TOF camera module and TOF circuit and heat dissipation method and manufacturing method and application thereof

Abstract

TOF camera module and TOF circuit and their heat dissipation method, manufacturing method and application, wherein the TOF circuit includes: a TOF light source circuit and a photosensitive circuit; wherein the TOF light source circuit is used to drive a TOF light source to generate light, and the light is reflected by a target and sensed by the photosensitive circuit, and the TOF light source circuit cooperates with the photosensitive circuit to process the information of the light and the reflected light to obtain depth image information, which provides a predetermined power level.

Description

Technical Field

[0001] The present invention relates to the field of TOF technology, and further to a TOF camera module and a TOF circuit, as well as a heat dissipation method, a manufacturing method, and applications thereof. Background Art

[0002] TOF (Time Of Flight) technology, that is, the sensor emits modulated near-infrared light, which is reflected after encountering an object. The sensor calculates the distance to the photographed object by calculating the time difference or phase difference between the emission and reflection of the infrared light to generate depth information, and further combines it with traditional contact shooting to present the three-dimensional outline of the object in a graphical form with different colors representing different distances.

[0003] TOF technology has a long history, but with the rapid development and application of intelligent technology and virtual reality technology in recent years, TOF technology and TOF modules have been greatly developed, becoming a research hotspot in the field of imaging technology today, with high research value and broad application prospects.

[0004] Taking the traditional TOF camera as an example, during the shooting process, the TOF camera first needs a laser transmitter to emit coded light to the object being photographed. When the object is a person, the laser needs to be irradiated onto the human body, and then reflected by the human body to a light receiving component. Furthermore, the processor calculates the time difference or phase difference between the emitted light and the received light to calculate the depth space information of the human body, and obtains the image of the object through the photosensitivity of the received light, and combines the depth information to obtain depth image information.

[0005] In this process, the objects being photographed, such as humans, animals, and organisms, need to be irradiated by laser. However, lasers may have some adverse effects on the objects being photographed, especially living organisms, and the power of the light source determines the extent of the impact to a certain extent.

[0006] On the other hand, a laser is a light-emitting device that generates heat during the process. A TOF camera needs to process the light information it receives through circuitry to generate depth images. This heat can affect the operation of this circuitry, and in severe cases, can even cause it to malfunction and produce inaccurate information. Furthermore, the higher the light source power, the greater the heat generated per unit time, which in turn has a greater impact on the TOF camera's normal operation.

[0007] On the other hand, based on traditional electronic technology, traditional TOF cameras and circuits have low overall integration and are large in size.

[0008] Furthermore, the operation of the laser requires circuit drive and control, but the working circuits used in existing TOF cameras have low precision, which means that the accuracy and reliability of the measurement results are low.

[0009] Furthermore, with the rapid development of intelligent technology and virtual reality technology, existing TOF cameras and corresponding circuits are far from meeting the existing requirements for TOF products. It is necessary to design corresponding circuits and configure corresponding devices according to the requirements of existing technologies. Summary of the Invention

[0010] One object of the present invention is to provide a TOF camera module and a TOF circuit, a heat dissipation method and a manufacturing method thereof, and an application thereof, wherein the TOF circuit provides a predetermined output power so that the output power of the light source meets predetermined requirements.

[0011] One object of the present invention is to provide a TOF camera module and a TOF circuit, as well as a heat dissipation method, a manufacturing method, and an application thereof, wherein the output power of the light source is adjusted by adjusting and designing the electronic components of the TOF circuit, such as resistors and capacitors, so that TOF circuits with different output powers can be designed by this method.

[0012] One object of the present invention is to provide a TOF camera module and a TOF circuit, a heat dissipation method and a manufacturing method thereof, and an application thereof, wherein the TOF circuit includes a protection circuit, which provides a power output within a predetermined range and monitors the power output so that the circuit operates safely.

[0013] One object of the present invention is to provide a TOF camera module and a TOF circuit, a heat dissipation method and a manufacturing method thereof, and an application thereof, wherein the protection circuit is used to monitor the TOF light source during operation so that the TOF light source operates within a safe range.

[0014] One object of the present invention is to provide a TOF camera module and a TOF circuit, a heat dissipation method and a manufacturing method thereof, and an application thereof, wherein the TOF camera module operates within a predetermined power range, has more stable operating performance, and obtains more accurate depth image information.

[0015] One object of the present invention is to provide a TOF camera module and a TOF circuit, a heat dissipation method and a manufacturing method thereof, and an application thereof, wherein the TOF circuit is integratedly arranged to reduce the waste of circuit elements and reduce the volume.

[0016] One object of the present invention is to provide a TOF camera module and a TOF circuit, a heat dissipation method and a manufacturing method thereof, and an application thereof, wherein the TOF circuit includes a temperature detection circuit, which detects the operating temperature of the light source and feeds back the information to the TOF circuit.

[0017] One object of the present invention is to provide a TOF camera module and a TOF circuit, a heat dissipation method and a manufacturing method thereof, and an application thereof, wherein temperature information is used to analyze the accuracy of acquired information, thereby improving the accuracy of the depth image information ultimately acquired.

[0018] One object of the present invention is to provide a TOF camera module and a TOF circuit, as well as a heat dissipation method, a manufacturing method, and an application thereof, wherein the TOF circuit includes a calibration data storage circuit for storing calibration data for the user to use for calibration, thereby making the working accuracy of the TOF camera module higher.

[0019] One object of the present invention is to provide a TOF camera module and a TOF circuit, as well as a heat dissipation method, a manufacturing method, and an application thereof, wherein calibration data is stored in a data storage circuit, thereby avoiding the possibility of errors when the user obtains the calibration data during use, ensuring accurate calibration, and being convenient for the user and saving time.

[0020] One object of the present invention is to provide a TOF camera module and a TOF circuit, as well as a heat dissipation method, a manufacturing method, and an application thereof, wherein the circuit elements of the TOF circuit are designed according to a predetermined layout to reduce power consumption in the circuit, making the circuit operation more stable and reliable.

[0021] One object of the present invention is to provide a TOF camera module and a TOF circuit, a heat dissipation method and a manufacturing method thereof, and an application thereof, wherein when the TOF circuit is arranged on a circuit board, a heat dissipation structure is designed accordingly to improve the heat dissipation performance of the TOF circuit and make it operate stably.

[0022] One object of the present invention is to provide a TOF camera module and a TOF circuit, as well as a heat dissipation method, a manufacturing method, and an application thereof, wherein the TOF camera module is optimized in various aspects such as power preset, circuit layout setting, and temperature monitoring, so that the TOF camera module operates at a predetermined power and operates stably and reliably, thereby providing reliable and stable depth image information for application in different electronic devices.

[0023] In order to achieve at least one of the above objectives, the present invention provides a TOF circuit in one aspect, comprising:

[0024] a TOF light source circuit; and

[0025] A photosensitive circuit; wherein the TOF light source circuit is used to drive a TOF light source to generate light, the light is reflected by a target and reacts with the photosensitive circuit, and the TOF light source circuit and the photosensitive circuit cooperate to process the information of the light and the reflected light to obtain depth image information.

[0026] According to some embodiments, the TOF circuit, wherein the TOF light source circuit includes a protection circuit, wherein the protection circuit provides a predetermined limited power to the TOF light source.

[0027] According to some embodiments, the TOF circuit, wherein the TOF light source circuit includes a protection circuit, wherein the protection circuit includes a shunt module and a sampling module, and the shunt module and the sampling module are electrically connected in parallel to perform shunt sampling.

[0028] According to some embodiments, in the TOF circuit, the shunt module is a resistor, and the sampling module is a current detection amplifier.

[0029] According to some embodiments, in the TOF circuit, the protection circuit includes an averaging low-pass module, the sampling module outputs current information to the averaging low-pass module, and the averaging low-pass module processes the current information to obtain a current average value.

[0030] According to some embodiments, in the TOF circuit, the averaging low-pass module is a resistor and a capacitor.

[0031] According to some embodiments, in the TOF circuit, the protection circuit includes a comparison module, the averaging low-pass module outputs information to the comparison module, and the comparison module performs comparison processing.

[0032] According to some embodiments, in the TOF circuit, the comparison module is a comparator chip.

[0033] According to some embodiments, in the TOF circuit, the protection circuit includes a current detection switch module, and the comparison module outputs information to the current detection switch module.

[0034] According to some embodiments, in the TOF circuit, the current detection switch module is a current-limiting load switch.

[0035] According to some embodiments, in the TOF circuit, the protection circuit includes an error latch module, the shunt module outputs to the error latch module, and the error latch module outputs the status information of the TOF light source to the current detection switch module.

[0036] According to some embodiments, in the TOF circuit, the error latch module includes two resistors connected in series.

[0037] According to some embodiments, in the TOF circuit, the current detection switch module controls the operation of the TOF light source in combination with information from the error latch module and the comparison module.

[0038] According to some embodiments, in the TOF circuit, the protection circuit includes a peak current limiting module, and the peak current limiting module is connected to the current detection switch module to limit the circuit operating peak power.

[0039] According to some embodiments, in the TOF circuit, the peak current limiting module is a resistor.

[0040] According to some embodiments, in the TOF circuit, the light source circuit includes a power supply, and the power supply provides operating power for the protection circuit.

[0041] According to some embodiments, the TOF circuit, wherein the TOF light source is a VCSEL.

[0042] According to some embodiments, in the TOF circuit, the protection circuit includes a capacitor, one end of the capacitor is connected to the shunt module, and the other end is grounded.

[0043] According to some embodiments, in the TOF circuit, the protection circuit changes the limiting power by adjusting the resistance and capacitance values ​​to obtain predetermined output powers of different levels.

[0044] According to some embodiments, the TOF circuit, wherein the light source circuit includes a driving circuit, the driving circuit is electrically connected to the photosensitive circuit, and the driving circuit drives the TOF light source to operate.

[0045] According to some embodiments, in the TOF circuit, the driving circuit includes a buffer logic chip and a MOSFET transistor, the photosensor circuit is communicatively connected to the buffer logic chip, and the buffer logic chip is communicatively connected to the MOSFET transistor.

[0046] According to some embodiments, in the TOF circuit, the buffer logic chip and the MOSFET transistor are arranged adjacent to the TOF light source.

