A slow lifting trough structure for preventing silicon wafers from sticking

Abstract

The present invention discloses a slow lifting trough structure for preventing silicon wafer adhesion, including a slow lifting trough. A tray is arranged in the slow lifting trough, and a number of partition plates are equidistantly and spacedly arranged on the tray. Drainage grooves are formed on both side surfaces of the partition plates. The drainage grooves arranged on both side surfaces of the partition plate are cross-distributed. Each side surface is provided with 10 - 15 drainage grooves, and the width of the drainage groove is 0.5 - 0.7 mm, and the depth is 0.3 - 0.4 mm. Without changing the existing trough structure and fixture tooling, the present invention simply reforms the tray in the slow lifting trough body, adds a group of equidistantly and spacedly arranged partition plates, and through the drainage grooves formed thereon, can effectively prevent the adhesion of thin silicon wafers, improve the yield rate of silicon wafers, has strong practicability, and is well worth popularizing.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer texturing, and specifically provides a slow-lifting tank structure for preventing silicon wafers from sticking together. Background Art

[0002] Improving efficiency and reducing costs is a long-term theme in the photovoltaic manufacturing industry. Among the current manufacturing costs of silicon-based solar cells, the cost of incoming silicon wafers still accounts for more than 50%. Using thinner silicon wafers can obviously directly reduce the cost of solar cells and improve competitiveness. However, thinner silicon wafers mean higher flexibility and bendability. When the thickness of monocrystalline silicon wafers is reduced to less than 160 μm, the traditional tooling fixtures on the texturing machine are no longer sufficient to ensure that the silicon wafers have enough spacing to prevent the silicon wafers from sticking together before entering the drying tank. When the silicon wafers are lifted from the liquid, due to the adsorption force of water between the silicon wafers, two silicon wafers are adsorbed together. The adhesion of adjacent wafers will not only cause the liquid medicine to remain on the silicon wafers, but also result in poor drying effect of the silicon wafers, with water marks remaining on the surface, affecting the yield of the current process and causing difficulties in the subsequent diffusion process production. The water vapor will pollute the high-temperature furnace tube during the diffusion process, affecting the production yield.

[0003] The factors affecting silicon wafer adhesion include not only the thickness of the silicon wafers but also the spacing of the silicon wafers in the carrier. Under the existing conditions, the overall size of the carrier tooling has been fixed to adapt to the size of the texturing tank. Changing the carrier size will inevitably require the transformation of the entire texturing equipment, with relatively high costs and difficulties. Without changing the overall size of the carrier, there is no further room to increase the silicon wafer spacing.

[0004] Therefore, in the trend of further reducing the thickness of silicon wafers, it is necessary to find a simple and feasible method to improve silicon wafer adhesion. However, most of the current single-crystal texturing machines in the industry are of the tank type, with a slow-lifting tank arranged before the drying tank. By slowly lifting the carrier from the water, the amount of liquid adsorbed on the surface of the silicon wafers is reduced to prevent the silicon wafers from sticking together.

[0005] However, when the silicon wafers are relatively thin and have high toughness, due to capillary action, the water at the close proximity of the silicon wafers cannot flow down, resulting in silicon wafer adhesion. The adhered silicon wafers have poor hot air circulation drying effect in the drying tank, and the silicon wafers usually still have moisture after being unloaded. Moreover, the general slow-lifting tank internally has a liftable bottom tray to achieve the lifting of the carrier. Usually, the tray structure is relatively simple and only has the liftable function. Therefore, a new slow-lifting tank structure is needed to solve the adhesion problem. Summary of the Invention

[0006] The purpose of the present invention is to provide a slow-lifting tank structure for preventing silicon wafers from sticking together to solve the problems raised in the above background art.

[0007] To achieve the above purpose, the present invention provides the following technical solutions:

[0008] A slow lifting tank structure for preventing silicon wafers from sticking, including a slow lifting tank, a tray is arranged in the slow lifting tank, a plurality of partition plates are arranged at equal intervals on the tray, and drainage grooves are formed on both side surfaces of the partition plates.

[0009] Preferably, flower basket clamping points are fixedly arranged at the four corners of the tray.

[0010] Preferably, the thickness of the partition plate is 1.0 - 1.5 mm, the height is 6 - 8 cm, and the width is 3 - 4 cm.

[0011] Preferably, the drainage grooves arranged on both side surfaces of the partition plate are cross - distributed, 10 - 15 drainage grooves are arranged on each side surface, the width of the drainage groove is 0.5 - 0.7 mm, and the depth is 0.3 - 0.4 mm.

