Cover plate, ultrasonic fingerprint sensor structure and electronic equipment

Abstract

The present invention provides a cover plate, an ultrasonic fingerprint sensor structure and an electronic device, and relates to the field of fingerprint recognition technology. The ultrasonic fingerprint sensor structure includes an ultrasonic fingerprint sensor, a film and a glass cover plate, the glass cover plate includes a fingerprint sensing area and a non-fingerprint sensing area, the ultrasonic fingerprint sensor is opposite to the fingerprint sensing area of ​​the glass cover plate, the position where the film film is opposite to the fingerprint sensing area is hollowed out, and an insulating layer is arranged between the ultrasonic fingerprint sensor and the fingerprint sensing area. By hollowing out the film film corresponding to the fingerprint sensing area, the problem of blurred fingerprint image imaging caused by the OCA layer affecting the propagation of ultrasonic waves is avoided. By arranging an insulating layer between the glass cover plate and the ultrasonic fingerprint sensor, the step difference between the ultrasonic fingerprint sensor and the glass cover plate is filled, the acoustic impedance is matched, and the ultrasonic wave is transmitted more smoothly between the fingerprint sensor and the glass cover plate, thereby improving the sensitivity and accuracy of the ultrasonic fingerprint sensor in identifying fingerprints.

Description

Technical Field

[0001] The present invention relates to the field of fingerprint recognition, and in particular to a cover plate, an ultrasonic fingerprint sensor structure and an electronic device. Background Art

[0002] Fingerprint recognition is a hot topic in the field of biometric recognition. Existing fingerprint sensors mainly include optical fingerprint sensors, ultrasonic fingerprint sensors, etc. Optical fingerprint sensors and ultrasonic fingerprint sensors are bonded to the glass cover through an OCA adhesive layer. During the bonding process, there will be a gap when the sensor and the glass cover are bonded, the bonding is uneven and easily produces marks; and the impedance characteristics of the OCA adhesive layer will affect the transmission of acoustic and optical signals, and will cause obvious acoustic impedance mismatch problems, seriously affecting the sensitivity of the ultrasonic fingerprint sensor, affecting the clarity of the fingerprint image, and causing errors in the fingerprint sensor's recognition of fingerprints. Summary of the invention

[0003] In view of this, an object of an embodiment of the present invention is to provide a cover plate to improve the sensitivity of an ultrasonic fingerprint sensor structure.

[0004] The embodiment of the present invention provides an ultrasonic fingerprint sensor structure to improve the above-mentioned problem.

[0005] An embodiment of the present invention provides an electronic device to improve the above-mentioned problem.

[0006] The technical solution adopted by the present invention is as follows:

[0007] A cover plate is applied to a fingerprint sensor structure, the cover plate comprises a glass cover plate and a film film, the glass cover plate comprises a fingerprint sensing area and a non-fingerprint sensing area, the film film is bonded to the glass cover plate, and the position of the film film corresponding to the fingerprint sensing area of ​​the glass cover plate is hollowed out to form a hollow area.

[0008] Furthermore, a first electroplating layer and an ink layer are sequentially provided in a fingerprint sensing area on a surface of a side of the glass cover plate connected to the film.

[0009] Furthermore, the cross-sectional area of ​​the first electroplating layer or the ink layer is smaller than the cross-sectional area of ​​the hollow region.

[0010] An ultrasonic fingerprint sensor structure, the ultrasonic fingerprint sensor structure includes an ultrasonic fingerprint sensor, an insulating layer and a cover plate, the ultrasonic fingerprint sensor is bonded to the cover plate, the cover plate includes a glass cover plate and a film film, the glass cover plate includes a fingerprint sensing area and a non-fingerprint sensing area, the film film is bonded to the glass cover plate, the position of the film film corresponding to the fingerprint sensing area of ​​the glass cover plate is hollowed out to form a hollow area, and the insulating layer is arranged between the ultrasonic fingerprint sensor and the fingerprint sensing area of ​​the glass cover plate to fill the hollow area of ​​the film film.

[0011] Furthermore, one side of the insulating layer is bonded to the fingerprint sensing area of ​​the glass cover plate, and the other side of the insulating layer opposite to the ultrasonic fingerprint sensor is bonded to the ultrasonic fingerprint sensor by glue.

[0012] Furthermore, the insulating layer is attached to the ultrasonic fingerprint sensor, and a side of the insulating layer facing away from the ultrasonic fingerprint sensor is bonded to the glass cover plate by glue.

