Chip pressing structure and semiconductor packaging structure

Abstract

The present invention provides a chip crimping structure and a semiconductor packaging structure, which includes a busbar having at least one guide through hole; at least one top pressure guide rod, which is respectively arranged in one-to-one correspondence with the guide through hole, and is conductively connected to the busbar through a conductive spring, and has a first state of penetrating the guide through hole and a second state of resetting under the pressure difference between the external pressure and the elastic force of the conductive spring; the connecting end surface of the conductive spring is a plane. The present invention provides a chip crimping structure and a semiconductor packaging structure, which compensates for the inconsistent chip thickness and the dimensional error caused by structural processing by arranging the conductive spring, so that the pressure of each chip is basically consistent, and the packaging reliability is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor devices, and in particular to a chip pressing structure and a semiconductor packaging structure. Background Art

[0002] At present, the most commonly used method in crimping packaging is rigid crimping, that is, both sides of the chip are crimped with a single metal column. Although this form has a simple structure, it has strict requirements on the chip thickness and the processing accuracy of the metal column size. Especially when the number of chips increases, if the size deviation is large, there will be serious deviations in the pressure inside the chip and between different chips during crimping. The chip with concentrated pressure will be crushed and damaged, and the chip with low pressure may discharge or burn out due to high temperature caused by high contact resistance and thermal resistance. Summary of the invention

[0003] Since the rigid compression structure may cause pressure deviation inside the chip and between chips, the present invention provides a chip compression structure and a semiconductor packaging structure to solve the above technical problems.

[0004] To achieve the above-mentioned purpose, an embodiment of the present invention provides a chip crimping structure, characterized in that it includes: a busbar base having at least one guide through hole; at least one pressing guide rod, which is arranged one-to-one corresponding to the guide through hole, and is conductively connected to the busbar base through a conductive spring, and has a first state of penetrating the guide through hole and a second state of being reset under the pressure difference between the external pressure and the elastic force of the conductive spring; the connecting end face of the conductive spring is a plane.

[0005] Optionally, it also includes an adjustment sleeve, which is arranged on the confluence bottom plate, is arranged one-to-one corresponding to the guide through holes, and is sleeved on the top pressure guide rod.

[0006] Optionally, the conductive pressure spring is arranged between the pressing guide rod and the adjusting sleeve.

[0007] Optionally, the conductive spring is arranged between the top pressure guide rod and the busbar, and is sleeved on the outside of the adjustment sleeve.

[0008] Optionally, the material of the conductive spring includes: beryllium copper.

[0009] Optionally, the surfaces of the pressure guide rod, the adjustment sleeve and the busbar bottom plate have a protective coating.

[0010] An embodiment of the present invention further provides a semiconductor packaging structure, comprising electrode plates stacked in sequence, at least one chip, and any one of the above-mentioned chip compression structures.

[0011] Optionally, the chip is connected to an end of the pressing guide rod facing away from the busbar.

[0012] Optionally, an insulating shell is also included to fix the electrode plate, the chip and the chip crimping structure.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The present invention provides a chip crimping structure and a semiconductor packaging structure. By setting a conductive spring, the inconsistent chip thickness and the dimensional error caused by structural processing are compensated, so that the pressure of each chip is basically consistent, and the packaging reliability is improved. The conductive spring will not have interlayer dislocation phenomenon, and the friction with the guide part is very small or no friction. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 is a cross-sectional view of the chip crimping structure of this embodiment;

[0017] Figure 2 is a schematic diagram of the chip crimping structure of this embodiment;

[0018] Figure 3 is a schematic diagram of the semiconductor packaging structure of this embodiment;

[0019] Figure 4 is a schematic diagram of the conductive spring of this embodiment;

[0020] Figure 5 is a cross-sectional view of the conductive spring of this embodiment;

[0021] Figure 6 It is a cross-sectional view of a chip crimping structure according to another embodiment.

[0022] Description of reference numerals:

[0023] 1-chip crimping structure; 2-pressing guide rod; 3-conducting spring; 31-first wire band; 311-first wire band end face; 32-second wire band; 321-second wire band end face; 4-adjusting sleeve; 5-busbar bottom plate; 6-chip; 7-electrode plate; 8-insulating shell. DETAILED DESCRIPTION

[0024] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] In order to solve the pressure deviation inside the chip and between chips caused by the rigid crimping structure, the inventor added an elastic structure inside the crimping package to compensate for the inconsistent chip thickness and dimensional deviation caused by structural processing through the deformation of the elastic structure. Since conventional pressure-bearing springs such as helical springs and cylindrical springs generally cannot meet the requirements of high pressure loads and small volume dimensions, disc springs are used as elastic parts in this structure, and the corresponding chip pressure is provided by combining multiple disc springs of the same specification with disc spring washers.