[0047] According to some embodiments, in the TOF circuit, the driving circuit includes at least one resistor and one capacitor, and the resistor and the capacitor cooperate with the buffer logic chip and the MOSFET transistor to work.

[0048] According to some embodiments, in the TOF circuit, the driving circuit includes 2 resistors and 6 capacitors.

[0049] According to some embodiments, in the TOF circuit, the light source circuit includes a temperature detection circuit, wherein the temperature detection circuit detects the temperature of the TOF light source.

[0050] According to some embodiments, in the TOF circuit, the temperature detection circuit includes a temperature sensor and a capacitor.

[0051] According to some embodiments, in the TOF circuit, the temperature sensor and the capacitor are disposed adjacent to the TOF light source.

[0052] According to some embodiments, the TOF circuit includes a calibration data storage circuit for storing calibration data of the TOF light source.

[0053] According to some embodiments, in the TOF circuit, the calibration data storage circuit includes a memory, a capacitor, and a resistor.

[0054] According to some embodiments, in the TOF circuit, the calibration data circuit is electrically connected to the photosensitive circuit.

[0055] According to some embodiments, the TOF circuit includes an interface unit, and the interface unit is used to output information.

[0056] According to some embodiments, in the TOF circuit, the photosensitive circuit includes a photosensitive chip and at least one capacitor.

[0057] According to some embodiments, the TOF circuit is disposed on at least one circuit board, and the circuit board has at least one heat dissipation hole.

[0058] According to some embodiments, in the TOF circuit, the heat dissipation hole is provided in coordination with the TOF light source.

[0059] According to some embodiments, in the TOF circuit, the circuit board is provided with at least one heat dissipation layer, and the heat dissipation layer is provided in coordination with the TOF light source.

[0060] According to some embodiments, in the TOF circuit, the heat dissipation layer is a copper layer.

[0061] Another aspect of the present invention provides a TOF camera module protection circuit, wherein the protection circuit provides a predetermined power output for a TOF light source, and the protection circuit includes a resistor, and a predetermined limited power is obtained by adjusting the resistance value.

[0062] According to some embodiments, the TOF camera module protection circuit, wherein the protection circuit includes a shunt module and a sampling module, the shunt module and the sampling module are electrically connected in parallel to perform shunt.

[0063] According to some embodiments, in the TOF camera module protection circuit, the shunt module is a resistor, and the sampling module is a current detection amplifier.

[0064] According to some embodiments, the TOF camera module protection circuit, wherein the protection circuit includes an averaging low-pass module, the sampling module outputs current information to the averaging low-pass module, and the averaging low-pass module processes the current information to obtain a current average value.

[0065] According to some embodiments, in the TOF camera module protection circuit, the averaging low-pass module is a resistor and a capacitor.

[0066] According to some embodiments, the TOF camera module protection circuit includes a comparison module, the average low-pass module outputs information to the comparison module, and the comparison module performs comparison processing.

[0067] According to some embodiments, in the TOF camera module protection circuit, the comparison module is a comparator chip.

[0068] According to some embodiments, the TOF camera module protection circuit includes a current detection switch module, and the comparison module outputs information to the current detection switch module.

[0069] According to some embodiments, in the TOF camera module protection circuit, the current detection switch module is a current limiting load switch.

[0070] According to some embodiments, the TOF camera module protection circuit, wherein the protection circuit includes an error latch module, the shunt module outputs to the error latch module, and the error latch module outputs the status information of the TOF light source to the current detection switch module.

[0071] According to some embodiments, in the TOF camera module protection circuit, the error latch module includes two series resistors and a protection cap.

[0072] According to some embodiments, in the TOF camera module protection circuit, the current detection switch module controls the operation of the TOF light source in combination with information from the error latch module and the comparison module.

[0073] According to some embodiments, the TOF camera module protection circuit includes a peak current limiting module, and the peak current limiting module is connected to the current detection switch module to limit the peak operating power of the circuit.

[0074] According to some embodiments, in the TOF camera module protection circuit, the peak current limiting module is a resistor.

[0075] According to some embodiments, the TOF camera module protection circuit includes a power supply, which provides working power for the protection circuit.

[0076] According to some embodiments, in the TOF camera module protection circuit, the TOF light source is a VCSEL.

[0077] According to some embodiments, the TOF camera module protection circuit includes a capacitor, one end of the capacitor is connected to the shunt module, and the other end is grounded.

[0078] According to some embodiments, the TOF camera module protection circuit, wherein the protection circuit changes the output power by adjusting the resistance and capacitance values ​​to obtain predetermined output power levels.

[0079] Another aspect of the present invention provides a TOF circuit with a heat dissipation structure, which comprises

[0080] a TOF circuit, driving a TOF light source; and

[0081] At least one circuit board, the TOF circuit board is arranged on the circuit board, and at least one circuit board has at least one heat dissipation hole to dissipate heat generated by the TOF circuit.

[0082] According to some embodiments, in the TOF circuit, the heat dissipation hole is provided in conjunction with the TOF light source.

[0083] According to some embodiments, in the TOF circuit, the circuit board is provided with at least one heat dissipation layer, and the heat dissipation layer is provided in cooperation with the TOF light source.

[0084] According to some embodiments, the TOF circuit, wherein the circuit board includes a light source substrate and a lens substrate, the TOF light source is arranged on the light source substrate, the heat dissipation hole is arranged on the light source substrate, and the TOF circuit is selectively arranged on the light source substrate and the lens substrate.

[0085] Another aspect of the present invention provides a TOF circuit manufacturing method, comprising the steps of:

[0086] (A) providing a shunt module for regulating current;

[0087] (B) Provide a sampling module to collect the current in the circuit

[0088] (C) providing a comparison module to compare the current signals in the circuit; and

[0089] (D) A current detection switch module is provided to control a TOF light source according to the results of the shunting module and the comparison module.

[0090] According to some embodiments, the TOF circuit manufacturing method further comprises the step of adjusting resistors and capacitors in the TOF circuit to obtain a predetermined level of output power.

[0091] According to some embodiments, the TOF circuit manufacturing method includes the steps of: providing an error latch module to obtain the status of the TOF light source and provide information to the current detection switch module.

[0092] According to some embodiments, the TOF circuit manufacturing method includes the steps of: providing an averaging low-pass module to obtain the average value of the current obtained by the sampling module and transmitting the average value to the comparison module.

[0093] According to some embodiments, the TOF circuit manufacturing method includes the steps of: providing a peak current limiting module to limit the peak current of the circuit.

[0094] Another aspect of the present invention provides a TOF circuit heat dissipation method, comprising the steps of:

[0095] Providing at least one circuit board, and setting at least one heat dissipation hole on the circuit board; and

[0096] Arrange a TOF circuit on the circuit board according to a predetermined layout;

[0097] According to some embodiments, the TOF circuit heat dissipation method includes the step of attaching a heat dissipation layer to a predetermined position of the circuit board.

[0098] According to some embodiments, in the TOF circuit heat dissipation method, arranging according to a predetermined layout includes arranging the protection circuit in the TOF circuit adjacent to a TOF light source.

[0099] According to some embodiments, in the TOF circuit heat dissipation method, arranging according to a predetermined layout includes arranging a driving circuit of the TOF circuit adjacent to the TOF light source.

[0100] According to some embodiments, in the TOF circuit heat dissipation method, arranging the circuit elements of the TOF circuit in a predetermined layout includes arranging the circuit elements of the TOF circuit in an integrated manner.

[0101] Another aspect of the present invention provides a TOF camera module, comprising:

[0102] a light source unit; and

[0103] A light receiving unit; wherein the light source unit generates light to a target, the light is reflected by the target, the light receiving unit receives the reflected light, and combines the information of the incident light and the reflected light to obtain depth image information.

[0104] According to some embodiments, in the TOF camera module, the light source unit includes a TOF light source and a light source circuit, and the light source circuit drives the TOF light source to operate.

[0105] According to some embodiments, in the TOF camera module, the light receiving unit includes a photosensitive circuit and a lens assembly, and the lens assembly receives light and transmits it to the photosensitive circuit for photosensitivity.

[0106] Another aspect of the present invention provides an electronic device comprising:

[0107] a device body; and

[0108] A TOF camera module as described above is arranged on the device body and cooperates with the device body to realize the acquisition and reproduction of depth images.

[0109] According to some embodiments, the electronic device is selected from the group consisting of: a smartphone, a tablet computer, a wearable device, a somatosensory interaction device, a ranging device, and a stereoscopic imaging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0110] Figure 1 2 is a schematic block diagram of a TOF camera module according to an embodiment of the present invention.

[0111] Figure 2 2 is a schematic diagram of a light source circuit block diagram of a TOF camera module according to the above embodiment of the present invention.

[0112] Figure 3 2 is a schematic diagram of a protection circuit block diagram of a TOF camera module according to the above embodiment of the present invention.

[0113] Figure 4 Schematic diagram of the working principle of the TOF camera module according to the above embodiment of the present invention.

[0114] Figure 5 3 is a schematic block diagram of data calibration of the TOF camera module according to the above embodiment of the present invention.

[0115] Figure 6 1 is a schematic block diagram of an implementation of a TOF camera module according to the above embodiment of the present invention.

[0116] Figure 7It is a schematic block diagram of the working process of the above-mentioned implementation method of the TOF camera module according to the above-mentioned embodiment of the present invention.

[0117] Figure 8 2 is a schematic diagram of a photosensitive circuit according to an embodiment of the TOF circuit of the TOF camera module of the present invention.

[0118] Figure 9 3. It is a schematic diagram of a protection circuit according to the implementation of the TOF circuit of the TOF camera module of the above embodiment of the present invention.

[0119] Figure 10 It is a schematic block diagram of the driving circuit of the TOF circuit of the TOF camera module according to the above embodiment of the present invention.

[0120] Figure 11 3. It is a schematic diagram of a temperature test circuit of the TOF circuit of the TOF camera module according to the above embodiment of the present invention.

[0121] Figure 12 3. It is a schematic diagram of the data storage circuit of the TOF circuit of the TOF camera module according to the above embodiment of the present invention.

[0122] Figure 13 This is the connection unit circuit diagram of the TOF camera module according to the above embodiment of the present invention.

[0123] Figure 14 3D schematic diagram of a specific implementation of the TOF camera module according to the above embodiment of the present invention.

