Electronic assembly with heat sink and electric insulator directly bonded to heat sink

Abstract

An electronic assembly drives an electric motor and receives a coolant fluid. The electronic assembly includes a heat sink that includes a thermally conductive material. The heat sink includes a frame extending between a first surface and a second surface. The first surface defines at least a portion of a cavity for receiving the coolant fluid therein. The heat sink includes a plurality of cooling members coupled to and extending from the first surface of the frame into the cavity such that the plurality of cooling members are disposed within the coolant fluid. The electronic assembly further includes an electrical insulator directly bonded to the second surface of the frame and a semiconductor thermally coupled to the electrical insulator. The electrical insulator is a thermal conductor and facilitates heat transfer between the semiconductor and the heat sink. The electrical insulator electrically insulates the semiconductor from the heat sink.

Description

BACKGROUND 1. TECHNICAL FIELD

[0002] The present invention relates generally to an electronic assembly for driving an electric motor and configured to receive a coolant fluid for cooling the electronic assembly.

[0003] 2. DESCRIPTION OF THE RELATED ART

[0004] A turbocharger receives exhaust gas from an internal combustion engine and delivers compressed air to the internal combustion engine. The turbocharger is used to increase the power output of the internal combustion engine, reduce the fuel consumption of the internal combustion engine, and reduce the emissions produced by the internal combustion engine. Delivering compressed air to the internal combustion engine through the turbocharger allows the internal combustion engine to be smaller, yet capable of producing the same or similar amount of horsepower as a larger naturally aspirated internal combustion engine. Having a smaller internal combustion engine for a vehicle reduces the mass and aerodynamic frontal area of the vehicle, which helps to reduce the fuel consumption of the internal combustion engine and improve the fuel economy of the vehicle.

[0005] In recent years, automobile companies have attempted to further increase the efficiency of the turbocharger and, in turn, the internal combustion engine to improve fuel efficiency. Specifically, in addition to the turbocharger, automobile companies include an electric motor that assists in delivering compressed air to the internal combustion engine.

[0006] Conventionally, the electric motor includes high power density electronics for driving the electric motor. However, packaging requirements typically limit the circuit board area of these higher power level electronics. The limited circuit board area makes it difficult to dissipate heat from the high power density electronics.

[0007] Heat sinks have been mounted to the circuit board having the high power density electronics; however, the circuit board and heat sink have an air gap between them, which reduces the heat conduction efficiency between the circuit board and the heat sink. Thermal grease has been added between the circuit board and the heat sink to improve the heat conduction efficiency; however, the grease is messy to work with, is tacky, and can move out of the desired location and degrade over time. Therefore, there is still a need for an improved electronic assembly for driving an electric motor. SUMMARY

[0008] An electronic assembly for driving an electric motor and configured to receive a coolant fluid for cooling the electronic assembly is provided. The electronic assembly includes a heat sink comprising a thermally conductive material. The heat sink includes a frame extending between a first surface and a second surface, wherein the first surface defines at least a portion of a cavity for receiving the coolant fluid therein. The heat sink further includes a plurality of cooling members coupled to and extending from the first surface of the frame into the cavity such that the plurality of cooling members are disposed within the coolant fluid in the cavity and can transfer heat between the heat sink and the coolant fluid. The electronic assembly further includes an electrical insulator directly bonded to the second surface of the frame (wherein the electrical insulator is a thermal conductor), and a semiconductor thermally coupled to the electrical insulator to facilitate heat transfer between the semiconductor and the heat sink. The electrical insulator electrically insulates the semiconductor from the heat sink.

[0009] Accordingly, the electronic assembly improves heat dissipation by directly bonding the electrical insulator to the second surface of the frame. More specifically, the direct bonding reduces a thermal insulating air gap between the electrical insulator and the second surface of the frame, which increases the thermal transfer efficiency of the electronic assembly. Additionally, by eliminating the need for a separately manufactured electrical insulator plate that is then mounted to the heat sink with a thermal grease therebetween, directly bonding the electrical insulator to the second surface of the frame reduces costs and increases yield. Furthermore, directly bonding the electrical insulator to the second surface of the frame allows for a thin layer of the electrical insulator, which reduces the size of the electronic assembly and improves the packaging characteristics of the electronic assembly. BRIEF DESCRIPTION OF DRAWINGS

[0010] The application will be better understood and its other advantages will become more apparent when consideration is given to the following detailed description, taken in conjunction with the drawings, in which:

[0011] Figure 1 is a perspective view of a motorized forced induction system and turbocharger forming a single component in an assisted turbocharger system.

[0012] Figure 2 is Figure 1 is a cross-sectional view of the assisted turbocharger system shown in

[0013] Figure 3 is a perspective view of a motorized forced induction system as a separate component from a turbocharger in an assisted turbocharger system.

[0014] Figure 4 is a cross-sectional view of the motorized forced induction system shown in Figure 3

[0015] Figure 5 is Figure 1 ​A schematic view of an auxiliary turbocharger system including a motorized forced induction system and a turbocharger as a single component for use with an engine.

[0016] Figure 6 A schematic view of an auxiliary turbocharger system including a motorized forced induction system and a turbocharger as independent components for use with an engine. Figure 3 A motorized forced induction system and a turbocharger as shown in

[0017] Figure 7 A perspective view of an electronics assembly.

