact fingers of the third cell than in the first and second cells.

[0127] Figure 15D provides a third electroplating cell with its cup and electrical contact apparatus in a different rotational position than in the first and second electroplating cells of Figures 15A and 15B. This third electroplating cell has a third cup 1501C with a fixedly connected third electrical contact apparatus 870C with a third plurality of electrical contact fingers 844C. In some implementations, like shown, the first, second, and third electrical contact apparatuses 870A, 870B, and 870C, respectively, may be the same as each other. In Figure 15C, the notch 1584 is in the same position with respect to the third electroplating cell as with the first and second electroplating cells. The third cup 1501C and third electrical contact apparatus 870C of the third cell have been rotated with respect to the notch 1584. In this example, the rotation is a different direction than with the second cell of Figure 15B, e.g., counterclockwise, with respect to the notch 1584, as provided by the dashed arrow. The third electrical contact apparatus 870C has been rotated into a third rotational position. In some instances, this may be considered the third electrical contact apparatus 870C being in a third or different clocking position, with respect to the notch, than the first and second electrical contact apparatuses of the first cell in Figure 15A and the second cell in Figure 15C.

[0128] To further illustrate this rotation, the struts 1582C1 through 1582C4 of the third cell have also been rotated along with the third cup 1501C and the third electrical contact apparatusDocket No. LAM1P065WO870C. With the third electrical contact apparatus 870C in the third rotational position of Figure 15D, the third plurality of electrical contact fingers 844C of the third electroplating cell are in different rotational positions than those of the first and second cells of Figures 15A and 15B. Further, the third plurality of electrical contact fingers 844C of the third electrical contact apparatus 870C in the third rotational position contact the substrate in a plurality of third locations different than the first locations of the first electroplating cell and the second locations of the second electroplating cell. This is similar to provided herein above and illustrated in Figure IOC, for example. Once in the third electroplating cell of Figure 15D, the substrate may undergo a third electroplating operation, such as the deposition of a metal different than copper, or another layer of copper.

[0129] Figure 15E illustrates a comparison of the different rotational positions and contact finger locations of the first, second, and third electroplating cells of Figures 15 A, 15B, and 15D. Here, the first plurality of electrical contact fingers 844A of the first cell of Figure 15A are shown without shading and with dashed lines, the second plurality of electrical contact fingers 844B of the second cell of Figure 15B are shown with shading and with dashed lines, and the third plurality of electrical contact fingers 844C of the third cell of Figure 15D is shown with cross-hatching and solid lines. As can be seen, the first plurality of electrical contact fingers 844A, the second plurality of electrical contact fingers 844B, and the third plurality of electrical contact fingers 844C are all in different rotational positions, or different clocking positions, than each other. These different rotational positions of the first plurality of electrical contact fingers 844A, the second plurality of electrical contact fingers 844B, and the third plurality of contact fingers 844C result in these contact fingers contacting the substrate in different locations. For instance, the first plurality of electrical contact fingers 844A contact the substrate in the plurality of first locations, the second plurality of electrical contact fingers 844B contact the substrate in a plurality of second locations, and the third plurality of electrical contact fingers 844C contact the substrate in a plurality of third locations different than the first and second locations.

[0130] In some implementations, the electrical apparatuses of the first, second, and third cell may be oriented at various angles with respect to the substrate notch. For example, the first electrical apparatus may be oriented at a first angle with respect to the notch, the second electrical apparatus may be oriented at a second angle with respect to the notch, and the third electrical apparatus may be oriented at a third angle with respect to the notch. In some instances, the first angle may be 0 degrees, the second angle may be at least +0.1 degrees, and the third angle may be at least -0.1 degree. In some further instances, the second angle may be at leastDocket No. LAM1P065WO+0.3 degrees and the third angle may be at least -0.3 degrees.

[0131] These offset angles between the notch and the first, second, and third electrical apparatuses are illustrated in Figure 16 which depicts a magnified, detail view of Figure 15E. Here, the notch 1584 location of the substrate is illustrated along with three first contact fingers 844A having no shading and dashed lines, two second contact fingers 844B with dark shading and dashed lines, and two third contact fingers 844C with cross-hatching and solid lines. A notch referential axis 886 is aligned with the notch 1584 and the angular measurements of the three electrical apparatuses may be referenced from this axis. The first electrical apparatus has a first referential axis 888A that extends through one first electrical contact finger 844A and as can be seen, the notch referential axis 886 and the first referential axis 888A are colinear and therefore offset to each other by 0 degrees. The second electrical apparatus has a second referential axis 888B that extends through one second electrical contact finger 844B and as can be seen, the notch referential axis 886 and the second referential axis 888B are offset by a first angle 91. In this illustration, the first angle may be considered a positive angle due to the clockwise rotation of the second electrical apparatus. The third electrical apparatus has a third referential axis 888C that extends through one third electrical contact finger 844C and as can be seen, the notch referential axis 886 and the third referential axis 888C are offset by a second angle 92. In this illustration, the second angle may be considered a negative angle due to the counterclockwise rotation of the third electrical apparatus. In some implementations, the first angle 91 may range from 0.1 degrees to about 1 degrees, and the second angle 92 may range from -0.1 degrees to about -1 degrees.

[0132] Also illustrated in Figure 16 are example first, second, and third contact locations for the first second, and third contact fingers. The first electrical contact finger 844A contacts the substrate at a first contact location 1078, second electrical contact finger 844B contacts the substrate at a second contact location 1080, and the third electrical contact finger 844C contacts the substrate at a third contact location 1082. The first contact location 1078, second location 1080, and third location 1082 are all at different locations on the substrate and with respect to the notch 1584. In other words, none of these locations overlap with each other.

[0133] The second and third electrical contact apparatuses may be rotated in various manners. For example, Figures 15A-16 illustrate that the second electrical contact apparatus may be rotated in one direction and the third electrical contact apparatus may be rotated in the opposite direction. In some instances, the first direction may be clockwise and the second direction may be counterclockwise; in other instances first direction may be counterclockwise and the second direction may be clockwise. In some other implementations, the second and third electricalDocket No. LAM1P065WO contact apparatuses may be rotated in the same direction, similar to that of Figures 10A-10C.

[0134] Various electroplating techniques are provided that electroplate multiple layers of material onto a substrate, with each layer being deposited with the respective electrical contact apparatuses in different rotational positions. Some implementations may use multiple electroplating cells that have each of their electrical contact apparatuses in different rotational positions. Figure 17 depicts another electroplating technique. This technique is similar to Figure 11 with noted differences. In block 1701, a substrate with a notch is provided to an electroplating system with a plurality of electroplating cells, such as N cells, with each cell having the same electrical contact apparatus having electrical contacts offset from each other by an offset distance greater than the width W of each contact, like provided above. For example, one such electroplating cell may be that provided in Figures 2, 3, 8, and 15; for simplicity, Figure 15 will be referenced in this example technique.

[0135] In block 1703, the cup and electrical apparatus of a first electroplating cell is positioned in a first rotational position with respect to the notch of the substrate. This may be the positioning provided above in Figure 15A. Here, the first cell has the first cup 1501A with the first electrical contact apparatus 870A in the first rotational position with respect to the notch 1584. In some implementations, this rotational position may be an angular offset from the notch of 0 degrees, like illustrated in Figures 15A and 16; in other implementations, this rotational position may be an angular offset from the notch of an angle greater than 0 degrees, such as 0.1 degrees, 0.3 degrees, or 0.6 degrees, for example. After the positioning of block 1703, in block 1705 the substrate is positioned in the first cell and the electrical contact fingers contact the substrate at a plurality of first locations, similar to block 1103 above. Once the substrate has been positioned in the first cell in block 1705, a first electroplating operation is performed on the substrate in the first electroplating cell as provided in block 1707, similar to the electroplating of block 1105. This electroplating may be depositing a layer of material on the substrate, such as copper or nickel, for example.

[0136] During or after the first electroplating operation of Figure 1707, block 1709 may be performed in which the cup and electrical apparatus of a second electroplating cell are positioned to a second rotational position with respect to the notch of the substrate. As provided above, the cup and electrical apparatus of the second electroplating cell are the same as in the first cell. The second rotational position is different than the first rotational position with respect to the notch of the substrate. For example, the positioning of the second electroplating cell is illustrated in Figure 15B and the difference between the first and second rotational positions is illustrated in Figure 15C. In some implementations, the second cell is rotated fromDocket No. LAM1P065WO another rotational position into the second rotational position. For example, the second cell may have been at a different rotational position for another electroplating operation, such as a third or fourth rotational position, and it is rotated from that position into the second rotational position during the positioning of block 1709. In some other implementations, the second cell may already be in the second rotational position and no actual rotation or movement is needed. In some implementations, the positioning of the cup and electrical apparatus of the second electroplating cell is clockwise rotation while in other implementations it is counterclockwise rotation.