[0124] Figure 15 Schematic diagram of the TOF camera module according to the above embodiment of the present invention.

[0125] Figure 16 1 is a schematic diagram of an exploded view of the above-mentioned specific implementation of the TOF camera module according to the above-mentioned embodiment of the present invention.

[0126] Figure 17 1 is a schematic diagram of the TOF circuit layout of the above-mentioned specific implementation of the TOF camera module according to the above-mentioned embodiment of the present invention.

[0127] Figure 18A , 18B is a schematic diagram of the light source substrate of the above-mentioned specific implementation of the TOF camera module according to the above-mentioned embodiment of the present invention.

[0128] Figure 19 FIG. 4 is a block diagram of a method for manufacturing a TOF protection circuit according to the above embodiment of the present invention.

[0129] Figure 204 is a block diagram of a heat dissipation method for a TOF circuit according to the above embodiment of the present invention.

[0130] Figure 21 2 is a schematic diagram of the application of the TOF camera module according to the above embodiment of the present invention. DETAILED DESCRIPTION

[0131] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are for illustrative purposes only, and those skilled in the art will readily appreciate other obvious variations. The basic principles of the present invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0132] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0133] It is understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the elements may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0134] With the rapid development and wide application of intelligent technology and virtual reality, TOF technology has also developed, and at the same time faces many problems, such as safety in actual use, safety and reliability of work, and the combination of actual circuit configuration and theory, etc. These are problems that need to be solved urgently. According to the present invention, a TOF camera module and a TOF circuit and a heat dissipation method and a manufacturing method and an application thereof are provided. The present invention pre-designs a TOF circuit that meets the requirements of the specification so that the output power of the TOF camera module is within a predetermined range. That is to say, a TOF camera module with different power requirements is designed according to requirements to meet different safety requirements for use and optimize resource utilization. Further, the present invention provides that when the TOF camera module is working, the working power is monitored so that it will not exceed the predetermined range, the output power is limited, the operation is more reliable and safe, and the collected data is more accurate. Further, the present invention detects the working temperature, on the one hand to ensure the safety of the work, and on the other hand the temperature data is used as the collected data screening a standard to further ensure the accuracy of data collection; further, in the specific implementation process of the present invention, the circuit component layout is designed according to the actual pre-required functions and the actual working conditions, the difference between the actual implementation circuit and the designed circuit is reduced, and the accuracy of the TOF camera module is improved; further, the present invention provides a calibration data storage circuit for the TOF camera module, which can pre-store calibration data. The user can directly retrieve the data therein for calibration when using it, without the need for secondary acquisition through other means, avoiding errors in the acquisition process and avoiding system errors caused by not performing calibration; further, the present invention provides a predetermined circuit layout and a heat dissipation structure of the circuit board for the TOF camera module, which on the one hand reduces the heat loss of the circuit itself, and on the other hand improves the heat dissipation performance of the circuit and reduces heat accumulation, thereby further improving the stability of the TOF camera module. Further, the TOF camera module of the present invention is modularly designed, so that each component is more integrated and conveniently applied to electronic equipment as a whole. In the above, the performance of the TOF camera module is improved in different ways, thereby providing the requirements of modern intelligent technology and virtual reality technology for the TOF camera module, so that the TOF camera module is more suitable for application in different fields, such as interactive entertainment, motion posture detection, expression recognition, entertainment advertising, medical technology, industrial control, etc., making the TOF camera module more suitable for application in various electronic devices, such as smart phones, tablet computers, wearable devices, somatosensory interaction devices, ranging equipment, and stereoscopic imaging equipment.

[0135] like Figures 1 to 13 As shown, a TOF camera module 100 according to an embodiment of the present invention can be applied to various electronic devices, for example but not limited to, smart phones, tablet computers, wearable devices, somatosensory interaction devices, ranging devices, and stereo imaging devices.

[0136] The TOF camera module 100 is used to obtain depth image information of the target under test, that is, the information obtained by the TOF camera module 100 includes depth information of the target and planar image information of the target.

[0137] According to this embodiment of the present invention, the TOF camera module 100 includes a TOF light source unit 10 and a light receiving unit 20. The TOF light source unit 10 is used to generate light, such as a laser. The light receiving unit 20 is used to receive light and obtain depth image information. For example, the TOF light source unit 10 emits light to a target object, and the light is reflected by the target object to obtain reflected light. The light receiving unit 20 receives the reflected light and obtains depth image information based on the reflected light information of the TOF light source unit 10.

[0138] Furthermore, the TOF camera module 100 includes an interface unit 30, which is used to transmit the depth image signal obtained by the TOF camera module 100 to an electronic device, such as a processor. The interface unit 30 is implemented as a multi-pin connector by way of example but not limitation.

[0139] The light source unit of the TOF camera module 100 includes a TOF light source 12 and a light source circuit 11, and the light source circuit 11 is used to drive the TOF light source 12 to generate light. The TOF light source 12 is, for example but not limited to, a VCSEL (Vertical Cavity Surface Emitting Laser) light source. That is, when the TOF light source unit 10 is working, the light source circuit 11 drives the TOF light source 12 to work and generate light. It is worth mentioning that the light source circuit 11 is a light source circuit 11 with a predetermined power, that is, when the TOF light source unit 10 is working normally, the normal working power of the light source unit is a predetermined value. In other words, the light source circuit 11 can be designed according to different requirements, so as to adjust the output power of the TOF light source unit 10 to meet different power requirements. For example, the output power of the TOF light source unit 10 can be adjusted by adjusting the circuit elements in the light source circuit 11, and the circuit elements are, for example but not limited to resistors and capacitors. According to the present invention, the light source circuit 11 can be designed to provide TOF light source units 10 with different predetermined powers, so as to meet different Application requirements, such as in the TOF camera module 100 for photographing people, in order to reduce the impact of light on the human body, a TOF camera module 100 with lower power is required. In this case, the light source circuit 11 can be designed to provide the TOF light source unit 10 and the TOF camera module 100 with lower power. For example, when photographing an object at a long distance, a TOF camera module 100 with higher power is required. In this case, the light source circuit 11 can be designed to provide the TOF light source unit 10 and the TOF camera module 100 with higher power. For example, when photographing an object with a small range and a short distance, the light source circuit 11 can be designed to provide the TOF light source circuit 11 and the TOF camera module 100 with appropriate power, thereby making full use of resources, avoiding waste due to excessive power, and avoiding inability to obtain accurate depth image information due to insufficient power.

[0140] The light receiving unit 20 includes a photosensitive circuit 21 and a lens assembly 22. The lens assembly 22 is used to receive and sense light. The photosensitive circuit 21 is electrically connected to the light source circuit 11. The photosensitive circuit 21 is used to process the light information and the light information emitted by the TOF light source 12 to obtain depth image information.

[0141] In other words, the light source circuit 11 and the photosensitive circuit 21 constitute the TOF circuit of the TOF camera module 100, that is, a circuit that realizes depth image information by cooperating with the light emission and receiving process of the TOF light source unit 10 and the light receiving unit 20.

[0142] The light source circuit 11 includes a driving circuit 111 , and the driving circuit 111 is used to drive the TOF light source 12 to operate.

[0143] Furthermore, the light source circuit 11 includes a protection circuit 112, which drives the TOF light source 12 to operate and protects the TOF light source 12. For example, the protection circuit 112 drives the light source to operate within a predetermined power range and limits the circuit power to exceed the predetermined range.

[0144] The protection circuit 112 is connected to the driving circuit 111 so as to protect the TOF light source 12 and the light source circuit 11 when the TOF light source 12 is driven to operate.

[0145] It is worth mentioning that in the TOF module, the operating power and circuit current of the TOF are important parameters for the stability and reliability of the TOF module. When the designed power is large but the actual power required is small, resources are wasted; when the designed power is small but the actual power required is large, it cannot meet the working requirements and the reliability of the information obtained is low. When the power or current of the light source circuit 11 exceeds the predetermined value, the reliability of the information obtained by the TOF module may be reduced, the circuit operation is unsafe, and resources are wasted. The protection circuit 112 of the present invention can be designed to meet the required power according to predetermined requirements. When working, it can detect the circuit current and power of the TOF camera module 100, thereby making the circuit operating power controllable from different aspects, making the operation of the TOF camera module 100 more reliable and stable. For example, the protection circuit 112 can be set to limit the current. When the current exceeds the limit value, the protection circuit 112 can be activated, such as disconnecting the power supply of the TOF light source 12, so that the TOF light source 12 stops working.

[0146] like Figure 3 FIG. 1 is a block diagram of the protection circuit 112 of the TOF camera module 100 according to the embodiment of the present invention. The protection circuit 112 includes a shunt module 1121 , a sampling module 1123 , a comparison module 1125 and a current detection switch module 1126 .

[0147] The shunt module 1121 is used to regulate the circuit current and is communicatively connected to the current detection switch module 1126 .

[0148] The sampling module 1123 is used to collect current signal information when the protection circuit 112 is working. The sampling module 1123 is arranged in parallel with the shunt module 1121 and has the same terminal voltage as the shunt module 1121.

[0149] The comparison module 1125 is used to compare current information and transmit the comparison result to the current detection switch.

[0150] The current detection switch module 1126 is used to determine the switch of the TOF light source 12 according to input information.

[0151] The protection circuit 112 further includes an averaging low-pass module 1124 , which cooperates with the adopting module to obtain the average value of the output signal of the sampling module 1123 .

[0152] Furthermore, the averaging module transmits information to the comparison module 1125 , and the comparison module 1125 compares the input information of the averaging low-pass module 1124 and transmits the comparison result to the current detection switch module 1126 .

[0153] Furthermore, the protection circuit 112 includes an error latch module 1122, which is used to determine the status of the TOF light source 12 and transmit the information to the current detection switch module 1126. In other words, the error latch module 1122 is communicatively connected to the current detection switch module 1126. For example, when the TOF light source 12 is normal, the error latch module 1122 transmits a closing message to the current detection switch module 1126, and the current detection switch module 1126 can determine whether the TOF light source 12 is on or off based on the input information. When the TOF light source 12 is abnormal, the error latch module 1122 transmits a disconnection message to the current detection switch module 1126, and the current detection switch module 1126 can determine whether the TOF light source 12 is on or off based on the input information.