[0026] However, the elastic structure requires a separate conductive connecting piece that can deform with the disc spring to achieve current flow, resulting in a complex crimping structure, a large volume, and poor thermal properties. Therefore, the inventors proposed a chip crimping structure, such as Figure 1-Figure 5 The chip crimping structure 1 may include:

[0027] The pressure guide rod 2, the conducting spring 3, the adjusting sleeve 4 and the busbar 5.

[0028] The conductive spring 3 and the adjustment sleeve 4 are sequentially mounted on the top pressure guide rod 2, and the lower end of the top pressure guide rod 2 passes through the conductive spring 3 and is inserted into the adjustment sleeve 4. The adjustment sleeve 4 is connected to the busbar base 5. The busbar base 5 is also provided with guide holes corresponding to the top pressure guide rod 2. Under the pressure difference between the external pressure and the elastic force of the conductive spring 3, the top pressure guide rod 2 has a first state of penetrating the guide hole and a second state of resetting. The conductive spring 3 is a double-helix conductive spring, the end faces of both ends are planes, and the first wire band 31 and the second wire band 32 are twisted with each other, and the first wire band 31 and the second wire band 32 have the same rectangular cross-section. The conductive spring 3 can be made of beryllium copper, the top pressure guide rod 2, the adjustment sleeve 4 and the busbar base 5 can be made of copper, and the surface is silver-plated, and the size of the top pressure guide rod 2 matches the chip 6.

[0029] Since the disc springs in the prior art are matched in line contact, and since line contact will increase the resistance between the parts connected by the springs, the springs themselves cannot be used as the current-conducting carrier between the chip and the external electrode, and a conductive connecting piece that can be deformed with the disc springs needs to be separately provided to achieve current flow. In this embodiment, by setting the connecting end face of the conductive spring 3 as a plane, the line contact can be changed into a surface contact, thereby greatly reducing the contact surface resistance between the top pressure guide rod 2 and the adjustment sleeve 4, and it is no longer necessary to separately provide a conductive connecting piece that can be deformed with the springs, thus forming a chip crimping structure without a conductive connecting piece that can be deformed with the springs. Therefore, the chip crimping structure is simple in structure and small in size.

[0030] In the actual processing process, there are processing errors in the size of each structural part, resulting in inconsistent pressures on different chips. In this embodiment, under the working pressure, the chip 6 causes the conductive spring 3 to undergo a certain compression deformation, and the top pressure guide rod 2 presents the first state of penetrating the guide hole under the working pressure of the chip 6, so that the pressure on each chip is roughly equal, which plays a role in compensating for the pressure. When the chip 6 is not subjected to working pressure, the top pressure guide rod 2 will not be subjected to the working pressure of the chip 6, and will present the second state of reset. In actual applications, those skilled in the art can adjust the number of chip crimping structures 1 according to the number of chips 6 to set multiple groups of independent chip crimping structures 1, thereby compensating for the size errors of each structural part, making the pressure of each chip 6 basically consistent, improving the packaging reliability, and reducing the difficulty of parts processing.

[0031] In this embodiment, while keeping other parts unchanged, the height of the adjustment sleeve 4 can be adjusted during the manufacturing process according to the packaging requirements to improve the versatility of the structural parts. The conductive spring 3 can be made of high-strength beryllium copper, which has weak magnetism, high strength, good electrical and thermal conductivity, and also reduces the parasitic parameters caused by the packaging.

[0032] Since common disc springs in the prior art are stacked in multiple layers, there will generally be interlayer dislocation, which will cause friction failure and fracture with the internal and external guide mechanisms, and then cause friction with the guide parts. In this embodiment, by passing the top pressure guide rod 2 through the conductive voltage spring 3, a guiding effect can be provided for the conductive voltage spring 3 to prevent the conductive voltage spring 3 from deflecting when subjected to pressure, ensuring that the conductive voltage spring 3 will not have interlayer dislocation, and then there will be little or no friction with the top pressure guide rod 2.

[0033] The conductive spring 3 includes two first and second wire strips 31 and 32 twisted together, and the first and second wire strips 31 and 32 have the same rectangular cross-section. The cross-sections of the first and second wire strips 31 and 32 are relatively inclined. This arrangement enables the conductive spring 3 to have the same advantages as the disc spring, such as high stiffness, strong buffering capacity, and small deformation under large loads. The first and second wire strips 31 and 32 are twisted together to a preset number of turns, for example, 5 to 8 turns, and the specific number of turns can be determined by those skilled in the art according to actual conditions.