[0137] Once the cup and electrical apparatus of the second electroplating cell are positioned in the second rotational position with respect to the notch, the substrate is positioned in the second cell, as provided by block 1711. When the substrate is positioned in the second cell, the electrical contact fingers contact the substrate at a plurality of second locations different than the first locations, similar to block 1109 above. As illustrated in Figures 15B, 15C, and 16, by rotating the cup and electrical apparatus of the second electroplating cell to a different rotational position with respect to the notch than in the first cell, the substrate is contacted at different locations by the electrical contact fingers of the first and second cells. For instance, in Figure 16, the one illustrated first contact location 1078 is at a different location on the substrate than the second contact location 1080. With the substrate in the second cell, a second electroplating operation is performed on the substrate. Once the substrate has been positioned in the second cell in block 1711, a second electroplating operation is performed on the substrate in the second electroplating cell as provided in block 1713, similar to the electroplating of block 1111. This electroplating may be depositing a layer of material on the substrate, such as copper or nickel, for example.

[0138] In some implementations, the first and second cells may be different cells, and the substrate may be transferred from the first cell to the second cell by a transfer robot, as indicated by optional block 1715. As provided above, the transfer robot lifts and carries the substrate in the same, uniform position to each cell and between each cell. For example, the notch of the substrate is at the same notch position each time it is carried by the robot, thereby providing the substrate in the same orientation and position for uniformity with respect to each cell. The positioning of the substrate into the first and second cells of blocks 1705 and 1711 may include the notch of the substrate being at the same notch location with respect to the transfer robot. In other words, the substrate may be positioned, or loaded, into the first and second cells at the same orientation with respect to the transfer robot.

[0139] Although not illustrated in Figure 17, some implementations may perform a thirdDocket No. LAM1P065WO electroplating operation in a third cell. Before positioning the substrate therein, the cup and electrical apparatus of the third cell may be positioned in the third rotational position with respect to the notch, as illustrated in Figures 15D and 16. This third rotational position is different than the first and second rotational positions. When the substrate is positioned in the third cell with its cup and electrical apparatus in the third rotational position, the electrical contact fingers contact the substrate in a plurality of third locations that are different than the first and second locations. This is also illustrated in Figures 15D, 15E, and 16. For example, the third contact location 1082 in Figure 16 is in a different location than the first and second contact locations 1078 and 1080.

[0140] In some other implementations, the first and second cells may be the same cells. In between the first and second electroplating operations, the substrate may be lifted from the cup and the cup may be rotated to the second rotational position. After this rotation, the substrate may be positioned back into the first cell for the second electroplating operation with the contact fingers contacting the substrate at different locations. Similarly, in some implementations, the first and third cells may be the same cell that performs the first and third electroplating operations, but again the electrical contact apparatus of the first cell is in different rotational positions for the first and third electroplating operations.

[0141] In some techniques, one or more determinations may be made to find an available electroplating cell for the second electroplating operation, after which that available cell may be rotated into the desired rotational position. This may occur in electroplating systems with many cells, such as 4, 6, 8, 10, or 12, for instance, and some such systems are described below and illustrated in Figures 12 and 13. The one or more determinations may also be made by the one or more controllers of the system; example controllers are provided herein. Figure 18 provides yet another electroplating technique. Blocks 1801, 1803, 1805, and 1807 are the same as blocks 1701, 1703, 1705, and 1707 of Figure 17 and are not repeated for brevity. During or after block 1807, block 1817 is performed in which a determination is made as to which electroplating cell of the N electroplating cells is available to perform a second electroplating operation on the substrate. This determination may include knowing the type of second electroplating operation that is to be performed, such as which material is to be electroplated, which of the cells in the system can perform such electroplating, and the status of such cell or cells, such as whether the cell is performing electroplating, down for maintenance or repairs, or open for electroplating.

[0142] Once it is determined that one of the N cells is available to perform this second electroplating operation, the cup and electrical contact apparatus of the available cell areDocket No. LAM1P065WO positioned into the second rotational position with respect to the notch, similar to block 1709. The substrate may then be transferred from the first cell to this available cell, as provided in block 1815, and then per block 1811, the substrate is positioned in the available electroplating cell such that the electrical contact fingers are contacting the substrate at the plurality of second locations different than the first locations, like in block 1711. In block 1813, the second electroplating operation is performed on the substrate in the available electroplating cell, like in block 1713.

[0143] In some implementations, determining available cells may be performed for the second electroplating operation, third electroplating operation, or both. For example, a technique may perform three electroplating operations, with the first and third electroplating operations depositing the same material and the second electroplating operation depositing a different material. After the second electroplating operation, a determination may be made as to which of the N electroplating cells is available for the third electroplating operation, which may be the same as the first electroplating operation. As provided above, in some instances, the first electroplating cell may be available for the third electroplating operation. In response to determining that the first cell is available for the third electroplating operation, the third cup and third electrical apparatus may be positioned into the third rotational position, and the substrate may be positioned therein and electroplated with the third electroplating operation.

[0144] Some electroplating techniques may be incorporated as part of a process recipe. In some implementations, the desired rotational positions are a part of the recipe and are executed sequentially during the execution of the recipe. For example, the two electroplating cells may not be prepositioned into the first and second rotational positions, but rather they are positioned as needed by the execution of the process recipe. Referring back to Figure 17, the blocks may be process recipe steps and block 1703 may be executed sequentially before block 1705, 1707, and 1709. During or after block 1707, the process recipe executes the positioning of block 1709. This sequential execution or performance may allow for more flexibility of the electroplating system such that each cell can be positioned into the desired rotational position for each unique process recipe using that cell.

[0145] In some implementations, the second rotational position may result in the second electrical contact fingers contacting the substate in a plurality of second locations that partially overlap with the first locations. This positioning may advantageously allow for multiple electroplating operations to occur while still minimizing the overlapping contact between contact fingers. For example, Figure 19 depicts a magnified detail view of electrical contacts similar to that of Figure 16. Here, a portion of the second electrical contact apparatus in aDocket No. LAM1P065WO different second rotational position than in Figures 15B and 16, and the three first contact fingers, are illustrated. The three first contact fingers 1944A of the first cell are shown with dashed lines and no shading, and in the same first rotational position. The three second contact fingers 1944B of the second cell are shown with shading and solid lines and here, these second contact fingers 1944B are in different locations than Figure 16. The cup and electrical apparatus of the second cell in this example has been rotated to a second rotational position such that the first and second locations partially overlap. For instance, one first location 1978 where one first electrical contact finger 1944A contacts the substrate and one second location 1980 where one second electrical contact finger 1944B contacts the substrate are shown and these locations 1978 partially overlap. The overlapping section 1990 is also identified here.

[0146] Similar to Figure 16, the notch referential axis 1986 is aligned with the notch 1584 and the angular measurements of the second electrical apparatus may be referenced from this axis. The first electrical apparatus has a first referential axis 1988A that extends through one first electrical contact finger 1944A and as can be seen, the notch referential axis 1986 and the first referential axis 1988A are colinear and therefore offset to each other by 0 degrees. The second electrical apparatus has the second referential axis 1988B that extends through one second electrical contact finger 1944B and as can be seen, the notch referential axis 1986 and the second referential axis 1988B are offset by a first angle 93. In this illustration, the first angle may be less than the width W of each contact, and may range from about 0.05 degrees to about 0.15 degrees, for example.

[0147] Various example electroplating systems and features will now be discussed. Figure 12 shows a schematic of a top view of an example electrodeposition apparatus. The electrodeposition apparatus 1200 can include three separate electroplating modules 1202, 1204, and 1206. The electrodeposition apparatus 1200 can also include three separate modules 1212, 1214, and 1216 configured for various process operations. For example, in some implementations, one or more of modules 1212, 1214, and 1216 may be a spin rinse drying (SRD) module. In other implementations, one or more of the modules 1212, 1214, and 1216 may be post-electrofill modules (PEMs), each configured to perform a function, such as edge bevel removal, backside etching, and acid cleaning of substrates after they have been processed by one of the electroplating modules 1202, 1204, and 1206.