[0154] The protection circuit 112 may further include a peak current limiting module 1127 for limiting the peak operating current of the light source circuit 11 so that the TOF camera module 100 operates within a predetermined power range. In other words, the peak current limiting module 1127 is communicatively connected to the current detection switch module 1126.

[0155] The peak current limiting module 1127 cooperates with the current detection switch module 1126 to work so that the limiting power or operating power of the TOF light source 12 is within a predetermined range.

[0156] The protection circuit 112 may include a power supply that provides operating power to the protection circuit 112. The power supply may be a component of the protection circuit 112 or may be current provided by an external circuit. Those skilled in the art will appreciate that the present invention is not limited in this respect.

[0157] That is, the input end of the protection circuit 112 is connected to the power supply, and the output end is connected to the TOF light source 12 .

[0158] Overall, with reference to Figure 4 The operating process of the protection circuit 112 may be as follows: current flows into the shunt module 1121 and the sampling module 1123 respectively. The sampling module 1123 collects current information and outputs the information to the averaging low-pass module 1124. The averaging low-pass module 1124 processes the input information and transmits the processed current information to the comparison module 1125. The comparison module 1125 performs comparison and transmits the comparison result to the current detection switch module 1126. One output current of the shunt module 1121 is transmitted to the current detection switch module 1126. Another output current of the shunt module 1121 is transmitted to the error latch module 1122. The error latch module 1122 transmits the output information to the current detection switch module 1126. The current detection switch module 1126 comprehensively determines the information from the shunt module 1121, the error latch module 1122, and the comparison module 1125 to determine whether to turn the TOF light source 12 on or off. For example, when the current detection switch module 1126 receives the information that the light source 12 is abnormal transmitted by the error latch module 1122, the current detection switch module 1126 controls to disconnect the power supply of the TOF light source 12; when the current detection switch module 1126 receives the current information of the shunt module 1121 exceeding the specified range, the current detection switch module 1126 controls to disconnect the power supply of the TOF light source 12; when the current detection switch module 1126 receives the comparison information of the comparison module 1125 exceeding the specified range, the current detection switch module 1126 controls to disconnect the power supply of the TOF light source 12; and when the input information of the shunt module 1121, the error latch module 1122 and the comparison module 1125 all fall within the predetermined range, the current detection switch module 1126 controls to turn on the power supply of the TOF light source 12, or keeps the power supply of the TOF light source 12 in the turned-on state.

[0159] During circuit design, in the protection circuit 112, the power of the light source circuit 11 can be adjusted by adjusting the circuit elements of one or more of the shunt module 1121, the sampling module 1123, the comparison module 1125, the current detection module, the averaging low-pass module 1124, the error latch module 1122, and the peak current limiting module 1127. The circuit elements include, but are not limited to, resistors and capacitors. In other words, during design, a TOF camera module 100 with a predetermined power can be obtained by adjusting the circuit elements of one or more of the shunt module 1121, the sampling module 1123, the comparison module 1125, the current detection switch module 1126, the averaging low-pass module 1124, the error latch module 1122, and the peak current limiting module 1127.

[0160] The light source circuit 11 further includes a temperature detection circuit 113, which detects the temperature of the TOF light source unit 10. The temperature detection circuit 113 is implemented as a temperature sensor, for example but not limited to, and may also include other matching current elements, such as inductors, capacitors, etc.

[0161] The temperature detection circuit 113 may be used to detect the temperature of the TOF light source 12 and / or the temperature of a heat-generating or sensitive component of the TOF light source circuit 11 .

[0162] Reference Figure 2 and Figure 5 The TOF circuit includes a calibration data storage circuit 23, and the calibration data storage circuit 23 is used to store the calibration data of the TOF camera module 100. That is to say, the calibration data of the TOF camera module 100 is pre-stored by the calibration data storage circuit 23 to facilitate user calibration. In other words, when the user uses the TOF camera module 100, the TOF camera module 100 can be calibrated by extracting the calibration data in the calibration storage circuit, so that the TOF camera module 100 has an accurate benchmark, improves the working accuracy of the TOF camera module 100, avoids errors in the secondary acquisition of calibration data during use and inaccurate calibration, and prevents inaccurate working benchmarks due to failure to perform calibration, thereby reducing the waste of user time.

[0163] The calibration data storage circuit 23 is implemented as a data memory by way of example but not limitation. Of course, it may also include other circuit components such as resistors, capacitors, etc.

[0164] The calibration data storage circuit 23 is electrically connected to the interface unit 30 , so that when used, an external electronic device can extract the calibration information stored in the calibration data storage circuit 23 through the interface unit 30 .

[0165] Reference Figure 4 and Figure 5 For example, the working process of the TOF camera module 100 can be that the TOF light source 12 emits light under the drive of the light source circuit 11, and the light is reflected by the target after reaching the target. Further, the emitted light is received by the light receiving unit 20 for photosensitivity. The photosensitive circuit 21 combines the information of the light emitted by the TOF light source 12 and the information of the light received by the light receiving unit 20 to obtain the depth image information of the target. Further, the depth image information of the target can be output through the interface unit 30. For example, it can be output to a processor to apply the depth image information, such as for interactive entertainment, gesture detection, expression recognition, entertainment advertising, medical technology, and industrial control. For example, it can be output to an electronic device, so that the depth image information of the target collected by the TOF camera module 100 can be reproduced in a three-dimensional manner by the electronic device. The light source circuit 11 is communicatively connected to the photosensitive circuit 21 to facilitate the transmission of the light emission information of the TOF light source 12 to the photosensitive circuit 21. The communication connection method is, for example, but not limited to, a wired or wireless connection method, such as an electrical connection method or a signal connection method.

[0166] Of course, before using the TOF camera module 100, the user can calibrate the TOF camera module 100 by extracting the calibration data in the calibration data storage circuit 23, so that the TOF camera module 100 obtains a reference value that meets the predetermined standard, making the output information more accurate.

[0167] Furthermore, during the operation of the TOF camera module 100, the temperature detection circuit 113 detects the temperature of the TOF light source 12. The temperature detection circuit 113 is communicatively connected to the photosensitive circuit 21. The photosensitive circuit 21 uses the information of the temperature detection circuit 113 as a reference value for image sampling. For example, when the temperature detection circuit 113 detects that the temperature of the TOF light source 12 is higher than a predetermined value, the photosensitive circuit 21 analyzes that the collected depth image information does not meet the predetermined conditions and eliminates it. When the temperature detection circuit 113 detects that the temperature of the TOF light source 12 is within a predetermined range, the photosensitive circuit 21 analyzes that the collected image information meets the predetermined conditions and retains it. Therefore, through the temperature monitoring method, the sampling is more accurate, and the depth image information obtained by the TOF camera module 100 is more accurate.

[0168] The temperature detection circuit 113 may also transmit information to an external device, such as to a main processor, so that the main processor can take corresponding measures.

[0169] Reference Figure 6 and Figure 7 In one embodiment, the TOF light source 12 is implemented as a VCSEL that meets predetermined standards, such as Class 3B, and generates 850nm laser light. The driver circuit 111 and the protection circuit 112 work in conjunction with the TOF light source 12. The photosensitive circuit 21 is implemented as an integrated chip, such as a photosensitive chip, with a resolution of 224×172. The interface unit 30 is implemented as a 30-pin connector, the temperature detection circuit 113 is implemented as a temperature sensor, and the calibration data storage circuit 23 is implemented as a data memory.

[0170] The driving circuit 111 and the protection circuit 112 drive the VCSEL to generate laser, the photosensitive circuit 21 is communicatively connected to the light source circuit 11, the sensor is communicatively connected to the photosensitive circuit 21 integrated chip, the calibration data storage circuit 23 is communicatively connected to the photosensitive circuit 21, and the main processor is communicatively connected to the 30Pin connector of the interface unit 30 to obtain depth image information.

[0171] In one embodiment, the TOF light source 12 is implemented as a near-infrared emitter, the light receiving unit 20 is implemented as a TOF receiving module, and the interface unit 30 is implemented as an input-output interface. The photosensitive circuit 21 can be implemented as a main control system, which includes a phase difference operator and an analysis and processing unit. The working process of the TOF camera module 100 is that the near-infrared emitter emits light, the phase of the reflected light is phase 1, the emitted light is projected onto the target, and is reflected after contacting the target, the TOF receiving module receives the light, and the phase corresponding to the received light is phase 2. Further, the main control system processes the phase difference information through the phase difference operator, for example, phase difference = phase 1 - phase 2. Further, the analysis and processing unit processes the phase difference to convert it into depth RAW data. Further, the depth RAW data can be output to the AP end through the input and output interface.

[0172] like Figure 8 FIG. 1 is a schematic diagram of a photosensitive circuit 21 of a TOF circuit of a TOF camera module 100 according to the above embodiment of the present invention. Figure 9 FIG. 1 is a schematic diagram of a protection circuit 112 of the TOF circuit of the TOF camera module 100 according to the above embodiment of the present invention. Figure 10As shown in FIG, it is a block diagram of a driving circuit 111 according to the embodiment of the TOF circuit of the TOF camera module 100 of the above embodiment of the present invention. Figure 11 As shown in FIG. 1 , it is a schematic diagram of a temperature test circuit according to the embodiment of the TOF circuit of the TOF camera module 100 according to the above embodiment of the present invention. Figure 12 The figure shows a data storage circuit diagram of the TOF circuit of the TOF camera module 100 according to the above embodiment of the present invention. Figures 8 to 12 Different parts of a specific implementation of the TOF circuit are shown respectively, namely the specific implementation of the photosensitive circuit 21, the protection circuit 112, the driving circuit 111, and the calibration data storage circuit 23. The different parts can work in combination with each other or cooperate with other circuits separately.

[0173] The photosensitive circuit 21 includes at least one photosensitive element 211 and at least one RC element 212. The photosensitive element 211 is used to sense light and process light information. The RC element 212 cooperates with the photosensitive element 211 to complete the photosensitive function.

[0174] Reference Figure 8 In this embodiment of the present invention, the photosensitive element 211 is implemented as a photosensitive chip U1. The photosensitive chip U1 may be a 42-port chip, some of which are used to connect to the protection circuit 112, the drive circuit 111, and the data calibration and storage circuit. For example, the model of the photosensitive chip U1 may be IRS1645C. The RSET N port of the photosensitive chip U1 is connected to a resistor R1, which may be, for example, 10KΩ.

