All-quartz crystal oscillator with improved package structure and preparation method thereof

A technology of quartz crystal and packaging structure, applied in electrical components, impedance networks, etc., can solve problems such as affecting the vacuum degree of products, and achieve the effects of improving versatility, improving vacuum degree, and preventing parasitic capacitance

CN107819450APending Publication Date: 2018-03-20CHENGDU TIMEMAKER CRYSTAL TECH
8 Cites 2 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2018-03-20

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses an all-quartz crystal oscillator with an improved package structure and a preparation method thereof, the all-quartz crystal oscillator with the improved package structure comprises a quartz wafer, a package cover and a package pedestal, the quartz wafer comprises a protection frame, the upper surface of the protection frame is provided with a package metal layer A, a package metal layer B is arranged outside a projection of the package metal layer A on the lower surface of the protection frame, a package metal layer C is arranged on a region, directly facing the package metal layer A, of the package cover, and a package metal layer D is arranged on a region, directly facing the package metal layer B, of the package pedestal; the projection of the package metal layer A and the projection of the package metal layer B are not overlapped mutually on the quartz wafer, thus, generation of parasitic capacitance can be prevented effectively; and instead of a glass solder or a resin solder, a metal is used for packaging, vacuum degree of products can be improved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of quartz crystal resonators, in particular to an all-quartz crystal resonator with an improved packaging structure and a preparation method thereof. Background technique

[0002] Quartz crystal resonators are usually composed of piezoelectric quartz wafers and packaging shells, wherein the piezoelectric quartz wafers are rectangular or circular, and the packaging shell materials are ceramics, glass, metal, etc. Electrodes are vapor-deposited on the upper and lower sides of the piezoelectric quartz wafer, and are fixed in the packaging shell by conductive glue. The electrodes are connected to the base pins of the packaging shell through the leads of the sealed package. The AC voltage is connected to the upper and lower electrodes of the quartz wafer through the pins, causing the quartz wafer to produce an inverse piezoelectric effect, thereby generating oscillation.

[0003] With the rapid development of mo...

Examples

specific Embodiment 1

[0041] An all-quartz crystal resonator with an improved packaging structure, comprising a quartz wafer 2, a packaging cover 1 and a packaging base 3, the quartz wafer 2 includes a protective frame 207, and the upper surface of the protective frame 207 is provided with a packaging metal layer A201 The encapsulation metal layer A201 is provided with an encapsulation metal layer B202 outside the projection of the lower surface of the protective frame 207, and the encapsulation cover 1 is provided with an encapsulation metal layer C101 in the area facing the encapsulation metal layer A201, and the encapsulation base An encapsulation metal layer D301 is provided on the seat 3 facing the encapsulation metal layer B202. After encapsulation, the encapsulation metal layers on the upper and lower surfaces of the quartz wafer are staggered from each other, and no capacitance structure is formed, thus avoiding the generation of parasitic capacitance.

[0042]The quartz wafer 2 also include...