[0148] The electrodeposition apparatus 1200 includes a central electrodeposition chamber 1224. The central electrodeposition chamber 1224 is a chamber that holds the chemical solution used as the electroplating solution in the electroplating modules 1202, 1204, and 1206. The electrodeposition apparatus 1200 also includes a dosing system 1226 that may store andDocket No. LAM1P065WO deliver additives for the electroplating solution. A chemical dilution module 1222 may store and mix chemicals to be used as an etchant. A filtration and pumping unit 1228 may filter the electroplating solution for the central electrodeposition chamber 1224 and pump it to the electroplating modules.

[0149] A system controller 1230, which may be the same as controller 1071 provided above, provides electronic and interface controls required to operate the electrodeposition apparatus 1200. The system controller 1230 (which may include one or more physical or logical controllers) controls some or all of the properties of the electroplating apparatus 1200. The system controller 1230 typically includes one or more memory devices and one or more processors. The processor may include a central processing unit (CPU) or computer, analog and / or digital input / output connections, stepper motor controller boards, and other like components. Instructions for implementing appropriate control operations as described herein may be executed on the processor. These instructions may be stored on the memory devices associated with the system controller 1230 or they may be provided over a network. In certain implementations, the system controller 1230 executes system control software.

[0150] The system control software in the electrodeposition apparatus 1200 may include instructions for controlling the timing, mixture of electrolyte components, inlet pressure, plating cell pressure, plating cell temperature, substrate temperature, current and potential applied to the substrate and any other electrodes, substrate position, substrate rotation, and other parameters of a particular process performed by the electrodeposition apparatus 1200. System control logic may be configured in any suitable way. For example, various process tool component sub-routines or control objects may be written to control operation of the process tool components necessary to carry out various process tool processes. System control software may be coded in any suitable computer readable programming language. The logic may also be implemented as hardware in a programmable logic device (e.g., an FPGA), an ASIC, or other appropriate vehicle.

[0151] In some implementations, system control logic includes input / output control (IOC) sequencing instructions for controlling the various parameters described above. For example, each phase of an electroplating process may include one or more instructions for execution by the system controller 1230. The instructions for setting process conditions for an immersion process phase may be included in a corresponding immersion recipe phase. In some implementations, the electroplating recipe phases may be sequentially arranged, so that all instructions for an electroplating process phase are executed concurrently with that process phase.Docket No. LAM1P065WO

[0152] The control logic may be divided into various components such as programs or sections of programs in some implementations. Examples of logic components for this purpose include a substrate positioning component, an electrolyte composition control component, a pressure control component, a heater control component, and a potential / current power supply control component.

[0153] In some implementations, there may be a user interface associated with the system controller 1230. The user interface may include a display screen, graphical software displays of the apparatus and / or process conditions, and user input devices such as pointing devices, keyboards, touch screens, microphones, etc.

[0154] In some implementations, parameters adjusted by the system controller 1230 may relate to process conditions. Non-limiting examples include bath conditions (temperature, composition, and flow rate), substrate position (rotation rate, linear (vertical) speed, angle from horizontal) at various stages, etc. These parameters may be provided to the user in the form of a recipe, which may be entered utilizing the user interface.

[0155] Signals for monitoring the process may be provided by analog and / or digital input connections of the system controller 1230 from various process tool sensors. The signals for controlling the process may be output on the analog and digital output connections of the process tool. Non-limiting examples of process tool sensors that may be monitored include mass flow controllers, pressure sensors (such as manometers), thermocouples, optical position sensors, etc. Appropriately programmed feedback and control algorithms may be used with data from these sensors to maintain process conditions.

[0156] A hand-off tool 1240 may select a substrate from a substrate cassette such as the cassette 1242 or the cassette 1244. The cassettes 1242 or 1244 may be front opening unified pods (FOUPs). A FOUP is an enclosure designed to hold substrates securely and safely in a controlled environment and to allow the substrates to be removed for processing or measurement by tools equipped with appropriate load ports and robotic handling systems. The hand-off tool 1240 may hold the substrate using a vacuum attachment or some other attaching mechanism.

[0157] The hand-off tool 1240 may interface with a wafer handling station 1232, the cassettes 1242 or 1244, a transfer station 1250, or an aligner 1248. From the transfer station 1250, a hand-off tool 1246 may gain access to the substrate. The transfer station 1250 may be a slot or a position from and to which hand-off tools 1240 and 1246 may pass substrates without going through the aligner 1248. In some implementations, however, to ensure that a substrate is properly aligned on the hand-off tool 1246 for precision delivery to an electroplating module,Docket No. LAM1P065WO the hand-off tool 1246 may align the substrate with an aligner 1248. The hand-off tool 1246 may also deliver a substrate to one of the electroplating modules 1202, 1204, or 1206 or to one of the three separate modules 1212, 1214, and 1216 configured for various process operations.

[0158] An example of a process operation according to the methods described above may proceed as follows: (1) electrodeposit copper or another material onto a substrate in the electroplating module 1204; (2) rinse and dry the substrate in SRD in module 1212; and, (3) perform edge bevel removal in module 1214.

[0159] An apparatus configured to allow efficient cycling of substrates through sequential plating, rinsing, drying, and PEM process operations may be useful for implementations for use in a manufacturing environment. To accomplish this, the module 1212 can be configured as a spin rinse dryer and an edge bevel removal chamber. With such a module 1212, the substrate would only need to be transported between the electroplating module 1204 and the module 1212 for the copper plating and EBR operations. In some implementations the methods described herein will be implemented in a system which comprises an electroplating apparatus and a stepper.

[0160] An alternative implementation of an electrodeposition apparatus 1300 is schematically illustrated in Figure 13. In this implementation, the electrodeposition apparatus 1300 has a set of electroplating cells 1307, each containing an electroplating bath, in a paired or multiple “duet” configuration. In addition to electroplating per se, the electrodeposition apparatus 1300 may perform a variety of other electroplating related processes and sub-steps, such as spinrinsing, spin-drying, metal and silicon wet etching, electroless deposition, pre- wetting and prechemical treating, reducing, annealing, electro-etching and / or electropolishing, photoresist stripping, and surface pre-activation, for example. The electrodeposition apparatus 1300 is shown schematically looking top down in Figure 13, and only a single level or “floor” is revealed in the figure, but it is to be readily understood by one having ordinary skill in the art that such an apparatus, e.g., the Lam Sabre™ 3D tool, can have two or more levels “stacked” on top of each other, each potentially having identical or different types of processing stations.

[0161] Referring once again to Figure 13, the substrates 1306 that are to be electroplated are generally fed to the electrodeposition apparatus 1300 through a front end loading FOUP 1301 and, in this example, are brought from the FOUP to the main substrate processing area of the electrodeposition apparatus 1300 via a front-end robot 1302 that can retract and move a substrate 1306 driven by a spindle 1303 in multiple dimensions from one station to another of the accessible stations — two front-end accessible stations 1304 and also two front-end accessible stations 1308 are shown in this example. The front-end accessible stations 1304 andDocket No. LAM1P065WO1308 may include, for example, pre-treatment stations, and spin rinse drying (SRD) stations. Lateral movement from side-to-side of the front-end robot 1302 is accomplished utilizing robot track 1302a. Each of the substrates 1306 may be held by a cup / cone assembly (not shown) driven by a spindle 1303 connected to a motor (not shown), and the motor may be attached to a mounting bracket 1309. Also shown in this example are the four “duets” of electroplating cells 1307, for a total of eight electroplating cells 1307. A system controller (not shown) may be coupled to the electrodeposition apparatus 1300 to control some or all of the properties of the electrodeposition apparatus 1300. The system controller may be programmed or otherwise configured to execute instructions according to processes described earlier herein.

[0162] In some implementations, a controller is part of a system, which may be part of the above-described examples. Such systems can comprise semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform or platforms for processing, and / or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller, depending on the processing requirements and / or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and / or load locks connected to or interfaced with a specific system.

[0163] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some implementations, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one orDocket No. LAM1P065WO more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0164] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g. a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0165] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0166] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other toolDocket No. LAM1P065WO components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.Experimental Results

[0167] Using the electrical apparatuses described herein resulted in advantageous and unexpected results. In some experiments, deep scratches were found that penetrated through the individual underlayers. Some examples included scratches deeper than an acceptable threshold of 0.5pm, such as 1pm and 2pm. In experiments with electrical contact fingers configured as provided herein above, such as with an average surface roughness Ra equal to or less than 5 micro-inches and a chamfered end portion, these deep scratches did not occur. In some examples, there were scratches, but they are much less than without these features, such as scratches having a depth are less than 0.4 pm. Based on this, using the electrical contact fingers provided herein reduce unwanted damage to the substrate.Additional and / or Alternative Implementations

[0168] Unless otherwise specified, the illustrated implementations are to be understood as providing example features of varying detail of some implementations. Thus, unless otherwise specified, the features, components, modules, layers, films, regions, aspects, structures, etc. (hereinafter individually or collectively referred to as an “element” or “elements”), of the various illustrations may be otherwise combined, separated, interchanged, and / or rearranged without departing from the teachings of the disclosure.