[0175] For example, the RC element 212 of the interface of the photosensitive chip U1 is implemented as a capacitor, such as Figure 8The capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, and C19 are shown in FIG. The capacitors C1, C2, and C3 are connected in parallel to the VDDMODH interface of the photosensitive chip. For example, the capacitance values ​​of the capacitors C1, C2, and C3 can be 10uF, 1nF, and 1nF, respectively. The capacitor C4 is connected to the VDDIO of the photosensitive chip. For example, the capacitance value of the capacitor C4 can be 100nF. The capacitors C5, C6, C7, C8, and C9 are connected in parallel to the 3V3 interface of the photosensitive chip U1. For example, the capacitance values ​​of the capacitors C5, C6, C7, C8, and C9 can be 10uF, 10nF, 10nF, 10nF, and 100nF, respectively. The capacitors C10, C11, and C12 are connected in parallel to the 3V3 interface of the photosensitive chip U1. For example, the capacitance values ​​of the capacitors C10, C11, and C12 are 1nF, 1nF, and 1nF respectively. The capacitors C13, C14, C15, C16, C17, C18, and C19 are connected in parallel to the 1V5 interface of the photosensitive chip U1. For example, the capacitance values ​​of the capacitors C13, C14, C15, C16, C17, C18, and C19 can be 10uF, 1nF, 10nF, 1nF, 100nF, 1nF, and 1nF respectively.

[0176] Reference Figure 9 In this embodiment of the present invention, the shunt module 1121 of the protection circuit 112 is implemented as a resistor R8. For example, in some embodiments, the resistance of the resistor R8 may be 0.082Ω.

[0177] The sampling module 1123 is implemented as a current sense amplifier U5. The averaging low-pass module 1124 is implemented as a resistor R10 and a resistor C28. The resistor R10 is connected to the OUT port of the current sense amplifier U5, and the capacitor C28 is connected to the GND port of the current sense amplifier U5. For example, in some embodiments, the resistance of the resistor R10 can be 10K, and the capacitance of the capacitor C28 can be 22uF. For example, the model of the current sense amplifier U5 can be MAX9634F.

[0178] The comparison module 1125 is implemented as a comparator chip U6. One end of the resistor R10 and one end of the capacitor C28 are respectively connected to the IN interface of the comparator chip U6. The GND interface of the current detection amplifier U5 is connected to the GNF interface of the comparator chip U6, and both are grounded. For example, the model of the comparator chip U6 can be MAX9645.

[0179] The current detection switch module 1126 is implemented as a current-limiting load switch U7, having six interfaces: IN, EN, GND, OUT, FLAG, and SETI. For example, the model of the current-limiting load switch U7 can be FPF2194. The OUT interface of the current-limiting load switch U7 is connected to the power supply (VVSEL) of the TOF light source 12. The GND interface of the current-limiting load switch U7 is grounded. The OUT interface of the comparison chip U6 is connected to the EN interface of the current-limiting load switch U7.

[0180] The peak current limiting module 1127 is implemented as a peak current limiting resistor R12, which works in conjunction with the current limiting load switch U7. The peak current limiting resistor R12 is connected to the interface SETI of the current limiting load switch U7. For example, the resistance of the resistor R12 is 751Ω.

[0181] The error latch module 1122 is implemented as a resistor R9, a resistor R11, and a protective cap (VCSEL cap). The resistor R11 is connected to the protective cap (VCSEL cap), such as a VCSEL, to obtain status information of the TOF light source 12, such as whether the TOF light source is disconnected or abnormal. The error latch module 1122 is connected to the EN interface of the current-limiting load switch U7. For example, the resistance of the resistor R9 can be 49.9Ω, and the resistance of the resistor R11 can be 10KΩ. For example, the protective cap (VCSEL cap) detects information about the TOF light source 12. When the protective cap (VCSEL cap) detects that the TOF light source 12 is normal, the error latch module 1122 transmits the normal light source information to the current-limiting load switch U7. When the protective cap (VCSEL cap) detects that the TOF light source 12 is abnormal, the error latch module 1122 transmits the abnormal light source information to the current-limiting load switch U7, and the current-limiting load switch U7 disconnects the power supply to the TOF light source 12.

[0182] One end of the shunt resistor R8 is connected to the B2 interface of the current limiting load switch U7.

[0183] The protection circuit 112 further includes a capacitor C29, which is used to regulate the circuit current. One end of the capacitor C29 is connected to the resistor R8, and the other end is grounded. For example, the capacitance value of the capacitor C29 can be 0.1uF.

[0184] The protection circuit 112 further includes a resistor R13 for regulating the circuit current. One end of the resistor R13 is connected to the EN interface of the current-limiting load switch U7, and the other end is grounded.

[0185] In the protection circuit 112, the power of the TOF light source 12 can be adjusted by adjusting the resistance value of the resistor in the circuit and the capacitance value of the capacitor. For example, the power of the TOF light source 12 can be adjusted by adjusting the resistance value or capacitance value of one or more of the resistors R8, R9, R11, R10, R13, R12 and C28, C29 to obtain the TOF camera module 100 of different power levels.

[0186] It should be understood by those skilled in the art that the models of the chips U1, U3, U4, U5, U6, U7, U8, and U9 and the capacitance values ​​of the capacitors and the resistance values ​​of the resistors in the above-mentioned embodiment are merely an example of an implementation method and are not a limitation of the present invention. The chips U1, U3, U4, U5, U6, U7, U8, and U9 may also be other models, and the resistance values ​​and the capacitance values ​​may also be other values.

[0187] Reference Figure 10 In this embodiment of the present invention, the driver circuit 111 includes a driver buffer logic chip U3 and a MOSFET transistor U4. The driver buffer logic chip U3 has six interfaces: A1, GND, A2, Y1, VCC, and Y2. The MOSFET transistor U4 has three interfaces: G, D, and S.

[0188] The driving circuit 111 further includes a resistor R2 , a resistor R7 , a plurality of capacitors, and a light emitting diode D1 . The plurality of capacitors are capacitors C21 , C23 , C24 , C25 , C26 , and C27 .

[0189] Interfaces A1 and A2 of the drive buffer logic chip U3 are connected to interface MOD_SE_P of the photosensitive chip U1. Interface GND of the drive buffer logic chip U3 is grounded. Interfaces Y1 and Y2 of the drive buffer logic chip U3 are connected to interface G of the MOSFET transistor U4. Interface VCC of the drive buffer logic chip U3 is connected to interface 3V3 of the photosensitive chip U1. For example, the model of the drive buffer logic chip U3 can be NC7WV17L6X.

[0190] The interface D of the MOSFET transistor U4 is connected to the diode D1, and the interface S of the MOSFET transistor U4 is grounded. The light emitting diode D1 is the TOF light source 12. For example, the model of the MOSFET transistor U4 can be CSD17381F4.

[0191] One end of the resistor R2 is connected to the interface MOD_SE_P of the photosensitive chip U1, and the other end is grounded. For example, the resistance of the resistor R2 is 10KΩ.

[0192] One end of the capacitor C21 is connected to the interface 3V3 of the photosensitive chip U1, and the other end is grounded. For example, the capacitance value of the capacitor C21 is 0.1uF.

[0193] The capacitors C23, C24, and C25 are connected in parallel to the power supply (VVSEL) of the TOF light source 12, such as VSEL, and are grounded. For example, the capacitance values ​​of the capacitors C23, C24, and C25 can be 10uF, 0.1uF, and 0.1uF, respectively.

[0194] One end of the resistor R7 is connected to the power supply (VVSEL) of the TOF light source 12 , and the other end is connected to the light emitting diode D1 .

[0195] One end of the capacitors C26 and C27 is connected to one end of the resistor R7, and the other end is grounded. For example, the resistance values ​​of the capacitors C26 and C27 can be 22nF and 22nF respectively.

[0196] One end of the light emitting diode D1 is connected to the resistor R7 , and the other end is connected to the interface D of the MOSFET transistor U4 .

[0197] Reference Figure 11 According to this embodiment of the present invention, the temperature detection circuit 113 includes a temperature sensor U8 and a capacitor C30.

[0198] For example, the temperature sensor U8 has six interfaces, namely SDA, VCC, A0, SCL, GND, and ALERT. Interface SDA of the temperature sensor U8 is connected to interface I2C_SDA of the photosensitive chip U1. Interface VCC of the temperature sensor U8 is connected to interface VDDIO of the photosensitive chip U1. Interface A0 of the temperature sensor U8 is grounded. Interface SCL of the temperature sensor U8 is connected to interface I2C_SCL of the photosensitive chip U1. Interface GND of the temperature sensor U8 is grounded. For example, the model of the temperature sensor U8 is PCT2202UK.

[0199] One end of the capacitor C30 is connected to the interface VDDIO of the photosensitive chip U1, and the other end is grounded. For example, the capacitance value of the capacitor C30 is 0.1uF.

[0200] The selection of the temperature sensor U8 needs to consider factors such as temperature measurement accuracy, number of communication interfaces, and operating power requirements.

[0201] Reference Figure 12 According to this embodiment of the present invention, the calibration data storage circuit 23 includes a memory U9, a resistor R14 and a capacitor C31.

[0202] The memory U9 has 8 interfaces, namely VCC, WC, DU, SCL, VSS, E2, SDA, and E1. The interface VCC of the memory U9 is connected to the interface VDDIO of the photosensitive chip U1, and the interface WC of the memory U9 is connected to the interface VDDIO of the photosensitive chip U1 through the resistor R14. The interface SCL of the memory U9 is connected to the interface I2C_SCL of the photosensitive chip U1. The interface VSS of the memory U9 is grounded. The interfaces E2 and E1 of the memory U9 are connected to the interface VDDIO of the photosensitive chip U1. The interface SDA of the memory U9 is connected to the interface I2C_SDA of the photosensitive chip U1. For example, the model of the memory U9 may be M24M01DF. For example, the resistance value of the resistor R14 is 10KΩ.

[0203] One end of the capacitor C31 is connected to the interface VDDIO of the photosensitive chip U1, and the other end is grounded. For example, the capacitance value of the capacitor C31 can be 0.1uF.

[0204] The selection of the memory U9 needs to consider factors such as the number of communication interfaces, storage capacity, working reliability and stability, etc.