[0018] Figure 8 A first exploded view of an electronics assembly as shown in Figure 7

[0019] A second exploded view of an electronics assembly as shown in Figure 9 Figure 7 A cross-sectional view of the electronics assembly as shown in

[0020] Figure 10A A cross-sectional view of the electronics assembly as shown in Figure 7

[0021] A cross-sectional view of the electronics assembly as shown in Figure 10B Figure 7 A cross-sectional view of the electronics assembly as shown in

[0022] Figure 11A A cross-sectional view of the electronics assembly as shown in Figure 7 A cross-sectional view of the electronics assembly as shown in

[0023] Figure 11B A cross-sectional view of the electronics assembly as shown in Figure 7 DETAILED DESCRIPTION

[0024] Referring to the drawings, wherein like reference numerals refer to like elements throughout the several views, an motorized forced induction system 20 is generally shown in Figures 1-6 As shown in Figure 5 and Figure 6 , the motorized forced induction system 20 increases the flow of air into an engine 22. The motorized forced induction system 20 includes an electric motor 24, an output shaft 26 coupled to and rotatably driven by the electric motor 24, and a compressor impeller 28 coupled to the output shaft 26 such that the compressor impeller 28 is rotatable with the output shaft 26, as shown in Figure 2 and 4 ​​​The rotation of the compressor is configured to compress air flowing into the engine 22. Compressing air flowing into the engine 22 increases the power output of the engine 22, decreases the fuel consumption of the engine 22, and reduces the emissions produced by the internal combustion engine 22.

[0025] As shown in FIGS. 1-5, the motorized forced induction system 20 can be used with an auxiliary turbocharger system 30. The auxiliary turbocharger system 30 receives air and produces exhaust gas for use with the engine 22. The auxiliary turbocharger system 30 is configured to increase the flow of air into the engine 22 to supplement the flow of air from the turbocharger 32 to the engine 22. Figure 5 Figure 6 As shown in FIGS. 1-5, the motorized forced induction system 20 can be used with an auxiliary turbocharger system 30. The auxiliary turbocharger system 30 receives air and produces exhaust gas for use with the engine 22. The auxiliary turbocharger system 30 is configured to increase the flow of air into the engine 22 to supplement the flow of air from the turbocharger 32 to the engine 22.

[0026] The auxiliary turbocharger system 30 includes a turbocharger 32 configured to receive exhaust gas from the engine 22 and proportionally increase the flow of air into the engine 22 with the flow of exhaust gas from the engine 22. As is generally known in the art, the turbocharger 32 includes a compressor wheel 34, a turbine wheel 36, and an output shaft 38, where the compressor wheel 34 and the turbine wheel 36 are both coupled to the output shaft 38 such that the compressor wheel 34 and the turbine wheel 36 can rotate with the output shaft 38. The turbine wheel 36 is rotated by exhaust gas flowing from the engine 22, which also rotates the output shaft 38 and the compressor wheel 34. The rotation of the compressor wheel 34 is configured to compress air flowing into the engine 22.

[0027] In one embodiment, the turbocharger 32 and the motorized forced induction system 20 are a single component, as shown in FIGS. 1-5. In other words, the motorized forced induction system 20 can be integrated into the turbocharger 32. In this configuration, the output shaft 26 of the motorized forced induction system 20 and the output shaft 38 of the turbocharger 32 are the same component. Further, the compressor wheel 28 of the motorized forced induction system 20 and the compressor wheel 34 of the turbocharger 32 are the same component. In another embodiment, the turbocharger 32 and the motorized forced induction system 20 are separate components from one another, as shown in FIGS. 6-8. Figure 1 2 In one embodiment, the turbocharger 32 and the motorized forced induction system 20 are a single component, as shown in FIGS. 1-5. In other words, the motorized forced induction system 20 can be integrated into the turbocharger 32. In this configuration, the output shaft 26 of the motorized forced induction system 20 and the output shaft 38 of the turbocharger 32 are the same component. Further, the compressor wheel 28 of the motorized forced induction system 20 and the compressor wheel 34 of the turbocharger 32 are the same component. In another embodiment, the turbocharger 32 and the motorized forced induction system 20 are separate components from one another, as shown in FIGS. 6-8. Figure 3 4 ​​​and 6. Both the turbocharger 32 and the motorized forced induction system 20 are fluidly coupled to the engine 22 for increasing the flow of air into the engine 22. In either embodiment, the motorized forced induction system 20 supplements the flow of air from the turbocharger 32 to the engine 22. One example of the motorized forced induction system 20 supplementing the flow of air from the turbocharger 32 to the engine 22 occurs when the flow of exhaust gas from the engine 22 is significantly slower than the desired flow of air into the engine 22, when the motorized forced induction system 20 increases the flow of air to the engine 22. This condition occurs when the engine RPM increases sharply, commonly referred to in the art as "turbolag." However, those skilled in the art will appreciate that the motorized forced induction system 20 can be used to supplement the flow of air from the turbocharger 32 to the engine 22 in any condition where increased air flow is desired. Further, those skilled in the art will appreciate that the motorized forced induction system 20 can be used in any suitable component and configuration for increasing the flow of air into the engine 22.

[0028] As shown in FIGS. Figure 2 and Figure 4 The motorized forced induction system 20 further includes an electronic assembly 40 electrically coupled with the electric motor 24 to drive the electric motor 24 to control the rotation of the output shaft 26 and the compressor impeller 28, as shown in FIGS.

[0029] As shown in FIGS. Figures 7-9 The electronic assembly 40 includes a heat sink 42 comprising a thermally conductive material. In one embodiment, the thermally conductive material comprises a metal, such as aluminum; however, those skilled in the art will appreciate that the thermally conductive material can be any suitable material capable of transferring heat.