[0169] The terminology used herein is for the purpose of describing some implementations and is not intended to be limiting. As used herein, the singular forms, “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It is to be understood that the phrases “for each <item> of the one or more <items>,” “each <item> of the one or more <items>,” and / or the like, if used herein, are inclusive of both a single-item group and multiple-item groups, i.e., the phrase “for . . . each” is used in the sense that it is used in programming languages to refer to each item of whatever population of items is referenced. For example, if the population of items referenced is a single item, then “each” would refer to only that single item (despite dictionary definitions of “each” frequently defining the term to refer to “every one of two or more things”) and would not imply that there must be at least two of those items. Similarly, the term “set” or “subset” should not be viewed, in itself, as necessarily encompassing a plurality of items — it is to be understood that a set or a subset can encompass only one member or multiple members (unless the context indicates otherwise).Docket No. LAM1P065WOThe terms “comprises,” “comprising,” “includes,” and / or “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It is also noted that, as used herein, the terms “substantially,” “about,” and other similar terms, are used as terms of approximation and not as terms of degree, and, as such, are utilized to account for inherent deviations in measured, calculated, and / or provided values that would be recognized by one of ordinary skill in the art. Accordingly, the term “substantially” as used herein, unless otherwise specified, means within 5% of a referenced value. For example, substantially perpendicular means within ±5% of parallel.

[0170] The use of cross-hatching and / or shading in the accompanying drawings is generally provided to clarify boundaries between adjacent elements. As such, neither the presence nor the absence of cross-hatching or shading conveys or indicates any preference or requirement for particular materials, material properties, dimensions, proportions, commonalities between illustrated elements, and / or any other characteristic, attribute, property, etc., of the elements, unless specified. Further, in the accompanying drawings, the size and relative sizes of elements may be exaggerated for clarity and / or descriptive purposes. As such, the sizes and relative sizes of the respective elements are not necessarily limited to the sizes and relative sizes shown in the drawings. When an implementation may be implemented differently, a specific process order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially at the same time or performed in an order opposite to the described order.

[0171] When an element, such as a layer, is referred to as being “on,” “connected to,” or “coupled to” another element, it may be directly on, directly connected to, or directly coupled to the other element or at least one intervening element may be present. When, however, an element is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element, there are no intervening elements present. Other terms and / or phrases if used herein to describe a relationship between elements should be interpreted in a like fashion, such as “between” versus “directly between,” “adjacent” versus “directly adjacent,” “on” versus “directly on,” etc. Further, the term “connected” may refer to physical, electrical, and / or fluid connection. To this end, for the purposes of this disclosure, the phrase “fluidically connected” is used with respect to volumes, plenums, holes, etc., that may be connected to one another, either directly or via one or more intervening components or volumes, to form a fluidic connection, similar to how the phrase “electrically connected” is used with respect toDocket No. LAM1P065WO components that are connected to form an electric connection. The phrase “fluidically interposed,” if used, may be used to refer to a component, volume, plenum, hole, etc., that is fluidically connected with at least two other components, volumes, plenums, holes, etc., such that fluid flowing from one of those other components, volumes, plenums, holes etc., to the other or another of those components, volumes, plenums, holes, etc., would first flow through the “fluidically interposed” component before reaching that other or another of those components, volumes, plenums, holes, etc.. For example, if a pump is fluidically interposed between a reservoir and an outlet, fluid flowing from the reservoir to the outlet would first flow through the pump before reaching the outlet. The phrase "fluidically adjacent," if used, refers to placement of a fluidic element relative to another fluidic element such that no potential structures fluidically are interposed between the two elements that might potentially interrupt fluid flow between the two fluidic elements. For example, in a flow path having a first valve, a second valve, and a third valve arranged sequentially therealong, the first valve would be fluidically adjacent to the second valve, the second valve fluidically adjacent to both the first and third valves, and the third valve fluidically adjacent to the second valve.

[0172] For the purposes of this disclosure, “at least one of X, Y, . . ., and Z” and “at least one selected from the group consisting of X, Y, . . ., and Z” may be construed as X only, Y only, . . ., Z only, or any combination of two or more of X, Y, . . ., and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0173] Although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Thus, a first element discussed below could be termed a second element without departing from the teachings of the disclosure. To this end, use of such identifiers, e.g., “a first element,” should not be read as suggesting, implicitly or inherently, that there is necessarily another instance, e.g., “a second element.” Further, the use, if any, of ordinal indicators, such as (a), (b), (c), . . ., or (1), (2), (3), . . ., or the like, in this disclosure and accompanying claims, is to be understood as not conveying any particular order or sequence, except to the extent that such an order or sequence is explicitly indicated. For example, if there are three steps labeled (i), (ii), and (iii), it is to be understood that these steps may be performed in any order (or even concurrently, if not otherwise contraindicated), unless indicated otherwise. For example, if step (ii) involves the handling of an element that is created in step (i), then step (ii) may be viewed as happening at some point after step (i). In a similar manner, if step (i) involves the handling of an element that is created in step (ii), the reverse isDocket No. LAM1P065WO to be understood.

[0174] Spatially relative terms, such as “beneath,” “below,” “under,” “lower,” “above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), and the like, may be used herein for descriptive purposes, and, thereby, to describe one element’s spatial relationship to at least one other element as illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of an apparatus in use, operation, and / or manufacture in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawings is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” or “over” the other elements or features. Thus, the term “below” can encompass both an orientation of above and below. Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and, as such, the spatially relative descriptors used herein interpreted accordingly.

[0175] The term “between,” as used herein and when used with a range of values, is to be understood, unless otherwise indicated, as being inclusive of the start and end values of that range. For example, between 1 and 5 is to be understood as inclusive of the numbers 1, 2, 3, 4, and 5, not just the numbers 2, 3, and 4.

[0176] As used herein, the phrase “operatively connected” is to be understood as referring to a state in which two components and / or systems are connected, either directly or indirectly, such that, for example, at least one component or system can control the other. For instance, a controller may be described as being operatively connected with (or to) a resistive heating unit, which is inclusive of the controller being connected with a sub-controller of the resistive heating unit that is electrically connected with a relay that is configured to controllably connect or disconnect the resistive heating unit with a power source that is capable of providing an amount of power that is able to power the resistive heating unit so as to generate a desired degree of heating. The controller itself likely will not supply such power directly to the resistive heating unit due to the current(s) involved, but it is to be understood that the controller is nonetheless operatively connected with the resistive heating unit.

[0177] As used herein, the singular forms, “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It is also to be understood that the phrases “for each <item> of the one or more <items>,” “each <item> of the one or more <items>,” and / or the like, if used herein, are inclusive of both a single-item group and multiple-item groups, i.e., the phrase “for . . . each” is used in the sense that it is used in programming languages to refer to each item of whatever population of items is referenced. For example, if the population of items referenced is a single item, then “each” would refer toDocket No. LAM1P065WO only that single item (despite dictionary definitions of “each” frequently defining the term to refer to “every one of two or more things”) and would not imply that there must be at least two of those items. Similarly, the term “set” or “subset” should not be viewed, in itself, as necessarily encompassing a plurality of items — it is to be understood that a set or a subset can encompass only one member or multiple members (unless the context indicates otherwise). In addition, the terms “comprises,” “comprising,” “includes,” and / or “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0178] Various implementations are described herein with reference to sectional views, isometric views, perspective views, plan views, and / or exploded illustrations that are schematic depictions of idealized implementations and / or intermediate structures. As such, variations from the shapes of the illustrations as a result of, for example, manufacturing techniques and / or tolerances, are to be expected. Thus, implementations disclosed herein should not be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result from, for instance, manufacturing. To this end, regions illustrated in the drawings may be schematic in nature and shapes of these regions may not reflect the actual shapes of regions of a device, and, as such, are not intended to be limiting.

[0179] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and are not to be interpreted in an idealized or overly formal sense, unless expressly so defined herein.

[0180] As customary in the field, some implementations are described and illustrated in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits, such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, and the like, which may be formed using semiconductor-based fabrication techniques or other manufacturing technologies. In the case of the blocks, units, and / or modules being implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform various functions discussed herein and may optionally be driven by firmware and / or software. It is also contemplated that each block, unit, and / or module may be implemented byDocket No. LAM1P065WO dedicated hardware, or as a combination of dedicated hardware to perform some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions. Also, each block, unit, and / or module of some implementations may be physically separated into two or more interacting and discrete blocks, units, and / or modules without departing from the inventive concepts. Further, the blocks, units, and / or modules of some implementations may be physically combined into more complex blocks, units, and / or modules without departing from the teachings of the disclosure.

