Display device and method of manufacturing the same

Abstract

The present invention relates to a display device and a manufacturing method thereof. The display device includes: a display module; a first adhesive member including a thermal initiator and directly disposed on a rear surface of the display module; a sensor unit directly disposed on the first adhesive member; and a second adhesive member including a photoinitiator and directly disposed on at least a portion of the first adhesive member and the rear surface of the display module.

Description

[0001] This application claims priority to and all benefits of Korean Patent Application No. 10-2018-0066335, filed on Jun. 8, 2018, which is hereby incorporated by reference in its entirety. Technical Field

[0002] Exemplary embodiments of the present invention herein relate to a display apparatus, and more particularly, to a display apparatus and a method of manufacturing the same. Background Art

[0003] Various display devices have been developed for use in multimedia devices such as televisions, portable phones, tablet computers, navigation systems, and game consoles.

[0004] Various display devices may generally include a display panel for displaying an image, and an input sensing unit for sensing an external input. The display panel may include a display area in which an image is displayed and a frame area provided around the display area. Recently, a display device for reducing the frame area and for expanding the display area has been developed. In this case, since the frame area of ​​the display device is reduced, the driving component previously provided in the frame area may overlap with the display area. For example, a fingerprint recognition sensor overlapping with the display area has been developed.

[0005] The fingerprint recognition sensor may be adhered to the rear surface of the display panel by an adhesive member. The adhesive member may be hardened according to a temperature change caused by external heat provided from the outside. The adhesive member may firmly fix the fingerprint recognition sensor to the display panel by external heat. Summary of the invention

[0006] In order to provide external heat to the adhesive member, the display device may be moved into a chamber for providing heat. However, when the display device is moved, the adhesive member and the display panel may move relative to each other. As a result, the fingerprint recognition sensor may be misaligned with the sensing area in which the fingerprint is recognized.

[0007] The present invention can provide a display device capable of easily aligning a sensor unit with a sensing area, and a method for manufacturing the display device.

[0008] In an exemplary embodiment of the present invention, a display device includes: a display module; a first adhesive member including a first thermal initiator and directly disposed on a rear surface of the display module; a sensor unit directly disposed on the first adhesive member; and a second adhesive member including a first photoinitiator and directly disposed on at least a portion of the first adhesive member and the rear surface of the display module.

[0009] In an exemplary embodiment, the first thermal initiator may be activated by a temperature change, and the first photoinitiator may be activated by ultraviolet ("UV") light.

[0010] In an exemplary embodiment, the display module may include: a display area in which an image is displayed; and a bezel area adjacent to the display area. The sensor unit may overlap the display area.

[0011] In an exemplary embodiment, an opening overlapping the sensor unit may be defined in the first adhesive member, and the sensor unit may be surrounded by the first adhesive member in a plan view.

[0012] In exemplary embodiments, the sensor unit may be spaced apart from the rear surface of the display module by the first adhesive member.

[0013] In an exemplary embodiment, the sensor unit may include: a sensor overlapping the opening and a package in which the sensor is disposed (eg, mounted). The package may be directly disposed on the first adhesive member.

[0014] In an exemplary embodiment, the sensor unit may include an optical type fingerprint recognition sensor.

[0015] In an exemplary embodiment, the first adhesive member may overlap the entire sensor unit and may be disposed between the display module and the sensor unit.

[0016] In an exemplary embodiment, the sensor unit may include an ultrasonic type fingerprint recognition sensor.

[0017] In an exemplary embodiment, the first adhesive member and the second adhesive member may constitute a single integral body on the rear surface of the display module. The first adhesive member may further include a second photoinitiator, and the second adhesive member may further include a second thermal initiator.

[0018] In an exemplary embodiment, the display device may further include a circuit board electrically connected to the display module and disposed on the rear surface of the display module. A hole area may be defined in the circuit board, and the sensor unit may be inserted into the hole area and may be directly disposed on the first adhesive member.

[0019] In an exemplary embodiment, the display module may include: a substrate; a display element layer disposed on the substrate; an encapsulation member disposed on the display element layer; and an input sensing unit disposed on the encapsulation member. The first adhesive member and the second adhesive member may be disposed on a rear surface of the substrate, the rear surface of the substrate corresponding to the rear surface of the display module.

[0020] In an exemplary embodiment of the present invention, a display device includes: a display module, including: a display area, an image is displayed in the display area; and a frame area, adjacent to the display area; a protective member, overlapping with a portion of the display area and disposed on a rear surface of the display module; a sensor unit, overlapping with a portion of the display area and disposed on the protective member; and an adhesive member, overlapping with the sensor unit and adhering the sensor unit to the protective member.

[0021] In an exemplary embodiment, a folding area and a non-folding area adjacent to the folding area may be defined in the display module, and the non-folding area may overlap with the sensor unit. The protective member may overlap with the non-folding area.

[0022] In an exemplary embodiment of the present invention, a method for manufacturing a display device includes: applying a first adhesive member to a rear surface of a substrate in which a display area and a bezel area adjacent to the display area are defined; disposing a sensor unit on the first adhesive member; applying a second adhesive member to at least a portion of the first adhesive member and the rear surface of the substrate; irradiating UV light onto the second adhesive member; and providing external heat to the first adhesive member.

[0023] In an exemplary embodiment, the first adhesive member may include a thermal initiator and may be applied to the rear surface of the substrate by a first application device to overlap with the display area. The second adhesive member may include a photoinitiator and may be applied to the rear surface of the substrate by a second application device to overlap with the display area.

[0024] In an exemplary embodiment, the first adhesive member and the second adhesive member may be applied to the rear surface of the substrate by one applying device, and the first adhesive member may include a first thermal initiator and a first photoinitiator, and the second adhesive member may include a second thermal initiator and a second photoinitiator.

[0025] In an exemplary embodiment, applying the second adhesive member and irradiating the UV light may be performed simultaneously.

[0026] In an exemplary embodiment, the first adhesive member may be applied such that the entire sensor unit overlaps with the first adhesive member.

[0027] In an exemplary embodiment, the first adhesive member may be applied such that the sensor unit is surrounded by the first adhesive member in a plan view. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate exemplary embodiments of the present invention and together with the description serve to explain the principles of the present invention. In the accompanying drawings:

[0029] Figure 1 is a perspective view showing an exemplary embodiment of a display device according to the present invention;

[0030] Figure 2 is an exploded perspective view showing an exemplary embodiment of a display device according to the present invention;

[0031] Figure 3A is a cross-sectional view showing an exemplary embodiment of a display module according to the present invention;

[0032] Figure 3B is a cross-sectional view showing another exemplary embodiment of a display module according to the present invention;

[0033] Figure 4 is a plan view showing an exemplary embodiment of a display panel according to the present invention;

[0034] Figure 5 yes Figure 4 An equivalent circuit diagram of a pixel shown in ;

[0035] Figure 6 is along Figure 2 A cross-sectional view taken along line II';

[0036] Figure 7 is a plan view showing an exemplary embodiment of a rear surface of a display module according to the present invention;

[0037] Figure 8 is a flow chart showing an exemplary embodiment of a method for manufacturing a display device according to the present invention;

[0038] 9A to 9D It is shown Figure 8 A perspective view of a method for manufacturing a display device in FIG.

