DEVICE, INTEGRATED CERAMIC RESONATOR, AND METHOD FOR MANUFACTURING AN INTEGRATED DEVICE

By integrating a surface-mounted circuit package directly onto a ceramic resonator with conductive via structures, the RF oscillator achieves stable and consistent high-frequency operation, addressing the limitations of quartz crystal-based oscillators.

BR112025019523A2Pending Publication Date: 2026-07-14QUALCOMM INC
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Patent Information

Authority / Receiving Office
BR · BR
Patent Type
Applications
Current Assignee / Owner
QUALCOMM INC
Filing Date
2024-03-11
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

Existing oscillators using quartz crystals for RF signal generation are large, sensitive to mechanical shock, and suffer from RF instabilities due to spurious capacitances and inductances when coupled to active oscillator circuits via wires, making them unsuitable for high-frequency applications and difficult to manufacture consistently.

Method used

A surface-mounted integrated circuit package is directly connected to an integrated ceramic resonator with conductive walls and a conductive rod, eliminating the need for wire coupling and reducing spurious capacitances and inductances, using a ceramic substrate with conductive via structures for electrical connections.

Benefits of technology

This configuration reduces RF instabilities, allows for smaller and more stable operation at high frequencies, and facilitates consistent manufacturing of RF oscillators with high quality factors, suitable for GHz frequency ranges.

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Abstract

In an aspect, an apparatus is disclosed that includes a surface-mounted integrated circuit package housing an active oscillator circuit; an integrated ceramic resonator formed from a ceramic substrate having an upper planar surface receiving the surface- mounted integrated circuit package, the integrated ceramic resonator including a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate, a conductive rod extending vertically into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity, a first conductive material extending vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package housing the active oscillator circuit; and a second conductive material extending through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package.
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