Transient Electrical Test Method for Thermal Resistance of Liquid-Cooled Cold Plates

Abstract

The invention provides a transient electrical testing method for the thermal resistance of a liquid cooling cold plate, and aims to provide a method for rapidly measuring the thermal resistance of a liquid cooling cold plate of high heating flux electronic equipment. The invention is achieved by the following technical scheme that a transient heat tester T3Ster is connected with a computer, and a semiconductor and an adapter thereof are connected to corresponding interfaces of a T3Ster testing host; that the voltage temperature coefficient (k coefficient) value of the tested semiconductor is tested and stored in a file; that main parameters of heating time, cooling time, heating current, testing current and voltmeter measuring range are set in T3Ster testing software arranged in the computer according to semiconductor and cold plate features; that a cooling curve of the tested semiconductor is obtained using T3Ster transient electrical testing; that data analysis is conducted to remove noise points in a testing curve and to perform mathematical transform of the testing curve; that a differential structure function is calculated, and a thermal resistance value of the liquid cooling cold plate is separated according to the differential structure function, thereby obtaining the thermal resistance of the cold plate.

Description

technical field

[0001] The invention belongs to a thermal resistance testing method in the thermal control field of electronic equipment. Background technique

[0002] With the advancement of science and technology, the complexity of electronic equipment continues to increase, the working capacity increases, and its volume shrinks sharply. With the sharp increase in the volume and power of electronic components, natural cooling and forced air cooling are difficult to meet The need for thermal design of electronic components. As an efficient and mature heat exchange equipment, cold plate is widely used in electronic equipment cooling. At present, the development of electronic devices tends to be miniaturized and integrated gradually. Miniaturized and integrated electronic devices not only increase the difficulty of processing and assembly, but also increase the difficulty of heat dissipation of electronic devices. According to statistics, the vast majority of electronic de...

Examples

Embodiment 1

[0034] Since the SOT-93 packaged transistor, such as a triode, can meet the test packaging requirements of T3Ster, it is possible to use a SOT-93 packaged transistor as the semiconductor device under test, and perform the following steps:

[0035] refer to figure 1 . First, measure the k coefficient of the triode: connect the triode and its adapter to the corresponding interface of the transient thermal tester T3Ster test host; In the T3Ster test software built into the computer, set the test temperature range according to the characteristics of the triode; perform the k coefficient test in the given temperature range and save the test results;

[0036] refer to Figure 8 . Second, according to Figure 8 As shown in the circuit connection diagram of the semiconductor device, connect the triode and its adapter to the corresponding interface of the T3Ster test host;

[0037] refer to Figure 9 . Third, according to the cold plate test semiconductor installation diagram, u...

technical field

[0001] The invention belongs to a thermal resistance testing method in the thermal control field of electronic equipment. Background technique

[0002] With the advancement of science and technology, the complexity of electronic equipment continues to increase, the working capacity increases, and its volume shrinks sharply. With the sharp increase in the volume and power of electronic components, natural cooling and forced air cooling are difficult to meet The need for thermal design of electronic components. As an efficient and mature heat exchange equipment, cold plate is widely used in electronic equipment cooling. At present, the development of electronic devices tends to be miniaturized and integrated gradually. Miniaturized and integrated electronic devices not only increase the difficulty of processing and assembly, but also increase the difficulty of heat dissipation of electronic devices. According to statistics, the vast majority of electronic de...

Examples

Embodiment 1

[0034] Since the SOT-93 packaged transistor, such as a triode, can meet the test packaging requirements of T3Ster, it is possible to use a SOT-93 packaged transistor as the semiconductor device under test, and perform the following steps:

[0035] refer to figure 1 . First, measure the k coefficient of the triode: connect the triode and its adapter to the corresponding interface of the transient thermal tester T3Ster test host; In the T3Ster test software built into the computer, set the test temperature range according to the characteristics of the triode; perform the k coefficient test in the given temperature range and save the test results;

[0036] refer to Figure 8 . Second, according to Figure 8 As shown in the circuit connection diagram of the semiconductor device, connect the triode and its adapter to the corresponding interface of the T3Ster test host;

[0037] refer to Figure 9 . Third, according to the cold plate test semiconductor installation diagram, u...

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