[0205] Reference Figure 13 According to this embodiment of the present invention, the interface unit 30 is implemented as a connector J1. The connector J1 has 30 interfaces, which are respectively connected to the interfaces corresponding to the photosensitive chip U1 and ground.

[0206] For example, interfaces 1 and 3 of the connector J1 are connected to interface 3V3 of the photosensitive chip U1. Interfaces 2, 4, 6, and 8 of the connector J1 are connected to interface V_ILLU of the photosensitive chip U1. Interfaces 5, 13, 19, 25, 10, 16, and 22 of the connector J1 are grounded. Interface 7 of the connector J1 is connected to interface VDDIO of the photosensitive chip U1. Interface 11 of the connector J1 is connected to interface IMG_CLK of the photosensitive chip U1. Interfaces 12 and 14 of the connector J1 are connected to interface 1V5 of the photosensitive chip U1. Interface 15 of the connector J1 is connected to interface CSI_D0_P of the photosensitive chip U1. Interface 17 of the connector J1 is connected to interface CSI_D0_N of the photosensitive chip U1. Interface 18 of the connector J1 is connected to interface ILLU_EN of the photosensitive chip U1. Interface 20 of the connector J1 is connected to interface IMG_START of the photosensitive chip U1. The interface 21 of the connector J1 is connected to the interface CSI_CL_P of the photosensitive chip U1. The interface 23 of the connector J1 is connected to the interface CSI_CL_N of the photosensitive chip U1. The interface 24 of the connector J1 is connected to the interface I2C_SCL of the photosensitive chip U1. The interface 26 of the connector J1 is connected to the interface I2C_SDA of the photosensitive chip U1. The interface 27 of the connector J1 is connected to the interface CSI_D1_P of the photosensitive chip U1. The interface 29 of the connector J1 is connected to the interface CSI_D1_N of the photosensitive chip U1. The interface 30 of the connector J1 is connected to the interface RESET_N of the photosensitive chip U1. For example, the model of the connector J1 can be AXE630124.

[0207] The TOF light source unit 10 and the light receiving unit 20 of the above embodiments of the present invention can be implemented in different ways to form different types of TOF camera modules 100 . Figures 14 to 18B FIG2 is a specific implementation of the TOF camera module 100 according to the above embodiment of the present invention. It is worth mentioning that the structure of the TOF camera module 100 is only used as an example to illustrate a way in which the present invention can be implemented, and is not a limitation of the present invention.

[0208] like Figure 14 As shown, it is a three-dimensional schematic diagram of a specific implementation of the TOF camera module 100 according to the above embodiment of the present invention. Figure 15 As shown in FIG, it is a schematic diagram of a TOF camera module 100 according to the above embodiment of the present invention. Figure 16, is an exploded schematic diagram of the above-mentioned specific implementation of the TOF camera module 100 according to the above-mentioned embodiment of the present invention. The TOF camera module 100 includes a TOF light source unit 10, a light receiving unit 20, and an interface unit 30. The TOF light source unit 10 emits light, the light receiving unit 20 receives the light and analyzes the emitted and received light information to obtain depth image information, and the interface unit 30 is communicatively connected to the light receiving unit 20 and transmits information to the electronic device.

[0209] In this embodiment of the present invention, the TOF light source unit 10 and the light receiving unit 20 each constitute a light source module and a camera module, and the light source module and the camera module are communicatively connected to each other. Specifically, the light source unit and the light receiving unit 20 are connected via a communication element 40, such as, but not limited to, a flexible connector or a multi-way cable.

[0210] The TOF light source unit 10 is disposed adjacent to the light receiving unit 20. The light directions of the TOF light source unit 10 and the light receiving unit 20 are consistent.

[0211] The TOF light source unit 10 includes a TOF light source 12 , a light source circuit 11 , and a light source substrate 13 .

[0212] The light receiving unit 20 includes a photosensitive circuit 21 and a lens assembly 22. The photosensitive circuit 21 includes a photosensitive element 211 and at least one resistor-capacitor element 212. The lens assembly 22 includes a lens 221, a lens supporting element 222, and a lens substrate 223. Furthermore, the circuit components of the TOF circuit are arranged on the light source substrate 13 and the lens substrate 223 in a predetermined layout.

[0213] The light source circuit 11 and the photosensitive circuit 21 constitute the circuit elements of the TOF circuit and are selectively arranged on the light source substrate 13 or the lens substrate 223. That is, the driving circuit 111, the protection circuit 112, the temperature detection circuit 113, the calibration data storage circuit 23, and the circuit elements in the photosensitive circuit 21 are selectively arranged on the light source substrate 13 and the lens substrate 223. In other words, the light source substrate 13 and the lens substrate 223 constitute the circuit board of the TOF camera module 100 on which the TOF circuit is arranged. The light source substrate 13 and the lens substrate 223 can be an integral circuit board or two circuit boards, and the present invention is not limited in this respect.

[0214] The TOF light source 12 is mounted on the light source substrate 13. In other words, the circuit components of the light source circuit 11 in the above embodiment are pre-set on the light source substrate 13, for example but not limited to, by embedded circuits, surface mounting, etching, etc. In other words, some components of the light source circuit 11 are disposed inside the light source substrate 13, while some circuit components are exposed on the surface of the light source substrate 13.

[0215] The photosensitive circuit 21 is provided on the lens substrate 223 by, for example, but not limited to, embedding, surface mounting, or etching a circuit. For example, the photosensitive chip is provided on the lens substrate 223 by surface mounting. The lens supporting element 222 is provided on the lens substrate 223, and the lens 221 is provided on the lens supporting element 222, so that the lens 221 is located in the light sensing path of the photosensitive chip.

[0216] The TOF light source 12 generates heat during operation. When the heat accumulates, it will affect the working stability of the TOF light source unit 10. In the present invention, the circuit elements of the light source circuit 11 are arranged according to a predetermined layout to optimize the layout of the light source circuit 11.

[0217] The circuit layout of the light source circuit 11 is, for example but not limited to, arranging the TOF light source 12 and the protection circuit 112 adjacent to each other to reduce power loss during long-distance transmission, thereby reducing signal inaccuracy.

[0218] The power circuit layout is exemplified but not limited to placing the temperature detection circuit 113 adjacent to the TOF light source 12 , so that the temperature information detected by the temperature detection circuit 113 is more accurate and closer to the actual temperature of the TOF light source 12 .

[0219] Further, refer to Figure 17 In this embodiment of the present invention, the TOF circuit can be arranged in such a manner that the buffer logic chip U3 and the MOSFET transistor U4 are positioned adjacent to the TOF light source 12, that is, adjacent to the VCSEL. The buffer logic chip U3 and the MOSFET transistor U4 are positioned adjacent to each other. The temperature sensor U8 is positioned adjacent to the TOF light source 12. The capacitor C30 is positioned adjacent to the TOF light source 12. The capacitor C30 is positioned adjacent to the temperature sensor U8.

[0220] Furthermore, circuit elements can be selectively arranged on the light source substrate 13 and the lens substrate 223, respectively. For example, circuit elements can be arranged around the photosensitive chip U1 and around the TOF light source 12. When arranging the circuit elements, the circuit elements of related circuits are placed close to each other, such as circuit elements belonging to the same module. During the arrangement process, the connection distance between related circuit elements is reduced to reduce transmission loss.

[0221] For example, in one embodiment, the photosensitive chip U1, the current detection amplifier U5, the comparator chip U6, the current-limiting load switch U7, and the calibration data memory U9 are disposed on the circuit board. The capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, and C19 are disposed adjacent to the photosensitive chip U1. The resistor R1 is disposed adjacent to the photosensitive chip U1. The resistor R14 and the capacitor C31 are disposed adjacent to the calibration data memory U9. The current detection amplifier U5 and the comparator chip U6 are disposed adjacent to each other. The resistors R8, R9, R10, R11, R12, and R13 are disposed adjacent to the current detection amplifier U5, the comparator chip U6, and the current-limiting load switch U7. The capacitor C29 is disposed adjacent to the current-limiting load switch U7.

[0222] The buffer logic chip U3, the MOSFET transistor U4, and the temperature sensor U8 are disposed on the light source substrate 13. The resistor R7 and the resistor R2 are also disposed on the light source substrate 13. The capacitors C21, C23, C24, C25, C26, and C27 are also disposed on the light source substrate 13. The capacitors C21, C23, C24, C25, C26, and C27 and the resistors R2 and R7 are collectively disposed.

[0223] like Figure 18A FIG. 1 is a schematic diagram of the light source substrate 13 of the TOF camera module 100 according to the above embodiment of the present invention. Figure 18B , which is a partially enlarged schematic diagram of the light source substrate 13 of the above-mentioned specific implementation of the TOF camera module 100 according to the above-mentioned embodiment of the present invention, is used to illustrate the heat dissipation of the light source substrate 13. The light source substrate 13 includes at least one substrate layer 131 and at least one heat dissipation layer 132. The heat dissipation layer 132 is provided at a predetermined position of the substrate layer 133 to enhance the heat dissipation performance of the light source substrate 13. The heat dissipation layer 132 can be implemented as a metal layer, for example but not limited to a copper layer, such as a coated copper layer.

[0224] The heat dissipation layer 132 is disposed in a predetermined area, for example but not limited to, the area corresponding to the TOF light source 12. The heat dissipation layer 132 may also be entirely attached to the surface of the substrate layer 131. Those skilled in the art will appreciate that the location and area of ​​the heat dissipation layer 132 are not limitations of the present invention.

[0225] The substrate layer 133 has at least one heat dissipation hole 131 to enhance the heat dissipation performance of the light source substrate 13. In some embodiments, the heat dissipation hole 131 is disposed at a position corresponding to the heat dissipation layer 132, thereby cooperating with the heat dissipation layer 132 to enhance the heat dissipation performance of the TOF light source unit 10. Of course, in other embodiments of the present invention, the heat dissipation hole 131 may also be disposed in other areas, and the positions of the heat dissipation area and the heat dissipation hole 131 may not correspond. Those skilled in the art will understand that the location of the heat dissipation hole 131 and the heat dissipation layer 132 is not a limitation of the present invention.

