A kind of palladium-containing less and less clean sn-zn solder and preparation method thereof

Abstract

The invention discloses a clean Sn-Zn brazing material containing palladium. The weight percent composition of each metal element is as follows: Pd: 0.05%-0.3%, Ga: 0.1%-0.5%, In: 6%-10% %, Ag: 0.1% to 3.5%, Zn: 7% to 10%, and the balance is Sn. During preparation, the palladium is first absorbed hydrogen and ground into powder for later use; the metal silver and tin are smelted in proportion to form a silver-tin intermediate alloy; After ~450℃, add the raw material zinc and keep it warm to obtain the Sn-Zn-Ag intermediate alloy liquid; add the raw materials indium and gallium in sequence, and when the temperature of the melt drops to 250~350℃, keep it warm to get the Sn-Zn-Ag-In -Ga intermediate alloy liquid; add palladium powder, fully melt it, cover it with a mixture of zinc chloride and vegetable oil, keep warm, and pour it into an ingot; after extrusion, drawing / rolling, it can be made into a filament / sheet shape. The solder has the characteristics of high cleanliness, strong wettability, less brazing seam defects, and low melting point.

Description

technical field

[0001] The invention relates to a brazing filler metal for zinc-aluminum alloy brazing, in particular to a palladium-containing poorly clean Sn-Zn brazing filler metal, and also relates to a preparation method of the brazing filler metal. Background technique

[0002] Zinc alloys, especially wrought zinc alloys, have excellent comprehensive properties and become ideal substitutes for copper alloys in some fields, and have broad application prospects in cluster industries such as electronic communications, sanitary ware, hardware construction, electromechanical, and clothing. Many industries such as sanitary ware, hardware, home appliances and other light industries have used wrought zinc alloys to manufacture structural parts, so replacing copper structures with zinc-aluminum alloys is bound to become a development direction of the manufacturing industry.

[0003] At present, low-temperature soft soldering is generally used for zinc alloy brazing at home and ...

Examples

Embodiment 1

[0024] Prepare 100kg palladium-containing slightly clean Sn-Zn solder, its composition requirements are: Pd: 0.05%, Ga: 0.1%, In: 6%, Ag: 0.3%, Zn: 7.5%, and the balance is Sn.

[0025] The preparation method is:

[0026] a. Put 0.05kg of palladium (sponge palladium) into a hydrogen furnace at 800°C to absorb hydrogen for 2 hours, take it out and cool it, and grind it into fine powder for later use;

[0027] b. Melting 0.3kg of metallic silver and 0.9kg of metallic tin into 1.2kg of silver-tin master alloy;

[0028] c. After melting the remaining 85.15kg of metal tin and 1.2kg of silver-tin intermediate alloy smelted in the second step, add 7.5kg of metal zinc after the temperature of the melt in the furnace rises to 420°C, and wait until it is completely melted , keep warm for 15 minutes to obtain Sn-Zn-Ag intermediate alloy liquid;

[0029] d. Add 6kg of metal indium and 0.1kg of metal gallium into the Sn-Zn-Ag master alloy liquid in order to melt, and when the temperature...

Embodiment 2

[0033] Prepare 100kg palladium-containing slightly clean Sn-Zn solder, its composition requirements are: Pd: 0.08%, Ga: 0.2%, In: 6%, Ag: 0.3%, Zn: 7%, and the balance is Sn.

[0034] The preparation method is the same as in Example 1.

Embodiment 3

[0036] Prepare 100kg palladium-containing slightly clean Sn-Zn solder, its composition requirements are: Pd: 0.1%, Ga: 0.2%, In: 8%, Ag: 0.5%, Zn: 8%, and the balance is Sn.

[0037] The preparation method is the same as in Example 1.

technical field

[0001] The invention relates to a brazing filler metal for zinc-aluminum alloy brazing, in particular to a palladium-containing poorly clean Sn-Zn brazing filler metal, and also relates to a preparation method of the brazing filler metal. Background technique

[0002] Zinc alloys, especially wrought zinc alloys, have excellent comprehensive properties and become ideal substitutes for copper alloys in some fields, and have broad application prospects in cluster industries such as electronic communications, sanitary ware, hardware construction, electromechanical, and clothing. Many industries such as sanitary ware, hardware, home appliances and other light industries have used wrought zinc alloys to manufacture structural parts, so replacing copper structures with zinc-aluminum alloys is bound to become a development direction of the manufacturing industry.

[0003] At present, low-temperature soft soldering is generally used for zinc alloy brazing at home and ...

Examples

Embodiment 1

[0024] Prepare 100kg palladium-containing slightly clean Sn-Zn solder, its composition requirements are: Pd: 0.05%, Ga: 0.1%, In: 6%, Ag: 0.3%, Zn: 7.5%, and the balance is Sn.

[0025] The preparation method is:

[0026] a. Put 0.05kg of palladium (sponge palladium) into a hydrogen furnace at 800°C to absorb hydrogen for 2 hours, take it out and cool it, and grind it into fine powder for later use;

[0027] b. Melting 0.3kg of metallic silver and 0.9kg of metallic tin into 1.2kg of silver-tin master alloy;

[0028] c. After melting the remaining 85.15kg of metal tin and 1.2kg of silver-tin intermediate alloy smelted in the second step, add 7.5kg of metal zinc after the temperature of the melt in the furnace rises to 420°C, and wait until it is completely melted , keep warm for 15 minutes to obtain Sn-Zn-Ag intermediate alloy liquid;

[0029] d. Add 6kg of metal indium and 0.1kg of metal gallium into the Sn-Zn-Ag master alloy liquid in order to melt, and when the temperature...

Embodiment 2

[0033] Prepare 100kg palladium-containing slightly clean Sn-Zn solder, its composition requirements are: Pd: 0.08%, Ga: 0.2%, In: 6%, Ag: 0.3%, Zn: 7%, and the balance is Sn.

[0034] The preparation method is the same as in Example 1.

Embodiment 3

[0036] Prepare 100kg palladium-containing slightly clean Sn-Zn solder, its composition requirements are: Pd: 0.1%, Ga: 0.2%, In: 8%, Ag: 0.5%, Zn: 8%, and the balance is Sn.

[0037] The preparation method is the same as in Example 1.