[0013] Furthermore, the insulating layer includes a first insulating layer and a second insulating layer, the first insulating layer is attached to the glass cover plate, the second insulating layer is attached to the ultrasonic fingerprint sensor, and the first insulating layer is bonded to the second insulating layer by glue.

[0014] Furthermore, a blind hole is formed in a fingerprint sensing area on a surface of a side of the glass cover plate facing away from the ultrasonic fingerprint sensor.

[0015] Furthermore, the film includes an OCA layer, a PET layer, a second electroplating layer and an ink layer in sequence, the OCA layer is bonded to the glass cover plate, and the ultrasonic fingerprint sensor is connected to the ink layer.

[0016] An electronic device comprises a device body and an ultrasonic fingerprint sensor structure as claimed in the claims, wherein the ultrasonic fingerprint sensor structure comprises an ultrasonic fingerprint sensor, a film and a glass cover plate, wherein the glass cover plate comprises a fingerprint sensing area and a non-fingerprint sensing area, wherein the film is adhered between the glass cover plate and the ultrasonic fingerprint sensor, wherein the ultrasonic fingerprint sensor is opposite to the fingerprint sensing area of ​​the glass cover plate, wherein the position where the film is opposite to the fingerprint sensing area is hollowed out, wherein an insulating layer for filling the hollowed-out area of ​​the film is arranged between the ultrasonic fingerprint sensor and the fingerprint sensing area of ​​the glass cover plate, and wherein the ultrasonic fingerprint sensor is arranged on the front surface or the rear surface of the device body.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention provides a cover plate, an ultrasonic fingerprint sensor structure and an electronic device, wherein the ultrasonic fingerprint sensor structure includes an ultrasonic fingerprint sensor, a film and a glass cover plate, wherein the glass cover plate includes a fingerprint sensing area and a non-fingerprint sensing area, wherein the film is adhered between the glass cover plate and the ultrasonic fingerprint sensor, wherein the ultrasonic fingerprint sensor is opposite to the fingerprint sensing area of ​​the glass cover plate, wherein the position of the film relative to the fingerprint sensing area is hollowed out, and an insulating layer for filling the hollowed-out area of ​​the film is provided between the ultrasonic fingerprint sensor and the fingerprint sensing area of ​​the glass cover plate. By hollowing out the film film, the obstruction of the film film OCA glue to ultrasonic wave propagation is removed, and the acoustic impedance is matched to make the fingerprint image clear; by adding an insulating layer to fill the gap between the glass cover plate and the ultrasonic fingerprint sensor, the problem of unstable signals caused by the uneven bonding between the ultrasonic fingerprint sensor and the glass cover plate is solved, and the sensitivity and accuracy of the ultrasonic fingerprint sensor are increased.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0021] Figure 1 A first viewing angle schematic diagram of the electronic device provided by the present invention is shown.

[0022] Figure 2 A second viewing angle schematic diagram of the electronic device provided by the present invention is shown.

[0023] Figure 3 A schematic diagram of the structure of an ultrasonic fingerprint sensor provided by the second embodiment is shown.

[0024] Figure 4 A schematic diagram of a film is shown.

[0025] Figure 5 A schematic cross-sectional view of a film is shown.

[0026] Figure 6 A schematic diagram of a cover plate without an exhaust duct is shown.

[0027] Figure 7 A schematic diagram of a cover plate provided by the present invention is shown.

[0028] Figure 8 A schematic diagram of the structure of an ultrasonic fingerprint sensor provided by the third embodiment is shown.

[0029] Fig. 9 A schematic diagram of the structure of an ultrasonic fingerprint sensor provided by the fourth embodiment is shown.

[0030] Icons: 10-electronic device; 100-device body; 200-ultrasonic fingerprint sensor structure; 220-cover; 210-glass cover; 211-fingerprint sensing area; 212-exhaust duct; 213-non-fingerprint sensing area; 217-first electroplating layer; 218-ink layer; 219-black layer at the bottom of the cover; 215-blind hole; 230-film; 231-OCA layer; 232-hollow area; 233-PET layer; 235-UV layer; 237-second electroplating layer; 239-ink layer; 250-ultrasonic fingerprint sensor; 270-circuit board; 280-insulating layer; 281-first insulating layer; 283-second insulating layer; 290-glue layer. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0033] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0034] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly stipulated and limited, the terms "set", "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements.

[0035] In the description of the present invention, it should also be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Terms such as "horizontal", "vertical", "overhanging" and the like do not mean that the components are absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted. The terms "include", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also include elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific circumstances.

