Decoupling system and method for decoupling system

Abstract

A decoupling system is disclosed, comprising a deflector plate configured to couple across a low pressure orifice of a low pressure chamber. The deflector plate comprises one or more vacuum holes extending through the deflector plate. A peeling flange is coupled to the remainder of the deflector plate at a compliant joint. A die profile opening extends from the compliant joint in the shape of a die profile around the peeling flange. The die profile opening separates the peeling flange from the remainder of the deflector plate. The peeling flange comprises a relaxed configuration and a peeling configuration, the relaxed configuration and the peeling configuration being configured to decouple the die from the die medium. In the relaxed configuration, the peeling flange coincides with the remainder of the deflector plate. In the peeling configuration, the peeling flange is deflected and at least a portion of the flange is spaced apart from the remainder of the deflector plate.

Description

Technical Field

[0001] This document generally relates to, but is not limited to, removing a package, such as a die, from a transport medium or a storage medium. Background Art

[0002] The wafer is bonded to a transport or storage medium such as Mylar to facilitate shipping and storage after the wafer is singulated into die. When it is desired to transport one or more die from the singulated wafer, the die is removed from the medium and moved to a tray, tape, track, etc. for further processing downstream, including bonding the die to a substrate (e.g., packaging).

[0003] In some examples, the die is removed from the medium by prying the die with an array of needles. The array of needles engages against a surface of the medium opposite to the surface on which the die is adhered. The die is coupled to a manipulator, for example, by pneumatic adsorption. The array of needles is driven upward into the medium. The engagement of each needle is transmitted to the die through the medium. At the same time, the manipulator is moved upward corresponding to the movement of the array of needles. The force transmitted through the medium pries the die away from the medium, thereby decoupling the die from the medium. The manipulator transports the decoupled die to a tray, belt, track, etc.

[0004] In other examples, the medium includes a heat-activated material, such as heat-activated Mylar. When decoupling the die from the medium, it is desirable to locally heat the medium near the die. Once the medium is heated, the adhesion between the die and the medium is broken and the die is removed using, for example, a manipulator. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] In the accompanying drawings, similar reference numerals may describe similar components in different views, and the drawings are not necessarily drawn to scale. Similar reference numerals with different letter suffixes may represent different instances of similar components. The accompanying drawings generally illustrate various embodiments discussed herein by way of example and not limitation.

[0006] Figure 1 is a side view of an example of a decoupled system.

[0007] Figure 2 is a schematic diagram of one example of a decoupler assembly including a deflection plate and a movable stage.

[0008] Figure 3 yes Figure 1 A cross-sectional view of a decoupling system, the section being taken through the decoupler assembly.

[0009] Figure 4A is a perspective view of an example of a deflection plate.

[0010] Figure 4B yes Figure 4A Top view of the deflector plate.

[0011] Figure 5A is a schematic diagram of the decoupled system with the spalling flange in a relaxed configuration.

[0012] Figure 5B is a schematic diagram of the decoupled system with the spalling flange in the spalling configuration.

[0013] Figure 5C is a schematic diagram of a decoupling system with the peel flange in a decoupled configuration and the die separated from the die dielectric.

[0014] Fig. 6A is an exemplary linear stress graph for a decoupling system including a deflector plate with a peeling flange.

[0015] Figure 6B is an example point stress graph for another decoupled system including a needle array.

[0016] Figure 7 is a block diagram illustrating one example of a method for decoupling a die medium from a die. DETAILED DESCRIPTION

[0017] The inventors have recognized that the problems to be solved may include, among other things, minimizing stresses on the die resulting from decoupling the die from a transport or storage medium (e.g., a medium or a die medium). The needle array generates large point loads and corresponding local (and relatively large) stresses in the die. In at least some examples, the point loads from the needle array generate cracks in the die or propagate cracks already present in the die, which may cause a device including the die to fail. After decoupling from the medium, the die is processed in additional steps, including one or more of bonding the chip to the die, thermally treating, etc. Defects in the die resulting from cracks generated or aggravated by the point loads of the needle array (in at least some examples) will not be detected until electrical testing after these processing steps. Therefore, a significant amount of time, labor, and value is added to the failed die that must be discarded or recycled.

[0018] This phenomenon is further enhanced by the industry goal of manufacturing thinner devices with thin, less robust dies (e.g., for use in small-scale devices such as tablets, mobile phones, etc.) Thin dies are subject to greater deflection and correspondingly greater stress under point loading, and are therefore susceptible to aggravated cracks.

[0019] The present subject matter can help provide a solution to this problem, for example, by utilizing a decoupling system configured to peel off a die medium from a die. The decoupling system includes a deflection plate configured to receive a die medium, wherein the die is adhered to the medium. The die (adhered to the die medium) is aligned with a peeling flange of the plate (e.g., in one example, corresponding to a die profile opening). The die medium is secured to the deflection plate. The peeling flange is deflected (e.g., rotated and bent, curved, peeled off, etc.) away from the die. Because the die medium is secured to the peeling flange, the medium moves with the deflected flange. The deflection forms a linear separation gap between the die and the die medium. In one example, the linear separation gap includes a shape corresponding to one or more of a flange end of the peeling flange (e.g., separated from the rest of the deflection plate) or a die profile opening, such as a channel formed between the peeling flange and the rest of the deflection plate. As the peel flange and the secured die dielectric are further deflected, the linear separation gap propagates across the die. Because the die and die dielectric separate along a line and the die dielectric peels (e.g., along the linear separation gap), point loading of the die is minimized (e.g., minimized or eliminated), and corresponding stresses imparted on the die are reduced.

[0020] The decoupling system reliably decouples the die from the die dielectric while minimizing the initiation or aggravation of cracks in the die. In addition, because the decoupling system strips the die dielectric away from the die and thereby distributes stress along the die (e.g., as opposed to the point loading of a pin array), the decoupling system is readily used with thin dies that would otherwise be susceptible to initiation or aggravation of cracks when separated from the dielectric using a pin array.

[0021] This summary is intended to provide an overview of the subject matter of this patent application. It is not intended to provide an exclusive or exhaustive explanation of the present disclosure. Specific embodiments are included to provide additional information about this patent application.

[0022] Figure 1 An example of a decoupling system 100 is shown. In the example, the decoupling system 100 includes a decoupler assembly 101. As further described herein, in yet another example, the decoupling system 100 includes the decoupler assembly 101 and a pickup assembly 204 configured to be secured to a die or other semiconductor to facilitate peeling of the die dielectric from the die. The decoupler assembly 101 of the decoupling system 100 includes a decoupler housing 104 surrounding a low pressure chamber 106. As further described herein, Figure 1 As further shown, the decoupler assembly 101 includes a portion of the decoupler housing 104 (eg, a low pressure port, such as Figure 22 and 3. The deflector plate 102 is coupled to the die medium (see orifice 208 shown in FIG. 2 ). As will be described herein, the deflector plate 102 includes features that facilitate removal of the die from the die medium, such as a polymer, including but not limited to biaxially oriented polyethylene terephthalate (BoPET, trade name Mylar). The deflector plate 102 includes a peel flange 108 configured to facilitate decoupling the die medium from the die.