[0181] Although the foregoing implementations have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. It should be noted that there are many alternative ways of implementing the processes, systems, and apparatuses of the disclosed implementations. Accordingly, implementations are to be considered as illustrative and not as restrictive, and implementations are not to be limited to the details given herein.

[0182] It is to be understood that the above disclosure, while focusing on a particular example implementation or implementations, is not limited to only the discussed example, but may also apply to similar variants and mechanisms as well, and such similar variants and mechanisms are also considered to be within the scope of this disclosure. For example, the above disclosure is directed to at least, but not exclusively, the following numbered implementations.

[0183] Implementation 1: An electroplating system, comprising N electroplating cells having a first electroplating cell and a second electroplating cell, wherein: each electroplating cell: is configured to perform an electroplating operation on a substrate having a notch, has an electrical contact apparatus having a plurality of electrical contact fingers arranged around a center axis and extending in a radial direction inwards towards the center axis, and has a cup assembly with a cup and cone, the cup fixedly connected to the electrical contact apparatus, and the cup assembly configured to hold and position the substrate in contact with the plurality of electrical contact fingers during the electroplating operation, the electrical contact fingers of each electrical contact apparatus have a width W transverse to the radial direction and circumferentially offset from immediately adjacent electrical contact fingers by an offset distance greater than W, each cup assembly is configured to rotate the cup and electrical contact apparatus to a plurality of rotational positions, the cup of the first electroplating cell is configured to be positioned in a first rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the first electroplating cell to contact a plurality of first locations on the substrate during a first electroplating operation in the first electroplating cell, the cup of the second electroplating cell is configured to be positioned in a secondDocket No. LAM1P065WO rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the second electroplating cell contact a plurality of second locations on the substrate during a second electroplating operation in the second electroplating cell, the first rotational position is different than the second rotational position with respect to the notch of the substrate, and the first locations are in different locations on the substrate than the second locations.

[0184] Implementation 2: The electroplating system of implementation 1, wherein the cup of the first electroplating cell is in the first rotational position with respect to the notch of the substrate when the substrate is loaded into the first electroplating cell, and the cup of the second electroplating cell is in the second rotational position with respect to the notch of the substrate when the substrate is loaded into the second electroplating cell.

[0185] Implementation 3: The electroplating system of implementation 1 or implementation 2, further comprising a transfer robot having an end effector and configured to load the substrate into the first electroplating cell while the notch of the substrate is at a notch position with respect to the end effector, and load the substrate into the second electroplating cell while the notch of the substrate is at the notch position with respect to the end effector.

[0186] Implementation 4: The electroplating system of implementations 1-3, wherein each cup assembly is configured to rotate the cup and the electrical contact apparatus to at least +0.6 degrees and -0.6 degrees with respect to the notch of the substrate.

[0187] Implementation 5: The electroplating system of implementations 1-4, further comprising a controller with one or more processors and one or more memories that store instructions for controlling the cup assembly of each electroplating cell, wherein the instructions are configured to cause the one or more processors to cause: the cup of the first electroplating cell to be positioned in the first rotational position for the first electroplating operation in the first electroplating cell, and the cup the second electroplating cell to be positioned in the second rotational position, different than the first rotational position, for the second electroplating operation in the second electroplating cell.

[0188] Implementation 6: The electroplating system of implementation 5, wherein the instructions are further configured to cause the one or more processors to cause: the cup of the second electroplating cell to rotate from another rotational position, different than the second rotational position, to the second rotational position before positioning the substrate into the second electroplating cell.

[0189] Implementation 7: The electroplating system of implementation 5, wherein the instructions are further configured to cause the one or more processors to: determine anDocket No. LAM1P065WO available electroplating cell of the N electroplating cells that is available for the second electroplating operation, cause, in response to the determination, the available electroplating cell to be positioned in the second rotational position, cause the substrate to be transferred into the available electroplating cell after the available electroplating cell is in the second rotational position, and perform the second electroplating operation in the available electroplating cell while the electrical contact fingers of the available electroplating cell contact the plurality of second locations on the substrate.

[0190] Implementation 8: The electroplating system of implementations 1-7, wherein the cup of the first electroplating cell is configured to be positioned in a third rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the first electroplating cell to contact a plurality of third locations on the substrate during a third electroplating operation in the first electroplating cell, the third rotational position is different than the first rotational position and the second rotational position with respect to the notch of the substrate, and the third locations are in different locations on the substrate than the first locations and the second locations.

[0191] Implementation 9: The electroplating system of implementations 1-8, wherein the N electroplating cells further has a third electroplating cell, the cup of the third electroplating cell is configured to be positioned in a third rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the third electroplating cell contact a plurality of third locations on the substrate during a third electroplating operation in the third electroplating cell, the third rotational position is different than the first rotational position and the second rotational position with respect to the notch of the substrate, and the third locations are in different locations on the substrate than the first locations and the second locations.

[0192] Implementation 10: The electroplating system of implementation 9, wherein a rotational direction between the first rotational position and the second rotational position is a first rotational direction, and a rotational direction between the first rotational position and the third rotational position is a second rotational direction opposite the first rotational position.

[0193] Implementation 11: The electroplating system of implementations 1-10, wherein a rotational distance between the first rotational position and the second rotational position is at least 0.1 degrees.

[0194] Implementation 12: The electroplating system of implementations 1-11, wherein a rotational distance between the first rotational position and the second rotational position is at least 0.3 degrees.

[0195] Implementation 13: The electroplating system of implementations 1-12, wherein aDocket No. LAM1P065WO rotational distance between the first rotational position and the second rotational position is at least 0.6 degrees.

[0196] Implementation 14: The electroplating system of implementations 1-13, wherein the electrical contact fingers of the first electroplating cell are arranged in a plurality of azimuthal positions about the center axis of the electrical contact apparatus, and the electrical contact fingers of the second electroplating cell are arranged in the plurality of azimuthal positions about the center axis of the electrical contact apparatus.

[0197] Implementation 15: The electroplating system of implementations 1-14, wherein the cup of the first electroplating cell is configured to be positioned in a third rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the first electroplating cell to contact a plurality of third locations on the substrate during a third electroplating operation in the first electroplating cell, the third rotational position is different than the first rotational position and the second rotational position with respect to the notch of the substrate, and the third locations partially overlap with the first locations.

[0198] Implementation 16: The electroplating system of implementations 1-15, wherein TV is greater than two, the electrical contact fingers of each electrical contact apparatus are radially offset from immediately adjacent electrical contact fingers by an offset distance greater than W * (N -1), and the electroplating system is configured to position the cup of each electroplating cell such that the electrical contact fingers of each electroplating cell contact the substrate at different locations than where the electrical contact fingers of the other electroplating cells contact the substrate.

[0199] Implementation 17: A method for electroplating, the method comprising providing a substrate having a notch to an electroplating system having N electroplating cells, wherein each electroplating cell is configured to perform an electroplating operation, has an electrical contact apparatus having a plurality of electrical contact fingers, and has a cup assembly with a cup and a cone, wherein the cup is fixedly connected to the electrical contact apparatus, wherein the cup assembly is configured to hold and position the substrate in contact with the plurality of electrical contact fingers during the electroplating operation, wherein the electrical contact fingers are arranged in a substantially equally spaced manner around a center axis, extend radially inwards towards the center axis, have a radial width W and are radially offset from immediately adjacent electrical contact fingers by an offset distance greater than W, and wherein each cup assembly is configured to rotate the cup and electrical contact apparatus to a plurality of rotational positions; positioning the cup and electrical contact apparatus of a first electroplating cell in a first rotational position with respect to the notch of the substrate;Docket No. LAM1P065WO positioning the substrate into the first electroplating cell while the cup and electrical contact apparatus of the first electroplating cell are in the first rotational position with respect to the notch of the substrate and thereby causing the electrical contact fingers of the first electroplating cell to contact a plurality of first locations on the substrate; performing a first electroplating operation on the substrate in the first electroplating cell; positioning the cup and electrical contact apparatus of a second electroplating cell in a second rotational position with respect to the notch of the substrate, wherein the second rotational position is different than the first rotational position with respect to the notch of the substrate; positioning the substrate into the second electroplating cell while the cup and electrical contact apparatus of the second electroplating cell are in the second rotational position with respect to the notch of the substrate and thereby causing the electrical contact fingers of the second electroplating cell to contact a plurality of second locations on the substrate, wherein the first locations are in different locations on the substrate than the second locations; and performing a second electroplating operation on the substrate in the second electroplating cell.

