Circuit configuration for controlling a power semiconductor device and arrangement having the same

Abstract

The invention proposes a circuit arrangement for controlling a power semiconductor device, the circuit arrangement having a first circuit carrier and a second circuit carrier arranged parallel to and spaced apart from the first circuit carrier, and having a plastic molding arranged in an intermediate space between the first and second circuit carriers, wherein the first circuit carrier comprises first conductor tracks having first contact points, which can be embodied in particular as contact pads or contact sockets, arranged on a main side of the first circuit carrier facing the plastic molding, the second circuit carrier comprises second conductor tracks having second contact points arranged on a main side of the second circuit carrier facing the plastic molding, wherein the plastic molding has a first holder for a first component having first and second contact means, the first contact means being in electrically conductive connection with the first contact points and the second contact means being in electrically conductive connection with the second contact points.

Description

TECHNICAL FIELD

[0001] A circuit configuration for controlling a power semiconductor arrangement having a first circuit carrier and a second circuit carrier is described. A setup having such a circuit configuration is also described. BACKGROUND

[0002] It is known from the general prior art to connect two circuit carriers, in particular two printed circuit boards arranged parallel to one another, in an electrically conductive manner by means of plug and socket connectors. SUMMARY

[0003] In view of the prior art, it is an object of the present application to provide a circuit configuration and a setup having the same, in which different components can be arranged spatially and in which an especially advantageous manner is employed in terms of circuit technology.

[0004] According to the application, this object is achieved by a circuit configuration having the following features and by a setup having the following features.

[0005] In a circuit configuration for controlling a power semiconductor arrangement according to the application, the circuit configuration has a first circuit carrier and a second circuit carrier arranged parallel to the first circuit carrier and spaced apart from the first circuit carrier, and has a plastic molded body arranged in an intermediate space between the first and second circuit carriers, the first circuit carrier has a first conductor track having a first contact point, which can be embodied in particular as a contact pad or a contact socket, which is arranged on a main side of the first circuit carrier facing the plastic molded body, and the second circuit carrier has a second conductor track having a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body, wherein the plastic molded body has a first holder for a first component having a first and a second contact device, and wherein the first contact device is in electrically conductive connection with the first contact point and the second contact device is in electrically conductive connection with the second contact point. This connection can preferably be achieved by means of a plug connector, a press-fit contact or a spring contact.

[0006] The first holder, in which the first component is located, is preferably filled by means of an electrically insulating casting compound. It is generally sufficient when the components are completely covered, in other words, the holder does not need to be filled up to its rim. The casting compound can also be designed to dissipate heat generated in the components as effectively as possible.

[0007] It is generally preferred that the first component has at least one further first contact means and one further second contact means, the first circuit carrier has at least one further first contact point, the second circuit carrier has at least one further second contact point, and the further first contact means and the further second contact means are each in an electrically conductive connection with the further first contact point and the further second contact point in a circuit-compatible manner.

[0008] This first component can preferably be embodied as an electrically isolated transmission component, in particular a transformer or an optocoupler.

[0009] In particular, it is practical and preferred if an additional component with additional contact means is arranged in an additional holder of the plastic molded body and if said additional component is electrically conductively connected to the associated additional contact point on the at least one circuit carrier. Examples of such additional components are printed circuit boards or current sensors, or assemblies consisting of both.

[0010] It is particularly advantageous if a first support surface of the plastic molded body rests on the first circuit carrier. It is likewise advantageous if a second support surface of the plastic molded body rests on the second circuit carrier. If both embodiments are implemented at the same time, this results in an assembly consisting of the first circuit carrier, the second circuit carrier and the plastic molded body, which makes it possible to further use this assembly particularly simply.