[0023] like Figure 1 As further shown, the decoupler assembly 101 provides a low pressure chamber 106 as described herein. In another example, an actuator (e.g., a removable stage, etc.) is provided within the low pressure chamber 106 and is configured to couple with the deflection plate 102. As will be described herein, the removable stage or actuator operates to deflect a portion of the deflection plate 102 (e.g., including the peeling flange 108) to peel the die medium from the die and thereby facilitate removal of the die from the die medium for storage, further processing, etc.

[0024] Reference again Figure 1 As previously described, the deflector plate 102 includes a peeling flange 108. In one example, the peeling flange 108 is at least partially bounded by the die outline opening 114. The die outline opening 114 isolates the peeling flange 108 from the rest of the deflector plate 102. Figure 1 As shown, the die outline opening 114 extends around the peel flange 108, and the other side of the peel flange 108 includes a compliant hinge 112. Figure 1 As shown, the compliant hinge 112 optionally extends between the sides of the die outline opening 114. In one example, the die outline opening 114 has a profile corresponding to a die (e.g., a die adhered to a die medium). As will be described herein, by providing the die outline opening 114 in a shape corresponding to the die, for example, the die medium adhered to the die is easily removed by peeling off the flange 108.

[0025] like Figure 1As further shown, the peel flange 108 includes a flange end 110. In one example, the flange end 110 includes a linear feature extending across the peel flange 108 and away from the opposite sides of the peel flange 108 including a compliant hinge 112. As will be described herein, in one example, the shape of the flange end 110 and the die profile opening 114 controls the creation and propagation of a linear separation gap between the die media and the die positioned above the deflector plate 102. The peel flange 108 of the deflector plate 102 also includes a compliant hinge 112 (e.g., a living hinge, a joint, etc.) configured to allow the peel flange 108 to deflect relative to the remainder of the deflector plate 102, which includes, for example, a plate perimeter 116. In one example, the peel flange 108 is configured to be moved into a deflected or bent configuration by actuation by a movable stage within the decoupler assembly 101 to facilitate pulling a portion of the die media away from a die statically held above the peel flange 108.

[0026] like Figure 1 As further shown, the deflector plate 102 includes one or more vacuum holes 118 provided at least on the peel flange 108. In another example, the vacuum holes 118 are provided at multiple locations on the deflector plate 102, including but not limited to the peel flange 108, the plate perimeter 116, etc. In one example, the vacuum holes 118 are used in conjunction with a low-pressure fluid (e.g., air) in the low-pressure chamber 106 to secure the die media (and the die adhered thereto) to the deflector plate 102 before and during operation of the decoupling system 100. By securing the die media to the deflector plate 102, e.g., to the peel flange 108, deflection of the peel flange 108 accordingly moves the die media away from the suspended die and thereby peels the die media from the die itself. In cooperation with the die outline opening 114, the peel flange 108 creates a linear separation gap between the die and the die medium (adhered to the peel flange) to minimize the local (e.g., point) stresses imparted on the die while providing consistent and reliable removal of the die medium from the die. In addition, in at least some examples, the pressure gradient between the upper and lower surfaces of the die medium (generated using the low-pressure fluid in the chamber 106) induces a linear separation gap between the die medium and the die along the die outline opening 114 and the edge of the peel flange 108 including the flange end 110.

[0027] Reference now Figure 2 , providing the previously Figure 12 is a partial cross-sectional view of a decoupling system 100 shown in FIG. 2. In this example, the decoupling system 100 includes a pickup assembly 204 and a decoupler assembly 101. Referring first to the decoupler assembly 101, as previously described, the decoupler assembly 101 includes a decoupler housing 104 that includes a low-pressure chamber 106 therein. In one example, the low-pressure chamber 106 is in communication with a negative pressure source, such as a vacuum pump, that is configured to reduce the pressure within the decoupler housing 104 relative to an external pressure, such as a pressure introduced on an opposing surface of the core medium located on the deflector plate 102.

[0028] like Figure 2 As further shown, the pick-up assembly 204 is shown in a raised position relative to the deflector plate 102. As shown, in one example, the pick-up assembly 204 includes a die interface 206 configured to be secured along a surface of a die, such as a die coupled to a die medium such as Mylar or other flexible polymer. The die interface 206 includes, but is not limited to, a suction interface, such as a pneumatic suction interface, an adhesive, a suction cup, etc., configured to secure the pick-up assembly 204 to the die while positioning the die on the die medium on the deflector plate 102. The pick-up assembly 204 holds the die in a stationary position while a portion of the deflector plate 102, such as the peel flange 108, is deflected to peel the die medium from the statically held die. In one example, the pick assembly 204 is coupled to or is part of a movable arm, actuator, etc., which is configured to move the decoupled tube core relative to the decoupler assembly 101, for example, for storage, further processing, etc.

[0029] like Figure 2 As further shown, the deflector plate 102 is shown in partial cross-section (the peel flange itself is not cross-hatched for ease of illustration), for example, the peel flange 108 extends from the compliant hinge 112 to the flange end 110. As previously described, in one example, the flange end 110 and the remainder of the peel flange 108 have a contour corresponding to the shape and size of the die to be removed from its die medium. Figure 2 As further shown, the deflector plate 102 including the peeling flange 108 is mounted across the low pressure aperture 208 of the decoupler housing 104. By providing the deflector plate 102 across the low pressure aperture 208, the pressure gradient provided by the low pressure fluid within the low pressure chamber 106 cooperates with, for example, a higher pressure fluid external to the decoupler housing 104 to secure the core media and the core thereon to the deflector plate 102 to facilitate peeling of the core media from the core, as described herein.

[0030] like Figure 2As further shown, the deflector plate 102 includes a peeling flange 108. The peeling flange is in turn coupled to a movable stage 200. In one example, the movable stage 200 is an actuator coupled to the peeling flange 108 (e.g., directly or indirectly) to deflect the peeling flange 108 relative to the remainder of the deflector plate 102 (e.g., the plate perimeter 116) to thereby deflect the peeling flange 198 (and the secured die media) away from a die statically positioned using a pickup assembly 204. The secured die media is thereby peeled from the retained die.

[0031] In one example, the peel flange 108 includes a peel handle 202 that provides an interface connection or coupling between the peel flange 108 and the movable stage 200. Figure 2 As shown, in one example, the exfoliation handle 202 is a direct coupling between the exfoliation flange 198 and the movable stage 200. Thus, the movement of the movable stage 200 is directly transmitted to the exfoliation flange 108 to deflect the exfoliation flange 108 accordingly relative to the rest of the deflector plate 102, for example, to rotate, curl, bend, bend, arc, etc. about the compliant hinge 112.

[0032] As will be described herein, in yet another example, the peeling flange 108 is indirectly coupled to the movable stage 200 using one or more transmission devices. In one example, the transmission device is configured to convert the movement of the movable stage 200 into a specified motion (direction, speed, applied force, etc.) applied to the peeling flange 108. For example, when the movable stage 200 is configured to move in an upward manner when powered, the transmission device is inserted between the peeling flange 108 and the movable stage 200 to convert the upward vertical motion of the movable stage 200 into a corresponding downward motion of the peeling flange 108 (e.g., rotation of the peeling flange around the compliant hinge 112). In another example, the transmission device inserted between the peeling flange 108 and the movable stage 200 is configured to change the motion provided by the movable stage 200. Therefore, the transmission device causes the movable stage 200 to move in steps upward or downward, and correspondingly moves the peeling flange 108 corresponding to the change in motion.

