High sensitivity near field resonant electric field test probe with loaded T-type electrode

Abstract

The invention relates to a high sensitivity near field resonant electric field test probe with a loaded T-type electrode. The test probe at least comprises a micro coaxial connector (SMA connector) and an electric field probe body, wherein the electric field probe body comprises a detection tip with the loaded T-type electrode, a resonator, an impedance transformer, a signal through hole and a coplanar waveguide CB-CPW with a metal back plate, design and manufacturing of the electric field probe body are based on the PCB process, and the four-layer board structure is employed. The test probe is advantaged in that high sensitivity, miniaturization and the high score rate are realized, useful electric field signals can be effectively extracted in the weak radiation level environment of the CPS band; the PCB processing process is employed to reduce production cost and shorten the development cycle; a more efficient and highly sensitive detection technology device is provided for interference source positioning and tracking of GPS narrowband RF electronic systems.

Description

Technical field

[0001] The invention relates to a high-sensitivity near-field resonance electric field test probe loaded with a T-shaped electrode, which is used for the extraction of narrow-band weak electric field signals, and belongs to the field of electromagnetic leakage and electromagnetic field near-field testing.

Background technique

[0002] Due to the increase in operating frequency, the increase in the wiring density of printed circuit boards, the rapid switching of high and low levels of digital signals, and the increase in the speed of data buses, some undesirable electromagnetic field radiation has been generated. These radiations are picked up by cables, traces or pins of integrated circuits, and coupled into electronic devices or electronic systems, resulting in serious electromagnetic compatibility problems, making the design of high-performance RF electronic systems facing new challenges and severe challenges. difficulty. In electronic product design, ...

Examples

Embodiment Construction

[0029] Combined with the accompanying drawings, the structure, positional relationship and function of each part of a high-sensitivity near-field resonant electric field test probe loaded with T-shaped electrodes will be further clarified.

[0030] figure 1 A four-layer PCB stacked structure of a high-sensitivity near-field resonant electric field test probe loaded with a T-shaped electrode is shown in the present invention. figure 2 An overall top view of a high-sensitivity near-field resonant electric field test probe loaded with a T-shaped electrode is shown in the present invention. Fig. 3 shows successively from left to right the first layer (Fig. 3(a)) and the second layer (Fig. ), the third layer (Fig. 3(c)) and the fourth layer (Fig. 3(d)).

[0031] The invention relates to a high-sensitivity near-field resonance electric field test probe loaded with a T-shaped electrode, which includes an SMA connector 1-1 and an electric field probe body; the design and processing...

Technical field

[0001] The invention relates to a high-sensitivity near-field resonance electric field test probe loaded with a T-shaped electrode, which is used for the extraction of narrow-band weak electric field signals, and belongs to the field of electromagnetic leakage and electromagnetic field near-field testing.

Background technique

[0002] Due to the increase in operating frequency, the increase in the wiring density of printed circuit boards, the rapid switching of high and low levels of digital signals, and the increase in the speed of data buses, some undesirable electromagnetic field radiation has been generated. These radiations are picked up by cables, traces or pins of integrated circuits, and coupled into electronic devices or electronic systems, resulting in serious electromagnetic compatibility problems, making the design of high-performance RF electronic systems facing new challenges and severe challenges. difficulty. In electronic product design, ...

Examples

Embodiment Construction

[0029] Combined with the accompanying drawings, the structure, positional relationship and function of each part of a high-sensitivity near-field resonant electric field test probe loaded with T-shaped electrodes will be further clarified.

[0030] figure 1 A four-layer PCB stacked structure of a high-sensitivity near-field resonant electric field test probe loaded with a T-shaped electrode is shown in the present invention. figure 2 An overall top view of a high-sensitivity near-field resonant electric field test probe loaded with a T-shaped electrode is shown in the present invention. Fig. 3 shows successively from left to right the first layer (Fig. 3(a)) and the second layer (Fig. ), the third layer (Fig. 3(c)) and the fourth layer (Fig. 3(d)).

[0031] The invention relates to a high-sensitivity near-field resonance electric field test probe loaded with a T-shaped electrode, which includes an SMA connector 1-1 and an electric field probe body; the design and processing...

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