[0039] Fig. 10A is a cross-sectional view showing another exemplary embodiment of a display device according to the present invention;

[0040] Fig. 10B It shows that the setting Fig. 10A An exploded perspective view of a sensor on a rear surface of a substrate shown in FIG.

[0041] Fig.11A and Fig. 11B is a perspective view showing another exemplary embodiment of a method for manufacturing a display device according to the present invention;

[0042] Fig. 12A is a plan view showing another exemplary embodiment of a circuit board and a display panel according to the present invention;

[0043] Fig. 12B It is shown that Fig. 12A A cross-sectional view of a display device including a circuit board and a display panel;

[0044] Fig. 12C It is shown that Fig. 12A A cross-sectional view of a display device according to a modified example of a circuit board and a display panel;

[0045] Fig.13A is a plan view showing another exemplary embodiment of a rear surface of a display device according to the present invention; and

[0046] Fig. 13B It is shown Fig.13A A cross-sectional view of a display device. DETAILED DESCRIPTION

[0047] The present invention will now be described more fully hereinafter with reference to the accompanying drawings in which various exemplary embodiments are shown. However, the present invention may be embodied in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. On the contrary, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and so that the scope of the present invention is fully communicated to those skilled in the art. The same reference numerals refer to the same elements throughout.

[0048] It should be understood that when an element such as a layer, region, or substrate is referred to as being "on" another element, the element can be directly on the other element, or there can be intervening elements. In contrast, the term "directly" means that there are no intervening elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0049] The terms used herein are only for the purpose of describing specific exemplary embodiments and are not intended to be limiting. As used herein, the singular forms "one" and "the" are intended to include plural forms (including "at least one") unless the context clearly indicates otherwise. "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more items in the associated listed items. It will be further understood that when used in this specification, the term "includes" or "comprising" specifies the presence of stated features, regions, entireties, steps, operations, elements and / or parts, but does not exclude the presence or addition of one or more other features, regions, entireties, steps, operations, elements, parts and / or their groups.

[0050] For ease of description, spatially relative terms such as "below," "below," "below," "above," and "above" may be used herein to describe the relationship of one element or feature shown in the figures relative to another element or feature. It should be understood that, in addition to the orientation depicted in the figures, the spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as being "below" or "below" other elements or features will be oriented "above" the other elements or features. Therefore, the exemplary term "below" can cover both above and below orientations. The device can be positioned in another manner (e.g., rotated 90 degrees or otherwise positioned), and the spatially relative descriptors used herein are interpreted accordingly.

[0051] It should be understood that although the terms first, second, etc. can be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of this article, the first element, first component, first region, first layer or first part discussed below can be referred to as the second element, second component, second region, second layer or second part.

[0052] As used herein, "about" or "approximately" includes stated values ​​and averages within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system).

[0053] Exemplary embodiments are described herein with reference to cross-sectional illustrations and / or plan illustrations that are idealized exemplary illustrations. In the accompanying drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations, for example, caused by manufacturing. For example, an etched region shown as a rectangle will typically have rounded or curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0054] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0055] Figure 1 is a perspective view showing a display apparatus according to an exemplary embodiment of the present invention. Figure 2 is an exploded perspective view showing a display apparatus according to an exemplary embodiment of the present invention. Figure 3A is a cross-sectional view illustrating a display module according to an exemplary embodiment of the present invention. Figure 3B is a cross-sectional view showing a display module according to another exemplary embodiment of the present invention.

[0056] refer to Figure 1 , the display device DD can display the image IM through the display surface DD-IS. In the exemplary embodiment shown, a display device DD including a flat display surface DD-IS is shown. However, the present invention is not limited to this. In other exemplary embodiments, the display device DD may include a curved display surface or a three-dimensional ("3D") display surface. The 3D display surface may include a plurality of display areas extending in different directions from each other. In an exemplary embodiment, the 3D display surface may include, for example, a polygonal columnar display surface.

[0057] In an exemplary embodiment, the display device DD may be a flexible display device. However, the present invention is not limited thereto. In another exemplary embodiment, the display device DD may be a rigid display device.

[0058] In addition, even if not shown in the figure, the electronic module, camera module and power module arranged (e.g., mounted) on the mainboard can be arranged in a bracket and / or a housing together with the display device DD to constitute a mobile phone. The display device DD according to the present invention can be applied to large-sized electronic devices (e.g., televisions and monitors) and small and medium-sized electronic devices (e.g., tablet computers, car navigation units, game consoles and smart watches).

[0059] The display surface DD-IS may be parallel to a plane defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface DD-IS (i.e., the thickness direction of the display device DD) may be indicated by a third direction DR3. The front surface (or top surface) and the rear surface (or bottom surface) of each of the components or units described below may be defined by a third direction DR3. However, the first direction DR1, the second direction DR2, and the third direction DR3 in the illustrated exemplary embodiments are illustrated as examples of the present invention, and the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be changed to opposite directions.

[0060] like Figure 1 As shown, the display surface DD-IS may include a display area DD-DA in which the image IM is displayed, and a frame area DD-NDA adjacent to the display area DD-DA. The image IM may not be displayed in the frame area DD-NDA. Figure 1 , application icons and a clock frame are shown as examples of image IM.

[0061] In the exemplary embodiment shown, in a plan view, the display area DD-DA may have a rectangular shape, and the frame area DD-NDA may have a shape surrounding the display area DD-DA. However, the present invention is not limited thereto. The shapes of the display area DD-DA and the frame area DD-NDA may be variously designed. In an exemplary embodiment, the frame area DD-NDA may be set to be adjacent to only one side of the display area DD-DA, or may be omitted, for example.

[0062] refer to Figure 2 , the display device DD may include a window member WM, a display module DM, a circuit board PCB, and a receiving member BC.

[0063] The window member WM may be disposed on the display module DM and may transmit an image provided from the display module DM through the transmission area TA. In detail, the window member WM may include a transmission area TA and a non-transmission area NTA. The transmission area TA may overlap with the display area DD-DA and may have a shape corresponding to the shape of the display area DD-DA. The image IM displayed in the display area DD-DA of the display device DD may be visible to the outside world through the transmission area TA of the window member WM.