[0033] During operation, Figure 2The decoupling system 100 shown in is coupled to a die medium including a die adhered thereto. For example, the die medium is secured across a deflection plate 102. In one example, the die medium is secured across the deflection plate 102 using a pressure gradient generated between a low pressure chamber 106 and an external environment (having atmospheric pressure in some examples) through a vacuum hole 118. After the die medium is secured to the deflection plate 102, a die interface 206 engages with the die and is accordingly secured to the die. By securing the die to the die interface, the die remains stationary during operation of the deflection plate 102, such as including deflection of the peeling flange 108 from a first relaxed configuration to a peeling configuration and finally to a decoupling configuration in which the die is decoupled from the die medium.

[0034] In one example, the movable stage 200 coupled to the peeling flange 108 is operated, for example, Figure 2 The movable stage 200 shown in FIG. 1 is moved in a downward direction to thereby pull the peel flange 108 (in this example, a cantilever feature of the deflection plate) in a downward manner relative to the rest of the plate perimeter 116. For example, when the peel flange 108 is deflected by a force applied to the peel flange 108 near the flange end 110, the tube core medium fastened to the peel flange 108 is deflected away from the tube core with the peel flange. As a result, a separation gap having a shape similar to (e.g., matching, identical to, etc.) one or more of the flange end 110, the tube core outline opening 114, etc. is formed between the tube core and the tube core medium. In another example, applying a pressure gradient to the tube core medium deflects the tube core medium into the tube core outline opening 114 and induces the separation gap between the tube core and the tube core medium. Optionally, the separation gap is induced in combination with the application of the pressure gradient and the initial deflection of the peel flange 108.

[0035] As the movable stage 200 continues to move, for example, in a downward manner, the peel flange 108 continues to deflect, and the linear separation gap formed between the die and the die medium secured with the peel flange 108 is enlarged as the linear separation gap propagates toward the compliant hinge 112. As the peel flange 108 continues to deflect, the linear separation gap extends across the entire die, thereby separating the die from the die medium. As will be described herein, the linear separation gap provides a stress distribution across the die and thereby minimizes (e.g., minimizes or eliminates) point loading of the die to minimize (e.g., minimizes or eliminates) the propagation or formation of cracks in the die.

[0036] Figure 3An example of an actuator 300 optionally coupled between the deflector plate 102 and the movable stage 200 is shown. In this example, the actuator 300 converts the upward movement of the movable stage 200 into a corresponding downward movement of the peeling flange 108. For example, in an example where the deflector plate 102 is provided as an aftermarket modification to an existing decoupler assembly 101, the actuator 300 provides an exemplary mechanism configured to convert a first movement, such as the first movement 302, into a second opposite movement 304 (e.g., downward). Therefore, even with an existing decoupler assembly 101 having a movable stage 200 configured to press one or more features, such as a needle array, into an assembly of a die and die medium, such a decoupler assembly 101 can be reconfigured, for example, using the actuator 300 described herein, to accordingly use a deflector plate 102 including a peeling flange 108.

[0037] Reference again Figure 3 In the illustrated example, the transmission 300 includes a roller bearing 306 configured for rolling engagement along, for example, the movable stage 200. In one example, the roller bearing 306 provides rolling engagement along the piston face of the movable stage 200. In addition, the transmission 300 includes a lever, such as a lever 308, extending between the roller bearing and a peeling handle 316 provided with a peeling flange 108. As shown in the example provided, the lever 308 includes a driving end 310 extending between the roller bearing 306 and the shaft 314 and a driven end 312 extending from the shaft 314 to a point coupled with the peeling handle 316. As shown in this example, the driving end 310 has a larger moment arm than the driven end 312. In other examples, the lever 308 is arranged oppositely, for example, the driven end 312 is longer than the driving end 310.

[0038] In operation, the transmission 300 is held in place by the shaft 314. For example, in one example, the shaft 314 is statically coupled to the decoupler housing 104 (e.g., the shaft 314 extends into and out of the page, e.g., engages with a corresponding wall of the decoupler housing 104). As the movable stage 200 moves upward, the roller bearing 306 engages with and rolls across the movable stage 200. The driving end 310 rotates clockwise (in this example), and the entirety of the joystick 308 rotates clockwise about the shaft 314 accordingly. The rotation of the joystick 308 is transmitted to the driven end 312 and accordingly moves the stripping handle 316 in a downward manner as shown using the second motion 304. Thus, the first motion 302 of the stage 200 is converted into a downward second motion 304 to accordingly move the stripping flange 108 from a relaxed configuration (e.g., Figure 3 ) is deflected into a peel-off configuration in which the peel-off flange 108 is deflected relative to the remainder of the deflector plate 102 to facilitate decoupling the die dielectric from the die.

[0039] Figure 3 The transmission device 300 shown in FIG. 1 is one example of a transmission device that can be used for a decoupler assembly 101 that includes one or more of the deflector plates 102 having a peeling flange 108, etc. In other examples, for example, a decoupler assembly 101 that includes a deflector plate 102 does not have a transmission device 300. Figure 2 As shown, the peeling flange 108 is directly coupled to the movable stage 200 or indirectly coupled, for example, via a peeling handle 202. In other examples, the decoupler assembly 101 includes a Figure 3 The transmission device includes, but is not limited to, a mechanism configured to increase or decrease the amount of the second movement 304 relative to the first movement 302. For example, in one example, Figure 3 As shown, the driving end 310 has a longer moment arm than the driven end 312. Therefore, a translation of the driving end 310 corresponding to the first motion 302, for example, results in a smaller corresponding second motion 304 (in the opposite direction). In the opposite arrangement, for example, where the driving end 310 is shorter than the driven end 312, the second motion 304 is greater relative to the first motion 302. In other examples, the transmission 300 includes other mechanisms coupled between the movable stage 200 and the exfoliation flange 108. For example, the transmission 300 includes, but is not limited to, a cam and cam follower arrangement, a multi-bar mechanism, etc.

[0040] Figure 4A and 4B 1 and 2 show perspective and top views of another example of a deflector plate 400. The deflector plate 400 includes a plurality of deflector plates similar in some respects to those previously described in Figure 1 , 2 The features of the deflector plate 102 shown and described in and 3. Figure 4A and 4B , the deflector plate 400 includes a plate perimeter 404 extending around a peeling flange 402 (continuous or optionally discontinuous). Figure 4A The peeling flange 402 shown in FIG. 4 is deflectable relative to the remainder of the deflection plate 400 including the plate perimeter 404. As shown, for example, in Figure 4A and 4B In both, the peel flange 402 is bounded on three sides by a die outline opening 414 in this example. The die outline opening 414 corresponds to a cut, ridge, opening, etc. provided between at least a portion of the peel flange 402 and the board perimeter 404. For example, as shown, in Figure 4A and 4BIn the embodiment of the present invention, a die outline opening 414 extends from a compliant hinge 412 that couples the peel flange 402 to the rest of the deflector plate 400. In at least one example, the die outline opening 414 has a shape corresponding to a die (e.g., a die adhered to a die medium) to facilitate removal of the die from the die medium using the deflector plate 400. For example, during operation, a die on the die medium is aligned or coincident with the peel flange 402 (including being aligned or coincident with the die outline opening 414) prior to operation of the deflector plate 400.

