Disc sandpaper and grinding equipment with the disc sandpaper

Abstract

The present invention relates to the technical field of grinding equipment, and in particular to a disc sandpaper and a grinding equipment with the disc sandpaper, comprising a sandpaper body, a plurality of first hole groups being evenly spaced on the grinding surface of the sandpaper body along the circumferential direction of the sandpaper body, the first hole group comprising a plurality of first holes, and the plurality of first holes in the same group being evenly spaced along the diameter of the sandpaper, a second hole being arranged between two adjacent first hole groups, and the second hole and the first hole of the first hole group both passing through the sandpaper body. The present invention reasonably arranges the distribution positions of the first hole group and the second hole, so that the chip removal holes can cover the entire grinding surface of the sandpaper as much as possible, reduces the blank area on the grinding surface of the sandpaper, avoids the blockage of the sandpaper caused by uneven distribution of the openings, and prolongs the service life of the sandpaper.

Description

Technical Field

[0001] The invention relates to the technical field of grinding equipment, in particular to a disc sandpaper and a grinding equipment with the disc sandpaper. Background Art

[0002] At present, disc sandpaper is often used for polishing car paint. Since polishing will generate a lot of dust, and the polishing method is usually dry grinding, the existing disc sandpaper is easily clogged by dust, thereby reducing the grinding life. The current solution to this problem is mainly to open holes on the disc sandpaper and achieve chip removal through these holes. However, most of the existing sandpapers do not have reasonable holes, and there are problems such as a small number of holes and uneven distribution of holes in different areas of the sandpaper, which leads to the phenomenon that clogging is still easy to occur in the unopened areas. Summary of the invention

[0003] The present invention aims at solving the problems of the prior art and provides a disc sandpaper and a grinding device with the disc sandpaper, so as to solve the problem that clogging is still easy to occur in the non-perforated area due to the small number of openings and the uneven distribution of holes in various areas on the sandpaper in the prior art.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] The present invention provides a disc sandpaper, comprising a sandpaper body, wherein a plurality of first hole groups are evenly spaced on a grinding surface of the sandpaper body along the circumferential direction of the sandpaper body, the first hole group comprises a plurality of first holes, and the plurality of first holes in the same group are evenly spaced along the diameter of the sandpaper, a second hole is arranged between two adjacent first hole groups, and the second hole and the first hole of the first hole group both penetrate the sandpaper body.

[0006] The total area of ​​the first hole group accounts for 3.1% to 5.5% of the area of ​​the grinding surface of the sandpaper body.

[0007] Among them, among the multiple first holes in the same group, the distance from the center of the first hole far away from the center of the sandpaper body to the center of the first hole close to the center of the sandpaper body is 77% to 88% of the diameter of the sandpaper body; among the multiple first holes in the same group, the distance between the centers of adjacent first holes is 12% to 18% of the diameter of the sandpaper body, and the aperture of the first holes is 3 to 8 mm.

[0008] Among them, among the multiple first holes in the first hole group, a group of auxiliary holes are respectively arranged on both sides of the first hole away from the center of the sandpaper body, and the two groups of auxiliary holes take the line connecting the centers of the first holes in the first hole group as the symmetry axis.

[0009] Wherein, a third hole is arranged between the two groups of auxiliary holes located on both sides of the first hole, and the third hole passes through the sandpaper body.

[0010] Among them, among the multiple first holes in the same group, the apertures of the first holes decrease sequentially along the direction from the center of the sandpaper body away to the center of the sandpaper body close to the sandpaper body.

[0011] Wherein, the total area of ​​the plurality of second holes is 2% to 5% of the area of ​​the grinding surface of the sandpaper body.

[0012] The number of the second holes is 8 to 18, and the diameter of the second holes is 5 to 12 mm.

[0013] Wherein, a fourth hole penetrating through the sandpaper body is opened at the center of the sandpaper body.

[0014] A grinding device with disc sandpaper also includes a grinding head, and the sandpaper body is fixed at the output end of the grinding head.

[0015] Beneficial effects of the present invention:

[0016] The present invention reasonably arranges the distribution positions of the first hole group and the second hole so that the chip removal holes can cover the entire grinding surface of the sandpaper as much as possible, reducing the blank area on the grinding surface of the sandpaper, avoiding the clogging of the sandpaper due to uneven hole distribution, and extending the service life of the sandpaper. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of a first embodiment of the present invention.

[0018] Figure 2 is a schematic diagram of a second embodiment of the present invention.

[0019] Figure 3 is a schematic diagram of a third embodiment of the present invention.