[0030] As shown in FIGS. Figures 10A-11B The heat sink 42 includes a frame 44 extending between a first surface 46 and a second surface 48. The first surface 46 defines at least a portion of a cavity 50 for receiving coolant fluid therein. The heat sink 42 further includes a plurality of cooling members 52 coupled to and extending from the first surface 46 of the frame 44 into the cavity 50. The plurality of cooling members 52 are disposed within the coolant fluid in the cavity 50 and can transfer heat between the heat sink 42 and the coolant fluid.

[0031] The electronic assembly 40 further includes an electrical insulator 54 directly bonded to the second surface 48 of the frame 44. The electrical insulator 54 is a thermal conductor. The electronic assembly 40 further includes a semiconductor 56 thermally coupled to the electrical insulator 54 to facilitate heat transfer between the semiconductor 56 and the heat sink 42, wherein the electrical insulator 54 electrically insulates the semiconductor 56 from the heat sink 42.

[0032] Electronic component 40 can be used with high power density electronic devices having typical power levels of 1-20 kW. Therefore, when used with high power density electronic devices, the aforementioned semiconductor 56 can be further defined as a power semiconductor. Electronic component 40 used with high power density electronic devices can drive electric motor 24.

[0033] Due to the common small package requirements of modern electronic devices, high power density leads to increased heat, which must be dissipated to increase electrical efficiency and prevent component failure. As will be apparent in the following description, the electronic assembly 40 of the present invention improves heat dissipation by directly bonding the electrical insulator 54 to the second surface 48 of the frame 44. In particular, the direct bonding reduces the thermal insulation gap between the electrical insulator 54 and the second surface 48 of the frame 44, which increases the heat transfer efficiency of the electronic assembly 40. In addition, by eliminating the need for a separately manufactured electrical insulating board (which is then mounted to a heat sink with hot grease therebetween), directly bonding the electrical insulator 54 to the second surface 48 of the frame 44 reduces costs and increases production yield. Furthermore, directly bonding the electrical insulator 54 to the second surface 48 of the frame 44 allows for a thinner layer of the electrical insulator 54, which reduces the size of the electronic assembly 40, improves the packaging characteristics of the electronic assembly 40, and reduces the thermal resistance between the semiconductor 56 and the coolant fluid.

[0034] like Figures 10A-11B As shown, the first surface 46 and the second surface 48 may be disposed opposite to each other such that the first surface 46 and the second surface 48 are separated from each other. The first surface 46 and the second surface 48 may be substantially parallel to each other. However, those skilled in the art will understand that the first surface 46 and the second surface 48 may be disposed in a non-parallel orientation, wherein the frame 44 extends between the first surface 46 and the second surface 48. Furthermore, the first surface 46 and the second surface 48 may have planar or non-planar constructions without departing from the scope of the invention.

[0035] Multiple cooling components 52 may extend substantially perpendicular to the first surface 46. For example... Figures 7-9 As shown, each of the plurality of cooling components 52 may have a cylindrical configuration. Furthermore, the plurality of cooling components 52 may extend from the first surface 46, spaced apart from each other, and substantially parallel to each other along the first surface 46 in a grid pattern. In this way, coolant fluid can flow freely around the plurality of cooling components 52, wherein heat is transferred to the flowing coolant fluid and transported away from the electronic component 40.

[0036] Further, each of the plurality of cooling members 52 can extend from a proximal end adjacent the first surface 46 to a distal end spaced apart from the first surface 46, with each of the plurality of cooling members 52 being truncated at the distal end. The distal end of each of the plurality of cooling members 52 can be spaced apart from any thermally conductive surface, such as the heat sink 42 itself or any other component of the electronic assembly 40, to limit the undesired transport of heat to anywhere other than the coolant fluid. For example, as shown in Figures 10A-11B The electronic assembly 40 can further include a coolant housing 58 coupled to the heat sink 42 and having an inner surface 60, with the inner surface 60 partially defining the cavity 50 for receiving the coolant fluid therein. The plurality of cooling members 52 and the coolant housing 58 can be completely spaced apart from one another to limit thermal transfer therebetween and enable looser tolerances on the length of the cooling members 52. In other words, spacing the distal end of each of the plurality of cooling members 52 apart from the coolant housing 58 or any thermally conductive surface facilitates efficient heat transfer from the heat sink 42 to the coolant fluid. Those skilled in the art will appreciate that the spacing between the plurality of cooling members 52 and the coolant housing 58 should be sized to prevent the coolant fluid from flowing between the plurality of cooling members 52 and the coolant housing 58, as opposed to around the cooling members 52. Those skilled in the art will appreciate that the plurality of cooling members 52 can have any suitable shape, size, and configuration to facilitate heat transfer to the coolant fluid.

[0037] The first surface 46 of the frame 44 of the heat sink 42 can have a generally planar configuration, with the heat sink 42 overlying the coolant housing 58 to define the cavity 50, with the heat sink 42 coupled to the coolant housing 58.