[0041] As further shown, the peel flange 402 is coupled to the deflector plate 400 using a compliant hinge 412. In some examples, the compliant hinge 412 is integral with the deflector plate 400. For example, the peel flange 402 and the plate perimeter 404 of the deflector plate 400 are constructed using the same material, such as spring steel, etc., and the compliant hinge 412 correspondingly forms a living hinge constructed of the same material. In other examples, the peel flange 402 and the plate perimeter 404 are independently constructed, and the compliant hinge 412 is a hinge inserted between the peel flange 402 and the plate perimeter 404. In such examples, the compliant hinge 412 optionally includes a mechanical hinge, such as a plug received in a slot, hole, etc., which is configured to facilitate rotation of the peel flange 402 relative to the rest of the deflector plate 400, such as including the plate perimeter 404. In one example, the compliant hinge 412 includes a separate biasing element, such as a spring, an elastomeric material, etc., inserted between a portion of the peeling flange 402 and, for example, the decoupler housing 104, the plate perimeter 404, etc. In such an example, the biasing element operates in a manner similar to the spring bias provided, for example, by a living hinge to bias the peeling flange 402 into a position such as Figure 4A and 4B The release structure shown. In the peeling flange 402, for example, by Figure 2 When deflected by operation of the stage of the movable stage 200 as shown, the movable stage overcomes the deflection provided by the deflection element and accordingly moves the peel flange 402 to the peel configuration to accordingly separate the die dielectric from the die.

[0042] like Figure 4A and 4B As further shown, the deflector plate 400 includes a plurality of vacuum holes 406 distributed across the deflector plate 400. In at least one example, the vacuum holes 406 are provided on the peeling flange 402 to respectively ensure that the die medium that is coincident with the die is secured to the peeling flange 402. Securing the die medium to the peeling flange 402 ensures that movement of the peeling flange 402 is transmitted to the die medium to respectively separate the die medium from the die itself. In other examples, for example, in Figure 4A and 4BIn the example shown, both the plate perimeter 404 and the peel flange 402 include vacuum holes 406. The vacuum holes 406 ensure that the die medium is secured across the deflector plate 400 including the peel flange 402 and the plate perimeter 404.

[0043] In one example, fastening the die medium across the deflection plate 400 holds the die medium in place not only along the peel flange 402 but also along the plate perimeter 404. Thus, the die medium is held in place both on the plate perimeter 404 and on the peel flange 402 by deflection of the peel flange 402. Thus, the die medium deflects (e.g., stretches) in accordance with the fastening between each of these features. Plastic deformation of the die medium, such as between the peel flange 402 and the plate perimeter 404 (where the die medium is fastened between the two), enhances the breaking of the adhesive bond between the die and the die medium. In other examples, the die medium (which may be deformed as described herein) is pulled into one or more of the vacuum holes 406, the die contour openings 414, etc. by the pressure gradient between the low pressure environment (e.g., in the low pressure chamber 106) and the higher pressure environment (e.g., atmospheric pressure outside the chamber). By pulling and deforming the die dielectric via these features of the deflection plate 400, the plate induces decoupling of the die dielectric from the die (eg, induces a separation gap, such as a linear separation gap along at least the die outline opening 414).

[0044] Figure 5A-5C An example of a die and die dielectric 502 in different configurations is shown, including deformation of the die dielectric 502 relative to the die 500 to correspondingly peel the die dielectric from the die 500. Figure 5A , the die 500 is shown coupled to the die medium 502. As previously described herein, the coupling of the die 500 to the die medium 502 includes forming an adhesive coupling between the polymer (in one example, Mylar) of the die medium 502 and the die 500. The die medium 502 is positioned above the deflection plate 102. In one example, for example, Figure 2 As shown in FIG. 1 , the decoupler assembly 101 includes a low pressure chamber 106. A higher pressure fluid, such as air, outside the decoupler assembly 101 cooperates with the low pressure environment within the low pressure chamber 106 (e.g., through the vacuum holes 118) to secure the core medium 502 to the deflector plate 102 according to the pressure differential. Figure 5A As further shown, the die medium 502 is positioned on the deflector plate 102, and the die 500 is aligned with the peel flange 108. Figure 1 or Figure 4A As shown in any of the above, the die 500 is positioned at a corresponding position to align with the die outline opening (eg Figure 1 The die outline opening 114 shown in FIG. Figure 4A The die outline opening 414 shown in FIG. 1 is aligned or coincident. Therefore, Figure 5A The flange ends 110 shown in FIG. 1 are aligned with corresponding ends of the die 500. In this view, the die media 502 is secured across the deflector plate 102 when the peel-off flange 108 is in a relaxed configuration and thereby coincides with or is flush with the rest of the deflector plate 102.

[0045] like Figure 5B As shown, the deflector plate 102 including, for example, a peeling flange 108 is disposed relative to Figure 5A The configuration shown in FIG. 1 is in a peeled configuration. In this example, the flange end 110 is relative to Figure 5A 108 is deflected (e.g., offset away from the die 500), the die medium 502 coupled along the peeling flange 508, for example, adjacent to the peeling flange 110, is pulled away from the die 500. As previously described herein, in at least one example, the die 500 is formed by a plurality of means such as a plurality of means. Figure 2 The features of the pickup assembly 204 with the die interface 206 are shown statically held in place. Thus, as the peel flange 108 is deflected (e.g., curled, bent, tilted, etc.) away from the remainder of the deflector plate 102, the flange end 110 along with the corresponding die medium 502 is pulled away from the die 500. Figure 5B As shown, a linear separation gap 504 is formed between the die 500 and a portion of the exfoliated dielectric portion 506 of the die dielectric 502 coupled, e.g., proximate the flange end 110. In one example, the linear separation gap 504 follows the contour of the die outline opening 414. For example, in the event of a force being applied proximate the flange end 110 (or 410) and in accordance with the shape of the flange end 110 (corresponding to the die outline opening 114, 414), the linear separation gap 504 follows the shape of the flange end 110 (410) and the die outline opening (e.g., 114, 414) to extend across the interface between the die 500 and the die dielectric 502, respectively. For example, stresses transmitted from the die dielectric 502 to the die 500 as exfoliation begins and progresses are transmitted to the die 500 in a substantially linear manner corresponding to the shape of the linear separation gap 504, as opposed to point loading stress risers found with a needle array.