[0020] Figure 4 is a schematic diagram of a fourth embodiment of the present invention.

[0021] exist Figures 1 to 4 Reference numerals in the drawings include:

[0022] 1—Sandpaper body 2—First hole group 3—Second hole

[0023] 4—auxiliary hole 5—third hole 6—fourth hole. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and the accompanying drawings. The contents mentioned in the embodiments are not limitations of the present invention. The present invention is described in detail below in conjunction with the accompanying drawings. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other without conflict.

[0025] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, front, back, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the drawings.

[0026] In addition, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art. The terms used in this specification are only for describing specific embodiments, not for limiting the present invention. The term "and / or" used herein includes any combination of one or more related listed items.

[0027] Example 1

[0028] A disc of sandpaper, such as Figure 1 , including a sandpaper body 1, along the circumferential direction of the sandpaper body 1, a plurality of groups of first hole groups 2 are evenly spaced on the grinding surface of the sandpaper body 1, the first hole group 2 includes a plurality of first holes, and the plurality of first holes in the same group are evenly spaced along the diameter of the sandpaper, and a second hole 3 is arranged between two adjacent groups of first hole groups 2, and the second hole 3 and the first hole of the first hole group 2 both penetrate the sandpaper body 1. Specifically, the main structure of the sandpaper body 1 adopts the existing technology, that is, it includes a base material layer and a grinding layer attached to the base material layer, and the surface of the grinding layer with abrasive grains attached is called a grinding surface. The base material layer, the grinding layer, and the abrasive grains are all existing technologies, and the present invention will not be described in detail. The present invention reasonably sets the distribution positions of the first holes and the second holes 3, so that the chip removal holes can cover the entire grinding surface of the sandpaper body 1 as much as possible, reduce the blank area on the grinding surface of the sandpaper, avoid the sandpaper clogging phenomenon caused by uneven distribution of openings, and extend the service life of the sandpaper.

[0029] In order to ensure the chip removal capability of the sandpaper and avoid affecting the grinding capability of the sandpaper due to too many holes, the total area of ​​the first hole group 2 in this embodiment accounts for 3.1% to 5.5% of the area of ​​the grinding surface of the sandpaper body 1 .

[0030] Preferably, if Figure 1 As shown, this embodiment includes six groups of first hole groups 2, and the spacing between two adjacent groups of first hole groups 2 is 60°, that is, the six groups of first holes are evenly distributed along the circumferential direction, further ensuring the uniformity of the chip removal hole distribution. Of course, the present invention does not limit the number of groups and the angle between groups of the first hole groups 2, and the two can be increased or decreased as needed.

[0031] Furthermore, for multiple first holes in the same group, the distance from the center of the first hole far from the center of the sandpaper body 1 to the center of the first hole close to the center of the sandpaper body 1 is 77% to 88%, preferably 83.7% of the diameter of the sandpaper body 1; for multiple first holes in the same group, the distance between the centers of adjacent first holes is 12% to 18% of the diameter of the sandpaper body 1, and the aperture of the first hole is 3 to 8 mm, preferably 5 mm. By limiting the position of the outermost first hole, the distribution density of the first holes in the same group, and the aperture of the first holes, the chip removal capacity of the sandpaper can be increased while ensuring the grinding area.

[0032] Example 2

[0033] Since the debris is mainly concentrated on the middle and outer circles of the sandpaper due to the centrifugal force, the chip removal capacity of the middle and outer circles of the sandpaper needs to be strengthened. Preferably, Figure 2 , a group of auxiliary holes 4 are respectively arranged on both sides of the first holes in the first hole group 2 away from the center of the sandpaper body 1, and the two groups of auxiliary holes 4 are symmetrically connected by the line connecting the centers of the first holes in the first hole group 2. Specifically, such an arrangement can increase the number of chip removal holes in the middle circle and the outer circle of the sandpaper body 1, thereby increasing the chip removal capacity of the sandpaper; the number of groups of auxiliary holes 4 can be increased as needed, and the present invention does not limit this.

[0034] Preferably, the diameter of the auxiliary hole 4 is equal to that of the first hole, which helps to reduce the difficulty of processing.

[0035] The disc sandpaper described in this embodiment has a third hole 5 disposed between the two groups of auxiliary holes 4 on both sides of the first hole, and the third hole 5 penetrates the sandpaper body 1. Specifically, the third hole 5 further fills the blank area on the sandpaper body 1 where there is no chip removal hole, thereby improving the chip removal capability.