[0064] The non-transmission area NTA may overlap with the frame area DD-NDA and may have a shape corresponding to the shape of the frame area DD-NDA. The transmittance of the non-transmission area NTA may be less than the transmittance of the transmission area TA. However, the present invention is not limited thereto. In another exemplary embodiment, the non-transmission area NTA may be omitted.

[0065] In an exemplary embodiment, the window member WM may include, for example, glass, sapphire or plastic. Figure 2 In the embodiment of the present invention, the window member WM may include a single layer. However, the present invention is not limited thereto. In an alternative exemplary embodiment, the window member WM may include a plurality of layers. In an exemplary embodiment, the window member WM may include a base layer and at least one printed layer disposed on the rear surface of the base layer. The printed layer may overlap with the non-transmissive area NTA. The printed layer may have a predetermined color. In an exemplary embodiment, the printed layer may have, for example, black or may have other colors different from black.

[0066] According to an exemplary embodiment of the present invention, the transmissive area TA may include a sensing area FSA. The sensing area FSA may overlap the transmissive area TA and may be an area for recognizing a fingerprint.

[0067] If the sensing area FSA overlaps only with the non-transmission area NTA, the area (or size) of the non-transmission area NTA may be increased by the area (or size) of the sensing area FSA. However, according to an exemplary embodiment of the present invention, the sensing area FSA may overlap with the transmission area TA (i.e., the display area DD-DA) in the display device DD, and thus the area (or size) of the non-transmission area NTA may be reduced. As a result, the area (or size) of the transmission area TA may be increased or expanded.

[0068] The sensor unit overlapping the sensing area FSA may be disposed on the rear surface of the display module DM, which will be described in detail later.

[0069] The display module DM may be disposed between the window member WM and the receiving member BC. The display module DM may include a display panel DP and an input sensing unit ISU.

[0070] The display panel DP may generate an image and may provide the generated image to the window member WM. According to some exemplary embodiments of the present invention, the display panel DP may be, but is not limited to, an organic light emitting display panel, a liquid crystal display panel, or a quantum dot light emitting display panel. The organic light emitting display panel may include an organic light emitting element. The liquid crystal display panel may include liquid crystal molecules. The quantum dot light emitting display panel may include quantum dots or quantum rods.

[0071] Hereinafter, a case where the display panel DP is an organic light emitting display panel will be described as an example. However, the present invention is not limited thereto. In other words, the exemplary embodiments of the present invention may apply other various display panels.

[0072] The input sensing unit ISU may be provided between the window member WM and the display panel DP. The input sensing unit ISU may sense an external input provided from the outside. The external input may be provided in various forms. In an exemplary embodiment, the external input may include at least one of various external inputs such as a part of the user's body (e.g., a finger), a stylus, light, heat, and pressure. In addition, the external input may include, for example, a close spatial touch (e.g., a hovering touch) and a touch of a part of the user's body.

[0073] The input sensing unit ISU may be directly disposed on the display panel DP. In the exemplary embodiment shown, the input sensing unit ISU may be integrated with the display panel DP through a continuous process. However, the present invention is not limited thereto. In another exemplary embodiment, the input sensing unit ISU may be provided as a separate panel and then may be coupled to the display panel DP through an adhesive member.

[0074] The containing member BC may be coupled to the window member WM. The containing member BC may provide a rear surface of the display device DD and may be coupled to the window member WM to define an internal space. The containing member BC may include a material having a relatively high rigidity. In an exemplary embodiment, the containing member BC may include a plurality of frames and / or plates including, for example, glass, plastic, and / or metal. The containing member BC may stably protect the components of the display device DD contained in the internal space of the containing member BC from external impacts.

[0075] In the above description, the containing member BC may include a material having high rigidity. However, the present invention is not limited thereto. In another exemplary embodiment, the containing member BC may include a flexible material. Although not shown in the drawings, the display device DD according to some exemplary embodiments of the present invention may be foldable or bendable. Therefore, at least some components included in the display device DD may also have flexibility.

[0076] refer to Figure 3A , the display module DM according to the exemplary embodiment will be described in detail. The display module DM may include a reference Figure 2 The display panel DP and the input sensing unit ISU are described.

[0077] The display panel DP may include a substrate SUB, a circuit layer COL, a display element layer ED, and an encapsulation member ECL. The display panel DP may include a display area DP-DA and a frame area DP-NDA. The display area DP-DA and the frame area DP-NDA of the display panel DP may be respectively connected to the reference Figure 1 The display area DD-DA and the bezel area DD-NDA of the described display device DD overlap. In some exemplary embodiments, the bezel area DP-NDA may be adjacent to one side of the display area DP-DA or may be omitted.

[0078] The substrate SUB may support components of the display panel DP and the input sensing unit ISU, and may include a flexible material. In an exemplary embodiment, the substrate SUB may include, for example, a plastic substrate, a glass substrate, or an organic / inorganic composite substrate. In an alternative exemplary embodiment, the substrate SUB may have a stacked structure including a plurality of insulating layers. In an exemplary embodiment, the plastic substrate may include, for example, at least one of an acrylic-based resin, a methacrylic-based resin, polyisoprene, a vinyl resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyimide-based resin, a polyamide-based resin, or a perylene-based resin.

[0079] The circuit layer COL may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer COL may include signal lines and / or control circuits of pixels.

[0080] The display element layer ED may overlap the display area DP-DA and may be disposed on the substrate SUB. The display element layer ED may include a display element, such as an organic light emitting diode. However, the present invention is not limited thereto. In other exemplary embodiments, the display element layer ED may include an inorganic light emitting diode or an organic-inorganic hybrid light emitting diode depending on the type of the display panel DP.

[0081] The encapsulation member ECL may encapsulate the display element layer ED. In an exemplary embodiment, the encapsulation member ECL may, for example, overlap with the display area DP-DA and the frame area DP-NDA. In an alternative exemplary embodiment, the encapsulation member ECL may overlap with the display area DP-DA, but may not overlap with the frame area DP-NDA.

[0082] In an exemplary embodiment, the encapsulation member ECL may be, for example, an encapsulation substrate. The encapsulation member ECL may protect the display element layer ED from foreign impurities such as moisture, oxygen, and / or dust particles. The encapsulation member ECL may be coupled to the substrate SUB by a sealing member SLP. In an exemplary embodiment, the sealing member SLP may include, for example, glass frit. However, the material of the sealing member SLP is not limited thereto.

[0083] The input sensing unit ISU may overlap the display area DP-DA and may be disposed on the encapsulation member ECL.

[0084] exist Figure 3A In the embodiment, the input sensing unit ISU may be directly disposed on the encapsulation member ECL through a continuous process. However, the present invention is not limited thereto. In another exemplary embodiment, an adhesive member (not shown) may be disposed between the input sensing unit ISU and the encapsulation member ECL, and the input sensing unit ISU may be directly disposed on (e.g., adhered to) the encapsulation member ECL through the adhesive member.