[0046] like Figure 5C As further shown, the tube core 500 is in a decoupled configuration relative to the tube core medium 502. In this example, the peeling flange 108 continues to move relative to the rest of the deflector plate 102. For example, as shown, relative to Figure 5B In the configuration shown in FIG, the peeling flange 108 is further deflected and the linear separation gap 504 has propagated along the tube core 500 to a position adjacent to the compliant hinge 112. In other words, initially at Figure 5BThe linear separation gap 504 shown in FIG. 1 begins adjacent to the flange end 110 and propagates from that location across the die 500 and the die dielectric toward the compliant hinge 112. Thus, the linear characteristics of the linear separation gap 504 remain substantially similar (e.g., similar or identical) throughout the decoupling operation, and the stress experienced on the die 500 remains distributed across the die 500, and point stresses are consistently and reliably avoided.

[0047] This makes it possible to use, for example, a decoupler system (e.g. Figure 1 The decoupler assembly 101 of the decoupling system 100 shown in FIG. 1 includes deflector plates 102 configured together to create a linear separation gap 504 between a die 500 and a die dielectric 502 to facilitate peeling of the die dielectric 502 from the die 500. For example, the linear separation gap 504 formed according to the shape of the flange end 410 (or 110) and the corresponding die profile opening (e.g., the opening 414 (114)) controls the creation and shape of the linear separation gap 504. By moving the peeling flange 108, for example, near the flange end 110, the linear separation gap 504 is created adjacent to the flange end 110 and has a linear shape, for example, extending across the flange end 110 and the corresponding portion (and end) of the die 500. The linear separation gap 504 propagates from the flange end 110 across the die 500 toward the compliant hinge 112. Thus, the linear separation gap distributes stresses across the die 500 in a linear manner, thereby substantially avoiding (e.g., minimizing or eliminating) point loads on the die 500. In other examples, the linear separation gap 504 follows the contour of the die contour opening 414 (or 114). For example, the linear separation gap 504 is initiated along one or more of the flange ends 410 (110) and one or more of the sides of the peel flange 408 (108) between the flange ends and the compliant hinge 412 (112). The separation gap 504 has a linear curved configuration that propagates from the edge of the die 500 toward the compliant hinge 412 (112).

[0048] Fig. 6A , Figure 6B Two graphs are shown for a die such as die 500 when peeling off the die dielectric 502, including a linear stress graph 600 and a local stress graph 604. Figure 6B, local stress graph 604 shows a plurality of point stresses 606 across die 500. In this example, one or more features, such as a pin array of a plurality of pins, are engaged against die 500, for example, by a die medium such as die medium 502. Engaging the pin array against the die medium transmits forces into die 500 in a localized manner, for example, corresponding to point stresses 606 shown in FIG. 6 (with denser points illustrated). In at least some examples, the local stresses applied to die 500 propagate pre-existing cracks in die 500, such as from a previous manufacturing step, or in other examples, create new cracks within die 500 depending on the stresses at the point locations.

[0049] refer to Fig. 6A In the linear stress curve graph 600, a distributed stress curve 602 is shown, which extends across the tube core, such as an example of a linear shape. As shown in the curve graph, the distributed stress curve 602 has less dense points (compared to Figure 6B 606), indicating less stress is imparted to the die 500. In each of the exemplary graphs, the die 500 is removed from the die dielectric, however, in the linear stress graph 600 ( Fig. 6A ), the die 500 is decoupled from the die dielectric 502 with significantly reduced stress on the die 500 due to the deflection plate 102 including the peel flange 108. Thus, removing the die 500 from the die dielectric 502 by deflection of the peel flange 108 of the deflection plate 102 (or the deflection plate 400 including the peel flange 402) provides a separated die 500 with a reduced failure rate due to, for example, cracks, whether the cracks are generated during or propagated by the decoupling process.

[0050] Figure 7 An example of a method 700 for decoupling a die from a die medium, for example, using one or more of the decoupling systems 100 described herein, is shown. In describing the method 700, reference is made to one or more of the components, features, functions, and steps described previously herein. Where convenient, reference is made to components, features, steps, etc. using reference numerals. The reference numerals provided are exemplary and not exclusive. For example, the components, features, functions, steps, etc. described in the method 700 include, but are not limited to, the corresponding numbered elements provided herein, other corresponding elements (numbered and unnumbered) described herein, and their equivalents.

[0051] At 702, method 700 includes transferring a Figure 5A The core medium 502 shown in FIG. 1 is secured to a deflection plate (one example of which is shown in FIG. 1 ). Figure 5A102). The deflector plate 102 includes a peel-off flange 108 having a flange end 110. The die medium 502 is engaged with the die 500 across a surface of the medium opposite to the surface fastened to the deflector plate 102. As previously described herein, in one example, the die medium 502 including the die 500 coupled thereto utilizes one or more vacuum holes 118 (e.g., Figure 1 ) is secured to the deflector plate 102. In another example, the deflector plate 400 includes a plurality of vacuum holes 406 located across the deflector plate 400, for example, along the plate perimeter 404 and the peeling flange 402. By providing a pressure gradient between the interior portions of the decoupler assembly 101, for example, in the low pressure chamber 106, the core medium 502 is securely secured across the deflector plate 102.

[0052] At 704, the die 500 is held in a stationary position. In one example, the decoupling system optionally includes a pick-up assembly 204 having a die interface 206. The pick-up assembly 204 is optionally moved (e.g., by an actuator, an arm, etc.) into close proximity with the die 500, e.g., as Figure 5A The die interface 206 is secured along the die 500 and holds the die 500 in a stationary position (eg, Figure 5A As described herein, in some examples, die interface 206 includes a suction cup, a pneumatic interface (e.g., similar in some respects to vacuum hole 406 described herein), or other features configured to reliably hold die 500 in a stationary position relative to die medium 502 while the die medium is deflected as described herein.

[0053] At 706, the peel flange 108 (and the peel flange 402 of the deflector plate 400, in another example) is deflected and the die medium is deflected with the peel flange 108 to thereby decouple the die medium 502 from the die 500. At 708, in an example, deflecting the peel flange 108 includes bending (e.g., rotating, bending, curling, arcing, etc.) the peel flange 108 and the die medium 502 secured to the peel flange while maintaining the die 500 in a stationary position. For example, as Figure 5B As shown, the die 500 remains in a substantially stationary position relative to the deflected exfoliated media portion 506 of the die media 502. At least a portion of the exfoliation flange 108 is in a bent configuration relative to the remainder of the deflector plate 102, and the exfoliated media portion 506 moves with the deflected portion of the exfoliation flange 108.

[0054] At 710, a linear separation gap 504 is induced between the die 500 and the die dielectric 502 (see Figure 5B In one example, the linear separation gap 504 is based on the flange end, the tube core outline opening 114 (eg, Figure 1110 ). In one example, as the peel flange 108 is deflected, for example, near the flange end 110, a portion of the peel flange 108 near the peel flange 110 is (at least initially) spaced a greater distance from the deflector plate 102 than the remainder of the peel flange 108 (e.g., closer to the compliant hinge 112). Thus, in this example, a linear separation gap 504 is created at a location initially near the flange end 110 and a corresponding portion of the die profile opening 114. The linear separation gap 504 extends across the die 500 (e.g., as shown in FIG. 11 ). Figure 5B Entering and leaving the page).