[0038] As shown in Figures 7-9 The electronic assembly 40 can have a partial annular configuration to surround the output shaft 26 of the motorized positive intake system 20. In other words, the electronic assembly 40 can be curved between a first end 62 and a second end 64 opposite the first end 62. The electronic assembly 40 can have a port 66 at each of the first end 62 and the second end 64. Each of the ports 66 open into the cavity 50 defined by the heat sink 42 (and the coolant housing 58 when present) and facilitate the flow of coolant fluid into and out of the cavity 50. More particularly, one of the ports 66 can be an inlet port through which the coolant fluid enters the cavity 50, and another of the ports 66 can be an outlet port through which the coolant fluid exits the cavity 50. In this way, the coolant fluid flows through the cavity 50 in a single direction between the first end 62 and the second end 64 to facilitate the movement of heated coolant fluid away from the electronic assembly 40. Those skilled in the art will appreciate that the heat sink 42 and the coolant housing 58 can have any suitable shape, size, and configuration to facilitate heat transfer from the heat sink 42 to the coolant fluid, as well as the flow of the coolant fluid away from the electronic assembly 40.

[0039] like Figures 10A-11B As shown, the electronic component 40 may further include a sealing member 68 that is compressed between the heat sink 42 and the coolant housing 58 to prevent coolant fluid from leaking between the heat sink 42 and the coolant housing 58. In other words, the sealing member 68 may occupy the gap between the heat sink 42 and the coolant housing 58 to prevent coolant fluid from leaking between the heat sink 42 and the coolant housing 58.

[0040] The coolant housing 58 may have a peripheral wall 70 at least partially surrounding the frame 44 of the radiator 42, wherein the sealing member 68 is compressed between the frame 44 of the radiator 42 and the peripheral wall 70 of the coolant housing 58. In one embodiment, one of the radiator 42 and the coolant housing 58 may define a recess 72 for receiving the sealing member 68 therein. Furthermore, the recess 72 positions and retains the sealing element to ensure engagement between the radiator 42 and the coolant housing 58 along the entire peripheral wall 70.

[0041] exist Figures 7-9 In the illustrated embodiment, the sealing member 68 is further defined as an O-ring. More specifically, the O-ring may have a circular cross-section. However, the sealing member 68 may have any suitable shape to prevent coolant fluid leakage between the radiator 42 and the coolant housing 58.

[0042] The sealing member 68 may be made of an elastomer capable of being compressed and sealed between the radiator 42 and the coolant housing 58; however, any suitable material may be used to seal between the radiator 42 and the coolant housing 58.

[0043] Although not shown in the accompanying drawings, the first surface 46 of the frame 44 can completely define the cavity 50, such that the heat sink 42 itself completely defines the cavity 50 (i.e., the electronic assembly 40 may not include a coolant housing). In other words, the cavity 50 can be defined within the frame 44 of the heat sink 42 itself, wherein the first surface 46 defines the entire periphery of the cavity 50. Those skilled in the art will understand that the electronic assembly 40 may include any number of components that completely or partially define the cavity 50 for receiving coolant fluid.

[0044] like Figures 10A-11BAs shown, the electrical insulator 54 can have an engagement surface 74 that abuts the second surface 48 of the frame 44; wherein the electrical insulator 54 is directly bonded to the second surface 48 along the engagement surface 74. In other words, the electrical insulator 54 can be placed along the second surface 48, wherein the engagement surface 74 of the electrical insulator 54 is directly bonded to the entire portion of the second surface 48 along which the electrical insulator 54 is placed. In this way, the electrical insulator 54 covers the second surface 48 of the frame 44. The electrical insulator 54 being directly bonded to the second surface 48 of the frame 44 along the engagement surface 74 substantially eliminates an air gap between the electrical insulator 54 and the frame 44 of the heat sink 42. In other words, the air gap between the electrical insulator 54 and the frame 44 of the heat sink 42 is so small that they are only visible at an atomic level. The presence of an air gap inhibits heat transfer between two adjacent thermally conductive materials. The substantial elimination of the air gap between the electrical insulator 54 and the frame 44 of the heat sink 42 facilitates efficient heat transfer between the electrical insulator 54 and the frame 44 of the heat sink 42. Furthermore, the substantial elimination of the air gap between the electrical insulator 54 and the frame 44 of the heat sink 42 eliminates the need for thermal grease therebetween, which is typically performed in the art (to fill the air gap with a thermally conductive material).

[0045] As Figure 7 , 8 and 10A-11B, the electrical insulator 54 can extend along the entire second surface 48 of the frame 44 to the perimeter wall 70; however, the electrical insulator 54 can extend along one or several portions of the second surface 48 of the frame 44.

[0046] The electrical insulator 54 (as its name implies) electrically insulates the semiconductor 56 from the heat sink 42 to prevent an electrical short between the semiconductor 56 and the heat sink 42. Furthermore, the electrical insulator 54 is also a thermal conductor that facilitates heat transfer from the semiconductor 56 (which heats up during operation) to the heat sink 42, which transfers the heat to the coolant fluid as described above.

[0047] The electrical insulator 54 can include at least one of an oxide and a nitride. Oxides and nitrides have desirable thermal conduction and electrical insulation properties that facilitate their use with the electrical insulator 54. Examples of suitable oxides / nitrides include (but are not limited to): aluminum oxide, aluminum nitride, boron nitride, magnesium oxide, and silicon oxide. However, those skilled in the art will appreciate that the electrical insulator 54 can include any material that is a thermal conductor and an electrical insulator 54.