[0085] refer to Figure 3B , the display module DMa may include a display panel DPa and an input sensing unit ISUa. Figure 3B The encapsulation component ECLa of the display module DMa can be Figure 3A The encapsulation member ECL of the display module DM is different, and Figure 3B The other components of the display module DMa can be respectively Figure 3A The other components of the display module DM are substantially the same.

[0086] The display panel DPa may include a substrate SUB, a circuit layer COL, a display element layer ED, and an encapsulation member ECLa.

[0087] The encapsulation component ECLa may encapsulate the display element layer ED. In an exemplary embodiment, the encapsulation component ECLa may, for example, overlap with the display area DP-DA and the frame area DP-NDA. In an alternative exemplary embodiment, the encapsulation component ECLa may overlap with the display area DP-DA, but may not overlap with the frame area DP-NDA. The encapsulation component ECLa may include at least one insulating layer. In an exemplary embodiment, the encapsulation component ECLa may include at least one encapsulation organic layer and at least one encapsulation inorganic layer.

[0088] The encapsulation inorganic layer may protect the display element layer ED from moisture / oxygen, and the encapsulation organic layer may protect the display element layer ED from foreign impurities such as dust particles. In an exemplary embodiment, the encapsulation inorganic layer may include, but is not limited to, for example, at least one of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. In an exemplary embodiment, the encapsulation organic layer may include, but is not limited to, for example, an acrylic-based organic layer.

[0089] The input sensing unit ISUa may be directly disposed on the encapsulation member ECLa through a continuous process. In an alternative exemplary embodiment, the input sensing unit ISUa may be coupled to the encapsulation member ECLa through an adhesive member. In this case, the input sensing unit ISUa may include a base layer and a sensing circuit layer. The sensing circuit layer may include multiple insulating layers and multiple conductive layers.

[0090] Figure 4 is a plan view showing a display panel according to an exemplary embodiment of the present invention. Figure 5 yes Figure 4 The equivalent circuit diagram of a pixel is shown in FIG.

[0091] refer to Figure 4 , the display panel DP may include a driving circuit GDC, a plurality of signal lines SGL, a plurality of first pads PD1 disposed in a first bonding region SPD, and a plurality of pixels PX.

[0092] The pixels PX may be disposed in the display area DP-DA. Each of the pixels PX may include an organic light emitting diode and a pixel driving circuit connected to the organic light emitting diode. The driving circuit GDC, the signal line SGL, the first pad PD1, and the pixel driving circuit may be included in Figure 3A In the circuit layer COL shown in FIG.

[0093] The drive circuit GDC may be a scan drive circuit. The drive circuit GDC may generate a plurality of scan signals and may sequentially output the scan signals to a plurality of scan lines GL to be described below. The drive circuit GDC may further output other control signals to the pixel drive circuit of the pixel PX.

[0094] The driving circuit GDC may include a plurality of thin film transistors provided by the same process as that of providing a pixel driving circuit of the pixel PX (eg, a low temperature polysilicon (“LTPS”) process or a low temperature polycrystalline oxide (“LTPO”) process).

[0095] The signal lines SGL may be disposed on the substrate SUB. The signal lines SGL may include scan lines GL, data lines DL, power lines PL, and control signal lines CSL. Each of the scan lines GL may be connected to a corresponding one of the pixels PX, and each of the data lines DL may be connected to a corresponding one of the pixels PX. The power lines PL may be connected to the pixels PX. The control signal lines CSL may provide control signals to the drive circuit GDC.

[0096] The signal line SGL may overlap the display area DP-DA and the frame area DP-NDA. Each of the signal lines SGL may include a pad portion and a line portion. The line portion may overlap the display area DP-DA and the frame area DP-NDA. The pad portion may be connected to an end of the line portion. The pad portion may be provided in the frame area DP-NDA and may correspond to each of the first pads PD1 provided in the first bonding area SPD.

[0097] The circuit board PCB may be connected to the display panel DP and may include a plurality of second pads PD2 disposed in the second bonding region DPD. The second pads PD2 may be electrically bonded to the first pads PD1 disposed in the first bonding region SPD of the display panel DP, so that a plurality of driving signals may be transmitted to the display panel DP through the first pads PD1 and the second pads PD2. The circuit board PCB may be rigid or flexible. In an exemplary embodiment, when the circuit board PCB is flexible, for example, a flexible printed circuit board may be used as the circuit board PCB.

[0098] For ease of description, Figure 4 , the circuit board PCB and the display panel DP are shown as being separated from each other. However, a portion of the circuit board PCB may be connected to a portion of the bezel area DP-NDA of the display panel DP, and the circuit board PCB may overlap the display area DP-DA and the bezel area DP-NDA. In an exemplary embodiment, as shown in FIG. Figure 2As shown, the circuit board PCB may be bent along one side surface of the substrate SUB so as to be disposed on, for example, the rear surface of the display panel DP.

[0099] In this case, the circuit board PCB may overlap the sensing area FSA in a plan view, or may not overlap the sensing area FSA in a plan view.

[0100] Figure 5 One scan line GL, one data line DL, a power line PL, and pixels PX connected to the lines GL, DL, and PL are shown. However, the configuration of the pixel PX is not limited to Figure 5 , but various modifications can be made.

[0101] The pixel PX may include an organic light emitting diode OLED and a pixel driving circuit.

[0102] The organic light emitting diode OLED may be a front surface light emitting diode or a rear surface light emitting diode. The pixel PX may include a first transistor (or a switching transistor) T1, a second transistor (or a driving transistor) T2, and a capacitor Cst, which constitute a pixel driving circuit for driving the organic light emitting diode OLED. A first power supply voltage ELVDD may be provided to the second transistor T2, and a second power supply voltage ELVSS may be provided to the organic light emitting diode OLED. The second power supply voltage ELVSS may be lower than the first power supply voltage ELVDD.

[0103] The first transistor T1 may output a data signal applied to the data line DL in response to a scan signal applied to the scan line GL. The capacitor Cst may be charged with a voltage corresponding to the data signal received from the first transistor T1. The second transistor T2 may be connected to the organic light emitting diode OLED. The second transistor T2 may control a driving current flowing through the organic light emitting diode OLED in response to an amount of charge stored in the capacitor Cst.

[0104] The equivalent circuit is shown as an example of a pixel PX, and the present invention is not limited thereto. In other exemplary embodiments, the pixel PX may also include a plurality of transistors and / or may include two or more capacitors. In other exemplary embodiments, the organic light emitting diode OLED may be connected between the power line PL and the second transistor T2.