[0011] In a particularly preferred embodiment of the circuit arrangement, the plastic molded body is designed and arranged to form an electrical insulation between the first and the second circuit carrier, in particular in accordance with the requirements of EN 60664 (current version). The first circuit carrier can be the primary side and the second circuit carrier is the secondary side of a driver for power semiconductor devices, which has a particularly compact design, since the insulation is not formed on one circuit carrier but is distributed over two circuit carriers.

[0012] The arrangement according to the invention is designed with a circuit arrangement and a power semiconductor device as described above, wherein the second circuit carrier is electrically conductively connected to the power semiconductor device by a control connection. It can be advantageous to design the load connection in essentially the same way, provided that the current-carrying capacity of the associated circuit carrier is sufficiently large.

[0013] It is particularly advantageous if the power semiconductor device is designed as a power semiconductor module or a power semiconductor sub-module. In this case, the power semiconductor device can have a separate housing or a sub-housing. An advantageous alternative to this is a common housing of the circuit arrangement and the power semiconductor device.

[0014] Of course, each feature or group of features mentioned in singular form, such as the respective contact points and contact means, can be present more than once in the circuit arrangement or arrangement according to the invention, if this is not explicitly or inherently excluded or contradicted by the idea of the invention.

[0015] It is self-evident that the various embodiments of the present application, whether they are used in conjunction with a circuit arrangement or with the construction, can be implemented individually or in any combination to achieve improvements. In particular, the above-mentioned features and the features mentioned below can be applied not only in the specified combinations, but also in other combinations or individually, without departing from the scope of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] Further explanations, advantageous details and features of the present application result from the following description of exemplary embodiments of the present application, which are schematically shown in the drawings or from related parts thereof. Figures 1 to 5

[0017] Figure 1 Schematic representation of a first embodiment of a circuit arrangement according to the present application in a lateral sectional view.

[0018] Figure 2 Schematic representation of a second embodiment of a circuit arrangement according to the present application in a lateral sectional view.

[0019] Figure 3 Schematic representation of a construction according to the present application in an exploded view and a lateral sectional view, the construction having a circuit arrangement and two power semiconductor modules.

[0020] Figure 4 and Figure 5 Embodiment of a plastic molded body of a circuit arrangement according to the present application in a three-dimensional perspective view and a plan view. DETAILED DESCRIPTION

[0021] Figure 1 Schematic representation of a first embodiment of a circuit arrangement 1 according to the present application in an exploded view and a lateral sectional view. The figure shows a first circuit carrier 2, which is embodied here as an industrial standard printed circuit board, having conductor tracks 22, 220 on its first main side 200 and on its second main side. The printed circuit board 2 is specifically designed and arranged for carrying primary side components of a circuit being part of a power electronic driver circuit.

[0022] The figure also shows a second circuit carrier 3, which is also embodied here as an industrial standard printed circuit board, having conductor tracks on its first main side 300 and on its second main side. The printed circuit board 3 is specifically designed and arranged for carrying secondary side components of a circuit being part of a power electronic driver circuit.

[0023] The two printed circuit boards 2, 3 are arranged here parallel to each other and spaced apart, wherein an intermediate space 5 is formed at least between portions of the two printed circuit boards 2, 3. In other words, at least portions of the printed circuit boards are arranged flush with each other in the direction of the normal of their main sides 200, 300.​

[0024] The plastic molding 4 is arranged in the intermediate space 5 and possibly also overlapping the intermediate space 5, and has a plurality of recesses, the openings of each of which respectively face one of the printed circuit boards 2, 3. These recesses form receptacles 42 which are designed to allow components 6, in particular electrical or electronic components, to be arranged therein.

[0025] In one of the receptacles 42, an emitter 60, therefore in technical terms a transformer, is arranged. The emitter 60 is designed to transmit electrical signals from the first printed circuit board 2 to the second printed circuit board and, if applicable, from the second printed circuit board back to the first printed circuit board in an electrically isolated manner. The term "signal" is to be understood here in particular as referring to control or measurement signals. However, such signals can also be energy signals by means of which power is transferred from the first printed circuit board to the second printed circuit board in order to supply it with energy. All these types of signals are frequently used in the field of power electronic drive circuits.