[0048] As Figure 10A and 11AAs shown, the electrical insulator 54 can include a passivation layer 76 that is directly bonded to the second surface 48 of the frame 44 and is composed of at least one of an oxide and a nitride. Those skilled in the art will appreciate that "passivation" refers to the material becoming "passive," i.e., less susceptible to the effects or corrosion of the environment of future use. Passivation includes the creation of a shield outer layer that is applied as a micro-coating, created by a chemical reaction with the underlying material, or allowed to occur from spontaneous oxidation in air. As noted above, the heat sink 42 includes a metal, such as aluminum. Accordingly, in one embodiment, when the passivation layer 76 is composed of an oxide, the passivation layer 76 can be applied to the second surface 48 of the frame 44 by an anodization process. Further, in one embodiment, when the passivation layer 76 is composed of a nitride, the passivation layer 76 can be applied to the second surface 48 of the frame 44 by a nitriding process.

[0049] As shown in FIG. 1, the electrical insulator 54 can further include a polymer 74 that is directly bonded to the second surface 48 of the frame 44. The polymer 74 can be composed of any suitable material, such as a thermoplastic or thermoset polymer. Non-limiting examples of the polymer 74 include polyether ether ketone (PEEK), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), and polyamide 46 (PA46). However, those skilled in the art will appreciate that the polymer 74 can be any suitable material for use in the application. Figure 10B and Figure 11B As shown, the electrical insulator 54 can further include a polymer in which at least one of an oxide and a nitride is dispersed within the polymer. In other words, the polymer can act as a matrix in which atomized oxide and / or nitride (e.g., fine particles or granules) are dispersed within and held in place by the polymer. The atomized particles of oxide and / or nitride are in close proximity to one another to facilitate heat transfer between the particles from the semiconductor 56 to the heat sink 42. The polymer can be thermally conductive to facilitate heat transfer between the particles of oxide and / or nitride. The polymer can have a working temperature range suitable for use in the application, such as between -55°C + 180°C. The polymer can be resistant to chemicals that can be found in the application, such as from electronic manufacturing processes (such as solder flux) or from the motorized positive air intake system 20 (e.g., oil). Non-limiting examples of the polymer include polyether ether ketone (PEEK), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), and polyamide 46 (PA46). However, those skilled in the art will appreciate that the polymer can be any suitable material for use in dispersing the oxide and / or nitride therein.

[0050] Further, the electrical insulator 54 can include a composite coating 78 that is directly bonded to the second surface 48 of the frame 44 and is composed of a polymer and at least one of an oxide and a nitride dispersed within the polymer. The composite coating 78 can be applied to the second surface 48 of the frame 44 by any suitable process, including but not limited to: spray coating, roll coating transfer, dipping, and vapor deposition.

[0051] As shown in FIG. 1, the electrical insulator 54 can further include a polymer 74 that is directly bonded to the second surface 48 of the frame 44. The polymer 74 can be composed of any suitable material, such as a thermoplastic or thermoset polymer. Non-limiting examples of the polymer 74 include polyether ether ketone (PEEK), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), and polyamide 46 (PA46). However, those skilled in the art will appreciate that the polymer 74 can be any suitable material for use in the application. Figures 10A-11BAs shown, the electrical insulator 54 can extend from the second surface 48 of the frame 44 to a height H of 100 micrometers or less. In other words, the electrical insulator 54 is configured as a thin layer along the second surface 48, which reduces material cost and weight of the electronic component 40 while providing thermal conductivity and electrical insulation properties. Figure 7 , 8 The dimensions of the electrical insulator 54 shown in 10A-11B have been enlarged to better illustrate the details of the electrical insulator 54. Those skilled in the art will understand that the electrical insulator 54 can extend from the second surface 48 of the frame 44 to any suitable height H while maintaining the desired thermal conductivity and electrical insulation properties.

[0052] like Figure 10A and 10B As shown, semiconductor 56 can be directly coupled to electrical insulator 54. More specifically, semiconductor 56 can be directly adjacent to electrical insulator 54, wherein heat from semiconductor 56 is directly transferred to electrical insulator 54. Alternatively, a bonding agent (e.g., solder, adhesive, etc.) can be provided between semiconductor 56 and electrical insulator 54 to bond semiconductor 56 to electrical insulator 54.

[0053] As another alternative, electronic component 40 may further include a conductive layer 80 between the electrical insulator 54 and the semiconductor 56, such as Figure 11A and 11B As shown in the diagram, the conductive layer 80 conducts heat between the semiconductor 56 and the electrical insulator 54. Furthermore, the conductive layer 80 is electrically coupled to the semiconductor 56 to facilitate electrical transfer between the semiconductor 56 and the electric motor 24. In other words, the conductive layer 80 can be a circuit that electrically couples the semiconductor 56 to other electrical and / or electronic components.

[0054] The conductive layer 80 can be directly bonded to the electrical insulator 54. Alternatively, the conductive layer 80 may comprise a copper alloy. In one embodiment, the conductive layer 80 is bonded to the electrical insulator 54 by cold gas spray deposition of copper. In another embodiment, the conductive layer 80 is bonded to the electrical insulator 54 by printing onto it (i.e., the conductive layer 80 is formed from a thin layer of deposited material, or “printed” onto the surface of the electrical insulator 54). Alternatively, the conductive layer 80 can be bonded to the electrical insulator 54 by lamination. However, the conductive layer 80 can be directly bonded to the electrical insulator 54 by any suitable process or method. Furthermore, those skilled in the art will understand that any suitable material with the desired thermal and electrical properties can be used instead of a copper alloy.