[0226] In other words, in some embodiments, the light source substrate 13 is formed by alternating overlapping of the heat dissipation layer 132 and the substrate layer 133, and the heat dissipation holes 131 pass through the alternating layers, so that the heat of the heat dissipation layer 132 can be dissipated through the heat dissipation holes 131, thereby improving the heat dissipation efficiency of the light source substrate 13.

[0227] Furthermore, the TOF camera module 100 includes an assembly frame 50, which is mounted on the light source unit and the light receiving unit 20, thereby integrating the TOF camera module 100. The assembly frame 50 has a light source hole 51 and a lens hole 52. The light source hole 51 corresponds to the TOF light source 12, so that the light from the TOF light source 12 can be emitted through the light source hole 51. The lens hole 52 corresponds to the lens 221 of the light receiving unit 20, so that the reflected light can enter the lens 221 through the lens hole 52.

[0228] Furthermore, the assembly frame 50 may be made of metal so as to enhance the heat dissipation performance of the TOF camera module 100 through the assembly frame 50 .

[0229] like Figure 19 FIG. 1 is a block diagram of a method for manufacturing a TOF circuit according to the above embodiment of the present invention. According to the above embodiment of the present invention, the present invention provides a method 1000 for manufacturing a TOF protection circuit 112, the manufacturing method comprising the steps of:

[0230] 1001: Providing a shunt module 1121 for regulating current;

[0231] 1002: Provide a sampling module 1123 to collect current in the circuit

[0232] 1003: providing a comparison module 1125 to compare current signals in the circuit; and

[0233] 1004 : Provide a current detection switch module 1126 to control a TOF light source 12 according to the results of the current diversion module 1121 and the comparison module 1125 .

[0234] Furthermore, the TOF protection circuit 112 manufacturing method 1000 includes the following steps:

[0235] 1005 : Provide an error latch module 1122 to obtain the status of the TOF light source 12 and provide information to the current detection switch module 1126 .

[0236] The step 1004 may further include: the current detection switch module 1126 controlling the TOF light source 12 according to the results of the shunt module 1121 , the comparison module 1125 and the error latch module 1122 .

[0237] The step 1002 may further include providing an averaging low-pass module 1124 to obtain the average value of the current obtained by the sampling module 1123 and transmit the average value to the comparison module 1125 .

[0238] The step 1004 may further include the step of providing a peak current limiting module 1127 to limit the peak current of the circuit.

[0239] The manufacturing method 1000 includes the step of adjusting the resistor and capacitor components in the TOF circuit to obtain a predetermined level of output power.

[0240] Specifically, the method includes the following steps: adjusting the values ​​of the resistors and capacitors in the shunt module 1121 , the error latch module 1122 , the average low-pass module 1124 and / or the peak current limiting module 1127 to obtain a predetermined level of output power.

[0241] Furthermore, the TOF circuit manufacturing method includes the steps of: arranging the circuit elements in the current regulating module 1121 , the error latch module 1122 , the averaging low-pass module 1124 and / or the peak current limiting module 1127 according to a predetermined layout.

[0242] According to the above embodiment of the present invention, the present invention provides a TOF circuit heat dissipation method, such as Figure 20 FIG. 2 is a block diagram of a TOF circuit heat dissipation method 2000 according to the above embodiment of the present invention. The heat dissipation method 2000 includes the following steps:

[0243] 2001: providing at least one circuit board, and setting at least one heat dissipation hole 131 on the circuit board; and

[0244] 2002: Arranging a TOF circuit on the circuit board according to a predetermined layout;

[0245] The step 2001 includes the step of attaching a heat dissipation layer 132 to a predetermined position of the circuit board.

[0246] Wherein, in step 2002, arranging according to a predetermined layout includes arranging the protection circuit 112 in the TOF circuit adjacent to a TOF light source 12;

[0247] Wherein, in step 2002 , arranging according to a predetermined layout includes arranging the driving circuit 111 of the TOF circuit adjacent to the TOF light source 12 .

[0248] Wherein, in step 2002, arranging the circuit elements of the TOF circuit according to a predetermined layout includes arranging them in an integrated manner.

[0249] The TOF camera module 100 of the present invention can be applied to different fields, such as interactive entertainment, motion posture detection, expression recognition, entertainment advertising, medical technology, and industrial control. The TOF camera module 100 can be applied to different electronic devices. For example, it can be output to an electronic device 200, so that the depth image information of the target collected by the TOF camera module 100 can be reproduced in a three-dimensional manner through the electronic device. The electronic device includes, but is not limited to, smart phones, tablet computers, wearable devices, somatosensory interaction devices, ranging devices, and stereoscopic imaging devices. The electronic device 200 includes a device body 300, and the TOF camera module 100 is arranged on the device body 300. The TOF camera module 100 cooperates with the device body 300 to realize the collection and reproduction of depth image information. Reference Figure 21 , taking a mobile phone as an example to illustrate that the TOF camera module 100 is applied to an electronic device, those skilled in the art should understand that the electronic device shown in the figure is not a limitation of the present invention.

[0250] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. TOF circuit, characterized in that, include: A TOF light source circuit; and a photosensitive circuit; wherein the TOF light source circuit is used to drive a TOF light source to generate light, the light is reflected by a target and reacts with the photosensitive circuit, and the TOF light source circuit cooperates with the photosensitive circuit to process the information of the light and the reflected light to obtain depth image information; Wherein, the TOF light source circuit includes a protection circuit, and the protection circuit is used to drive the TOF light source to work and protect the TOF light source; the protection circuit is also used to drive the light source to work within a predetermined power and / or limited current range, and limit the circuit power and / or current to exceed the predetermined range; The protection circuit includes a shunt module, a sampling module, a comparison module and a current detection switch module, wherein the shunt module is communicatively connected to the current detection switch module, the sampling module is connected to the shunt module and is used to collect the current in the protection circuit, the comparison module is connected to the current detection switch module and is used to compare the current signal in the circuit and transmit the comparison result to the current detection switch, and the current detection switch module is used to control the TOF light source according to the information input by the shunt module and the comparison module; when the comparison information received by the current detection switch module from the comparison module exceeds a limited range, the current detection switch module controls to disconnect the power supply of the TOF light source, so that the TOF light source stops working; The protection circuit also includes an error latch module, the shunt module outputs current to the error latch module, and the error latch module is used to output the status information of the TOF light source to the current detection switch module; the current detection switch module controls the operation of the TOF light source in combination with the information of the error latch module and the comparison module.

2. The TOF circuit according to claim 1, wherein: The protection circuit provides a predetermined limited power for the TOF light source.

3. The TOF circuit according to claim 1, wherein: The shunt module and the sampling module are electrically connected in parallel to perform shunt sampling.

4. The TOF circuit according to claim 3, wherein: The shunt module is a resistor, and the sampling module is a current detection amplifier.

5. The TOF circuit according to claim 3, wherein: The protection circuit further includes an average low-pass module. The sampling module is further used to output current information to the average low-pass module. The average low-pass module is used to process the current information to obtain a current average value.

6. The TOF circuit according to claim 5, wherein: The average low-pass module is a resistor and a capacitor.

7. The TOF circuit according to claim 5, wherein: The average low-pass module is used to output information to the comparison module, and the comparison module is also used to perform comparison processing on the information input by the average low-pass module.

8. The TOF circuit according to claim 1, wherein: The comparison module is a comparator chip.

9. The TOF circuit according to claim 1, wherein: The current detection switch module is a current limiting load switch.

10. The TOF circuit according to claim 1, wherein: The error latch module includes two series resistors and a protection cap.

11. The TOF circuit according to claim 1, wherein: The protection circuit further includes a peak current limiting module, which is connected to the current detection switch module and is used to limit the circuit working peak power.

12. The TOF circuit according to claim 11, wherein: The peak current limiting module is a resistor.

13. The TOF circuit according to any one of claims 1 to 12, wherein: The light source circuit includes a power supply, and the power supply provides working power for the protection circuit.

14. The TOF circuit according to any one of claims 1 to 12, wherein: The TOF light source is a VCSEL.

15. The TOF circuit according to any one of claims 1 to 12, wherein: The protection circuit comprises a capacitor, one end of which is connected to the shunt module and the other end is grounded.

16. The TOF circuit according to any one of claims 4, 6, 10, and 12, wherein: The protection circuit changes the limiting power by adjusting the resistance and capacitance values ​​to obtain predetermined output powers of different levels.

17. The TOF circuit according to any one of claims 1 to 12, wherein: The TOF light source circuit includes a driving circuit, which is electrically connected to the photosensitive circuit and drives the TOF light source to operate.

18. The TOF circuit according to claim 17, wherein: The driving circuit includes a buffer logic chip and a MOSFET transistor. The photosensitive circuit is communicatively connected to the buffer logic chip, and the buffer logic chip is communicatively connected to the MOSFET transistor.

19. The TOF circuit according to claim 18, wherein: The buffer logic chip and the MOSFET transistor are disposed adjacent to the TOF light source.

20. The TOF circuit according to claim 18, wherein: The driving circuit includes at least one resistor and one capacitor, and the resistor and the capacitor cooperate with the buffer logic chip and the MOSFET transistor to work.

21. The TOF circuit according to claim 20, wherein: The driving circuit includes 2 resistors and 6 capacitors.

22. The TOF circuit according to any one of claims 1 to 12, wherein: The light source circuit includes a temperature detection circuit, and the temperature detection circuit is used to detect the temperature of the TOF light source.

23. The TOF circuit according to claim 22, wherein: The temperature detection circuit includes a temperature sensor and a capacitor.

24. The TOF circuit according to claim 23, wherein: The temperature sensor and the capacitor of the temperature detection circuit are arranged adjacent to the TOF light source.

25. The TOF circuit according to any one of claims 1 to 12, wherein: The TOF circuit includes a calibration data storage circuit, and the calibration data storage circuit is used to store the calibration data of the TOF light source.

26. The TOF circuit according to claim 25, wherein: The calibration data storage circuit includes a memory, a capacitor and a resistor.

27. The TOF circuit according to claim 26, wherein: The TOF circuit includes an interface unit, which is used to output information, and the calibration data circuit is electrically connected to the interface unit.

28. The TOF circuit according to any one of claims 1 to 12, wherein: The TOF circuit includes an interface unit, and the interface unit is used to output information.

29. The TOF circuit according to any one of claims 1 to 12, wherein: The photosensitive circuit includes a photosensitive chip and at least one capacitor.