[0036] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0037] First embodiment

[0038] This embodiment provides an electronic device 10. Figure 1 and Figure 2 , Figure 1 and Figure 2FIG. 1 is a schematic diagram of an electronic device 10 provided in this embodiment. The electronic device 10 includes a device body 100 and an ultrasonic fingerprint sensor structure 200 , wherein the ultrasonic fingerprint sensor structure 200 is disposed on the device body 100 .

[0039] Specifically, the ultrasonic fingerprint sensor structure 200 includes a glass cover plate 210 , which can be disposed on the front surface of the device body 100 to serve as a front cover plate of the electronic device 10 or disposed on the rear surface of the device body 100 to serve as a rear cover plate of the electronic device 10 .

[0040] Second embodiment

[0041] This embodiment provides an ultrasonic fingerprint sensor structure 200, see Figure 3 , Figure 3 A schematic structural diagram of an ultrasonic fingerprint sensor structure 200 provided in an embodiment of the present invention is shown.

[0042] It should be noted that the ultrasonic fingerprint sensor structure 200 provided in this embodiment can be used in the electronic device 10 provided in the first embodiment.

[0043] The ultrasonic fingerprint sensor structure 200 includes a circuit board 270 , an ultrasonic fingerprint sensor 250 , an insulating layer 280 and a cover plate 220 . The cover plate 220 includes a film 230 and a glass cover plate 210 .

[0044] The ultrasonic fingerprint sensor 250 is connected to the circuit board 270 , the cover plate 220 is bonded to the ultrasonic fingerprint sensor 250 , and the insulating layer 280 is disposed between the cover plate 220 and the ultrasonic fingerprint sensor 250 .

[0045] Specifically, the circuit board 270 may be a flexible circuit board 270 or other circuit boards 270 . The ultrasonic fingerprint sensor 250 converts the recognized fingerprint information into an electrical signal, and transmits the electrical signal to the processor of the electronic device 10 through the circuit board 270 for processing.

[0046] The ultrasonic fingerprint sensor 250 is used to obtain the user's fingerprint information. The ultrasonic fingerprint sensor 250 sends ultrasonic waves to the finger, generates a grayscale image of the corresponding fingerprint according to the time and intensity of the received reflected ultrasonic waves, and then performs image processing to identify the fingerprint.

[0047] The cover plate 220 includes a glass cover plate 210 and a film 230. The glass cover plate 210 includes a fingerprint sensing area 211 and a non-fingerprint sensing area 213. The ultrasonic fingerprint sensor 250 is opposite to the fingerprint sensing area 211 of the glass cover plate 210. The fingerprint sensing area 211 is used for fingerprint recognition by the user. For example, the user can use a finger to touch the fingerprint sensing area 211 on the side of the glass cover plate 210 away from the ultrasonic fingerprint sensor 250 to perform fingerprint recognition.

[0048] The fingerprint sensing area 211 of the glass cover plate 210 is also subjected to ink processing technology. The fingerprint sensing area 211 of the glass cover plate 210 is subjected to ink processing technology on the side opposite to the ultrasonic fingerprint sensor 250 for coloring, such as forming a first electroplating layer 217 by electroplating, printing a LOGO on an ink layer 218, and using a bottom black layer 219 as a base color, thereby achieving printing patterns, applying black and white inks, or making wire drawing and textures. For example, printing a corporate LOGO by GDM process.

[0049] In this embodiment, the thickness of the first electroplating layer 217 can be set to 8 μm, the thickness of the ink layer 218 can be set to 35 μm, and the thickness of the bottom black layer 219 can be set to 15 μm.

[0050] In this embodiment, a blind hole 215 is formed in the fingerprint sensing area 211 of the glass cover plate 210 on the side facing away from the ultrasonic fingerprint sensor 250. Figure 3 The blind hole 215 may be a flat-bottomed shallow blind hole 215 or an arc-bottomed shallow blind hole 215. The blind hole 215 can provide a user with a sense of touch when performing fingerprint recognition, assist in fingerprint positioning, make fingerprint recognition more accurate, and improve user experience.

[0051] See also Figure 4 and Figure 5 , Figure 4 A schematic diagram of a film 230 is shown. Figure 5 2 shows a schematic cross-sectional view of the film film 230. The film film 230 includes an OCA layer 231, a PET layer 233, a UV layer 235, a second electroplating layer 237 and an ink layer 239 in sequence, the OCA layer 231 is bonded to the glass cover 210, and the ultrasonic fingerprint sensor 250 is connected to the ink layer 239. In this embodiment, the thickness of the film film 230 can be set to 100 μm.