[0012] Preferably, the distance between every two adjacent partition plates is 4 mm.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] Without changing the existing tank structure and fixture tooling, the present invention simply reforms the tray in the slow lifting tank body, adds a group of partition plates at equal intervals, and through the drainage grooves formed thereon, can effectively prevent the adhesion of thin silicon wafers, improve the yield rate of silicon wafers, has strong practicability, and is very worthy of promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a top - view schematic diagram of the overall structure of the present invention;

[0016] Figure 2 is a front - view schematic diagram of the overall structure of the present invention;

[0017] Figure 3 is a left - view schematic diagram of the overall structure of the present invention;

[0018] Figure 4 is a front - view schematic diagram of the connection structure between the tray and the partition plate of the present invention;

[0019] Figure 5 is a left - view schematic diagram of the connection structure between the tray and the partition plate of the present invention;

[0020] Figure 6 is a detailed schematic diagram of the drainage groove structure on the partition plate of the present invention.

[0021] In the figure: 1 slow lifting tank, 2 tray, 3 partition plate, 4 drainage groove, 5 flower basket clamping point. DETAILED DESCRIPTION OF THE INVENTION

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0023] Please refer to Figures 1-6 , the present invention provides a technical solution:

[0024] A slow-lifting tank structure for preventing silicon wafer adhesion, including a slow-lifting tank 1, a tray 2 is arranged in the slow-lifting tank 1, flower basket clamping points 5 are fixedly arranged at the four corners of the tray 2, and the flower basket clamping points 5 are used to clamp the flower basket for holding silicon wafers. A number of partition plates 3 are equidistantly arranged on the tray 2. The thickness of the partition plates 3 is 1.0 - 1.5 mm, the height is 6 - 8 cm, and the width is 3 - 4 cm. The drainage grooves 4 arranged on both sides of the partition plates 3 are cross-distributed. There are 10 - 15 drainage grooves 4 on each side, and the width of the drainage grooves 4 is 0.5 - 0.7 mm, and the depth is 0.3 - 0.4 mm. The distance between every two adjacent partition plates 3 is 4 mm, and drainage grooves 4 are opened on both sides of the partition plates 3.

[0025] Embodiment 1:

[0026] The slow-lifting tank 1 has a liftable bottom tray 2 inside. In the present invention, a row of partition plates 3 with drainage grooves 4 are added in the middle of the tray 2. The partition plates 3 can enter the gaps between the silicon wafers. During the lifting process of the flower basket, the liquid between the silicon wafers is introduced into the lower tank through the drainage grooves 4, avoiding the adhesion caused by the residual liquid between the silicon wafers. On the basis of the existing structure, the present invention realizes the ability to prevent silicon wafer adhesion by simply adding components.

[0027] The thickness of the partition plate 3 is 1.5 mm, the top is flat, and the distance is equivalent to the distance between the silicon wafers, about 4 mm. When the flower basket enters the slow-lifting tank 1 and is placed on the tray 2, through laser positioning, for those skilled in the art, the distance between the silicon wafers in the flower basket is often set to about 4 mm, and the accuracy is sufficient to ensure that the partition plate 3 enters the gap between the silicon wafers. The height of the partition plate 3 is 8 cm, which can reach the middle area of the silicon wafer, and the top is smooth to avoid scratching the silicon wafer. The width is 4 cm, the width of the drainage groove is 0.7 mm, the depth is 0.4 mm, the distance is 2.5 mm, and they are cross-distributed on both sides. There are 11 drainage grooves evenly distributed on each side. Without changing the existing tank structure and fixture tooling, simply modifying the structure on the tray 2 in the slow-lifting tank 1 and adding a set of partition plates 3 can effectively prevent the adhesion of thin silicon wafers and improve the yield.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A slow-lifting trough structure for preventing silicon wafers from sticking, comprising a slow-lifting trough (1), wherein a liftable tray (2) is arranged in the slow-lifting trough (1), and it is characterized in that: A number of partition plates (3) are equidistantly arranged in the middle of the tray (2), and drainage grooves (4) are formed on both side surfaces of the partition plates (3); flower basket clamping points (5) are fixedly arranged at the four corners of the tray (2); The height of the partition plate (3) is 6-8 cm, and the drainage grooves (4) arranged on both side surfaces of the partition plate (3) are cross-distributed.

2. The slow lifting trough structure for preventing wafer adhesion according to claim 1, characterized in that: The thickness of the partition plate (3) is 1.0-1.5 mm, and the width is 3-4 cm.

3. The slow-lifting tank body structure for preventing silicon wafer adhesion according to claim 1, characterized in that: There are 10-15 drainage grooves (4) on each side surface, and the width of the drainage groove (4) is 0.5-0.7 mm, and the depth is 0.3-0.4 mm.

4. A slow lifting trough structure for preventing silicon wafer adhesion according to any one of claims 1 to 3, characterized in that: The distance between every two adjacent partition plates (3) is 4 mm.

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