[0105] Figure 6 is along Figure 2 A cross-sectional view taken along line II'. Figure 7 is a plan view showing a rear surface of a display module according to an exemplary embodiment of the present invention.

[0106] and Figure 2 Compared to the display device DD shown in Figure 6 The illustrated display device DD may further include a polarization layer POL, a window adhesive member AM, a sensor unit SU, and an adhesive member AU.

[0107] The polarizing layer POL may be disposed between the display module DM and the window member WM. The polarizing layer POL may polarize external light incident through the window member WM, and thus may prevent the circuit elements included in the display module DM from being visible to the outside world. In some exemplary embodiments, the polarizing layer POL may be omitted. The window adhesive member AM may be disposed between the polarizing layer POL and the window member WM to adhere the window member WM to the polarizing layer POL. In an exemplary embodiment, the window adhesive member AM may include, for example, an optically transparent adhesive film, an optically transparent resin, or a pressure-sensitive adhesive film.

[0108] As above reference Figure 2 As described above, the sensing area FSA for identifying an external fingerprint may overlap with the display area DP-DA. However, the present invention is not limited thereto. In another exemplary embodiment, a portion of the sensing area FSA may overlap with the bezel area DP-NDA.

[0109] The sensor unit SU may overlap the sensing area FSA and may be disposed on the rear surface of the substrate SUB. The sensor unit SU may include a sensor SS, and a housing SP in which the sensor SS is disposed (eg, mounted).

[0110] According to some exemplary embodiments of the present invention, the sensor SS may be a fingerprint recognition sensor and may be operated, for example, in an optical, ultrasonic, or capacitive manner. However, the present invention is not limited to exemplary embodiments in which the sensor SS is a fingerprint recognition sensor. In other exemplary embodiments, the sensor SS may include, for example, a camera, a pressure-sensitive sensor, a proximity sensor, a brightness sensor, and / or a temperature sensor disposed under the substrate SUB.

[0111] In the following, the optical fingerprint recognition sensor will be described as Figure 6 An example of a sensor SS of the sensor unit SU of the exemplary embodiment is shown in FIG. The optical type fingerprint recognition sensor may irradiate light to a fingerprint and may then sense light reflected by the fingerprint to recognize the fingerprint.

[0112] The sensing area FSA may include an identification area IA and a bonding area BA surrounding the identification area IA in a plan view. The sensor SS may overlap the identification area IA to identify the fingerprint, and the housing SP may overlap the identification area IA and the bonding area BA. In other words, the housing SP may overlap the entire sensing area FSA.

[0113] The sensor SS facing the substrate SUB may be disposed (eg, mounted) in the housing SP, and the housing SP may transmit a signal sensed from the sensor SS to the circuit board PCB. Even though not shown in the drawings, the housing SP may include a control circuit electrically connected to the circuit board PCB and the sensor SS.

[0114] The adhesive member AU may adhere the sensor unit SU to the substrate SUB. The adhesive member AU may include a first adhesive member ADm and a second adhesive member ADa.

[0115] The first adhesive member ADm may be disposed on the rear surface of the substrate SUB, and more specifically, may be disposed between the housing SP and the substrate SUB. The first adhesive member ADm may not overlap the identification area IA but may overlap the bonding area BA.

[0116] The first adhesive member ADm may be disposed on the rear surface of the substrate SUB to surround the sensor SS in a plan view. Therefore, an opening OP may be defined between the substrate SUB and the sensor unit SU disposed on the first adhesive member ADm. The sensor SS may receive light reflected from the fingerprint through the opening OP defined by the first adhesive member ADm.

[0117] According to an exemplary embodiment of the present invention, the first adhesive member ADm may include a thermal initiator that is activated under the condition that heat is provided. The thermal initiator of the first adhesive member ADm may be activated according to a temperature change caused by heat provided from the outside. A thermal initiator may change according to the temperature of the heat provided in the process of manufacturing the display device DD and / or the processing time of the high temperature process.

[0118] Therefore, after the first adhesive member ADm is disposed between the housing SP and the substrate SUB, heat may be provided to the first adhesive member ADm from the outside. As a result, the first adhesive member ADm may be hardened by external heat, and the housing SP and the substrate SUB may be fixed to each other by the first adhesive member ADm.

[0119] In an exemplary embodiment, the thermal initiator included in the first adhesion member ADm may include, for example, tert-amyl peroxybenzoate, 4,4'-azobis(4-cyanovaleric acid), 1,1'-azobis(cyanocyclohexane), azobisisobutylnitrile ("AIBN"), 2,2-bis(tert-butylperoxy)butane, 1,1-bis(tert-butylperoxy)cyclohexane, benzoyl peroxide ("BPO"), 2,5-bis(tert-butylperoxy)-2,5- At least one of dimethylhexane, bis[1-(tert-butylperoxy)-1-methylethyl]benzene, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, tert-butyl hydroperoxide, tert-butyl peracetate, tert-butyl peroxide, tert-butyl perbenzoate, tert-butyl peroxyisopropyl carbonate, cumene hydroperoxide, cyclohexanone peroxide, diisopropylbenzene peroxide, dodecanoyl peroxide, 2,4-pentanedione peroxide, or potassium peroxodisulfate.

[0120] In order to harden the first adhesive member ADm disposed between the housing SP and the substrate SUB, the display device DD may be moved into a chamber or device for providing heat. However, when heat is not provided to the first adhesive member ADm, the first adhesive member ADm and the substrate SUB may not be firmly fixed to each other. As a result, the first adhesive member ADm and the substrate SUB may move relative to each other, and thus the first adhesive member ADm may not be accurately aligned with the sensing area FSA.

[0121] However, according to an exemplary embodiment of the present invention, the second adhesive member ADa may adhere the first adhesive member ADm to the substrate SUB. The second adhesive member ADa according to an exemplary embodiment of the present invention may include a photoinitiator activated by ultraviolet ("UV") light.

[0122] Specifically, the second adhesive member ADa may be disposed on at least a portion of the first adhesive member ADm and the substrate SUB, and UV light may be irradiated from the outside onto the second adhesive member ADa. The second adhesive member ADa may be hardened by irradiation of UV light, and thus the first adhesive member ADm and the substrate SUB may be fixed to each other by the second adhesive member ADa. In particular, the second adhesive member ADa may not overlap with the sensor unit SU, and may be directly disposed on (e.g., adhered to) at least a portion of the first adhesive member ADm and the substrate SUB.

[0123] As a result, the first adhesive member ADm may be fixed to the substrate SUB through the second adhesive member Ada hardened by the UV light, and thus the first adhesive member ADm may be accurately aligned with the sensing area FSA.