[0055] As described previously herein, in another example, a linear separation gap 504 is formed according to the flange end 110 or the die outline opening 114, thereby providing a gap between the remainder of the deflector plate 102 (e.g., the plate perimeter 116) and the flange end 110. The linear separation gap 504 optionally follows the shape of the die outline opening 114 and extends along one or more portions of the peel flange 108, including the flange end 110 and the side of the peel flange extending from the flange end 110 toward the compliant hinge 112. In this example, the linear separation gap 504 also propagates toward the compliant hinge 112.

[0056] At 712, deflecting the peel flange 108 further includes propagating the linear separation gap 504 along the tube core 500 in accordance with the continued bending of the peel flange 108. Figure 5C As shown, the portion of the decoupling system 100 including the deflector plate 102 is shown in the decoupled configuration and the peeling flange 108 is relative to Figure 5B 108. The orientation shown is further deflected. As shown, the exfoliated dielectric portion 506 has expanded, for example, extending along the exfoliated flange 108 to the compliant hinge 112. Thus, the linear separation gap 504 previously created between the die 500 and the die dielectric 502 near the flange end 110 (or optionally near the die outline opening 114) propagates toward the compliant hinge 112 to correspondingly decouple the die 500 from the die dielectric 502. As previously described herein, when propagated in this manner, the linear separation gap 504 ensures a distributed application of stress to the die 500, which significantly minimizes (e.g., minimizes or eliminates) point loads and correspondingly reduces the propagation and initiation of cracks within the die 500 that would otherwise result from localized point loading of the die 500, such as that created using a needle array.

[0057] Several options for the method 700 follow. In one example, securing the die medium 502 to the deflector plate 102 includes aligning the die 500 with the peel flange 108. For example, as described herein, in one example, the peel flange 108 is bounded along one or more sides by the die outline opening 114. The die outline opening 114 shapes the peel flange 108 to correspond to the shape of the die 500. When positioned on the deflector plate 102, the die medium 502 is ready to be deflected with the die 500 aligned along the die outline opening 114 and the peel flange 108.

[0058] In another example, bending the peel flange 108 and the core medium attached to the peel flange includes one or more of rotating, bending, curling, or arcing the peel flange 108 from the flange end 110 toward the compliant hinge 112, which couples the peel flange 108 with the rest of the deflector plate 102 (e.g., the plate perimeter 116). As described herein, bending the peel flange includes, but is not limited to, one or more of deflecting, rotating, bending, arcing, curling, etc., the peel flange 108, etc. Thus, in some examples, the peel flange remains substantially straight (without bending or arcing), while in other examples, the peel flange is constructed using a deformable material such as spring steel, which is configured to bend, curl, arc, etc. relative to the rest of the deflector plate 102 when deflected (e.g., by the movable stage 200).

[0059] In yet another example, inducing the linear separation gap 504 includes controlling the shape of the linear separation gap 504 using one or more of the shape of the flange end 110 or the shape of the die outline opening 114 between the peel flange 108 and the remainder of the deflector plate 102, such as the plate perimeter 116. Thus, by changing the shape of the die outline opening 114 or the shape of the peel flange 108, in one example, the induced linear separation gap 504 is adjusted to have a different shape, such as a linear shape extending around the interface between the die medium 502 to the die 500. In some examples, the linear separation gap 504 provides a horseshoe-shaped or multi-faceted linear gap between the die 500 and the die medium 502, corresponding to each of the sides of the peel flange 108 separated from the remainder of the plate perimeter 116. Thus, in one example, the linear separation gap 504 includes a horseshoe or C-shaped linear separation gap 504 that begins at the flange end 110 and extends at least partially to the side of the peel flange 108 (e.g., extending from the flange end 110 toward the compliant hinge 112). As the peel flange 108 continues to deflect, in such an example, the C-shaped linear separation gap 504 propagates toward the compliant hinge 112, for example, in a continuous C or horseshoe linear shape, which decouples the die from the die medium 502, again as shown in FIG. Figure 5C as shown in .

[0060] Various notes and examples

[0061] Example 1 includes subject matter, for example, may include a decoupling system comprising: a deflector plate configured to couple across a low pressure orifice of a low pressure chamber, the deflector plate comprising: one or more vacuum holes extending through the deflector plate, a peeling flange coupled to the remainder of the deflector plate at a compliant joint, and the peeling flange extending from the compliant joint to a flange end, and a die contour opening extending from the compliant joint around the peeling flange in the shape of a die contour, the die contour opening separating the peeling flange from the remainder of the deflector plate; and wherein the peeling flange comprises a relaxation and peeling structure configured to decouple a die from a die medium: in the relaxation structure, the peeling flange coincides with the remainder of the deflector plate, and in the peeling structure, the peeling flange is deflected at the compliant joint relative to the remainder of the deflector plate and the flange end is spaced apart from the remainder of the deflector plate.

[0062] Example 2 may include, or may optionally be combined with the subject matter of Example 1 to optionally include, wherein, in a relaxed configuration, the core medium is secured along the remainder of the peel flange and the deflector plate, and in a peeled configuration, the core medium remains secured along the remainder of the peel flange and the deflector plate, and a linear separation gap is between the core medium and the core based on deflection of the peel flange.

[0063] Example 3 can include, or can optionally be combined with the subject matter of one or any combination of Examples 1 or 2 to optionally include, wherein the linear separation gap includes a shape corresponding to a shape of one or more of a portion of the die outline opening or a flange end.

[0064] Example 4 may include, or may optionally be combined with the subject matter of one or any combination of Examples 1-3, to optionally include, wherein the peeling flange includes a decoupling structure, in which: the peeling flange is further deflected relative to the peeling structure, and the linear separation gap moves toward the compliant hinge based on the further deflection.

[0065] Example 5 can include, or can optionally be combined with the subject matter of one or any combination of Examples 1-4 to optionally include, wherein the deflector plate, the compliant joint, and the spalling flange are constructed from the same material.

[0066] Example 6 can include, or can optionally be combined with the subject matter of Examples 1-5, to optionally include, wherein the compliant joint comprises a living hinge.

[0067] Example 7 can include, or can optionally be combined with the subject matter of Examples 1-6 to optionally include, wherein the peeling flange is a cantilever flange.

[0068] Example 8 can include, or can optionally be combined with the subject matter of Examples 1-7, to optionally include, wherein the spalling flange includes a spalling handle near an end of the flange, and the spalling handle is configured to couple with a movable stage of the decoupler assembly.

[0069] Example 9 can include, or can optionally be combined with the subject matter of Examples 1-8 to optionally include, wherein the remainder of the deflector plate includes a plate perimeter extending around at least a portion of the peel flange, and the tube core contour opening separates the plate perimeter from at least the flange end of the peel flange.

[0070] Example 10 can include, or can optionally be combined with the subject matter of Examples 1-9 to optionally include, a decoupler housing comprising a low pressure orifice and a low pressure chamber; a movable stage within the low pressure chamber, the movable stage coupled to the peeling flange; a die adhered along the die medium; and a pick-up assembly configured to selectively secure to the die along the die interface.