[0055] Semiconductor 56 may be made entirely of semiconductor materials. Alternatively, semiconductor 56 may be made of multiple materials, wherein at least one of the materials comprises a semiconducting material. For example, such as Figures 10A-11BAs shown, the semiconductor 56 includes a semiconductor die 82 and a semiconductor package 84 at least partially encapsulating the semiconductor die 82. The semiconductor die 82 includes a semiconductor material. The semiconductor package 84 includes an electrically insulative material. The semiconductor package 84 encapsulates the semiconductor die 82 in such a way as to expose only the semiconductor die 82 to the electrically insulative body 54 (or components therebetween, such as the electrically conductive layer 80) and to protect the semiconductor die 82 from degradation by the environment. In this way, the semiconductor package 84 prevents electrical shorts between the semiconductor die 82 and other components that are external to the electronic assembly 40 but interface with the electronic assembly 40.

[0056] Those skilled in the art will appreciate that additional layers can be provided between the semiconductor 56 and the electrically insulative body 54. For example, the electronic assembly 40 can further include a thermally conductive pad 86 that can be provided between the semiconductor 56 and the electrically insulative body 54. As shown, Figure 11A and 11B As shown, the thermally conductive pad 86 can directly abut the semiconductor 56. The thermally conductive pad 86 can be constructed of a metallic material (e.g., a copper alloy) or any other material that is both thermally and electrically conductive.

[0057] As another example, the electronic assembly 40 can further include a solder 88 between the semiconductor 56 and the electrically insulative body 54 to secure the semiconductor 56 to the electrically insulative body 54 and to facilitate thermal conduction between the semiconductor 56 and the electrically insulative body 54. As shown, Figure 11A and 11B As shown, the solder 88 can be provided between the thermally conductive pad 86 and the electrically conductive layer 80 and utilize the electrically insulative body 54 and the electrically conductive layer 80 to secure the semiconductor 56 and the thermally conductive pad 86. However, the solder 88 can be provided anywhere between the semiconductor 56 and the electrically insulative body 54 to facilitate securing the semiconductor 56 to the electrically insulative body 54 and to facilitate thermal conduction between the semiconductor 56 and the electrically insulative body 54. The solder 88 can be at least partially constructed of tin or any other suitable material that facilitates thermal conduction, electrical conductivity, and bonding between components.

[0058] Similar to the electrically insulative body 54 described above, Figure 2 , 4 , 7, 8, 11A, and 11B have been exaggerated to better illustrate details of the thermally conductive pad 86 and the solder 88.

[0059] Figure 2 , 4FIGS. 7 and 8 show electronic assemblies 40 having two semiconductors 56. This configuration is illustrative in nature and is used to show a semiconductor 56 bonded directly to an electrical insulator 54 and a semiconductor 56 bonded to an electrical insulator with a conductive layer 80, a thermally conductive pad 86, and solder 88 therebetween. Those skilled in the art will appreciate that the electronic assembly 40 can be any number of semiconductors 56 positioned in any layout along the electrical insulator 54 with any number of components and combinations of components between the semiconductors 56 and the electrical insulator 54 without departing from the scope of the present application. Further, the electronic assembly 40 can include other electronic components (such as resistors, capacitors, inductors, etc.) without departing from the scope of the present application.

[0060] The present application has been described in an illustrative manner, and it is to be understood that the terminology which has been used is intended to be in the nature of words of description rather than of limitation. Many modifications and variations of the present application are possible in light of the above teachings. Therefore, it is to be understood that within the scope of the appended claims, wherein reference numerals are by way of example and not limitation, the application can be practiced other than as specifically described.

[0061] While the present application has been defined by reference to a detailed description of embodiments of the application, it should be understood that modifications can be made to the embodiments without departing from the scope of the present application, which is defined by the following claims:

[0062] 1. An electronic assembly for driving an electric motor and configured to receive a coolant fluid for cooling the electronic assembly, the electronic assembly comprising:

[0063] a heat sink comprising a thermally conductive material and further comprising:

[0064] a frame extending between a first surface and a second surface, wherein the first surface defines at least a portion of a cavity for receiving a coolant fluid therein; and

[0065] a plurality of cooling members coupled to and extending from the first surface of the frame into the cavity such that the plurality of cooling members are disposed within the coolant fluid in the cavity and can transfer heat between the heat sink and the coolant fluid;

[0066] an electrical insulator bonded directly to the second surface of the frame, wherein the electrical insulator is a thermal conductor; and

[0067] a semiconductor thermally coupled to the electrical insulator to facilitate heat transfer between the semiconductor and the heat sink, wherein the electrical insulator electrically insulates the semiconductor from the heat sink.

[0068] 2. The electronic assembly of Example 1, wherein the electrical insulator has an engagement surface that abuts the second surface of the frame, wherein the electrical insulator is directly bonded to the second surface entirely along the engagement surface.

[0069] 3. The electronic assembly of Example 1 or Example 2, wherein the electrical insulator comprises at least one of an oxide and a nitride.

[0070] 4. The electronic assembly of Example 3, wherein the electrical insulator comprises a passivation layer that is directly bonded to the second surface of the frame and is comprised of the at least one of the oxide and the nitride.

[0071] 5. The electronic assembly of Example 3 or Example 4, wherein the electrical insulator comprises a polymer, wherein the at least one of the oxide and the nitride is dispersed within the polymer.

[0072] 6. The electronic assembly of Example 5, wherein the electrical insulator comprises a composite coating that is directly bonded to the second surface of the frame and is comprised of the polymer and the at least one of the oxide and the nitride dispersed within the polymer.

[0073] 7. The electronic assembly of any one of Examples 1-6, wherein the electrical insulator extends a height of 100 microns or less from the second surface of the frame.