[0052] OCA is a special adhesive used to bond transparent optical elements (such as lenses, etc.). It is colorless and transparent, has a light transmittance of more than 90%, has good bonding strength, can be cured at room temperature or medium temperature, and has the characteristics of small curing shrinkage. OCA is one of the important raw materials for touch screen assembly. In this embodiment, the OCA layer 231 is used to bond the PET layer 233 and other structures to the glass cover 210.

[0053] The PET layer 233 is used as a soft substrate, and the UV layer 235 is connected to the PET layer 233 for performing processes such as wire drawing and line texture, so that the glass cover plate 210 has various characteristics, such as glare. The ink layer 239 includes an ink color layer and a cover bottom ink layer, and the second electroplating layer 237 is used to display color, for example, a mirror silver color layer can be electroplated. The ink color layer is used to increase the color display effect of the second electroplating layer 237, and the cover bottom ink layer is used as a base color and has an opaque characteristic.

[0054] See also Figure 3 and Figure 5 The position of the film film 230 relative to the fingerprint sensing area 211 of the glass cover plate 210 is hollowed out to form a hollow area 232, so as to avoid the acoustic impedance characteristics of the OCA layer 231 and other layers of the film film 230 hindering the propagation of ultrasonic waves between the ultrasonic fingerprint sensor 250 and the glass cover plate 210, thereby affecting the recognition sensitivity and accuracy of the ultrasonic fingerprint sensor 250. An insulating layer 280 is provided between the ultrasonic fingerprint sensor 250 and the fingerprint sensing area 211 of the glass cover plate 210 to fill the hollow area 232 formed by the hollowing of the film film 230. In this embodiment, the thickness of the film film 230 is set to 100 μm.

[0055] It should be noted that an exhaust duct 212 is provided between the film 230 and the fingerprint sensing area 211. Figure 6 and Figure 7 , Figure 6 FIG. 2 shows a schematic structural diagram of a cover plate 220 without a preset exhaust duct 212. Figure 7The schematic diagram of the structure of the cover plate 220 provided with the exhaust duct 212 is shown. In the cover plate 220 without the exhaust duct 212, the film 230 and the glass cover plate 210 are not flatly attached, and bubbles are easily generated at the uneven places. In the cover plate 220 provided in this embodiment, the exhaust duct 212 is provided between the film 230 and the fingerprint sensing area 211 to prevent air from forming bubbles between the film 230 and the glass cover plate 210. Specifically, the cross-sectional area of ​​the hollow area 232 is larger than the cross-sectional area of ​​the first electroplating layer 217 or the ink layer 218 provided in the fingerprint sensing area 211 to form the exhaust duct 212, so that the air can be discharged through the exhaust duct 212 when the film 230 and the glass cover plate 210 are attached, and the uneven attachment can be avoided to generate bubbles. The exhaust duct 212 can be filled when the film 230 is attached and the bottom black layer 219 is made.

[0056] Specifically, one side of the insulating layer 280 is bonded to the fingerprint sensing area 211 of the glass cover 210 , and the other side of the insulating layer 280 opposite to the ultrasonic fingerprint sensor 250 is bonded to form a glue layer 290 .

[0057] The insulating layer 280 can be made of MESA or DAF material, which can fill the gap between the ultrasonic fingerprint sensor 250 and the glass cover 210. The acoustic impedance is matched to allow ultrasonic waves to propagate better between the ultrasonic fingerprint sensor 250 and the glass cover 210. It should be noted that when the MESA or DAF material is set on the glass cover 210 to form the insulating layer 280, the curing temperature of the MESA or DAF shall not exceed the temperature that the glass cover 210 can withstand, otherwise the glass cover 210 will be damaged. For example, in this embodiment, the temperature when setting the insulating layer 280 shall not exceed 130°C. The insulating layer 280 can be made of Henkel MESA125E, Henkel MESA120u or Sanjian 1655DDAF.

[0058] The glue layer 290 may be made of materials such as Henkel 3280 or Henkel 3285.

[0059] In this embodiment, the thickness of the glue layer 290 can be set to 21 μm, and the thickness of the insulating layer 280 can be set to 70 μm.

[0060] The insulating layer 280 can fill the gap between the glass cover 210 and the ultrasonic fingerprint sensor 250 , match the acoustic impedance, make the ultrasonic wave transmit smoothly, and improve the sensitivity and accuracy of the ultrasonic fingerprint sensor 250 .