[0026] The receptacle 42 in which the transformer 60 is designed without a separate housing is almost completely filled with an electrically insulating casting compound 44. The casting compound 44 serves on the one hand for the internal electrical insulation of the transformer 60 and on the other hand for fixing the transformer 60 in the receptacle 42.

[0027] The transformer 60 here has two first contact devices 64, 640 which are designed here without general restriction as spring contacts. These first contact devices 64, 640 produce an electrically conductive connection to the associated first contact points 24, 240 of the first printed circuit board 2. For this purpose, two conductors 22, 220 of the first printed circuit board 2 which here face the main side 200 of the plastic molding 4 have first contact points 24, 240 which are designed here as contact surfaces.

[0028] The transformer 60 here has two second contact devices 68, 680 which are designed here without general restriction as part of a plug-socket connector, here as a plug. These second contact devices 68, 680 produce an electrically conductive connection to the associated second contact points 34, 340 of the second printed circuit board 3. For this purpose, two conductors 32, 320 of the first printed circuit board 3 which here face the main side 300 of the plastic molding 4 have second contact points 34, 340 which are designed here as sockets.

[0029] In another receptacle 42, another component 62, in this case a capacitor, is arranged. The capacitor 62 has additional contact devices 660 which form a plug-socket connection here with sockets 360 on further conductor tracks of the second printed circuit board 3.

[0030] Figure 2 schematic diagram of a second embodiment of the circuit arrangement 1 according to the application is shown in exploded view and in lateral section view, which is essentially similar to the first embodiment. The differences are described below.

[0031] In addition to the first embodiment, the molded plastic body 4 of this second embodiment has a first support surface 402 and a second support surface 404, which are designed to rest on the relevant main sides 200, 300 of the respective printed circuit boards 2, 3, whereby the two printed circuit boards 2, 3 and the plastic molded body 4 form a structural unit, which can be installed as a whole, for example, in a power electronics arrangement.

[0032] Furthermore, the first contact means 64, 640 are designed here as press-fit contacts of an industry standard. The first printed circuit board 2 of this second embodiment has as first contact points 24, 240 recesses of an industry standard for receiving these press-fit contacts.

[0033] In addition, purely by way of example, an electronic component 280 is shown on the first main side 200 of the first printed circuit board 2. In the assembled state of the printed circuit board 2 and the plastic molded body 4, this component is located in one of the receptacles.

[0034] Purely by way of example, the second printed circuit board 3 also has an electronic component 380 on its second main side and is otherwise identical to the first embodiment.

[0035] Figure 3 A schematic diagram of an arrangement 100 according to the application with a circuit arrangement 1 and two power semiconductor modules 7 is shown in exploded view and in lateral section view. Here the plastic molded body 4 has identical transformers 60 in the two receptacles 42, which are designed and arranged essentially as Figure 2 shown.

[0036] The first printed circuit board 2 has corresponding first contact means 24, 240 for the press-fit contacts of the two transformers.

[0037] The figure also shows two second circuit carriers 3, which are embodied here as printed circuit boards of an industry standard each, with conductor tracks 32, 320 on the first main side and on the second main side. These second printed circuit boards 3 are designed and provided in particular for carrying secondary-side components of a circuit that is part of a power electronics drive circuit for the arrangement 100 according to the application.

[0038] By means of the contact springs 70, the power semiconductor modules 7 are in each case conductively connected to the second printed circuit board 3, or more precisely to the conductor tracks 36 of the second main side. These connections are implemented at least as auxiliary terminal connections, in particular for the transmission of control signals. It is also standard practice to transmit sensor signals, for example from temperature sensors, from the power semiconductor modules 7 to the printed circuit board 3. In some applications and with suitable power semiconductor modules 7, it is also possible to implement load connections between the respective second circuit board 3 and the associated power semiconductor module 7.