[0200] Implementation 18: The method of implementation 17, wherein the positioning the substrate into the first electroplating cell comprises loading the substrate into the first electroplating cell while the notch of the substrate is at a notch position with respect to an end effector supporting the substrate, and the positioning the substrate into the second electroplating cell comprises loading the substrate into the second electroplating cell while the notch of the substrate is at the notch position with respect to the end effector supporting the substrate.

[0201] Implementation 19: The method of implementation 17 or implementation 18, wherein positioning the cup and electrical contact apparatus of the second electroplating cell in the second rotational position comprises rotating the cup and electrical contact apparatus from another rotational position, different than the second rotational position, to the second rotational position before positioning the substrate into the second electroplating cell.

[0202] Implementation 20: The method of implementation 19, wherein the rotating is clockwise.

[0203] Implementation 21: The method of implementation 19, wherein the rotating is counterclockwise.

[0204] Implementation 22: The method of implementations 17-21, further comprising transferring the substrate from the first electroplating cell to the second electroplating cell.

[0205] Implementation 23: The method of implementations 17-22, further comprising determining an available electroplating cell of the N electroplating cells that is available for theDocket No. LAM1P065WO second electroplating operation; positioning, in response to the determining, the cup and electrical contact apparatus of the available electroplating cell in the second rotational position; transferring the substrate from the first electroplating cell to the available electroplating cell after the cup and electrical contact apparatus of the available electroplating cell are in the second rotational position; and performing the second electroplating operation in the available electroplating cell while the electrical contact fingers of the available electroplating cell contact the substrate at the plurality of second locations.

[0206] Implementation 24: The method of implementations 17-23, further comprising positioning the cup and electrical contact apparatus of a third electroplating cell in a third rotational position with respect to the notch of the substrate, wherein the third rotational position is different than the first rotational position and the second rotational position with respect to the notch of the substrate; transferring the substrate from the second electroplating cell to the third electroplating cell; positioning the substrate into the third electroplating cell while the cup and electrical contact apparatus of the third electroplating cell are in the third rotational position with respect to the notch of the substrate and thereby causing the electrical contact fingers of the third electroplating cell to contact a plurality of third locations on the substrate, wherein the first locations and the second locations are in different locations on the substrate than the third locations; and performing a third electroplating operation on the substrate in the third electroplating cell.

[0207] Implementation 25: The method of implementation 24, wherein the third electroplating cell is the same as the first electroplating cell.

[0208] Implementation 26: The method of implementation 24, wherein the third electroplating cell is different than the first electroplating cell and the second electroplating cell.

[0209] Implementation 27: The method of implementation 24, wherein positioning the cup and electrical contact apparatus of the second electroplating cell in the second rotational position comprises rotating the cup in a first rotational direction with respect to the notch of the substrate, and positioning the cup and electrical contact apparatus of the third electroplating cell in the second rotational position comprises rotating the cup in a second rotational direction, opposite the first rotational direction, with respect to the notch of the substrate.

[0210] Implementation 28: The method of implementation 24, wherein positioning the cup and electrical contact apparatus of the second electroplating cell in the second rotational position comprises rotating the cup in a first rotational direction with respect to the notch of the substrate, and positioning the cup and electrical contact apparatus of the third electroplating cell in the second rotational position comprises rotating the cup in the first rotational directionDocket No. LAM1P065WO with respect to the notch of the substrate.

[0211] Implementation 29: The method of implementations 17-28, wherein a rotational distance between the first rotational position and the second rotational position is at least 0.1 degrees.

[0212] Implementation 30: The method of implementations 17-29, wherein a rotational distance between the first rotational position and the second rotational position is at least 0.3 degrees.

[0213] Implementation 31: The method of implementations 17-30, wherein a rotational distance between the first rotational position and the second rotational position is at least 0.6 degrees.

[0214] Implementation 32: An electrical contact apparatus for an electroplating cup assembly, the electrical contact apparatus comprising a body portion extending at least partially around a central axis; and a plurality of electrical contacts arranged circumferentially around the central axis and extending radially inward toward the central axis from the body portion, wherein each electrical contact has: a proximal portion coupled to the body portion, and a distal portion configured to contact a substrate and move relative to the body portion in a direction parallel to the central axis and forming an included angle ranging from about 45 degrees to 145 degrees relative to the proximal portion, wherein the distal portion has an average surface roughness (Ra) of about 5 micro-inches or less.

[0215] Implementation 33: An electrical contact apparatus for an electroplating cup assembly, the electrical contact apparatus comprising a body portion extending at least partially around a central axis; and a plurality of electrical contacts arranged circumferentially around the central axis and extending radially inward toward the central axis from the body portion, wherein each electrical contact has a proximal portion coupled to the body portion, and a distal portion configured to contact a substrate and move relative to the body portion in a direction parallel to the central axis and forming an included angle ranging from about 45 degrees to 145 degrees relative to the proximal portion, wherein the distal portion of each electrical contact finger has an end portion that is beveled, chamfered, and / or has one or more curved surfaces.

[0216] Implementation 34: The electrical contact apparatus of implementations 32 or 33, wherein the end portion of each electrical contact finger has an average surface roughness (Ra) of about 3 micro-inches or less.

[0217] Implementation 35: The electrical contact apparatus of implementations 32-34, wherein a top surface of the distal portion of each electrical contact spans from the proximal portion to a distal end of the distal portion, and has a planar portion and the end portion, andDocket No. LAM1P065WO the planar portion and the end portion have an average surface roughness (Ra) of about 5 microinches or less.

[0218] Implementation 36: The electrical contact apparatus of implementation 35, wherein at least 70% of the top surface of the distal portion of each electrical contact has an average surface roughness Ra of about 5 micro-inches or less.

[0219] Implementation 37: The electrical contact apparatus of implementation 35, wherein the edges of the top surface of the distal portion of each electrical contact intersect with sides of the distal portion, and the edges are curved.

[0220] Implementation 38: The electrical contact apparatus of implementations 32-37, wherein the end portion of each electrical contact has one or more curved surfaces.

[0221] Implementation 39: The electrical contact apparatus of implementations 32-38, wherein the end portion of each electrical contact has a curved surface that spans from the distal end to a planar portion, and has a radius of about 0.0015 inches and 0.004 inches.

[0222] Implementation 40: The electrical contact apparatus of implementations 32-39, wherein each electrical contact has a width transverse to the radial direction and has a thickness, the thickness is between about 0.00325 inches and 0.00275 inches, and the width is between about 0.05 inches and 0.03 inches.

[0223] Implementation 41: The electrical contact apparatus of implementations 32-40, wherein each electrical contact has a width W transverse to the radial direction, is interposed between two immediately adjacent electrical contact fingers, and is circumferentially offset from each immediately adjacent electrical contact finger by an offset distance greater than 0.25W.

[0224] Implementation 42: The electrical contact apparatus of implementations 32-41, wherein the end portion of each electrical contact finger is beveled.

[0225] Implementation 43: The electrical contact apparatus of implementations 32-42, wherein the end portion of each electrical contact finger is rounded.

[0226] Implementation 44: The electrical contact apparatus of implementations 32-43, wherein the end portion of each electrical contact finger is chamfered.

[0227] Implementation 45: The electrical contact apparatus of implementation 44, wherein the end portion has a varying cross-sectional thickness in the radial direction that begins at 0.0 inches and ends at about 0.003 inches.

[0228] Implementation 46: The electrical contact apparatus of implementations 32-45, wherein the end portion of each electrical contact finger has one or more curved surfaces.

[0229] Implementation 47: The electrical contact apparatus of implementations 32-46,Docket No. LAM1P065WO wherein the end portion of each electrical contact finger has a curved surface that spans from the distal end to a planar portion, and has a radius of about 0.0015 inches and 0.004 inches.

[0230] Implementation 48: The electrical contact apparatus of implementations 32-47, wherein each electrical contact finger has a width transverse to the radial direction and has a thickness, and the thickness is between about 0.00325 inches and 0.00275 inches.

[0231] Implementation 49: The electrical contact apparatus of implementation 48, wherein the width is between about 0.05 inches and 0.03 inches.

[0232] Implementation 50: The electrical contact apparatus of implementations 32-49, wherein each electrical contact finger: has a width W transverse to the radial direction, is interposed between two immediately adjacent electrical contact fingers, and is circumferentially offset from each immediately adjacent electrical contact finger by an offset distance greater than W.