[0061] Third embodiment

[0062] This embodiment provides an ultrasonic fingerprint sensor structure 200, see Figure 8 , Figure 8 A schematic structural diagram of an ultrasonic fingerprint sensor structure 200 provided in an embodiment of the present invention is shown.

[0063] It should be noted that the ultrasonic fingerprint sensor structure 200 provided in this embodiment can be used in the electronic device 10 provided in the first embodiment.

[0064] It should also be noted that the basic principle and technical effects of the ultrasonic fingerprint sensor structure 200 provided in this embodiment are basically the same as those in the above embodiments. For the sake of brief description, for parts not mentioned in this embodiment, reference may be made to the corresponding contents in the above embodiments.

[0065] In this embodiment, the insulating layer 280 is attached to the ultrasonic fingerprint sensor 250 , and a side of the insulating layer 280 facing away from the ultrasonic fingerprint sensor 250 is bonded to the glass cover plate 210 by glue to form a glue layer 290 .

[0066] In this embodiment, the insulating layer 280 can be made of MESA or DAF material, which can fill the gap between the ultrasonic fingerprint sensor 250 and the glass cover 210. Match the acoustic impedance to allow ultrasonic waves to propagate better between the ultrasonic fingerprint sensor 250 and the glass cover 210. It should be noted that the temperature when the MESA or DAF material is set on the ultrasonic fingerprint sensor 250 to form the insulating layer 280 cannot exceed the maximum temperature that the ultrasonic fingerprint sensor 250 can withstand. In this embodiment, it cannot exceed 90°C. The insulating layer 280 can be made of Henkel MESA125E, Henkel MESA120u or Sanjian 1655DDAF. The glue layer 290 can be made of materials such as Henkel 3280 or Henkel 3285.

[0067] In this embodiment, the thickness of the glue layer 290 can be set to 20 μm, and the thickness of the insulating layer 280 can be set to 20-25 μm.

[0068] The insulating layer 280 can fill the gap between the glass cover 210 and the ultrasonic fingerprint sensor 250 , match the acoustic impedance, make the ultrasonic wave transmit smoothly, and improve the sensitivity and accuracy of the ultrasonic fingerprint sensor 250 .

[0069] Fourth embodiment

[0070] This embodiment provides an ultrasonic fingerprint sensor structure 200, see Fig. 9 , Fig. 9 A schematic structural diagram of an ultrasonic fingerprint sensor structure 200 provided in an embodiment of the present invention is shown.

[0071] It should be noted that the ultrasonic fingerprint sensor structure 200 provided in this embodiment can be used in the electronic device 10 provided in the first embodiment.

[0072] It should also be noted that the basic principle and technical effects of the ultrasonic fingerprint sensor structure 200 provided in this embodiment are basically the same as those in the above embodiments. For the sake of brief description, for parts not mentioned in this embodiment, reference may be made to the corresponding contents in the above embodiments.

[0073] In this embodiment, the insulating layer 280 includes a first insulating layer 281 and a second insulating layer 283, the first insulating layer 281 is adhered to the glass cover plate 210, the second insulating layer 283 is adhered to the ultrasonic fingerprint sensor 250, and glue is arranged between the first insulating layer 281 and the second insulating layer 283 to form a glue layer 290, and the two are bonded through the glue layer 290.

[0074] In this embodiment, the insulating layer 280 can be made of MESA or DAF material, which can fill the gap between the ultrasonic fingerprint sensor 250 and the glass cover plate 210. Matching acoustic impedance allows ultrasonic waves to propagate better between the ultrasonic fingerprint sensor 250 and the glass cover plate 210. It should be noted that the temperature when the MESA or DAF material is set on the ultrasonic fingerprint sensor 250 to form the insulating layer 280 cannot exceed the maximum temperature that the ultrasonic fingerprint sensor 250 or the glass cover plate 210 can withstand. It is selected to be set on one side of the glass cover plate 210 or one side of the ultrasonic fingerprint sensor 250 according to the different curing temperatures of the MESA material or DAF material, or the processing technology, convenience, etc. The insulating layer 280 can be made of Henkel MESA125E, Henkel MESA120u or Sanjian 1655DDAF. The glue layer 290 can be made of materials such as Henkel 3280 or Henkel 3285. The insulating layer 280 can fill the gap between the glass cover 210 and the ultrasonic fingerprint sensor 250 , match the acoustic impedance, make the ultrasonic wave transmit smoothly, and improve the sensitivity and accuracy of the ultrasonic fingerprint sensor 250 .