[0039] In addition, purely by way of example, electronic components 282 are shown on the second main side of the first printed circuit board 2.

[0040] Figure 4 and Figure 5 Embodiments of the plastic molded body 4 of the circuit arrangement according to the application are shown in three-dimensional perspective views and plan views. These plastic molded bodies 4 are used in power electronics arrangements for connecting the primary-side circuit portion of a drive circuit to the three secondary-side circuit portions of a three-bridge circuit.

[0041] To this end, the plastic molded body 4 has three transformers 60, which are designed here for energy transfer, respectively arranged in the associated receptacle 42. For the sake of clarity, the potting compound is omitted from the figures. In addition, further components for the transmission of control signals are shown, as well as three current measurement devices 66, each having a current sensor and a third printed circuit board for evaluating the signal of the respective current sensor.

[0042] Second contact devices 68, 680 are also shown, as well as a second support surface 404 for the second printed circuit board 3, which here carries all of the secondary-side circuit portions of all three phases. In addition, mounting devices 406 are shown, which, together with screws (not shown), serve to form a structural unit with the plastic molded body 4 and the printed circuit boards (not shown).

Claims

1. A circuit configuration (1) for controlling a power semiconductor device (7), the circuit configuration (1) having a first circuit carrier (2) and a second circuit carrier (3) configured parallel to and spaced apart from the first circuit carrier, and having a plastic molded body (4) configured in an intermediate space (5) between the first circuit carrier (2) and the second circuit carrier (3), a first support surface (402) of the plastic molded body (4) resting on the first circuit carrier (2), and a second support surface (404) of the plastic molded body (4) resting on the second circuit carrier (3), characterized in that, The first circuit carrier (2) has a first conductor track (22) having a first contact point (24) disposed on the main side (200) of the first circuit carrier (2) facing the plastic molded body (4). The second circuit carrier (3) has a second conductor track (32) having a second contact point (34) disposed on the main side (300) of the second circuit carrier (3) facing the plastic molded body (4). The plastic molded body (4) has a first retainer (42) formed as a groove, the opening of each groove facing one of the first circuit carrier (2) and the second circuit carrier, and a first part having a first contact device (64) and a second contact device (68). The component (6) is disposed in the first retainer (42), the first retainer (42) having the first component (6) therein is filled with an electrically insulating casting compound (44), wherein the first contact device (64) is electrically connected to the first contact point (24) and the second contact device (68) is electrically connected to the second contact point (34), and the first component (6) has at least another first contact device (640) and another second contact device (680), the first circuit carrier (2) has at least another first contact point (240), the second circuit carrier (3) has at least another second contact point (340), and the other first contact device (640) and the other second contact device (680) are electrically connected to the other first contact point (240) and the other second contact point (340) in a circuit-compatible manner, respectively.

2. The circuit configuration according to claim 1, characterized in that: The first component (6) is designed as an electrically isolated transmission component.

3. The circuit configuration according to claim 1, characterized in that: The first component (6) is designed as a transformer (60) or an optocoupler.

4. The circuit configuration according to claim 1, characterized in that: The additional components (62, 66) having additional contact devices (660) are configured in additional retainers of the plastic molded body (4), and the additional components are electrically connected to at least one associated additional contact point (360) on a circuit carrier.

5. The circuit configuration according to claim 1, characterized in that: The plastic molded body (4) is designed and configured to form electrical insulation between the first circuit carrier (2) and the second circuit carrier (3).

6. A configuration (100) having a circuit configuration (1) according to any one of claims 1-5, and having a power semiconductor device (7), characterized in that The second circuit carrier (3) is electrically connected to the power semiconductor device (7) via a control connection (70).

7. The configuration according to claim 6, characterized in that: The power semiconductor device (7) is a power semiconductor module or a power semiconductor sub-module.

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