[0124] External UV light may not be irradiated onto the first adhesive member ADm between the substrate SUB and the housing SP overlapping the sensing area FSA. This may be because the UV light is reflected by the sensor unit SU of the metal material. Therefore, the first adhesive member ADm according to an exemplary embodiment of the present invention may include a thermal initiator and may be hardened by a heat treatment process.

[0125] In one exemplary embodiment, the photoinitiator included in the second adhesion member ADa may include, for example, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methylpropan-1-one, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-one. )-butanone-1, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphinate, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, [1-(4-phenylsulfanylbenzoyl)heptylamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethyleneamino]acetate, or at least one of bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrrolyl)phenyl]titanium(IV).

[0126] refer to Figure 7 , the sensor unit SU, the adhesive member AU, and the circuit board PCB may be disposed on a rear surface SUB-BS of the substrate SUB.

[0127] The sensor SS of the sensor unit SU may be disposed (e.g., mounted) in the housing SP to face the back surface SUB-BS. The first adhesive member ADm may surround the sensor SS on the back surface SUB-BS in a plan view. In addition, the first adhesive member ADm may overlap a portion of the housing SP in a plan view. In other words, the first adhesive member ADm may be directly disposed (e.g., adhered to) the housing SP and the back surface SUB-BS.

[0128] The second adhesive member ADa may overlap a portion of the first adhesive member ADm, and may be directly disposed on (eg, adhered to) the first adhesive member ADm and the back surface SUB-BS. Figure 7As shown, the second adhesion member ADa may be disposed at each of the corners of the first adhesion member ADm. In an exemplary embodiment, the second adhesion member ADa may be disposed at each of the vertices of the first adhesion member ADm in a plan view. However, for example, the present invention is not limited thereto.

[0129] In another exemplary embodiment, the second adhesive member ADa may surround the first adhesive member ADm in a plan view, and may be directly disposed on (e.g., adhered to) the first adhesive member ADm and the back surface SUB-BS. In other words, the second adhesive member ADa may be a member for fixing the first adhesive member ADm to the substrate SUB, and the shape and material of the second adhesive member ADa may be variously modified or altered.

[0130] The circuit board PCB may be spaced apart from the sensor unit SU in the second direction DR2. The circuit board PCB may be electrically connected to the sensor unit SU. In an exemplary embodiment, the circuit board PCB and the sensor unit SU may be connected to each other, for example, through a flexible printed circuit board.

[0131] Figure 8 is a flowchart illustrating a method for manufacturing a display device according to an exemplary embodiment of the present invention. 9A to 9D It is shown Figure 8 A perspective view of a method for manufacturing a display device in FIG.

[0132] refer to Figure 8 and Fig.9A , the first adhesive member ADm may be applied to the rear surface SUB-BS of the substrate SUB by the first applying device ND1 (S110). According to an exemplary embodiment of the present invention, the first applying device ND1 may provide or apply the above reference Figure 6 The first adhesive member ADm including the thermal initiator is described. External heat may not be provided to the first adhesive member ADm in operation S110, and thus the first adhesive member ADm may not be firmly adhered to the substrate SUB.

[0133] In addition, the first applying device ND1 may apply the first adhesive member ADm to the back surface SUB-BS in a manner that the opening OP is defined by the first adhesive member ADm. In the exemplary embodiment shown, the first adhesive member ADm has, for example, a rectangular shape. However, the present invention is not limited thereto. Various modifications may be made to the shape of the first adhesive member ADm.

[0134] refer to Figure 3A The described circuit layer COL, display element layer ED, and encapsulation member ECL may be disposed on a front surface (or top surface) SUB-US of the substrate SUB.

[0135] refer to Figure 8 and Fig. 9B , the sensor unit SU may be disposed on the first adhesive member ADm (S120). The sensor unit SU may overlap at least a portion of the first adhesive member ADm. Similar to operation S110, external heat may not be provided to the first adhesive member ADm in operation S120, and thus the first adhesive member ADm may not firmly adhere the sensor unit SU to the substrate SUB.

[0136] refer to Figure 8 and Fig. 9C The second adhesive member ADa may be applied to the first adhesive member ADm and the back surface SUB-BS by the second applying device ND2 (S130). The second adhesive member ADa may overlap at least a portion of the first adhesive member ADm.

[0137] According to an exemplary embodiment of the present invention, the second application device ND2 can provide or apply the above reference Figure 6 The second adhesive member ADa including the photoinitiator is described. The second adhesive member ADa may not overlap with the sensor unit SU and may be exposed to the outside from the first adhesive member ADm and the sensor unit SU.

[0138] UV light LB may be irradiated to the second adhesive member ADa (S140). The UV light LB may be irradiated by the lighting device UD. Since the second adhesive member ADa is completely exposed to the outside from the first adhesive member ADm and the sensor unit SU, the UV light LB may be irradiated to the entire second adhesive member ADa. By irradiating the UV light LB to the second adhesive member ADa, the second adhesive member ADa may be hardened. As a result, the first adhesive member ADm may be firmly fixed to the substrate SUB by the second adhesive member ADa.

[0139] According to an exemplary embodiment of the present invention, operation S130 and operation S140 may be performed simultaneously. In other words, the second adhesive member ADa may be applied to the back surface SUB-BS by the second applying device ND2, and at the same time, the UV light LB may be irradiated onto the second adhesive member ADa. Therefore, before the heat treatment process for providing external heat to the first adhesive member ADm, the first adhesive member ADm and the substrate SUB may be firmly fixed to each other by the second adhesive member ADa.

[0140] In another exemplary embodiment, operations S130 and S140 may be performed before operation S120.

[0141] refer to Figure 8 and Fig.9D, external heat may be provided to the first adhesive member ADm (S150). Since the temperature is changed by the heat provided from the outside, the thermal initiator included in the first adhesive member ADm may be activated.

[0142] After operation S140, the substrate SUB may move to a space where the heating device HD is disposed to receive external heat. In this case, since the substrate SUB and the first adhesive member ADm are fixed by the second adhesive member ADa, the alignment between the substrate SUB and the first adhesive member ADm may be maintained.

[0143] The heating device HD may provide heat HT to the entire first adhesive member ADm. The thermal initiator included in the first adhesive member ADm may be activated by the heat HT, and thus the adhesion of the first adhesive member ADm may be increased. In other words, since the heat HT is provided to the first adhesive member ADm, the first adhesive member ADm may be hardened.

[0144] Specifically, the heat HT may be completely provided to the first adhesive member ADm disposed between the back surface SUB-BS and the sensor unit SU, and thus the sensor unit SU may be securely fixed to the back surface SUB-BS.

[0145] Fig. 10A is a cross-sectional view showing a display device according to another exemplary embodiment of the present invention. Fig. 10B It shows that the setting Fig. 10A An exploded perspective view of the sensor on the rear surface of the substrate is shown in FIG.