[0074] 8. The electronic assembly of any one of Examples 1-7, further comprising a conductive layer between the electrical insulator and the semiconductor, wherein the conductive layer conducts heat between the semiconductor and the electrical insulator, and wherein the conductive layer is electrically coupled to the semiconductor to facilitate electrical transmission between the semiconductor and the electric motor.

[0075] 9. The electronic assembly of Example 8, wherein the conductive layer is directly bonded to the electrical insulator.

[0076] 10. The electronic assembly of Example 8 or Example 9, wherein the conductive layer comprises a copper alloy.

[0077] 11. The electronic assembly of any one of Examples 1-10, wherein the first and second surfaces are disposed opposite one another such that the first and second surfaces are distanced from one another.

[0078] 12. The electronic assembly of any one of Examples 1-11, wherein the first and second surfaces are substantially parallel to one another.

[0079] 13. The electronic assembly of any of embodiments 1-12, wherein the plurality of cooling members extend substantially perpendicular to the first surface.

[0080] 14. The electronic assembly of any of embodiments 1-13, further comprising a coolant housing coupled to the heat spreader and having an inner surface, wherein the inner surface partially defines the cavity for receiving a coolant fluid therein.

[0081] 15. The electronic assembly of embodiment 14, wherein the plurality of cooling members and the coolant housing are completely separated from one another to limit heat transfer therebetween.

[0082] 16. The electronic assembly of embodiment 14 or embodiment 15, further comprising a sealing member compressed between the heat spreader and the coolant housing to prevent leakage of the coolant fluid between the heat spreader and the coolant housing.

[0083] 17. The electronic assembly of embodiment 16, wherein the sealing member is further defined as an O-ring.

[0084] 18. The electronic assembly of embodiment 16 or embodiment 17, wherein the coolant housing has a perimeter wall at least partially surrounding the frame of the heat spreader, wherein the sealing member is compressed between the frame of the heat spreader and the perimeter wall of the coolant housing.

[0085] 19. The electronic assembly of any of embodiments 1-18, further comprising a solder between the semiconductor and the electrical insulator to secure the semiconductor to the electrical insulator and to facilitate heat conduction between the semiconductor and the electrical insulator.

[0086] 20. The electronic assembly of any of embodiments 1-19, wherein the semiconductor is directly coupled to the electrical insulator.

[0087] 21. A motorized forced induction system for increasing airflow into an engine, the forced induction system comprising:

[0088] an electric motor;

[0089] an output shaft coupled to and driven by the electric motor;

[0090] a compressor impeller coupled to the output shaft such that the compressor impeller rotates with the output shaft, and wherein rotation of the compressor impeller is configured to compress air flowing into an engine; and

[0091] an electronic assembly electrically coupled with the electric motor to drive the electric motor to control rotation of the output shaft and compressor impeller, and configured to receive a coolant fluid for cooling the electronic assembly, the electronic assembly comprising:

[0092] a heat sink comprising a thermally conductive material and further comprising:

[0093] a frame extending between a first surface and a second surface, wherein the first surface defines at least a portion of a cavity for receiving a coolant fluid therein; and

[0094] a plurality of cooling members coupled to the first surface of the frame and extending from the first surface of the frame into the cavity such that the plurality of cooling members are disposed within the coolant fluid in the cavity and can transfer heat between the heat sink and the coolant fluid;

[0095] an electrical insulator directly bonded to the second surface of the frame, wherein the electrical insulator is a thermal conductor; and

[0096] a semiconductor thermally coupled to the electrical insulator to facilitate heat transfer between the semiconductor and the heat sink, wherein the electrical insulator electrically insulates the semiconductor from the heat sink.

[0097] 22. An auxiliary turbocharger system that receives air and produces exhaust gas for use with an engine, the auxiliary turbocharger system comprising:

[0098] a turbocharger configured to receive exhaust gas from an engine and proportionally increase a flow of air into the engine with a flow of exhaust gas from the engine; and

[0099] The motorized air induction system of claim 21, wherein the motorized air induction system is configured to increase the flow of air into the engine to supplement the flow of air from the turbocharger to the engine.

[0100] 23. The auxiliary turbocharger system of embodiment 22, wherein the turbocharger and the motorized air induction system are a single component.

[0101] 24. The auxiliary turbocharger system of embodiment 22, wherein the turbocharger and the motorized air induction system are separate components spaced apart from one another.

[0102] 25. An electronic assembly for driving an electric motor and configured to receive a coolant fluid for cooling an electronic assembly, the electronic assembly comprising:

[0103] a heat sink comprising a thermally conductive material and further comprising:

[0104] a frame extending between a first surface and a second surface, wherein the first surface defines at least a portion of a cavity for receiving a coolant fluid therein; and

[0105] a plurality of cooling members coupled to and extending from the first surface of the frame into the cavity such that the plurality of cooling members are disposed within the coolant fluid in the cavity and can transfer heat between the heat sink and the coolant fluid;

[0106] an electrical insulator directly bonded to the second surface of the frame, wherein the electrical insulator is a thermal conductor; and

[0107] a semiconductor thermally coupled to the electrical insulator to facilitate heat transfer between the semiconductor and the heat sink, wherein the electrical insulator electrically insulates the semiconductor from the heat sink;

[0108] wherein the electrical insulator has a bonding surface that abuts the second surface of the frame, wherein the electrical insulator is directly bonded to the second surface entirely along the bonding surface; and

[0109] wherein the electrical insulator comprises at least one of an oxide and a nitride.