[0233] Implementation 51: An electroplating system, comprising N electroplating cells having a first electroplating cell and a second electroplating cell, each electroplating cell: is configured to perform an electroplating operation on a substrate, has an electrical contact apparatus having a plurality of electrical contact fingers arranged around a center axis and extending in a radial direction inwards towards the center axis, and has a cup assembly configured to hold and rotate the substrate, and position the substrate in contact with the plurality of electrical contact fingers during the electroplating operation; and a transfer robot configured to move the substrate between the electroplating cells, wherein: the electrical contact fingers of each electrical contact apparatus have a width W transverse to the radial direction and circumferentially offset from immediately adjacent electrical contact fingers by an offset distance greater than W, the electroplating system is configured to position the substrate in the first electroplating cell such that the electrical contact fingers of the first electroplating cell contact a plurality of first locations on the substrate during the electroplating operation in the first electroplating cell, the electroplating system is configured to position the substrate in the second electroplating cell such that the electrical contact fingers of the second electroplating cell contact a plurality of second locations on the substrate during the electroplating operation in the second electroplating cell, and the first locations are in different locations on the substrate than the second locations.

[0234] Implementation 52: The electroplating system of implementation 51, further comprising a controller with one or more processors and one or more memories that store instructions for controlling the transfer robot and the cup assembly of each electroplating cell, wherein the instructions are configured to cause the one or more processors to cause: the cupDocket No. LAM1P065WO assembly of the first electroplating cell to position the substrate in a first rotational position for the electroplating operation in the first electroplating cell, the transfer robot to transfer the substrate from the cup assembly of the first electroplating cell to the cup assembly of the second electroplating cell, and the cup assembly of the second electroplating cell to rotate the substrate to a second rotational position different than the first rotational position for the electroplating operation in the second electroplating cell.

[0235] Implementation 53: The electroplating system of implementation 52, wherein the rotational distance between the first rotational position and the second rotational position is at least 0.3 degrees.

[0236] Implementation 54: The electroplating system of implementation 52, wherein the electrical contact fingers of the first electroplating cell are arranged in a plurality of azimuthal positions about the center axis of the electrical contact apparatus, and the electrical contact fingers of the second electroplating cell are arranged in the plurality of azimuthal positions about the center axis of the electrical contact apparatus.

[0237] Implementation 55: The electroplating system of implementation 52, wherein the electrical contact fingers of the first electroplating cell are arranged in a plurality of first azimuthal positions about the center axis of the electrical contact apparatus, the electrical contact fingers of the second electroplating cell are arranged in a plurality of second azimuthal positions about the center axis of the electrical contact apparatus, and the first azimuthal positions are in different azimuthal locations than the second azimuthal positions.

[0238] Implementation 56: The electroplating system of implementations 45-55, wherein the electrical contact fingers of the first electroplating cell are arranged in a plurality of first azimuthal positions about the center axis of the electrical contact apparatus, the electrical contact fingers of the second electroplating cell are arranged in a plurality of second azimuthal positions about the center axis of the electrical contact apparatus, and the first azimuthal positions are different than the second azimuthal positions.

[0239] Implementation 57: The electroplating system of implementations 45-56, wherein N is greater than two, the electrical contact fingers of each electrical contact apparatus are radially offset from immediately adjacent electrical contact fingers by an offset distance greater than W * (N -1), and the electroplating system is configured to position the substrate in the electroplating cells such that the electrical contact fingers of each electroplating cell contact the substrate at different locations than where the electrical contact fingers of the other electroplating cells contact the substrate.

[0240] Implementation 58: The electroplating system of implementation 57, furtherDocket No. LAM1P065WO comprising a controller with one or more processors and one or more memories that store instructions for controlling the transfer robot and the cup assembly of each electroplating cell, wherein the instructions are configured to cause the one or more processors to cause: the cup assembly of the N electroplating cells to rotate the substrate by a rotational distance of between about W and W * 2 with respect to the rotational position of the substrate in the immediately previous electroplating cell, and the transfer robot to transfer the substrate between the cup assemblies of each of the N electroplating cells.

[0241] Implementation 59: A method for electroplating, the method comprising providing a substrate to a first electroplating cell, wherein the first electroplating cell has an electrical contact apparatus having a plurality of electrical contact fingers, and has a cup assembly configured to hold and rotate the substrate, and position the substrate in contact with the plurality of electrical contact fingers, wherein the electrical contact fingers are arranged in a substantially equally spaced manner around a center axis, extend radially inwards towards the center axis, have a radial width W and are radially offset from immediately adjacent electrical contact fingers by an offset distance greater than W; positioning the substrate in the first electroplating cell such that the electrical contact fingers of the first electroplating cell are contacting the substrate at a plurality of first positions; electroplating the substrate in the first electroplating cell; transferring the substrate from the first electroplating cell to a second electroplating cell, wherein the second electroplating cell has the electrical contact apparatus and the cup assembly; positioning the substrate in the second electroplating cell such that the electrical contact fingers of the second electroplating cell are contacting a plurality of second positions on the substrate, wherein the first positions are in different locations on the substrate than the second positions; and electroplating the substrate in the second electroplating cell.

[0242] Implementation 60: The method of implementation 59, wherein the positioning the substrate in the second electroplating cell comprises rotating, by the cup assembly of the second electroplating cell, the substrate to a second rotational position with respect to the substrate in the first electroplating cell.

[0243] Implementation 61: An electrical contact apparatus for an electroplating cup assembly, the electrical contact apparatus comprising an annular body having a central axis; a plurality of electrical contact fingers arranged circumferentially along an inner circumference of the annular body and directed radially inward toward the central axis, each contact finger having a proximal portion coupled to the annular body, a distal portion, and being configured to flexibly move when a force is applied to the distal portion; and wherein the distal portion has a surface roughness of 5 microinches or less and forms an angle relative to the proximal portion rangingDocket No. LAM1P065WO from 45 degrees to 145 degrees.

[0244] Implementation 62: The electrical contact apparatus of implementation 61, wherein the distal portion comprises a tapered end portion, a beveled end portion, or a rounded end portion.

[0245] Implementation 63: The electrical contact apparatus of implementation 61 or 62 or implementation 54, wherein each pair of adjacent electrical contact fingers are circumferentially spaced from one another.

[0246] Implementation 64: The electrical contact apparatus of implementations 61-63, wherein each electrical contact finger is evenly spaced from the two immediate adjacent electrical contact fingers.

[0247] Implementation 65: The electrical contact apparatus of implementations 61-64, wherein at least one electrical contact finger is circumferentially offset from an adjacent electrical contact finger by an offset distance.

[0248] Implementation 66: The electrical contact apparatus of implementations 61-65, wherein each electrical contact finger has a width and the offset distance is greater than the width of the electrical contact fingers.

[0249] Implementation 67: The electrical contact apparatus of implementations 61-66, wherein each electrical contact finger has a width and the offset distance is at least twice the width of the electrical contact fingers.

Claims

Docket No. LAM1P065WOCLAIMSWhat is claimed is:

1. An electroplating system, comprising N electroplating cells having a first electroplating cell and a second electroplating cell, wherein: each electroplating cell: is configured to perform an electroplating operation on a substrate having a notch, has an electrical contact apparatus having a plurality of electrical contact fingers arranged around a center axis and extending in a radially inward direction toward the center axis, and has a cup assembly fixedly connected to the electrical contact apparatus and configured to hold and position the substrate in contact with the plurality of electrical contact fingers during the electroplating operation; each electrical contact finger has a width W transverse to the radial direction and is circumferentially offset from each adjacent electrical contact finger by an offset distance greater than W, each cup assembly is configured to rotate the electrical contact apparatus to a plurality of rotational positions, the cup assembly of the first electroplating cell is configured to be positioned in a first rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the first electroplating cell to contact a plurality of first locations on the substrate during a first electroplating operation in the first electroplating cell, the cup assembly of the second electroplating cell is configured to be positioned in a second rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the second electroplating cell contact a plurality of second locations on the substrate during a second electroplating operation in the second electroplating cell, the first rotational position is different than the second rotational position with respect to the notch of the substrate, and the first locations are in different locations on the substrate than the second locations.

2. The electroplating system of claim 1 , further comprising a transfer robot having an end effector and configured to: load the substrate into the first electroplating cell while the notch of the substrate is at a notch position with respect to the end effector, andDocket No. LAM1P065WO load the substrate into the second electroplating cell while the notch of the substrate is at the notch position with respect to the end effector.