[0071] Example 11 may include, or may optionally be combined with the subject matter of Examples 1-10 to optionally include a decoupling system comprising: a decoupler assembly configured to decouple a die from a die medium, the decoupler assembly comprising: a decoupler housing comprising a low pressure chamber, a movable stage within the decoupler housing, and a deflection plate coupled to the decoupler housing, the deflection plate comprising: one or more vacuum holes communicating with the low pressure chamber, a compliant joint, a die profile opening extending from the compliant joint, and a peeling flange extending from the compliant joint to a flange end, the peeling flange within the die profile opening, and the peeling flange coupled to the movable stage near the flange end.

[0072] Example 12 may include, or may optionally be combined with the subject matter of Examples 1-11 to optionally include, wherein the peeling flange is configured to deflect between a relaxed and peeling configuration, wherein in the relaxed configuration the peeling flange coincides with the remainder of the deflection plate, and in the peeling configuration the peeling flange is bent relative to the relaxed configuration using a movable stage and a linear separation gap is induced between the tube core and the tube core medium in response to the bending.

[0073] Example 13 can include, or can optionally be combined with the subject matter of Examples 1-12 to optionally include, wherein the peeling flange includes a decoupling configuration in which: the peeling flange is further bent relative to the peeling configuration and the linear separation gap moves toward the compliant hinge based on further deflection.

[0074] Example 14 can include, or can optionally be combined with the subject matter of Examples 1-13 to optionally include, wherein the linear separation gap includes a shape corresponding to a shape of one or more of a portion of the die outline opening or the flange end.

[0075] Example 15 can include, or can optionally be combined with the subject matter of Examples 1-14 to optionally include, wherein the vacuum aperture and the low pressure chamber are configured to secure the media with the exfoliation flange in each of the relaxed and exfoliated configurations.

[0076] Example 16 can include, or can optionally be combined with the subject matter of Examples 1-15 to optionally include a pickup assembly over the exfoliation flange, the pickup assembly comprising a die interface configured to hold the die stationary in each of the relaxed and exfoliated configurations.

[0077] Example 17 may include, or may optionally be combined with the subject matter of Examples 1-16 to optionally include, wherein the decoupler assembly includes a transmission device coupled between the peeling flange and the movable table, the transmission device being configured to convert a first movement of the movable table into a second movement of the peeling flange, the second movement being different from the first movement.

[0078] Example 18 may include, or may optionally be combined with the subject matter of Examples 1-17 to optionally include, wherein the decoupler assembly includes a transmission device coupled between the stripping flange and the movable table, the transmission device including: a roller bearing engaged with the movable table; a joystick coupled to the roller bearing on a driving end of the joystick, the joystick including a driven end opposite to the driving end, an axis extending through the joystick, and the joystick is configured to rotate about the axis; and a stripping handle coupling the driven end to the stripping flange.

[0079] Example 19 can include, or can optionally be combined with the subject matter of Examples 1-18 to optionally include, wherein the deflector plate, the compliant joint, and the peeling flange are integral.

[0080] Example 20 may include, or may optionally be combined with the subject matter of Examples 1-19 to optionally include a method for decoupling a die from a die medium, comprising: securing the die medium to a deflection plate, the deflection plate including a peel-off flange extending to a flange end, the die engaging the die medium; maintaining the die in a stationary position; deflecting the peel-off flange and the die medium relative to the die, the deflection comprising: bending the peel-off flange and the die medium secured to the peel-off flange while maintaining the die in a stationary position, inducing a linear separation gap between the die and the die medium near the flange end according to the contour of the flange end, and propagating the linear separation gap along the die according to continued bending of the peel-off flange.

[0081] Example 21 can include, or can optionally be combined with the subject matter of Examples 1-20 to optionally include, wherein securing the die media to the deflector plate includes securing to one or more vacuum ports in the deflector plate including a peel flange.

[0082] Example 22 can include, or can optionally be combined with the subject matter of Examples 1-21 to optionally include, wherein securing the die media to the deflector plate includes aligning the die with the peel flange.

[0083] Example 23 can include, or can optionally be combined with the subject matter of Examples 1-22 to optionally include, wherein holding the die in the stationary position includes securing the die to a die interface of a pickup assembly.

[0084] Example 24 can include, or can optionally be combined with the subject matter of Examples 1-23 to optionally include, wherein bending the peel flange and the core medium includes rotating and bending the peel flange from the flange end toward a compliant hinge that couples the peel flange to the remainder of the deflector plate.

[0085] Example 25 can include, or can optionally be combined with the subject matter of Examples 1-24 to optionally include, wherein inducing the linear separation gap includes controlling the shape of the linear separation gap using one or more of a shape of the flange end or a shape of the tube core opening profile between the peel flange and the remainder of the deflector plate.

[0086] Each of these non-limiting examples may stand on its own or may be combined with one or more of the other examples in various permutations or combinations.

[0087] The above detailed description includes reference to the accompanying drawings, which form a part of the detailed description. The accompanying drawings show specific embodiments in which the present disclosure can be practiced by way of example. These embodiments are also referred to as "examples" in this article. Such examples may include elements other than those shown or described. However, the inventors also contemplate examples that only provide those elements shown or described. In addition, the inventors also contemplate examples of any combination or arrangement of those elements shown or described relative to the specific examples (or one or more aspects thereof) shown or described herein or relative to other examples (or one or more aspects thereof).

[0088] In the event of inconsistent usages between this document and any document incorporated by reference, the usage in this document controls.

[0089] In this document, the term "a" is used to include one or more than one, as is commonly used in patent literature, independent of any other instance or usage of "at least one" or "one or more". In this document, the term "or" is used to represent a non-exclusive or, so that unless otherwise stated, "A or B" includes "A but not B", "B but not A", and "A and B". In this document, the terms "including" and "wherein" are used as the plain English equivalents of the corresponding terms "comprising" and "wherein". Moreover, in the following claims, the terms "including" and "comprising" are open-ended, that is, systems, devices, articles, compositions, formulas, or processes that include elements other than those listed after such terms in the claims are still considered to fall within the scope of the claim. In addition, in the following claims, the terms "first", "second", and "third", etc. are used merely as labels and are not intended to impose any numerical requirements on their objects.

[0090] The method examples described herein may be at least partially machine or computer implemented. Some examples may include a computer-readable medium or machine-readable medium encoded with instructions, which may be used to configure an electronic device to perform the method described in the above example. The implementation of this method may include code, such as microcode, assembly language code, high-level language code, etc. This code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. In addition, in an example, the code may be tangibly stored on one or more volatile, non-transient or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of these tangible computer-readable media may include, but are not limited to, hard disks, removable disks, removable optical disks (e.g., compact disks and digital video disks), cassettes, memory cards or memory sticks, random access memory (RAM), read-only memory (ROM), etc.