Claims

1. An electronic assembly for driving an electric motor and configured to receive a coolant fluid for cooling electronic components, the electronic assembly comprising: a heat sink comprising a thermally conductive material and further comprising: a C-shaped frame having a first end and a second end opposite each other, a first port disposed proximate the first end for allowing the coolant fluid to enter the heat sink, a second port disposed proximate the second end for allowing the coolant fluid to exit the heat sink, the frame extending between a first surface and a second surface, wherein the first surface defines at least a portion of a cavity for receiving the coolant fluid; and a plurality of cooling members coupled to and extending from the first surface of the frame into the cavity such that the plurality of cooling members are disposed within the coolant fluid in the cavity and can transfer heat between the heat sink and the coolant fluid; an electrical insulator directly bonded to the second surface of the frame, wherein the electrical insulator is a thermal conductor; and a semiconductor thermally coupled to the electrical insulator to facilitate heat transfer between the semiconductor and the heat sink, wherein the electrical insulator electrically insulates the semiconductor from the heat sink, wherein the electrical insulator has a bonding surface abutting the second surface of the frame, wherein the electrical insulator is directly bonded to the second surface entirely along the bonding surface and the second surface of the frame.

2. The electronic assembly of claim 1, wherein the electrical insulator comprises at least one of an oxide and a nitride.

3. The electronic assembly of claim 2, wherein the electrical insulator comprises a passivation layer directly bonded to the second surface of the frame and composed of the at least one of the oxide and the nitride.

4. The electronic assembly of claim 2, wherein the electrical insulator comprises a polymer, wherein the at least one of the oxide and the nitride is dispersed within the polymer.

5. The electronic assembly of claim 4, wherein the electrical insulator comprises a composite coating directly bonded to the second surface of the frame and composed of the polymer and the at least one of the oxide and the nitride dispersed within the polymer.

6. The electronic assembly of claim 1, wherein the electrical insulator extends a height of 100 microns or less from the second surface of the frame.

7. The electronic assembly of any one of claims 1-6, further comprising an electrically conductive layer between the electrical insulator and the semiconductor, wherein the electrically conductive layer conducts heat between the semiconductor and the electrical insulator, and wherein the electrically conductive layer is electrically coupled to the semiconductor to facilitate electrical transmission between the semiconductor and the electric motor.

8. The electronic assembly of claim 7, wherein the electrically conductive layer is directly bonded to the electrical insulator, or wherein the electrically conductive layer comprises a copper alloy.

9. The electronic assembly of any of claims 1-6, wherein the first and second surfaces are disposed opposite one another such that the first and second surfaces are distanced from one another, or wherein the first and second surfaces are substantially parallel to one another; or wherein the plurality of cooling members extend substantially perpendicular to the first surface.

10. The electronic assembly of any of claims 1-6, further comprising a coolant housing coupled to the heat sink and having an inner surface, wherein the inner surface partially defines the cavity for receiving the coolant fluid.

11. The electronic assembly of claim 10, wherein the plurality of cooling members and the coolant housing are completely isolated from one another to limit heat transfer therebetween, or further comprising a sealing member compressed between the heat sink and the coolant housing to prevent leakage of the coolant fluid between the heat sink and the coolant housing.

12. The electronic assembly of claim 11, wherein the electronic assembly further comprises a sealing member compressed between the heat sink and the coolant housing to prevent leakage of the coolant fluid between the heat sink and the coolant housing, and wherein the sealing member is further defined as an O-ring.

13. The electronic assembly of claim 11, wherein the electronic assembly further comprises the sealing member compressed between the heat sink and the coolant housing to prevent leakage of the coolant fluid between the heat sink and the coolant housing, and wherein the coolant housing has a perimeter wall at least partially surrounding the frame of the heat sink, wherein the sealing member is compressed between the frame of the heat sink and the perimeter wall of the coolant housing.

14. The electronic assembly of any of claims 1-6, further comprising a solder between the semiconductor and the electrical insulator to secure the semiconductor to the electrical insulator and to promote heat conduction between the semiconductor and the electrical insulator; or wherein the semiconductor is directly coupled to the electrical insulator.

15. The electronic assembly for driving an electric motor and configured to receive a coolant fluid for cooling an electronic assembly of claim 1, wherein the electrical insulator has an engagement surface abutting the second surface of the frame, wherein the electrical insulator is directly bonded to the second surface completely along the engagement surface; and wherein the electrical insulator comprises at least one of an oxide and a nitride.

16. A motorized supercharging system for increasing airflow into an engine, the supercharging system comprising: an electric motor; an output shaft coupled to the electric motor and rotatably driven by the electric motor; a compressor impeller coupled to the output shaft such that the compressor impeller rotates with the output shaft, and wherein rotation of the compressor impeller is configured to compress air flowing into the engine; and and The electronic assembly of any of claims 1-6, electrically coupled with the electric motor to drive the electric motor to control rotation of the output shaft and compressor impeller, and configured to receive a coolant fluid for cooling the electronic assembly.

17. A supplemental turbocharger system that receives air and produces exhaust for use with an engine, the supplemental turbocharger system comprising: a turbocharger configured to receive exhaust from the engine and increase air flow into the engine in proportion to exhaust flow from the engine; and The motorized air induction system of claim 16, wherein the motorized air induction system is configured to increase air flow into the engine to supplement air flow from the turbocharger to the engine.

18. The supplemental turbocharger system of claim 17, wherein the turbocharger and the motorized air induction system are a single component, or wherein the turbocharger and the motorized air induction system are separate components spaced apart from one another.

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