[0075] In this embodiment, the thickness of the first insulating layer 281 can be set to 70-75 μm, and the thickness of the second insulating layer 283 can be set to 20-25 μm.

[0076] In summary, the present invention provides a cover plate, an ultrasonic fingerprint sensor structure and an electronic device, wherein the ultrasonic fingerprint sensor structure includes an ultrasonic fingerprint sensor, a film and a glass cover plate, wherein the glass cover plate includes a fingerprint sensing area and a non-fingerprint sensing area, wherein the film is adhered between the glass cover plate and the ultrasonic fingerprint sensor, wherein the ultrasonic fingerprint sensor is opposite to the fingerprint sensing area of ​​the glass cover plate, wherein the position of the film relative to the fingerprint sensing area is hollowed out, and an insulating layer for filling the hollowed-out area of ​​the film is provided between the ultrasonic fingerprint sensor and the fingerprint sensing area of ​​the glass cover plate. By hollowing out the film film corresponding to the fingerprint sensing area, the problem of blurred fingerprint image caused by the OCA layer of the film affecting the propagation of ultrasonic waves between the ultrasonic fingerprint sensor and the glass cover plate is avoided, and by providing an insulating layer between the glass cover plate and the ultrasonic fingerprint sensor, the step difference between the ultrasonic fingerprint sensor and the glass cover plate is filled, and the acoustic impedance is matched, so that the ultrasonic waves are transmitted more smoothly between the fingerprint sensor and the glass cover plate, thereby improving the sensitivity and accuracy of the ultrasonic fingerprint sensor in identifying fingerprints.

[0077] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An ultrasonic fingerprint sensor structure, characterized in that: The ultrasonic fingerprint sensor structure includes an ultrasonic fingerprint sensor, an insulating layer and a cover plate, the ultrasonic fingerprint sensor is bonded to the cover plate, the cover plate includes a glass cover plate and a film film, the glass cover plate includes a fingerprint sensing area and a non-fingerprint sensing area, the film film is bonded to the glass cover plate, and the position of the film film corresponding to the fingerprint sensing area of ​​the glass cover plate is hollowed out to form a hollow area; The insulating layer is disposed between the ultrasonic fingerprint sensor and the fingerprint sensing area of ​​the glass cover to fill the hollow area of ​​the film; An exhaust passage is arranged between the film and the fingerprint sensing area.

2. The ultrasonic fingerprint sensor structure according to claim 1, characterized in that: The fingerprint sensing area on the surface of the side where the glass cover plate is connected to the film is also provided with a first electroplating layer and an ink layer in sequence.

3. The ultrasonic fingerprint sensor structure as claimed in claim 2, characterized in that: The cross-sectional area of ​​the first electroplating layer and / or ink layer is smaller than the cross-sectional area of ​​the hollow region.

4. The ultrasonic fingerprint sensor structure according to claim 1, characterized in that: One side of the insulating layer is bonded to the fingerprint sensing area of ​​the glass cover plate, and the other side of the insulating layer opposite to the ultrasonic fingerprint sensor is bonded to the ultrasonic fingerprint sensor by glue.

5. The ultrasonic fingerprint sensor structure as claimed in claim 1, characterized in that: The insulating layer is attached to the ultrasonic fingerprint sensor, and a side of the insulating layer facing away from the ultrasonic fingerprint sensor is bonded to the glass cover plate by glue.

6. The ultrasonic fingerprint sensor structure according to claim 1, characterized in that: The insulating layer includes a first insulating layer and a second insulating layer, the first insulating layer is attached to the glass cover plate, the second insulating layer is attached to the ultrasonic fingerprint sensor, and the first insulating layer is bonded to the second insulating layer by glue.

7. The ultrasonic fingerprint sensor structure according to any one of claims 4 to 6, characterized in that: A blind hole is formed in a fingerprint sensing area on a surface of the glass cover plate on one side facing away from the ultrasonic fingerprint sensor.

8. The ultrasonic fingerprint sensor structure according to any one of claims 4 to 6, characterized in that: The film includes an OCA layer, a PET layer, a second electroplating layer and an ink layer in sequence, the OCA layer is bonded to the glass cover plate, and the ultrasonic fingerprint sensor is connected to the ink layer.

9. An electronic device, characterized in that: The electronic device comprises a device body and the ultrasonic fingerprint sensor structure according to any one of claims 1 to 8, wherein the ultrasonic fingerprint sensor is arranged on the front surface or the rear surface of the device body.

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