[0146] Fig. 10A The structures of the first adhesive member ADm1 and the sensor unit SUz of the display device DDa may be similar to Figure 6 The structures of the first adhesive member ADm and the sensor unit SU of the display device DD are different. Fig. 10A The other components of the display device DDa can be connected with Figure 6 The corresponding components of the display device DD are substantially the same.

[0147] For details, refer to Fig. 10A and Fig. 10B , the sensor unit SUz may include a sensor SSz, and a housing SPz in which the sensor SSz is disposed (e.g., mounted). According to an exemplary embodiment of the present invention, the sensor unit SUz may be an ultrasonic type fingerprint recognition sensor. In an exemplary embodiment, the ultrasonic type fingerprint recognition sensor may recognize a fingerprint, for example, by ultrasonic signals emitted from a plurality of piezoelectric sensors included in the sensor SSz.

[0148] The adhesion member AUz may include a first adhesion member ADm1 and a second adhesion member ADa1. The second adhesion member ADa1 may have Figure 6 The material and structure of the second adhesion member ADa shown in are substantially the same as those of FIG.

[0149] The first adhesive member ADm1 may be disposed on the rear surface SUB-BS of the substrate SUB. The first adhesive member ADm1 may overlap the entire sensor unit SUz, and no opening may be defined in the first adhesive member ADm1.

[0150] Since the sensor SSz of the sensor unit SUz is an ultrasonic type fingerprint recognition sensor, the sensor unit SUz can be completely adhered to the rear surface SUB-BS of the substrate SUB by the first adhesive member ADm1, as shown in FIG. Fig. 10B In this case, Fig. 10A The thickness of the first adhesive member ADm1 along the third direction DR3 may be less than Figure 6 The thickness of the first adhesive member ADm along the third direction DR3 is 2.38×10 .

[0151] Fig.11A and Fig. 11B is a perspective view illustrating a method for manufacturing a display device according to another exemplary embodiment of the present invention.

[0152] exist Fig.11A and Fig. 11B The process of applying the adhesive member AUk to the rear surface SUB-BS of the substrate SUB in the method for manufacturing a display device may be different from 9A to 9D The process in the method for manufacturing a display device. Fig.11A and Fig. 11B Other processes in the manufacturing method can be combined with 9A to 9D The corresponding processes in the manufacturing method are roughly the same.

[0153] According to an exemplary embodiment of the present invention, Fig.11A and Fig. 11B The adhesive member AUk may have Figure 6 The shape of the first adhesion member ADm and the second adhesion member ADa when they constitute a single integral body.

[0154] For details, refer to Fig.11A The applying device NDk may apply the adhesive member AUk to the rear surface SUB-BS of the substrate SUB. The applying device NDk may make the shape of the adhesive member AUk consistent with that in Fig.9A and Fig. 9CThe adhesive member AUk is applied to the back surface SUB-BS in a manner corresponding to the combined shape of the first adhesive member ADm and the second adhesive member ADa shown in FIG. 1. In other words, the adhesive member AUk can be applied to the back surface SUB-BS by one applying device NDk.

[0155] According to an exemplary embodiment of the present invention, the adhesive member AUk may include a thermal initiator and a photoinitiator. In other words, Fig.11A The characteristics of the adhesion member AUk can be related to Figure 6 This corresponds to a feature that each of the first adhesion member ADm and the second adhesion member ADa includes both a thermal initiator and a photoinitiator.

[0156] like Fig. 11B As shown, since the photoinitiator is included in the adhesive member AUk, UV light LB can be irradiated onto the adhesive member AUk by the lighting device UD. Therefore, the adhesive member AUk can be firmly fixed to the rear surface SUB-BS. Thereafter, even though not shown in the figure, Figure 6 The sensor unit SU may be disposed on the adhesive member AUk, and external heat may be provided to the adhesive member AUk to fix the sensor unit SU to the adhesive member AUk.

[0157] Fig. 12A is a plan view showing a circuit board and a display panel according to another exemplary embodiment of the present invention. Fig. 12B It is shown that Fig. 12A A cross-sectional view of a display device including a circuit board and a display panel. Fig. 12C It is shown that Fig. 12A A cross-sectional view of a display device of a modified example of a circuit board and a display panel.

[0158] Fig. 12A and Fig. 12B The structure of the circuit board PCBz in the display device DDb and the position of the sensor unit SU can be Figure 4 and Figure 6 The components of the display device DDb are different from those of the display device DDa, and other components of the display device DDb may be substantially the same as the corresponding components of the display device DD.

[0159] refer to Fig. 12A and Fig. 12BAccording to an exemplary embodiment of the present invention, a hole area OP2 may be defined in the circuit board PCBz. The second bonding area DPD of the circuit board PCBz may be disposed on the first bonding area SPD, and the circuit board PCBz may be bent along one side surface of the substrate SUB. Since the circuit board PCBz is bent along one side surface of the substrate SUB, a portion of the circuit board PCBz may be disposed on the rear surface of the substrate SUB. In this case, the portion of the circuit board PCBz disposed on the rear surface of the substrate SUB may overlap with the bezel area DP-NDA and the display area DP-DA. In particular, the hole area OP2 of the circuit board PCBz may overlap with the sensing area FSA.

[0160] The sensor unit SU may be inserted into the hole area OP2 and may be disposed on the rear surface of the substrate SUB. The sensor unit SU may be electrically connected to the circuit board PCBz.

[0161] The adhesive member AU according to an exemplary embodiment of the present invention may be directly disposed on (eg, adhered to) the sensor unit SU and the substrate SUB to fix the sensor unit SU to the substrate SUB.

[0162] refer to Fig. 12C , the sensor unit SU is Fig. 12C The position in the display device DDc can be related to Fig. 12B The position of the display device DDc in the display device DDb is different, and other components of the display device DDc can be substantially the same as the corresponding components of the display device DDb.

[0163] According to an exemplary embodiment of the present invention, Fig. 12C The hole area OP2 may overlap with the display area DP-DA and the frame area DP-NDA. Fig. 12C The sensor unit SU may also overlap the display area DP-DA and the bezel area DP-NDA.

[0164] Fig.13A is a plan view showing a rear surface of a display device according to still another exemplary embodiment of the present invention. Fig. 13B It is shown Fig.13A A cross-sectional view of a display device.

[0165] and Figure 6 Compared with the display device DD, Fig.13A and Fig. 13B The display device DDd may further include a protective member PM. In addition, the adhesive member AD-Z of the display device DDd may be different from the adhesive member AU of the display device DD. Fig.13A and Fig. 13B The other components of the display device DDd can be connected with Figure 6The corresponding components of the display device DD are substantially the same.