[0034] The top pressure guide rod 2, the adjustment sleeve 4 and the busbar 5 are made of copper, and the surface is silver-plated, so as to reduce the contact resistance, improve the conductivity, and have the purpose of anti-oxidation and anti-corrosion.

[0035] Of course, as another embodiment, the top pressure guide rod 2, the adjustment sleeve 4 and the converging bottom plate 5 can be made of other conductive materials to play a conductive role. The surfaces of the top pressure guide rod 2, the adjustment sleeve 4 and the converging bottom plate 5 can also be plated with other materials to have anti-oxidation and anti-corrosion effects.

[0036] As another embodiment, the adjustment sleeve 4 can be omitted, and the conductive spring 3 can play a corresponding role. Figure 6 The chip crimping structure 1 may include: a pressing guide rod 2, a conductive spring 3 and a busbar 5. The lower end of the pressing guide rod 2 passes through the conductive spring 3, and the conductive spring 3 is directly connected to the busbar 5. The busbar 5 is also provided with guide holes corresponding to the pressing guide rods 2. Under the pressure difference between the external pressure and the elastic force of the conductive spring 3, the pressing guide rod 2 has a first state of penetrating the guide hole and a second state of being reset.

[0037] In this embodiment, the contact surface between the pressing guide rod 2 and the chip 6 is processed with high precision, so that the roughness of the contact surface between the pressing guide rod 2 and the chip 6 is very low, for example, the roughness can be 0.4um. Such a setting can reduce the friction between the chip 6 and the pressing guide rod 2 during the working process, thereby reducing the heat generated by the chip 6, extending the service life of the chip 6, and improving the stability of the chip 6.

[0038] The size of the top pressure guide rod 2 matches the chip 6. Such an arrangement can prevent the chip 6 from bending during operation, thereby better protecting the chip 6 and extending the service life of the chip 6.

[0039] like Figure 3As shown, this embodiment also provides a semiconductor packaging structure, including: a chip crimping structure 1, a chip 6, an electrode plate 7 and an insulating frame 8. The chip 6 is crimped on the electrode plate 7 by the chip crimping structure 1, and is fixed by the insulating shell 8 to form a semiconductor packaging structure. The semiconductor packaging structure configured in this way can be packaged into a module alone, or multiple units can be connected in parallel to form a module with a larger capacity, and the structural performance is stable, the pressure is uniform, and it meets the reliability requirements.

[0040] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A chip crimping structure, characterized in that: include: A collector bottom plate (5) having at least one guide through hole; At least one pressing guide rod (2) is arranged one by one in correspondence with the guide through holes, is electrically connected to the busbar (5) via a conductive spring (3), and has a first state of penetrating the guide through hole and a second state of being reset under the action of a pressure difference between an external pressure and the elastic force of the conductive spring (3); The conductive voltage spring (3) is a current guide carrier; the connecting end surface of the conductive voltage spring (3) is a plane, so that the conductive voltage spring (3) and the top pressure guide rod (2) are in surface contact.

2. The crimping structure according to claim 1, characterized in that: Also includes: The adjustment sleeve (4) is arranged on the confluence bottom plate (5), is arranged in one-to-one correspondence with the guide through holes, and is sleeved on the top-pressing guide rod (2).

3. The crimping structure according to claim 2, characterized in that: The conductive spring (3) is arranged between the pressing guide rod (2) and the adjusting sleeve (4).

4. The crimping structure according to claim 2, characterized in that: The conductive spring (3) is arranged between the top pressure guide rod (2) and the collector bottom plate (5), and is sleeved on the outside of the adjustment sleeve (4).

5. The crimping structure according to claim 4, characterized in that: The material of the conductive spring (3) includes: beryllium copper.

6. The crimping structure according to any one of claims 1 to 5, characterized in that: The conductive spring (3) comprises a first wire band (31) and a second wire band (32) twisted with each other, and the first wire band (31) and the second wire band (32) have rectangular cross-sections.

7. The crimping structure according to any one of claims 2 to 5, characterized in that: The surfaces of the pressure guide rod (2), the adjustment sleeve (4) and the collector bottom plate (5) have a protective coating.

8. A semiconductor packaging structure, characterized in that: It comprises electrode plates (7) stacked in sequence, at least one chip (6), and the chip pressing structure according to any one of claims 1 to 7.

9. The semiconductor package structure according to claim 8, characterized in that: The chip (6) is connected to an end of the pressing guide rod (2) facing away from the busbar bottom plate (5).

10. The semiconductor package structure according to claim 9, wherein: It also includes an insulating shell (8) for fixing the electrode plate (7), the chip (6) and the chip crimping structure.

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