30. The TOF circuit according to any one of claims 1 to 12, wherein: The TOF circuit is disposed on at least one circuit board, and the circuit board has at least one heat dissipation hole.

31. The TOF circuit of claim 30, wherein: The heat dissipation hole is arranged in coordination with the TOF light source.

32. The TOF circuit of claim 30, wherein: The circuit board is provided with at least one heat dissipation layer, and the heat dissipation layer is arranged in coordination with the TOF light source.

33. The TOF circuit of claim 32, wherein: The heat dissipation layer is a copper layer.

34. The TOF circuit of claim 30, wherein: The circuit board includes a light source substrate and a lens substrate, the TOF light source is arranged on the light source substrate, the heat dissipation hole is arranged on the light source substrate, and the TOF circuit is selectively arranged on the light source substrate and the lens substrate.

35. A protection circuit for a TOF camera module, characterized in that: The protection circuit includes a shunt module, a sampling module, a comparison module and a current detection switch module, wherein the shunt module is communicatively connected to the current detection switch module, the sampling module is connected to the shunt module and is used to collect the current in the protection circuit, the comparison module is connected to the current detection switch module and is used to compare the current signal in the circuit and transmit the comparison result to the current detection switch, and the current detection switch module is used to control a TOF light source according to the information input by the shunt module and the comparison module; the protection circuit is used to drive the TOF light source to work and protect the TOF light source; the protection circuit is also used to drive the light source to work within a predetermined power and / or limited current range, and limit the circuit power and / or current to exceed the predetermined range; when the current detection switch module receives the comparison information of the comparison module exceeding the limited range, the current detection switch module controls to disconnect the power supply of the TOF light source, so that the TOF light source stops working; The protection circuit also includes an error latch module, the shunt module outputs current to the error latch module, and the error latch module is used to output the status information of the TOF light source to the current detection switch module; the current detection switch module controls the operation of the TOF light source in combination with the information of the error latch module and the comparison module.

36. The protection circuit for a TOF camera module according to claim 35, wherein: The shunting module and the sampling module are electrically connected in parallel to perform shunting.

37. The protection circuit for a TOF camera module according to claim 35, wherein: The shunt module is a resistor, and the sampling module is a current detection amplifier.

38. The protection circuit for a TOF camera module according to claim 36, wherein: The protection circuit includes an average low-pass module. The sampling module is also used to output current information to the average low-pass module. The average low-pass module is used to process the current information to obtain a current average value.

39. The protection circuit for a TOF camera module according to claim 38, wherein: The average low-pass module is a resistor and a capacitor.

40. The protection circuit for a TOF camera module according to claim 38, wherein: The average low-pass module is further used to output information to the comparison module, and the comparison module is further used to perform comparison processing on the information input by the average low-pass module.

41. The protection circuit for a TOF camera module according to claim 35, wherein: The comparison module is a comparator chip.

42. The protection circuit for a TOF camera module according to claim 35, wherein: The current detection switch module is a current limiting load switch.

43. The protection circuit for a TOF camera module according to claim 35, wherein: The protection circuit is used to provide a predetermined power output for a TOF light source.

44. The protection circuit for a TOF camera module according to claim 35, wherein: The error latch module includes two series resistors and a protection cap.

45. The protection circuit for a TOF camera module according to claim 35, wherein: The protection circuit further includes a peak current limiting module, which is connected to the current detection switch module and is used to limit the peak operating power of the circuit.

46. ​​The protection circuit for a TOF camera module according to claim 45, wherein: The peak current limiting module is a resistor.

47. The protection circuit for a TOF camera module according to any one of claims 35 to 46, wherein: The protection circuit includes a power supply, and the power supply provides working power for the protection circuit.

48. The protection circuit for a TOF camera module according to any one of claims 35 to 46, wherein: The TOF light source is a VCSEL.

49. A protection circuit for a TOF camera module according to any one of claims 35 to 46, wherein the protection circuit comprises a capacitor, one end of the capacitor is connected to the shunt module, and the other end is grounded.

50. The protection circuit for a TOF camera module according to any one of claims 37, 39, 44, and 46, wherein: The protection circuit changes the output power by adjusting the resistance and capacitance values ​​to obtain predetermined output powers of different levels.

51. A TOF circuit manufacturing method, characterized in that: Includes steps: (A) providing a shunt module for regulating current; (B) Provide a sampling module to collect the current in the circuit (C) providing a comparison module to compare the current signal in the circuit; and (D) providing a current detection switch module, controlling a TOF light source according to the results of the shunting module and the comparison module to form a protection circuit; the protection circuit is used to drive the TOF light source to work and protect the TOF light source; the protection circuit is also used to drive the light source to work within a predetermined power and / or limited current range, and limit the circuit power and / or current to exceed the predetermined range; when the comparison information received by the current detection switch module from the comparison module exceeds the limited range, the current detection switch module controls to disconnect the power supply of the TOF light source, so that the TOF light source stops working; The TOF circuit manufacturing method further includes the steps of: providing an error latch module to obtain the state of the TOF light source and provide information to the current detection switch module; So that the current detection switch module controls the operation of the TOF light source in combination with the information of the error latch module and the comparison module.

52. The TOF circuit manufacturing method according to claim 51, wherein: The TOF circuit manufacturing method further includes the step of adjusting the resistor and capacitor components in the TOF circuit to obtain a predetermined level of output power.

53. The TOF circuit manufacturing method according to claim 51, comprising the step of: providing an average low-pass module to obtain the average value of the current obtained by the sampling module and transmitting it to the comparison module.

54. The TOF circuit manufacturing method according to claim 51, comprising the step of: providing a peak current limiting module to limit the peak current of the circuit.

55. A TOF circuit heat dissipation method, characterized in that: Includes steps: Providing at least one circuit board, and setting at least one heat dissipation hole on the circuit board; and The TOF circuit as described in any one of claims 1 to 34 is arranged on the circuit board according to a predetermined layout.

56. The TOF circuit heat dissipation method according to claim 55, comprising the step of: attaching a heat dissipation layer to a predetermined position of the circuit board.

57. The TOF circuit heat dissipation method according to claim 55, wherein: Arranging the TOF circuit as described in any one of claims 1 to 34 on the circuit board according to a predetermined layout includes: arranging the protection circuit in the TOF circuit adjacent to a TOF light source.

58. The TOF circuit heat dissipation method according to claim 55, wherein: Arranging the TOF circuit as described in any one of claims 1 to 34 on the circuit board according to a predetermined layout includes: arranging the driving circuit of the TOF circuit adjacent to a TOF light source.

59. The TOF circuit heat dissipation method according to claim 55, wherein: The TOF circuit as claimed in any one of claims 1 to 34 is arranged on the circuit board according to a predetermined layout, including: circuit elements of the TOF circuit are arranged in an integrated manner. 60.TOF camera module, characterized in that: include: a light source unit; and a light receiving unit; wherein the light source unit generates light to a target, the light is reflected by the target, the light receiving unit receives the reflected light, and obtains depth image information by combining information of the incident light and the reflected light; Wherein, the light source unit includes a TOF light source and a TOF light source circuit, the TOF light source circuit is used to drive the TOF light source to work, the light receiving unit includes a photosensitive circuit and a lens assembly, the lens assembly receives light and transmits it to the photosensitive circuit for photosensitivity; Wherein, the TOF light source circuit includes a protection circuit, and the protection circuit is used to drive the TOF light source to work and protect the TOF light source; the protection circuit is also used to drive the light source to work within a predetermined power and / or limited current range, and limit the circuit power and / or current to exceed the predetermined range; The protection circuit includes a shunt module, a sampling module, a comparison module and a current detection switch module, wherein the shunt module is communicatively connected to the current detection switch module, the sampling module is connected to the shunt module and is used to collect the current in the protection circuit, the comparison module is connected to the current detection switch module and is used to compare the current signal in the circuit and transmit the comparison result to the current detection switch, and the current detection switch module is used to control the TOF light source according to the information input by the shunt module and the comparison module; when the comparison information received by the current detection switch module from the comparison module exceeds a limited range, the current detection switch module controls to disconnect the power supply of the TOF light source, so that the TOF light source stops working; The protection circuit also includes an error latch module, the shunt module outputs current to the error latch module, and the error latch module is used to output the status information of the TOF light source to the current detection switch module; the current detection switch module controls the operation of the TOF light source in combination with the information of the error latch module and the comparison module.

61. An electronic device, characterized in that: include: - Equipment body; and A TOF camera module, which is arranged in the device body and cooperates with the device body to realize the acquisition and reproduction of depth images; The TOF camera module includes: a light source unit and a light receiving unit; wherein the light source unit generates light to a target, the light is reflected by the target, the light receiving unit receives the reflected light, and obtains depth image information by combining the information of the incident light and the reflected light; the light source unit includes a TOF light source and a TOF light source circuit, the TOF light source circuit is used to drive the TOF light source to work, the light receiving unit includes a photosensitive circuit and a lens assembly, the lens assembly receives light and transmits it to the photosensitive circuit for photosensitivity; Wherein, the TOF light source circuit includes a protection circuit, and the protection circuit is used to drive the TOF light source to work and protect the TOF light source; the protection circuit is also used to drive the light source to work within a predetermined power and / or limited current range, and limit the circuit power and / or current to exceed the predetermined range; The protection circuit includes a shunt module, a sampling module, a comparison module and a current detection switch module, wherein the shunt module is communicatively connected to the current detection switch module, the sampling module is connected to the shunt module and is used to collect the current in the protection circuit, the comparison module is connected to the current detection switch module and is used to compare the current signal in the circuit and transmit the comparison result to the current detection switch, and the current detection switch module is used to control the TOF light source according to the information input by the shunt module and the comparison module; when the comparison information received by the current detection switch module from the comparison module exceeds a limited range, the current detection switch module controls to disconnect the power supply of the TOF light source, so that the TOF light source stops working; The protection circuit also includes an error latch module, the shunt module outputs current to the error latch module, and the error latch module is used to output the status information of the TOF light source to the current detection switch module; the current detection switch module controls the operation of the TOF light source in combination with the information of the error latch module and the comparison module.

62. The electronic device according to claim 61, wherein: The electronic device is selected from the group consisting of: a smart phone, a tablet computer, a wearable device, a somatosensory interaction device, a distance measuring device, and a stereoscopic imaging device.

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