[0166] According to an exemplary embodiment of the present invention, the display device DDd may be a flexible display device. In other words, the display device DDd may include a folding area FA and a non-folding area NFA adjacent to the folding area FA, and the folding area FA may be bent or folded along a folding axis FX.

[0167] For details, refer to Fig.13A and Fig. 13B , the protection member PM may be disposed on the rear surface of the substrate SUB. Specifically, the protection member PM may be disposed on the rear surface of the substrate SUB to overlap the non-folding area NFA overlapping the sensor unit SU.

[0168] The adhesive member AD-Z and the circuit board PCBz may be disposed on the protective member PM. The adhesive member AD-Z may adhere the sensor unit SU to the protective member PM. In an exemplary embodiment, the adhesive member AD-Z may have, for example, Figure 6 The composition of the adhesive member AU shown in FIG. 1 is the same as that of the adhesive member AU shown in FIG. 1 . In an exemplary embodiment, the adhesive member AD-Z may be provided, for example, in the form of a double-sided tape.

[0169] Fig. 13B The adhesive member AD-Z shown in FIG. 4 may be in the form of a double-sided tape. In this case, the adhesive member AD-Z may not include a thermal initiator and a photoinitiator, and may adhere the sensor unit SU to the protective member PM.

[0170] According to an exemplary embodiment of the present invention, the sensor unit may be disposed on a first adhesive member including a thermal initiator, and the first adhesive member may be fixed to the rear surface of the substrate by a second adhesive member including a photoinitiator. In particular, since the first adhesive member and the substrate are fixed to each other by the second adhesive member, when the substrate is moved into the chamber, the alignment between the first adhesive member and the substrate may be maintained.

[0171] Although the present invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the exemplary embodiments described above are not restrictive, but illustrative. Therefore, the scope of the present invention will be determined by the broadest permissible interpretation of the appended claims and their equivalents, and should not be restricted or limited by the foregoing description.

Claims

1. A display device, comprising: A display module, the display module comprising: a display area, in which an image is displayed; and a frame area adjacent to the display area; a first adhesive member including a first thermal initiator, and a first surface of the first adhesive member is directly disposed on a rear surface of the display module; a sensor unit directly disposed on a second surface of the first adhesive member opposite to the first surface in a sensing area overlapping the display area; and a second adhesive member including a first photoinitiator and disposed directly on at least a portion of the second surface of the first adhesive member and the rear surface of the display module, wherein the sensing area includes a recognition area and a bonding area, wherein the first adhesion member does not overlap the recognition area of ​​the sensor unit in a plan view.

2. The display device according to claim 1, wherein: The first thermal initiator is activated by temperature change, and the first photoinitiator is activated by ultraviolet light.

3. The display device according to claim 1, wherein: An opening overlapping the sensor unit is defined in the first adhesive member, and the sensor unit is surrounded by the first adhesive member in a plan view.

4. The display device according to claim 3, wherein: The sensor unit is spaced apart from the rear surface of the display module by the first adhesive member.

5. The display device according to claim 3, wherein: The sensor unit comprises: a sensor overlapping the opening; and a housing in which the sensor is disposed, and Wherein, the housing is directly disposed on the first adhesive member.

6. The display device according to claim 3, wherein: The sensor unit includes an optical type fingerprint recognition sensor.

7. The display device according to claim 1, wherein: The first adhesive member overlaps the entire sensor unit and is disposed between the display module and the sensor unit.

8. The display device according to claim 7, wherein: The sensor unit includes an ultrasonic type fingerprint recognition sensor.

9. The display device according to claim 1, wherein: The first adhesive member and the second adhesive member constitute a single integral body on the rear surface of the display module, Wherein, the first adhesive member further includes a second photoinitiator, and the second adhesive member further includes a second thermal initiator.

10. The display device according to claim 1, further comprising: a circuit board electrically connected to the display module and disposed on the rear surface of the display module, wherein a hole region is defined in the circuit board, and the sensor unit is inserted into the hole region and is directly disposed on the first adhesive member.

11. The display device according to claim 1, wherein: The display module comprises: substrate; A display element layer is disposed on the substrate; a packaging component, disposed on the display element layer; and An input sensing unit is disposed on the packaging component. The first adhesive member and the second adhesive member are disposed on a rear surface of the substrate, and the rear surface of the substrate corresponds to the rear surface of the display module.

12. A display device, comprising: Display module, including: a display area in which an image is displayed; and a frame area, adjacent to the display area; a protection member overlapping a portion of the display area and disposed on a rear surface of the display module; a sensor unit provided on the protection member in a sensing area overlapping the portion of the display area; and an adhesive member overlapping the sensor unit and adhering the sensor unit to the protective member, The adhesive member comprises: a first adhesive member including a first thermal initiator, and a first surface of the first adhesive member is directly disposed on the rear surface of the protective member, a second adhesive member including a first photoinitiator and disposed directly on at least a portion of a second surface of the first adhesive member opposite to the first surface and the rear surface of the protective member, wherein the sensing area includes a recognition area and a bonding area, wherein the first adhesion member does not overlap the recognition area of ​​the sensor unit in a plan view.

13. The display device according to claim 12, wherein: A folding area and a non-folding area adjacent to the folding area are defined in the display module, and the non-folding area overlaps the sensor unit, and Wherein, the protection component overlaps with the non-folding area.

14. A method for manufacturing a display device, the method comprising: applying a first adhesive member to a rear surface of a substrate in which a display area and a frame area adjacent to the display area are defined, a first surface of the first adhesive member being disposed directly on the rear surface of the substrate; disposing a sensor unit on a second surface of the first adhesive member opposite to the first surface in a sensing area overlapping a portion of the display area, wherein the sensing area includes a recognition area and a bonding area, wherein the first adhesive member does not overlap the recognition area of ​​the sensor unit in a plan view; applying a second adhesive member to at least a portion of the second surface of the first adhesive member and to the rear surface of the substrate; irradiating ultraviolet light onto the second adhesive member; as well as External heat is provided to the first adhesive member.

15. The method according to claim 14, wherein: The first adhesive member includes a thermal initiator and is applied to the rear surface of the substrate by a first applying device to overlap the display area, and The second adhesive member includes a photoinitiator and is applied to the rear surface of the substrate by a second applying device to overlap with the display area.

16. The method according to claim 14, wherein: applying the first adhesive member and the second adhesive member to the rear surface of the substrate by a single applying device, and Wherein, the first adhesive member includes a first thermal initiator and a first photoinitiator, and the second adhesive member includes a second thermal initiator and a second photoinitiator.

17. The method according to claim 14, wherein: Applying the second adhesive member and irradiating the ultraviolet light are performed simultaneously.

18. The method according to claim 14, wherein: The first adhesive member is applied such that the sensor unit is surrounded by the first adhesive member in a plan view.

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