[0091] The above description is intended to illustrate rather than limit. For example, the above examples (or one or more aspects thereof) can be used in combination with each other. For example, other embodiments can be used by a person of ordinary skill in the art after studying the above description. An abstract is provided to comply with 37C.FR§1.72(b) to allow the reader to quickly determine the essence of the technical disclosure. The abstract is submitted with the understanding that the abstract will not be used to interpret or limit the scope or meaning of the claims. Moreover, in the above specific embodiments, various features can be grouped together to simplify the present disclosure. This should not be interpreted as intended to indicate that the disclosed features that are not claimed are necessary for any claim. On the contrary, the subject matter of the present invention may be present in less than all the features of a specific disclosed embodiment. Thus, the following claims are incorporated into the specific embodiments as examples or embodiments, each claim relying on itself as an independent embodiment, and it is conceivable that such embodiments can be combined with each other in various combinations or arrangements. The scope of the present disclosure should be determined with reference to the attached claims together with the full scope of equivalents to which such claims are entitled.

Claims

1. A decoupling system, comprising: a deflector plate configured to couple across a low pressure orifice of the low pressure chamber, the deflector plate comprising: one or more vacuum holes extending through the deflector plate, a peeling flange coupled to the remainder of the deflector plate at a compliant joint and extending from the compliant joint to a flange end, and a die contour opening extending from the compliant joint in the shape of a die contour around the peel flange, the die contour opening separating the peel flange from the remainder of the deflector plate; and wherein the peel-off flange comprises a relaxation structure and a peel-off structure, wherein the relaxation structure and the peel-off structure are configured to decouple the tube die from the tube die medium: In the relaxed configuration, the peel-off flange coincides with the remainder of the deflector plate, and In the spalling configuration, the spalling flange is deflected relative to the remainder of the deflector plate at the compliant joint, and the flange end is spaced apart from the remainder of the deflector plate.

2. The decoupling system according to claim 1, wherein: In the relaxed configuration, the core medium is secured along the peel flange and the remainder of the deflector plate, and In the peel-off configuration, the die medium remains secured along the peel-off flange and the remainder of the deflector plate, and there is a linear separation gap between the die medium and the die based on the deflection of the peel-off flange.

3. The decoupling system according to claim 2, wherein: The linear separation gap includes a shape corresponding to a shape of one or more of a portion of the die outline opening or the flange end.

4. The decoupling system according to claim 2, wherein: The peel flange comprises a decoupling configuration, and in the decoupling configuration: The peeling flange is further deflected relative to the peeling configuration, and The linear separation gap moves toward the compliant joint in response to the further deflection.

5. The decoupling system according to any one of claims 1 to 4, wherein: The deflector plate, the compliant joint and the spalling flange are constructed from the same material.

6. The decoupling system according to any one of claims 1 to 4, wherein: The compliant joint includes a living hinge.

7. The decoupling system according to any one of claims 1 to 4, wherein: The peeling flange is a cantilever flange.

8. The decoupling system according to any one of claims 1 to 4, wherein: The spalling flange includes a spalling handle located near an end of the flange, and the spalling handle is configured to couple with a movable stage of a decoupler assembly.

9. The decoupling system according to any one of claims 1 to 4, wherein: The remainder of the deflector plate includes a plate perimeter extending around at least a portion of the spalling flange, and the die outline opening separates the plate perimeter from at least the flange end of the spalling flange.

10. The decoupling system according to any one of claims 1 to 4, comprising: a decoupler housing including the low pressure orifice and the low pressure chamber; a movable stage within the low pressure chamber, the movable stage coupled to the peeling flange; said tube core adhered along said tube core dielectric; as well as A pickup assembly is configured to selectively secure with the die along a die interface.

11. A decoupling system, comprising: A decoupler assembly configured to decouple a die from a die medium, the decoupler assembly comprising: a decoupler housing including a low pressure chamber, a movable stage located within the decoupler housing, and A deflector plate coupled to the decoupler housing, the deflector plate comprising: one or more vacuum holes communicating with the low pressure chamber, Soft joints, a die profile opening extending from the compliant joint, and A peel flange extends from the compliant joint to a flange end, the peel flange is positioned within the die outline opening, and the peel flange is coupled to the movable stage proximate the flange end.

12. The decoupling system according to claim 11, wherein: The peeling flange is configured to deflect between a relaxed configuration and a peeling configuration: In the relaxed configuration, the peel flange coincides with the remainder of the deflector plate, and In the peeled configuration, the peel flange is bent relative to the relaxed configuration using the movable stage, and a linear separation gap is induced between the die and the die medium according to the bending.

13. The decoupling system according to claim 12, wherein: The peel flange comprises a decoupling configuration, and in the decoupling configuration: The peeling flange is further deflected relative to the peeling configuration, and The linear separation gap moves toward the compliant joint in response to the further deflection.

14. The decoupling system according to claim 12, wherein: The linear separation gap includes a shape corresponding to a shape of one or more of a portion of the die outline opening or the flange end.

15. The decoupling system according to any one of claims 12 to 14, wherein: The vacuum aperture and the low pressure chamber are configured to secure the media with the exfoliation flange in each of the relaxed configuration and the exfoliation configuration.

16. The decoupling system of any of claims 12-14, comprising a pickup assembly located over the exfoliation flange, the pickup assembly comprising a die interface configured to hold the die stationary in each of the relaxed configuration and the exfoliated configuration.

17. The decoupling system according to any one of claims 11 to 14, wherein: The decoupler assembly includes a transmission coupled between the exfoliation flange and the movable stage, the transmission configured to translate a first movement of the movable stage into a second movement of the exfoliation flange, the second movement being different from the first movement.

18. The decoupling system according to any one of claims 11 to 14, wherein: The decoupler assembly includes a transmission device coupled between the peeling flange and the movable stage, the transmission device including: a roller bearing engaged with said movable table, a joystick coupled to the roller bearing at a drive end of the joystick, the joystick comprising a driven end opposite the drive end, an axis extending through the joystick, and the joystick is configured to rotate about the axis, and A stripping handle couples the driven end to the stripping flange.

19. The decoupling system according to any one of claims 11 to 14, wherein: The deflector plate, the compliant joint and the spalling flange are integral.

20. A method for decoupling a die from a die medium, comprising: securing the core medium to a deflector plate, the deflector plate including a peel-off flange extending to a flange end, the core engaging the core medium; maintaining the die in a stationary position; deflecting the peel flange and the core medium relative to the core, the deflecting comprising: flexing the peel flange and the die medium secured thereto while maintaining the die in the stationary position, inducing a linear separation gap between the die and the die medium proximate the flange end according to a contour of the flange end, and The linear separation gap is propagated along the die in accordance with continued bending of the peel flange.

21. The method according to claim 20, wherein: Securing the die media to the deflector plate includes securing using one or more vacuum ports in the deflector plate including the peel flange.

22. The method according to claim 20, wherein: Media securing the die to the deflector plate includes aligning the die with the peel flange.

23. The method according to claim 20, wherein: Holding the die in a stationary position includes securing the die to a die interface of a pickup assembly.

24. The method according to any one of claims 20 to 23, wherein: Bending the spalling flange and the core dielectric includes rotating and bending the spalling flange from the flange end toward a compliant hinge coupling the spalling flange to the remainder of the deflector plate.

25. The method according to any one of claims 20 to 23, wherein: Inducing a linear separation gap includes controlling a shape of the linear separation gap using one or more of a shape of the flange end or a shape of a die opening profile between the peel flange and a remainder of the deflector plate.

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