[0036] Example 3

[0037] A disc sandpaper described in this embodiment, such as Figure 3 As shown, for the multiple first holes in the same group, the apertures of the first holes decrease in sequence from the center of the sandpaper body 1 away from the center of the sandpaper body 1 to the center of the sandpaper body 1 close to the center of the sandpaper body 1 .

[0038] In the disc sandpaper described in this embodiment, the second holes 3 are mainly distributed in the middle circle and the outer circle of the sandpaper, and are used to fill the blank areas between the groups of first hole groups 2. The total area of ​​the plurality of second holes 3 is 2% to 5% of the area of ​​the grinding surface of the sandpaper body 1, preferably 3.5%.

[0039] The number of the second holes 3 is 8 to 18, preferably 14; the diameter of the second holes 3 is 5 to 12 mm, preferably 8 mm.

[0040] Example 4

[0041] A disc sandpaper described in this embodiment, such as Figure 4 The center of the sandpaper body 1 is provided with a fourth hole 6 penetrating the sandpaper body 1. Specifically, the fourth hole 6 can further enhance the central chip removal capability of the sandpaper body 1 on the one hand, and can also serve as a positioning hole of the sandpaper body 1 on the other hand. In this embodiment, the diameter of the fourth hole 6 is preferably 16 mm.

[0042] In addition, the above embodiments can be combined, such as Figure 4 As shown, in this embodiment, the chip removal capacity of the middle and outer circles of the sandpaper is increased by increasing the number of the first holes in the first hole group 2 and increasing the aperture of the first holes.

[0043] A grinding device with a disc sandpaper also includes a grinding head, and the sandpaper body 1 is fixed to the output end of the grinding head. Specifically, the disc sandpaper is fixed on the grinding head, and as the grinding head rotates, the disc sandpaper can synchronously rotate for grinding.

[0044] Sandpaper was used to polish automobile paint for verification. The non-porous disc sandpaper was clogged at 45 seconds, the ordinary 8-hole disc sandpaper was clogged at 60 seconds, and the disc sandpaper with the hole design of the third embodiment was clogged at 75 seconds. The grinding amount was almost unaffected compared with the ordinary sandpaper. Therefore, the present invention can effectively improve the anti-clogging effect of sandpaper on the basis of ensuring the grinding ability.

[0045] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A grinding device with a disc sandpaper, characterized in that: The disc sandpaper comprises a sandpaper body, and the grinding device comprises a grinding head. The sandpaper body is fixed at the output end of the grinding head. Along the circumferential direction of the sandpaper body, a plurality of first hole groups are evenly spaced on the grinding surface of the sandpaper body. The first hole group comprises a plurality of first holes, and the plurality of first holes in the same group are evenly spaced along the diameter of the sandpaper. A second hole is arranged between two adjacent first hole groups, and the second hole and the first hole of the first hole group both penetrate the sandpaper body. The spacing between two adjacent first hole groups is 60°, and the six first holes are evenly distributed along the circumferential direction. The total area of ​​the first hole group is 3.1% to 5.5% of the area of ​​the grinding surface of the sandpaper body; The second holes are distributed in the middle circle and the outer circle of the sandpaper body, and are used to fill the blank areas between the groups of first holes; the number of the second holes is 8 to 18; the diameter of the second holes is 5 to 12 mm; the total area of ​​the plurality of second holes is 2% to 5% of the area of ​​the grinding surface of the sandpaper body; For the multiple first holes in the same group, the distance between the center of the first hole far from the center of the sandpaper body and the center of the first hole close to the center of the sandpaper body is 77% to 88% of the diameter of the sandpaper body; for the multiple first holes in the same group, the distance between the centers of adjacent first holes is 12% to 18% of the diameter of the sandpaper body, and the aperture of the first hole is 3 to 8 mm; For the plurality of first holes in the same group, the apertures of the first holes are gradually reduced from the center of the sandpaper body away from the center of the sandpaper body to the center of the sandpaper body close to the center of the sandpaper body; A plurality of first holes in the first hole group, a group of auxiliary holes are respectively arranged on both sides of the first hole away from the center of the sandpaper body, and the two groups of auxiliary holes are symmetrically connected by a line connecting the centers of the first holes in the first hole group; the aperture of the auxiliary holes is equal to that of the first holes; A third hole is provided between the two groups of auxiliary holes located on both sides of the first hole, and the third hole penetrates the sandpaper body; The number of the second holes is 8 to 18, and the diameter of the second holes is 5 to 12 mm; A fourth hole penetrating the sandpaper body is formed at the center of the sandpaper body.

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