A kind of manufacturing method of pcb and pcb

A manufacturing method and heat dissipation substrate technology, which is applied in the direction of printed circuits connected with non-printed electrical components, circuit heating devices, printed circuit components, etc., can solve the limitations, the overall weight of PCB is large, and the manufacturing process and process complexity are increased To achieve reliable electrical connection or grounding, save assembly space, and reduce thickness

CN108184308BActive Publication Date: 2020-06-26DONGGUAN SHENGYI ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2020-06-26

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Abstract

The invention, which relates to the field of circuit board technology, specifically discloses a manufacturing method of a PCB and a PCB. The manufacturing method comprises: S1, a substrate is provided, a straight slot is formed in the substrate, and thus the side wall of the straight slot is metalized to form a slot wall cooper part; S2, a heat dissipation substrate is provided, a copper layer islaid on the upper surface of the heat dissipation substrate, and a heat dissipation substrate circuit pattern is formed on the copper layer; S3, the heat dissipation substrate is embedded in the straight slot of the substrate and thus the upper surface of the heat dissipation substrate is placed in the straight slot, and the copper layer formed on the upper surface of the heat dissipation substrate is communicated with the slot wall cooper part; and S4, a board circuit pattern is formed on the surface of the substrate and is communicated with the heat dissipation substrate circuit pattern by the slot wall cooper part. In addition, the invention also provides a PCB formed by using the manufacturing method. Therefore, the heat dissipation efficiency of the power component can be improved; the height of the PCB can be reduced effectively; and reliable electrical connection between the power component on the surface of the heat dissipation substrate and the PCB surface circuit pattern is realized.
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Description

technical field

[0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a PCB and the PCB. Background technique

[0002] Due to the rapid development of electronic technology, PCBs are constantly improving in the direction of miniaturization, multi-function, high integration and high power. Therefore, the requirements for PCB heat dissipation performance are getting higher and higher. The current mainstream PCB heat dissipation technologies mainly include metal substrates. (aluminum substrate, copper substrate) technology, ceramic substrate technology, and buried copper block technology. The heat is dissipated in time, thereby reducing the temperature of electrical appliances and equipment, improving the service life of each high-power component and the working performance and reliability of the entire electrical appliance.

[0003] However, the problem with the heat dissipation technology of the above-mentioned PCB...

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Embodiment Construction

[0031] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only the parts related to the present invention are shown in the drawings but not all of them.

[0032] Such as figure 1 As shown, the present embodiment provides a method for manufacturing a PCB, comprising the following steps:

[0033] Step 1, providing a substrate 1 . Specifically, the substrate 1 may be a single core board, or a multi-layer board formed by laminating multiple core boards. When the substrate 1 is a multi-layer board formed by laminating multiple core boards, multiple core boards and prepregs are provided, and prepregs are stacked between two adjacent c...