3. The electroplating system of claim 1, further comprising a controller with one or more processors and one or more memories that store instructions for controlling the cup assembly of each electroplating cell, wherein the instructions are configured to cause the one or more processors to cause: the cup assembly of the first electroplating cell to be positioned in the first rotational position for the first electroplating operation in the first electroplating cell, and the cup assembly of the second electroplating cell to be positioned in the second rotational position, different than the first rotational position, for the second electroplating operation in the second electroplating cell.

4. The electroplating system of claim 3, wherein the instructions are further configured to cause the one or more processors to cause: the cup assembly of the second electroplating cell to rotate from another rotational position, different than the second rotational position, to the second rotational position before positioning the substrate into the second electroplating cell.

5. The electroplating system of claim 3, wherein the instructions are further configured to cause the one or more processors to: determine an available electroplating cell of the N electroplating cells that is available for the second electroplating operation, cause, in response to the determination, the available electroplating cell to be positioned in the second rotational position, cause the substrate to be transferred into the available electroplating cell after the available electroplating cell is in the second rotational position, and perform the second electroplating operation in the available electroplating cell while the electrical contact fingers of the available electroplating cell contact the plurality of second locations on the substrate.

6. The electroplating system of claim 1, wherein: the N electroplating cells further has a third electroplating cell,Docket No. LAM1P065WO the cup assembly of the third electroplating cell is configured to be positioned in a third rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the third electroplating cell contact a plurality of third locations on the substrate during a third electroplating operation in the third electroplating cell, the third rotational position is different than the first rotational position and the second rotational position with respect to the notch of the substrate, and the third locations are in different locations on the substrate than the first locations and the second locations.

7. The electroplating system of claim 6, wherein: a rotational direction between the first rotational position and the second rotational position is a first rotational direction, and a rotational direction between the first rotational position and the third rotational position is a second rotational direction opposite the first rotational position.

8. The electroplating system of claim 1, wherein a rotational distance between the first rotational position and the second rotational position is at least 0.1 degrees.

9. The electroplating system of claim 1, wherein: the cup assembly of the first electroplating cell is configured to be positioned in a third rotational position with respect to the notch of the substrate and cause the electrical contact fingers of the first electroplating cell to contact a plurality of third locations on the substrate during a third electroplating operation in the first electroplating cell, the third rotational position is different than the first rotational position and the second rotational position with respect to the notch of the substrate, and the third locations partially overlap with the first locations.

10. The electroplating system of claim 1, wherein:N is greater than two, the electrical contact fingers of each electrical contact apparatus are radially offset from immediately adjacent electrical contact fingers by an offset distance greater than W * (N -1), and the electroplating system is configured to position the cup assembly of each electroplating cell such that the electrical contact fingers of each electroplating cell contact theDocket No. LAM1P065WO substrate at different locations than where the electrical contact fingers of the other electroplating cells contact the substrate.

11. A method for electroplating, the method comprising: providing a substrate having a notch to an electroplating system having N electroplating cells, wherein each electroplating cell is configured to perform an electroplating operation, has an electrical contact apparatus having a plurality of electrical contact fingers, and has a cup assembly, wherein the cup assembly is fixedly connected to the electrical contact apparatus, wherein the cup assembly is configured to hold and position the substrate in contact with the plurality of electrical contact fingers during the electroplating operation, wherein the electrical contact fingers are arranged in a substantially equally spaced arrangement around a center axis, extend radially inward toward the center axis, have a radial width W and are radially offset from immediately adjacent electrical contact fingers by an offset distance greater than W, and wherein each cup assembly is configured to rotate the electrical contact apparatus to a plurality of rotational positions; positioning the cup assembly and electrical contact apparatus of a first electroplating cell in a first rotational position with respect to the notch of the substrate; positioning the substrate into the first electroplating cell while the cup assembly and electrical contact apparatus of the first electroplating cell are in the first rotational position with respect to the notch of the substrate and thereby causing the electrical contact fingers of the first electroplating cell to contact a plurality of first locations on the substrate; performing a first electroplating operation on the substrate in the first electroplating cell; positioning the cup assembly and electrical contact apparatus of a second electroplating cell in a second rotational position with respect to the notch of the substrate, wherein the second rotational position is different than the first rotational position with respect to the notch of the substrate; positioning the substrate into the second electroplating cell while the cup assembly and electrical contact apparatus of the second electroplating cell are in the second rotational position with respect to the notch of the substrate and thereby causing the electrical contact fingers of the second electroplating cell to contact a plurality of second locations on the substrate, wherein the first locations are in different locations on the substrate than the second locations; andDocket No. LAM1P065WO performing a second electroplating operation on the substrate in the second electroplating cell.

12. The method of claim 11, wherein: the positioning the substrate into the first electroplating cell comprises loading the substrate into the first electroplating cell while the notch of the substrate is at a notch position with respect to an end effector supporting the substrate, and the positioning the substrate into the second electroplating cell comprises loading the substrate into the second electroplating cell while the notch of the substrate is at the notch position with respect to the end effector supporting the substrate.

13. The method of claim 11, wherein: positioning the cup assembly and electrical contact apparatus of the second electroplating cell in the second rotational position comprises rotating the cup assembly and electrical contact apparatus from another rotational position, different than the second rotational position, to the second rotational position before positioning the substrate into the second electroplating cell.

14. The method of claim 11, further comprising: determining an available electroplating cell of the / V electroplating cells that is available for the second electroplating operation; positioning, in response to the determining, the cup assembly and electrical contact apparatus of the available electroplating cell in the second rotational position; transferring the substrate from the first electroplating cell to the available electroplating cell after the cup assembly and electrical contact apparatus of the available electroplating cell are in the second rotational position; and performing the second electroplating operation in the available electroplating cell while the electrical contact fingers of the available electroplating cell contact the substrate at the plurality of second locations.

15. The method of claim 11, further comprising: positioning the cup assembly and electrical contact apparatus of a third electroplating cell in a third rotational position with respect to the notch of the substrate, wherein the thirdDocket No. LAM1P065WO rotational position is different than the first rotational position and the second rotational position with respect to the notch of the substrate; transferring the substrate from the second electroplating cell to the third electroplating cell; positioning the substrate into the third electroplating cell while the cup assembly and electrical contact apparatus of the third electroplating cell are in the third rotational position with respect to the notch of the substrate and thereby causing the electrical contact fingers of the third electroplating cell to contact a plurality of third locations on the substrate, wherein the first locations and the second locations are in different locations on the substrate than the third locations; and performing a third electroplating operation on the substrate in the third electroplating cell.

16. The method of claim 11, wherein a rotational distance between the first rotational position and the second rotational position is at least 0.1 degrees.

17. An electrical contact apparatus for an electroplating cup assembly, the electrical contact apparatus comprising: a body portion extending at least partially around a central axis; and a plurality of electrical contacts arranged circumferentially around the central axis and extending radially inward toward the central axis from the body portion, wherein each electrical contact has: a proximal portion coupled to the body portion, and a distal portion configured to contact a substrate and move relative to the body portion in a direction parallel to the central axis and forming an included angle ranging from about 45 degrees to 145 degrees relative to the proximal portion, wherein the distal portion has an average surface roughness (Ra) of about 5 micro-inches or less.

18. The electrical contact apparatus of claim 17, wherein the end portion of each electrical contact has an average surface roughness (Ra) of about 3 micro-inches or less.

19. The electrical contact apparatus of claim 17, wherein: a top surface of the distal portion of each electrical contact spans from the proximal portion to a distal end of the distal portion, and has a planar portion and the end portion, andDocket No. LAM1P065WO the planar portion and the end portion have an average surface roughness (Ra) of about 5 micro-inches or less.

20. The electrical contact apparatus of claim 19, wherein at least 70% of the top surface of the distal portion of each electrical contact has an average surface roughness Ra of about 5 micro-inches or less.

21. The electrical contact apparatus of claim 19, wherein: the edges of the top surface of the distal portion of each electrical contact intersect with sides of the distal portion, and the edges are curved.

22. The electrical contact apparatus of claim 17, wherein the end portion of each electrical contact has one or more curved surfaces.

23. The electrical contact apparatus of claim 17, wherein the end portion of each electrical contact has a curved surface that spans from the distal end to a planar portion, and has a radius of about 0.0015 inches and 0.004 inches.

24. The electrical contact apparatus of claim 17, wherein: each electrical contact has a width transverse to the radial direction and has a thickness, the thickness is between about 0.00325 inches and 0.00275 inches, and the width is between about 0.05 inches and 0.03 inches.

25. The electrical contact apparatus of claim 17, wherein each electrical contact: has a width W transverse to the radial direction, is interposed between two immediately adjacent electrical contact fingers, and is circumferentially offset from each immediately adjacent electrical contact finger by an offset distance greater than 0.25W.

Images